Microsatellite heat conduction structural member

Abstract

The invention relates to a microsatellite heat conduction structural member which comprises a structural layer, the shape of which is matched with the shape of a heat dissipation part of a PCDH control unit; a heat-conducting insulating layer is arranged on one side, facing the heat dissipation component, of the structural layer; and an anti-radiation layer is also arranged between the structural layer and the heat-conducting insulating layer. The heat-conducting structural member provided by the invention has the advantages of compact structure, unique appearance, light structure, high reliability, good structural strength and the like, the heat of the component can be effectively conducted out while convenient assembly is realized, the working efficiency of the component is improved, and the service life of the component is prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of heat conduction control, and in particular to a heat conduction structural part for a micro-satellite. Background Art

[0002] With the continuous development of aerospace technology, the working environment of micro-satellites in space is becoming increasingly complex. During the operation of satellites, electronic equipment will generate a lot of heat. If the heat cannot be dissipated in a timely and effective manner, the temperature of the electronic equipment will be too high, which will affect its performance and reliability, and may even cause failures, shortening the working time and service life of the satellite. At present, the existing satellite thermal conductive structure has certain limitations in terms of heat dissipation efficiency, structural compactness, and compatibility with other satellite components, and cannot meet the growing demand for high-performance satellite thermal control. Summary of the invention

[0003] Based on this, it is necessary to provide a micro-satellite thermal conductive structural component that can improve the satellite's heat dissipation efficiency, has a compact structure and good compatibility in order to address the above technical problems.

[0004] A micro-satellite heat-conducting structural component comprises: a structural layer, the shape of which is adapted to the shape of a heat dissipation part of a PCDH control unit; A heat-conducting insulating layer is arranged on the structural layer at a side facing the heat-dissipating components; and an anti-radiation layer is also arranged between the structural layer and the heat-conducting insulating layer.

[0005] In one of the embodiments, a weight-reducing portion is provided on the structural layer at a position where the thermally conductive insulating layer is not provided and at a side away from the heat dissipation component.

[0006] In one embodiment, the weight-reducing portion is a groove or a hollow.

[0007] In one of the embodiments, reinforcing ribs are provided at the hollowed-out positions, and the strength of the structural layer is increased by the reinforcing ribs.

[0008] In one embodiment, the structural layer, the weight-reducing component and the reinforcing ribs are integrally formed.

[0009] In one of the embodiments, a mounting groove is further provided on the structural layer; the height of the mounting groove is less than or equal to the thickness of the thermally conductive insulating layer and the anti-radiation layer superimposed.

[0010] In one of the embodiments, a stepped avoidance structure is provided on one side of the structural layer where the heat-conducting insulating layer is provided; the stepped avoidance structure is a step formed according to the different heights of the heat dissipation components.

[0011] In one embodiment, the structural layer is prepared using a metal material with high thermal conductivity and light weight as a substrate, and the thermal conductivity is increased through a black anodizing surface treatment process.

[0012] In one of the embodiments, the anti-radiation layer is made of tantalum or polyethylene or synthetic fiber.

[0013] In one embodiment, the thermally conductive insulating layer is made of a material having both insulating and thermally conductive properties.

[0014] Compared with the prior art, the micro-satellite heat-conducting structural component provided by the present invention has the following effects: 1. The shape of the structural layer matches the shape of the heat dissipation part of the PCDH control unit, which can ensure close contact with the device, facilitate quick installation and integration, and have good compatibility.

[0015] 2. The thermally conductive insulation layer can not only dissipate heat for the heat dissipation components, but also provide electrical insulation to prevent short circuit or leakage, thus ensuring the safe operation of electronic equipment.

[0016] 3. The setting of the anti-radiation layer can resist the high-energy particle radiation in space, protect electronic components from radiation damage, and extend the life of the equipment.

[0017] 4. By only setting the thermal insulation layer and the anti-radiation layer at the position of the heat dissipation components, the structure is compact. While meeting the heat dissipation performance, the use of redundant materials is avoided, unnecessary weight is reduced, and a lightweight design is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 This is a schematic diagram of the structure of a heat-conducting structural component of a micro-satellite in one embodiment; Figure 2 is a schematic diagram of the first surface structure of a structural layer in one embodiment; Figure 3 FIG. 4 is a schematic diagram of the second surface structure of the structural layer in one embodiment.

[0020] Description of reference numerals: Structural layer 1, first surface 11, second surface 12, groove 13, hollow 14, connecting beam 141, reinforcing rib 15, mounting groove 16, stepped avoidance structure 17, mounting hole 18, thermal conductive insulation layer 2, anti-radiation layer 3.

[0021] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0024] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0025] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, a physical connection, or a wireless communication connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] In addition, the detachable connection mentioned in the present invention includes but is not limited to snap connection, threaded connection, pin connection, magnetic connection, plug-in connection, etc., which can be adaptively selected according to the situation. The specific detachable connection method in the following embodiment is one of the practicable methods and is not the only limitation.

[0027] It can be understood that the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0028] The present invention is applied to commercial micro-satellites, and can conduct heat to heat dissipation components that need heat conduction during the operation of the satellite, thereby extending the working time of the components and obtaining more data. The design has the advantages of compact structure, unique appearance, light structure, high reliability, good structural strength, etc., and can effectively conduct heat from components while achieving convenient assembly, improving the working efficiency of components and extending the service life of components.

[0029] The following will describe the implementation of the present invention in detail with reference to the accompanying drawings in the embodiment diagram of the present invention.

[0030] This embodiment discloses a micro-satellite heat-conducting structural part, including: a structural layer 1, the shape of the structural layer 1 is adapted to the shape of the heat dissipation part of the PCDH control unit, which can ensure close contact with the device, facilitate rapid installation and integration, and have good compatibility. On the structural layer 1, a heat-conducting insulating layer 2 is provided on the side facing the heat dissipation component, which can provide electrical insulation while dissipating heat for the heat dissipation component, prevent short circuit or leakage, and ensure the safe operation of the electronic equipment. Between the structural layer 1 and the heat-conducting insulating layer 2, an anti-radiation layer 3 is also provided, and the anti-radiation layer 3 can resist high-energy particle radiation in space, protect electronic components from radiation damage, and extend the life of the equipment. In addition, since the micro-satellite is sensitive to weight, by only providing a heat-conducting insulating layer and an anti-radiation layer at the position of the heat dissipation component, the function is guaranteed while achieving a lightweight design as much as possible. Through the combined design of the structural layer 1, the heat-conducting insulating layer 2 and the anti-radiation layer 3, the thermal management is optimized, the electronic components are ensured to work at a suitable temperature, and the reliability is improved.

[0031] Specifically, the structural layer 1 is a plate-like structure with a certain thickness, and is prepared using a metal material with high thermal conductivity and light weight as a substrate. For example, a 6063-T6 series aluminum alloy or titanium alloy or a carbon fiber composite material can be used as a substrate, and a black anodized surface treatment process is used to increase thermal conductivity. Its overall shape is designed according to the shape of one side of the heat dissipation part of the PCDH control unit. It can be seen that the shape of the structural layer 1 is irregular.

[0032] The structural layer 1 has a first surface 11 and a second surface 12. One or more thermally conductive insulating layers 2 are provided on the first surface 11. The number of thermally conductive insulating layers 2 is determined according to the number of heat dissipation components required to dissipate heat, and the positions correspond to the positions of the heat dissipation components. In this embodiment, thermally conductive insulating layers 2 are provided in three regions A, B, and C, and an anti-radiation layer 3 is provided between the structural layer 1 and the thermally conductive insulating layer 2.

[0033] On the first surface 11, a weight-reducing component is provided at a position where the heat-conducting insulating layer 2 is not provided and on the second surface away from the heat-dissipating components. The weight-reducing component is a groove 13 or a hollow 14, such as Figure 1 As shown, the groove 13 is set at a place where the gap or space is small, and the hollow 14 is set at a place where the space is large. At the hollow 14, the structures on both sides are connected by a connecting beam 141, and a cross reinforcing rib 15 is set between the two connecting beams 141. The reinforcing rib 15 increases the strength of the structural layer 1 and can also enhance heat dissipation. It is worth noting that in order to ensure that the structural layer 1 has sufficient strength, the diameter of the connecting beam 141 is larger than the diameter of the reinforcing rib 15, so that the structural strength is met.

[0034] In addition, in order to ensure the overall strength of the structural layer 1, grooves 13 are preferably set at the small spaces at both ends of the structural layer 1. The structural layer 1, the weight-reducing components and the reinforcing ribs 15 can also be milled through the whole piece of material to form an integral body, while reducing weight and further ensuring the structural strength. During the milling process, the groove position maintains a certain wall thickness to ensure that the structure has sufficient strength; the four corners of the reinforcing ribs 15 are appropriately chamfered to enhance the aesthetics of the structure.

[0035] The thermal insulation layer 2 is a regular rectangle for easy installation, one side of which faces the heat dissipation components and the other side is in contact with the anti-radiation layer 3. The thermal insulation layer 2 is made of a material having both insulation and thermal conductivity, such as a thermally conductive silicon pad, a polyurethane thermally conductive pad, etc.

[0036] The anti-radiation layer 3 is also a regular rectangle for easy installation, and its shape is adapted to the thermally conductive insulating layer 2, and its length and width are greater than or equal to the length and width of the thermally conductive insulating layer 2. One side of the anti-radiation layer 3 is in contact with the thermally conductive insulating layer 2, and the other side is in contact with the first surface 11 of the structural layer 1. The anti-radiation layer 3 is made of a material with radiation protection performance, such as tantalum, polyethylene, or synthetic fiber.

[0037] In order to prevent the thermal insulation layer 2 and the anti-radiation layer 3 from falling off, a mounting groove 16 is further provided on the first surface of the structural layer 1, and the height of the mounting groove 16 is less than or equal to the superimposed thickness of the thermal insulation layer 2 and the anti-radiation layer 3. The number of mounting grooves 16 is determined according to the situation. The mounting groove 16 can be provided at each position where the thermal insulation layer 2 and the anti-radiation layer 3 are provided, or the mounting groove 16 can be provided only in the area of ​​the thermal insulation layer 2 and the anti-radiation layer 3 with a larger area. In this embodiment, the mounting groove 16 is provided only in the area B with a larger area. By embedding the thermal insulation layer 2 and the anti-radiation layer 3 into the mounting groove 16, it can effectively dissipate heat while preventing them from falling off.

[0038] Since the heights of the heat dissipation components on the PCDH control unit are different, a stepped avoidance structure 17 is also provided on the first surface of the structural layer 1; the stepped avoidance structure 17 is a step formed according to the different heights of the heat dissipation components, and the number of steps is more than one, which is specifically determined according to the height of the heat dissipation components. At the same time, the stepped design of the stepped avoidance structure 17 can avoid other components, so that the heat conduction structure maintains an appropriate distance above the components that do not need heat conduction.

[0039] A mounting hole 18 is also provided on the side of the structural layer 1, and the mounting hole 18 is a threaded mounting hole. By means of threaded connection, the micro-satellite heat-conducting structural component in this embodiment can be integrated into other structural frames, and then the micro-satellite heat-conducting structural component can be firmly and stably installed by means of screws, with strong adaptability and good compatibility.

[0040] During preparation, first select the appropriate material according to the design requirements, such as the light alloy aluminum 6063-T6 for the structural layer 1, and then grind it into the required shape according to the shape of the heat dissipation part of the PCDH control unit. The thermal insulation layer 2 uses a thermal conductive silicon pad, and is pasted on the surface of the heat dissipation component during installation. The anti-radiation layer 3 uses a tantalum sheet, and the two sides of the tantalum sheet are pasted to the thermal conductive silicon pad and the first surface of the structural layer 1 to form a multi-layer structure; the tantalum sheet and the thermal conductive silicon pad are sheared to form a regular square structure.

[0041] The processed structural layer 1, tantalum sheet and thermal conductive silicon pad are assembled according to the assembly process document to ensure that they are well pasted on the surface of the components that need heat dissipation and fixed through the mounting holes 18. After the installation is completed, the overall thermal conductive structure is debugged and tested to check whether the overall thermal conductive structure meets the thermal conductivity requirements. If there is a problem, it is adjusted and repaired in time to ensure that the overall thermal conductive structure can work normally and provide reliability and heat dissipation guarantee for satellite electronic equipment.

[0042] During heat dissipation, the thermally conductive insulating layer 2 transfers the heat of the heat dissipating components to the anti-radiation layer 3, the anti-radiation layer 3 transfers the heat to the structural layer 1, and then the structural layer 1 transfers the heat to the outside.

[0043] The present invention greatly improves the heat dissipation efficiency of the satellite through the synergistic effect of the heat-conducting insulation layer 2 with high thermal conductivity, the anti-radiation layer 3 and the structural layer 1 with a special shape, and can quickly dissipate the heat generated by the electronic equipment to the outside world, ensuring the stable operation of the electronic equipment. During the design, the structural layer 1 is optimized according to the internal space layout of the satellite to reduce space occupancy, make the structure compact, improve the internal space utilization of the satellite, and ensure the stability and reliability of the structure. In addition to the full weight reduction design, the structural layer 1 also gives priority to the use of light and high-quality aluminum alloy 6063-T6 type materials, while ensuring that its appearance meets the use and structural strength, and further realizes the lightweight design. The heat-conducting structural parts provided by the present invention can cooperate well with other components of the satellite, will not interfere with other systems of the satellite, have good compatibility, and are easy to install and maintain, reducing the maintenance cost of the satellite.

[0044] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0045] The above-mentioned embodiments only express several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A micro-satellite heat-conducting structural component, characterized in that: include: A structural layer, the shape of which is adapted to the shape of the heat dissipation part of the PCDH control unit; A heat-conducting insulating layer is provided on the structural layer on a side facing the heat dissipation component; An anti-radiation layer is also arranged between the structural layer and the thermally conductive insulating layer.

2. The micro-satellite heat-conducting structural component according to claim 1, characterized in that: A weight-reducing portion is provided on the structural layer at a position where the heat-conducting insulating layer is not provided and at a side away from the heat-dissipating component.

3. The micro-satellite heat-conducting structural component according to claim 2, characterized in that: The weight-reducing portion is a groove or a hollow.

4. The micro-satellite heat-conducting structure according to claim 3, characterized in that: Reinforcing ribs are provided at the hollowed-out positions, and the strength of the structural layer is increased by the reinforcing ribs.

5. The micro-satellite heat-conducting structural component according to claim 4, characterized in that: The structural layer, the weight-reducing component and the reinforcing ribs are integrally formed.

6. The micro-satellite heat-conducting structure according to any one of claims 1 to 5, characterized in that: A mounting groove is also provided on the structural layer; the height of the mounting groove is less than or equal to the thickness of the thermally conductive insulating layer and the anti-radiation layer superimposed.

7. The micro-satellite heat-conducting structure according to claim 6, characterized in that: On the structural layer, a side where the heat-conducting insulating layer is provided is also provided with a stepped avoidance structure; the stepped avoidance structure is a step formed according to the different heights of the heat dissipation components.

8. The micro-satellite heat-conducting structure according to claim 6, characterized in that: The structural layer is prepared by using a metal material with high thermal conductivity and light weight as a base material, and the thermal conductivity is increased by a black anodizing surface treatment process.

9. The micro-satellite heat-conducting structure according to any one of claims 1 to 5, characterized in that: The anti-radiation layer is made of tantalum or polyethylene or synthetic fiber.

10. The micro-satellite heat-conducting structure according to any one of claims 1 to 5, characterized in that: The heat-conducting insulating layer is made of a material having both insulating properties and heat-conducting properties.

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