Flexible circuit board, display module and display device

Abstract

The invention discloses a flexible circuit board, a display module and a display device, and relates to the technical field of display. The flexible circuit board comprises a plurality of bendable areas which are arranged in a first direction and are separated from one another, bending axes of the bendable areas extend in a second direction, the bendable areas comprise a first bendable area, and the flexible circuit board comprises a substrate; the first metal layer is located on one side of the substrate and comprises a first wiring area and a second wiring area which extend in the first direction and are arranged in the second direction; the second metal layer is located on the side, away from the first metal layer, of the substrate and comprises a bending pattern and a first hole which are located in the first bendable area; in orthographic projection on the substrate, the bending pattern is overlapped with the first wiring area, and the first opening is overlapped with the second wiring area.

Description

Flexible circuit board, display module and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a flexible circuit board, a display module, and a display device. Background Art

[0002] In conventional display modules, in order to reduce the volume and weight of the entire module, a printed circuit board is usually attached to the back of the display panel and connected to the display panel through a flexible circuit board to achieve signal transmission.

[0003] Overview

[0004] The present disclosure provides a flexible circuit board, comprising a plurality of bendable regions arranged along a first direction and separated from each other, wherein the bending axes of the bendable regions extend along a second direction, the plurality of bendable regions including a first bendable region, and the flexible circuit board comprises:

[0005] substrate;

[0006] A first metal layer, located on one side of the base substrate, including a first routing area and a second routing area extending along a first direction and arranged along a second direction; and

[0007] A second metal layer is located on a side of the base substrate facing away from the first metal layer, and includes a bending pattern and a first opening located in the first bendable area; and

[0008] In an orthographic projection on the base substrate, the bending pattern overlaps with the first wiring area, and the first opening overlaps with the second wiring area.

[0009] In some embodiments, in an orthographic projection on the base substrate, an area where the first bendable area and the first routing area overlap with each other is located within the range of the bending pattern.

[0010] In some embodiments, the first routing area includes:

[0011] A plurality of ground lines are separated from each other and extend along a first direction, wherein the ground lines are connected to the bending pattern through first via holes.

[0012] In some embodiments, the first routing area further includes:

[0013] A plurality of first signal lines are separated from each other and extend along a first direction, wherein the first signal line is located between two adjacent ground lines, and at least one first signal line is disposed between two adjacent ground lines.

[0014] In some embodiments, the first signal line includes a low voltage differential signal line.

[0015] In some embodiments, the second metal layer includes two first openings, and the two first openings are located on different sides of the bending pattern.

[0016] In some embodiments, the two first openings and the bending pattern are arranged along the second direction, and the two first openings have different sizes in the second direction.

[0017] In some embodiments, the plurality of bendable regions further include a second bendable region, and the second metal layer further includes:

[0018] The second opening located in the second bendable area overlaps with both the first routing area and the second routing area in an orthographic projection on the base substrate.

[0019] In some embodiments, the width of the bending pattern in the first direction is greater than the width of the second opening in the first direction, and the width of the bending pattern in the first direction is equal to the width of the first opening in the first direction.

[0020] In some embodiments, the first routing area includes:

[0021] a first pin, disposed near a first side edge of the first wiring area, and configured to bind the display panel; and

[0022] a second pin, disposed near a second side edge of the first wiring area and used for binding a printed circuit board;

[0023] The first side and the second side are two opposite sides of the first routing area in a first direction, and the bending pattern is located on a side of the second bending area away from the first pin.

[0024] In some embodiments, the flexible circuit board further comprises: a flat area located on at least one side of the bendable area;

[0025] The second metal layer further includes: a flat pattern located in the flat area, the flat pattern and the bending pattern are an integrated structure interconnected, and the flat pattern is connected to the ground line in the first metal layer through a second via.

[0026] In some embodiments, the planar pattern includes: a first conductive pattern for connecting to a ground potential; and

[0027] In an orthographic projection on the base substrate, the first conductive pattern is located within the second routing area and has no overlap with the second via hole.

[0028] In some embodiments, the first metal layer further includes: a second pin for binding a printed circuit board; and

[0029] The first conductive pattern is located on a side of the plurality of bendable areas close to the second pins.

[0030] In some embodiments, the second metal layer includes a plurality of the first conductive patterns, the plurality of the first conductive patterns are located on both sides of the first routing area, and the plurality of the first conductive patterns are arranged along the second direction.

[0031] In some embodiments, the bending pattern is a grid pattern.

[0032] The present disclosure provides a display module, comprising:

[0033] A display panel, and a flexible circuit board as described in any embodiment, wherein the first metal layer in the flexible circuit board is bound and connected to the display panel.

[0034] In some embodiments, the display module further includes: a printed circuit board, bonded and connected to the first metal layer in the flexible circuit board;

[0035] The plurality of bendable areas further include a second bendable area, and the first bendable area and the second bendable area are both in a bent state, so that the printed circuit board is located on a side of the display panel away from the light emitting surface;

[0036] Wherein, a bending radius of the bending pattern is greater than or equal to a bending radius of the second bendable area.

[0037] In some embodiments, the second metal layer further includes: a first conductive pattern for connecting to a ground potential;

[0038] The display module further includes:

[0039] A first conductive tape is located on a side of the flexible circuit board close to the second metal layer, with the tape surface facing the second metal layer; and

[0040] An insulating film is adhered to the adhesive surface of the first conductive tape, the insulating film including an insulating pattern and a third opening. In the orthographic projection on the base substrate, the insulating pattern covers at least the first opening and the second opening, and the third opening covers the first conductive pattern.

[0041] In some embodiments, the display panel includes a first frame, and the first metal layer is connected to a pin located in the first frame;

[0042] The display module further includes:

[0043] a second conductive tape, located on one side of the first frame, with the tape surface facing the first frame; and

[0044] a third conductive tape, located on a side of the printed circuit board close to the components, with the adhesive surface facing the components;

[0045] The first conductive tape, the second conductive tape and the third conductive tape are an integrated structure, and the insulating film extends to the adhesive surface of the third conductive tape, and the orthographic projection of the insulating film on the base substrate covers the orthographic projection of the component on the base substrate.

[0046] The present disclosure provides a display device, comprising:

[0047] The display module according to any one of the embodiments; and

[0048] The driving component is connected to the display module and is used to drive the display module to display.

[0049] The above description is only an overview of the technical solution of the present disclosure. In order to more clearly understand the technical means of the present disclosure, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the specific implementation methods of the present disclosure are listed below.

[0050] BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or related technologies, the following is a brief introduction to the drawings required for the description of the embodiments or related technologies. Obviously, the drawings described below are some embodiments of the present disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts. It should be noted that the scales in the drawings are for illustration only and do not represent the actual scale.

[0052] FIG1 exemplarily shows a schematic structural diagram of a display module in the related art;

[0053] FIG2 exemplarily shows a schematic planar structural diagram of a flexible circuit board provided by the present disclosure;

[0054] FIG3 exemplarily shows a circuit layout diagram of a flexible circuit board provided by the present disclosure;

[0055] FIG4 exemplarily shows a schematic cross-sectional structure diagram of a flexible circuit board provided by the present disclosure;

[0056] FIG5 exemplarily shows a circuit layout diagram of the first metal layer;

[0057] FIG6 exemplarily shows a circuit layout diagram of the second metal layer;

[0058] FIG7 exemplarily shows a local circuit layout diagram of the first routing area;

[0059] FIG8 exemplarily shows a schematic structural diagram of a display module provided by the present disclosure in an unbent state;

[0060] FIG9 exemplarily shows a schematic structural diagram of a display module provided by the present disclosure in a bent state;

[0061] FIG10 exemplarily shows a schematic planar structural diagram of an integrated conductive tape and an insulating film;

[0062] FIG11 exemplarily shows a schematic planar structural diagram of a first pin;

[0063] FIG12 exemplarily shows another planar structural schematic diagram of a flexible circuit board provided by the present disclosure.

[0064] Detailed description

[0065] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0066] In related technologies, printed circuit boards (PCBs) are commonly used as supports for electronic components and as a means of electrically connecting them. As shown in Figure 1, attaching the PCB to the back of the display panel 11 can reduce the overall size of the display module. The display panel 11 and PCB can be connected via a flexible printed circuit (FPC) to facilitate signal transmission.

[0067] In the related art, FPCs generally use a single-layer copper design in the bending area and a double-layer copper design in the non-bending area. However, the inventors have found that using this structure to transmit signals, especially low-voltage differential signals, can easily cause signal instability, affecting the display effect of the display panel 11.

[0068] 2 shows a schematic planar structure diagram of a flexible circuit board provided by the present disclosure, FIG3 shows a circuit layout diagram of a flexible circuit board provided by the present disclosure, and FIG4 shows a schematic cross-sectional structure diagram of a flexible circuit board provided by the present disclosure.

[0069] As shown in FIG. 2 or FIG. 3 , the flexible circuit board includes a plurality of bendable areas BA arranged along a first direction f1 and separated from each other, a bending axis of the bendable areas BA extending along a second direction f2 , and the plurality of bendable areas BA include a first bendable area BA1 .

[0070] As shown in FIG. 4 , the flexible circuit board includes: a base substrate 21 ; a first metal layer 22 located on one side of the base substrate 21 ; and a second metal layer 23 located on a side of the base substrate 21 away from the first metal layer 22 .

[0071] 5 shows a circuit layout diagram of the first metal layer, and FIG. 6 shows a circuit layout diagram of the second metal layer.

[0072] As shown in FIG. 2 , FIG. 3 or FIG. 5 , the first metal layer 22 includes a first routing area SL1 and a second routing area SL2 extending along the first direction f1 and arranged along the second direction f2 .

[0073] As shown in Figures 2, 3, or 6, the second metal layer 23 includes a bending pattern 231 located in the first bendable area BA1 and a first opening 232. In orthographic projection on the substrate 21, the bending pattern 231 overlaps the first trace area SL1, and the first opening 232 overlaps the second trace area SL2.

[0074] Exemplarily, as shown in FIG. 2 or FIG. 3 , the first direction f1 and the second direction f2 are perpendicular to each other.

[0075] As shown in FIG. 2 or FIG. 3 , in the orthographic projection on the base substrate 21 , the first routing area SL1 and the second routing area SL2 extend through each bendable area BA, that is, the first routing area SL1 overlaps with each bendable area BA, and the second routing area SL2 overlaps with each bendable area BA.

[0076] Exemplarily, as shown in FIG. 4 , the first opening 232 is a through hole that penetrates the second metal layer 23 in a direction from the base substrate 21 to the second metal layer 23 .

[0077] The flexible printed circuit board provided herein provides a bending pattern 231 within the overlapping region of the first bendable area BA1 and the first routing area SL1, forming a double-layer copper structure in the overlapping region. This effectively reduces impedance and improves impedance matching between the first bendable area and the non-bending area of ​​the routing within the first routing area SL1. This improves the stability and anti-interference capability of the signals transmitted by the routing within the first routing area SL1, thereby enhancing signal transmission quality and display quality. Furthermore, a first opening 232 is provided within the overlapping region of the first bendable area BA1 and the second routing area SL2, forming a single-layer copper structure in the overlapping region. This ensures that the first bendable area BA1 retains good flexibility and bendability, thereby avoiding problems such as black screen light leakage that may result from bending and ensuring normal display in the bent state.

[0078] For example, low voltage differential signal lines for transmitting low voltage differential signals may be arranged in the first wiring area SL1 to improve the transmission quality of the low voltage differential signals and further improve the display effect.

[0079] In some embodiments, as shown in FIG. 3 , in the orthographic projection on the base substrate 21 , the area where the first bendable area BA1 and the first trace area SL1 overlap with each other is located within the range of the bending pattern 231 .

[0080] Exemplarily, as shown in FIG. 3 , the width of the first wiring region SL1 in the second direction f2 is smaller than the width of the bending pattern 231 in the second direction f2.

[0081] For example, as shown in FIG3 , in an orthographic projection onto the substrate 21, two opposing sides of the overlapping region of the first bendable area BA1 and the first trace area SL1 in the second direction f2 are retracted relative to two opposing sides of the bending pattern 231 in the second direction f2. The retracted dimension d1 can be, for example, greater than or equal to 0.3 mm.

[0082] In some embodiments, as shown in FIG. 5 , the first wiring area SL1 includes a plurality of ground lines 51 separated from each other and extending along the first direction f1 . The ground lines 51 are connected to the bending pattern 231 through the first vias HL1 .

[0083] Exemplarily, as shown in FIG5 , a plurality of grounding lines 51 are arranged along the second direction f2.

[0084] Exemplarily, as shown in FIG5 , a plurality of ground lines 51 are connected to the bending pattern 231 through different first via holes HL1 .

[0085] Exemplarily, as shown in FIG. 3 , in an orthographic projection on the base substrate 21 , the first via hole HL1 is centrally disposed in the region of the bending pattern 231 in the first direction f1 .

[0086] In some embodiments, as shown in Figure 5 or Figure 7, the first routing area SL1 also includes: a plurality of first signal lines 52 separated from each other and extending along the first direction f1, the first signal line 52 is located between two adjacent ground lines 51, and at least one first signal line 52 is arranged between two adjacent ground lines 51.

[0087] Exemplarily, as shown in FIG. 5 or FIG. 7 , a plurality of first signal lines 52 are arranged along the second direction f2 .

[0088] Exemplarily, as shown in FIG7 , two first signal lines 52 are provided between two adjacent ground lines 51 .

[0089] In some embodiments, the first signal line 52 includes a low voltage differential signal line.

[0090] To ensure the display signal quality, the first routing area SL1 including the low voltage differential signal line is located in the middle area of ​​the first metal layer 22 , as shown in FIG. 2 , FIG. 3 or FIG. 5 . Second routing areas SL2 are provided on both sides of the first routing area SL1 .

[0091] In some embodiments, as shown in FIG. 2 , FIG. 3 , or FIG. 6 , the second metal layer 23 includes two first openings 232 , and the two first openings 232 are located on different sides of the bending pattern 231 .

[0092] As shown in Figure 2, Figure 3 or Figure 6, the first bendable area BA1 is divided into three areas arranged along the second direction f2, the middle area is provided with a bending pattern 231, and the other two areas are provided with first openings 232. The first openings 232 are located on the left and right sides of the bending pattern 231.

[0093] In some embodiments, as shown in FIG. 2 , FIG. 3 , or FIG. 6 , the two first openings 232 and the bending pattern 231 are arranged along the second direction f2 , and the two first openings 232 have different sizes in the second direction f2 .

[0094] Of course, the sizes of the two first openings 232 in the second direction f2 may also be the same.

[0095] Exemplarily, as shown in any one of FIG. 2 to FIG. 4 and FIG. 6 , the plurality of bendable areas BA further include a second bendable area BA2 .

[0096] In some embodiments, as shown in any one of Figures 2, 3 and 6, the second metal layer 23 further includes: a second opening 233 located in the second bendable area BA2, and in the orthographic projection on the base substrate 21, the second opening 233 overlaps with the first routing area SL1 and the second routing area SL2.

[0097] As shown in FIG. 4 , the second opening 233 is a through hole that penetrates the second metal layer 23 in a direction from the base substrate 21 to the second metal layer 23 .

[0098] In this embodiment, a second opening 233 is provided in the area where the second bendable area BA2 overlaps with the first routing area SL1 and the second routing area SL2, so that the overlapping area forms a single-layer copper structure, ensuring that the second bendable area BA2 has good flexibility and bendability, thereby avoiding problems such as black screen light leakage that may be caused by bending, and ensuring normal display in the bent state.

[0099] In some embodiments, as shown in FIG. 2 , the width of the bending pattern 231 in the first direction f1 is greater than the width of the second opening 233 in the first direction f1 , and the width of the bending pattern 231 in the first direction f1 is equal to the width of the first opening 232 in the first direction f1 .

[0100] By providing the second opening 233 in the second bendable area BA2 , a single-layer copper structure is formed in the second opening 233 region. The width of the second opening 233 in the first direction f1 is relatively small, thereby reducing the impact on signal transmission.

[0101] In some embodiments, as shown in FIG3 or FIG5 , the first wiring area SL1 includes: a first pin PIN1 disposed near a first side of the first wiring area SL1 for bonding to a display panel; and a second pin PIN2 disposed near a second side of the first wiring area SL1 for bonding to a printed circuit board. The first side and the second side are two opposing sides of the first wiring area SL1 in a first direction f1.

[0102] Exemplarily, as shown in FIG. 3 or FIG. 5 , the first side is the upper edge of the first wiring area SL1 , and the second side is the lower edge of the first wiring area SL1 .

[0103] Exemplarily, as shown in FIG. 3 or FIG. 5 , a plurality of first pins PIN1 are arranged along the second direction f2 , and a plurality of second pins PIN2 are arranged along the second direction f2 .

[0104] In some embodiments, as shown in FIG3 , the bending pattern 231 is located on a side of the second bendable area BA2 away from the first pin PIN1. Specifically, the bending pattern 231 is located between the second bendable area BA2 and the second pin PIN2. This increases the distance between the bending pattern 231 and the display panel, thus avoiding the black screen light leakage problem that may be caused by providing a double layer of copper in the bendable area close to the display panel.

[0105] In some embodiments, the bending pattern 231 is a grid pattern, which can improve the flexibility and bendability of the first bendable area BA1 and avoid display abnormalities caused by bending.

[0106] It should be noted that the bending pattern 231 may also be a solid pattern, so as to reduce the impedance of the second metal layer 23 .

[0107] In some embodiments, as shown in Figure 3, the flexible circuit board further includes a flat area PA located on at least one side of the bendable area BA. The flat area PA may be, for example, another area of ​​the flexible circuit board except the bendable area BA.

[0108] Exemplarily, as shown in Figure 3, the flat area PA may include: a first binding area PA1, located on the side of the second bendable area BA2 away from the first bendable area BA1; a second flat area PA2, located between the second bendable area BA2 and the first bendable area BA1; a third flat area PA3, located on the side of the first bendable area BA1 away from the second bendable area BA2; and a second binding area PA4, located on the side of the third flat area PA3 away from the second bendable area BA2.

[0109] In some embodiments, as shown in FIG3 , the second metal layer 23 further includes a flat pattern 234 located in the flat area PA. The flat pattern 234 and the bending pattern 231 are interconnected integral structures. The flat pattern 234 is connected to the ground line in the first metal layer 22 through the second via HL2 .

[0110] The ground line connected to the planar pattern 234 may be located in the first wiring area SL1 or in the second wiring area SL2 .

[0111] For example, in the orthographic projection on the base substrate 21 , the planar pattern 234 may be completely distributed within the planar area PA, or may be arranged in a partial area within the planar area PA (as shown in FIG. 3 ), which is not limited in the present disclosure.

[0112] For example, as shown in FIG. 3 , in the orthographic projection on the base substrate 21 , the planar pattern 234 has no overlap with the first binding area PA1 and the second binding area PA4 , and is completely distributed in the second planar area PA2 and the third planar area PA3 .

[0113] Exemplarily, the flat pattern 234 and the bending pattern 231 have the same structure, both being a grid structure or a solid structure.

[0114] For example, as shown in FIG. 3 , the same ground line may be connected to the planar pattern 234 through a plurality of second via holes HL2 .

[0115] During actual use, display panels generate static electricity, causing unstable display signals, sometimes intermittently, affecting the display quality and resulting in image anomalies, poor vertical lines, crosstalk, shutdowns, and breakdown. Furthermore, static electricity discharge cannot be detected in advance and is only discovered by the user during use. Therefore, static electricity protection is a key aspect of display product design.

[0116] In order to achieve electrostatic protection, in some embodiments, as shown in Figure 3 or Figure 6, the flat pattern 234 includes: a first conductive pattern 61, which is used to be connected to the ground potential; and in the orthographic projection on the base substrate 21, the first conductive pattern 61 is located within the range of the second routing area SL2 and has no overlap with the second via HL2.

[0117] Exemplarily, as shown in FIG3 , in the orthographic projection on the base substrate 21 , the first conductive pattern 61 does not overlap with the bendable area BA, the first routing area SL1 , the first binding area PA1 , and the second binding area PA4 .

[0118] Exemplarily, as shown in FIG3 , the first conductive pattern 61 is located on a side of the multiple bendable areas BA close to the second pin PIN2 , that is, the first conductive pattern 61 is located between the multiple bendable areas BA and the second pin PIN2 .

[0119] Exemplarily, the first conductive pattern 61 is an exposed area within the flat pattern 234, connected to the backplane of the display module via conductive tape for grounding. This conducts away static electricity generated by the display panel, preventing potential adverse effects from static electricity, improving display stability, and enhancing the display quality. Furthermore, it allows for rapid recirculation of noise signals, preventing noise leakage and interference, and improving electrostatic shielding.

[0120] Exemplarily, as shown in FIG. 3 or FIG. 6 , the first conductive pattern 61 may be a rectangle with a size of 8 mm*3 mm.

[0121] In some embodiments, as shown in FIG. 3 or FIG. 6 , the second metal layer 23 includes a plurality of first conductive patterns 61 . The plurality of first conductive patterns 61 are located on both sides of the first wiring region SL1 , and the plurality of first conductive patterns 61 are arranged along the second direction f2 .

[0122] By providing a plurality of first conductive patterns 61 connected to the ground potential, static electricity in different areas can be conducted away, thereby preventing abnormal display and other defects caused by local static electricity accumulation.

[0123] Exemplarily, the base substrate 21 is a polyimide film with a thickness of, for example, 25 microns.

[0124] Exemplarily, the materials of the first metal layer 22 and the second metal layer 23 are both copper foils, and the thickness is, for example, 1 / 3 OZ.

[0125] For example, as shown in FIG4 , the flexible circuit board may further include a first adhesive layer 24 and a first protective film 25 stacked on a side of the first metal layer 22 facing away from the base substrate 21, with the first adhesive layer 24 located between the first metal layer 22 and the first protective film 25. The flexible circuit board may further include a gold-plated layer 28 covering the first pin PIN1 and the second pin PIN2.

[0126] For example, as shown in FIG4 , the flexible circuit board may further include: a second adhesive layer 26 and a second protective film 27 stacked sequentially on the side of the second metal layer 23 facing away from the base substrate 21, with the second adhesive layer 26 located between the second metal layer 23 and the second protective film 27. The second adhesive layer 26 and the second protective film 27 may be removed at the bendable area BA.

[0127] Exemplarily, the thickness of the first adhesive layer 24 and the second adhesive layer 26 is 15 micrometers.

[0128] Exemplarily, the first protection film 25 and the second protection film 27 are, for example, 12.5 micron polyimide films.

[0129] For example, the width W1 of the first wiring area SL1 in the second direction f2 can be calculated using the following formula: W1=W0*X=(10*M+5*N+6*O+10*P)*X.

[0130] As shown in Figure 7, M is the line width of the first signal line 52, for example, 0.06mm to 0.09mm. N is the distance between two adjacent first signal lines 52, for example, 0.09mm. O is the line width of the ground line 51, for example, 0.3mm to 0.35mm. P is the distance between adjacent first signal lines 52 and ground lines 51, for example, 0.06mm to 0.075mm. W0 is the width of a routing unit in the second direction f2, and X is the number of routing units included in the first routing area SL1. Figure 7 shows a routing unit. The first routing area SL1 may include one routing unit, or it may include multiple (such as two) routing units arranged along the second direction f2. This disclosure is not limited to this.

[0131] Exemplarily, the width W0 of the routing unit in the second direction f2 may be, for example, 4 mm.

[0132] 7 , there are five groups of first signal lines 52 and six ground lines 51. For example, a first routing area SL1 including two routing units may include ten groups of first signal lines 52 and eleven ground lines 51, each group including two first signal lines 52.

[0133] The present disclosure provides a display module, as shown in FIG8 , which includes: a display panel 81 , and a flexible circuit board 83 as provided in any embodiment, wherein the first metal layer 22 in the flexible circuit board 83 is bound and connected to the display panel 81 .

[0134] Those skilled in the art will appreciate that the display module provided by the present disclosure has the advantages of the flexible circuit board 83 described above.

[0135] In some embodiments, as shown in FIG. 8 , the display module further includes a printed circuit board 82 , which is bound and connected to the first metal layer 22 in the flexible circuit board 83 .

[0136] Exemplarily, the display panel 81 is bonded and connected to the first metal layer 22 located in the first bonding area PA1 , and the first metal layer 22 located in the first bonding area PA1 includes a first pin PIN1 .

[0137] Exemplarily, the printed circuit board 82 is bonded to the first metal layer 22 located in the second bonding area PA4 , and the first metal layer 22 located in the second bonding area PA4 includes a second pin PIN2 .

[0138] FIG. 8 shows the display module in an unbent state, and FIG. 9 shows the display module in a bent state.

[0139] In some embodiments, as shown in FIG9 , the plurality of bendable areas BA further include a second bendable area BA2 , and the first bendable area BA1 and the second bendable area BA2 are both in a bent state, so that the printed circuit board 82 is located on the side of the display panel 81 away from the light emitting surface.

[0140] In some embodiments, as shown in FIG. 9 , a bending radius R1 of the first bendable area BA1 is greater than or equal to a bending radius R2 of the second bendable area BA2 .

[0141] In some embodiments, the bending radius R1 of the bending pattern 231 is greater than or equal to the bending radius R2 of the second bendable area BA2 .

[0142] In some embodiments, as shown in FIG. 9 , the display module may further include a back plate 84 . When the first bendable area BA1 and the second bendable area BA2 are in a bent state, the back plate 84 is located between the display panel 81 and the printed circuit board 82 .

[0143] In some embodiments, as shown in Figure 6 , the second metal layer 23 further includes a first conductive pattern 61 for connecting to ground potential. As shown in Figure 9 , the display module further includes a first conductive tape 85 located on the side of the flexible circuit board 83 adjacent to the second metal layer 23, with the tape facing the second metal layer 23. The provision of the first conductive tape 85 provides electromagnetic shielding for the flexible circuit board 83.

[0144] In this embodiment, as shown in Figure 10, the display module also includes: an insulating film 86, which is adhered to the adhesive surface of the first conductive tape 85, and the insulating film 86 includes an insulating pattern 861 and a third opening 862. In the orthographic projection on the base substrate 21, the insulating pattern 861 covers at least the first opening 232 and the second opening 233, and the third opening 862 covers the first conductive pattern 61.

[0145] There is no adhesive on the surface of the insulating film 86 that is away from the first conductive tape 85. The third opening 862 is a through hole that penetrates the insulating film 86 in the thickness direction of the insulating film 86.

[0146] By setting the insulating pattern 861 to cover at least the first opening 232 and the second opening 233, the first conductive tape 85 can be prevented from adhering to the flexible circuit board 83 in the single-layer copper area (i.e., the area corresponding to the first opening 232 and the second opening 233), thereby reducing the risk of the flexible circuit board 83 being torn during rework.

[0147] By providing the third opening 862 , the adhesive surface of the first conductive tape 85 and the first conductive pattern 61 are bonded together, and the first conductive pattern 61 can be connected to the ground potential through the first conductive tape 85 .

[0148] Exemplarily, as shown in FIG10 , the orthographic projection edge of the third opening 862 on the base substrate 21 is expanded relative to the orthographic projection edge of the first conductive pattern 61 on the base substrate 21 , and the expansion dimension is greater than or equal to 2 mm.

[0149] In some embodiments, as shown in FIG. 8 , the display panel 81 includes a first frame BZ, and the first metal layer 22 is connected to pins located in the first frame BZ.

[0150] In some embodiments, as shown in FIG10 , the display module further includes: a second conductive tape 101 , located on one side of the first frame BZ, with the adhesive surface facing the first frame BZ; and a third conductive tape 102 , located on a side of the printed circuit board 82 close to the components, with the adhesive surface facing the components.

[0151] Exemplarily, the edge of the second conductive tape 101 close to the display area of ​​the display panel 81 may be flush with the edge of the polarizer.

[0152] The third conductive tape 102 is used to simultaneously connect the printed circuit board 82 and the back plate 84 to achieve grounding of the printed circuit board 82. The third conductive tape 102 is also used to provide electromagnetic shielding for components on the printed circuit board 82.

[0153] In some embodiments, as shown in Figure 10, the first conductive tape 85, the second conductive tape 101 and the third conductive tape 102 are an integrated structure, and the insulating film 86 extends to the adhesive surface of the third conductive tape 102, and the orthographic projection of the insulating film 86 on the base substrate 21 covers the orthographic projection of the components on the base substrate 21.

[0154] By designing the first conductive tape 85, the second conductive tape 101, and the third conductive tape 102 as an integrated conductive tape, the process steps can be simplified and production efficiency can be improved. Furthermore, the integrated conductive tape can improve the efficiency of static discharge. Furthermore, by providing an insulating film 86 covering the components on the printed circuit board 82, the electronic components can be prevented from burning out.

[0155] For example, as shown in Figure 10, the integrated conductive tape can cover one or more flexible circuit boards at the same time. The integrated conductive tape is, for example, a black light-shielding tape.

[0156] Exemplarily, the pins within the first frame BZ are panel pins, the panel pin width is 0.12 mm, the panel pin spacing is 0.06 mm, the panel pin period is 0.18 mm, and the panel pin length is 0.7 mm.

[0157] For example, as shown in FIG11 , the width of the first pin PIN1 (as shown in FIG11 ) is 0.09 mm, the pitch of the first pin PIN1 is 0.09 mm, the period of the first pin PIN1 (as shown in FIG11 ) is 0.18 mm, and the length of the first pin PIN1 is 1 mm. To prevent insufficient contact caused by misalignment, along the length direction of the first pin PIN1, the first pin PIN1 generally extends beyond the panel pin by at least 0.1 mm, and the first pin PIN1 extends beyond the edge of the display panel 81 by at least 0.2 mm.

[0158] In addition, when manufacturing the first pin PIN1, the width of the first pin PIN1 can be pre-shrunk by 0.8 ten-thousandths relative to the panel pin width. In this way, during the binding process, heating can cause the first pin PIN1 to expand, and ultimately make the width of the first pin PIN1 roughly equal to the panel pin width.

[0159] To reduce the risk of display non-uniformity, the distance between the bending start area of ​​the flexible circuit board 83 and the edge of the display panel 81 is greater than or equal to 1.6 mm.

[0160] Exemplarily, as shown in Figure 9 or Figure 12, the distance X between the first bendable area BA1 and the first edge of the flexible circuit board 83 (the upper edge shown in Figure 12, that is, the edge close to the display panel 81) is: X = A + B + C, where A is the size of the area of ​​the flexible circuit board 83 covering the display panel 81 in the first direction f1, B is the coating width of the UV glue in the first direction f1, for example, less than or equal to 1.0 mm, and C is, for example, 0.3 mm.

[0161] For example, as shown in Figures 9 or 12 , the width L1 of the second bendable area BA2 in the first direction f1 is: L1 = 2R2 + 1 mm, where R2 is the bending radius of the second bendable area BA2. To reduce the bending stress in the second bendable area BA2 and shorten the length of the flexible circuit board 83 in the first direction f1, the plastic frame of the display panel 81 can be chamfered near the second bendable area BA2. R2 can be, for example, 1 mm.

[0162] Exemplarily, as shown in Figure 9 or Figure 12, the distance Y between the first bendable area BA1 and the first edge is: Y = A + B + C + D + H - 1.5mm, where D is the distance between the light-emitting surface of the display panel 81 and the surface of the back panel 84 facing away from the display panel 81, and H is the thickness of the printed circuit board 82, for example, 0.8mm.

[0163] Exemplarily, as shown in FIG. 9 or FIG. 12 , the width L2 of the first bendable area BA1 in the first direction f1 is: L2 = 2R1 + 2×1.5 mm, where R1 is the bending radius of the first bendable area BA1 .

[0164] The present disclosure provides a display device, comprising: a display module as provided in any embodiment; and a driving component connected to the display module and configured to drive the display module to perform display.

[0165] Those skilled in the art will appreciate that the display device provided by the present disclosure has the advantages of the above-mentioned display module.

[0166] The display device provided by the present disclosure can be: a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a car display device, a vehicle, a smart watch, a fitness wristband, a personal digital assistant, or any other product or component with a display function.

[0167] In the present disclosure, “a plurality of” means two or more, and “at least one” means one or more, unless otherwise clearly defined.

[0168] In the present disclosure, the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it should not be understood as a limitation on the present disclosure.

[0169] As used herein, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, product, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, commodity, or apparatus that includes the element.

[0170] References herein to "one embodiment," "some embodiments," "exemplary embodiments," "one or more embodiments," "an example," "an example," "some examples," and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of the present disclosure. Schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any one or more embodiments or examples in any suitable manner.

[0171] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any actual relationship or order between these entities or operations.

[0172] When describing some embodiments, the expressions "coupled" and "connected" may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0173] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0174] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0175] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0176] The use of "for" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0177] The use of "based on" or "according to" in this document is intended to be open and inclusive. A process, step, calculation, or other action based on one or more stated conditions or values ​​may, in practice, be based on other conditions or values ​​beyond the stated values. A process, step, calculation, or other action based on one or more stated conditions or values ​​may, in practice, be based on other conditions or values ​​beyond the stated values.

[0178] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0179] As used herein, "parallel", "perpendicular", "equal", and "flush" include the situations described and situations similar to the situations described, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, the difference between the two being equal is less than or equal to 5% of either one. "Flush" includes absolute equality and approximate flushness, wherein the acceptable deviation range of approximate flushness can be, for example, the distance between the two being flush is less than or equal to 5% of either one's size.

[0180] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0181] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0182] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. A flexible circuit board, comprising a plurality of bendable regions arranged along a first direction and separated from each other, wherein the bending axes of the bendable regions extend along a second direction, wherein the plurality of bendable regions include a first bendable region, and wherein the flexible circuit board comprises: substrate substrate; A first metal layer, located on one side of the substrate, includes a first routing area and a second routing area extending along a first direction and arranged along a second direction; as well as A second metal layer, located on a side of the base substrate away from the first metal layer, comprising a bending pattern and a first opening located in a first bendable area; and In an orthographic projection on the base substrate, the bending pattern overlaps with the first wiring area, and the first opening overlaps with the second wiring area.

2. The flexible circuit board according to claim 1, wherein: In the orthographic projection on the base substrate, the region where the first bendable region and the first routing region overlap with each other is located within the range of the bending pattern.

3. The flexible circuit board according to claim 1 or 2, wherein: The first routing area includes: A plurality of grounding lines are separated from each other and extend along a first direction, wherein the grounding lines are connected to the bending pattern through a first via hole.

4. The flexible circuit board according to claim 3, wherein: The first routing area also includes: A plurality of first signal lines are separated from each other and extend along a first direction, wherein the first signal line is located between two adjacent ground lines, and at least one first signal line is disposed between two adjacent ground lines.

5. The flexible circuit board according to claim 4, wherein: The first signal line includes a low voltage differential signal line.

6. The flexible circuit board according to any one of claims 1 to 5, wherein: The second metal layer includes two first openings, and the two first openings are located on different sides of the bending pattern.

7. The flexible circuit board according to claim 6, wherein: The two first openings and the bending pattern are arranged along a second direction, and the two first openings have different sizes in the second direction.

8. The flexible circuit board according to any one of claims 1 to 7, wherein: The plurality of bendable regions further include a second bendable region, and the second metal layer further includes: The second opening located in the second bendable area overlaps with both the first wiring area and the second wiring area in an orthographic projection on the base substrate.

9. The flexible circuit board according to claim 8, wherein: The width of the bending pattern in the first direction is greater than the width of the second opening in the first direction, and the width of the bending pattern in the first direction is equal to the width of the first opening in the first direction.

10. The flexible circuit board according to claim 8 or 9, wherein: The first routing area includes: A first pin, disposed near a first side edge of the first wiring area, and used for binding a display panel; and A second pin is disposed near a second side edge of the first wiring area and is used for binding a printed circuit board; The first side edge and the second side edge are two opposite side edges of the first routing area in a first direction, and the bending pattern is located on a side of the second bending area away from the first pin.

11. The flexible circuit board according to any one of claims 1 to 10, wherein: The flexible circuit board further comprises: a flat area located on at least one side of the bendable area; The second metal layer further includes: a flat pattern located in the flat area, the flat pattern and the bending pattern are an integrated structure interconnected, and the flat pattern is connected to the ground line in the first metal layer through a second via hole.

12. The flexible circuit board according to claim 11, wherein: The planar pattern includes: a first conductive pattern for connecting to a ground potential; and In an orthographic projection on the base substrate, the first conductive pattern is located within the range of the second routing area and has no overlap with the second via hole.

13. The flexible circuit board according to claim 12, wherein: The first metal layer further includes: a second pin for binding a printed circuit board; and The first conductive pattern is located on a side of the plurality of bendable areas close to the second pins.

14. The flexible circuit board according to claim 12 or 13, wherein: The second metal layer includes a plurality of the first conductive patterns, the plurality of the first conductive patterns are located on both sides of the first routing area, and the plurality of the first conductive patterns are arranged along a second direction.

15. The flexible circuit board according to any one of claims 1 to 14, wherein: The bending pattern is a grid pattern.

16. A display module, comprising: A display panel, and a flexible circuit board as claimed in any one of claims 1 to 15, wherein the first metal layer in the flexible circuit board is bound and connected to the display panel.

17. The display module according to claim 16, wherein: The display module further includes: a printed circuit board, which is bound and connected to the first metal layer in the flexible circuit board; The plurality of bendable areas further include a second bendable area, and the first bendable area and the second bendable area are both in a bent state, so that the printed circuit board is located on a side of the display panel away from the light emitting surface; Wherein, a bending radius of the bending pattern is greater than or equal to a bending radius of the second bendable area.

18. The display module according to claim 17, wherein: The second metal layer further includes: a first conductive pattern for connecting to a ground potential; The display module also includes: A first conductive tape, located on a side of the flexible circuit board close to the second metal layer, with the tape surface facing the second metal layer; and An insulating film is adhered to the adhesive surface of the first conductive tape, the insulating film comprising an insulating pattern and a third opening, in the orthographic projection on the base substrate, the insulating pattern at least covers the first opening and the second opening, and the third opening covers the first conductive pattern.

19. The display module according to claim 18, wherein: The display panel includes a first frame, and the first metal layer is connected to a pin located in the first frame; The display module also includes: A second conductive tape is located at one side of the first frame, with the tape surface facing the first frame; and A third conductive tape is located on a side of the printed circuit board close to the components, with the tape surface facing the components; The first conductive tape, the second conductive tape and the third conductive tape are an integrated structure, and the insulating film extends to the adhesive surface of the third conductive tape, and the orthographic projection of the insulating film on the base substrate covers the orthographic projection of the component on the base substrate.

20. A display device, comprising: The display module according to any one of claims 16 to 19; as well as The driving component is connected to the display module and is used to drive the display module to display.

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