Stacked display unit and display

Abstract

The invention discloses a stacked display unit and a display. The unit comprises a sapphire substrate, a light-emitting chip arrangement layer and a unit driving chip, wherein the light-emitting chip arrangement layer and the unit driving chip are vertically stacked on the sapphire substrate. The light-emitting chip arrangement layer comprises Micro-LED chips generating red light, green light and blue light, first insulation packaging layers are filled among the chips, and signal pads and common pads are arranged for electrode connection. The unit driving chip is arranged on the first insulation packaging layer, and a driving pin of the unit driving chip is electrically connected with the signal pad and the common pad. The second insulating packaging layer covers the signal pads and the common pads, but exposes the unit driving chips, and is provided with contact pads which are connected with data and power supply pins of the driving chips. According to the design, the occupation of the horizontal space of the display unit is reduced, the resolution ratio is improved, active driving is realized, and the loss of the luminous efficiency of the Micro-LED chip is avoided. Wherein the unit driving chip can be a silicon substrate, and due to the fact that the carrier mobility of the unit driving chip is higher, large-current driving is supported, and the display performance of the Micro-LED can be better exerted.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular to a stacked display unit and a display. Background Art

[0002] In recent years, with the rapid development of display technology, Micro-LED has become a hot spot in the new generation of display technology due to its excellent brightness, contrast and power consumption characteristics. In order to improve the production efficiency and yield of Micro-LED displays, technicians in this field have come up with the idea of ​​packaging the red, green and blue Micro-LED chips and the unit driver chips in the same display packaging unit. In the subsequent display production process, it is only necessary to arrange these display packaging units one by one on the corresponding circuit board.

[0003] However, in the current display packaging unit, the three-color Micro-LED chip and the unit driver chip are arranged on the same horizontal plane, which occupies a large amount of horizontal space and is not conducive to improving the resolution of the overall display. This defect is particularly prominent in display applications that pursue higher resolution and smaller pixel pitch. The large-sized display unit means that the number of pixels that can be arranged on the same area of ​​the display is limited, thus limiting the resolution improvement of the display. Summary of the invention

[0004] The purpose of the present application is to provide a stacked display unit and a display, which can improve the above-mentioned problems.

[0005] The embodiment of the present application is implemented as follows:

[0006] In a first aspect, the present application provides a stacked display unit, comprising: a sapphire substrate and a light emitting chip arrangement layer and a unit driving chip stacked in a vertical direction of the sapphire substrate;

[0007] The light-emitting chip arrangement layer includes Micro-LED chips for generating red light, green light and blue light; a first insulating packaging layer is filled between the Micro-LED chips, the first electrodes of each of the Micro-LED chips extend to a signal pad located on a surface of the first insulating packaging layer, and the second electrodes of each of the Micro-LED chips are electrically connected to each other and extend to a common pad located on a surface of the first insulating packaging layer;

[0008] The unit driving chip is also arranged on the first insulating packaging layer, and each driving pin of the unit driving chip is electrically connected to each signal pad and the common pad respectively; a second insulating packaging layer is also stacked on the first insulating packaging layer, and the second insulating packaging layer covers the signal pad and the common pad but exposes the unit driving chip; contact pads are arranged on the surface of the second insulating packaging layer, and each of the contact pads is electrically connected to each data pin and power pin of the unit driving chip.

[0009] It can be understood that the present application provides a stacked display unit, which vertically stacks and packages the light-emitting chip arrangement layer for generating red light, green light and blue light and the unit driver chip, which can greatly reduce the horizontal space occupied by the display unit, which is beneficial to improve the resolution of the overall display. In addition, the unit driver chip is packaged in the display unit, which can actively drive each Micro-LED chip, avoiding the problem of large luminous efficiency loss of the Micro-LED chip due to excessive current density caused by the traditional passive drive architecture solution.

[0010] In an optional embodiment of the present application, the unit driver chip is a silicon-based driver chip.

[0011] It is understandable that existing OLEDs often use LPTS (low temperature polycrystalline silicon) or IGZO (metal oxide) for active driving. However, the carrier mobility of LTPS and IGZO is lower than that of single crystal silicon. Therefore, if LPTS or IGZO is used to drive Micro-LED display, it is difficult to drive with high current and the display performance of Micro-LED cannot be fully utilized. This application selects silicon-based driver chips and Micro-LED chips for display unit packaging, which can better exert the display performance of Micro-LED.

[0012] In an optional embodiment of the present application, the light-emitting chip arrangement layer includes at least one red light Micro-LED chip, at least one blue light Micro-LED chip and at least one green light Micro-LED chip; the light-emitting surfaces of the red light Micro-LED chip, the blue light Micro-LED chip and the green light Micro-LED chip are all bonded to the sapphire substrate through a light-transmitting adhesive layer.

[0013] In an optional embodiment of the present application, the light-emitting chip arrangement layer includes at least three blue light Micro-LED chips, wherein a red light quantum dot unit and a red light filter unit are arranged between the first blue light Micro-LED chip and the sapphire substrate, a green light quantum dot unit and a green light filter unit are arranged between the second blue light Micro-LED chip and the sapphire substrate, and a blue light filter unit is arranged between the third blue light Micro-LED chip and the sapphire substrate.

[0014] It can be understood that the blue light beam emitted by the first blue light Micro-LED chip is converted into a red light beam through the red light quantum dot unit, and then becomes the red light output part of the display unit after passing through the red light filter unit, wherein the red light filter unit is used to transmit the converted red light beam and filter out the unconverted blue light beam. The blue light beam emitted by the second blue light Micro-LED chip is converted into a green light beam through the green light quantum dot unit, and then becomes the green light output part of the display unit after passing through the green light filter unit, wherein the green light filter unit is used to transmit the converted green light beam and filter out the unconverted blue light beam. The blue light beam emitted by the third blue light Micro-LED chip is directly emitted through the blue light filter unit and becomes the blue light output part of the display unit.

[0015] In an optional embodiment of the present application, the red light filter unit, the green light filter unit and the blue light filter unit are arranged on the surface of the sapphire substrate, and the surface of the sapphire substrate is also coated with a first water and oxygen barrier layer to cover each filter unit; the red light quantum dot unit is arranged in the orthographic projection area of ​​the red light filter unit on the first water and oxygen barrier layer, and the red light quantum dot unit and the corresponding red light filter unit constitute a first convex structure; the green light quantum dot unit is arranged in the orthographic projection area of ​​the green light filter unit on the first water and oxygen barrier layer, and the green light quantum dot unit and the corresponding green light filter unit constitute a second convex structure; a first light-transmitting filling layer is arranged on the first convex structure, the second convex structure and the surface of the blue light filter unit facing away from the sapphire substrate; the light-emitting surfaces of the first blue light Micro-LED chip, the second blue light Micro-LED chip and the third blue light Micro-LED chip are bonded to the first light-transmitting filling layer through a light-transmitting adhesive layer.

[0016] In an optional embodiment of the present application, the surface of the sapphire substrate is provided with grooves of the same number as the blue light Micro-LED chip; wherein the first groove is provided in the orthographic projection area of ​​the first blue light Micro-LED chip and is filled with the red light filter unit; the second groove is provided in the orthographic projection area of ​​the second blue light Micro-LED chip and is filled with the green light filter unit; the third groove is provided in the orthographic projection area of ​​the third blue light Micro-LED chip and is filled with the blue light filter unit; the surface of the sapphire substrate is covered with a second light-transmitting filling layer, The red light quantum dot unit and the green light quantum dot unit are arranged on the second light-transmitting filling layer, the red light quantum dot unit is arranged in the orthographic projection area of ​​the red light filtering unit, and the green light quantum dot unit is arranged in the orthographic projection area of ​​the green light filtering unit; a third light-transmitting filling layer is arranged on the surface of the red light quantum dot unit and the green light quantum dot unit facing away from the sapphire substrate; the light-emitting surfaces of the first blue light Micro-LED chip, the second blue light Micro-LED chip and the third blue light Micro-LED chip are bonded to the third light-transmitting filling layer through a light-transmitting adhesive layer.

[0017] It can be understood that the present application optimizes the thermal expansion matching of the filter unit by placing the filter unit in the groove. In addition, the filter unit is placed in the groove and no longer protrudes from the surface of the sapphire substrate, thereby ensuring the flatness of the surface of the sapphire substrate. This helps to alleviate the excessive concentration of stress in the water and oxygen barrier layer covering the surface of the filter unit, improve its adhesion to the substrate and deposition uniformity, thereby improving the defects of the water and oxygen barrier layer.

[0018] Optionally, the groove is a spherical groove protruding in the light emitting direction of the Micro-LED chip. On the one hand, the hemispherical groove is more conducive to alleviating the problem of excessive stress concentration of the water and oxygen barrier layer covering the surface of the filter unit. On the other hand, the refractive index of the filter material is greater than the refractive index of the sapphire substrate. In this way, the light beam emitted from the quantum dot unit will be refracted, thereby reducing the light emitting angle, which is more advantageous in scenarios where small-angle light emission is required (for example, as a light source device for augmented reality glasses).

[0019] In an optional embodiment of the present application, the surface of the sapphire substrate facing the Micro-LED chip includes at least one of the following:

[0020] The surface of the sapphire substrate facing the Micro-LED chip is a curved surface, and the curved surface is convex in the direction away from the light emitting direction of the Micro-LED chip. It can be understood that the concave curved surface is conducive to converging the red, green and blue light beams, further reducing the light emitting angle of the entire display unit;

[0021] The surface of the sapphire substrate facing the Micro-LED chip is a curved surface, and the curved surface is convex toward the light emitting direction of the Micro-LED chip. It can be understood that when making a spherical display, the convex curved surface can be designed according to the position and angle of the display unit, so that the display unit is more closely fitted to the outer surface of the spherical display;

[0022] The surface of the sapphire substrate facing the Micro-LED chip is a spherical surface, and the spherical surface is convex in the direction away from the light emitting direction of the Micro-LED chip. It can be understood that the concave spherical surface is also conducive to converging the red, green and blue light beams, further reducing the light emitting angle of the entire display unit;

[0023] The surface of the sapphire substrate facing the Micro-LED chip is a spherical surface, and the spherical surface protrudes toward the light emitting direction of the Micro-LED chip. It can be understood that when making a spherical display, the convex spherical surface can also be designed according to the position and angle of the display unit, so that the display unit can better fit the outer surface of the spherical display.

[0024] In an optional embodiment of the present application, when the surface of the sapphire substrate facing the Micro-LED chip is a curved surface, the curved surface is a surface formed by a single arc line extending in a straight direction, and the extension trajectory of the midpoint of the arc line forms a centerline axis, and the Micro-LED chips in the light-emitting chip arrangement layer are arranged symmetrically about the centerline axis.

[0025] In an optional embodiment of the present application, when the surface of the sapphire substrate facing the Micro-LED chip is a spherical surface, the Micro-LED chips in the light-emitting chip arrangement layer are arranged around the center point of the spherical surface.

[0026] In a second aspect, the present application discloses a display comprising a display backplane and a stacked display unit as described in any one of the first aspects; the display backplane comprises a driving circuit for driving the stacked display unit, and the stacked display unit array is arranged on the display backplane and electrically connected to the driving circuit.

[0027] Beneficial effects:

[0028] This stacked display unit significantly reduces the horizontal space occupied by vertically stacking the red, green and blue Micro-LED chips with the unit driver chip, which is beneficial to improving the display resolution. This design allows more pixels to be arranged in the same area to meet the needs of high resolution and smaller pixel pitch. At the same time, the unit driver chip is built into the display unit to realize the active drive of the Micro-LED chip, effectively avoiding the problem of luminous efficiency loss caused by traditional passive drive. This stacked structure not only optimizes space utilization, but also improves driving efficiency and display effects. It is a major innovation in Micro-LED display technology and provides strong support for the pursuit of higher performance displays.

[0029] Among them, the unit driver chip can be a silicon-based driver chip. Compared with traditional LTPS and IGZO, the silicon-based driver chip has higher carrier mobility and can support high current drive, thereby giving full play to the display performance of Micro-LED. This feature solves the problem of luminous efficiency loss caused by excessive current density in the passive drive architecture and improves the display effect. In addition, the integrated packaging technology of silicon-based driver chips and Micro-LED chips realizes more efficient driving and finer pixel control, providing strong support for Micro-LED displays that pursue high resolution and excellent display quality.

[0030] In order to make the above-mentioned objects, features and advantages of the present application more obvious and understandable, optional embodiments are specifically listed below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 is a cross-sectional schematic diagram of a first stacked display unit provided by the present application;

[0033] Figure 2 yes Figure 1 A schematic cross-sectional view along the dashed line AA';

[0034] Figure 3 yes Figure 1 A schematic cross-sectional view along the dashed line BB';

[0035] Figure 4 yes Figure 1 A schematic cross-sectional view along the dotted line CC';

[0036] Figure 5 yes Figure 1 A top view of the stacked display unit shown;

[0037] Figure 6 is a cross-sectional schematic diagram of a second stacked display unit provided by the present application;

[0038] Figure 7 is a cross-sectional schematic diagram of a third stacked display unit provided in the present application;

[0039] Figure 8 is a cross-sectional schematic diagram of a fourth stacked display unit provided by the present application;

[0040] Fig. 9 is a cross-sectional schematic diagram of a fifth stacked display unit provided by the present application;

[0041] Fig.10 yes Fig. 9 Schematic cross-sectional view along the dotted line EE'. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0043] First, as Figure 1 As shown, the present application provides a stacked display unit, which includes: a sapphire substrate 1 and a light-emitting chip arrangement layer and a unit driving chip 2 stacked along a vertical direction of the sapphire substrate 1 .

[0044] The light-emitting chip arrangement layer includes Micro-LED chips for generating red light, green light and blue light, such as Figure 1 As shown, the light-emitting chip arrangement layer includes a red light Micro-LED chip 31, a blue light Micro-LED chip 32 and a green light Micro-LED chip 33; the light-emitting surfaces of the red light Micro-LED chip 31, the blue light Micro-LED chip 32 and the green light Micro-LED chip 33 are all bonded to the sapphire substrate 1 through a transparent adhesive layer 8.

[0045] like Figure 1 As shown, the first insulating packaging layer 4 is filled between the Micro-LED chips. The first electrodes of each Micro-LED chip extend to the signal pad located on the surface of the first insulating packaging layer 4, and the second electrodes of each Micro-LED chip are electrically connected to each other and extend to the common pad located on the surface of the first insulating packaging layer 4. Figure 2 yes Figure 1 The cross-sectional diagram along the dotted line AA' is shown in FIG. Figure 2 As shown, the positive electrode 311 and the negative electrode 312 of the red light Micro-LED chip 31 are exposed from the first insulating encapsulation layer 4, and the other parts of the red light Micro-LED chip 31 are covered by the first insulating encapsulation layer 4; the positive electrode 321 and the negative electrode 322 of the green light Micro-LED chip 32 are exposed from the first insulating encapsulation layer 4, and the other parts of the green light Micro-LED chip 32 are covered by the first insulating encapsulation layer 4; the positive electrode 331 and the negative electrode 332 of the blue light Micro-LED chip 33 are exposed from the first insulating encapsulation layer 4, and the other parts of the blue light Micro-LED chip 33 are covered by the first insulating encapsulation layer 4. Figure 3 As shown, Figure 3 yes Figure 1 In the cross-sectional diagram along the dotted line BB', three signal pads and one common pad are arranged on the first insulating packaging layer 4. The first signal pad 51 is connected to the positive electrode 311 of the red light Micro-LED chip 31 through a conductive strip, the second signal pad 52 is connected to the positive electrode 321 of the green light Micro-LED chip 32 through a conductive strip, and the third signal pad 53 is connected to the positive electrode 331 of the blue light Micro-LED chip 33 through a conductive strip; the negative electrodes of the three LED chips are electrically connected to each other and extend to the common pad 54 through the conductive strip.

[0046] The first insulating packaging layer 4 is also provided with a unit driving chip 2, and each driving pin of the unit driving chip 2 is electrically connected to each signal pad and a common pad. Figure 4 As shown, the four pins a6, a2, a3, and a7 of the unit driving chip 2 are connected to the first signal pad 51, the second signal pad 52, the third signal pad 53, and the common pad 54 respectively.

[0047] A second insulating packaging layer 6 is further stacked on the first insulating packaging layer 4. The second insulating packaging layer 6 covers the signal pad and the common pad, but exposes the unit driving chip 2. Figure 5 As shown. A contact pad is arranged on the surface of the second insulating packaging layer 6, and each contact pad is electrically connected to each data pin and power pin of the unit driving chip 2. Figure 5 As shown, the communication data input pin a1 of the unit driving chip 2 is connected to the first contact pad 71 through a conductive strip, the communication data output pin a5 of the unit driving chip 2 is connected to the second contact pad 72 through a conductive strip, the power pin a4 of the unit driving chip 2 is connected to the third contact pad 73 through a conductive strip, and the ground pin a8 of the unit driving chip 2 is connected to the fourth contact pad 74 through a conductive strip.

[0048] It can be understood that the present application provides a stacked display unit, which vertically stacks and packages the light-emitting chip arrangement layer for generating red light, green light and blue light and the unit driver chip, which can greatly reduce the horizontal space occupied by the display unit, which is beneficial to improve the resolution of the overall display. In addition, the unit driver chip is packaged in the display unit, which can actively drive each Micro-LED chip, avoiding the problem of large luminous efficiency loss of the Micro-LED chip due to excessive current density caused by the traditional passive drive architecture solution.

[0049] In an optional embodiment of the present application, the unit driver chip can be a silicon-based driver chip. It can be understood that existing OLEDs often use LPTS (low-temperature polycrystalline silicon) or IGZO (metal oxide) for active driving. However, the carrier mobility of LTPS and IGZO is lower than that of single-crystal silicon. Therefore, if LPTS or IGZO is used to drive the Micro-LED display, it is difficult to drive with a large current, and the display performance of the Micro-LED cannot be fully utilized. The present application selects a silicon-based driver chip and a Micro-LED chip for display unit packaging, which can better exert the display performance of the Micro-LED.

[0050] In an optional embodiment of the present application, Figure 1 As shown, the light-emitting chip arrangement layer includes at least one red light Micro-LED chip, at least one blue light Micro-LED chip and at least one green light Micro-LED chip; the light-emitting surfaces of the red light Micro-LED chip, the blue light Micro-LED chip and the green light Micro-LED chip are all bonded to the sapphire substrate through a transparent adhesive layer.

[0051] In an optional embodiment of the present application, the above-mentioned light-emitting chip arrangement layer may also include at least three blue light Micro-LED chips, wherein a red light quantum dot unit and a red light filter unit are arranged between the first blue light Micro-LED chip and the sapphire substrate, a green light quantum dot unit and a green light filter unit are arranged between the second blue light Micro-LED chip and the sapphire substrate, and a blue light filter unit is arranged between the third blue light Micro-LED chip and the sapphire substrate.

[0052] like Figure 6As shown, a red light filter unit 101, a green light filter unit 102 and a blue light filter unit 103 are arranged on the surface of a sapphire substrate 1, and a first water and oxygen barrier layer 11 is also coated on the surface of the sapphire substrate 1 to cover each filter unit; a red light quantum dot unit 12 is arranged in the orthographic projection area of ​​the red light filter unit 101 on the first water and oxygen barrier layer 11, and the red light quantum dot unit 12 and the corresponding red light filter unit 101 form a first convex structure; a green light quantum dot unit 13 is arranged in the green light filter unit 101 on the first water and oxygen barrier layer 11 In the orthographic projection area of ​​the optical filtering unit 102, the green light quantum dot unit 13 and the corresponding green light filtering unit 102 constitute a second convex structure; the first convex structure, the second convex structure and the surface of the blue light filtering unit 103 facing away from the sapphire substrate 1 are provided with a first light-transmitting filling layer 14; the light-emitting surfaces of the first blue light Micro-LED chip 15, the second blue light Micro-LED chip 16 and the third blue light Micro-LED chip 17 are bonded to the first light-transmitting filling layer 14 through a light-transmitting adhesive layer.

[0053] It can be understood that the blue light beam emitted by the first blue light Micro-LED chip is converted into a red light beam through the red light quantum dot unit, and then becomes the red light output part of the display unit after passing through the red light filter unit, wherein the red light filter unit is used to transmit the converted red light beam and filter out the unconverted blue light beam. The blue light beam emitted by the second blue light Micro-LED chip is converted into a green light beam through the green light quantum dot unit, and then becomes the green light output part of the display unit after passing through the green light filter unit, wherein the green light filter unit is used to transmit the converted green light beam and filter out the unconverted blue light beam. The blue light beam emitted by the third blue light Micro-LED chip is directly emitted through the blue light filter unit and becomes the blue light output part of the display unit.

[0054] Figure 6 In the embodiment, black glue can be filled between the first protruding structure, the second protruding structure and the blue light filter unit 103 to prevent cross-talk. In addition, the red light quantum dot unit 12 and the green light quantum dot unit 13 are also wrapped by the second water and oxygen barrier layer 18.

[0055] In an optional embodiment of the present application, the surface of the sapphire substrate 1 is provided with grooves equal in number to the number of blue light Micro-LED chips. Figure 7As shown, the first groove 21 is arranged in the orthographic projection area of ​​the first blue light Micro-LED chip 15, and is filled with a red light filter unit; the second groove 22 is arranged in the orthographic projection area of ​​the second blue light Micro-LED chip 16, and is filled with a green light filter unit; the third groove 23 is arranged in the orthographic projection area of ​​the third blue light Micro-LED chip 17, and is filled with a blue light filter unit; the surface of the sapphire substrate 1 is covered with a second light-transmitting filling layer 20, and the second light-transmitting filling layer is provided with a red light quantum dot unit 12, a green light quantum dot unit 13 and a transparent material unit 25, and the red light quantum dot unit 12 is provided with a green light quantum dot unit 13 and a transparent material unit 25. The sub-dot unit 12 is arranged in the orthographic projection area of ​​the red light filter unit, the green light quantum dot unit 13 is arranged in the orthographic projection area of ​​the green light filter unit, and the transparent material unit 25 is arranged in the orthographic projection area of ​​the blue light filter unit; a third light-transmitting filling layer 24 is arranged on the surface of the red light quantum dot unit 12, the green light quantum dot unit 13, and the transparent material unit 25 facing away from the sapphire substrate 1; the light-emitting surfaces of the first blue light Micro-LED chip 15, the second blue light Micro-LED chip 16 and the third blue light Micro-LED chip 17 are bonded to the third light-transmitting filling layer 24 through a light-transmitting adhesive layer.

[0056] It can be understood that the present application optimizes the thermal expansion matching of the filter unit by placing the filter unit in the groove. In addition, the filter unit is placed in the groove and no longer protrudes from the surface of the sapphire substrate, thereby ensuring the flatness of the surface of the sapphire substrate. This helps to alleviate the excessive concentration of stress in the water and oxygen barrier layer covering the surface of the filter unit, improve its adhesion to the substrate and deposition uniformity, thereby improving the defects of the water and oxygen barrier layer.

[0057] The materials of the first light-transmitting filling layer 14, the second light-transmitting filling layer 20, and the third light-transmitting filling layer 24 can be acrylic resin, polyimide, poly(p-phenylene benzobisoxazole), silica gel, etc., the purpose of which is to keep the thickness of the first protruding structure, the second protruding structure and the blue light filtering unit 103 uniform.

[0058] Optionally, the groove is a spherical groove protruding in the light emitting direction of the Micro-LED chip. On the one hand, the hemispherical groove is more conducive to alleviating the problem of excessive stress concentration of the water and oxygen barrier layer covering the surface of the filter unit. On the other hand, the refractive index of the filter material is greater than the refractive index of the sapphire substrate. In this way, the light beam emitted from the quantum dot unit will be refracted, thereby reducing the light emitting angle, which is more advantageous in scenarios where small-angle light emission is required (for example, as a light source device for augmented reality glasses).

[0059] In an optional embodiment of the present application, the surface of the sapphire substrate 1 facing the Micro-LED chip includes at least one of the following.

[0060] Case 1: The surface of the sapphire substrate 1 facing the Micro-LED chip is a curved surface, and the curved surface is convex in the direction away from the light emitting direction of the Micro-LED chip, such as Figure 8 As shown, Figure 8 is a cross-sectional schematic diagram of another stacked display unit provided by the present application, Figure 8 The cross-sectional view of the DD' dashed line Figure 2 Similarly, the positive and negative electrodes of each Micro-LED chip are exposed from the first insulating packaging layer 4 through the conductive material 80. It can be understood that the concave arc surface is conducive to converging the red, green and blue light beams, further reducing the light output angle of the entire display unit.

[0061] Case 2: The surface of the sapphire substrate 1 facing the Micro-LED chip is a curved surface, and the curved surface protrudes toward the light emitting direction of the Micro-LED chip. It can be understood that when making a spherical display, the convex curved surface can be designed according to the position and angle of the display unit, so that the display unit can better fit the outer surface of the spherical display.

[0062] Case 3: The surface of the sapphire substrate 1 facing the Micro-LED chip is a spherical surface, and the spherical surface is convex in the direction away from the light emitting direction of the Micro-LED chip, such as Fig. 9 As shown, Fig. 9 It is a cross-sectional schematic diagram of another stacked display unit provided by the present application, in which the positive and negative electrodes of each Micro-LED chip are exposed from the first insulating encapsulation layer 4 through the conductive material 80. It can be understood that the concave spherical surface is also conducive to converging the red, green and blue light beams, further reducing the light output angle of the entire display unit. The distance from any point on the above spherical surface to the target point is equal, and the edge points of the spherical surface form a circle on the plane, and the center of the circle is the center point of the spherical surface. Fig.10 yes Fig. 9 The cross-sectional diagram along the dotted line EE' in FIG. 1 is a schematic diagram of a cross-sectional diagram along the dotted line EE' in FIG. 1 , where point Q is the positive projection area of ​​the above-mentioned center point. Fig.10As shown, the first insulating packaging layer 4 covers the red light Micro-LED chip 31, the blue light Micro-LED chip 32 and the green light Micro-LED chip 33. The positive electrode of the red light Micro-LED chip 31 is exposed from the first insulating packaging layer 4 through the conductive material 80 to form a first electrode region 331, and the negative electrode of the red light Micro-LED chip 31 is exposed from the first insulating packaging layer 4 through the conductive material 80 to form a second electrode region 332; the positive electrode of the blue light Micro-LED chip 32 is exposed from the first insulating packaging layer 4 through the conductive material 80 to form a third electrode region 333, and the negative electrode of the blue light Micro-LED chip 32 is exposed from the first insulating packaging layer 4 through the conductive material 80 to form a fourth electrode region 334; the positive electrode of the green light Micro-LED chip 33 is exposed from the first insulating packaging layer 4 through the conductive material 80 to form a fifth electrode region 335, and the negative electrode of the blue light Micro-LED chip 32 is exposed from the first insulating packaging layer 4 through the conductive material 80 to form a sixth electrode region 336. Fig.10 As shown, the Micro-LED chips in the light-emitting chip arrangement layer are arranged around the center point of the sphere.

[0063] Case 4: The surface of the sapphire substrate 1 facing the Micro-LED chip is a spherical surface, and the spherical surface protrudes toward the light emitting direction of the Micro-LED chip. It can be understood that when making a spherical display, the convex spherical surface can also be designed according to the position and angle of the display unit, so that the display unit can better fit the outer surface of the spherical display.

[0064] In an optional embodiment of the present application, when the surface of the sapphire substrate 1 facing the Micro-LED chip is a curved surface, the curved surface is a surface formed by a single arc line extending in a straight direction, and the extension trajectory of the midpoint of the arc line forms a centerline axis, and the Micro-LED chips in the light-emitting chip arrangement layer are arranged symmetrically about the centerline axis.

[0065] In an optional embodiment of the present application, when the surface of the sapphire substrate 1 facing the Micro-LED chip is a spherical surface, the Micro-LED chips in the light-emitting chip arrangement layer are arranged around the center point of the spherical surface.

[0066] In a second aspect, the present application discloses a display comprising a display backplane and a stacked display unit as described in any one of the first aspects; the display backplane comprises a driving circuit for driving the stacked display unit, an array of stacked display units is arranged on the display backplane and is electrically connected to the driving circuit.

[0067] The expressions "first", "second", "the first" or "the second" used in various embodiments of the present disclosure may modify various components regardless of order and / or importance, but these expressions do not limit the corresponding components. The above expressions are only configured for the purpose of distinguishing an element from other elements. For example, a first user device and a second user device represent different user devices, although both are user devices. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present disclosure.

[0068] When one element (e.g., a first element) is referred to as being "(operably or communicatively) coupled" or "(operably or communicatively) coupled to" or "connected to" another element (e.g., a second element), it is understood that the one element is directly connected to the other element or the one element is indirectly connected to the other element via yet another element (e.g., a third element). Conversely, it is understood that when an element (e.g., a first element) is referred to as being "directly connected" or "directly coupled" to another element (the second element), no element (e.g., a third element) is interposed between the two.

[0069] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0070] The above description is only an optional embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above invention concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other.

[0071] As used herein, the words "if" and "if" may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to determining" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)", depending on the context.

[0072] The above description is only an optional embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above invention concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other.

[0073] The above description is only an optional embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A stacked display unit, characterized in that: include: A sapphire substrate and a light-emitting chip arrangement layer and a unit driving chip stacked in a vertical direction of the sapphire substrate; The light-emitting chip arrangement layer includes Micro-LED chips for generating red light, green light and blue light; a first insulating packaging layer is filled between the Micro-LED chips, the first electrodes of each of the Micro-LED chips extend to a signal pad located on a surface of the first insulating packaging layer, and the second electrodes of each of the Micro-LED chips are electrically connected to each other and extend to a common pad located on a surface of the first insulating packaging layer; The unit driving chip is also arranged on the first insulating packaging layer, and each driving pin of the unit driving chip is electrically connected to each signal pad and the common pad respectively; a second insulating packaging layer is also stacked on the first insulating packaging layer, and the second insulating packaging layer covers the signal pad and the common pad but exposes the unit driving chip; contact pads are arranged on the surface of the second insulating packaging layer, and each of the contact pads is electrically connected to each data pin and power pin of the unit driving chip.

2. The stacked display unit according to claim 1, characterized in that: The light-emitting chip arrangement layer includes at least one red light Micro-LED chip, at least one blue light Micro-LED chip and at least one green light Micro-LED chip; the light-emitting surfaces of the red light Micro-LED chip, the blue light Micro-LED chip and the green light Micro-LED chip are all bonded to the sapphire substrate through a light-transmitting adhesive layer.

3. The stacked display unit according to claim 1, characterized in that: The light-emitting chip arrangement layer includes at least three blue light Micro-LED chips, wherein a red light quantum dot unit and a red light filter unit are arranged between the first blue light Micro-LED chip and the sapphire substrate, a green light quantum dot unit and a green light filter unit are arranged between the second blue light Micro-LED chip and the sapphire substrate, and a blue light filter unit is arranged between the third blue light Micro-LED chip and the sapphire substrate.

4. The stacked display unit according to claim 3, characterized in that: The red light filter unit, the green light filter unit and the blue light filter unit are arranged on the surface of the sapphire substrate, and the surface of the sapphire substrate is also coated with a first water and oxygen barrier layer to cover each filter unit; the red light quantum dot unit is arranged in the orthographic projection area of ​​the red light filter unit on the first water and oxygen barrier layer, and the red light quantum dot unit and the corresponding red light filter unit constitute a first convex structure; the green light quantum dot unit is arranged in the orthographic projection area of ​​the green light filter unit on the first water and oxygen barrier layer, and the green light quantum dot unit and the corresponding green light filter unit constitute a second convex structure; A first light-transmitting filling layer is arranged on the surfaces of the first protruding structure, the second protruding structure and the blue light filtering unit facing away from the sapphire substrate; the light-emitting surfaces of the first blue light Micro-LED chip, the second blue light Micro-LED chip and the third blue light Micro-LED chip are bonded to the first light-transmitting filling layer through a light-transmitting adhesive layer.

5. The stacked display unit according to claim 3, characterized in that: The surface of the sapphire substrate is provided with grooves of the same number as the blue light Micro-LED chip; wherein the first groove is provided in the orthographic projection area of ​​the first blue light Micro-LED chip and is filled with the red light filter unit; the second groove is provided in the orthographic projection area of ​​the second blue light Micro-LED chip and is filled with the green light filter unit; the third groove is provided in the orthographic projection area of ​​the third blue light Micro-LED chip and is filled with the blue light filter unit; The surface of the sapphire substrate is covered with a second light-transmitting filling layer, the red light quantum dot unit and the green light quantum dot unit are arranged on the second light-transmitting filling layer, the red light quantum dot unit is arranged in the orthographic projection area of ​​the red light filter unit, and the green light quantum dot unit is arranged in the orthographic projection area of ​​the green light filter unit; A third light-transmitting filling layer is arranged on the surface of the red light quantum dot unit and the green light quantum dot unit facing away from the sapphire substrate; the light-emitting surfaces of the first blue light Micro-LED chip, the second blue light Micro-LED chip and the third blue light Micro-LED chip are bonded to the third light-transmitting filling layer through a light-transmitting adhesive layer.

6. The stacked display unit according to claim 5, characterized in that: The groove is a spherical groove protruding toward the light emitting direction of the Micro-LED chip, and the refractive index of the red light filter unit, the green light filter unit, and the blue light filter unit are all greater than the refractive index of the sapphire substrate.

7. The stacked display unit according to any one of claims 1 to 6, characterized in that: The surface of the sapphire substrate facing the Micro-LED chip includes at least one of the following: The surface of the sapphire substrate facing the Micro-LED chip is a curved surface, and the curved surface is convex in a direction away from the light emitting direction of the Micro-LED chip; The surface of the sapphire substrate facing the Micro-LED chip is a curved surface, and the curved surface is convex toward the light emitting direction of the Micro-LED chip; The surface of the sapphire substrate facing the Micro-LED chip is a spherical surface, and the spherical surface is convex in a direction away from the light emitting direction of the Micro-LED chip; The surface of the sapphire substrate facing the Micro-LED chip is a spherical surface, and the spherical surface is convex toward the light emitting direction of the Micro-LED chip.

8. The stacked display unit according to claim 7, characterized in that: Also includes at least one of the following: When the surface of the sapphire substrate facing the Micro-LED chip is a curved surface, the curved surface is a surface formed by a single arc line extending in a straight direction, the extension trajectory of the midpoint of the arc line forms a centerline axis, and the Micro-LED chips in the light-emitting chip arrangement layer are arranged symmetrically about the centerline axis; When the surface of the sapphire substrate facing the Micro-LED chip is a spherical surface, the Micro-LED chips in the light-emitting chip arrangement layer are arranged around the center point of the spherical surface.

9. The stacked display unit according to any one of claims 1 to 6, characterized in that: The unit driving chip is a silicon-based driving chip.

10. A display, characterized in that: include: A display backplane and a stacked display unit as claimed in any one of claims 1 to 9; The display backplane includes the driving circuit for driving the stacked display units. The stacked display unit array is arranged on the display backplane and is electrically connected to the driving circuit.

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