Parameter compensation methods, apparatus, equipment and storage media for wire bonding

Abstract

This application provides a parameter compensation method, apparatus, device, and storage medium for wire bonding. The method includes: determining the type of wire bonding compensation to be used, the direction of wire bonding compensation, and the method of wire bonding compensation; wherein the type of wire bonding compensation represents the feature referenced for compensation, the direction of wire bonding compensation represents the direction targeted for compensation, and the method of wire bonding compensation represents the change in parameter compensation values ​​between different wire bonding points; determining a corresponding wire bonding compensation formula based on the type of wire bonding compensation, the direction of wire bonding compensation, and the method of wire bonding compensation; and, in response to triggering wire bonding execution, calculating the target parameter value corresponding to each wire bonding point according to the wire bonding compensation formula, and performing wire bonding for each wire bonding point according to the target parameter value; wherein the target parameter value is the sum of the original parameter value and the parameter compensation value. This application can compensate for parameters such as ultrasonic values ​​and pressure values ​​used in wire bonding, providing a wire bonding scheme with superior wire bonding performance.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging, and more specifically, to a parameter compensation method, apparatus, device, and storage medium for wire bonding. Background Technology

[0002] Wire bonding is a technique for electrically interconnecting integrated circuit chips and their packages during semiconductor device manufacturing. As one of the earliest chip packaging technologies, it remains widely used in the microelectronics packaging field due to its flexibility and ease of use, generating over four trillion wire bonding joints annually. A common problem with the second solder joint is non-sticking, also known as warping, which is the most obvious form of bonding failure. Bond strength can be improved by increasing pressure or ultrasonic power to promote atomic diffusion. However, excessive pressure or ultrasonic power can damage the root and tail of the second solder joint, actually reducing bond strength. Therefore, appropriate parameters are needed to achieve reliable second soldering.

[0003] The transducer vibration direction of the wire bonding machine is vertical. Using the same welding parameters, different wire pull directions result in uneven "fishtail" bonding, requiring individual grouping and adjustment of welding power and pressure for each wire. However, for products with a large number of wires, such as BGA and QFN, requiring dozens to hundreds of wires, manual methods are very difficult. Another issue is that the characteristics of some special lead frames cause pins in certain fixed positions to float, resulting in uneven energy transfer at these floating positions even with the same welding parameters. When the operator adjusts the product, parameters need to be individually modified for different positions, and then the modified parameters for different positions need to be grouped. This method is time-consuming and inefficient, and is also prone to quality defects due to operator negligence in confusing different grouped parameters. All of these factors indicate that manually adjusting parameters for device welding is not only complex and difficult, but also prone to errors and quality problems. Finally, the design of the pressure plate leads to the problem that areas with the pressure plate bond well, while other areas bond poorly.

[0004] Therefore, this application provides a parameter compensation method, apparatus, device, and storage medium for wire bonding to solve one of the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this application is to provide a parameter compensation method, apparatus, device, and storage medium for wire bonding, which can solve at least one of the aforementioned technical problems. The specific solution is as follows:

[0006] According to a specific embodiment of this application, in a first aspect, this application provides a parameter compensation method for wire bonding, comprising:

[0007] The following steps are taken: First, determine the type, direction, and method of the two-weld compensation to be used. The type of compensation represents the feature referenced for compensation, the direction represents the direction targeted by compensation, and the method represents the variation of parameter compensation values ​​between different two-weld points. Second, determine the corresponding two-weld compensation formula based on the type, direction, and method. Third, in response to triggering wire bonding, calculate the target parameter value for each of the two-weld points according to the compensation formula, and perform wire bonding for each of the two-weld points according to the target parameter value. The target parameter value is the sum of the original parameter value and the compensated parameter value.

[0008] In one embodiment, the two-weld compensation type includes a line feature compensation type, a device feature compensation type, and a unit clamping feature compensation type. The line feature compensation type describes the influence of the positional relationship between a first solder point and two solder points on the parameter compensation value. The device feature compensation type describes the influence of the positional relationship between two solder points and the center point of a device on the parameter compensation value. The unit clamping feature compensation type describes the influence of the positional relationship between two solder points and the center point of a unit area on the parameter compensation value. The unit area includes some or all devices that are bonded in a single pass by a pressure plate. The two-weld compensation direction includes a vertical direction, a horizontal direction, and a bidirectional direction. The bidirectional direction is used to perform horizontal or vertical compensation on different two solder points. The two-weld compensation method includes an elliptical compensation method, a sinusoidal compensation method, and a square compensation method. The two-weld compensation formula corresponding to the elliptical compensation method uses an elliptical formula as the basic formula. The two-weld compensation formula corresponding to the sinusoidal compensation method uses a sine curve formula as the basic formula. The two-weld compensation formula corresponding to the square compensation method uses a fixed value as the basic formula.

[0009] In one embodiment, when the two-weld compensation type is a line feature compensation type and the two-weld compensation method is an elliptical compensation method, the two-weld compensation formula corresponding to the vertical direction is a first formula, and the two-weld compensation formula corresponding to the horizontal direction is a second formula; and the two-weld compensation formulas corresponding to both directions include the first formula and the second formula. For both directions, the first formula is used when the angle between the connecting line between the first weld point and the second weld point and the horizontal direction is within a first range, and the second formula is used when the angle between the connecting line between the first weld point and the second weld point and the horizontal direction is within a second range; the first formula includes: The second formula includes: When the first range includes: ; ;

[0010] The second range includes: ; ; Where R is the calculated target value of the parameter corresponding to the two weld points, a is the maximum target value of the parameter in the vertical direction, b is the original value of the parameter, a′ is the maximum target value of the parameter in the horizontal direction, and θ is the angle between the connecting line between the first and second weld points and the horizontal direction.

[0011] In one embodiment, when the secondary welding compensation type is a device feature compensation type and the secondary welding compensation method is an elliptical compensation method, the secondary welding compensation formula corresponding to the vertical direction or the horizontal direction includes: Where R is the target value of the parameters corresponding to the two solder joints calculated. A planar coordinate system is constructed with the center point of the device as the origin. x is the horizontal coordinate of the two solder joints and y is the vertical coordinate of the two solder joints.

[0012] In one embodiment, the step of calculating the target parameter value corresponding to each of the two weld points according to the two-weld compensation formula includes: in response to the two-weld compensation type to be used being one, using the calculated value of the two-weld compensation formula as the target parameter value; in response to the two-weld compensation type to be used being two or three, superimposing the parameter compensation values ​​of different two-weld compensation formulas, and calculating the target parameter value based on the superimposed parameter compensation value.

[0013] According to a specific embodiment of this application, in a second aspect, this application provides a parameter compensation device for wire bonding, comprising:

[0014] A determining unit is used to determine the type, direction, and method of the two-weld compensation to be used; wherein the type of two-weld compensation represents the feature referenced for compensation, the direction of two-weld compensation represents the direction targeted by compensation, and the method of two-weld compensation represents the change in parameter compensation values ​​between different two-weld points; and is used to determine the corresponding two-weld compensation formula based on the type, direction, and method of two-weld compensation; an execution unit, in response to triggering the execution of wire bonding, calculates the target parameter value corresponding to each of the two-weld points according to the two-weld compensation formula, and performs wire bonding for each of the two-weld points according to the target parameter value; wherein the target parameter value is the sum of the original parameter value and the parameter compensation value.

[0015] In one embodiment, the two-weld compensation type includes a line feature compensation type, a device feature compensation type, and a unit clamping feature compensation type. The line feature compensation type describes the influence of the positional relationship between a first solder point and two solder points on the parameter compensation value. The device feature compensation type describes the influence of the positional relationship between two solder points and the center point of a device on the parameter compensation value. The unit clamping feature compensation type describes the influence of the positional relationship between two solder points and the center point of a unit area on the parameter compensation value. The unit area includes some or all devices that are bonded in a single pass by a pressure plate. The two-weld compensation direction includes a vertical direction, a horizontal direction, and a bidirectional direction. The bidirectional direction is used to perform horizontal or vertical compensation on different two solder points. The two-weld compensation method includes an elliptical compensation method, a sinusoidal compensation method, and a square compensation method. The two-weld compensation formula corresponding to the elliptical compensation method uses an elliptical formula as the basic formula. The two-weld compensation formula corresponding to the sinusoidal compensation method uses a sine curve formula as the basic formula. The two-weld compensation formula corresponding to the square compensation method uses a fixed value as the basic formula.

[0016] In one embodiment, the execution unit calculates the target parameter value corresponding to each of the two weld points according to the two-weld compensation formula in the following manner: in response to the two-weld compensation type to be used being one, the calculated value of the two-weld compensation formula is used as the target parameter value; in response to the two-weld compensation type to be used being two or three, the parameter compensation values ​​of different two-weld compensation formulas are superimposed, and the target parameter value is calculated based on the superimposed parameter compensation value.

[0017] According to a specific embodiment of this application, in a third aspect, this application provides an electronic device including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the method described in any one of the first aspects.

[0018] According to a specific embodiment of this application, in a fourth aspect, this application provides a computer-readable storage medium having a computer program / instructions stored thereon, characterized in that the computer program / instructions, when executed by a processor, implement the method described in any one of the first aspects.

[0019] Compared with the prior art, the above-described solution of this application has at least the following beneficial effects: This application provides a parameter compensation method for wire bonding. By determining the type, direction, and method of compensation for the two solder joints to be used, and calculating the target parameter values ​​required for each solder joint using the corresponding formula, the purpose of automatically adjusting the welding parameters during the wire bonding process is achieved. This method reduces manual debugging time, avoids quality problems caused by human error, and improves production efficiency and product quality. In addition, it also supports personalized compensation settings for different types of solder joints, making the welding process more flexible and precise. Attached Figure Description

[0020] Figure 1 A flowchart of a parameter compensation method for wire bonding is shown;

[0021] Figure 2 A schematic diagram of a pressure plate structure is shown;

[0022] Figure 3 A schematic diagram of a selected unit area within a pressure plate is shown;

[0023] Figure 4 A schematic diagram of overall compensation for devices within a unit area is shown;

[0024] Figure 5 A schematic diagram is shown showing how to compensate devices within a single unit area separately;

[0025] Figure 6 This diagram illustrates the effects of different compensation methods on a device feature type.

[0026] Figure 7 A schematic diagram is shown illustrating compensation along the vertical direction using line feature compensation type and elliptical compensation method;

[0027] Figure 8 A schematic diagram is shown illustrating compensation along the horizontal direction using line feature compensation type and elliptical compensation method;

[0028] Figure 9 A schematic diagram is shown illustrating compensation in both directions using line feature compensation type and elliptical compensation method;

[0029] Figure 10 A schematic diagram illustrating the principle of using elliptic compensation method based on device feature compensation type is shown;

[0030] Figure 11 A schematic diagram is shown illustrating compensation in both directions using device feature compensation type and elliptic compensation method;

[0031] Figure 12A schematic diagram showing the device feature compensation type and sinusoidal compensation method is provided.

[0032] Figure 13 A schematic diagram of the settings interface for a two-weld compensation type is shown;

[0033] Figure 14 This diagram illustrates the effect of using multiple types of two-weld compensation simultaneously.

[0034] Figure 15 A unit block diagram of a parameter compensation device for wire bonding according to an embodiment of this application is shown;

[0035] Figure 16 This is a block diagram of an electronic device for ultrasonic compensation in wire bonding, according to an exemplary embodiment. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “said,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms, and “multiple” generally includes at least two unless the context clearly indicates otherwise.

[0038] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0039] It should be understood that although the terms first, second, third, etc., may be used in the embodiments of this application, these descriptions should not be limited to these terms. These terms are only used to distinguish the descriptions. For example, first may also be referred to as second without departing from the scope of the embodiments of this application, and similarly, second may also be referred to as first.

[0040] Depending on the context, the words “if” or “suppose” as used here can be interpreted as “when” or “in response to determination” or “in response to detection.” Similarly, depending on the context, the phrases “if determination” or “if detection (of the stated condition or event)” can be interpreted as “when determination” or “in response to determination” or “when detection (of the stated condition or event)” or “in response to detection (of the stated condition or event).”

[0041] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or device that includes said element.

[0042] It should be noted that any symbols and / or numbers present in the specification that are not marked in the accompanying drawings are not reference numerals.

[0043] The optional embodiments of this application are described in detail below with reference to the accompanying drawings.

[0044] The embodiments provided in this application are embodiments of a parameter compensation method for wire bonding.

[0045] The following combination Figure 1 The embodiments of this application will be described in detail.

[0046] Figure 1 A flowchart of a parameter compensation method for wire bonding is shown, as follows: Figure 1 As shown, it includes the following steps.

[0047] Step S101: Determine the type of secondary welding compensation to be used, the direction of secondary welding compensation, and the method of secondary welding compensation.

[0048] Among them, the type of two-weld compensation represents the feature referenced for compensation, the direction of two-weld compensation represents the direction targeted by compensation, and the method of two-weld compensation represents the change of parameter compensation values ​​between different two-weld points.

[0049] Step S102: Determine the corresponding two-weld compensation formula based on the type, direction, and method of the two-weld compensation.

[0050] Step S103: In response to the trigger to execute wire bonding, calculate the target value of the parameter corresponding to each two-bond joint according to the two-bond compensation formula, and execute wire bonding for each two-bond joint according to the target value of the parameter.

[0051] In this embodiment, the original parameter value is the ultrasonic power originally used to bond the two solder joints, the target parameter value is the ultrasonic power used to bond the two solder joints after being calculated and adjusted according to the formula, and the parameter compensation value represents the difference between the original parameter value and the target parameter value. That is, the target parameter value is the sum of the original parameter value and the parameter compensation value.

[0052] In this embodiment, the compensation parameter can be the ultrasonic value or pressure value used for wire bonding. This application provides a compensation algorithm for the two solder joint positions to automatically adjust the welding pressure and ultrasonic power output compensation to achieve better results for different types of leads.

[0053] In this embodiment, the two-weld compensation type includes three types: line feature compensation type, device feature compensation type, and unit clamping feature compensation type.

[0054] On the one hand, the line feature compensation type is used to describe the influence of the positional relationship between one weld point and two weld points on the parameter compensation value. For example, the amount of ultrasonic power to be compensated can be determined by the angle between the line connecting the two weld points and the horizontal direction.

[0055] On the other hand, the device feature compensation type is used to describe the influence of the positional relationship between the two solder joints and the device center point on the parameter compensation value. For example, a planar coordinate system can be constructed with the device center point as the origin along the horizontal and vertical directions, and then the ultrasonic power to be compensated can be determined based on the coordinates of the two solder joints in the planar coordinate system.

[0056] On the other hand, the element clamping feature compensation type is used to describe the influence of the two weld points and the center point of the element region on the parameter compensation value.

[0057] Figure 2 A schematic diagram of a pressure plate structure is shown.

[0058] Figure 3 A schematic diagram of a selected unit area within a pressure plate is shown.

[0059] For example, such as Figure 2 As shown, the pressure plate includes a matrix-like dot array, allowing for the simultaneous placement of wire bonds for multiple different devices. For example, as... Figure 3 As shown, each small white square represents one of the devices in the layout. During the wire bonding process, they can be arranged according to... Figure 3The cell region is selected as shown. This cell region can include some or all of the devices that undergo a single bonding operation by the pressure plate. Furthermore, the devices within the cell region can be treated as a whole to consider parameter compensation values ​​in a joint manner. For example, four devices within the cell region defined by points a1, b1, c1, and d1 can be considered as a single unit, and their parameter compensation values ​​can be determined according to the calculation method of the device characteristic compensation type. The difference between this and the device characteristic compensation type is that this uses the center point of the cell region, while the device characteristic compensation type uses the center point of the device.

[0060] Figure 4 A schematic diagram of overall compensation for devices within a unit area is shown.

[0061] Figure 5 A schematic diagram is shown showing how to compensate devices within a single unit area.

[0062] For example, such as Figure 4 As shown, for unit region ① (in the example, represented by a unit region defined by points a0, b0, c0, and d0), the devices within the unit region can be treated as a whole, and elliptical compensation is applied, compensating along both directions. For unit region ② (in the example, represented by a unit region defined by points a1, b1, c1, and d1), the devices within the unit region can be treated as a whole, and elliptical compensation is applied, compensating along the horizontal direction. Furthermore, as... Figure 5 As shown, for unit region ① (in this example, a unit region defined by four points a0, b0, c0, and d0), compensation can be performed on the devices along the edges of the unit region according to their feature types. Furthermore, the compensation only applies to the direction of the unit region. For example, here, each device along the edge of unit region ① is compensated according to its feature type, elliptical compensation method, and bidirectional compensation. Alternatively, each device along the edge of unit region ② can be compensated according to its feature type, elliptical compensation method, and vertical compensation direction. Of course, other compensation methods can be used; this example only illustrates the selectable compensation methods, and other possible implementations are not detailed here.

[0063] In this embodiment, the two-weld compensation direction includes a vertical direction, a horizontal direction, and a bidirectional direction. The bidirectional direction is used to perform horizontal or vertical compensation on different two-weld points. In some embodiments, when the two weld points are approximately in the upper or lower half of the region, the parameter compensation value can be calculated using a vertical two-weld compensation formula; and when the two weld points are approximately in the left or right half of the region, the parameter compensation value can be calculated using a horizontal two-weld compensation formula.

[0064] In this embodiment, the two-weld compensation methods include elliptical compensation, sinusoidal compensation, and square compensation. Specifically, the two-weld compensation formula for the elliptical compensation method uses the elliptical formula as its basic formula, the two-weld compensation formula for the sinusoidal compensation method uses the sine curve formula as its basic formula, and the two-weld compensation formula for the square compensation method uses a fixed value as its basic formula.

[0065] Figure 6 This diagram illustrates the effects of different compensation methods on a single device feature type. For example, ... Figure 6 As shown, elliptical compensation, sinusoidal compensation, or square compensation can be used to achieve compensation based on device feature types. Elliptical and sinusoidal compensation methods correspond to the same or different parameter compensation values ​​at different solder joints. For example, the parameter compensation value of elliptical compensation has a variation range of 100% to 120% compared to the original parameter value, and the maximum parameter compensation value of sinusoidal compensation also has a variation range of 120%. However, compared to elliptical compensation, the variation of parameter compensation values ​​between adjacent solder joints differs. Square compensation, on the other hand, refers to using a fixed value for compensation at any two solder joints, such as using a maximum parameter compensation value with a variation range of 120%.

[0066] As a feasible embodiment, when the two-weld compensation type is a line feature compensation type and the two-weld compensation method is an elliptical compensation method, compensation can be performed only in the vertical or horizontal direction, or in both directions.

[0067] Figure 7 A schematic diagram is shown illustrating compensation along the vertical direction using line feature compensation type and elliptical compensation method.

[0068] For example, such as Figure 7 As shown, R is the distance from point P to O, representing the target parameter value; θ is the angle between the line connecting the first and second welding points and the horizontal direction; R′ is the radius of the circle, with the same value as the distance from b to O, representing the original parameter value; the distance from a to O is the maximum target parameter value in the vertical direction; and the parameter compensation value is the distance R from point P to O minus the radius R′ of the circle. Based on this, the ellipse formula is expressed as: ,and , Substituting, we can get , where R is the target value of the parameter corresponding to the two weld points calculated.

[0069] Figure 8 A schematic diagram is shown illustrating compensation along the horizontal direction using line feature compensation type and elliptical compensation method.

[0070] For example, such as Figure 8As shown, R is the distance from point P to O, representing the target parameter value; θ is the angle between the line connecting the first and second welding points and the horizontal direction; R′ is the radius of the circle, with the same value as the distance from b′ to O; the distance from a′ to O is the maximum target parameter value in the horizontal direction; and the parameter compensation value is the distance R from point P to O minus the radius R′ of the circle. Based on this, the ellipse formula is expressed as: ,and , Substituting, we can get , where R is the target value of the parameter corresponding to the two weld points calculated.

[0071] Figure 9 A schematic diagram is shown illustrating compensation in both directions using line feature compensation type and elliptical compensation method.

[0072] For example, such as Figure 9 As shown, R is the distance from point P to O, representing the target parameter value; θ is the angle between the line connecting the first and second welding points and the horizontal direction; R′ is the radius of the circle, with the same value as the distance from b to O, representing the original parameter value; the distance from a to O is the maximum target parameter value in the vertical direction; the distance from a′ to O is the maximum target parameter value in the horizontal direction; and the parameter compensation value is the distance R from point P to O minus the radius R′ of the circle. Based on this, the equation can be obtained by rearranging. and This allows us to calculate the four intersection points between the two ellipses:

[0073] , , ,and ,

[0074] The angle is divided into four semi-zones: upper, lower, left, and right. The first range is defined when the angle between the connecting line between two weld points and the horizontal direction lies within the upper or lower semi-zone. In this case, the first formula in the vertical direction is used as the corresponding compensation formula for the two weld points in both directions. The first range includes:

[0075] ;

[0076] The first formula includes: Correspondingly, when the angle between the connecting line between the first and second weld points and the horizontal direction is within the left and right halves, it is defined as the second range. In this case, the second formula is used as the corresponding bidirectional weld compensation formula. The second range includes:

[0077] ; ; The second formula includes: Where R is the calculated target parameter value corresponding to the two weld points, a is the maximum target parameter value in the vertical direction, b is the original parameter value, a′ is the maximum target parameter value in the horizontal direction, and θ is the angle between the connecting line between the first and second weld points and the horizontal direction.

[0078] As a feasible embodiment, when the two-weld compensation type is a line feature compensation type and the two-weld compensation method is an elliptical compensation method, compensation can be performed only in the vertical or horizontal direction, or in both directions.

[0079] Figure 10 This diagram illustrates the principle of using elliptic compensation with device feature compensation. Figure 10 As shown, during wire bonding, there are aluminum pads at the four corners, which help stabilize the two solder joints. As the distance moves away from the four corners, the middle direction requires greater pressure or ultrasonic power. Therefore, it is considered that at the four corners, the parameter is the original value and the parameter compensation value is zero. At the midpoint between the two corners, the maximum parameter compensation value is used, and the change of the parameter compensation value adopts the gradual change of elliptical arc.

[0080] Figure 11 A schematic diagram is shown showing compensation in both directions using device feature compensation type and elliptic compensation method.

[0081] For example, such as Figure 11 As shown, a planar coordinate system is established with the center point of the device as the center and along the horizontal and vertical directions. θ′ is the angle between the line connecting the center point of the device and the two solder joints and the horizontal direction. The positions of the two solder joints can be obtained through planar coordinates, such as A(x0, y0), B(x1, y1), C(x2, y2), and D(x3, y3).

[0082] For example, when 45°≤θ´≤135° and -135°≤θ´≤-45°, the vertical compensation method is used, and the calculation for point A is as follows: , , , Finally sorted out Where a is the maximum target value of the parameter in the vertical direction, b is the original value of the parameter, R is the target value of the parameter corresponding to the two solder joints calculated, a plane coordinate system is constructed with the center point of the device as the origin, x is the horizontal coordinate of the two solder joints, y is the vertical coordinate of the two solder joints, and X represents the positional relationship of point A corresponding to the elliptical compensation method.

[0083] For example, when -45°≤θ´≤45° and 135°≤θ´≤-135°, the horizontal compensation method is used, and the calculation for point A is as follows: , , , Finally sorted out Where a′ is the maximum target parameter value in the horizontal direction, b is the original parameter value, R is the calculated target parameter value corresponding to the two solder joints, a plane coordinate system is constructed with the device center point as the origin, x is the horizontal coordinate of the two solder joints, y is the vertical coordinate of the two solder joints, and Y represents the positional relationship of point A corresponding to the elliptical compensation method. Therefore, the calculation of y and x in the horizontal or vertical directions is different depending on the device feature compensation type and the elliptical compensation method, but the final target parameter value can be calculated using the formula. .

[0084] Figure 12 A schematic diagram showing the device feature compensation type and sinusoidal compensation method is shown.

[0085] For example, such as Figure 12 As shown, a planar coordinate system is established with the center point of the device as the center and along the horizontal and vertical directions. θ′ is the angle between the line connecting the center point of the device and the two solder points and the horizontal direction. The positions of the two solder points can be obtained through planar coordinates, such as A(x0, y0), B(x1, y1), C(x2, y2), D(x3, y3), and E(x4, y4).

[0086] For example, when 45°≤θ´≤135° and -135°≤θ´≤-45°, vertical compensation is used, and the sine curve is calculated using the formula. The parameter compensation values ​​for point A are summarized as follows: , , Where y′ is the parameter compensation value, x′ is the independent variable of y′, 2K is the maximum parameter compensation value in the vertical direction, and X1 represents the positional relationship of point A corresponding to the sine compensation method.

[0087] For example, when -45°≤θ´≤45° and 135°≤θ´≤-135°, horizontal compensation is used, and the sine curve is calculated using the formula. For point A, the parameter compensation values ​​are summarized as follows: , Where y′ is the parameter compensation value, x′ is the independent variable of y′, 2K′ is the maximum parameter compensation value in the horizontal direction, and Y1 represents the positional relationship of point A corresponding to the sinusoidal compensation method.

[0088] In this embodiment of the application, when performing wire bonding, one, two, or all three types of wire bonding can be selected.

[0089] In this embodiment of the application, the target value of the parameter corresponding to each two welding point is calculated according to the two welding compensation formula. For example, if there is only one type of two welding compensation to be used, the calculated value of the two welding compensation formula can be used as the target value of the parameter. Alternatively, if there are two or three types of two welding compensation to be used, the parameter compensation values ​​of different two welding compensation formulas can be superimposed, and the target value of the parameter can be calculated based on the superimposed parameter compensation value.

[0090] For example, the parameter compensation values ​​calculated according to different two-weld compensation formulas are superimposed, and the sum between the superimposed parameter compensation value and the original parameter value is calculated to obtain the parameter target value.

[0091] Figure 13 A schematic diagram of the settings interface for a two-weld compensation type is shown.

[0092] Figure 14 A schematic diagram illustrating the effect of using multiple types of two-weld compensation simultaneously is shown.

[0093] For example, such as Figure 13 As shown, the interface allows you to enable or disable line features, device features, and unit clamping features to execute one or more of these types. For example, as... Figure 14 As shown, compensation calculations can be performed using both device feature type and cell clamping feature type simultaneously. Based on this, on the one hand, parameter compensation value calculations for cell clamping feature type can be performed within the cell area, and on the other hand, parameter compensation values ​​can be calculated separately for each device. Then, the two parameter compensation values ​​are superimposed to obtain the final parameter compensation value used.

[0094] In this embodiment, the development of a two-weld parameter compensation function first solves the problem of poor wire bonding effects. Secondly, it provides a method other than group-based parameter adjustment, reducing the workload for engineers and enabling them to complete tasks faster and more accurately when encountering similar products. Finally, it addresses the need for future development, allowing the function to be continuously enriched to accommodate more semiconductors with unique characteristics.

[0095] This application also provides apparatus embodiments that follow the above embodiments, for implementing the method steps of the above embodiments. The interpretation of the same names is the same as that of the above embodiments, and they have the same technical effects as those of the above embodiments, so they will not be repeated here.

[0096] like Figure 15 As shown, this application provides a parameter compensation device 1500 for wire bonding, comprising:

[0097] The determining unit 1501 is used to determine the type, direction, and method of the two-weld compensation to be used. The two-weld compensation type represents the feature referenced for compensation, the two-weld compensation direction represents the direction targeted by compensation, and the two-weld compensation method represents the change in parameter compensation values ​​between different two-weld points. It is also used to determine the corresponding two-weld compensation formula based on the two-weld compensation type, direction, and method. The execution unit 1502, in response to a trigger to execute wire bonding, calculates the target parameter value for each two-weld point according to the two-weld compensation formula, and performs wire bonding for each two-weld point according to the target parameter value. The target parameter value is the sum of the original parameter value and the parameter compensation value.

[0098] In one embodiment, the two-bonding compensation type includes line feature compensation type, device feature compensation type, and unit clamping feature compensation type. The line feature compensation type describes the influence of the positional relationship between the first and second bond points on the parameter compensation value. The device feature compensation type describes the influence of the positional relationship between the second bond point and the device center point on the parameter compensation value. The unit clamping feature compensation type describes the influence of the positional relationship between the second bond point and the center point of the unit area on the parameter compensation value. The unit area includes some or all devices that undergo single bonding by the pressure plate. The two-bonding compensation direction includes vertical, horizontal, and bidirectional directions. The bidirectional direction is used to perform horizontal or vertical compensation on different two bond points. The two-bonding compensation method includes elliptical compensation method, sinusoidal compensation method, and square compensation method. The two-bonding compensation formula corresponding to the elliptical compensation method uses the elliptical formula as the basic formula, the two-bonding compensation formula corresponding to the sinusoidal compensation method uses the sine curve formula as the basic formula, and the two-bonding compensation formula corresponding to the square compensation method uses a fixed value as the basic formula.

[0099] In one embodiment, the execution unit 1502 calculates the target parameter value corresponding to each of the two weld points according to the two-weld compensation formula in the following manner: In response to the use of one type of two-weld compensation, the calculated value of the two-weld compensation formula is used as the target parameter value. In response to the use of two or three types of two-weld compensation, the parameter compensation values ​​of different two-weld compensation formulas are superimposed, and the target parameter value is calculated based on the superimposed parameter compensation value.

[0100] Regarding the apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments related to the method, and will not be elaborated upon here.

[0101] Figure 16 This is a block diagram of an electronic device 1600 for ultrasonic compensation in wire bonding, according to an exemplary embodiment.

[0102] like Figure 16As shown, one embodiment of this application provides an electronic device 1600. The electronic device 1600 includes a memory 1601, a processor 1602, and an input / output (I / O) interface 1603. The memory 1601 stores instructions. The processor 1602 is used to execute the ultrasonic compensation method for wire bonding according to embodiments of this application by calling the instructions stored in the memory 1601. The processor 1602 is connected to both the memory 1601 and the I / O interface 1603, for example, via a bus system and / or other forms of connection mechanisms (not shown). The memory 1601 can be used to store programs and data, including the program for the ultrasonic compensation method for wire bonding according to embodiments of this application. The processor 1602 executes various functional applications and data processing of the electronic device 1600 by running the program stored in the memory 1601.

[0103] In this embodiment, the processor 1602 can be implemented using at least one of the following hardware forms: digital signal processor (DSP), field programmable gate array (FPGA), and programmable logic array (PLA). The processor 1602 can be one or a combination of several of the following: central processing unit (CPU) or other processing units with data processing capability and / or instruction execution capability.

[0104] The memory 1601 in this embodiment may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory. The non-volatile memory may include, for example, read-only memory (ROM), flash memory, hard disk drive (HDD), or solid state drive (SSD).

[0105] In this embodiment, the I / O interface 1603 can be used to receive input instructions (such as numeric or character information, and to generate key signal inputs related to user settings and function control of the electronic device 1600), and can also output various information (such as images or sounds) to the outside. In this embodiment, the I / O interface 1603 may include one or more of the following: a physical keyboard, function keys (such as volume control keys, power buttons, etc.), a mouse, a joystick, a trackball, a microphone, a speaker, and a touch panel.

[0106] In some embodiments, this application provides a computer-readable storage medium storing computer-executable instructions that, when executed by a processor, perform any of the methods described above.

[0107] In some embodiments, this application provides a computer program product comprising a computer program that, when executed by a processor, performs any of the methods described above.

[0108] Although the operations are described in a specific order in the accompanying drawings, this should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all of the operations shown to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0109] The methods, apparatus, devices, and storage media of this application can be implemented using standard programming techniques, and various method steps can be implemented using rule-based logic or other logic. It should also be noted that the terms "apparatus" and "module" as used herein and in the claims are intended to include implementations using one or more lines of software code and / or hardware implementations and / or devices for receiving input.

[0110] Any step, operation, or procedure described herein may be performed or implemented using one or more hardware or software modules, either alone or in combination with other devices. In one embodiment, the software module is implemented using a computer program product comprising a computer-readable medium containing computer program code, which is executable by a computer processor to perform any or all of the described steps, operations, or procedures.

[0111] The foregoing description of implementations of this application has been provided for illustrative and descriptive purposes. The foregoing description is not exhaustive and is not intended to limit this application to the exact forms disclosed. Various modifications and variations may exist in accordance with the foregoing teachings, or may arise from practice of this application. These embodiments were chosen and described to illustrate the principles of this application and its practical application, enabling those skilled in the art to utilize this application in various implementations and modifications to suit the specific purpose of the concept.

[0112] Regarding the apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments related to the method, and will not be elaborated upon here.

[0113] It can be further understood that, unless otherwise specified, "connection" includes both direct connections where no other components exist between the two parties and indirect connections where other components exist between them.

[0114] It is further understood that although the operations are described in a specific order in the accompanying drawings in the embodiments of this application, this should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all the operations shown to be performed to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0115] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the field of this application that are not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0116] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

[0117] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A parameter compensation method for wire bonding, characterized in that, include: The type of two-weld compensation to be used, the direction of two-weld compensation, and the method of two-weld compensation are determined; wherein, the type of two-weld compensation represents the feature referenced for compensation, the direction of two-weld compensation represents the direction targeted by compensation, and the method of two-weld compensation represents the change of parameter compensation values ​​between different two-weld points; Based on the type of secondary weld compensation, the direction of secondary weld compensation, and the method of secondary weld compensation, determine the corresponding secondary weld compensation formula; In response to the trigger to execute wire bonding, the target value of the parameter corresponding to each of the two bonding points is calculated according to the two-bond compensation formula, and the wire bonding is executed for each of the two bonding points according to the target value of the parameter. Wherein, the target value of the parameter is the sum of the original value of the parameter and the compensation value of the parameter; The two-weld compensation types include line feature compensation type, device feature compensation type, and unit clamping feature compensation type. The line feature compensation type is used to describe the influence of the positional relationship between the first and second solder joints on the parameter compensation value. The device feature compensation type is used to describe the influence of the positional relationship between the second solder joint and the device center point on the parameter compensation value. The unit clamping feature compensation type is used to describe the influence of the positional relationship between the second solder joint and the center point of the unit area on the parameter compensation value. The unit area includes some or all of the devices that are bonded in a single operation by the pressure plate. The two-weld compensation directions include the vertical direction, the horizontal direction, and both directions. The two directions are used to perform horizontal or vertical compensation on different two-weld points. The two-weld compensation method includes elliptical compensation method, sinusoidal compensation method, and square compensation method. The two-weld compensation formula corresponding to the elliptical compensation method adopts the elliptical formula as the basic formula, the two-weld compensation formula corresponding to the sinusoidal compensation method adopts the sine curve formula as the basic formula, and the two-weld compensation formula corresponding to the square compensation method adopts a fixed value as the basic formula. The parameter is either an ultrasonic value or a pressure value.

2. The method according to claim 1, characterized in that, When the two-weld compensation type is a line feature compensation type and the two-weld compensation method is an elliptical compensation method, the two-weld compensation formula corresponding to the vertical direction is the first formula, and the two-weld compensation formula corresponding to the horizontal direction is the second formula; the two-weld compensation formulas corresponding to both directions include the first formula and the second formula. For both directions, the first formula is used when the angle between the connecting line between the first weld point and the second weld point and the horizontal direction is within a first range, and the second formula is used when the angle between the connecting line between the first weld point and the second weld point and the horizontal direction is within a second range. The first formula includes: ； The second formula includes: ； When the first range includes: ； ； The second range includes: ； ； Where R is the calculated target value of the parameter corresponding to the two weld points, a is the maximum target value of the parameter in the vertical direction, b is the original value of the parameter, a′ is the maximum target value of the parameter in the horizontal direction, and θ is the angle between the connecting line between the first and second weld points and the horizontal direction.

3. The method according to claim 1, characterized in that, When the secondary welding compensation type is a device feature compensation type and the secondary welding compensation method is an elliptical compensation method, the secondary welding compensation formula corresponding to the vertical direction or the horizontal direction includes: ； Where R is the calculated target value of the parameter corresponding to the two solder joints, a planar coordinate system is constructed with the center point of the device as the origin, x is the horizontal coordinate of the two solder joints, and y is the vertical coordinate of the two solder joints.

4. The method according to claim 1, characterized in that, The calculation of the target parameter value corresponding to each of the two weld points according to the two-weld compensation formula includes: In response to the fact that the type of two-weld compensation to be used is one, the calculated value of the two-weld compensation formula is used as the target value of the parameter; In response to the fact that there are two or three types of two-weld compensation to be used, the parameter compensation values ​​of different two-weld compensation formulas are superimposed, and the parameter target value is calculated based on the superimposed parameter compensation value.

5. A parameter compensation device for wire bonding, characterized in that, include: The determining unit is used to determine the type of two-weld compensation to be used, the direction of two-weld compensation, and the method of two-weld compensation; wherein, the type of two-weld compensation represents the feature referenced for compensation, the direction of two-weld compensation represents the direction targeted by compensation, and the method of two-weld compensation represents the change of parameter compensation values ​​between different two-weld points; and is used to determine the corresponding two-weld compensation formula based on the type of two-weld compensation, the direction of two-weld compensation, and the method of two-weld compensation. The execution unit, in response to triggering the wire bonding, calculates the target parameter value corresponding to each of the two bonding points according to the two-bond compensation formula, and performs wire bonding for each of the two bonding points according to the target parameter value; wherein, the target parameter value is the sum of the original parameter value and the parameter compensation value; The two-weld compensation types include line feature compensation type, device feature compensation type, and unit clamping feature compensation type. The line feature compensation type is used to describe the influence of the positional relationship between the first and second solder joints on the parameter compensation value. The device feature compensation type is used to describe the influence of the positional relationship between the second solder joint and the device center point on the parameter compensation value. The unit clamping feature compensation type is used to describe the influence of the positional relationship between the second solder joint and the center point of the unit area on the parameter compensation value. The unit area includes some or all of the devices that are bonded in a single operation by the pressure plate. The two-weld compensation directions include the vertical direction, the horizontal direction, and both directions. The two directions are used to perform horizontal or vertical compensation on different two-weld points. The two-weld compensation method includes elliptical compensation method, sinusoidal compensation method, and square compensation method. The two-weld compensation formula corresponding to the elliptical compensation method adopts the elliptical formula as the basic formula, the two-weld compensation formula corresponding to the sinusoidal compensation method adopts the sine curve formula as the basic formula, and the two-weld compensation formula corresponding to the square compensation method adopts a fixed value as the basic formula. The parameter is either an ultrasonic value or a pressure value.

6. The apparatus according to claim 5, characterized in that, The execution unit calculates the target parameter value corresponding to each of the two weld points according to the two-weld compensation formula in the following manner: In response to the fact that the type of two-weld compensation to be used is one, the calculated value of the two-weld compensation formula is used as the target value of the parameter; In response to the fact that there are two or three types of two-weld compensation to be used, the parameter compensation values ​​of different two-weld compensation formulas are superimposed, and the parameter target value is calculated based on the superimposed parameter compensation value.

7. An electronic device comprising a memory, a processor, and a computer program stored in the memory, characterized in that, The processor executes the computer program to implement the method described in any one of claims 1-4.

8. A computer-readable storage medium having a computer program / instructions stored thereon, characterized in that, When the computer program / instruction is executed by the processor, it implements the method described in any one of claims 1-4.

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