Thimble positioning method in laser processing process, electronic equipment and storage medium

Abstract

The invention provides an ejector pin positioning method in the laser machining process, electronic equipment and a storage medium, and belongs to the technical field of laser beam machining. The method comprises the steps that when it is detected that a to-be-machined plate is placed into a machine tool, a shot image and a machining drawing of the to-be-machined plate are obtained, the shot image comprises visual information of the to-be-machined plate, and the machining drawing comprises machining pattern information of the to-be-machined plate; based on the visual information of the to-be-processed plate and the processing pattern information of the to-be-processed plate, determining the rotation offset of the to-be-processed plate and the preset point location of an ejector pin; based on the rotation offset and a thimble preset point position, determining a thimble mounting point position of the to-be-processed plate relative to the machine tool; and controlling a movable laser head of the machine tool to move according to the thimble mounting point position so as to guide positioning and mounting of the thimble. The method can effectively improve the efficiency and accuracy of thimble point location determination.

Description

Technical Field

[0001] The present application relates to the technical field of laser beam processing, and in particular to a method for positioning a pin during laser processing, an electronic device and a storage medium. Background Art

[0002] In modern industrial manufacturing, laser processing of metal substrates is a complex and precise task. In order to meet the high-precision process requirements, a large gas pressure is usually required during the processing to ensure the processing quality. However, this high-pressure environment will cause the lance (i.e., the component on the machine tool used to support or fix the metal substrate) under the metal substrate to contact the surface of the metal substrate, resulting in scratches or even product scrapping. To solve this problem, it is usually necessary to place a pin at a specific position of the metal substrate before processing to prevent the lance from directly contacting and scratching the material surface.

[0003] However, the existing ejector placement relies on the worker's visual judgment and manual placement, and because the metal substrate may be slightly deflected at an angle when placed on the processing platform of the machine tool by the worker, it cannot completely match the machine tool coordinate system. Even if the worker places the ejector according to the predetermined ejector point, the actual position may deviate, thereby increasing the risk of product scrapping.

[0004] Therefore, during the laser processing, there is currently a technical problem of low precision in the positioning and installation of the ejector pin. Summary of the invention

[0005] The purpose of the present application is to provide a method for positioning a pin during laser processing, an electronic device and a storage medium to solve the above-mentioned problems.

[0006] To achieve the above objectives, in a first aspect, the present application proposes a method for positioning an ejector pin during laser processing, the method comprising: When it is detected that a plate to be processed is placed in a machine tool, a photographed image and a processing drawing of the plate to be processed are obtained, wherein the photographed image includes visual information of the plate to be processed, and the processing drawing includes processing pattern information of the plate to be processed; Based on the visual information of the plate to be processed and the processing pattern information of the plate to be processed, determining the rotation offset of the plate to be processed and the preset position of the ejector pin; Based on the rotation offset and the preset position of the ejector, determining the installation position of the ejector of the plate to be processed relative to the machine tool; The movable laser head of the machine tool is controlled to move according to the ejector installation point to guide the positioning installation of the ejector.

[0007] In some embodiments, determining the rotation offset of the plate to be processed and the preset position of the ejector pin based on the visual information of the plate to be processed and the processing pattern information of the plate to be processed includes: Based on the visual information of the plate to be processed, first position information of an actual marking point of the plate to be processed compared to an actual coordinate system is acquired; Based on the processing pattern information of the plate to be processed, obtaining second position information of a theoretical marking point of the plate to be processed compared to a machine tool coordinate system; Based on the first position information and the second position information, calculating a position offset matrix from the theoretical marking point to the actual marking point; Based on the position offset matrix, the rotation offset of the plate to be processed in the machine tool coordinate system is determined.

[0008] In some embodiments, before obtaining the first position information of the actual marking point of the plate to be processed compared to the actual coordinate system, the method further includes: Calibrate the camera of the machine tool to determine the center distance between the movable laser head and the camera, and the ratio of each pixel point in the captured image to the actual physical unit; Based on the center distance and the ratio, the pixel coordinates of each pixel point in the captured image are mapped to an actual coordinate system.

[0009] In some embodiments, after obtaining the first position information of the actual marking point of the plate to be processed compared to the actual coordinate system based on the visual information of the plate to be processed, the method further includes: Controlling a movable laser head of the machine tool to move according to the first position information to collect real-time image information of the actual marking point; Based on the real-time image information, frame a boundary area including the actual marking point; The boundary area is saved as a positioning template.

[0010] In some implementations, before saving the boundary area as a positioning template, the method further includes: Selecting a number of data points from the boundary area as test points; Perform feature comparison between the test point and the actual marking point; When the comparison result does not meet the preset comparison standard, the boundary area is adjusted.

[0011] In some embodiments, determining the rotation offset of the plate to be processed and the preset position of the ejector pin based on the visual information of the plate to be processed and the processing pattern information of the plate to be processed includes: Determining a non-pattern area based on the processing pattern information of the plate to be processed; Determining a preset ejector area based on the distribution characteristics of the non-pattern area; Acquiring the size information and / or weight information of the plate to be processed, and determining the preset number of ejector pins based on the size information and / or weight information; Based on the preset ejector pin area and the preset ejector pin quantity, the preset ejector pin positions are determined.

[0012] In some implementations, the captured image further includes the shank distribution information of the machine tool, and the determining of the ejector preset point based on the ejector preset area and the ejector preset number includes: Extracting the contour coordinates of the sword ridge based on the sword ridge distribution information; Performing a difference operation based on the contour coordinates of the sword and the preset ejector area to determine the ejector planning area; Based on the ejector planning area and the ejector preset number, the ejector preset point positions are determined.

[0013] In some embodiments, determining the ejector installation point of the plate to be processed relative to the machine tool based on the rotation offset and the preset ejector point includes: Based on the rotation offset, a rotation compensation amount and a displacement compensation amount of the preset ejector point are calculated; Based on the rotation compensation amount and the displacement compensation amount, the ejector installation point position corresponding to the ejector preset point position in the machine tool coordinate system is determined.

[0014] In a second aspect, the present application provides an electronic device, comprising: one or more processors; A memory is used to store one or more programs, wherein when the one or more programs are executed by the one or more processors, the one or more processors execute the ejector positioning method in the laser processing process as described above.

[0015] In a third aspect, the present application proposes a storage medium storing executable instructions, which, when executed by a processor, causes the processor to execute the ejector positioning method in the laser processing process as described above.

[0016] Compared with the prior art, the beneficial effects of this application include: Firstly, by acquiring the photographed image and processing drawing of the plate to be processed when it is detected that the plate to be processed is placed in the machine tool, the problem of ejector positioning deviation caused by incomplete information or deviation in the plate placement can be effectively reduced.

[0017] Secondly, based on the visual information of the plate to be processed and the processing pattern information obtained, the rotation offset of the plate to be processed and the preset ejector point are determined. Compared with the traditional method of relying on manual marking of ejector points and placing ejectors by manual visual judgment, this application can accurately calculate the rotation offset of the plate relative to the machine tool coordinate system and automatically determine the preset ejector point according to the processing drawing. This improvement eliminates the uncertainty caused by human factors, and there is no need to manually mark the ejector point, which can effectively improve the efficiency and accuracy of ejector point determination.

[0018] On the third aspect, the ejector installation point of the plate to be processed relative to the machine tool is determined by the calculated rotational offset and the preset ejector point. This means that even if the plate is angularly deflected during the placement process, the present application can accurately install the ejector at the ejector installation point by calculating compensation. This real-time adjustment and compensation mechanism can ensure that the ejector is always in the accurate installation position, avoid direct contact between the ejector and the surface of the plate to be processed, and thus prevent the occurrence of scratches. On the fourth aspect, by controlling the movable laser head of the machine tool to move according to the ejector installation point to guide the positioning and installation of the ejector, the accuracy and reliability of the ejector positioning can be ensured, reducing the risk of product scrapping. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope of the present application.

[0020] Figure 1 A schematic diagram of a flow chart of a method for positioning an ejector pin during laser processing in one embodiment; Figure 2 A schematic diagram of processing pattern information of a processing drawing during laser processing in one embodiment; Figure 3 A partial flow diagram of a method for positioning an ejector pin during laser processing in one embodiment; Figure 4 A detailed schematic diagram of a method for positioning an ejector pin during laser processing in one embodiment; Figure 5 is a schematic flow chart of a method for positioning an ejector pin during laser processing in another embodiment; Figure 6 It is a schematic flow chart of a method for positioning an ejector pin during laser processing in another embodiment; Figure 7 It is a structural schematic diagram of an electronic device involved in the method for positioning a pin during laser processing in an embodiment of the present application. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0022] All terms (including technical and scientific terms) used in this application have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used here should be interpreted as having a meaning consistent with the context of this specification, and should not be interpreted in an idealized or overly rigid manner.

[0023] For example, the terms "first", "second", etc. used in this application may be used in this article to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, the first position information may be referred to as the second position information, and similarly, the second position information may be referred to as the first position information. Both the first position information and the second position information are position information, but they are not the same position information.

[0024] For another example, the terms “include”, “comprising”, etc. used in this application indicate the existence of features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0025] As mentioned above, the existing ejector placement relies on the visual judgment and manual placement of workers, and because the metal substrate may be slightly deflected when placed on the processing platform of the machine tool by the worker, it cannot completely match the machine tool coordinate system. This means that even if the worker places the ejector according to the predetermined ejector point, the actual position may deviate, thereby increasing the risk of product scrapping. Therefore, in the laser processing process, there is currently a technical problem of low precision in ejector positioning and installation. To this end, the present application proposes an ejector positioning method, electronic equipment and storage medium in the laser processing process, which can effectively improve the efficiency and accuracy of ejector point determination.

[0026] like Figure 1 As shown, a method for positioning an ejector pin in a laser processing process proposed in an embodiment of the present application includes the following steps: Step S10, when it is detected that a plate to be processed is placed in a machine tool, a photographed image and a processing drawing of the plate to be processed are obtained, wherein the photographed image includes visual information of the plate to be processed, and the processing drawing includes processing pattern information of the plate to be processed.

[0027] In this embodiment, the plate to be processed refers to a metal or non-metal material plate that needs to undergo various laser processing operations (such as laser cutting, laser marking, laser engraving, etc.) during the industrial manufacturing process. The machine tool is a mechanical device used to perform laser processing on the plate to be processed. The machine tool realizes the laser processing operation of the plate to be processed through the relative movement between the movable laser head and the plate to be processed, so as to achieve the size and shape required by the processing drawing. The captured image is an image obtained by photographing the plate to be processed placed in the machine tool using an image acquisition device (such as a camera). The visual information included therein refers to the physical feature information about the surface of the plate to be processed, such as shape, texture, color, etc. The processing drawing is a technical document used to guide mechanical processing and manufacturing. It may describe in detail one or more information such as the size, shape, material requirements, surface treatment, tolerance range, and processing technology of the parts or products to be processed. The processing drawing information refers to the drawing information about the processing of the plate to be processed contained in the processing drawing, which may include one or more information such as the processing drawing, processing path, theoretical marking points, and ejector point positions.

[0028] As a feasible implementation method for detecting that the plate to be processed is placed in the machine tool, the control system of the machine tool is connected to an operation interface, and a trigger instruction that the plate to be processed has been placed in the machine tool is received based on the operation interface. The trigger instruction can be a button or a sliding bar on the operation interface, and the worker confirms the placement status of the plate to be processed and triggers the instruction.

[0029] As another feasible implementation method for detecting that the plate to be processed is placed in the machine tool, the placement status of the plate to be processed is detected by at least one sensor. For example, a photoelectric sensor is used to detect whether a plate to be processed is placed in the machine tool by emitting and receiving light. When the plate to be processed is placed in the machine tool, the changes in the light blocking or reflected light will be captured by the photoelectric sensor. For another example, a pressure sensor is used to detect the change in the pressure applied to the machine tool by the plate to be processed. When the pressure increases to a stable value, it is determined that the plate to be processed has been placed in the machine tool.

[0030] Step S20, based on the visual information of the plate to be processed and the processing pattern information of the plate to be processed, determining the rotation offset of the plate to be processed and the preset position of the ejector pin.

[0031] In this embodiment, the rotation offset refers to the offset information between the actual position and the standard position of the plate to be processed when it is placed on the machine tool in the machine tool coordinate system. The rotation offset includes one or more information such as the rotation angle and translation distance in the machine tool coordinate system. The ejector preset point refers to the ejector placement position pre-set on the processing drawing according to the processing pattern information. Among them, the ejector preset point can be marked in advance on the processing drawing by the operator, or it can be automatically preset on the processing drawing by the control system of the machine tool according to the processing pattern information. Figure 2 The five-pointed star mark pointed by the middle arrow is the preset point of the ejector.

[0032] In some embodiments, Figure 3 As shown, the step S20 includes: Step A10: Based on the visual information of the plate to be processed, first position information of the actual marking point of the plate to be processed compared to the actual coordinate system is obtained.

[0033] In this embodiment, the mark point is a reference point used for positioning and alignment, including actual mark points and theoretical mark points. The actual mark point is a physical reference point pre-marked on the physical plate to be processed, which can be a specific pattern, hole or other obvious feature on the plate to be processed. The actual coordinate system is a coordinate system established based on the captured image, reflecting the coordinate position of each pixel in the captured image.

[0034] Image recognition algorithms (such as template matching, feature extraction, etc.) are used to identify actual marking points from the visual information of the plate to be processed, and the position information of each actual marking point in the actual coordinate system is saved to form a set containing multiple point coordinates.

[0035] In some embodiments, the camera of the machine tool can be calibrated to determine the center distance between the movable laser head and the camera (i.e., the physical distance between the movable laser head and the optical center of the camera), and the ratio between each pixel point in the captured image and the actual physical unit. Based on the center distance and the ratio, the pixel coordinates of each pixel point in the captured image are mapped to the actual coordinate system, thereby determining the position information of the actual marking point displayed in the captured image in the actual coordinate system.

[0036] As a feasible implementation method of camera calibration, the camera can be calibrated by cross calibration. Specifically, a pre-drawn theoretical cross icon is obtained, the length and shape of which are known, which is convenient for subsequent calibration calculations. According to the theoretical cross icon, the movable laser head of the machine tool is controlled to cut out an actual cross mark graphic on the plate to be processed as a reference for calibration. The camera of the machine tool is controlled to move to the position above the actual cross icon, and ensure that the actual cross icon is within the field of view of the camera. The image area containing the actual cross icon is selected as a sample image. The cross mark feature points (such as intersection points) in the sample image are extracted by image processing algorithms (such as edge detection) for subsequent calibration calculations. According to the cross mark feature points, the camera of the machine tool is controlled to move to four different positions of the actual cross mark (such as top, bottom, left, and right) in turn, and images are collected respectively. At each position, the pixel coordinates of the cross mark feature points are extracted by image processing. According to the actual physical size of the actual cross mark and the pixel size in the sample image, the ratio of pixels to actual physical units (K value) is calculated. And through geometric relationship, the center distance between the movable laser head and the optical center of the camera is calculated.

[0037] It should be noted that, in addition to the cross calibration, the camera can also be calibrated by using a checkerboard calibration, a circular calibration plate, etc. This embodiment does not limit the specific calibration method of the camera.

[0038] Furthermore, the pixel coordinates (X pixels, Y pixels) of the actual mark point in the captured image are identified through image processing algorithms (such as template matching or feature extraction). The pixel coordinates are multiplied by the K value and converted into physical coordinates (X physical, Y physical) relative to the actual coordinate system: X physics = X pixels × K, Y physics = Y pixels × K.

[0039] For example, if the K value is 0.02 mm / pixel and the pixel coordinates of an actual marker point are (500, 300), the physical coordinates (Xphysical, Yphysical) are: Xphysical = 500×0.02=10, Yphysical = 300×0.02=6 (in mm).

[0040] The above physical coordinates do not take into account the offset between the movable laser head and the camera. If there is a center distance offset (ΔX, ΔY) between the movable laser head and the camera, the first position information of the actual marking point compared to the actual coordinate system can be expressed according to the actual coordinates (Xactual, Yactual), where Xactual = Xphysical + ΔX, Yactual = Yphysical + ΔY. In other words, Xactual = X pixels × K + ΔX, Yactual = Y pixels × K + ΔY.

[0041] Step A20: Based on the processing pattern information of the plate to be processed, second position information of a theoretical marking point of the plate to be processed compared to a machine tool coordinate system is obtained.

[0042] In this embodiment, the theoretical marking point is a theoretical reference point pre-marked on the processing drawing, which can be a certain specific pattern, such as Figure 2 The small hexagonal pattern marked with 1, 2, and 3. The machine tool coordinate system is the workspace coordinate system of the machine tool itself, and all physical movements and operations of the machine tool are performed in this coordinate system.

[0043] In some implementations, the machining drawing may be aligned with the machine tool coordinate system, and the alignment operation includes origin alignment, scale alignment, and direction alignment. After detecting that the machining drawing is aligned with the machine tool coordinate system, an image recognition algorithm (such as template matching, feature extraction, etc.) is used to determine the theoretical marking points on the aligned machining drawing according to the machining drawing information, and determine the second position information of the theoretical marking points in the machine tool coordinate system.

[0044] Step A30: Calculate a position offset matrix from the theoretical marking point to the actual marking point based on the first position information and the second position information.

[0045] In some embodiments, the actual marking points (obtained in step A10) are matched with the theoretical marking points (obtained in step A20) in order to ensure that the quantity and position logic are consistent. Further, the position offset matrix from the theoretical marking points to the actual marking points is fitted by the least squares method. The position offset moment includes rotation, translation and scaling parameters, and the formula is as follows:

[0046] Among them, a, b, d, e represent rotation and scaling, and c and f represent translation.

[0047] Step A40: determining the rotation offset of the plate to be processed in the machine tool coordinate system based on the position offset matrix.

[0048] In this embodiment, the rotation offset includes the rotation angle and translation distance of the plate to be processed relative to the machine tool coordinate system. The rotation offset of the plate to be processed can be obtained by extracting the rotation parameters and translation parameters in the position offset matrix.

[0049] In some embodiments, Figure 4 As shown, after step A10, the step further includes: Step A11, controlling the movable laser head of the machine tool to move according to the first position information to collect real-time image information of the actual marking point.

[0050] In this embodiment, the movable laser head is a movable component in the machine tool for performing laser processing (such as cutting and marking), which can drive the camera to move synchronously. According to the first position information of the actual marking point in the actual coordinate system obtained in step A10, such as the coordinates (X actual, Y actual), the movable laser head of the machine tool is controlled to drive the camera to move to the position corresponding to the actual marking point. This step may involve converting the first position information from the actual coordinate system to the machine tool coordinate system, thereby controlling the movable laser head to move to the position corresponding to the actual marking point in the machine tool coordinate system. The specific coordinate conversion process is not described in detail in this embodiment, and the determination and guidance of the ejector installation point can be referred to steps S30 and S40.

[0051] Step A12: based on the real-time image information, select a boundary area including the actual marking point.

[0052] In this embodiment, the boundary area refers to a rectangular or polygonal area that surrounds the actual marking points in the real-time image information, which is used to limit the matching range of the positioning template. The real-time image information containing the actual marking points is collected by the camera, and then the actual marking points in the real-time image information are identified by using an image recognition algorithm (such as edge detection, boundary extraction, etc.), and the boundary area including the actual marking points is framed. As a feasible implementation method for frame-selecting the boundary area, the actual marking points can be automatically located and the minimum circumscribed boundary area can be generated through connected component analysis.

[0053] Step A13: Save the boundary area as a positioning template.

[0054] In this embodiment, the positioning template can be used to more quickly obtain the actual marking points of each plate to be processed during the processing of subsequent batches of plates to be processed.

[0055] In some embodiments, in order to verify and adjust the accuracy of the boundary area and ensure its consistency with the actual marking points, before step A13, several data points can be selected from the boundary area as test points; the test points are compared with the actual marking points; when the comparison results do not meet the preset comparison standards, the boundary area is adjusted. Finally, the adjusted boundary area that meets the preset comparison standards is saved as a positioning template.

[0056] Specifically, a number of pixels (such as 10 to 20 points) can be randomly selected in the boundary area as test points. Key features are extracted from the test points and the actual marking points, and the key features may include at least one of geometric features (such as shape, edge curvature, area, etc.), texture features (such as grayscale distribution, local binary pattern (LBP), etc.) and depth features (high-dimensional feature vectors extracted by convolutional neural network (CNN)). Key features of the test points and the actual marking points are compared based on image processing or machine learning algorithms (such as template matching, feature point detection, deep learning model, etc.). A comparison result is generated based on the similarity of the comparison between the test point and the actual marking point, and the comparison result is compared with the preset comparison standard to determine whether the boundary area needs to be adjusted. For example, if more than 90% or less than 80% of the test points meet the comparison standard, it is determined that the boundary area needs to be adjusted. If not, it is determined that the boundary area is valid. When the comparison result does not meet the preset comparison standard, the specific part that needs to be adjusted (such as position offset, size change, etc.) is determined by analyzing the deviation in the comparison result. The boundary area is adjusted by moving, scaling, rotating, etc. until the comparison result meets the preset comparison standard. It is understandable that if one adjustment fails to meet the standard, the above steps can be repeated multiple times to gradually optimize the boundary area. The final adjusted boundary area is saved as a positioning template, so that in the subsequent processing process, the positioning template can be used for positioning and alignment to ensure the accuracy and efficiency of each processing.

[0057] Step S30: determining the installation position of the ejector of the plate to be processed relative to the machine tool based on the rotation offset and the preset position of the ejector.

[0058] In this embodiment, the ejector installation point refers to a set of three-dimensional space coordinates after coordinate transformation compensation, which is used to determine the physical installation position of the ejector. The ejector preset point on the processing drawing is subjected to rotational offset transformation based on the rotational offset to obtain the ejector installation point to eliminate the placement error of the plate to be processed.

[0059] In some embodiments, the rotation compensation and displacement compensation of the preset ejector point can be calculated based on the rotation offset; and the ejector installation point corresponding to the preset ejector point in the machine tool coordinate system can be determined based on the rotation compensation and the displacement compensation. The ejector installation point can be represented by coordinates (X installation, Y installation).

[0060] Specifically, the rotation offset includes the rotation angle θ and the translation deviation ( , ). The preset ejector point set defined in the machining drawing is {(X1, Y1), (X2, Y2), ..., (Xn, Yn)}. The rotation compensation is the angle to be rotated in the opposite direction. θ is used to offset the angular deflection of the plate to be processed. The displacement compensation amount is the offset required for reverse translation. and , used to offset the translation deviation of the plate to be processed. Through the inverse transformation of rotation and translation, the preset position of the ejector is converted from the plate coordinate system to the machine tool coordinate system, then X installation = X theory × cosθ + Y theory × sinθ ,Yinstall= Xtheoretical × sinθ + Ytheoretical × cosθ .

[0061] For example, suppose the preset position of the ejector pin of an aluminum substrate is (100, 50), and the translation offset of the aluminum substrate is detected to be ΔX=2, ΔY= 1. Rotation offset θ = 5°. Based on the above formula, we can calculate X installation = 101.98 mm. Y installation = 42.09 mm. Therefore, the actual installation point of the ejector is (101.98, 42.09) mm.

[0062] Step S40, controlling the movable laser head of the machine tool to move according to the ejector installation point to guide the positioning installation of the ejector.

[0063] The ejector installation point is converted into a control instruction executable by the machine tool (which can be a G code, a standard programming language for CNC machine tools, used to control parameters such as motion axis, speed, feed, etc.), and the movable laser head of the machine tool is controlled to move in sequence according to the ejector installation point to guide the worker to place the ejector. In some embodiments, a cross or annular spot can be projected at the ejector installation point by a low-power laser to indicate the ejector placement position.

[0064] In some embodiments, after the ejector is placed, a second camera shot can be taken to verify whether there is a deviation between the actual installation position of the ejector and the installation point of the ejector. When the deviation exceeds the allowable range, an alarm can be triggered to prompt re-placement or automatic compensation of subsequent points.

[0065] In the method for positioning the ejector pin in the laser processing process proposed in the embodiment of the present application, firstly, by obtaining the photographed image and processing drawing of the plate to be processed when the plate to be processed is detected to be placed in the machine tool, the ejector pin positioning deviation problem caused by incomplete information or plate placement position deviation can be effectively reduced. Secondly, based on the obtained visual information and processing pattern information of the plate to be processed, the rotation offset and the ejector pin preset point of the plate to be processed are determined. Compared with the traditional method of relying on manual marking of the ejector pin point and placing the ejector pin by manual visual judgment, the present application can accurately calculate the rotation offset of the plate relative to the machine tool coordinate system and automatically determine the ejector pin preset point according to the processing drawing. This improvement eliminates the uncertainty caused by human factors, and there is no need to manually mark the ejector pin point, which can effectively improve the efficiency and accuracy of the ejector pin point determination. Thirdly, the ejector pin installation point of the plate to be processed relative to the machine tool is determined by the calculated rotation offset and ejector pin preset point. This means that even if the plate is angularly deflected during the placement process, the present application can accurately install the ejector pin at the ejector pin installation point by calculating compensation. This real-time adjustment and compensation mechanism can ensure that the ejector pin is always in the correct installation position, preventing the ejector pin from directly contacting the surface of the plate to be processed, thereby preventing scratches. Fourthly, by controlling the movable laser head of the machine tool to move according to the ejector pin installation point to guide the positioning and installation of the ejector pin, the accuracy and reliability of the ejector pin positioning can be ensured, reducing the risk of product scrapping.

[0066] In one embodiment, Figure 5 As shown, the step S20 further includes: Step B10: determining a non-pattern area based on the processing pattern information of the plate to be processed.

[0067] In this embodiment, the processing pattern information includes the geometric paths and areas of cutting, drilling, engraving and other operations defined in the processing drawing, such as Figure 2 The green lined area is shown in the figure. The non-pattern area is the area not covered by any machining operation in the machining drawing, such as Figure 2 The free area outside the machining pattern shown.

[0068] In some implementations, the processing pattern area can be identified from the processing drawing based on the processing pattern information, and a difference operation is performed between the entire area of ​​the processing drawing and the processing pattern area, and the remaining part is the non-pattern area. In some implementations, the processing drawings may be segmented using the GrabCut algorithm of OpenCV, which may divide the processing drawings into processing pattern areas and non-pattern areas based on a Gaussian mixture model.

[0069] Step B20, determining a preset ejector pin area based on the distribution characteristics of the non-pattern area.

[0070] In this embodiment, the distribution feature refers to the spatial distribution attribute of the non-pattern area, such as area, position, shape, etc.

[0071] It can be understood that the non-pattern area is an irregular shape area. In order to facilitate the screening of the ejector preset area that can be used to place the ejector, the non-pattern area can be divided into sub-areas according to the continuity of shape transformation, and the distribution characteristics of each sub-area are analyzed respectively to further screen the ejector preset area. It is analyzed whether each sub-area can fully accommodate the minimum area required by the ejector, and the sub-area that can accommodate the minimum area is used as the ejector preset area. The minimum area can be an area determined according to the contour shape of the contact area between the ejector and the plate to be processed.

[0072] In one embodiment, a filtering condition for the preset ejector area is preset, that is, the occupied area of ​​each ejector preset point is ≥π×(thrust pin radius+safety margin) 2 , where the safety margin is the minimum distance to prevent the edge of the ejector from being too close to the processing path. By analyzing the contour area of ​​each sub-area, the local area that cannot accommodate the area occupied by the preset ejector point is filtered out, and the remaining area is the ejector preset area.

[0073] In another embodiment, the shape regularity of each sub-region is evaluated, which can be specifically calculated by (4π×area) / (perimeter 2 ) is used to calculate the circularity of the region. This formula quantifies the degree of its closeness to a circle by comparing the relationship between the area and the perimeter of the region. The closer the circularity value is to 1, the closer the region is to a circle and the better the stability. It is also possible to set the sub-regions with circularity values ​​< a preset threshold (such as 0.75) as unstable regions. Such regions are usually narrow or irregular in shape, which may cause uneven distribution of ejector support force and are not suitable for placing ejectors. Finally, the unstable regions are filtered out, and the remaining regions are the ejector preset regions.

[0074] In another embodiment, the circularity of each sub-region is calculated, and the sub-region with a circularity value greater than a preset threshold is marked as an unstable region, and the unstable region is filtered to obtain a stable region. The contour area of ​​each stable region is calculated, and the local area of ​​each contour area that cannot accommodate the occupied area of ​​the preset ejector point is filtered out to obtain the ejector preset area.

[0075] Step B30, obtaining the size information and / or weight information of the plate to be processed, and determining the preset number of ejector pins based on the size information and / or weight information.

[0076] In this embodiment, the size information includes the length L, width W, and thickness T (unit: mm) of the plate to be processed. The weight information includes the mass (unit: kg) of the plate to be processed.

[0077] By presetting the minimum load capacity, maximum load capacity, minimum load area, and maximum load area of ​​a single ejector, the first minimum number m1 and the first maximum number n1 of ejectors can be calculated based on the weight information of the plate to be processed. The preset number of ejectors can be any suitable value or value range between m1 and n1.

[0078] Furthermore, according to the size information of the plate to be processed and the preset distribution rule (such as every 0.5 At least 1 ejector pin, and / or every 0.5 The preset number of ejector pins may be any suitable value or value range between m2 and n2.

[0079] The first guaranteed minimum number m1 and the second guaranteed minimum number m2 represent the minimum number of ejector pins required for the sheet to be processed calculated from different dimensions, respectively, and the first maximum number n1 and the second maximum number n2 represent the maximum number of ejector pins required for the sheet to be processed calculated from different dimensions, respectively. The preset number of ejector pins may also be any suitable value or value interval within the intersection interval formed by the two intervals [m1, n1] and [m2, n2]. For example, the maximum value of the first guaranteed minimum number and the second guaranteed minimum number may be taken as the preset number of ejector pins, so that sufficient ejector pins are placed on the sheet to be processed.

[0080] Step B40: determining ejector preset points based on the ejector preset area and the ejector preset number.

[0081] In this embodiment, the preset ejector points are determined based on the preset ejector area and the preset number of ejector pins and in accordance with a preset point allocation rule.

[0082] In one embodiment, the point allocation rule includes uniform distribution, and the preset ejector points are evenly distributed in a grid or ring manner within the preset ejector area.

[0083] In another embodiment, the point allocation rule includes a gravity-prioritized distribution, with the gravity / mass center of the plate to be processed as the center of the circle, and the ejector preset points are evenly distributed in a ring. It should be noted that if the gravity / mass center of the plate to be processed belongs to the ejector preset area, then the ejector preset area to which the gravity / mass center belongs is the ejector must be set area.

[0084] In some implementations, the upper limit of the number of preset ejector pins can also be calculated based on the distribution characteristics of the preset ejector pin area and the occupied area of ​​the preset ejector pin points. The upper limit represents the maximum number of ejector pins that can be placed on the plate to be processed.

[0085] It is understandable that each processing pattern will be cut off by the movable laser head according to the processing order, thereby affecting the overall weight and distribution of the center of gravity of the plate to be processed. Therefore, when the preset number of ejector pins is greater than the upper limit, it means that the number of ejector pins that can be placed on the plate to be processed cannot meet the preset number of ejector pins. At this time, the processing order and ejector pin preset points of each processing pattern can be determined based on the distribution characteristics of the ejector pin preset area (or ejector pin planning area) and the processing pattern information of the plate to be processed, so that after the corresponding ejector pins are placed based on the ejector pin preset points, the plate to be processed is processed according to the processing order.

[0086] Specifically, based on the distribution characteristics of the preset ejector area and the preset number of ejectors, the preset ejector points are determined. According to the distribution positions of the preset ejector points, the support center of gravity of the preset ejector points is determined. Based on the support center of gravity and the processing drawing information of the plate to be processed, the processing order of each processing drawing is determined. By processing the processing drawings according to the processing order, the center of gravity change trajectory of the plate to be processed can be always close to the support center of gravity. When the number of ejectors that can be placed in the preset ejector area is insufficient to meet the preset number of ejectors, this embodiment can prevent the plate to be processed from having an unstable center of gravity or warping during processing by reasonably arranging the ejector layout.

[0087] In the method for positioning the ejector pin during laser processing proposed in the embodiment of the present application, on the one hand, by accurately extracting the processing pattern information and calculating the non-pattern area, it is ensured that the ejector pin will not be placed in the area that needs to be processed, thereby avoiding interference with the processing process. On the other hand, based on the distribution characteristics of the non-pattern area (such as area, position, shape, etc.), and through filtering conditions (such as occupied area, circularity), the part that is most suitable as the preset area for the ejector pin is screened out, thereby ensuring the rationality and stability of the ejector pin layout. On the third hand, combined with the size information and weight information, the maximum bearing capacity and distribution rules of a single ejector pin are comprehensively considered to ensure that the number of ejectors meets the support requirements without excessively wasting resources. On the fourth hand, according to the support center of gravity corresponding to the layout position of the preset ejector pin point, the processing order of the processing pattern is dynamically adjusted, so that the ejector pin can always provide the best support at different processing stages, thereby improving resource utilization and processing efficiency.

[0088] In one embodiment, the captured image also includes the distribution information of the blade of the machine tool, such as Figure 6 As shown, the step B40 further includes: Step B41, extracting the contour coordinates of the sword ridge based on the sword ridge distribution information.

[0089] In this embodiment, the Jian Shan is a supporting structure regularly distributed on the machine tool. By capturing the distribution information of the Jian Shan in the image and using image processing technology (such as edge detection, contour recognition, etc.), the contour coordinates of the Jian Shan can be accurately extracted.

[0090] Step B42, performing a difference operation based on the contour coordinates of the sword shank and the preset ejector area to determine the ejector planning area.

[0091] By excluding the intersection of the area occupied by the Jianshan contour coordinates and the ejector preset area from the ejector preset area, the final ejector planning area can be obtained. This step ensures that the ejector will not be arranged at the Jianshan position, avoids potential interference problems, and improves the safety and efficiency of processing.

[0092] Step B43, determining the preset positions of the ejector pins based on the ejector pin planning area and the preset number of ejector pins.

[0093] In this embodiment, the preset ejector points are determined based on the ejector planning area and the preset number of ejectors and according to a preset point allocation rule.

[0094] In one embodiment, the point allocation rule includes uniform distribution, and the preset ejector points are evenly distributed in a grid or ring manner within the ejector planning area.

[0095] In another embodiment, the point allocation rule includes a gravity-prioritized distribution, with the gravity / mass center of the plate to be processed as the center of the circle, and the preset ejector points are evenly distributed in a ring. It should be noted that if the gravity / mass center of the plate to be processed belongs to the ejector planning area, then the ejector planning area to which the gravity / mass center belongs is the ejector must be set area.

[0096] In some implementations, the upper limit of the preset number of ejector pins can also be calculated based on the distribution characteristics of the ejector pin planning area and the occupied area of ​​the preset ejector pin positions. The upper limit of the number represents the maximum number of ejector pins that can be placed on the plate to be processed.

[0097] When the preset number of ejectors is greater than the upper limit, it means that the number of ejectors that can be placed on the plate to be processed cannot meet the preset number of ejectors. As an implementation method, at this time, the processing order and the preset positions of ejectors for each processing pattern can be determined based on the distribution characteristics of the ejector planning area and the processing pattern information of the plate to be processed, so that after the corresponding ejectors are placed based on the preset positions of the ejectors, the plate to be processed is processed according to the processing order.

[0098] Specifically, based on the distribution characteristics of the ejector planning area and the preset number of ejectors, the preset positions of the ejectors are determined. According to the distribution positions of the preset ejector points, the support center of gravity of the preset ejector points is determined. Based on the support center of gravity and the processing drawing information of the plate to be processed, the processing order of each processing drawing is determined. By processing the processing drawings according to the processing order, the center of gravity change trajectory of the plate to be processed can be always close to the support center of gravity. When the number of ejectors that can be placed in the ejector planning area is insufficient to meet the preset number of ejectors, this embodiment can prevent the plate to be processed from having an unstable center of gravity or warping during processing by reasonably arranging the processing order of the processing drawings. As another implementation method, the upper limit of the number of ejectors that can be accommodated in the ejector planning area in this embodiment is affected by the contour of the jianshan on the plate to be processed. The contour of the jianshan on the plate to be processed is related to the placement position of the plate to be processed on the machine tool. Therefore, when the preset number of ejectors is greater than the upper limit, a prompt message is issued to readjust the placement position of the plate to be processed, so as to prompt the worker to adjust the placement position of the plate to be processed. After the worker adjusts, step S10 is re-executed.

[0099] Furthermore, based on the contour coordinates of the sword shan, the preset number of ejectors and the preset area of ​​the ejectors, suggestions for rearranging the plates to be processed can be given so that the sword shan avoids the preset area of ​​the ejectors as much as possible to meet the distribution of the preset number of ejectors.

[0100] Specifically, based on the contour coordinates of the Jianshan, the relative position relationship between the Jianshan and the preset ejector area under different plate placement positions is simulated. From the various simulated relative position relationships, the target relative position relationship with the largest ejector planning area and the largest upper limit on the number of ejectors that can be satisfied is selected, and based on the target relative position relationship, the placement suggestions for the plates to be processed are generated.

[0101] In the method for positioning the ejector pin during laser processing proposed in the embodiment of the present application, on the one hand, by accurately extracting the coordinates of the sword shank contour and performing a difference operation, it is ensured that the ejector pin will not be arranged at the sword shank position, thereby avoiding potential interference problems and improving the safety and efficiency of processing. On the other hand, when the preset number of ejector pins is greater than the upper limit, by dynamically adjusting the processing order of each processing pattern, it is possible to ensure stable support of the sheet material and improve processing accuracy. On the third hand, when the preset number of ejector pins exceeds the upper limit of the number that the ejector pin planning area can accommodate, guide the workers to adjust the placement of the sheet material to be processed, increase the area of ​​the ejector pin planning area, and thus increase the upper limit of the number that the ejector pin planning area can accommodate.

[0102] In one embodiment, a computer-readable storage medium is provided, on which executable instructions are stored. When the instructions are executed by a processor, the processor executes the steps in the above-mentioned method embodiments.

[0103] In one embodiment, an electronic device is also provided, including one or more processors; a memory, in which one or more programs are stored, wherein when the one or more programs are executed by one or more processors, the one or more processors execute the steps in the above-mentioned method embodiments.

[0104] In one embodiment, Figure 7 As shown, it shows a schematic diagram of the structure of an electronic device for implementing an embodiment of the present application. The electronic device 700 includes a central processing unit (CPU) 701, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 702 or a program loaded from a storage part 708 to a random access memory (RAM) 703. In the RAM 703, various programs and data required for the operation of the electronic device 700 are also stored. The CPU 701, the ROM 702, and the RAM 703 are connected to each other via a bus 704. An input / output (I / O) interface 705 is also connected to the bus 704.

[0105] The following components are connected to the I / O interface 705: an input section 706 including a keyboard, a mouse, etc.; an output section 707 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 708 including a hard disk, etc.; and a communication section 709 including a network interface card such as a LAN card, a modem, etc. The communication section 709 performs communication processing via a network such as the Internet. A drive 710 is also connected to the I / O interface 705 as needed. A removable medium 711, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 710 as needed, so that a computer program read therefrom is installed into the storage section 708 as needed.

[0106] In particular, according to an embodiment of the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, including a computer-readable medium carrying instructions, in such an embodiment, the instructions can be downloaded and installed from a network through a communication part 709, and / or installed from a removable medium 711. When the instructions are executed by a central processing unit (CPU) 701, the various method steps described in the present application are executed.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0108] In addition, those skilled in the art will appreciate that, although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the above claims, any one of the claimed embodiments may be used in any combination. The information disclosed in this background technology section is intended only to deepen the understanding of the overall background technology of the present application and should not be regarded as an admission or in any form of implication that the information constitutes prior art known to those skilled in the art.

Claims

1. A method for positioning an ejector pin during laser processing, characterized in that: The method comprises: When it is detected that a plate to be processed is placed in a machine tool, a photographed image and a processing drawing of the plate to be processed are obtained, wherein the photographed image includes visual information of the plate to be processed, and the processing drawing includes processing pattern information of the plate to be processed; Based on the visual information of the plate to be processed and the processing pattern information of the plate to be processed, determining the rotation offset of the plate to be processed and the preset position of the ejector pin; Based on the rotation offset and the preset position of the ejector, determining the installation position of the ejector of the plate to be processed relative to the machine tool; The movable laser head of the machine tool is controlled to move according to the ejector installation point to guide the positioning installation of the ejector.

2. The method for positioning the ejector pin during laser processing according to claim 1, characterized in that: The step of determining the rotation offset of the plate to be processed and the preset position of the ejector pin based on the visual information of the plate to be processed and the processing pattern information of the plate to be processed includes: Based on the visual information of the plate to be processed, first position information of an actual marking point of the plate to be processed compared to an actual coordinate system is acquired; Based on the processing pattern information of the plate to be processed, obtaining second position information of a theoretical marking point of the plate to be processed compared to a machine tool coordinate system; Based on the first position information and the second position information, calculating a position offset matrix from the theoretical marking point to the actual marking point; Based on the position offset matrix, the rotation offset of the plate to be processed in the machine tool coordinate system is determined.

3. The method for positioning the ejector pin during laser processing according to claim 2, characterized in that: Before obtaining the first position information of the actual marking point of the plate to be processed compared to the actual coordinate system, the method further includes: Calibrate the camera of the machine tool to determine the center distance between the movable laser head and the camera, and the ratio of each pixel point in the captured image to the actual physical unit; Based on the center distance and the ratio, the pixel coordinates of each pixel point in the captured image are mapped to an actual coordinate system.

4. The method for positioning the ejector pin during laser processing according to claim 2, characterized in that: After obtaining the first position information of the actual marking point of the plate to be processed compared with the actual coordinate system based on the visual information of the plate to be processed, the method further includes: Controlling a movable laser head of the machine tool to move according to the first position information to collect real-time image information of the actual marking point; Based on the real-time image information, frame a boundary area including the actual marking point; The boundary area is saved as a positioning template.

5. The method for positioning the ejector pin during laser processing according to claim 4, characterized in that: Before saving the boundary area as a positioning template, the method further includes: Selecting a number of data points from the boundary area as test points; Perform feature comparison between the test point and the actual marking point; When the comparison result does not meet the preset comparison standard, the boundary area is adjusted.

6. The method for positioning the ejector pin during laser processing according to claim 1, characterized in that: The step of determining the rotation offset of the plate to be processed and the preset position of the ejector pin based on the visual information of the plate to be processed and the processing pattern information of the plate to be processed includes: Determining a non-pattern area based on the processing pattern information of the plate to be processed; Determining a preset ejector area based on the distribution characteristics of the non-pattern area; Acquiring the size information and / or weight information of the plate to be processed, and determining the preset number of ejector pins based on the size information and / or weight information; Based on the preset ejector pin area and the preset ejector pin quantity, the preset ejector pin positions are determined.

7. The method for positioning the ejector pin during laser processing according to claim 6, characterized in that: The captured image also includes the shank distribution information of the machine tool, and the preset ejector point is determined based on the preset ejector area and the preset ejector number, including: Extracting the contour coordinates of the sword ridge based on the sword ridge distribution information; Performing a difference operation based on the contour coordinates of the sword and the preset ejector area to determine the ejector planning area; Based on the ejector planning area and the ejector preset number, the ejector preset point positions are determined.

8. The method for positioning an ejector pin during laser processing according to any one of claims 1 to 7, characterized in that: The step of determining the installation position of the ejector pin of the plate to be processed relative to the machine tool based on the rotation offset and the preset position of the ejector pin comprises: Based on the rotation offset, a rotation compensation amount and a displacement compensation amount of the preset ejector point are calculated; Based on the rotation compensation amount and the displacement compensation amount, the ejector installation point position corresponding to the ejector preset point position in the machine tool coordinate system is determined.

9. An electronic device, characterized in that: include: one or more processors; a memory for storing one or more programs, When the one or more programs are executed by the one or more processors, the one or more processors execute the ejector positioning method in the laser processing process as described in any one of claims 1 to 8.

10. A storage medium, characterized in that: The storage medium stores executable instructions, and when the instructions are executed by the processor, the processor executes the ejector positioning method in the laser processing process according to any one of claims 1 to 8.

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