Drive mechanism

By designing a driving mechanism including a fixed part, a movable part and a driving component, the precise motion control of the optical element is achieved by using elastic elements and magnetic elements, the problems of miniaturization of the lens driving module and structural strength are solved, and automatic focus and optical anti-shaking functions are supported.

CN119960138APending Publication Date: 2025-05-09AITE TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202311481683.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-11-08
Publication Date
2025-05-09

AI Technical Summary

Technical Problem

How to miniaturize in the lens drive module and ensure structural strength to support autofocus and optical anti-hand shock functions.

Method used

A driving mechanism is designed, including a fixed part, a movable part and a driving assembly, connecting the housing and the base with an upper elastic element and a lower elastic element, and driving the movement of the carrier and the optical element through a coil and a magnetic element.

Benefits of technology

It realizes precise motion control of optical components, supports automatic focus and optical anti-shaking functions, and improves structural strength and flexibility through miniaturization design and the use of elastic components.

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Abstract

A driving mechanism is used for driving an optical element to move and comprises a fixed part, a movable part and a driving assembly. And the movable part is movably connected with the fixed part and is used for bearing the optical element. The driving assembly drives the movable part to move relative to the fixed part.
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Description

Technical Field

[0001] The present invention relates to a driving mechanism, and more particularly to a driving mechanism for driving an optical element to move. Background Art

[0002] With the development of technology, many electronic devices (such as smart phones or digital cameras) now have the function of taking photos or recording videos. These electronic devices are becoming more and more popular and are developing in the direction of convenient and thinner designs to provide users with more choices.

[0003] Some electronic devices with camera or video recording functions are equipped with a lens driving module to drive an optical element to move, thereby achieving the functions of autofocus and optical image stabilization (OIS). Light can pass through the aforementioned optical element to form an image on a photosensitive element.

[0004] However, how to further miniaturize the lens driving module and ensure that it has sufficient structural strength has become an important challenge for researchers in this technical field. Summary of the invention

[0005] The object of the present invention is to provide a driving mechanism to solve at least one of the above problems.

[0006] In view of the above-mentioned known problems, an embodiment of the present invention provides a driving mechanism for driving an optical element to move, wherein the optical element has an optical axis, and the driving mechanism includes a fixed portion, a movable portion, and a driving assembly. The movable portion is movably connected to the fixed portion, wherein the optical element is disposed on the movable portion. The driving assembly is used to drive the movable portion to move relative to the fixed portion.

[0007] In one embodiment, the driving mechanism further includes a quadrilateral upper elastic element, and the fixing portion includes a shell and a base connected to each other, wherein the upper elastic element connects the movable portion and the shell, and a plurality of slots are formed at a corner of the upper elastic element.

[0008] In one embodiment, the housing is formed with a concave structure, and the upper elastic element is connected to the concave structure.

[0009] In one embodiment, the driving mechanism further includes an upper elastic element, the fixed portion includes a shell and a base connected to each other, and the upper elastic element connects the movable portion and the shell, wherein the upper elastic element forms an opening, the movable portion forms a groove, and the groove is communicated with the opening.

[0010] In one embodiment, the movable portion further forms a protrusion located in the groove.

[0011] In one embodiment, the driving mechanism further includes a lower elastic element, the fixed portion includes a shell and a base connected to each other, and the lower elastic element connects the base and the movable portion, wherein the lower elastic element has a positioning hole, the movable portion is formed with a card block, and the card block is embedded in the positioning hole.

[0012] In one embodiment, the driving mechanism further includes a lower elastic element, the fixed portion includes a shell and a base connected to each other, and the lower elastic element connects the base and the movable portion, wherein the lower elastic element has an opening, the movable portion forms a recess, and the recess is communicated with the opening.

[0013] In one embodiment, the driving mechanism further includes a lower elastic element and a wire, the fixed part includes a shell and a base connected to each other, and the lower elastic element connects the base and the movable part, wherein the driving component includes a coil arranged on the movable part and a magnetic element fixed to the inner side of the shell, the movable part forms a winding post, and the wire connects the coil and the winding post, wherein the lower elastic element has a recessed portion, and the recessed portion is adjacent to the winding post.

[0014] In one embodiment, the driving mechanism further includes a lower elastic element and a conductive member, the fixed portion includes a shell and a base connected to each other, and the lower elastic element connects the base and the movable portion, wherein the conductive member is embedded in the base, and one end of the conductive member is exposed on the top side of the base for electrically connecting to the lower elastic element.

[0015] In one embodiment, the base has a quadrilateral structure, and the end portion is located at a corner of the base.

[0016] In one embodiment, the lower elastic element is formed with a long strip-shaped through hole, a long axis of the through hole is inclined relative to a side of the base, and the through hole and the end portion at least partially overlap in the direction of the optical axis.

[0017] In one embodiment, the driving mechanism further includes a circuit component, the fixing portion includes a shell and a base connected to each other, and the base is formed with a convex rib, wherein the circuit component is fixed to the outer side of the convex rib.

[0018] In one embodiment, the base further forms a bottom surface, a left limiting surface and a right limiting surface, wherein the bottom surface, the left limiting surface and the right limiting surface are adjacent to the rib, and the circuit component abuts against the bottom surface and one of the left and right limiting surfaces.

[0019] In one embodiment, the circuit component is a circuit board.

[0020] In one embodiment, the driving mechanism further includes a magnetic field sensing element and a magnet, the magnet is disposed on the movable portion, and the magnetic field sensing element is disposed on the circuit component to sense the position of the magnet.

[0021] In one embodiment, the driving mechanism further includes a circuit component and a conductive member, the fixing portion includes a shell and a base connected to each other, the circuit component is fixed on the base, and the conductive member is embedded in the base to electrically connect the circuit component.

[0022] In one embodiment, an L-shaped structure is formed at the end of the conductive element.

[0023] In one embodiment, the conductive element is integrated into the base by insert molding.

[0024] In one embodiment, the base is formed with a rib, the circuit assembly is fixed on the outer side of the rib, and the inner side of the rib is formed with a groove and an inclined surface, wherein the inclined surface is located in the groove.

[0025] In one embodiment, the movable portion is in a quadrilateral shape, and a hole is formed on the top side of the movable portion, wherein the hole is located adjacent to a corner of the movable portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 An exploded view of a driving mechanism according to an embodiment of the present invention is shown.

[0027] Figure 2 express Figure 1 Another exploded view of the drive mechanism in .

[0028] Figure 3 express Figure 1 and Figure 2 A three-dimensional view of the drive mechanism after assembly.

[0029] Figure 4 express Figure 1 and Figure 2 Another perspective view of the drive mechanism after assembly.

[0030] Figure 5An exploded view showing the shell before being combined with the upper elastic element.

[0031] Figure 6 A three-dimensional diagram showing the combination of the housing and the upper elastic element.

[0032] Figure 7 A three-dimensional diagram showing the combination of the coil and the carrier.

[0033] Figure 8 A schematic diagram showing that the opening of the upper elastic element is connected to the groove on the carrier.

[0034] Fig. 9 A three-dimensional diagram showing the combination of the coil and the carrier.

[0035] Fig.10 A three-dimensional diagram showing the combination of the lower elastic element, the coil and the supporting member.

[0036] Fig.11 A partial enlarged schematic diagram showing the lower elastic element being fixed to the bottom side of the supporting member.

[0037] Fig.12 A three-dimensional diagram showing the circuit assembly and the base after being combined.

[0038] Fig.13 A three-dimensional diagram showing that the lower elastic element is arranged on the base.

[0039] Fig.14 A three-dimensional diagram showing the coil and the carrier being arranged in the base.

[0040] Fig.15 Schematic diagram showing laser welding along direction D.

[0041] Fig.16 An exploded view showing the circuit assembly and base before they are combined.

[0042] Fig.17 Indicates along Figure 3 Cross-sectional view along line segment A1-A2 in FIG.

[0043] Fig.18 Indicates along Figure 3 A cross-sectional view of the line segment A3-A4 in FIG.

[0044] Fig.19 A partially enlarged stereoscopic view showing the ribs on the base.

[0045] Fig. 20 A cross-sectional view showing the positioning ejector pin contacting a conductive member.

[0046] The reference numerals are as follows:

[0047] 100: Driving mechanism

[0048] B: Plastic base

[0049] B1: Raised ribs

[0050] B11: Bottom

[0051] B12: Left limit surface

[0052] B13: Right limit surface

[0053] B2: Groove

[0054] B21: Inclined surface

[0055] BS: Lower elastic element

[0056] BS1: Positioning hole

[0057] BS2: Opening

[0058] BS3: Depression

[0059] BS4: Electrical connection

[0060] C: Coil

[0061] D: Direction

[0062] F: Circuit components

[0063] FS: Upper elastic element

[0064] FS1: Slotting

[0065] FS2: Open

[0066] G: Gap

[0067] H: Shell

[0068] H1: Concave structure

[0069] HS: Magnetic field sensing element

[0070] HM:Magnet

[0071] LH: Bearing

[0072] LH1: Hole

[0073] LH2: Winding column

[0074] M: Magnetic components

[0075] N:Card Block

[0076] O: Optical axis

[0077] P: Conductive parts

[0078] P1: End

[0079] R: Groove

[0080] R1: Bump

[0081] r: concave part

[0082] S: Positioning ejector pin

[0083] S1: Chamfer surface

[0084] T:Piercing

[0085] T1: Long axis

[0086] W: Wire DETAILED DESCRIPTION

[0087] The following describes the drive mechanism of the embodiment of the present invention. However, it is easy to understand that the embodiment of the present invention provides many suitable inventive concepts and can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific way, and are not intended to limit the scope of the present invention.

[0088] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0089] The above and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are used to illustrate and are not used to limit the present invention.

[0090] First, please refer to Figures 1 to 4 ,in Figure 1 An exploded view of a driving mechanism 100 according to an embodiment of the present invention is shown. Figure 2 express Figure 1 Another exploded view of the drive mechanism 100, Figure 3 express Figure 1 and Figure 2 The driving mechanism 100 is a three-dimensional view after assembly, Figure 4 express Figure 1 and Figure 2 Another perspective view of the drive mechanism 100 after assembly.

[0091] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the driving mechanism 100 of the present embodiment is, for example, a voice coil motor (VCM), which can be installed in a mobile phone or other portable electronic device to drive an optical element (such as an optical lens) to move, thereby achieving functions such as auto focusing (AF) or optical image stabilization (OIS).

[0092] The aforementioned driving mechanism 100 mainly includes a hollow housing H, a plastic base B, a circuit component F, a carrier LH, an upper elastic element FS, at least one lower elastic element BS, at least one magnetic element M and at least one coil C. In this embodiment, the aforementioned housing H has a hollow structure and is combined with the base B, and the circuit component F is fixed to one side of the base B, wherein the housing H and the base B can together constitute a fixed portion of the driving mechanism 100.

[0093] In addition, the aforementioned carrier LH is movably accommodated in the housing H, and an optical element (not shown) can be fixed in the carrier LH, wherein the aforementioned carrier LH constitutes a movable part that can move relative to the aforementioned fixed part (housing H and base B).

[0094] Specifically, the aforementioned carrier LH is connected to the housing H and the base B through upper and lower elastic elements FS and BS (such as metal springs), respectively, so that the carrier LH can be suspended in the driving mechanism 100 in a movable manner. Through the aforementioned mechanism configuration, external light can enter the driving mechanism 100 along the optical axis O (Z-axis direction) of the optical element, and the light will pass through the optical lens and reach an image sensing element (not shown) located below the base B, thereby generating a digital image.

[0095] It should be particularly noted that a coil C is provided on both sides of the aforementioned carrier LH, and a magnetic element M (such as a magnet) corresponding to the aforementioned coil C is provided on the inner side of the shell H, wherein the aforementioned coil C and the magnetic element M can constitute a driving component.

[0096] When a current signal is applied to the aforementioned coil C, the magnetic force generated between the coil C and the magnetic element M can drive the carrier LH and the optical element disposed therein to move relative to the base B and the shell H along the optical axis O direction (Z-axis direction), thereby achieving the function of autofocus (AF) or optical image stabilization (OIS).

[0097] Depend on Figure 1 and Figure 2As can be seen in FIG. 1 , a magnetic field sensing element HS is provided on the circuit component F, and a magnet HM is provided on one side of the carrier LH, wherein the magnetic field sensing element HS can be used to sense the position change of the magnet HM. For example, the magnetic field sensing element HS can be a Hall effect sensor, a magnetoresistive sensor (MR sensor), or a fluxgate sensor, etc., which can be used to sense the position of the magnet HM, so as to know the relative position change between the carrier LH and the fixed part (shell H and base B).

[0098] Please also read Figure 5 and Figure 6 ,in Figure 5 An exploded view showing the housing H before being combined with the upper elastic element FS. Figure 6 A three-dimensional diagram showing the housing H and the upper elastic element FS combined.

[0099] like Figure 5 and Figure 6 As shown, the shell H and the upper elastic element FS of this embodiment are both quadrilateral, wherein concave structures H1 recessed toward the -Z axis direction are respectively formed at the four corners of the shell H, and a plurality of long strip-shaped slots FS1 are respectively formed at the four corners of the upper elastic element FS.

[0100] from Figure 6 It can be seen that the aforementioned concave structure H1 is recessed toward the direction of the upper elastic element FS, and the grooves FS1 located at the four corners of the upper elastic element FS will respectively contact the four concave structures H1 of the shell H during assembly. The grooves FS1 are formed at the four corners of the upper elastic element FS, which can help the upper elastic element FS and the metal shell H to be welded (welding) or soldering (soldering) to enhance the connection strength between the upper elastic element FS and the shell H.

[0101] On the other hand, from Figure 5 and Figure 6 It can also be seen that the upper elastic element FS is further formed with at least one opening FS2, which can be used to accommodate glue to facilitate bonding of the upper elastic element FS and the carrier LH (movable part).

[0102] Please also refer to Figure 7 , Figure 8 ,in Figure 7 A three-dimensional diagram showing the combination of the coil C and the carrier LH, Figure 8 A schematic diagram showing that the opening FS2 of the upper elastic element FS is connected to the groove R on the carrier LH.

[0103] like Figure 7As shown, at least one hole LH1 is formed on the top side of the carrier LH, wherein the hole LH1 is adjacent to a corner of the carrier LH, thereby preventing structural defects caused by uneven thickness of the carrier LH during plastic molding.

[0104] In addition, from Figure 7 and Figure 8 It can be seen that at least one groove R is formed on the top side of the aforementioned carrier LH, and a protrusion R1 is formed in the groove R, wherein the opening FS2 of the aforementioned upper elastic element FS corresponds to the groove R on the carrier LH and is connected to the aforementioned.

[0105] In this way, during assembly, glue can be injected into the groove R on the top side of the carrier LH through the opening FS2 of the upper elastic element FS to firmly bond the upper elastic element FS and the carrier LH, wherein the protrusion R1 located in the groove R can increase the adhesion area between the glue and the carrier LH, thereby greatly improving the connection strength between the upper elastic element FS and the shell H.

[0106] Please also read Fig. 9 , Fig.10 and Fig.11 ,in Fig. 9 A three-dimensional diagram showing the combination of the coil C and the carrier LH, Fig.10 A three-dimensional diagram showing the combination of the lower elastic element BS, the coil C and the carrier LH, Fig.11 A partial enlarged schematic diagram showing the lower elastic element BS being fixed to the bottom side of the carrier LH.

[0107] like Fig. 9 As shown, a recess r and a block N are formed on the bottom side of the carrier LH in this embodiment. In addition, a winding post LH2 is formed on both sides of the carrier LH, wherein one end of two wires W are respectively connected to the coil C, and the other end is wound around the aforementioned winding post LH2.

[0108] It should be noted that from Fig.10 and Fig.11 As can be seen from the figure, the two lower elastic elements BS are respectively formed with a positioning hole BS1, an opening BS2 and an arc-shaped recessed portion BS3. When assembling, the block N on the bottom side of the carrier LH can pass through the positioning hole BS1 of the lower elastic element BS (such as Fig.11As shown), the lower elastic element BS is positioned at a preset position on the bottom side of the carrier LH. At this time, the opening BS2 on the bottom side of the carrier LH will be aligned with the recess r of the lower elastic element BS and connected to the aforementioned recess r, and the winding post LH2 on the side of the carrier LH will be aligned with and adjacent to the recess BS3 of the lower elastic element BS. During assembly, solder can be applied to the aforementioned recess BS3 and allowed to flow and contact the wire W on the winding post LH2. In this way, the aforementioned coil C can be electrically connected to the lower elastic element BS through the wire W.

[0109] On the other hand, from Fig.10 and Fig.11 It can also be seen that an electrical connection portion BS4 is formed at the end of each lower elastic element BS, and a long strip-shaped through hole T is formed on the electrical connection portion BS4 for laser welding with the conductive member P fixed on the base B.

[0110] Please also refer to Fig.12 , Fig.13 , Fig.14 and Fig.15 ,in Fig.12 A three-dimensional diagram showing the combination of the circuit assembly F and the base B, Fig.13 A three-dimensional diagram showing that the lower elastic element BS is arranged on the base B, Fig.14 A three-dimensional diagram showing the coil C and the carrier LH arranged in the base B, Fig.15 Schematic diagram showing laser welding along direction D.

[0111] from Fig.12 It can be seen that a number of conductive parts P made of metal are embedded inside the base B made of plastic material, wherein the conductive parts P and the base B are manufactured by insert molding, and an end P1 of the conductive part P is exposed on the top side of the base B and is located at the corner of the quadrilateral base B.

[0112] In addition, if Fig.13 and Fig.14 As shown, the lower elastic element BS is arranged on the top side of the base B to connect the base B and the carrier LH arranged in the base B, wherein the electrical connection portion BS4 of the lower elastic element BS can be joined to the end P1 of the conductive element P by laser welding.

[0113] It should be noted that after the carrier LH is installed on the base B, the laser welding machine can be Fig.15 The laser welding is performed in the direction D shown in the figure to prevent the laser beam from being affected by the carrier LH and the base B, wherein the aforementioned direction D is substantially perpendicular to the long axis T1 ( Fig.15), and the aforementioned long axis T1 is inclined with the side of the quadrilateral base B, that is, the long axis T1 forms an inclination angle with the X-axis direction or the Y-axis direction.

[0114] In this embodiment, the end portion P1 of the conductive member P and the through hole T on the lower elastic element BS at least partially overlap in the direction of the optical axis O (Z axis).

[0115] Next, please refer to Fig.16 ,in Fig.16 An exploded view showing the circuit assembly F and the base B before being combined.

[0116] like Fig.16 As shown, a convex rib B1 is formed on one side of the aforementioned base B, and a bottom surface B11, a left limit surface B12 and a right limit surface B13 are respectively formed on the outer side of the convex rib B1. During assembly, the aforementioned circuit component F (such as a circuit board) can be bonded and fixed to the outer surface of the convex rib B1, and the circuit component F can be abutted against the aforementioned bottom surface B11 and one of the left and right limit surfaces B12, B13 to ensure that the circuit component F can be positioned at a preset position on the base B, thereby improving the accuracy of the magnetic field sensing element HS in sensing the position of the aforementioned magnet HM.

[0117] It should be understood that the left limiting surface B12 and the right limiting surface B13 in this embodiment are parallel to the optical axis O (Z-axis direction), the bottom surface B11 is perpendicular to the left limiting surface B12 and the right limiting surface B13, and the bottom surface B11, the left limiting surface B12 and the right limiting surface B13 are adjacent to the convex rib B1.

[0118] Please also refer to Fig.17 , Fig.18 ,in Fig.17 Indicates along Figure 3 The cross-sectional view of the line segment A1-A2 in Fig.18 Indicates along Figure 3 A cross-sectional view of the line segment A3-A4 in FIG.

[0119] like Fig.17 As shown, the magnetic element M is fixed to the inner surface of the housing H, and its position corresponds to the coil C on the carrier LH. When a current signal is applied to the coil C, the magnetic force generated between the coil C and the magnetic element M can drive the carrier LH and the optical element disposed therein to move relative to the base B and the housing H along the Z-axis direction, thereby achieving the function of auto focus (AF) or optical image stabilization (OIS).

[0120] In addition, if Fig.18 As shown, at least one conductive member P is embedded in the base B, wherein the end of the conductive member P has an L-shaped structure for electrically connecting to the circuit component F.

[0121] Please also read Fig.19 and Fig. 20 ,in Fig.19 A partially enlarged stereoscopic view showing the rib B1 on the base B, Fig. 20 A cross-sectional view showing the positioning ejector pin S contacting the conductive member P.

[0122] like Fig.19 As shown, at least one groove B2 and at least one inclined surface B21 are formed inside the rib B1, wherein the inclined surface B21 is located inside the groove B2 and at the corner of the L-shaped structure at the end of the conductive element P. Specifically, the shapes of the groove B2 and the inclined surface B21 are Fig. 20 The positioning pin S is defined by the positioning pin S in the plastic film forming process of the base B, because the positioning pin S will abut the conductive member P to prevent the conductive member P from shifting and maintain the L-shaped structure at its end. Since the end of the positioning pin S is formed with an inclined chamfered surface S1, the plastic base B will fill the gap G between the conductive member P and the chamfered surface S1 of the positioning pin S during the forming process ( Fig. 20 ), which will produce Fig.19 The inclined surface B21 shown in FIG.

[0123] Although the embodiments of the present invention and their advantages have been disclosed as above, it should be understood that those skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufactures, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any technician in the relevant technical field can understand the current or future developed processes, machines, manufactures, material compositions, devices, methods and steps from the disclosure of the present invention. As long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can all be used according to the present invention. Therefore, the scope of protection of the present invention includes the above-mentioned processes, machines, manufactures, material compositions, devices, methods and steps. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes the combination of each claim and embodiment.

[0124] Although the present invention has been disclosed above in terms of preferred embodiments, they are not intended to limit the present invention. Those skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A driving mechanism for driving an optical element to move, wherein the optical element has an optical axis, the driving mechanism comprising: a fixing portion; a movable part movably connected to the fixed part, wherein the optical element is disposed on the movable part; as well as A driving assembly is used to drive the movable part to move relative to the fixed part.

2. The driving mechanism as described in claim 1, wherein the driving mechanism also includes a quadrilateral upper elastic element, and the fixed part includes a shell and a base connected to each other, wherein the upper elastic element connects the movable part and the shell, and a plurality of grooves are formed at a corner of the upper elastic element.

3. The driving mechanism as claimed in claim 2, wherein the housing is formed with a concave structure, the concave structure is recessed toward the upper elastic element along the optical axis direction, and the upper elastic element is connected to the concave structure at the slot.

4. The driving mechanism as described in claim 1, wherein the driving mechanism also includes an upper elastic element, the fixed part includes a shell and a base connected to each other, and the upper elastic element connects the movable part and the shell, wherein the upper elastic element is formed with an opening, the movable part is formed with a groove, and the groove corresponds to the opening and is connected with the opening. 5 . The driving mechanism as claimed in claim 4 , wherein the movable portion further forms a protrusion located in the groove.

6. A driving mechanism as described in claim 1, wherein the driving mechanism also includes a lower elastic element, the fixed part includes a shell and a base connected to each other, and the lower elastic element connects the base and the movable part, wherein the lower elastic element has a positioning hole, the movable part is formed with a card block, and the card block is embedded in the positioning hole.

7. A driving mechanism as described in claim 1, wherein the driving mechanism also includes a lower elastic element, the fixed part includes a shell and a base connected to each other, and the lower elastic element connects the base and the movable part, wherein the lower elastic element has an opening, the movable part is formed with a recess, and the recess corresponds to the opening and is connected to the opening.

8. A driving mechanism as described in claim 1, wherein the driving mechanism also includes a lower elastic element and a wire, the fixed part includes a shell and a base connected to each other, and the lower elastic element connects the base and the movable part, wherein the driving component includes a coil arranged on the movable part and a magnetic element fixed to the inner side of the shell, the movable part forms a winding post, and the wire connects the coil and the winding post, wherein the lower elastic element has a recessed portion, and the recessed portion is adjacent to the winding post and electrically connected to each other.

9. A driving mechanism as described in claim 1, wherein the driving mechanism also includes a lower elastic element and a conductive member, the fixed portion includes a shell and a base connected to each other, and the lower elastic element connects the base and the movable portion, wherein the conductive member is embedded in the base, and one end of the conductive member is exposed on the top side of the base for electrically connecting the lower elastic element. 10 . The driving mechanism of claim 9 , wherein the base has a quadrilateral structure, and the end portion is located at a corner of the base.

11. The driving mechanism as claimed in claim 10, wherein the lower elastic element is formed with a long strip-shaped through hole, a long axis of the through hole is inclined relative to a side of the base, and the through hole and the end portion at least partially overlap in the direction of the optical axis.

12. The driving mechanism as claimed in claim 1, wherein the driving mechanism further comprises a circuit assembly, the fixing portion comprises a shell and a base connected to each other, and the base is formed with a convex rib, wherein the circuit assembly is fixed to the outer side of the convex rib.

13. The driving mechanism as described in claim 12, wherein the base is further formed with a bottom surface, a left limiting surface and a right limiting surface, wherein the bottom surface, the left limiting surface and the right limiting surface are adjacent to the convex rib, and the circuit component abuts against the bottom surface and one of the left limiting surface and the right limiting surface.

14. The driving mechanism of claim 13, wherein the circuit component is a circuit board. 15 . The driving mechanism as claimed in claim 14 , wherein the driving mechanism further comprises a magnetic field sensing element and a magnet, the magnet is disposed on the movable part, and the magnetic field sensing element is disposed on the circuit component to sense the position of the magnet.

16. The driving mechanism as described in claim 1, wherein the driving mechanism further comprises a circuit component and a conductive member, the fixing portion comprises a shell and a base connected to each other, the circuit component is fixed on the base, and the conductive member is embedded in the base to electrically connect the circuit component.

17. The driving mechanism of claim 16, wherein a terminal end of the conductive member has an L-shaped structure.

18. The driving mechanism of claim 17, wherein the conductive member is integrated into the base by insert molding.

19. The driving mechanism as claimed in claim 18, wherein the base is formed with a rib, the circuit component is fixed on the outer side of the rib, and the inner side of the rib is formed with a groove and a slope, wherein the slope is located in the groove and at the corner of the L-shaped structure. 20 . The driving mechanism of claim 1 , wherein the movable portion is in a quadrilateral shape, and a hole is formed on a top side of the movable portion, wherein the hole is located adjacent to a corner of the movable portion.