Liquid cooling flow determination method and apparatus, electronic device, and storage medium
By obtaining the thermal design power consumption and maximum frequency of the liquid-cooled server, adjusting the processor load to the maximum load, determining the relationship between the first frequency and the maximum frequency, and adjusting the current and liquid cooling flow, the problem of insufficient heat dissipation of the liquid-cooled server under full load is solved, the maximum liquid cooling flow is determined, and the efficiency and stability of the liquid cooling system are improved.
Patent Information
- Application Number
- CN202510121507.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2045-01-24
AI Technical Summary
In the prior art, when all processing cores of a processor of a liquid-cooled server are simultaneously running at full load, it is impossible to determine the liquid cooling flow rate that meets the maximum heat dissipation demand, resulting in insufficient heat dissipation.
By obtaining the thermal design power and maximum frequency of the liquid-cooled server, the initial liquid cooling flow rate, and adjusting the processor load to the maximum load, the relationship between the first frequency and the maximum frequency is determined. If the first frequency is greater than or equal to the maximum frequency, the initial liquid cooling flow rate is determined to be the maximum flow rate; if they are not equal, the current and liquid cooling flow rate are adjusted until the frequency equals the maximum frequency, and the final liquid cooling flow rate is determined.
It effectively determines the maximum liquid cooling flow required for liquid-cooled servers, ensuring that heat dissipation needs are met under maximum load, and improving the efficiency and stability of the liquid cooling system.
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Figure CN119960577B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of server technology, and in particular to a method, device, electronic device, and storage medium for determining liquid cooling flow. Background Art
[0002] Liquid-cooled servers dissipate heat from their processors through circulating coolant. In some scenarios, all processing cores of the processors in the liquid-cooled server need to run at full load simultaneously.
[0003] In related technologies, multiple temperature ranges are defined on the liquid cooling control terminal, with each temperature range corresponding to a preset liquid cooling flow rate. When the processor temperature reaches a certain temperature range, the liquid cooling flow rate of the liquid-cooled server is set according to the preset liquid cooling flow rate corresponding to that temperature range. However, when all processing cores of the processor are running at full load simultaneously, the processor power consumption reaches its maximum value, resulting in the liquid cooling flow rate determined by the above method being unable to meet the heat dissipation requirements of the liquid cooling server. Therefore, a method for determining the maximum liquid cooling flow rate required by a liquid cooling server is urgently needed. Summary of the Invention
[0004] The present application provides a method, apparatus, device and storage medium for determining a liquid cooling flow rate, which are used to determine the maximum liquid cooling flow rate required by a liquid cooling server.
[0005] This application provides a method for determining liquid cooling flow, comprising:
[0006] Get the thermal design power consumption and maximum frequency of the liquid-cooled server;
[0007] Determine the initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and control the liquid cooling system to cool the liquid cooling server according to the initial liquid cooling flow rate;
[0008] Adjusting a processor load of the liquid-cooling server to a maximum load, and obtaining a first frequency of the liquid-cooling server under the maximum load;
[0009] If the first frequency is greater than or equal to the maximum frequency, the initial liquid cooling flow rate is determined as the maximum liquid cooling flow rate;
[0010] If the first frequency is less than the maximum frequency, the liquid cooling server is subjected to at least one current adjustment process and a liquid cooling flow adjustment process until the frequency of the liquid cooling server is equal to the maximum frequency, and the maximum liquid cooling flow is determined.
[0011] The present application provides a device for determining a liquid cooling flow rate, comprising:
[0012] An acquisition module, used to obtain the thermal design power consumption and maximum frequency of the liquid cooling server;
[0013] a processing module, configured to determine an initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and control the liquid cooling system to cool the liquid cooling server according to the initial liquid cooling flow rate;
[0014] an adjustment module, configured to adjust a processor load of the liquid cooling server to a maximum load and obtain a first frequency of the liquid cooling server under the maximum load;
[0015] a first determining module, configured to determine the initial liquid cooling flow rate as the maximum liquid cooling flow rate if the first frequency is greater than or equal to the maximum frequency;
[0016] The second determination module is used to perform at least one current adjustment process and liquid cooling flow adjustment process on the liquid cooling server if the first frequency is less than the maximum frequency, until the frequency of the liquid cooling server is equal to the maximum frequency, and determine the maximum liquid cooling flow.
[0017] The present application also provides an electronic device, comprising: a memory for storing a computer program; and a processor for implementing the steps of any of the above-mentioned methods for determining a liquid cooling flow rate when executing the computer program.
[0018] The present application also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of any of the above-mentioned methods for determining the liquid cooling flow rate are implemented.
[0019] The liquid cooling flow determination method, device, electronic device, and storage medium provided in the embodiments of the present application control the liquid cooling system to liquid-cool the liquid-cooled server according to the initial liquid cooling flow, and when the liquid cooling server is liquid-cooled according to the initial liquid cooling flow, the processor load of the liquid cooling server is adjusted to the maximum load, and then the size between the first frequency and the maximum frequency of the liquid cooling server under the maximum load is determined. When the first frequency is greater than or equal to the maximum frequency, the initial liquid cooling flow is determined as the maximum liquid cooling flow; when the first frequency is less than the maximum frequency, the liquid cooling server is subjected to at least one current adjustment process and liquid cooling flow adjustment process, so that the frequency of the liquid cooling server under the adjusted current gradually increases until the frequency of the liquid cooling server is equal to the maximum frequency, and then the liquid cooling flow of the liquid cooling server at this time is determined as the maximum liquid cooling flow. The above method can be used to determine the maximum liquid cooling flow required by the liquid cooling server. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0021] Figure 1 Schematic diagram of application scenarios provided by embodiments of the present application;
[0022] Figure 2 A schematic diagram of a method for determining liquid cooling flow provided in an embodiment of the present application Figure 1 ;
[0023] Figure 3 A schematic diagram of a process for determining a maximum liquid cooling flow rate provided in an embodiment of the present application;
[0024] Figure 4 A schematic diagram of the structure of a remote control terminal provided in an embodiment of the present application;
[0025] Figure 5 A schematic diagram of a method for determining liquid cooling flow provided in an embodiment of the present application Figure 2 ;
[0026] Figure 6 A schematic structural diagram of a device for determining a liquid cooling flow rate provided in an embodiment of the present application;
[0027] Figure 7 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION
[0028] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0029] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.
[0030] First, let’s explain the terms involved in this application:
[0031] Liquid-cooled servers use liquid cooling to dissipate heat from heat-generating components such as processors. Common examples of liquid-cooled servers include cold plate-type servers. For example, a cold plate-type server includes a cold plate with fluid channels designed within it, through which coolant circulates. Cold plate-type servers transfer heat generated by heat-generating components such as processors to the circulating coolant, dissipating the heat.
[0032] In the related art, at least one temperature interval is determined at the liquid cooling control end, and each temperature interval corresponds to a preset liquid cooling flow rate. For any one of the at least one temperature intervals, when the temperature of the processor is in the temperature interval, the cooling liquid control end determines the liquid cooling flow rate of the liquid cooling server based on the preset liquid cooling flow rate corresponding to the temperature interval. However, when the processor is at maximum load, the power consumption of the processor will reach a maximum value. In order for the liquid cooling flow rate to be able to meet the heat dissipation requirements of the processor, it is necessary to determine the maximum liquid cooling flow rate required by the processor. Furthermore, when the processor is at maximum load, the processing core of the processor usually cannot reach the maximum frequency. It is necessary to perform current adjustment processing on the liquid cooling server so that all processing cores of the processor reach the maximum frequency. In the process of performing current adjustment processing on the liquid cooling server, the power consumption of the liquid cooling server increases. In order for the liquid cooling system to be able to meet the heat dissipation requirements of the liquid cooling server in a timely manner, it is necessary to determine the maximum liquid cooling flow rate required by the liquid cooling server after each current adjustment processing on the liquid cooling server.
[0033] An embodiment of the present application provides a method for determining a liquid cooling flow rate. By judging the size between a first frequency and a maximum frequency of a liquid cooling server under maximum load, when the first frequency is greater than or equal to the maximum frequency, the initial liquid cooling flow rate of the liquid cooling server at the first frequency is determined as the maximum liquid cooling flow rate; when the first frequency is less than the maximum frequency, the liquid cooling server is subjected to at least one current adjustment process and a liquid cooling flow adjustment process, so that the frequency of the liquid cooling server gradually increases after the current adjustment until the frequency of the liquid cooling server is equal to the maximum frequency, and then, the liquid cooling flow rate of the liquid cooling server at this time is determined as the maximum liquid cooling flow rate, thereby achieving the determination of the maximum liquid cooling flow rate required by the liquid cooling server.
[0034] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.
[0035] Combined with the specific application scenarios on which the method for determining the liquid cooling flow rate depends, the specific application scenarios are described here. Figure 1 , Figure 1 This is a schematic diagram of an application scenario provided by an embodiment of the present application. Figure 1As shown, it includes a liquid cooling server 11, a remote control terminal 12 and a liquid cooling control terminal 13. The liquid cooling server 11 refers to a server that dissipates heat for heat-generating components such as the server's processor by liquid cooling. The liquid cooling server 11 can be, for example, a cold plate liquid cooling server.
[0036] During actual application, the liquid cooling server 11 can communicate with the remote control terminal 12 through the internal network or management system of the liquid cooling server. For example, the remote control terminal 12 can send an information acquisition request to the liquid cooling server 11, and the liquid cooling server 11 can send status information to the remote control terminal 12; the remote control terminal 12 can communicate with the liquid cooling control terminal 13, for example, the remote control terminal 12 sends the liquid cooling flow to the liquid cooling control terminal 13; the liquid cooling system can be set through the liquid cooling control terminal 13 to perform liquid cooling on the liquid cooling server 11. The liquid cooling flow.
[0037] It should be noted that Figure 1 This is just an example to illustrate an application scenario, and is not intended to limit the application scenario.
[0038] The following specific embodiments describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.
[0039] Figure 2 A schematic diagram of a method for determining liquid cooling flow provided in an embodiment of the present application Figure 1 .like Figure 2 As shown, the method includes:
[0040] S201: Obtain the thermal design power consumption and maximum frequency of a liquid cooling server.
[0041] The execution subject of the present application may be a remote control terminal, or a liquid cooling flow determination device provided in the remote control terminal. The liquid cooling flow determination device may be implemented through software, or through a combination of software and hardware.
[0042] The TDP of a liquid-cooled server refers to the TDP of the processor in the server. TDP is an indicator of the amount of heat generated by the processor, indicating the amount of heat generated when the processor is at maximum load. The unit of TDP is watts (W). Typically, the TDP of a processor is a fixed value, determined and marked by the processor manufacturer at the factory. TDP can be used to determine the maximum heat dissipation required by the liquid cooling system of a liquid-cooled server to dissipate heat from the processor, ensuring normal operation of the processor under full load without overheating.
[0043] The maximum frequency of a liquid-cooled server refers to the maximum frequency of the processor in the server. The maximum frequency is the maximum frequency a processor can reach during operation and indicates the processor's maximum performance. Typically, the maximum performance of a processor is a fixed value, determined and marked by the processor manufacturer at the factory. For example, the maximum frequency of a processor can be the processor's nominal maximum frequency.
[0044] S202: Determine an initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and control the liquid cooling system to liquid-cool the liquid cooling server according to the initial liquid cooling flow rate.
[0045] A liquid cooling system is a system used to cool the processor in a liquid-cooled server. Liquid cooling flow rate refers to the volume of liquid flowing per unit time. Liquid cooling flow rate can be expressed in liters per minute (L / min), representing the volume of liquid flowing per minute. Therefore, when a liquid cooling system cools a server, a greater flow rate provides greater heat dissipation to the processor; a smaller flow rate reduces heat dissipation to the processor. Therefore, when a liquid cooling system cools a server, controlling the flow rate is crucial to maintain the processor temperature within an appropriate range.
[0046] The initial liquid cooling flow rate refers to the liquid cooling flow rate determined based on the thermal design power consumption. When the liquid cooling system cools the liquid-cooled server based on the initial liquid cooling flow rate, the heat dissipation requirements of the liquid-cooled server can be met within the thermal design power consumption. In some embodiments, the method for controlling the liquid cooling system to cool the liquid-cooled server based on the initial liquid cooling flow rate can be as follows: the initial liquid cooling flow rate is sent to a liquid cooling control terminal. Upon receiving the initial liquid cooling flow rate, the liquid cooling control terminal sets the liquid cooling flow rate in the liquid cooling system to the initial liquid cooling flow rate, thereby cooling the liquid-cooled server using the initial liquid cooling flow rate.
[0047] For example, assuming that the initial liquid cooling flow rate is 10L / min, the remote control end sends the initial liquid cooling flow rate to the liquid cooling control end. After receiving the initial liquid cooling flow rate, the liquid cooling control end sets the liquid cooling flow rate in the liquid cooling system to 10L / min. Then, the liquid cooling system liquid cools the liquid-cooled server according to the liquid cooling flow rate of 10L / min.
[0048] S203: Adjust the processor load of the liquid cooling server to a maximum load, and obtain a first frequency of the liquid cooling server under the maximum load.
[0049] Adjusting the processor load of a liquid-cooled server to maximum load means ensuring that all processing cores of the processor in the liquid-cooled server are operating at full load. The first frequency of the liquid-cooled server at maximum load refers to the frequency at which the processor of the liquid-cooled server stably operates at maximum load. The first frequency indicates the performance ceiling of the processor under the current liquid cooling conditions.
[0050] S204: If the first frequency is greater than or equal to the maximum frequency, the initial liquid cooling flow rate is determined as the maximum liquid cooling flow rate.
[0051] If the first frequency is greater than or equal to the maximum frequency, it indicates that the liquid cooling system can meet the liquid cooling requirements of the processor at the maximum frequency when performing liquid cooling according to the initial liquid cooling flow rate. Therefore, the initial liquid cooling flow rate can be determined as the maximum liquid cooling flow rate.
[0052] For example, if the first frequency is 30 Hz, the maximum frequency is 30 Hz, and the initial liquid cooling flow rate is 10 L / min, since the first frequency is equal to the maximum frequency, the initial liquid cooling flow rate of 10 L / min is determined as the maximum liquid cooling flow rate, that is, the maximum liquid cooling flow rate is determined to be 10 L / min.
[0053] S205: If the first frequency is less than the maximum frequency, perform at least one current adjustment process and a liquid cooling flow adjustment process on the liquid cooling server until the frequency of the liquid cooling server is equal to the maximum frequency, and then determine the maximum liquid cooling flow.
[0054] When the first frequency is less than the maximum frequency, it means that the liquid cooling system cannot meet the liquid cooling demand of the processor at the maximum frequency when dissipating heat with the initial liquid cooling flow rate. Therefore, it is necessary to perform at least one current adjustment process and liquid cooling flow adjustment process on the liquid cooling server. Performing at least one current adjustment on the liquid cooling server means adjusting the load current of the processor in the liquid cooling server at least once. Since the load current of the processor is positively correlated with the frequency, specifically, the greater the load current of the processor, the greater the frequency; the smaller the load current of the processor, the smaller the frequency. Therefore, by adjusting the load current of the processor in the liquid cooling server at least once, the frequency of the liquid cooling server can be adjusted until the frequency of the liquid cooling server is equal to the maximum frequency, and the liquid cooling flow rate at this time is the maximum liquid cooling flow rate.
[0055] When a liquid-cooled server undergoes at least one current adjustment, the load current of the processor in the server increases, correspondingly generating more heat. Therefore, to maintain the processor temperature within a suitable range, the liquid cooling flow rate must be adjusted accordingly after the current adjustment to ensure that the liquid cooling flow rate meets the processor's cooling requirements.
[0056] exist Figure 2In the illustrated embodiment, a liquid cooling system is controlled based on an initial liquid cooling flow rate to cool a liquid-cooled server. While the server is being cooled based on the initial liquid cooling flow rate, the processor load of the server is adjusted to a maximum load. The difference between the first frequency and the maximum frequency of the server under maximum load is then determined. If the first frequency is greater than or equal to the maximum frequency, the initial liquid cooling flow rate is determined as the maximum liquid cooling flow rate. If the first frequency is less than the maximum frequency, the server undergoes at least one current adjustment and a liquid cooling flow rate adjustment, gradually increasing the frequency of the server under the adjusted current until the frequency of the server equals the maximum frequency. The liquid cooling flow rate of the server at this point is then determined as the maximum liquid cooling flow rate. This method can determine the maximum liquid cooling flow rate required by the server.
[0057] exist Figure 2 Based on the embodiment shown below, combined with Figure 3 The process of determining the maximum liquid cooling flow rate when the first frequency is less than the maximum frequency is further described.
[0058] Figure 3 A schematic diagram of a process for determining the maximum liquid cooling flow rate provided in an embodiment of the present application is shown in FIG. Figure 3 As shown, the process may include the following steps:
[0059] S301, i is initialized to 1.
[0060] S302 : Perform an i-th current adjustment process on the liquid cooling server to obtain an i-th current, and obtain an i-th frequency of the liquid cooling server under the i-th current.
[0061] Here, the i-th current refers to the current obtained after the i-th current adjustment process is performed on the liquid-cooled server; the i-th frequency refers to the frequency of the liquid-cooled server at the i-th current after the i-th current adjustment process is performed on the liquid-cooled server. Exemplarily, the first current is obtained after the first current adjustment of the liquid-cooled server, and the frequency of the liquid-cooled server at the first current is the first frequency; the second current adjustment of the liquid-cooled server results in the second current, and the frequency of the liquid-cooled server at the second current is the second frequency. i is sequentially 1, 2, ..., until the i-th frequency is greater than or equal to the maximum frequency. Exemplarily, if the 5th frequency is equal to the maximum frequency, i is sequentially 1, 2, 3, 4, 5; if the 7th frequency is equal to the maximum frequency, i is sequentially 1, 2, 3, 4, 5, 6, 7.
[0062] In some embodiments, the liquid-cooled server is subjected to the i-th current adjustment process, and the i-th current is obtained as follows: if i is 1, the preset reference current is determined as the i-th current; if i is greater than 1, the adjustment ratio is determined based on i, and the product of the reference current and the adjustment ratio is determined as the i-th current, and the adjustment ratio is a positive number greater than 1.
[0063] The higher the frequency of a liquid-cooled server, the greater its power consumption. The lower the power consumption, the lower the frequency. The higher the frequency, the better, and the lower the power consumption, the better. Therefore, for liquid-cooled servers, the frequency and power consumption must be within an appropriate range. A preset baseline current is used, and under this current, the frequency and power consumption of the liquid-cooled server are balanced.
[0064] The liquid cooling server can be subjected to the i-th current adjustment process by adjusting the ratio to obtain the i-th current. In the process of adjusting the i-th current of the liquid cooling server, different i corresponds to different adjustment ratios. Specifically, the adjustment ratio can be determined by calculating i, and the formula for calculating the adjustment ratio by i can be shown as formula (1):
[0065] N=100 / (100-n) (1)
[0066] Where N is the adjustment ratio, and n is i-1. For example, when the second current adjustment is performed on the liquid cooling server, the adjustment ratio is When the third current adjustment is performed on the liquid cooling server, the adjustment ratio is
[0067] Exemplarily, if i=1, the reference current is determined to be the first current, that is, the first current is equal to the preset reference current. At this time, the first frequency of the liquid cooling server is equal to the square of the first current multiplied by the resistance of the liquid cooling server, that is, the first frequency is equal to the square of the reference current multiplied by the resistance of the liquid cooling server. Exemplarily, if the first current is I, the resistance of the liquid cooling server is R, the first frequency of the liquid cooling server is P1, and the preset reference current is X, then P1=I 2 *R=X 2 *R.
[0068] For example, if i=3, the reference current is X, and the adjustment ratio is determined based on i=3: According to the reference current adjustment ratio, the third current can be determined as: At this time, the third frequency of the liquid cooling server is equal to the square of the third current multiplied by the resistance of the liquid cooling server, that is, the third frequency is equal to For example, if the third current is I, the resistance of the liquid cooling server is R, and the third frequency of the liquid cooling server is P3, then P3=I2 *R=(100 / 98*X) 2 *R.
[0069] S303: Determine the i-th power of the liquid cooling server according to the i-th current.
[0070] The i-th power represents the power consumption of the liquid-cooled server at the i-th current. The i-th power of the liquid-cooled server is equal to the i-th frequency of the liquid-cooled server. Therefore, the i-th power of the liquid-cooled server can be determined based on the i-th current by determining the i-th frequency of the liquid-cooled server at the i-th current, and determining the i-th frequency as the i-th power of the liquid-cooled server.
[0071] Exemplarily, assuming i=4, the fourth frequency of the liquid-cooled server at the fourth current is P4, then P4 is determined as the fourth power of the liquid-cooled server, that is, the fourth power of the liquid-cooled server is determined to be P4.
[0072] S304: Determine an i-th liquid cooling flow rate of the liquid cooling server according to the i-th power, and control the liquid cooling system to liquid-cool the liquid cooling server according to the i-th liquid cooling flow rate.
[0073] After the i-th current adjustment process is performed on the liquid-cooled server, the processor of the liquid-cooled server generates more heat. In order for the liquid cooling system to meet the heat dissipation requirements of the liquid-cooled server, the liquid cooling flow rate needs to be adjusted accordingly.
[0074] The i-th liquid cooling flow rate refers to the liquid cooling flow rate required by the liquid-cooled server when the frequency of the liquid-cooled server is the i-th frequency. The i-th liquid cooling flow rate of the liquid-cooled server can be determined based on the i-th power as follows: determining the specific heat capacity and density of the coolant in the liquid-cooled server; determining the temperature difference corresponding to the liquid-cooled server, where the temperature difference is the difference between the temperature of the coolant after passing through the liquid-cooled server and the temperature of the coolant before passing through the liquid-cooled server; and determining the i-th liquid cooling flow rate based on the i-th power, specific heat capacity, density, and temperature difference.
[0075] The coolant in a liquid-cooled server refers to the liquid used for cooling. The specific heat capacity of the coolant indicates the energy absorbed when the temperature increases by 1°C, or the energy released when the temperature decreases by 1°C. The unit of specific heat capacity is joules per kilogram per degree Celsius (J / kg*C). The temperature differential for a liquid-cooled server is measured in degrees Celsius (C). To ensure stable operating temperatures, the temperature differential for liquid-cooled servers is typically fixed and can be set in advance based on demand.
[0076] The liquid cooling power consumption of the liquid cooling system can be calculated by the liquid cooling flow rate, specific heat capacity, density and temperature difference. The calculation formula can be shown as formula (2):
[0077] P Q=Cp*ρ*Q*ΔT (2)
[0078] Where Q represents the liquid cooling flow rate, P Q It represents the liquid cooling power consumption of the liquid cooling system when the liquid cooling flow rate is Q, Cp is the specific heat capacity of the coolant, ρ is the density of the coolant, and ΔT represents the temperature difference corresponding to the liquid-cooled server.
[0079] When the liquid cooling system cools the liquid cooling server, the liquid cooling power consumption of the liquid cooling system is consistent with the power of the liquid cooling server. In this case, the liquid cooling system can meet the heat dissipation requirements of the liquid cooling server. Based on this, when the power of the liquid cooling server is the i-th power, the i-th liquid cooling flow rate can be calculated based on the i-th power of the liquid cooling server, the specific heat capacity, density, and temperature difference of the coolant. The calculation formula can be shown as formula (3):
[0080] Q i =P i / (Cp*ρ*ΔT) (3)
[0081] Among them, Q i is the i-th liquid cooling flow rate, P i is the i-th power of the liquid-cooled server.
[0082] After calculating the i-th liquid cooling flow rate, the liquid cooling system can be controlled according to the i-th liquid cooling flow rate to cool the liquid-cooled server. The method of controlling the liquid cooling system to cool the liquid-cooled server according to the i-th liquid cooling flow rate is the same as the method of controlling the liquid cooling system to cool the liquid-cooled server according to the processing liquid cooling flow rate, and will not be repeated here.
[0083] S305: Determine whether the i-th frequency is greater than or equal to the maximum frequency.
[0084] If yes, execute S307;
[0085] If not, execute S306.
[0086] S306, update i to i+1.
[0087] When the i-th frequency is less than the maximum frequency, the processing cores in the liquid-cooled server have not yet reached their maximum frequency. Consequently, the power consumption of the liquid-cooled server has not yet reached its maximum. The liquid cooling system, using the i-th liquid cooling flow rate, cannot meet the server's maximum heat dissipation requirements. Therefore, the i+1th current adjustment is required for the liquid-cooled server.
[0088] S307: Determine the i-th liquid cooling flow rate as the maximum liquid cooling flow rate.
[0089] When the i-th frequency is greater than or equal to the maximum frequency, the processing core in the liquid-cooled server has reached its maximum frequency. At this point, the power consumption of the liquid-cooled server has reached its maximum. The liquid cooling system can meet the maximum heat dissipation requirement of the liquid-cooled server when cooling the server at the i-th liquid cooling flow rate. Therefore, the i-th liquid cooling flow rate is determined as the maximum liquid cooling flow rate.
[0090] exist Figure 3 In the illustrated embodiment, a liquid-cooled server undergoes current adjustment processing i times. During the i-th current adjustment process, an adjustment ratio is determined based on i, and then the i-th current is determined based on the adjustment ratio and a preset reference current. After determining the i-th current, the i-th frequency of the liquid-cooled server at the i-th current is determined, and then the i-th liquid cooling flow rate of the liquid-cooled server is determined. The liquid cooling system is controlled based on the i-th liquid cooling flow rate to cool the server until the i-th frequency equals the maximum frequency. The i-th liquid cooling flow rate of the liquid-cooled server at the i-th frequency is determined as the maximum liquid cooling flow rate. In the above method, the liquid-cooled server undergoes current adjustment processing multiple times until the frequency of the liquid-cooled server equals the maximum frequency, and the liquid cooling flow rate of the liquid-cooled server at this time is determined as the maximum liquid cooling flow rate, thereby determining the maximum liquid cooling flow rate required by the liquid-cooled server. In addition, during the process of multiple current adjustment processing of the liquid-cooled server, the liquid cooling flow of the liquid-cooled server is adjusted accordingly, so that when the frequency of the liquid-cooled server increases, the liquid cooling flow of the liquid cooling system when liquid cooling the liquid-cooled server increases accordingly, thereby meeting the heat dissipation requirements of the liquid-cooled server during the current adjustment processing and improving the efficiency and stability of the liquid cooling system.
[0091] In some embodiments, the remote control terminal may include multiple modules. Figure 4 To understand, Figure 4 A schematic diagram of the structure of a remote control terminal provided in an embodiment of the present application is shown in FIG. Figure 4 As shown, the remote control terminal 40 includes an information collection module 41, a pressurization execution module 42, a voltage regulator (VR) optimization module 43, a data processing module 44, and a task delivery module 45. The information collection module 41, the pressurization execution module 42, the VR optimization module 43, the data processing module 44, and the task delivery module 45 can communicate with each other. Furthermore, the information collection module 41 can communicate with the liquid cooling server to obtain information about the liquid cooling server. The pressurization execution module 42 can communicate with the liquid cooling server to send a program startup instruction to the liquid cooling server.
[0092] The VR optimization module 43 can adjust the load current of the processor in the liquid-cooled server, and then adjust the frequency of the liquid-cooled server. For example, a reference current is preset in the VR optimization module, and the frequency and power consumption of the liquid-cooled server under the reference current are relatively balanced. The load current of the processor in the liquid-cooled server can be obtained, and the load current is compared with the preset reference current. If the load current of the liquid-cooled server is less than the preset reference current, it means that the frequency of the liquid-cooled server is small at this time. The load current of the liquid-cooled server is adjusted so that the load current is equal to the reference current, thereby increasing the frequency of the liquid-cooled server; if the load current of the liquid-cooled server is greater than the preset reference current, it means that the power consumption of the liquid-cooled server is large at this time. The load current of the liquid-cooled server is adjusted so that the load current is equal to the reference current, thereby reducing the power consumption of the liquid-cooled server.
[0093] In some embodiments, the liquid-cooled server includes a current register, and the power control unit of the liquid-cooled server stores the load current value of the liquid-cooled server in the current register through the bus of the liquid-cooled server. The VR optimization module can read the current load current of the liquid-cooled server from the current register.
[0094] The task issuing module 45 can communicate with the liquid cooling control terminal to send the liquid cooling flow value to the liquid cooling control terminal.
[0095] Based on the above embodiments, Figure 5 The method for determining the liquid cooling flow rate in this application is further introduced.
[0096] Figure 5 A schematic diagram of a method for determining liquid cooling flow provided in an embodiment of the present application Figure 2 , see Figure 5 , the method may include the following steps:
[0097] S501: Obtain the thermal design power consumption and maximum frequency of a liquid cooling server.
[0098] The thermal design power consumption and maximum frequency of the liquid-cooled server can be obtained through the information collection module. The way in which the information collection module obtains the thermal design power consumption and maximum frequency of the liquid-cooled server can be as follows: sending an information acquisition request to the liquid-cooled server, the information acquisition request is used to request the status information of the processor of the liquid-cooled server; receiving the status information sent by the liquid-cooled server, the status information including the thermal design power consumption and maximum frequency.
[0099] Exemplarily, the information collection module sends an information acquisition request to the liquid cooling server, requesting to acquire status information of the processor of the liquid cooling server. After receiving the information acquisition request, the liquid cooling server sends the status information to the information collection module.
[0100] S502: Determine an initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and control the liquid cooling system to perform liquid cooling on the liquid cooling server according to the initial liquid cooling flow rate.
[0101] According to the thermal design power consumption, the formula for determining the initial liquid cooling flow corresponding to the liquid cooling server can be shown as formula (4):
[0102] Q f =TDP / (Cp*ρ*ΔT) (4)
[0103] Among them, TDP is thermal design power consumption, Q f The initial liquid cooling flow rate refers to the liquid cooling flow rate that the liquid cooling system needs to provide when cooling the liquid-cooled server under the thermal design power consumption.
[0104] The task delivery module can control the liquid cooling system to cool the liquid-cooled server based on the initial liquid cooling flow rate. For example, the task delivery module sends the initial liquid cooling flow rate to the liquid cooling control terminal. Upon receiving the initial liquid cooling flow rate, the liquid cooling control terminal determines the liquid cooling flow rate in the liquid cooling system based on the initial liquid cooling flow rate.
[0105] S503: Adjust the processor load of the liquid cooling server to a maximum load, and obtain a first frequency of the liquid cooling server under the maximum load.
[0106] The processor load of the liquid-cooled server can be adjusted to the maximum load through the pressure execution module. The specific implementation method can be as follows: a program startup instruction is sent to the liquid-cooled server, and the program startup instruction is used to start the processor stress testing program in the liquid-cooled server, and the processor stress testing program is used to adjust the processor load of the liquid-cooled server to the maximum load.
[0107] Exemplary: the pressure execution module sends a program start instruction to the liquid cooling server. After receiving the program start instruction, the liquid cooling server starts the processor stress test program in the liquid cooling server according to the program start instruction and adjusts the processor load of the liquid cooling server to the maximum load.
[0108] When the liquid cooling server is under maximum load, the first frequency of the liquid cooling server under maximum load is calculated based on the load current of the liquid cooling server at this time. The calculation formula can be shown as formula (5):
[0109] P = I 2 * R (5)
[0110] Wherein, P is the first frequency, I is the load current of the liquid cooling server at this time, and R is the resistance of the liquid cooling server.
[0111] S504, determining whether the first frequency is greater than or equal to the maximum frequency;
[0112] If yes, execute S505;
[0113] If not, execute S505.
[0114] S505: Determine the initial liquid cooling flow rate as the maximum liquid cooling flow rate.
[0115] S506, i is updated to i+1.
[0116] S507 , performing an i-th current adjustment process on the liquid cooling server to obtain an i-th current, and obtaining an i-th frequency of the liquid cooling server under the i-th current.
[0117] The VR optimization module may be used to perform an i-th current adjustment process on the liquid-cooled server to obtain an i-th current, and obtain an i-th frequency of the liquid-cooled server under the i-th current.
[0118] The specific implementation of performing the i-th current adjustment process on the liquid cooling server to obtain the i-th current and obtaining the i-th frequency of the liquid cooling server under the i-th current can be found in Figure 3 Step S302 in the illustrated embodiment will not be described in detail here.
[0119] After obtaining the i-th frequency of the liquid-cooled server at the i-th current, the VR optimization module sends the i-th current and the i-th frequency to the data processing module.
[0120] S508: Determine the i-th power of the liquid cooling server according to the i-th current.
[0121] The i-th power of the liquid cooling server can be determined by the data processing module. After receiving the i-th current and the i-th frequency, the data processing module determines the i-th frequency of the liquid cooling server at the i-th current as the i-th power of the liquid cooling server.
[0122] S509: Determine an i-th liquid cooling flow rate of the liquid cooling server according to the i-th power.
[0123] The data processing module can determine the i-th liquid cooling flow rate of the liquid cooling server according to the i-th power. The specific embodiment of determining the i-th liquid cooling flow rate of the liquid cooling server can be referred to Figure 3 S304 in the illustrated embodiment will not be described in detail here.
[0124] S510: Control the liquid cooling system to perform liquid cooling on the liquid-cooled server according to the i-th liquid cooling flow rate.
[0125] The manner in which the liquid cooling system is controlled to cool the liquid cooling server according to the i-th liquid cooling flow rate is the same as the manner in which the liquid cooling system is controlled to cool the liquid cooling server according to the initial liquid cooling flow rate, and will not be further elaborated here.
[0126] S511, determining whether the i-th frequency is greater than or equal to the maximum frequency;
[0127] If yes, execute S513;
[0128] If not, execute S512.
[0129] S512, update i to 1.
[0130] When the i-th frequency is less than the maximum frequency, the current adjustment process is continued for the liquid-cooled server. It should be noted that the i+1-th current adjustment process is performed on the liquid-cooled server at this time.
[0131] S513: Determine the i-th liquid cooling flow rate as the maximum liquid cooling flow rate.
[0132] In some embodiments, the method for determining the liquid cooling flow provided in the embodiments of the present application also includes: determining the working state of the liquid cooling server; when the working state is a pressurized state, controlling the liquid cooling system to perform liquid cooling for the liquid cooling server according to the maximum liquid cooling flow, and the pressurized state is used to indicate that the liquid cooling server is working under maximum load.
[0133] For example, after obtaining the maximum liquid cooling flow required by a liquid-cooled server using the method for determining the liquid cooling flow provided in an embodiment of the present application, when the liquid cooling server is operating normally, it is determined whether the operating state of the liquid cooling server is pressurized, that is, whether the liquid cooling server is operating under maximum load. If the liquid cooling server is operating under maximum load, the liquid cooling system is controlled based on the maximum liquid cooling flow to cool the liquid cooling server. In this case, when the liquid cooling system uses the maximum liquid cooling flow to cool the liquid cooling system, the heat dissipation requirements of the liquid cooling server under maximum load can be met.
[0134] exist Figure 5In the illustrated embodiment, by determining the difference between the first frequency and the maximum frequency of the liquid-cooled server at maximum load, if the first frequency is greater than or equal to the maximum frequency, the initial liquid cooling flow rate of the liquid-cooled server at the first frequency is determined as the maximum liquid cooling flow rate. If the first frequency is less than the maximum frequency, the liquid-cooled server is subjected to at least one current adjustment process and a liquid cooling flow rate adjustment process, so that the frequency of the liquid-cooled server gradually increases after the current adjustment until the frequency of the liquid-cooled server equals the maximum frequency. Then, the liquid cooling flow rate of the liquid-cooled server at this time is determined as the maximum liquid cooling flow rate, thereby determining the maximum liquid cooling flow rate required by the liquid-cooled server. Secondly, during the process of performing the current adjustment process on the liquid-cooled server, the power consumption of the liquid-cooled server continues to increase. To ensure normal heat dissipation of the liquid-cooled server, the liquid cooling flow rate of the liquid-cooled server is adjusted accordingly after each current adjustment process on the liquid-cooled server, so that the liquid cooling system can promptly meet the heat dissipation requirements of the liquid-cooled server during the current adjustment process, thereby improving the efficiency and stability of the liquid cooling system.
[0135] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method.
[0136] Figure 6 A schematic diagram of a liquid cooling flow determination device provided in an embodiment of the present application is shown in FIG. Figure 6 As shown, the liquid cooling flow determination device 60 provided in the embodiment of the present application includes:
[0137] An acquisition module 61 is configured to acquire a thermal design power consumption and a maximum frequency of a liquid cooling server;
[0138] The processing module 62 is used to determine an initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and control the liquid cooling system to cool the liquid cooling server according to the initial liquid cooling flow rate;
[0139] an adjusting module 63, configured to adjust the processor load of the liquid cooling server to a maximum load and obtain a first frequency of the liquid cooling server under the maximum load;
[0140] a first determining module 64 for determining the initial liquid cooling flow rate as the maximum liquid cooling flow rate if the first frequency is greater than or equal to the maximum frequency;
[0141] The second determination module 65 is configured to perform at least one current adjustment process and a liquid cooling flow adjustment process on the liquid cooling server if the first frequency is less than the maximum frequency, until the frequency of the liquid cooling server is equal to the maximum frequency, and then determine the maximum liquid cooling flow.
[0142] In a possible implementation, the second determining module 65 is specifically configured to:
[0143] Performing an i-th current adjustment process on the liquid-cooled server to obtain an i-th current, and obtaining an i-th frequency of the liquid-cooled server under the i-th current;
[0144] Determine the i-th power of the liquid-cooled server according to the i-th current;
[0145] Determine an i-th liquid cooling flow rate of the liquid cooling server according to the i-th power, and control the liquid cooling system to liquid-cool the liquid cooling server according to the i-th liquid cooling flow rate;
[0146] Here, i is sequentially set to 1, 2, ..., until the i-th frequency is greater than or equal to the maximum frequency, and the i-th liquid cooling flow rate is determined as the maximum liquid cooling flow rate.
[0147] In a possible implementation, the second determining module 65 is specifically configured to:
[0148] If i is 1, the preset reference current is determined as the i-th current;
[0149] If i is greater than 1, the adjustment ratio is determined according to i, and the product of the reference current and the adjustment ratio is determined as the i-th current, and the adjustment ratio is a positive number greater than 1.
[0150] In a possible implementation, the second determining module 65 is specifically configured to:
[0151] Determine the specific heat capacity and density of the coolant for liquid-cooled servers;
[0152] Determine a temperature difference corresponding to the liquid-cooled server, where the temperature difference is the difference between the temperature of the coolant after passing through the liquid-cooled server and the temperature of the coolant before passing through the cooling server;
[0153] Determine the i-th liquid cooling flow rate according to the i-th power, specific heat capacity, density and temperature difference.
[0154] In a possible implementation, the acquisition module 61 is specifically configured to:
[0155] Sending an information acquisition request to the liquid cooling server, where the information acquisition request is used to request status information of a processor of the liquid cooling server;
[0156] Receive status information sent by the liquid cooling server, where the status information includes thermal design power consumption and maximum frequency.
[0157] In a possible implementation, the adjustment module 63 is specifically configured to:
[0158] A program start instruction is sent to the liquid cooling server. The program start instruction is used to start a processor stress testing program in the liquid cooling server. The processor stress testing program is used to adjust the processor load of the liquid cooling server to the maximum load.
[0159] In a possible implementation manner, the device for determining the liquid cooling flow rate further includes:
[0160] Determine the working status of the liquid-cooled server;
[0161] When the working state is the pressurized state, the liquid cooling system is controlled according to the maximum liquid cooling flow rate to perform liquid cooling on the liquid-cooled server. The pressurized state is used to indicate that the liquid-cooled server is working under the maximum load.
[0162] The device for determining the liquid cooling flow rate provided in the embodiment of the present application and the description of the features in the corresponding embodiment can be found in the relevant description of the embodiment corresponding to the method for determining the liquid cooling flow rate, and no further details will be given here.
[0163] Figure 7 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application is shown in FIG. Figure 7 As shown, the electronic device 70 provided in this embodiment includes: at least one processor 71 and a memory 72. Optionally, the device 70 also includes a communication component 73. The processor 71, the memory 72 and the communication component 73 are connected via a bus 74.
[0164] During the specific implementation process, at least one processor 71 executes the computer-executable instructions stored in the memory 72, so that the at least one processor 71 executes the above-mentioned embodiment of the method for determining the liquid cooling flow rate.
[0165] The specific implementation process of the processor 71 can be found in the above-mentioned method embodiment. Its implementation principle and technical effects are similar, and will not be repeated here in this embodiment.
[0166] In the above embodiments, it should be understood that the processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), etc. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the method disclosed in the application may be directly implemented by a hardware processor or implemented by a combination of hardware and software modules in the processor.
[0167] The memory may include a high-speed memory (Random Access Memory, RAM), and may also include a non-volatile memory (NVM), such as at least one disk memory.
[0168] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus. Buses can be classified into address buses, data buses, and control buses. For ease of illustration, the buses in the drawings of this application are not limited to just one bus or just one type of bus.
[0169] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above-mentioned liquid cooling flow determination method embodiments when running.
[0170] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.
[0171] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, it implements the steps of any of the above-mentioned liquid cooling flow determination method embodiments.
[0172] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium, the non-volatile computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, implementing the steps in any of the above-mentioned liquid cooling flow determination method embodiments.
[0173] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.
[0174] The above is a detailed introduction to a method for determining a liquid cooling flow rate, an electronic device, and a storage medium provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.
Claims
1. A method for determining liquid cooling flow rate, characterized in that: include: Get the thermal design power consumption and maximum frequency of the liquid-cooled server; determining an initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and controlling a liquid cooling system to liquid-cool the liquid cooling server according to the initial liquid cooling flow rate; adjusting a processor load of the liquid cooling server to a maximum load, and obtaining a first frequency of the liquid cooling server under the maximum load; If the first frequency is greater than or equal to the maximum frequency, determining the initial liquid cooling flow rate as the maximum liquid cooling flow rate; If the first frequency is less than the maximum frequency, the liquid cooling server is subjected to at least one current adjustment process and a liquid cooling flow adjustment process until the frequency of the liquid cooling server is equal to the maximum frequency, and the maximum liquid cooling flow is determined.
2. The method according to claim 1, characterized in that Performing at least one current adjustment process and a liquid cooling flow adjustment process on the liquid cooling server until the frequency of the liquid cooling server is equal to the maximum frequency, and determining the maximum liquid cooling flow, including: performing an i-th current adjustment process on the liquid-cooled server to obtain an i-th current, and obtaining an i-th frequency of the liquid-cooled server under the i-th current; Determining an i-th power of the liquid-cooled server according to the i-th current; determining an i-th liquid cooling flow rate of the liquid cooling server according to the i-th power, and controlling the liquid cooling system to liquid-cool the liquid cooling server according to the i-th liquid cooling flow rate; Here, the value of i is 1, 2, ... in sequence, until the i-th frequency is greater than or equal to the maximum frequency, and the i-th liquid cooling flow rate is determined as the maximum liquid cooling flow rate.
3. The method according to claim 2, characterized in that Performing an i-th current adjustment process on the liquid cooling server to obtain an i-th current includes: If the value of i is 1, the preset reference current is determined as the i-th current; If i is greater than 1, an adjustment ratio is determined according to i, and a product of the reference current and the adjustment ratio is determined as the i-th current, where the adjustment ratio is a positive number greater than 1.
4. The method according to claim 2 or 3, characterized in that Determining an i-th liquid cooling flow rate of the liquid cooling server according to the i-th power includes: Determining the specific heat capacity and density of the coolant of the liquid-cooled server; Determining a temperature difference corresponding to the liquid-cooled server, where the temperature difference is a difference between a temperature of the coolant after passing through the liquid-cooled server and a temperature of the coolant before passing through the liquid-cooled server; The i-th liquid cooling flow rate is determined according to the i-th power, the specific heat capacity, the density, and the temperature difference.
5. The method according to claim 2 or 3, characterized in that Obtain the thermal design power consumption and maximum frequency of a liquid-cooled server, including: Sending an information acquisition request to the liquid cooling server, wherein the information acquisition request is used to request status information of a processor of the liquid cooling server; The status information sent by the liquid cooling server is received, where the status information includes the thermal design power consumption and the maximum frequency.
6. The method according to claim 2 or 3, characterized in that Adjusting the processor load of the liquid-cooled server to a maximum load, including: A program start instruction is sent to the liquid cooling server, where the program start instruction is used to start a processor stress testing program in the liquid cooling server, where the processor stress testing program is used to adjust the processor load of the liquid cooling server to the maximum load.
7. The method according to claim 1, characterized in that The method further comprises: Determining the operating status of the liquid cooling server; When the working state is a pressurized state, the liquid cooling system is controlled according to the maximum liquid cooling flow rate to perform liquid cooling on the liquid cooling server, and the pressurized state is used to indicate that the liquid cooling server is working under maximum load.
8. A device for determining liquid cooling flow, characterized in that: include: An acquisition module is used to obtain the thermal design power consumption and maximum frequency of the liquid cooling server; a processing module, configured to determine an initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and control a liquid cooling system to liquid cool the liquid cooling server according to the initial liquid cooling flow rate; an adjusting module, configured to adjust a processor load of the liquid cooling server to a maximum load, and obtain a first frequency of the liquid cooling server under the maximum load; a first determining module, configured to determine the initial liquid cooling flow rate as a maximum liquid cooling flow rate if the first frequency is greater than or equal to the maximum frequency; The second determination module is used to perform at least one current adjustment process and a liquid cooling flow adjustment process on the liquid cooling server if the first frequency is less than the maximum frequency, until the frequency of the liquid cooling server is equal to the maximum frequency, and then determine the maximum liquid cooling flow.
9. An electronic device, characterized in that: include: memory and processor; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory to implement the method for determining the liquid cooling flow rate according to any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the method for determining the liquid cooling flow rate according to any one of claims 1 to 7.
Citation Information
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