Electronic device

Abstract

The invention provides an electronic device, comprising: a first panel comprising a first bonding pad and a first edge adjacent to the first bonding pad; the second panel is overlapped with the first panel, and the second panel comprises a second joint pad; the circuit board is electrically connected with the first panel and is used for providing a first signal; the first conductive connecting piece is electrically connected with the first panel and the second panel; wherein the first signal is input into the first bonding pad of the first panel through the circuit board, and is input into the second bonding pad of the second panel through the first conductive connecting piece; wherein, in a plan view direction, the first bonding pad is arranged between the second bonding pad and the first edge.

Description

Technical Field

[0001] The present invention relates to an electronic device, and more particularly to an electronic device comprising a plurality of panels. Background Art

[0002] With the advancement of electronic device technology, most electronic products today pursue being thinner, lighter, shorter, or more highly integrated, that is, a single electronic device can have multiple functions, such as display, touch, privacy, etc. It is known that the light transmittance of an electronic device can be adjusted by overlapping multiple panels to achieve functions such as privacy.

[0003] However, when multiple panels overlap, the circuits in the non-display area are prone to mutual interference, which can cause panel failure in serious cases, thus affecting the process yield. In addition, using substrates of different thicknesses to reduce the thickness of the overall device can easily cause collapse due to lack of support on the substrate, leading to defects such as short circuits.

[0004] Therefore, there is an urgent need to provide an electronic device to improve the above defects. Summary of the invention

[0005] The present invention provides an electronic device, comprising: a first panel, comprising a first bonding pad and a first edge adjacent to the first bonding pad; a second panel, overlapping the first panel, wherein the second panel comprises a second bonding pad; a circuit board, electrically connected to the first panel and used to provide a first signal; and a first conductive connecting member, electrically connected to the first panel and the second panel; wherein the first signal is input to the first bonding pad of the first panel via the circuit board, and is input to the second bonding pad of the second panel via the first conductive connecting member; wherein, in a top-down direction, the first bonding pad is between the second bonding pad and the first edge.

[0006] The present invention further provides an electronic device, comprising: a first panel, comprising a first bonding pad; a second panel, overlapping the first panel, wherein the second panel comprises a second bonding pad; a circuit board, electrically connected to the first panel and used to provide a first signal; and a first conductive connecting member, electrically connected to the first panel and the second panel; wherein the first signal is input to the first bonding pad of the first panel via the circuit board, and is input to the second bonding pad of the second panel via the first conductive connecting member; wherein the resistance value of the circuit board is different from the resistance value of the first conductive connecting member. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 FIG. 4 is an exploded schematic diagram of an electronic device according to an embodiment of the present invention.

[0008] Figure 2 for Figure 1Schematic top view of .

[0009] Figure 3A for Figure 2 Schematic diagram of the cross section of line segment A-A'.

[0010] Figure 3B for Figure 2 Schematic diagram of the cross section of line segment BB'.

[0011] Figure 4 The figure is a schematic diagram of the electrical connection relationship between the first panel and the second panel of the electronic device according to an embodiment of the present invention.

[0012] Figure 5 FIG. 4 is an exploded schematic diagram of an electronic device according to an embodiment of the present invention.

[0013] Figure 6 for Figure 5 Schematic top view of .

[0014] Figure 7 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention.

[0015] Figure 8 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention.

[0016] Fig. 9 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention.

[0017] Fig.10 FIG. 4 is a schematic top view of a portion of a first panel of an electronic device according to an embodiment of the present invention.

[0018] Description of reference numerals:

[0019] 1 First panel

[0020] 11. First substrate

[0021] 12. Second substrate

[0022] 13. First conductive layer

[0023] 131 Part 1

[0024] 131A Extension

[0025] 132 Part 2

[0026] 132A Extension

[0027] 14 Second conductive layer

[0028] 15. First light modulation layer

[0029] 16 First frame glue

[0030] 16' Frame Adhesive

[0031] 2 Second Panel

[0032] 21 Third substrate

[0033] 22 Fourth substrate

[0034] 23. Third conductive layer

[0035] 231 Part 3

[0036] 232 Part 4

[0037] 24 Fourth conductive layer

[0038] 25. Second light modulation layer

[0039] 26 Second frame glue

[0040] 3 Circuit Board

[0041] 41 first conductive connection member

[0042] 42 second conductive connecting member

[0043] 5 Adhesive layer

[0044] 61 First Polarizer

[0045] 611 recess

[0046] 612 Another recess

[0047] 62 Second polarizer

[0048] 63 Third polarizer

[0049] 64 Fourth polarizer

[0050] 65 Fifth polarizer

[0051] 7 Third Panel

[0052] 71 Fifth substrate

[0053] 72 Sixth substrate

[0054] 73 Light Modulation Layer

[0055] 8 Backlight module

[0056] 91 First Wire

[0057] 92 Second wire

[0058] 93 Third Conductive

[0059] 94 Fourth conductor

[0060] AA1, AA2 active area

[0061] B1, B2 surrounding areas

[0062] B11, B21 Shelter Area

[0063] B12, B22 exposed area

[0064] e1 First edge

[0065] e2 Second Edge

[0066] e3 The third edge

[0067] e4 Fourth Edge

[0068] M Registration mark

[0069] P1 First bonding pad

[0070] P2 Second bonding pad

[0071] P3 Third bonding pad

[0072] P4 Fourth bonding pad

[0073] PL1, PL2 protective layer

[0074] PL3 Another layer of protection

[0075] PS1 First support

[0076] PS2 Second support

[0077] D1 First distance

[0078] D2 Second distance

[0079] L1 First Length

[0080] L2 Second length

[0081] T1, T2 thickness

[0082] W1 First Width

[0083] W2 Second width

[0084] W3 Third Width

[0085] W4 Fourth Width

[0086] X, Y direction

[0087] Z Look down direction DETAILED DESCRIPTION

[0088] The following describes the implementation of the present invention through specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways according to different viewpoints and applications without departing from the spirit of the present invention.

[0089] It should be noted that, in this document, unless otherwise specified, "having a" component is not limited to having a single component, but may have one or more components. Furthermore, the ordinal numbers used in the specification and claims, such as "first" and "second", to modify the components of the claims, do not themselves imply or represent any previous ordinal numbers of the claimed components, nor do they represent the order of one claimed component and another claimed component, or the order in the manufacturing method. The use of these ordinals is only used to make a claimed component with a certain name clearly distinguishable from another claimed component with the same name.

[0090] Certain words are used throughout the specification and the claims that follow to refer to specific components. It will be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following specification and claims, the words "include", "contain", "have" and the like are open-ended words, and therefore should be interpreted as "including but not limited to..." Therefore, when the terms "include", "contain" and / or "have" are used in the description of the present invention, they specify the presence of corresponding features, regions, steps, operations and / or components, but do not exclude the presence of one or more corresponding features, regions, steps, operations and / or components.

[0091] In the text, the terms "about", "approximately", "substantially", and "roughly" generally mean within 10%, within 5%, within 3%, within 2%, within 1%, or within 0.5% of a given value or range. The numbers given here are approximate numbers, that is, in the absence of specific instructions for "about", "approximately", "substantially", and "roughly", the meanings of "about", "approximately", "substantially", and "roughly" can still be implied. In addition, the terms "range from a first value to a second value" and "range between a first value and a second value" mean that the range includes the first value, the second value, and other values ​​therebetween.

[0092] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present invention, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0093] In addition, relative terms such as "below" or "bottom" and "above" or "top" may be used in the embodiments to describe the relative relationship of one component of the drawings to another component. It is understood that if the device of the drawings is turned over so that it is upside down, the component described on the "below" side will become the component on the "above" side. When a corresponding component (such as a film layer or area) is referred to as "on another component", it can be directly on the other component, or there can be other components between the two. On the other hand, when a component is referred to as "directly on another component", there is no component between the two. In addition, when a component is referred to as "on another component", the two have an up-and-down relationship in the top-down direction, and this component can be above or below the other component, and this up-and-down relationship depends on the orientation of the device.

[0094] In the present invention, the distance, length, width and thickness can be measured by an optical microscope, and the distance, length, width and thickness can be measured by a cross-sectional image in an electron microscope, but the present invention is not limited thereto. In the present invention, the resistance value can be measured by using a three-meter, a four-point probe or other precision instruments. In addition, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0095] It should be noted that the technical solutions provided in the following different embodiments can be replaced, combined or mixed with each other to form another embodiment without violating the spirit of the present invention.

[0096] Figure 1 FIG. 4 is an exploded schematic diagram of an electronic device according to an embodiment of the present invention. Figure 2 for Figure 1 Schematic top view of . Figure 3A for Figure 2 Schematic diagram of the cross section of line segment A-A'. Figure 3B for Figure 2 Schematic diagram of the cross section of the line segment BB'. For the convenience of explanation, Figure 1 Some components are omitted.

[0097] In one embodiment of the present invention, Figures 1 to 3A As shown, the electronic device includes: a first panel 1, including a first bonding pad P1 and a first edge e1 adjacent to the first bonding pad; a second panel 2, overlapping the first panel 1, wherein the second panel 2 includes a second bonding pad P2; a circuit board 3, electrically connected to the first panel 1, and used to provide a first signal; and a first conductive connecting member 41, electrically connected to the first panel 1 and the second panel 2; wherein the first signal is input to the first bonding pad P1 of the first panel 1 via the circuit board 3, and is input to the second bonding pad P2 of the second panel 2 via the first conductive connecting member 41. In the present invention, as Figure 2 As shown, in the top view direction Z of the electronic device, the first bonding pad P1 is between the second bonding pad P2 and the first edge e1. The present invention provides a first conductive connector 41 so that a signal can be input from a circuit board 3 to the first panel 1 and the second panel 2, thereby reducing the number of circuit boards, thereby reducing the mutual interference of circuit boards, improving the reliability of the electronic device, saving costs or simplifying the process.

[0098] In more detail, Figure 1 , Figure 3A and Figure 3BAs shown, the first panel 1 may include: a first substrate 11; a second substrate 12, disposed opposite to the first substrate 11; a first conductive layer 13, disposed on the first substrate 11; a second conductive layer 14, disposed on the second substrate 12; a first light modulation layer 15, disposed between the first conductive layer 13 and the second conductive layer 14; and a first sealant 16, disposed between the first conductive layer 13 and the second conductive layer 14 and surrounding the first light modulation layer 15. The second panel 2 may include: a third substrate 21; a fourth substrate 22, disposed opposite to the third substrate 21; a third conductive layer 23, disposed on the third substrate 21; a fourth conductive layer 24, disposed on the fourth substrate 22; a second light modulation layer 25, disposed between the third conductive layer 23 and the fourth conductive layer 24; and a second sealant 26, disposed between the third conductive layer 23 and the fourth conductive layer 24 and surrounding the second light modulation layer 25. In the present invention, although not shown in the figure, the first panel 1 and the second panel 2 may include an alignment film, which is respectively arranged on the first conductive layer 13, the second conductive layer 14, the third conductive layer 23 and the fourth conductive layer 24, and the alignment film is arranged adjacent to the first light modulation layer 15 or the second light modulation layer 25. The first panel 1 and the second panel 2 may be panels with adjustable viewing angles. The first light modulation layer 15 may be controlled by applying a voltage to the first conductive layer 13 and the second conductive layer 14, or / and the second light modulation layer 25 may be controlled by applying a voltage to the third conductive layer 23 and the fourth conductive layer 24, so that the transmittance of the first panel 1 or / and the second panel 2 can be adjusted, so that the electronic device can achieve the effects of light transmission, shielding, or privacy, thereby realizing the anti-peeping effect of the electronic device. In one embodiment of the present invention, the first panel 1 and the second panel 2 may be, for example, an Electrical Control Birefringence (ECB) panel or a liquid crystal panel, respectively, but the present invention is not limited thereto. The voltage of the conductive layer can be controlled so that the first panel 1 and the second panel 2 have a sharing mode and an anti-peeping mode, respectively, and the first panel 1 and the second panel 2 can be switched between the sharing mode and the anti-peeping mode, respectively. The "anti-peeping" means, for example, that the transmittance is less than 10%, such as less than 8%, 6%, 5%, 4%, 3%, 2%, 1%, 0.5% or less, so that the picture cannot be observed, or it can also mean that the picture cannot be observed at some angles, such as being observable at a front viewing angle but not at a side viewing angle.

[0099] In this embodiment, if Figure 2 As shown, the third substrate 21 has a third edge e3 , and the first edge e1 and the third edge e3 are parallel to each other, wherein in the top-view direction Z of the electronic device, the first bonding pad P1 may be located between the first edge e1 and the third edge e3 .

[0100] In one embodiment of the present invention, Figure 3A and Figure 3BAs shown, the second substrate 12 can be disposed on the first substrate 11, and the second substrate 12 can be disposed between the first substrate 11 and the third substrate 21; the fourth substrate 22 can be disposed on the third substrate 21, and the third substrate 21 can be disposed between the second substrate 12 and the fourth substrate 22, but the present invention is not limited to this.

[0101] In the present invention, Figure 2 and Figure 3A As shown, in the top view direction Z of the electronic device, the first bonding pad P1 overlaps with a portion of the first conductive layer 13, the second bonding pad P2 overlaps with a portion of the third conductive layer 23, the first conductive connector 41 can be electrically connected to the first bonding pad P1 through the first conductive layer 13, and the first conductive connector 41 can be electrically connected to the second bonding pad P2 through the third conductive layer 23. In the present invention, Figure 3A As shown, the first substrate 11 includes an active area AA1 and a peripheral area B1, wherein in the cross-sectional view, the peripheral area B1 also includes a shielding area B11 and an exposed area B12 overlapping with the second substrate, and the first bonding pad P1 is arranged in the exposed area B12 of the first substrate 11. The third substrate 21 includes an active area AA2 and a peripheral area B2, wherein in the cross-sectional view, the peripheral area B2 includes a shielding area B21 and an exposed area B22 overlapping with the fourth substrate 22, and the second bonding pad P2 is arranged in the exposed area B22 of the third substrate 21. The "active area" refers to, for example, an area on the first substrate 11 surrounded by the first frame glue 16, or, for example, an area on the third substrate 21 surrounded by the second frame glue 26. In addition, the "peripheral area" refers to, for example, an area outside the active area AA1 on the first substrate 11, or, for example, an area outside the active area AA2 on the third substrate 21.

[0102] In one embodiment of the present invention, Figure 3A As shown, the first conductive layer 13 may be disposed on the first bonding pad P1, but the present invention is not limited thereto. In other embodiments of the present invention, the first bonding pad P1 may be disposed on the first conductive layer 13. Similarly, in one embodiment of the present invention, the third conductive layer 23 may be disposed on the second bonding pad P2, but the present invention is not limited thereto. In other embodiments of the present invention, the second bonding pad P2 may be disposed on the third conductive layer 23. In one embodiment of the present invention, Figure 3B As shown, the circuit board 3 can be disposed on the first substrate 11. More specifically, the circuit board 3 is disposed in the peripheral area B1 of the first substrate 11 and is electrically connected to the first conductive layer 13. In other embodiments of the present invention, although not shown in the figure, the circuit board 3 can also be disposed on the third substrate 21 and can be electrically connected to the third conductive layer 23.

[0103] In one embodiment of the present invention, Figure 2As shown, the first panel 1 has a first length L1, and the second panel 2 has a second length L2, wherein the first length L1 is different from the second length L2. Figure 2 As shown, in the top-view direction Z of the electronic device, the first length L1 of the first panel 1 may be the length of the first substrate 11 in the Y direction, and the second length L2 of the second panel 2 may be the length of the third substrate 21 in the Y direction, but the present invention is not limited to this. In one embodiment of the present invention, although not shown in the figure, in the top-view direction Z of the electronic device, the length of the first panel 1 may be the length of the first substrate 11 in the X direction, and the length of the second panel 2 may be the length of the third substrate 21 in the X direction, wherein the length of the first panel 1 may be different from the length of the second panel 2. The "length of the panel" refers to the maximum dimension of the panel in one direction. In addition, in the present invention, Figure 2 As shown, the first conductive connection member 41 and the circuit board 3 can be arranged on the same side of the first panel 1. In other words, the first conductive connection member 41 and the circuit board 3 are arranged adjacent to the first edge e1 of the first panel 1. In one embodiment of the present invention, the first edge e1 of the first panel 1 is the edge of the largest substrate in the first panel 1, for example, equivalent to the edge of the first substrate 11.

[0104] In one embodiment of the present invention, Figure 3A and Figure 3BAs shown, the second panel 2 may include a first support member PS1 and a second support member PS2, the first support member PS1 and the second support member PS2 are respectively disposed between the third conductive layer 23 and the fourth conductive layer 24, and the first support member PS1 may be disposed on the outside of the second frame glue 26, for example, disposed in the shielding area B21 on the third substrate 21 in the cross-sectional view. In other words, in the cross-sectional view, the first support member PS1 may be disposed between one side of the second frame glue 26 adjacent to the third edge e3 and the third edge e3, so that the third conductive layer 23 and the fourth conductive layer 24 extending outside the second frame glue 26 reduce the occurrence of short circuits. In addition, the second support member PS2 may be disposed on the inner side of the second frame glue 26, for example, in the cross-sectional view, the second support member PS2 may be disposed in the area surrounded by the second frame glue 26, so that the third conductive layer 23 and the fourth conductive layer 24 in the second frame glue 26 maintain a distance. In more detail, along the Y-axis direction of the third substrate 21, the first support member PS1 is further away from the second light modulation layer 25 and closer to the third edge e3 than the second support member PS2. The first support member PS1 and the second support member PS2 can maintain a distance between the third substrate 21 and the fourth substrate 22, reduce the short circuit between the third conductive layer 23 and the fourth conductive layer 24 due to the collapse of the substrate, and thus improve the reliability of the electronic device. In one embodiment of the present invention, in the top view direction Z of the electronic device, at least part of the first support member PS1 can overlap with the third conductive layer 23, and the second support member PS2 can overlap with the third conductive layer 23. In addition, although not shown in the figure, in one embodiment of the present invention, the first panel 1 can also include the first support member PS1 and the second support member PS2 as shown in the second panel 2, so that the first substrate 11 and the second substrate 12 maintain a specific distance, reduce the short circuit between the first conductive layer 13 and the second conductive layer 14 due to the collapse of the substrate, thereby improving the reliability of the electronic device, and the features of the support members in the first panel 1 are as shown in the first support member PS1 and the second support member PS2 of the second panel 2, and are not repeated here.

[0105] In the present invention, the materials of the first substrate 11, the second substrate 12, the third substrate 21 and the fourth substrate 22 may be the same or different, and the materials of the first substrate 11, the second substrate 12, the third substrate 21 and the fourth substrate 22 may each include glass, quartz, sapphire, ceramic, plastic, polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethylene terephthalate (PET), polymethylmethacrylate (PMMA), other suitable materials or combinations of the above materials, but the present invention is not limited thereto. In the present invention, the thicknesses of the first substrate 11, the second substrate 12, the third substrate 21 and the fourth substrate 22 may be the same or different, and the thicknesses of the first substrate 11, the second substrate 12, the third substrate 21 and the fourth substrate 22 may each be 0.01 mm to 0.5 mm, for example, 0.01 mm to 0.03 mm, 0.15 mm to 0.5 mm, but the present invention is not limited thereto. In one embodiment of the present invention, the thickness of the first substrate 11 and the second substrate 12 may be greater than the thickness of the third substrate 21 and the fourth substrate 22. For example, the thickness of the first substrate 11 and the second substrate 12 may be 0.15 mm to 0.5 mm, and the thickness of the third substrate 21 and the fourth substrate 22 may be 0.01 mm to 0.03 mm. In one embodiment of the present invention, the first substrate 11 and the second substrate 12 may be hard substrates, and the third substrate 21 and the fourth substrate 22 may be soft substrates, but the present invention is not limited thereto. By designing the thickness of the first substrate 11, the second substrate 12, the third substrate 21 and the fourth substrate 22 within the above range, the electronic device can have a thinning effect.

[0106] In the present invention, the materials of the first conductive layer 13, the second conductive layer 14, the third conductive layer 23 and the fourth conductive layer 24 may be the same or different, and the materials of the first conductive layer 13, the second conductive layer 14, the third conductive layer 23 and the fourth conductive layer 24 may each include a metal, a metal oxide, an alloy thereof or a combination thereof, such as gold, silver, copper, aluminum, chromium, platinum, indium zinc oxide (IZO), indium tin oxide (ITO), indium tin zinc oxide (ITZO), indium gallium zinc oxide (IGZO), aluminum zinc oxide (AZO) or a combination thereof, but the present invention is not limited thereto. In one embodiment of the present invention, the first conductive layer 13, the second conductive layer 14, the third conductive layer 23 and the fourth conductive layer 24 may each include a metal oxide, such as indium tin oxide.

[0107] In the present invention, the materials of the first light modulation layer 15 and the second light modulation layer 25 may be the same or different. The materials of the first light modulation layer 15 and the second light modulation layer 25 may respectively include guest host type liquid crystal (GHLC), dye liquid crystal, twisted nematic liquid crystal (TN LC), super twisted nematic liquid crystal (STN LC), polymer dispersed liquid crystal (PDLC), polymer network liquid crystal (PNLC), cholesterol liquid crystal (cholesteric texture liquid crystal), polymer-stabilized cholesteric texture liquid crystal (PSCT LC), suspended particle material (SPD), electrochromic materials, etc. or a combination thereof, but the present invention is not limited thereto.

[0108] In the present invention, the materials of the first bonding pad P1 and the second bonding pad P2 may be the same or different, and the materials of the first bonding pad P1 and the second bonding pad P2 may each include a metal, a metal oxide, an alloy thereof, or a combination thereof, such as gold, silver, copper, aluminum, chromium, platinum, indium zinc oxide (IZO), indium tin oxide (ITO), indium tin zinc oxide (ITZO), indium gallium zinc oxide (IGZO), aluminum zinc oxide (AZO), or a combination thereof, but the present invention is not limited thereto. In one embodiment of the present invention, the first bonding pad P1 and the second bonding pad P2 may each include a metal. In the present invention, the materials of the first bonding pad P1 and the second bonding pad P2 are different from the materials of the first conductive layer 13, the second conductive layer 14, the third conductive layer 23, or the fourth conductive layer 24. In the present invention, the first conductive connector 41 may be a conductive glue, a metal wire, a metal foil, a silver glue paint, or other conductive materials, but the present invention is not limited thereto. In the present invention, the circuit board 3 may include a printed circuit board (PCB), a flexible printed circuit board (FPC), or a combination thereof. In one embodiment of the present invention, the resistance value of the circuit board 3 may be different from the resistance value of the first conductive connection member 41, and the "different" means that the two values ​​are different, or the difference must be more than 10%. In one embodiment of the present invention, the resistance value of the first conductive connection member 41 may be less than 0.1 ohms / square inch, for example, less than 0.03 ohms / square inch or less than 0.07 ohms / square inch, but the present invention is not limited thereto. In one embodiment of the present invention, the resistance value of the circuit board 3 may be greater than 0.13 ohms / square inch, but the present invention is not limited thereto.

[0109] In the present invention, the materials of the first support member PS1 and the second support member PS2 may be the same or different, and the materials of the first support member PS1 and the second support member PS2 may each include a resin, a polymer, a photoresist material or a combination thereof, but the present invention is not limited thereto. In the present invention, the shapes, sizes and quantities of the first support member PS1 and the second support member PS2 are not particularly limited and may be adjusted as needed, for example, suitable shapes include rectangular columns, trapezoidal columns, inverted trapezoidal columns, circular columns or a combination thereof, but the present invention is not limited thereto.

[0110] In one embodiment of the present invention, Figure 1 and Figure 2 As shown, the electronic device may further include a second conductive connection member 42 electrically connected to the first panel 1 and the second panel 2. The second conductive connection member 42 may be used to input a second signal. More specifically, the second signal may be input to the third bonding pad P3 of the first panel 1 via the circuit board 3, and to the fourth bonding pad P4 of the second panel 2 via the second conductive connection member 42. In one embodiment of the present invention, Figure 2As shown in FIG. 1 , in the top view direction Z of the electronic device, the third bonding pad P3 is farther away from the circuit board 3 than the first bonding pad P1. Figure 2 As shown, in the top view direction Z of the electronic device, the third bonding pad P3 is between the fourth bonding pad P4 and the first edge e1. Figure 2 As shown, in the top view direction Z of the electronic device, the third bonding pad P3 may be between the first edge e1 and the third edge e3. In the present invention, the third bonding pad P3 and the fourth bonding pad P4 are similar to the first bonding pad P1 and the second bonding pad P2, and the second conductive connecting member 42 is similar to the first conductive connecting member 41, which will not be described in detail here. In the present invention, the first signal and the second signal may be, for example, a scan signal, a data signal, an electrode signal or a combination thereof, but the present invention is not limited thereto. In one embodiment, the first signal and the second signal may respectively control the voltage on the first panel 1 (e.g., the voltage of the first conductive layer 13 and the second conductive layer 14) and the voltage on the second panel 2 (e.g., the voltage of the third conductive layer 23 and the fourth conductive layer 24), resulting in a change in the rotation of the liquid crystal or a change in the haze of the first panel or the second panel to achieve a change in transmittance. However, the present invention is not limited to this. In another embodiment, the first signal and the second signal may simultaneously control the voltage on the first panel 1 (e.g., the voltage of the first conductive layer 13 and the second conductive layer 14) and the voltage on the second panel 2 (e.g., the voltage of the third conductive layer 23 and the fourth conductive layer 24).

[0111] In one embodiment of the present invention, Figure 3A and Figure 3B As shown, the electronic device may further include: an adhesive layer 5, disposed between the first panel 1 and the second panel 2. The adhesive layer 5 can be used to attach the first panel 1 to the second panel 2, so that the first panel 1 and the second panel 2 are assembled into one. In the present invention, the adhesive layer 5 may include glass glue, optical glue, silicone, adhesive tape, hot melt glue, AB glue, two-component adhesive, polymer glue or a combination thereof, but the present invention is not limited thereto.

[0112] In one embodiment of the present invention, Figure 1 , Figure 3A and Figure 3B As shown, the electronic device may further include: a first polarizer 61, disposed on a side of the second panel 2 away from the first panel 1 in the Z-axis direction; a second polarizer 62, disposed between the first panel 1 and the second panel 2 in the Z-axis direction; and a third polarizer 63, disposed on a side of the first panel 1 away from the second panel 2 in the Z-axis direction. In the present invention, the polarization axes of the first polarizer 61, the second polarizer 62, and the third polarizer 63 may be parallel to each other, wherein the polarization axes of the polarizers may be, for example, Figure 3A As indicated by the arrow in .

[0113] In one embodiment of the present invention, Figure 3A and Figure 3B As shown, in the top-view direction Z of the electronic device, the area of ​​the first polarizer 61 may be substantially the same as the area of ​​the fourth substrate 22; the area of ​​the second polarizer 62 may be substantially the same as the area of ​​the second substrate 12 or the third substrate 21; the area of ​​the third polarizer 63 may be substantially the same as the area of ​​the first substrate 11, but the present invention is not limited thereto. The "area of ​​the polarizer" refers to the projected area of ​​the polarizer in the top-view direction Z of the electronic device. The "area of ​​the substrate" refers to the projected area of ​​the substrate in the top-view direction Z of the electronic device.

[0114] In one embodiment of the present invention, Figure 3A and Figure 3B As shown, the electronic device may further include a third panel 7, wherein the first panel 1 and the second panel 2 are disposed on the third panel 7. In more detail, the third panel 7 may be a display panel, and therefore, the third panel 7 may include: a fifth substrate 71; a sixth substrate 72, disposed opposite to the fifth substrate 71; and a light modulation layer 73, disposed between the fifth substrate 71 and the sixth substrate 73. In the present invention, although not shown in the figure, the conductive layer, the driving component, the display unit, the wire, the alignment film, the black matrix layer, the color filter unit, the electrode, other components or a combination thereof may be disposed on the fifth substrate 71 and the sixth substrate 72, but the present invention is not limited thereto. In the present invention, the light modulation layer 73 may include liquid crystal molecules (LC), quantum dots (QD), fluorescent molecules, phosphors, organic light emitting diodes (OLED), sub-millimeter light emitting diodes (mini LED), micro LEDs (micro LED), quantum dot light emitting diodes (QLED or QD-LED) or a combination thereof, but the present invention is not limited thereto.

[0115] In one embodiment of the present invention, when the display panel is a liquid crystal display panel, a thin film transistor may be disposed on the fifth substrate 71, and a color filter unit may be disposed on the sixth substrate 72, but the present invention is not limited thereto. In one embodiment of the present invention, when the display panel is a liquid crystal display panel, the fifth substrate 71 may be a thin film transistor substrate integrating a color filter array, and the sixth substrate 72 may be an opposite substrate, but the present invention is not limited thereto. In one embodiment of the present invention, when the display panel is a self-luminous display panel, the fifth substrate 71 may be a thin film transistor substrate (TFT substrate), and the sixth substrate 72 may be a covering substrate, but the present invention is not limited thereto. In one embodiment of the present invention, when the display panel is a non-self-luminous display panel, such as Figure 3A and Figure 3BAs shown, the electronic device may further include a backlight module 8, wherein the third panel 7 is disposed on the backlight module 8. In the present invention, although not shown in the figure, the backlight module 8 may include a light-emitting unit, a light guide plate, a diffusion plate, a brightness enhancement film, a prism sheet, a reflective sheet, other optical films or a combination thereof, but the present invention is not limited thereto. In one embodiment of the present invention, when the display panel is a self-luminous display panel, the backlight module 8 may be omitted. Figure 3A and Figure 3B The backlight module 8 in.

[0116] In one embodiment of the present invention, Figure 3A and Figure 3B As shown, the electronic device may further include: a fourth polarizer 64, disposed between the first panel 1 and the third panel 7; and a fifth polarizer 65, wherein the third panel 7 may be disposed on the fifth polarizer 65, and more specifically, the fifth polarizer 65 may be disposed between the third panel 7 and the backlight module 8. In the present invention, the polarization axis of the fourth polarizer 64 and the polarization axis of the fifth polarizer 65 are in different directions, for example, the polarization axis of the fourth polarizer 64 is perpendicular to the polarization axis of the fifth polarizer 65. The polarization axis of the polarizer may be, for example, Figure 3A In one embodiment of the present invention, the polarization axis of the fourth polarizer 64 and the polarization axis of the first polarizer 61 are parallel to each other.

[0117] In one embodiment of the present invention, Figure 3A As shown, the electronic device may further include a protective layer PL1, PL2, the protective layer PL1 is disposed on the first substrate 11, and the protective layer PL2 is disposed on the third substrate 21. In more detail, the protective layer PL1 may cover the first bonding pad P1, a portion of the first conductive layer 13 and a portion of the first conductive connector 41, and the protective layer PL2 may cover the second bonding pad P2, a portion of the third conductive layer 23 and a portion of the first conductive connector 41. The protective layers PL1 and PL2 may reduce the entry of external air or moisture, and / or improve the adhesion of the first conductive connector 41, thereby improving the reliability of the electronic device. Similarly, in other embodiments of the present invention, although not shown in the figure, the third bonding pad P3 (such as Figure 2 ) and the fourth bonding pad P4 (as shown Figure 2 In the present invention, the material of the protective layers PL1 and PL2 may include glass glue, optical glue, silicone, tape, hot melt glue, AB glue, two-component adhesive, light-curing glue, polymer glue, resin or a combination thereof, but the present invention is not limited thereto.

[0118] In one embodiment of the present invention, Figure 3AAs shown, the electronic device may further include another protective layer PL3, covering the first conductive connector 41, wherein the other protective layer PL3 exposes the two ends of the first conductive connector 41, so that the first conductive connector 41 can be electrically connected to the first panel 1 and the second panel 2 through the two ends respectively. The other protective layer PL3 can reduce the direct contact between the first conductive connector 41 and the internal components of the electronic device, thereby reducing the risk of short circuit. In the present invention, the material of the other protective layer PL3 may include glass glue, optical glue, silicone, hot melt glue, AB glue, light curing glue, polymer glue, resin or a combination thereof, but the present invention is not limited thereto. Similarly, in other embodiments of the present invention, although not shown in the figure, the second conductive connector 42 may also be covered by another protective layer, which will not be repeated here.

[0119] The electrical connection relationship between the first panel 1 and the second panel 2 will be further described below.

[0120] Figure 4 FIG. 1 is a schematic diagram of the electrical connection relationship between the first panel and the second panel of an electronic device according to an embodiment of the present invention. For the convenience of explanation, some components are omitted, and in the top view of the electronic device, the first substrate in the partially overlapping first panel and the third substrate in the second panel are shown in a non-overlapping manner. Figure 4 middle.

[0121] In one embodiment of the present invention, Figure 4 As shown, a first bonding pad P1 and a first conductive layer 13 are disposed on the first substrate 11 of the first panel 1, wherein a portion of the first conductive layer 13 is disposed on the first bonding pad P1, and a first conductive connection member 41 can be electrically connected to the first bonding pad P1 via the first conductive layer 13. A second bonding pad P2 and a third conductive layer 23 are disposed on the third substrate 21 of the second panel 2, wherein a portion of the third conductive layer 23 is disposed on the second bonding pad P2, and the first conductive connection member 41 can be electrically connected to the second bonding pad P2 via the third conductive layer 23. Therefore, the first signal can be input to the first bonding pad P1 on the first substrate 11 via a circuit board (not shown), and input to the second bonding pad P2 on the third substrate 21 via the first conductive connection member 41.

[0122] In addition, if Figure 4As shown, a third bonding pad P3 is also provided on the first substrate 11 of the first panel 1, wherein a portion of the first conductive layer 13 is provided on the third bonding pad P3, and the second conductive connection member 42 can be electrically connected to the third bonding pad P3 via the first conductive layer 13. A fourth bonding pad P4 is also provided on the third substrate 21 of the second panel 2, wherein a portion of the third conductive layer 23 is provided on the fourth bonding pad P4, and the second conductive connection member 42 can be electrically connected to the fourth bonding pad P4 via the third conductive layer 23. Therefore, the second signal can be input to the third bonding pad P3 on the first substrate 11 via a circuit board (not shown), and input to the fourth bonding pad P4 on the third substrate 23 via the second conductive connection member 42.

[0123] In more detail, Figure 1 and Figure 4 As shown, the first conductive layer 13 may include a first portion 131 and a second portion 132, and the first portion 131 is electrically insulated from the second portion 132. The third conductive layer 23 may include a third portion 231 and a fourth portion 232, and the third portion 231 is electrically insulated from the fourth portion 232. The first signal may be input from the circuit board 3 into the first portion 131 of the first conductive layer 13 to input the first signal into the first panel 1. The first signal may be input from the circuit board 3 into the first portion 131 of the first conductive layer 13 and the first bonding pad P1, and input into the second bonding pad P2 and the third portion 231 of the third conductive layer 23 via the first conductive connector 41 to input the first signal into the second panel 2. The second signal may be input from the circuit board 3 into the second portion 132 of the first conductive layer 13, and input into the second conductive layer 14 via a conductive material (not shown) to input the second signal into the first panel 1. The second signal can be input into the second part 132 of the first conductive layer 13 and the third bonding pad P3 by the circuit board 3, input into the fourth bonding pad P4 and the fourth part 232 of the third conductive layer 23 via the second conductive connecting member 42, and input into the fourth conductive layer 24 via the conductive material (not shown), so as to input the second signal into the second panel 2.

[0124] In one embodiment of the present invention, Figure 4 As shown, an alignment mark M may also be provided on the first substrate 11, wherein a portion of the first conductive layer 13 is provided on the alignment mark M. The alignment mark M may provide a position indication when the circuit board (not shown) is joined. In the present invention, the material of the alignment mark M may include a metal, such as gold, silver, copper, aluminum, chromium, platinum, an alloy thereof or a combination thereof, but the present invention is not limited thereto. In one embodiment of the present invention, the material of the alignment mark M may be the same as the material of the first bonding pad P1 or the third bonding pad P3, and the alignment mark M may be prepared by the same process procedure as that for preparing the first bonding pad P1 or the third bonding pad P3, so that the alignment mark M and the first bonding pad P1 or the third bonding pad P3 are provided on the same layer.

[0125] In one embodiment of the present invention, Figure 4 As shown, the electronic device may further include: a first wire 91 disposed on the first substrate 11, and a portion of the first conductive layer 13 is disposed on the first wire 91; a second wire 92 disposed on the third substrate 21, and a portion of the third conductive layer 23 is disposed on the second wire 92, wherein the first wire 91 is electrically connected to the first bonding pad P1, and the second wire 92 is electrically connected to the second bonding pad P2. Similarly, as Figure 4 As shown, the electronic device may further include: a third conductive wire 93, which is disposed on the first substrate 11, and a portion of the first conductive layer 13 is disposed on the third conductive wire 93; a fourth conductive wire 94, which is disposed on the third substrate 21, and a portion of the third conductive layer 23 is disposed on the fourth conductive wire 94, wherein the third conductive wire 93 is electrically connected to the third bonding pad P3, and the fourth conductive wire 94 is electrically connected to the fourth bonding pad P4. Therefore, the first signal can be input to the first conductive wire 91 and the first bonding pad P1 via a circuit board (not shown in the figure), and input to the second bonding pad P2 and the second conductive wire 92 via the first conductive connection member 41. Similarly, the second signal can be input to the third conductive wire 93 and the third bonding pad P3 via a circuit board (not shown in the figure), and input to the fourth bonding pad P4 and the fourth conductive wire 94 via the second conductive connection member 42. The resistance can be reduced by disposing the first conductive wire 91, the second conductive wire 92, the third conductive wire 93 and / or the fourth conductive wire 94.

[0126] In one embodiment of the present invention, Figure 4 As shown, the first portion 131 of the first conductive layer 13 has an extension portion 131A extending along the X direction, wherein in the top-view direction Z of the electronic device, part of the extension portion 131A overlaps with the first conductive line 91. In a direction perpendicular to the top-view direction Z of the electronic device (e.g., the Y direction), the extension portion 131A has a first width W1, and the first conductive line 91 has a second width W2, wherein the first width W1 is greater than the second width W2. In one embodiment of the present invention, as Figure 4 As shown, the second portion 132 of the first conductive layer 13 has an extension portion 132A extending along the X direction, wherein in the top-view direction Z of the electronic device, part of the extension portion 132A overlaps with the third conductive line 93. In a direction perpendicular to the top-view direction Z of the electronic device (e.g., the Y direction), the extension portion 132A has a third width W3, and the third conductive line 93 has a fourth width W4, wherein the third width W3 is greater than the fourth width W4. Similarly, the second conductive line 92 and the third portion 231 of the third conductive layer 23 also have similar features to the first conductive line 91 and the first portion 131 of the first conductive layer 13, and the fourth conductive line 94 and the fourth portion 232 of the third conductive layer 23 also have similar features to the third conductive line 93 and the second portion 132 of the first conductive layer 13, which will not be described in detail here.

[0127] In one embodiment of the present invention, the materials of the first conductive wire 91, the second conductive wire 92, the third conductive wire 93 and the fourth conductive wire 94 may be the same or different. The materials of the first conductive wire 91, the second conductive wire 92, the third conductive wire 93 and the fourth conductive wire 94 may each include a metal, an alloy thereof or a combination thereof, such as gold, silver, copper, aluminum, chromium, platinum, an alloy thereof or a combination thereof, but the present invention is not limited thereto. In one embodiment of the present invention, the materials of the first conductive wire 91, the second conductive wire 92, the third conductive wire 93 and the fourth conductive wire 94 are different from the materials of the first conductive layer 13, the second conductive layer 14, the third conductive layer 23 or the fourth conductive layer 24. In one embodiment of the present invention, the materials of the first wire 91, the second wire 92, the third wire 93 and the fourth wire 94 can be the same as the materials of the first bonding pad P1 and the second bonding pad P2, and the first wire 91, the second wire 92, the third wire 93 and the fourth wire 94 can be prepared by the same process procedure as the preparation of the first bonding pad P1 and the second bonding pad P2, so that the first wire 91 and the third wire 93 are located in the same layer as the first bonding pad P1, and the second wire 92 and the fourth wire 94 are located in the same layer as the second bonding pad P2.

[0128] Figure 5 FIG. 4 is an exploded schematic diagram of an electronic device according to an embodiment of the present invention. Figure 6 for Figure 5 A top view of the diagram. Figure 5 and Figure 6 Electronic devices and Figure 1 and Figure 2 Similar, except for the following differences.

[0129] In one embodiment of the present invention, Figure 5 As shown, the first polarizer 61 has a concave portion 611, and the concave portion 611 corresponds to the first conductive connecting member 41. In more detail, as shown in FIG. Figure 6 As shown, in the top view direction Z of the electronic device, the concave portion 611 of the first polarizer 61 can expose a portion of the third substrate 21, a portion of the third conductive layer 23 and the second bonding pad P2. In other words, in the top view direction Z of the electronic device, the first polarizer 61 and the second bonding pad P2 do not overlap. Figure 5 and Figure 6As shown, the first polarizer 61 may have another recess 612, and the other recess 612 is located at a position corresponding to the second conductive connector 42. In more detail, in the top-view direction Z of the electronic device, the other recess 612 of the first polarizer 61 may expose a portion of the third substrate 21, a portion of the third conductive layer 23, and the fourth bonding pad P4. In other words, in the top-view direction Z of the electronic device, the first polarizer 61 does not overlap with the fourth bonding pad P4. In one embodiment of the present invention, in the top-view direction Z of the electronic device, the area of ​​the first polarizer 61 is different from the area of ​​the fourth substrate 22, for example, the area of ​​the first polarizer 61 is greater than the area of ​​the fourth substrate 22.

[0130] Figure 7 FIG. 1 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention. Figure 7 Electronic devices and Figure 3A Similar, except for the following differences.

[0131] In one embodiment of the present invention, Figure 7 As shown, the first substrate 11 has a first edge e1; the second substrate 12 has a second edge e2; the third substrate 21 has a third edge e3; the fourth substrate 22 has a fourth edge e4, wherein the first edge e1, the second edge e2, the third edge e3 and the fourth edge e4 are parallel to each other, and the distance between the first edge e1 and the second edge e2 is different from the distance between the third edge e3 and the fourth edge e4. In more detail, as Figure 7 As shown, there may be a first distance D1 between the first edge e1 and the second edge e2; there may be a second distance D2 between the third edge e3 and the fourth edge e4, wherein the first distance D1 is different from the second distance D2.

[0132] In one embodiment of the present invention, Figure 7 As shown, the thickness T1 of the first bonding pad P1 may be greater than the thickness T2 of the first conductive layer 13. In this way, the contact resistance can be reduced, thereby improving the conductivity. In one embodiment of the present invention, the thickness T1 of the first bonding pad P1 may be 0.05μm to 0.5μm, but the present invention is not limited to this. The thickness T2 of the first conductive layer 13 may be 0.01μm to 0.2μm, but the present invention is not limited to this. In one embodiment of the present invention, similarly, the thickness of the second bonding pad P2 may also be greater than the thickness of the third conductive layer 23, for example, the thickness of the second bonding pad P2 may be 0.05μm to 0.5μm or 0.05μm to 0.2μm, and the thickness of the third conductive layer 23 may be 0.01μm to 0.2μm or 0.05μm to 0.2μm, but the present invention is not limited to this.

[0133] In one embodiment of the present invention, Figure 7As shown, the first substrate 11 may be disposed on the second substrate 12, and the first substrate 11 may be disposed between the second substrate 12 and the third substrate 21. In one embodiment of the present invention, the thickness of the first substrate 11 and the second substrate 12 may be respectively less than the thickness of the third substrate 21 and the fourth substrate 22. For example, the thickness of the first substrate 11 and the second substrate 12 may be respectively 0.01 mm to 0.03 mm, and the thickness of the third substrate 21 and the fourth substrate 22 may be respectively 0.15 mm to 0.5 mm, but the present invention is not limited thereto. In one embodiment of the present invention, the first substrate 11 and the second substrate 12 may be soft substrates, and the third substrate 21 and the fourth substrate 22 may be hard substrates, but the present invention is not limited thereto.

[0134] In one embodiment of the present invention, Figure 7 As shown, in the top-view direction Z of the electronic device, the area of ​​the first polarizer 61 may be substantially the same as the area of ​​the fourth substrate 22; the area of ​​the second polarizer 62 may be substantially the same as the area of ​​the first substrate 11 or the third substrate 21; the area of ​​the third polarizer 63 may be substantially the same as the area of ​​the second substrate 12, but the present invention is not limited thereto. The "area of ​​the polarizer" refers to the projected area of ​​the polarizer in the top-view direction Z of the electronic device. The "area of ​​the substrate" refers to the projected area of ​​the substrate in the top-view direction Z of the electronic device.

[0135] In addition, in one embodiment of the present invention, when the third panel 7 is a self-luminous display panel, the Figure 7 The backlight module 8 in.

[0136] Figure 8 FIG. 1 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention. Figure 8 Electronic devices and Figure 3A Similar, except for the following differences.

[0137] In one embodiment of the present invention, Figure 8 As shown, the third substrate 21 may be disposed on the fourth substrate 22, and the fourth substrate 22 may be disposed between the second substrate 12 and the third substrate 21. In one embodiment of the present invention, the thicknesses of the first substrate 11, the second substrate 12, the third substrate 21, and the fourth substrate 22 may be substantially the same, for example, the thicknesses of the first substrate 11, the second substrate 12, the third substrate 21, and the fourth substrate 22 may be 0.01 to 0.05 mm, but the present invention is not limited thereto. By designing the thicknesses of the first substrate 11, the second substrate 12, the third substrate 21, and the fourth substrate 22 to be within the above range, the electronic device may have a thinning effect.

[0138] In one embodiment of the present invention, Figure 8As shown, in the top view direction Z of the electronic device, the area of ​​the first substrate 11 can be substantially the same as the area of ​​the third substrate 21; the area of ​​the second substrate 12 can be substantially the same as the area of ​​the fourth substrate 22. Therefore, the first distance D1 between the first edge e1 and the second edge e2 can be substantially equal to the second distance D2 between the third edge e3 and the fourth edge e4. In this way, an electronic device with a narrow frame can be obtained. In addition, as Figure 8 As shown, the area of ​​the first polarizer 61 may be substantially the same as the area of ​​the third substrate 21; the area of ​​the second polarizer 62 may be substantially the same as the area of ​​the second substrate 12 or the fourth substrate 22; the area of ​​the third polarizer 63 may be substantially the same as the area of ​​the first substrate 11, but the present invention is not limited thereto.

[0139] In addition, in one embodiment of the present invention, when the third panel 7 is a self-luminous display panel, the Figure 8 The backlight module 8 in.

[0140] Fig. 9 FIG. 1 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention. Fig. 9 Electronic devices and Figure 3A Similar, except for the following differences.

[0141] In one embodiment of the present invention, Fig. 9 As shown, the third panel 7 can be disposed on the first panel 1 and the second panel 2; the fourth polarizer 64 can be disposed on the third panel 7; the fifth polarizer 65 can be disposed on the first panel 1 and the second panel 2, and in more detail, the fifth polarizer 65 can be disposed between the third panel 7 and the second panel 2. In the present invention, the directions of the polarization axes of the fourth polarizer 64 and the fifth polarizer 65 are different, for example, the polarization axis of the fourth polarizer 64 is perpendicular to the polarization axis of the fifth polarizer 65. In one embodiment of the present invention, the polarization axis of the fifth polarizer 65 is parallel to the polarization axis of the first polarizer 61.

[0142] In one embodiment of the present invention, Fig. 9 As shown, the first substrate 11 has a first edge e1; the second substrate 12 has a second edge e2; the third substrate 21 has a third edge e3; and the fourth substrate 22 has a fourth edge e4, wherein the first edge e1, the second edge e2, the third edge e3 and the fourth edge e4 are parallel to each other, and the distance between the first edge e1 and the second edge e2 is different from the distance between the third edge e3 and the fourth edge e4. In more detail, as Fig. 9 As shown, there may be a first distance D1 between the first edge e1 and the second edge e2; there may be a second distance D2 between the third edge e3 and the fourth edge e4, wherein the first distance D1 is different from the second distance D2.

[0143] In one embodiment of the present invention, Fig. 9 As shown, the size of the first bonding pad P1 may be different from the size of the second bonding pad P2. The "size of the bonding pad" refers to the length, width or height of the bonding pad. In one embodiment of the present invention, the thickness T1 of the first bonding pad P1 may be greater than the thickness T2 of the first conductive layer 13. In this way, the contact resistance can be reduced, thereby improving the conductivity. In one embodiment of the present invention, the thickness T1 of the first bonding pad P1 may be 0.05μm to 0.5μm, but the present invention is not limited thereto. The thickness T2 of the first conductive layer 13 may be 0.01μm to 0.2μm, but the present invention is not limited thereto.

[0144] In one embodiment of the present invention, Fig. 9 As shown, the thickness of the first substrate 11 and the second substrate 12 may be respectively smaller than the thickness of the third substrate 21 and the fourth substrate 22. For example, the thickness of the first substrate 11 and the second substrate 12 may be respectively 0.01 mm to 0.03 mm, and the thickness of the third substrate 21 and the fourth substrate 22 may be respectively 0.15 mm to 0.5 mm, but the present invention is not limited thereto. In one embodiment of the present invention, the first substrate 11 and the second substrate 12 may be soft substrates, and the third substrate 21 and the fourth substrate 22 may be hard substrates, but the present invention is not limited thereto.

[0145] In addition, in one embodiment of the present invention, the third panel 7 may also be disposed below the first panel 1 and the second panel 2, wherein the third panel 7 is disposed between the first panel 1 and the backlight module 8. In one embodiment of the present invention, when the third panel 7 is a self-luminous display panel, the backlight module 8 may be omitted. Fig. 9 The backlight module 8 in.

[0146] Fig.10 FIG. 1 is a schematic top view of a portion of a first panel of an embodiment of the present invention. For the convenience of explanation, Fig.10 Some components are omitted.

[0147] In one embodiment of the present invention, Fig.10 As shown, the first panel 1 may include a first sealant 16 and an outer sealant 16', which are respectively disposed on the first conductive layer 13 and the second conductive layer 14 (eg, Figure 3B ), and the outer frame glue 16' is arranged adjacent to the circuit board 3 or the first bonding pad P1 / third bonding pad P3 relative to the first frame glue 16. In the top view direction Z of the electronic device, part of the outer frame glue 16' can overlap with the second part 132 of the first conductive layer 13, and the outer frame glue 16' does not overlap with the third wire 93. In one embodiment of the present invention, as Fig.10 As shown, the first panel 1 may include a first support member PS1 and a second support member PS2, wherein the first support member PS1 and the second support member PS2 are respectively disposed on the first conductive layer 13 and the second conductive layer 14 (eg, Figure 3B ), and the first support member PS1 can be disposed on the outside of the first frame glue 16, and the second support member PS2 can be disposed on the inside of the first frame glue 16. In other words, the first support member PS1 is disposed closer to the circuit board 3 than the second support member PS2. The first support member PS1 and the second support member PS2 can make the first substrate 11 and the second substrate 12 (as shown) Figure 3B As shown in FIG. 1 , the distance between the first conductive layer 13 and the second conductive layer 14 (as shown in FIG. 1 ) extending outside the first sealant 16 can be reduced. Figure 3B As shown in FIG. 1 , a short circuit is caused by the collapse of the substrate, thereby improving the reliability of the electronic device. Fig.10 As shown, in a direction perpendicular to the top-view direction Z of the electronic device (eg, the Y direction), a portion of the first support member PS1 may overlap a portion of the second support member PS2 , thereby improving the reliability of the electronic device.

[0148] The above specific embodiments are to be construed as merely illustrative, and not limitative of the remainder of the invention in any way whatsoever.

Claims

1. An electronic device, characterized in that: Include: A first panel including a first bonding pad and a first edge adjacent to the first bonding pad; a second panel, overlapping the first panel, wherein the second panel comprises a second bonding pad; a circuit board, electrically connected to the first panel and used for providing a first signal; and a first conductive connecting member electrically connected to the first panel and the second panel; Wherein, the first signal is input to the first bonding pad of the first panel via the circuit board, and is input to the second bonding pad of the second panel via the first conductive connection member; Wherein, in a top-view direction, the first bonding pad is between the second bonding pad and the first edge.

2. The electronic device according to claim 1, wherein: The first panel includes a first conductive layer. The first bonding pad overlaps with the first conductive layer. The first conductive connecting element is electrically connected to the first bonding pad via the first conductive layer.

3. The electronic device according to claim 1, wherein: It also includes a first polarizer, which is arranged on the second panel, wherein the first polarizer has a concave portion, and the concave portion corresponds to the first conductive connecting component.

4. The electronic device according to claim 1, wherein: Also includes: A first polarizer is disposed on a first side of the second panel away from the first panel; a second polarizer disposed between the first panel and the second panel; and A third polarizer is disposed on a second side of the first panel away from the second panel; Wherein, the polarization axes of the first polarizer, the second polarizer and the third polarizer are parallel to each other.

5. The electronic device according to claim 1, wherein: The first conductive connecting member and the circuit board are arranged on the same side of the first panel.

6. The electronic device as claimed in claim 1, wherein: The first panel comprises: a first substrate; a second substrate, disposed opposite to the first substrate; A first conductive layer is disposed on the first substrate; a second conductive layer disposed on the second substrate; and A first supporting member is disposed between the first conductive layer and the second conductive layer.

7. The electronic device according to claim 6, wherein: The first panel also includes: a first light modulation layer disposed between the first conductive layer and the second conductive layer; and A first frame glue is disposed between the first conductive layer and the second conductive layer and surrounds the first light modulation layer; Wherein, the first supporting member is arranged on the outer side of the first frame glue.

8. The electronic device as claimed in claim 6, wherein: The first panel further includes a second support member disposed between the first conductive layer and the second conductive layer, wherein the first support member and the second support member partially overlap in a direction perpendicular to the top-view direction of the electronic device.

9. An electronic device, characterized in that: Include: a first panel including a first bonding pad; a second panel, overlapping the first panel, wherein the second panel comprises a second bonding pad; a circuit board, electrically connected to the first panel and used for providing a first signal; and a first conductive connecting member electrically connected to the first panel and the second panel; Wherein, the first signal is input to the first bonding pad of the first panel via the circuit board, and is input to the second bonding pad of the second panel via the first conductive connection member; Wherein, the resistance value of the circuit board is different from the resistance value of the first conductive connecting component.

10. The electronic device according to claim 9, wherein: The first panel includes a first conductive layer. The first bonding pad overlaps with the first conductive layer. The first conductive connecting element is electrically connected to the first bonding pad via the first conductive layer.

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