Glass packaging diode batch tinning tool and tinning method thereof

Abstract

The invention relates to the technical field of tinning tools, in particular to a glass packaging diode batch tinning tool and a tinning method thereof.The tinning tool comprises a tool frame, a tinning device, a tinning device and a tinning device, and a row of first mounting grooves and a row of second mounting grooves are formed in the tool frame at intervals; the first mounting grooves and the second mounting grooves are in one-to-one correspondence; wherein the first mounting groove is used for binding a first pin of a diode, and the second mounting groove is used for binding a second pin of the diode; first connecting holes are formed in the two ends of the pressing plate, the pressing plate is connected with the tool frame through the first connecting holes, and the pressing plate is located between the first mounting groove and the second mounting groove and abuts against the first pin or the second pin of the diode so as to prevent the diode from moving. The tinning tool has the advantages that the diode does not need to leave the tinning tool, and tinning of the first pin and the second pin of the diode can be completed by moving the first pin and the second pin between the first mounting groove and the second mounting groove.

Description

Technical Field

[0001] The invention relates to the technical field of tinning tooling, and in particular to a batch tinning tooling for glass packaged diodes and a tinning method thereof. Background Art

[0002] In electronic assembly, components need to undergo a lot of pre-treatment work before installation, and tinning the diode pins is one of them. The purpose of tinning is to improve the solderability of the pins and reduce the risk of solder joints caused by physical defects such as surface oxidation and excess materials. Tinning is a metal surface treatment technology that forms a protective thin layer by coating a layer of lead-tin solder on the metal surface. This thin layer has good conductivity and solderability, and plays an important role in improving welding quality. Therefore, in high-reliability products, the lead soldering ends of electronic components need to be tinned.

[0003] There are two main ways to tin the pins of glass-encapsulated diodes: one is to use a soldering iron to tinn, and the other is to use a tin pot to tinn. Among them, tin pot tinn is currently a more common process method. However, the existing glass-encapsulated diode tinning method mainly relies on manual operation and single tinning, that is, using a clamping tool to clamp the pin at one end of the diode and immerse it vertically in the molten tin pot to complete the tinning, and the other end of the pin is tinned in the same way. This method has the following shortcomings: (1) Low tinning efficiency. In modern electronic products, the number of glass-encapsulated diodes used is usually dozens to hundreds. The efficiency of single tinning is low and it is difficult to meet the needs of large-scale production. (2) The tinning position is difficult to control. In order to reduce the thermal shock at the root of the glass-encapsulated diode, a 5mm non-tinning distance is required from the diode body. However, it is difficult to accurately control this distance by manually dipping into the tin pot. Summary of the invention

[0004] In view of this, the present invention aims to provide a glass-packaged diode batch tinning tooling and a tinning method thereof, which can achieve the purpose of batch tinning and precise control of the tinning position through the tinning tooling, greatly improve production efficiency and enhance tinning quality.

[0005] To achieve the above-mentioned purpose, the technical solution created by the present invention is implemented as follows: a glass-packaged diode batch tin-enameling tool, comprising: a tool frame, a row of first mounting grooves and a row of second mounting grooves are arranged at intervals on the tool frame; the first mounting grooves correspond to the second mounting grooves one by one; wherein the first mounting grooves are used to restrain the first pin of the diode, and the second mounting grooves are used to restrain the second pin of the diode; a pressure plate, first connecting holes are arranged at both ends of the pressure plate, the pressure plate is connected to the tool frame through the first connecting holes, the pressure plate is located between the first mounting groove and the second mounting groove, and abuts against the first pin or the second pin of the diode to prevent the diode from moving.

[0006] Furthermore, the tooling frame includes a rectangular frame, a boss and two connecting rods; the first mounting groove and the second mounting groove are respectively arranged on two opposite sides of the rectangular frame; the bosses are distributed at the four corners of the rectangular frame; each boss is provided with a penetrating second connecting hole, and the axis of the second connecting hole is parallel to the axis of the first mounting groove and the second mounting groove; Furthermore, the connecting end of the connecting rod has a limiting column, and the handheld end of each connecting rod passes through the second connecting hole of the two bosses located on the same side of the rectangular frame; wherein the limiting column of each connecting rod abuts against a corresponding boss, and the handheld end of the connecting rod passes through the other boss.

[0007] Furthermore, the diameter of the limiting column is larger than the diameter of the connecting rod and the diameter of the second connecting hole.

[0008] Furthermore, the two connecting rods pass through the first connecting holes at both ends of the pressing plate respectively.

[0009] Furthermore, the distance between the inner side surfaces of the first mounting groove and the second mounting groove on the rectangular frame is greater than or equal to three times the length of the diode body.

[0010] Furthermore, the first installation groove and the second installation groove have the same structure, both are waist drum-shaped, including a semicircular groove and flexible tooth columns extending outward from both ends of the semicircular groove opening; the opening size between the two flexible tooth columns is smaller than the opening size of the semicircular groove.

[0011] Furthermore, the width of the first mounting groove and the width of the second mounting groove are respectively equal to the width of the non-tin-plated area at the root of the first pin and the width of the non-tin-plated area at the root of the second pin of the diode.

[0012] Furthermore, an insulating thermal pad is provided on a side of the pressing plate facing the diode.

[0013] A method for mass tinning of glass-encapsulated diodes is implemented based on the above-mentioned glass-encapsulated diode mass tinning tooling, comprising the following steps: S1: Open the tin pot and set the temperature of the tin pot so that the temperature of the tinning inside the tin pot reaches the set value.

[0014] S2: Press the first pin and the second pin of the diode into the first mounting groove and the second mounting groove respectively.

[0015] S3: Place the side of the press plate with the insulating thermal pad attached to it on the second pin of the diode.

[0016] S4: Pass the connecting rods of the tooling frame through the bosses on the same short side of the tooling frame and the first connecting holes of the pressing plate in sequence.

[0017] S5: Holding the connecting rod, insert the first pin into the tin pot, tin the first pin, and then move the tooling out of the tin pot.

[0018] S6: Pull out the connecting rod and remove the pressure plate, move the diode body toward the second mounting groove, and make the second pin become the tin-plated end.

[0019] S7: Repeat steps S3-S5 to complete the tinning of the second pin. Compared with the prior art, the invention can achieve the following beneficial effects: 1) The tinning tool of the present invention can complete the tinning work of multiple diodes at one time. Through the tinning tool, the length of the non-tinning area at the root of the first pin and the root of the second pin can be accurately controlled.

[0020] 2) The diode does not need to leave the tinning tooling, and the tinning of the first pin and the second pin of the diode can be completed by moving the first pin and the second pin between the first mounting groove and the second mounting groove.

[0021] 3) The tinning tooling of the present invention has a simple structure design, convenient installation and strong applicability. The tinning tooling is reusable and supports single-person operation, which can greatly improve work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS The drawings constituting part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments and descriptions of the present invention are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings: Figure 1 2 is a schematic diagram of the structure of a batch tinning tool for glass-encapsulated diodes provided according to an embodiment of the present invention; Figure 2 is a schematic diagram of the structure of a tooling frame provided according to an embodiment of the present invention; Figure 3 According to an embodiment of the present invention, Figure 1 A partial enlarged view of the first mounting groove at position A in the middle; Figure 4 is a schematic structural diagram of a connecting rod provided according to an embodiment of the present invention; Figure 5 is a schematic structural diagram of a pressing plate provided according to an embodiment of the present invention; Figure 6 It is a schematic diagram of the structure that the first pin and the second pin of the diode provided in an embodiment of the present invention are tin-plated ends.

[0022] The reference numerals include: 1, tooling frame; 11, rectangular frame; 111, first mounting groove; 112, second mounting groove; 113, semicircular groove; 114, flexible tooth column; 12, boss; 13, connecting rod; 131, limiting column; 14, second connecting hole; 141, countersunk hole; 2, pressure plate; 21, first connecting hole; 3, diode; 31, first pin; 32, second pin; 33, diode body. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the invention more clear, the invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the invention and do not constitute a limitation of the invention.

[0024] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0026] In the description of the invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the invention can be understood according to specific circumstances.

[0027] The present invention will be described in detail below with reference to the embodiments.

[0028] like Figures 1 to 6 As shown, a glass encapsulated diode batch tinning tooling includes: a tooling frame 1 and a pressing plate 2. The diode 3 includes a diode body 33, a first pin 31 and a second pin 32. In this embodiment, the diode 3 is a glass encapsulated diode.

[0029] The tooling frame 1 comprises a rectangular frame 11, a boss 12 and two connecting rods 13. In this embodiment, the rectangular frame 11 is a long rectangular frame.

[0030] A row of first mounting grooves 111 is provided on one long side of the rectangular frame 11, and a row of second mounting grooves 112 is provided on the other long side of the rectangular frame 11. The first mounting groove 111 is used to bind the first pin 31 of the diode 3, and the second mounting groove 112 is used to bind the second pin 32 of the diode 3. The long side size of the rectangular frame 11 is smaller than the size of the tin pot. The distance Y1 between the inner side surfaces of the two long sides and the length Y2 of the diode body 33 satisfy Y1≥3Y2. The number of the first mounting grooves 111 and the second mounting grooves 112 in each row determines the number of diodes 3 that can be carried, and the present invention does not limit the number of the first mounting grooves 111 and the second mounting grooves 112.

[0031] The first mounting groove 111 corresponds to the second mounting groove 112 one by one and has the same structure. The first mounting groove 111 and the second mounting groove 112 are both waist drum-shaped, including a semicircular groove 113 and flexible tooth columns 114 extending outward from both ends of the opening of the semicircular groove 113. The diameter of the semicircular groove 113 is equal to the diameter of the first pin 31 and the diameter of the second pin 32 of the diode 3. The opening size between the two flexible tooth columns 114 is smaller than the diameter of the semicircular groove 113.

[0032] By applying a certain external force, the first pin 31 and the second pin 32 can be pressed into the first mounting groove 111 and the second mounting groove 112 respectively. The elastic design of the flexible tooth column 114 enables the first pin 31 and the second pin 32 to be firmly clamped and kept relatively stable, thereby ensuring that the first mounting groove 111 and the second mounting groove 112 have a certain binding effect on the first pin 31 and the second pin 32.

[0033] The width of the flexible tooth column 114 is equal to the width of the first mounting groove 111 and the width of the second mounting groove 112. At the same time, the width of the flexible tooth column 114 is equal to the width of the non-tin-plated area at the root of the first pin 31 and the width of the non-tin-plated area at the root of the second pin 32. During the tin-plating process, the width of the non-tin-plated area at the root of the first pin 31 and the width of the non-tin-plated area at the root of the second pin 32 can be controlled by the width of the flexible tooth column 114. In this embodiment, the width of the non-tin-plated area at the root of the first pin 31 and the width of the non-tin-plated area at the root of the second pin 32 are both 5mm, that is, the width of the flexible tooth column 114, the width of the first mounting groove 111 and the width of the second mounting groove 112 are 5mm.

[0034] The bosses 12 are distributed at the four corners of the rectangular frame 11. Each boss 12 is provided with a penetrating second connection hole 14, and the axis of the second connection hole 14 is parallel to the axis of the first mounting groove 111 and the second mounting groove 112. A countersunk hole 141 is provided at one end of the second connection hole 14 facing outward. In this embodiment, the boss 12 is a rectangular block.

[0035] A limiting column 131 is provided at the connecting end of the connecting rod 13, and the diameter of the limiting column 131 is adapted to the countersunk hole 141, and the connecting rod 13 is adapted to the second connecting hole 14. The handheld end of the connecting rod 13 sequentially passes through the second connecting holes 14 of the two bosses 12 located on the same short side of the rectangular frame 11. Among them, the limiting column 131 is located in the countersunk hole 141 of the corresponding boss 12, and abuts against the end surface of the countersunk hole 141, and the handheld end of the connecting rod 13 passes through the other boss 12. In this embodiment, the length of the handheld end of the connecting rod 13 passing through is at least 20 mm, so as to facilitate handholding during tinning.

[0036] In one embodiment, the second connection hole 14 is not provided with a countersunk hole 141 , and the end surface of the limiting column 131 directly contacts the boss 12 .

[0037] The pressing plate 2 is a rectangular plate, and its length is equal to that of the rectangular frame 11. First connecting holes 21 are provided at both ends of the pressing plate 2, and the pressing plate 2 is connected to the connecting rod 13 through the first connecting holes 21, so that the pressing plate 2 is located between the first mounting groove 111 and the second mounting groove 112, and abuts against the first pin 31 or the second pin 32 of the diode 3 to prevent the diode 3 from moving. Specifically, the size of the first connecting hole 21 is equal to that of the second connecting hole 14, and the connecting rod 13 and the first connecting hole 21 are clearance-matched, and the clearance is 0.05mm-0.1mm.

[0038] An insulating thermal pad is provided on one side of the pressing plate 2 that contacts the first pin 31 or the second pin 32, so as to ensure that there is appropriate contact stress between the pressing plate 2 and the diode 3, and to prevent the pressing plate 2 from causing physical damage to the first pin 31 or the second pin 32 of the diode 3. In this embodiment, the thickness of the insulating thermal pad is 0.2 mm.

[0039] Specifically, the width Y3 of the pressing plate 2 should satisfy Y1-Y2-Y3>0, that is, Y1-Y2>Y3. Due to the difference in length of different diode bodies 33, when tinning the first pin 31 or the second pin 32, it is necessary to ensure the installation space of the pressing plate 2. Therefore, the width Y3 of the pressing plate 2 needs to satisfy Y1-Y2>Y3.

[0040] In this embodiment, the rectangular frame 11, the boss 12, the two connecting rods 13 and the pressing plate 2 are all made of polyimide. The high temperature resistance of polyimide can reach 450°C, which is much higher than the liquidus temperature of 183°C of lead-tin solder. At the same time, the polyimide material does not stick to the lead-tin solder after contacting it, so the tinning tooling can be reused.

[0041] A method for mass tinning of glass-encapsulated diodes is implemented based on the above-mentioned glass-encapsulated diode mass tinning tooling, comprising the following steps: S1: Open the tin pot and set the temperature of the tin pot to 260℃±5℃, so that the temperature of the tinning inside the tin pot reaches the set value (260℃±5℃).

[0042] S2: Press the first pin 31 of the diode 3 into the first mounting groove 111 of the rectangular frame 11 , and press the second pin 32 into the second mounting groove 112 , so that the diode body 33 is close to one end of the first mounting groove 111 .

[0043] S3: Make the side of the pressing plate 2 with the insulating thermal pad contact the second pin 32 of the diode 3, make the edge of the pressing plate 2 close to the diode body 33, and ensure that the first connecting holes 21 at both ends of the pressing plate 2 are coaxial with the second connecting holes 14 of the boss 12.

[0044] S4: The handheld end of the connecting rod 13 is sequentially passed through a boss 12 located on the same short side of the rectangular frame 11, the first connecting hole 21 of the pressing plate 2, and then passed through another boss 12. The insertion direction is from the first installation groove 111 to the second installation groove 112. Figure 6 As shown in a.

[0045] S5: Holding the hand-held end of the connecting rod 13, inserting the first pin 31 vertically downward into the tin pot, tinning the first pin 31, the tinning time does not exceed 3s (preset time), and then moving the tooling out of the tin pot.

[0046] S6: Pull out the connecting rod 13 and remove the pressing plate 2, move the diode body 33 toward the second mounting groove 112, and make the second pin 32 become a tin-plated end. Figure 6 As shown in b.

[0047] S7: Repeat steps S3-S5 to complete the tinning of the second pin 32.

[0048] After the second pin 32 is tinned, the connecting rod 13 is pulled out and the pressing plate 2 is removed. A dust-free clean cloth is dipped in an appropriate amount of anhydrous ethanol to clean the tinned first pin 31 and the second pin 32 .

[0049] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A glass encapsulated diode batch tinning tool, characterized in that: include: A tooling frame, wherein a row of first mounting grooves and a row of second mounting grooves are arranged at intervals on the tooling frame; the first mounting grooves correspond to the second mounting grooves one by one; wherein the first mounting grooves are used to bind the first pins of the diodes, and the second mounting grooves are used to bind the second pins of the diodes; A pressure plate, wherein first connecting holes are provided at both ends of the pressure plate, the pressure plate is connected to the tooling frame through the first connecting holes, the pressure plate is located between the first mounting groove and the second mounting groove, and abuts against the first pin or the second pin of the diode to prevent the diode from moving.

2. The glass encapsulated diode batch tinning tooling according to claim 1 is characterized in that: The tooling frame comprises a rectangular frame, a boss and two connecting rods; The first mounting groove and the second mounting groove are respectively arranged on two opposite sides of the rectangular frame; The bosses are distributed at the four corners of the rectangular frame; each of the bosses is provided with a penetrating second connecting hole, and the axis of the second connecting hole is parallel to the axis of the first mounting groove and the second mounting groove.

3. The glass encapsulated diode batch tinning tooling according to claim 2 is characterized in that: The connecting end of the connecting rod has a limiting column, and the hand-held end of each connecting rod passes through the second connecting hole of the two bosses located on the same side of the rectangular frame; wherein the limiting column of each connecting rod abuts against a corresponding one of the bosses, and the hand-held end of the connecting rod passes through the other boss.

4. The glass encapsulated diode batch tinning tooling according to claim 3 is characterized in that: The diameter of the limiting column is larger than the diameter of the connecting rod and the diameter of the second connecting hole.

5. The glass encapsulated diode batch tinning tooling according to claim 2, characterized in that: The two connecting rods pass through the first connecting holes at both ends of the pressing plate respectively.

6. The glass encapsulated diode batch tinning tooling according to claim 2, characterized in that: The distance between the inner side surfaces of two sides of the rectangular frame where the first mounting groove and the second mounting groove are provided is greater than or equal to three times the length of the diode body.

7. The glass encapsulated diode batch tinning tooling according to claim 1, characterized in that: The first mounting groove and the second mounting groove have the same structure and are both drum-shaped, including a semicircular groove and flexible tooth columns extending outward from both ends of the semicircular groove opening; the opening size between the two flexible tooth columns is smaller than the opening size of the semicircular groove.

8. The glass encapsulated diode batch tinning tooling according to claim 1, characterized in that: The width of the flexible tooth column is equal to the width of the non-tin-plated area at the root of the first pin and the width of the non-tin-plated area at the root of the second pin of the diode.

9. The glass encapsulated diode batch tinning tooling according to claim 1, characterized in that: An insulating heat-conducting pad is arranged on a side of the pressing plate facing the diode.

10. A method for mass tinning of glass-encapsulated diodes, implemented based on the glass-encapsulated diode mass tinning tooling according to any one of claims 1 to 9, characterized in that: The steps include: S1: Open the tin pot and set the temperature of the tin pot so that the temperature of the tinning in the tin pot reaches the set value; S2: Pressing the first pin and the second pin of the diode into the first mounting groove and the second mounting groove respectively; S3: placing the side of the pressing plate with the insulating thermal pad attached thereto on the second pin of the diode; S4: passing the connecting rod of the tooling frame through the bosses and the pressing plate on the same short side of the tooling frame in sequence; S5: holding the connecting rod, inserting the first pin into the tin pot, tinning the first pin, and then removing the tooling from the tin pot; S6: Pull out the connecting rod and remove the pressing plate, move the diode body toward the second mounting groove, and make the second pin become a tin-plated end; S7: Repeat steps S3-S5 to complete the tinning of the second pin.

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