Semiconductor module

Abstract

A semiconductor module includes a substrate, at least one semiconductor element on the substrate, and an optical fiber cable connected to the semiconductor element. The optical fiber cable is directly or indirectly fixed to the substrate at a plurality of positions.

Description

Technical Field

[0001] The disclosed embodiments relate to a semiconductor module. Background Art

[0002] Conventionally, there is known a semiconductor module in which a semiconductor element (hereinafter also referred to as an optical element) for converting an electrical signal into an optical signal is mounted on a substrate. An optical fiber cable for transmitting the converted optical signal from the optical element to the outside is sometimes connected to the semiconductor module (see Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-9824 Summary of the invention

[0006] The semiconductor module of the present invention comprises a substrate, at least one semiconductor element located on the substrate, and an optical fiber cable connected to the semiconductor element. The optical fiber cable is directly or indirectly fixed to the substrate at a plurality of locations. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a top view of the semiconductor module according to the embodiment.

[0008] Figure 2 It is a side view of the semiconductor module according to the embodiment.

[0009] Figure 3 It is a top view of the semiconductor module according to another first embodiment.

[0010] Figure 4 It is a side view of the semiconductor module according to another first embodiment.

[0011] Figure 5 This is another enlarged plan view of the semiconductor module according to the first embodiment.

[0012] Figure 6 This is an enlarged plan view of a semiconductor module according to another second embodiment.

[0013] Figure 7 It is a top view of a semiconductor module according to another third embodiment.

[0014] Figure 8 It is an enlarged plan view of a semiconductor module according to another third embodiment.

[0015] Fig. 9 It is a top view of a semiconductor module according to another fourth embodiment.

[0016] Fig.10 It is a side view of a semiconductor module according to another fourth embodiment.

[0017] Fig.11 It is a top view of a semiconductor module according to another fifth embodiment.

[0018] Fig.12 It is an enlarged plan view of a semiconductor module according to another fifth embodiment. DETAILED DESCRIPTION

[0019] Hereinafter, the embodiments of the semiconductor module disclosed in the present application will be described with reference to the accompanying drawings. It should be noted that the present invention is not limited to the embodiments shown below. In addition, the various embodiments can be appropriately combined within the scope that does not cause inconsistency in the processing content. In addition, in the following embodiments, the same figure mark is marked on the same part, and repeated description is omitted.

[0020] In addition, in the embodiments shown below, expressions such as "certain", "orthogonal", "perpendicular" or "parallel" are sometimes used, but these expressions do not necessarily mean "certain", "orthogonal", "perpendicular" or "parallel" in a strict sense. That is, the above expressions allow for deviations such as manufacturing accuracy and setting accuracy.

[0021] In the drawings referred to below, for ease of understanding, an orthogonal coordinate system is sometimes shown in which the X-axis direction, Y-axis direction, and Z-axis direction are defined to be orthogonal to each other and the positive direction of the Z-axis is set as the vertical upward direction.

[0022] Conventionally, there is known a semiconductor module in which a semiconductor element (hereinafter also referred to as an optical element) for converting an electrical signal into an optical signal is mounted on a substrate. An optical fiber cable for transmitting the converted optical signal from the optical element to the outside is sometimes connected to the semiconductor module.

[0023] However, in the above-mentioned conventional technology, since the optical fiber cable is only fixed to the semiconductor element, when vibration or impact is applied to the substrate or the optical fiber cable from the outside, the connection of the optical fiber cable may be damaged.

[0024] Therefore, it is desired to realize a technology that can overcome the above-mentioned problems and improve the mechanical strength of the semiconductor module.

[0025] <Implementation Method>

[0026] First, refer to Figure 1 and Figure 2 The semiconductor module 1 according to the embodiment will be described. Figure 1 is a top view of a semiconductor module 1 according to an embodiment. Figure 2 It is a side view of the semiconductor module 1 according to the embodiment.

[0027] In each of the following embodiments, the semiconductor module 1 is described as an optical module in which the optical element 3 is mounted on a substrate. However, the semiconductor module of the present invention is not necessarily an optical module.

[0028] like Figure 1 and Figure 2 As shown, the semiconductor module 1 of the embodiment includes a substrate 2, a plurality of optical elements 3 (optical elements 3a to 3d), and a heat dissipation member 4. The optical element 3 is an example of a semiconductor element.

[0029] The substrate 2 is, for example, in the shape of a quadrilateral plate when viewed from above. In addition to the plurality of optical elements 3a to 3d and the heat dissipation member 4, a power IC 5, a control IC 6, a plurality of passive components 7, etc. are also located on the first surface 21 (here, the upper surface) of the substrate 2. The passive components 7 are, for example, resistors, capacitors, coils, etc.

[0030] In addition, although Figure 1 and Figure 2 Although not shown in the figure, the connector is located on the second surface 22 (here, the lower surface) of the substrate 2. The substrate 2 is electrically connected to the main board via the connector.

[0031] The optical element 3 is a semiconductor element that converts an electrical signal into an optical signal. Alternatively, the optical element 3 may also convert an optical signal into an electrical signal. The interface portion 31 is located on the upper surface of each optical element 3 .

[0032] The interface portion 31 is connected to the optical connector 33 via the optical fiber cable 32. That is, the optical fiber cable 32 is fixed to the substrate 2 via the interface portion 31 and the optical element 3.

[0033] In the embodiment, the interface unit 31 and the optical connector 33 may be connected via a plurality of optical fiber cables 32. For example, in the embodiment, the interface unit 31 and the optical connector 33 may be connected via a transmission side cable group 32A and a reception side cable group 32B.

[0034] The transmission side cable group 32A is composed of a plurality of optical fiber cables 32 that transmit the optical signal transmitted from the optical element 3. The reception side cable group 32B is composed of a plurality of optical fiber cables 32 that transmit the optical signal received by the optical element 3.

[0035] The heat dissipation member 4 is a so-called heat sink, and is located above the plurality of optical elements 3. In addition, the heat dissipation member 4 does not necessarily cover all of the plurality of optical elements 3. Figure 1 As shown, the upper surfaces of the plurality of optical elements 3 may be partially exposed from the heat dissipation member 4 .

[0036] The heat dissipation member 4 is adjacent to the plurality of optical elements 3 and releases the heat generated by the optical elements 3 to the outside of the semiconductor module 1. In addition, the heat dissipation member 4 may be in direct contact with the optical element 3. Alternatively, the heat dissipation member 4 may be in contact with the optical element 3 via a TIM (Thermal Interface Material). That is, the heat dissipation member 4 may be thermally connected to the plurality of optical elements 3.

[0037] The heat dissipation member 4 may be formed of a metal having a relatively high thermal conductivity, such as aluminum, copper, or iron. TIM is a composite material containing a thermally conductive filler in a resin.

[0038] The heat dissipation member 4 includes a first portion 41 and a plurality of third portions (not shown). The first portion 41 is a plate-shaped portion disposed opposite to the first surface 21 of the substrate 2 at a distance therefrom. The plurality of third portions are foot-shaped portions provided on the first portion 41. Specifically, the plurality of third portions extend from the first portion 41 toward the substrate 2 and contact the substrate 2 (are mounted on the substrate 2). In addition, the plurality of third portions are located at positions spaced apart from each other along a predetermined direction (the Y-axis direction in the figure).

[0039] These third portions are formed in a shape in which the thickness partially increases from the first portion 41. The third portion may be integrated with the first portion 41. The plurality of third portions may be connected to the first portion 41 and the substrate 2. The plurality of third portions extend in a certain direction (here, the X-axis direction).

[0040] In the embodiment, the optical fiber cable 32 extends from the interface portion 31 in a direction approaching the heat dissipation member 4 (the negative direction of the X axis in the figure), passes directly over the heat dissipation member 4 in this direction, and extends to the optical connector 33.

[0041] Here, in the embodiment, the optical fiber cable 32 may be fixed to the heat dissipation member 4 by the elastic member 42 located between the optical fiber cable 32 and the heat dissipation member 4. In other words, the optical fiber cable 32 may be fixed to the substrate 2 via the elastic member 42 and the heat dissipation member 4.

[0042] Thus, in the embodiment, the optical fiber cable 32 can be indirectly fixed to the substrate 2 at a plurality of positions (here, the interface portion 31 and the elastic member 42). Thus, when vibration or impact is applied to the substrate 2 or the optical fiber cable 32 from the outside, it is possible to reduce the situation where an excessive load is applied to the connection portion of the optical fiber cable 32 (i.e., the interface portion 31).

[0043] That is, in the embodiment, it is possible to improve the mechanical strength of the semiconductor module 1. In addition, in the embodiment, by fixing the optical fiber cable 32 to the substrate 2 at a plurality of locations, it is possible to reduce the possibility of damage to the connection points of the optical fiber cable 32.

[0044] In the embodiment, the optical fiber cable 32 may be fixed to the substrate 2 via the heat dissipation member 4. This can improve the mechanical strength of the semiconductor module 1 and improve the heat dissipation efficiency of the plurality of optical elements 3.

[0045] In the embodiment, the optical fiber cable 32 may be fixed to the heat dissipation member 4 via the elastic member 42. Thus, when vibration or impact is applied to the substrate 2 or the optical fiber cable 32 from the outside, the elastic member 42 can absorb the vibration or impact from the outside.

[0046] That is, in the embodiment, it is possible to further improve the mechanical strength of the semiconductor module 1. The elastic member 42 may be made of a material having appropriate elasticity, such as resin, sponge, or silicon wafer.

[0047] In the embodiment, the interface portion 31 and the heat dissipation member 4 may be separated from each other. This can reduce the amount of vibration or impact applied to the interface portion 31 when vibration or impact is applied to the heat dissipation member 4 from the outside.

[0048] That is, in the embodiment, the mechanical strength of the semiconductor module 1 can be further improved.

[0049] In addition, Figure 1 and Figure 2 In the example of FIG. 1 , an example is shown in which a portion of the optical fiber cable 32 is fixed to the substrate 2 via the heat dissipation member 4 and the elastic member 42 , but the present invention is not limited to this example.

[0050] For example, in the technology of the present invention, the mid-way portion of the optical fiber cable 32 can be directly fixed to the surface (e.g., the first surface 21, etc.) of the substrate 2. In addition, in the technology of the present invention, the mid-way portion of the optical fiber cable 32 can also be indirectly fixed to the substrate 2 via a member without a heat dissipation function.

[0051] Thus, even when vibration or shock is applied from the outside to the substrate 2 or the optical fiber cable 32, it is possible to reduce excessive load applied to the connection of the optical fiber cable 32. That is, in the embodiment, the mechanical strength of the semiconductor module 1 can be improved.

[0052] like Figure 1 As shown in the figure, when viewed along the extension direction (X-axis direction) of the optical fiber cable 32, the plurality of optical elements 3a to 3d are arranged in a direction (Y-axis direction) orthogonal to the extension direction. Specifically, the plurality of optical elements 3a to 3d are arranged in the order of optical element 3d, optical element 3c, optical element 3b, and optical element 3a in the positive direction of the Y-axis.

[0053] In addition, the plurality of optical elements 3a to 3d are arranged to be spaced apart from each other. By providing this structure, when the plurality of optical elements 3a to 3d are located on the substrate 2, thermal interference between the optical elements 3a to 3d can be reduced.

[0054] Specifically, if Figure 1 As shown, the optical element 3a among the plurality of optical elements 3a to 3d and the optical element 3b located closest to the optical element 3a are offset from each other in the extending direction (X-axis direction) and the direction orthogonal to the extending direction (Y-axis direction) of the optical fiber cable 32. Similarly, the optical element 3d among the plurality of optical elements 3a to 3d and the optical element 3c located closest to the optical element 3d are offset from each other in the X-axis direction and the Y-axis direction.

[0055] Thus, the plurality of optical elements 3 are arranged to be staggered. Thus, in the embodiment, the distance between adjacent optical elements 3 can be ensured, in other words, the thermal interference between adjacent optical elements 3 can be reduced, and the size of the substrate 2 can be reduced.

[0056] Here, an example is described in which two adjacent optical elements (for example, optical element 3a and optical element 3b) among the plurality of optical elements 3a to 3d are separated in the X-axis direction and the Y-axis direction. However, the present invention is not limited to this, and in all the plurality of optical elements 3a to 3d, the positions of two adjacent semiconductor elements may be offset in the extension direction (X-axis direction) of the optical fiber cable 32 and in the direction orthogonal to the extension direction (Y-axis direction).

[0057] For example, the plurality of optical elements 3a to 3d may be arranged in a staggered manner. This can reduce thermal interference between the optical elements 3 and reduce the size of the substrate 2.

[0058] On the negative side of the semiconductor module 1 in the X-axis direction, a blower (not shown) such as a cooling fan may be provided to blow air toward the semiconductor module 1. The blower generates wind W in the positive direction of the X-axis.

[0059] The wind W sent out from the blower hits the first portion 41 of the heat dissipating member 4 , flows along the first surface 21 of the substrate 2 , and passes through the ventilation path 100 formed between the substrate 2 and the first portion 41 .

[0060] Furthermore, in the embodiment, the wind W is blown to the plurality of optical elements 3 located at the outlet side of the ventilation path 100 , so that the heat dissipation efficiency of the plurality of optical elements 3 can be further improved.

[0061] Furthermore, in the embodiment, since the plurality of optical elements 3 are arranged in a direction (here, the Y-axis direction) intersecting the flow direction of the wind W, the wind W blows substantially uniformly to all the optical elements 3. Therefore, according to the embodiment, the heat dissipation efficiency of the plurality of optical elements 3 can be further improved.

[0062] like Figure 2 As shown, the power IC5 and the control IC6 can be located below the heat dissipation member 4. In addition, the power IC5 and the control IC6 can be thermally connected to the heat dissipation member 4. Thus, the heat generated by the power IC5 and the control IC6 can be efficiently dissipated through the heat dissipation member 4.

[0063] For example, a plurality of power ICs 5 may be present on the substrate 2 , thereby enabling power to be supplied to the optical element 3 at a plurality of standard voltages.

[0064] <Other Embodiments>

[0065] Next, refer to Figures 3 to 12 A semiconductor module 1 according to another embodiment will be described. Figure 3 is a top view of a semiconductor module 1 according to another first embodiment. Figure 4 1 is a side view of a semiconductor module 1 according to another embodiment of the present invention. Figure 5 It is an enlarged plan view of the semiconductor module 1 according to another first embodiment.

[0066] like Figure 3 As shown in FIG. 1 , in another embodiment 1, the structure of the heat dissipation member 4 is different from that in the above embodiment. Specifically, in another embodiment 1, the heat dissipation member 4 may be composed of a first portion 41 , a third portion (not shown), and a plurality of second portions 43 .

[0067] The plurality of second portions 43 are located on the upper surface 41a of the first portion 41 in an upright state. In addition, in another embodiment 1, the second portion 43 is plate-shaped (i.e., a heat sink). The plate-shaped second portion 43 is arranged, for example, in the same direction as the direction in which the optical fiber cable 32 extends (the X-axis direction in the drawings). In addition, the plurality of second portions 43 are arranged in a direction perpendicular to the direction in which the second portion 43 extends (the Y-axis direction in the drawings).

[0068] In this way, by providing the plurality of second portions 43 positioned on the upper surface 41 a of the first portion 41 in an upright state, the heat dissipation efficiency of the plurality of optical elements 3 can be further improved.

[0069] Furthermore, in another embodiment, Figure 3 As shown in FIG. 4 , the optical fiber cable 32 may be disposed between adjacent second portions 43 , and the optical fiber cable 32 may be fixed to the upper surface 41 a of the first portion 41 via the elastic member 42 .

[0070] In this way, the optical fiber cable 32 is passed between the adjacent second portions 43 and bonded and fixed to the upper surface 41 a of the first portion 41 , thereby eliminating the need for additional extension in the planar direction of the substrate 2 and the need for additional fixing members.

[0071] Therefore, according to another first embodiment, the semiconductor module 1 can be manufactured compactly and at low cost.

[0072] In addition, in another embodiment, Figure 5 As shown, the interval B1 between adjacent second portions 43 may be greater than the interval B1 between adjacent second portions 43 and the same optical element 3 (see Figure 3 ) The overall width A1 of all the optical fiber cables 32 connected thereto (ie, A1 < B1).

[0073] This can reduce the number of Figure 3 ) all the optical fiber cables 32 connected to the second part 43 interfere with each other on the upper surface 41a of the first part 41.

[0074] In addition, Figures 3 to 5 In the example shown in FIG. 1 , the second portion 43 is in a plate shape (ie, a heat sink), but the present invention is not limited to this example.

[0075] Figure 6 FIG. 1 is an enlarged top view of a semiconductor module 1 according to another embodiment 2. Figure 6 As shown, the second portion 43 may also be pin-shaped (ie, heat dissipation pin). The plurality of pin-shaped second portions 43 are, for example, positioned in a matrix on the upper surface 41a of the first portion 41 in an upright state. Thus, the heat dissipation efficiency of the plurality of optical elements 3 can be further improved.

[0076] Figure 7 is a top view of a semiconductor module 1 according to another third embodiment. Figure 8 It is an enlarged plan view of a semiconductor module 1 according to another third embodiment.

[0077] like Figure 7 As shown in the other embodiment 3, the second portion 43 is arranged differently from the other embodiment 1. Specifically, in the other embodiment 3, the second portion 43 is also located between the transmission side cable group 32A and the reception side cable group 32B connected to the same optical element 3.

[0078] Thus, similar to the above-mentioned other embodiment 1, there is no need to extend the substrate 2 in the plane direction, and there is no need to arrange another fixing member. Therefore, according to the other embodiment 3, the semiconductor module 1 can be manufactured compactly and at low cost.

[0079] In the third embodiment, the second portion 43 is located between the transmission cable group 32A and the reception cable group 32B connected to the same optical element 3, so that the number of second portions 43 located in the heat dissipation member 4 can be increased. Thus, the heat dissipation efficiency of the plurality of optical elements 3 can be further improved.

[0080] In addition, in another embodiment three, if Figure 8 As shown, the interval B1 between adjacent second portions 43 may be greater than the width A2 (ie, A2 <B1)。

[0081] This can reduce the interference between the transmission-side cable group 32A or the reception-side cable group 32B and the second portion 43 on the upper surface 41 a of the first portion 41 .

[0082] In addition, in another embodiment 3, the interval A3 between the transmitting side cable group 32A and the receiving side cable group 32B connected to the same optical element 3 may be greater than the width B2 of the second portion 43 (ie, B2 <A3)。

[0083] This can reduce the interference between the transmission-side cable group 32A or the reception-side cable group 32B and the second portion 43 on the upper surface 41 a of the first portion 41 .

[0084] Fig. 9 is a top view of a semiconductor module 1 according to another fourth embodiment. Fig.10 FIG. 1 is a side view of a semiconductor module 1 according to another fourth embodiment. Fig.10 As shown in FIG. 1 , in another fourth embodiment, the configuration of the optical fiber cable 32 is different from that in the above-mentioned embodiments.

[0085] Specifically, in another embodiment four, the optical fiber cable 32 can extend from the interface portion 31 in a direction away from the heat dissipation component 4 (the positive direction of the X-axis in the drawing), and change to a direction approaching the heat dissipation component 4 (the negative direction of the X-axis in the drawing) at a bend 32a formed midway.

[0086] Furthermore, in another fourth embodiment, the midway portion 32 b of the optical fiber cable 32 that has been changed to approach the heat dissipation member 4 may be fixed to the upper surface 41 a of the first portion 41 of the heat dissipation member 4 .

[0087] Thus, even when vibration or shock is applied from the outside to the substrate 2 or the optical fiber cable 32, it is possible to reduce excessive load applied to the connection of the optical fiber cable 32. That is, in the embodiment, the mechanical strength of the semiconductor module 1 can be improved.

[0088] In addition, in another fourth embodiment, the optical fiber cable 32 can be located between adjacent second portions 43. Thus, there is no need to extend the substrate 2 in the plane direction, and no need to configure an additional fixing member. Therefore, according to another fourth embodiment, the semiconductor module 1 can be manufactured compactly and at low cost.

[0089] In another fourth embodiment, the direction of the optical fiber cable 32 can be changed by the curved portion 32a. This can reduce the situation where a large load is applied to the connection of the optical fiber cable 32, thereby reducing the situation where the connection of the optical fiber cable 32 is damaged.

[0090] In addition, in another fourth embodiment, the direction of the optical fiber cable 32 is changed by the curved portion 32a, thereby reducing the loss of the optical signal transmitted in the optical fiber cable 32. Preferably, the curvature radius of the curved portion 32a is, for example, greater than 15 mm.

[0091] In addition, in another embodiment 4, if Fig.10 As shown, the upper end portion 32 a 1 of the bent portion 32 a may be located higher than the portion 32 b of the optical fiber cable 32 fixed to the heat dissipation member 4 .

[0092] By setting the upper end 32a1 of the curved portion 32a higher in this manner, the curvature radius of the curved portion 32a can be increased, thereby reducing damage to the connection of the optical fiber cable 32 and reducing optical signal loss.

[0093] Furthermore, by setting the portion 32 b fixed to the heat dissipation member 4 lower, even if the overall height of the heat dissipation member 4 remains the same, the height of the second portion 43 itself can be set higher, thereby further improving the heat dissipation efficiency of the plurality of optical elements 3 .

[0094] In each embodiment described here, an example is shown in which a pair of interface units 31 and optical connectors 33 are connected using two cable groups (transmission side cable group 32A and reception side cable group 32B), but the present invention is not limited to this example.

[0095] Fig.11 is a top view of a semiconductor module 1 according to another fifth embodiment. Fig.12 FIG. 1 is an enlarged top view of a semiconductor module 1 according to another fifth embodiment. Fig.11 As shown in FIG. 1 , in another fifth embodiment, a pair of interface portions 31 and optical connectors 33 may be connected by one optical fiber cable group 32C.

[0096] The optical fiber cable group 32C may include both optical fiber cables 32 for transmitting optical signals sent from the optical element 3 and optical fiber cables 32 for transmitting optical signals received by the optical element 3 .

[0097] Furthermore, in another fifth embodiment, a portion of the optical fiber cable group 32C in the middle may be fixed to the heat dissipation member 4. This can improve the mechanical strength of the semiconductor module 1.

[0098] In addition, in another embodiment 5, if Fig.12 As shown, the interval B1 between adjacent second portions 43 may be greater than the width A4 (ie, A4 <B1)。

[0099] This can reduce the mutual interference between the optical fiber cable group 32C and the second portion 43 on the upper surface 41 a of the first portion 41 .

[0100] The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments, and various modifications can be made without departing from the gist thereof. For example, in the above embodiments, an example is shown in which a plurality of elastic members 42 that respectively fix a plurality of cable groups are arranged in a row in the Y-axis direction, but the present invention is not limited to this example.

[0101] For example, a plurality of elastic members 42 may be arranged so as to form the same interval with the corresponding optical elements 3. This also makes it possible to improve the mechanical strength of the semiconductor module 1.

[0102] Those skilled in the art can easily derive further effects or other modes. Therefore, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Therefore, various changes can be made without departing from the spirit or scope of the overall inventive concept defined by the attached claims and their equivalents.

[0103] In addition, the present technology can adopt the following structures. (1)

[0105] A semiconductor module, comprising:

[0106] substrate;

[0107] at least one semiconductor element located on the substrate; and

[0108] A fiber optic cable connected to the semiconductor element,

[0109] The optical fiber cable is fixed to the substrate directly or indirectly at a plurality of locations. (2)

[0111] The semiconductor module according to (1), wherein:

[0112] There is also a heat dissipation member located above the semiconductor element,

[0113] The optical fiber cable is fixed to the substrate via the heat dissipation member. (3)

[0115] The semiconductor module according to (2), wherein:

[0116] There is also an elastic member located between the optical fiber cable and the heat dissipation member. (4)

[0118] The semiconductor module according to (2) or (3), wherein:

[0119] The heat dissipation member includes a first portion and a plurality of second portions positioned on the first portion in an upright state.

[0120] The optical fiber cable is located between a plurality of adjacent second parts and is fixed to the first part. (5)

[0122] The semiconductor module according to (4), wherein:

[0123] Also features:

[0124] a transmission-side cable group composed of a plurality of the optical fiber cables for transmitting the optical signal transmitted from the semiconductor element; and

[0125] A receiving-side cable group is composed of a plurality of the optical fiber cables for transmitting the optical signal received by the semiconductor element.

[0126] The second portion is located between the transmission-side cable group and the reception-side cable group connected to the same semiconductor element. (6)

[0128] The semiconductor module according to any one of (2) to (5), wherein:

[0129] It also has an interface portion located on the upper surface of the semiconductor element and connecting the semiconductor element and the optical fiber cable,

[0130] The optical fiber cable extends from the interface portion in a direction away from the heat dissipation member, and changes direction toward the heat dissipation member at a bend formed midway. (7)

[0132] The semiconductor module according to (6), wherein:

[0133] An upper end portion of the bent portion is located at a position higher than a portion of the optical fiber cable fixed to the heat dissipation member. (8)

[0135] The semiconductor module according to any one of (2) to (7), wherein:

[0136] It also has an interface portion located on the upper surface of the semiconductor element and connecting the semiconductor element and the optical fiber cable,

[0137] The interface portion and the heat dissipation component are separated from each other.

[0138] Description of Reference Numerals

[0139] 1Semiconductor module

[0140] 2 substrates

[0141] 3. 3a to 3d Optical element (an example of a semiconductor element)

[0142] 32 Fiber Optic Cable

[0143] 32A transmission side cable set

[0144] 32B receiving side cable set

[0145] 32C Fiber Optic Cable Set

[0146] 32a Bend

[0147] 32a1 upper end

[0148] 32b

[0149] 4 Heat dissipation components

[0150] 41 Part 1

[0151] 41a Upper surface

[0152] 42 Elastic member

[0153] 43 Part 2

Claims

1. A semiconductor module, wherein: have: substrate; at least one semiconductor element located on the substrate; as well as A fiber optic cable connected to the semiconductor element, The optical fiber cable is fixed to the substrate directly or indirectly at a plurality of locations.

2. The semiconductor module according to claim 1, wherein: There is also a heat dissipation member located above the semiconductor element, The optical fiber cable is fixed to the substrate via the heat dissipation member.

3. The semiconductor module according to claim 2, wherein: There is also an elastic member located between the optical fiber cable and the heat dissipation member.

4. The semiconductor module according to claim 2 or 3, wherein: The heat dissipation member includes a first portion and a plurality of second portions positioned on the first portion in an upright state. The optical fiber cable is located between a plurality of adjacent second parts and is fixed to the first part.

5. The semiconductor module according to claim 4, wherein: Also features: a transmission-side cable group composed of a plurality of the optical fiber cables for transmitting the optical signal transmitted from the semiconductor element; and A receiving-side cable group is composed of a plurality of the optical fiber cables for transmitting the optical signal received by the semiconductor element. The second portion is located between the transmission-side cable group and the reception-side cable group connected to the same semiconductor element.

6. The semiconductor module according to any one of claims 2 to 5, wherein: It also has an interface portion located on the upper surface of the semiconductor element and connecting the semiconductor element and the optical fiber cable, The optical fiber cable extends from the interface portion in a direction away from the heat dissipation member, and changes direction toward the heat dissipation member at a bend formed midway.

7. The semiconductor module according to claim 6, wherein: An upper end portion of the bent portion is located at a position higher than a portion of the optical fiber cable fixed to the heat dissipation member.

8. The semiconductor module according to any one of claims 2 to 7, wherein: It also has an interface portion located on the upper surface of the semiconductor element and connecting the semiconductor element and the optical fiber cable, The interface portion and the heat dissipation component are separated from each other.

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