Mobile socket

Abstract

The present application relates to a mobile socket. The mobile socket (100) comprises: a housing (101); a power supply assembly (102) comprising a power supply interface for the mobile socket; the functional components (103) are at least distributed on the first surface and the second surface of the shell, and each functional component comprises a jack; a circuit board assembly (104) disposed within the housing, the circuit board assembly being electrically connected to at least a portion of the functional components; and a heat sink (105), which is laid on the housing on the inner side of the housing, and which is designed to discharge heat via the housing.

Description

Technical Field

[0001] The present application relates to a mobile socket. Background Art

[0002] In the field of electrical connection, sockets are key equipment for power transmission. According to the installation method, they can be generally divided into fixed sockets and mobile sockets. Fixed sockets are typically wall sockets, which are usually embedded in the walls of buildings and fixedly connected to the power grid through the electrical wiring system. The position is relatively fixed and not easy to change after installation. In contrast, mobile sockets are socket devices with flexible access characteristics. They are connected to any available power interface in the power grid through their own power components, such as electrical contacts, and can reliably transmit power from the power grid to various types of electrical equipment plugged into them, providing power for the electrical equipment.

[0003] With the rapid development of modern technology, the types of household appliances are becoming more and more diverse, and their functions are becoming more and more diverse. From traditional refrigeration, heating, and lighting equipment to smart home appliances with IoT functions, such as smart home appliance control systems and smart home environment monitoring equipment, the widespread use of these devices has greatly improved the quality and convenience of life. At the same time, the demand for electricity supply is also showing a rapid growth trend, which is not only reflected in the increase in the number of electrical devices, but also includes higher requirements for power supply quality, power supply methods, and intelligent control.

[0004] In this context, smart power sockets have been proposed and gradually become key equipment to meet modern electricity needs. Compared with traditional mobile sockets, smart power sockets integrate intelligent control technologies such as remote control, power monitoring, overload protection, and timer switch on the basis of their basic power supply functions, realizing intelligent management and control of electrical equipment, and improving the safety, convenience, and energy saving of electricity use.

[0005] However, with the continuous expansion of the functions of smart power sockets and the increasing complexity of their structures, the integration of their internal components and electronic circuits continues to increase. In a limited space, high-density integrated electronic components and complex circuit systems will generate a lot of heat during operation. Due to the limitations of the internal space, its heat dissipation channels and heat dissipation area are restricted, and heat is difficult to dissipate effectively, which causes heat dissipation problems of internal components and electronic circuits. This problem may not only affect the normal operation and service life of smart power sockets, but also pose a potential threat to the safe operation of electrical equipment. Therefore, how to effectively solve the heat dissipation problem of sockets, especially smart power sockets, has become an urgent problem to be solved. Summary of the invention

[0006] Therefore, the task of the present application is to provide a mobile socket, which can overcome at least one defect in the prior art, thereby achieving effective heat dissipation, especially when the internal structure of the socket body is complex and the space is limited.

[0007] The object is achieved by a mobile socket.

[0008] The present application relates to a mobile socket, wherein the mobile socket comprises: a shell; a power supply assembly, the power supply assembly comprising a power supply interface for the mobile socket; functional components, the functional components are distributed at least on a first surface and a second surface of the shell, the functional components comprising a jack; a circuit board assembly arranged in the shell, the circuit board assembly is electrically connected to at least a part of the functional components; and a heat sink, the heat sink is laid on the shell on the inner side of the shell, and the heat sink is configured to conduct heat through the shell.

[0009] In the scope of the present application, a mobile socket can be understood as a socket that can flexibly access the power grid through its power supply component, especially the power supply interface, so as to provide power for the mobile socket itself and the electrical equipment plugged into the mobile socket. The mobile socket can include various functional components. Typically, the mobile socket can include a socket, especially a high-voltage socket for accessing the electrical equipment. The high-voltage socket can be, for example, a national standard socket, an American standard socket, a European standard socket, a British standard socket, a European standard socket, a South African standard socket, etc. It can be understood that the power supply interface of the mobile socket can belong to different plug / socket standards than the high-voltage socket it has, so that the mobile socket can also exist as a converter socket.

[0010] In the scope of the present application, the functional component can be understood as the following components, which are arranged on the housing of the mobile socket or arranged in the housing of the mobile socket and are at least partially accessible to the user (for example, via the corresponding opening of the housing). The user can interact with these components. The above-mentioned jack is a typical functional component, and the user can connect the electrical device to the jack. In addition, in some embodiments, especially for smart sockets, the functional component can also include at least one of a control device (such as a button, a touch screen, etc.), an indicator device (such as an LED lamp, a display screen, a digital tube, etc.), and a weak current jack (such as TYPE-A, TYPE-B, TYPE-C, Mini USB, Micro USB, Lighting interface, etc.). For miniaturized and integrated mobile sockets, it is advantageous that the functional components are distributed on at least two surfaces (i.e., the first surface and the second surface) of the housing of the mobile socket, thereby providing a variety of functions under a small form factor.

[0011] In addition, the mobile socket may further include a circuit board assembly disposed within the housing, the circuit board assembly being electrically connected to at least a portion of the functional components in the functional components so as to implement the corresponding functions of the functional components. In some cases, the functional components may exist as part of the circuit board assembly and, for example, be disposed on a circuit board of the circuit board assembly. In addition to the functional components disposed on the circuit board, the circuit board assembly may further include other electronic components disposed on the circuit board, which are accommodated in the housing of the mobile socket and are used to implement the corresponding functions of the mobile socket and are not used for (direct) interaction with the user. Examples of such electronic components may be an isolation transformer assembly, a rectifier / voltage regulator circuit, a wireless module, a processor, a memory, a sensor, and the like.

[0012] In the mobile socket according to the present application, a heat sink is advantageously provided inside the housing, the heat sink is laid on the housing on the inner side of the housing, and is configured to conduct heat from, for example, a power supply component, a functional component and / or a circuit board component through the housing. Here, the heat sink can be in planar contact with the housing, and there is a large heat-conducting contact surface between the heat sink and the housing, so that the heat inside the mobile socket can be transferred to the housing via the heat sink and dissipated through the housing. This heat dissipation method through the housing can effectively increase the heat dissipation area and does not occupy the design space of the original electronic circuit. Thus, the heat can be advantageously conducted through the housing without significantly affecting or even affecting the internal and external structural design of the mobile socket. In some cases, due to the presence of the heat sink, there is no need to reserve space in the housing for heat dissipation, so that the mobile socket can be designed to be more compact.

[0013] The technical solution according to the present application is particularly suitable for miniaturized and portable power sockets. Unlike some solutions mentioned in the prior art that do not require consideration or have a large space environment to arrange the heat dissipation structure, for these sockets, there is a complex constraint relationship between small size, compact structure, integrated functions and efficient heat dissipation, so it is very challenging to achieve a balance between these factors. Especially for intelligent power sockets with complex functions, the balance between factors such as volume, function, heat dissipation, and aesthetics is even more challenging. By following the technical solution of the present application, especially by laying a heat sink on the inner side of the shell, it is possible to achieve a balance between various factors, further optimize the internal structure design of the power socket, and improve assembly efficiency without changing the overall appearance of the socket, especially for sockets with complex functions.

[0014] According to one embodiment of the present application, the heat sink is at least partially located on the first surface and / or the second surface of the shell. Generally speaking, functional components distributed on the first surface and / or the second surface of the shell, especially components such as jacks that are frequently plugged in and out and carry current transmission, and components such as indicator devices that are in working state for a long time, may generate a large amount of heat during operation. By purposefully arranging heat sinks on the first surface and / or the second surface of the shell, the heat generated by the functional components can be effectively and quickly conducted away, and the temperature of the components can be reduced in time, thereby advantageously achieving heat dissipation and ensuring the stability and reliability of the equipment during long-term operation.

[0015] According to one embodiment of the present application, the heat sink extends on at least two adjacent surfaces of the shell. Here, a heat sink is not limited to a single surface of the shell, but can be cleverly extended on at least two adjacent surfaces of the shell. This unique layout breaks the limitations of traditional heat dissipation structures and fully considers the transfer and dissipation of heat inside the device. By extending the heat sink to at least another surface of the shell, more abundant heat conduction and dissipation paths can be provided. Here, the layout of the heat sink opens up a heat dissipation channel that spans multiple surfaces of the shell, and multiple surfaces of the shell are jointly included in the heat dissipation process, so that heat can be quickly and evenly transferred from the inside of the socket to the external environment. In particular, the heat sink can extend to non-heat-concentrated areas of the shell, which generally have lower temperatures, and conducting heat to these areas helps to dissipate heat more efficiently. In addition, this can effectively reduce the temperature difference inside the socket, reduce the potential damage to internal components caused by uneven temperature, and improve the stability and service life of the socket.

[0016] According to one embodiment of the present application, the heat sink is arranged in or near a heat concentration area of ​​the mobile socket, and the heat concentration area includes at least one of an area of ​​the power supply component, an area of ​​the functional component, and an area of ​​the circuit board assembly.

[0017] According to one embodiment of the present application, the heat concentration area includes the isolation transformer component and / or the rectification / voltage stabilization circuit and / or the wireless module and / or the processor and / or the memory and / or the socket area of ​​the mobile socket.

[0018] According to one embodiment of the present application, the heat sink is arranged between the housing and the circuit board assembly, and the heat sink is in direct or indirect contact with the housing and the circuit board assembly. In particular, for a functionally integrated smart socket, the circuit board assembly, such as its processor, wireless transceiver module, etc., generally has a large amount of heat. By arranging the heat sink between the housing and the circuit board assembly, the circuit board assembly can be dissipated in a targeted manner to ensure the reliable operation of the mobile socket. Here, "direct contact" can be understood as a direct heat transfer connection between the heat sink and the housing and / or the circuit board assembly without passing through other intermediate media. In contrast, "indirect contact" can be understood as the presence of an intermediate medium between the heat sink and the housing and / or the circuit board assembly, at least in a partial area. The heat sink can be arranged on the upper side (i.e., the electronic component side) and / or the lower side (i.e., the circuit board side) of the circuit board assembly.

[0019] According to one embodiment of the present application, the heat sink has an avoidance gap; and / or a heat-conducting element is provided between the heat sink and the circuit board assembly. The avoidance gap allows other elements / structures to pass through the heat sink without problems. These elements / structures may be, for example, elements / structures of the mobile socket itself, but may also be, for example, elements / structures outside the mobile socket, such as plugs of electrical equipment, etc. By adding a heat-conducting element, on the one hand, the gap between the heat sink and the circuit board assembly can be bridged to ensure reliable thermal contact; on the other hand, the thermal conductivity efficiency can be improved to achieve more efficient heat conduction. In some embodiments, the heat-conducting element can be constructed as a thermally conductive film or thermally conductive glue, such as silicone grease, etc., and the thermally conductive glue can be applied or injected into the desired position.

[0020] According to one embodiment of the present application, the heat-conducting element is arranged at a position corresponding to the heat-concentrating element of the circuit board assembly; and / or the heat-conducting element bridges the distance between the circuit board assembly and the heat sink. The heat-concentrating element can be understood as an element with a large amount of heat, such as an isolation transformer assembly, a rectifier / voltage regulator, a wireless signal processing unit, a processing unit for providing a power transmission protocol for identifying and operating a charging module with a weak current interface, a memory, etc. In this way, effective heat conduction and heat dissipation of these heat-concentrating elements can be ensured with the help of heat-conducting elements. In addition, for electronic components with a lower height on the circuit board assembly, the heat sink laid on the housing may not be able to directly contact these electronic components with a lower height. In this case, a heat-conducting element can be arranged between these electronic components with a lower height and the heat sink to ensure reliable thermal contact.

[0021] According to one embodiment of the present application, the circuit board of the circuit board assembly extends parallel to the side of the shell that is configured with a high-power socket. Generally speaking, the side of the mobile socket that is configured with a high-power socket can have a larger area, and the circuit board arranged parallel to this side can be correspondingly larger in size for use, thereby being able to more effectively utilize the internal space of the shell, integrate more electronic components, and achieve richer functions. In addition, a heat sink can be provided on the side of the shell that is configured with a high-power socket, and this heat sink can also extend directly on the shell to the area of ​​the circuit board assembly to form a coherent heat dissipation channel, which is conducive to more reasonable planning of the spatial layout inside the mobile socket, so that the heat sink and the circuit board assembly and other components cooperate more closely and orderly.

[0022] According to one embodiment of the present application, the mobile socket includes two circuit board assemblies, the circuit boards of the two circuit board assemblies are parallel to each other and spaced apart from each other in a direction perpendicular to the circuit boards. This embodiment is particularly suitable for a socket that is substantially in the shape of a three-dimensional cube, such as a portable conversion socket. Advantageously, the two circuit board assemblies can be arranged parallel to the surface of the mobile socket on which the power pins are provided. Advantageously, the two circuit board assemblies can be arranged in a manner facing each other, so that the circuit boards of the two circuit board assemblies can be closer to the surface of the housing, for example, on which the heat sink is already provided, and the heat dissipation of the circuit board can be performed simultaneously with the aid of the heat sink.

[0023] According to one embodiment of the present application, the mobile socket includes a temperature sensor and a processor electrically connected to the temperature sensor, and the temperature sensor is arranged in or near the heat concentration area of ​​the mobile socket. Here, a temperature monitoring function is advantageously added to the mobile socket, and the temperature sensor arranged in or near the heat concentration area can advantageously monitor the temperature inside the socket.

[0024] According to one embodiment of the present application, the processor is configured to limit or shut down at least a portion of the functions of the mobile socket according to the temperature measured by the temperature sensor. For example, when the temperature sensor detects that the internal temperature of the mobile socket exceeds the safety threshold, the processor can respond quickly and timely limit or shut down some functions of the socket to avoid potential safety hazards such as fire and electrical damage caused by excessive temperature, thereby providing users with reliable safety protection. In addition, this intelligent control mechanism can effectively prevent irreversible damage to key components such as circuit boards, electronic components, and sockets of the mobile socket itself due to overheating, thereby extending the service life of the socket and reducing maintenance costs.

[0025] According to one embodiment of the present application, the heat sink includes a metal layer and a thermally conductive adhesive layer located on one side or both sides of the metal layer. The metal layer can be a highly thermally conductive metal piece such as a copper sheet or an aluminum sheet. The thermally conductive adhesive layer can be, for example, an insulating thermally conductive silicone material known in the prior art, a high-temperature insulating tape layer, a thermally conductive silicone grease, or a thermally conductive insulating elastic rubber layer, and the material can be widely known silicone rubber, epoxy resin, polyurethane, graphene, etc. This layered structure of the heat sink can advantageously improve the thermal conductivity efficiency and the structural stability of the heat sink.

[0026] According to one embodiment of the present application, the functional component further includes at least one of a control device, an indicator device, and a sensor interface. The control device may be, for example, a button, a touch screen, a roller, a knob, etc., and the indicator device may be, for example, an LED lamp, a display screen, a digital tube, etc. The sensor interface may be, for example, a USB interface, an RJ45 Ethernet interface, an RS-485 interface, etc., which is used to connect the corresponding sensor. In addition, wireless interfaces such as a Wi-Fi interface, a Bluetooth interface, and a ZigBee interface are also conceivable.

[0027] Other features of the present application are derived from the drawings and the specific embodiments. All the features and feature combinations mentioned above in the specification and the features and feature combinations mentioned below in the specific embodiments and / or shown separately in the drawings can be used not only in the corresponding given combination, but also in other combinations, or can be used alone. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] After reading the following detailed description in conjunction with the accompanying drawings, various aspects of the present application will be better understood, in which:

[0029] Figure 1 A partial exploded perspective view of a mobile socket according to an embodiment of the present application is schematically shown;

[0030] Figure 2 Schematically shows Figure 1 An upper housing and a circuit board assembly of a mobile socket;

[0031] Figure 3 Schematically shows Figure 1 An upper housing of a mobile socket;

[0032] Figure 4 An exploded view of a mobile socket according to another embodiment of the present application is schematically shown. DETAILED DESCRIPTION

[0033] The present application will be described below with reference to the accompanying drawings, wherein the accompanying drawings illustrate several embodiments of the present application. However, it should be understood that the present application can be presented in a variety of different ways and is not limited to the embodiments described below; in fact, the embodiments described below are intended to make the disclosure of the present application more complete and fully explain the scope of protection of the present application to those skilled in the art. It should also be understood that the embodiments disclosed herein can be combined in various ways to provide more additional embodiments.

[0034] It should be understood that the terms used in the specification are only used to describe specific embodiments and are not intended to limit the present application. All terms (including technical terms and scientific terms) used in the specification have the meanings commonly understood by those skilled in the art unless otherwise defined. For the sake of simplicity and / or clarity, well-known functions or structures may not be described in detail.

[0035] The singular forms "a", "said" and "the" used in the specification include plural forms unless clearly indicated. The terms "include", "comprise" and "contain" used in the specification indicate the presence of the claimed features, but do not exclude the presence of one or more other features. The term "and / or" used in the specification includes any and all combinations of one or more of the relevant listed items.

[0036] In the specification, when an element is referred to as being “on,” “attached to,” “connected to,” “coupled to,” or “contacting” another element, etc., the element may be directly on, attached to, connected to, coupled to, or contacting another element, or intervening elements may be present.

[0037] In the specification, spatial relational terms such as "upper", "lower", "front", "back", "top", "bottom", etc. may describe the relationship of one feature to another feature in the drawings. It should be understood that the spatial relational terms include different orientations of the device in use or operation in addition to the orientation shown in the drawings. For example, when the device in the drawings is turned over, features previously described as being "below" other features may now be described as being "above" the other features. The device may also be oriented in other ways (rotated 90 degrees or in other orientations), and the relative spatial relationships will be interpreted accordingly.

[0038] Figures 1 to 3 A mobile socket 100 according to an embodiment of the present application is schematically shown. The mobile socket 100 comprises:

[0039] Housing 101;

[0040] A power supply assembly 102, the power supply assembly comprising a power supply interface for the mobile socket 100;

[0041] Functional components 103, which are distributed at least on the first surface 30 and the second surface 310 of the housing, and include jacks 31 and 312;

[0042] a circuit board assembly 200 disposed in the housing, the circuit board assembly being electrically connected to at least a portion of the functional components; and

[0043] A heat sink is disposed on the housing 101 on the inner side of the housing 101 and is configured to dissipate heat via the housing 101 .

[0044] Specifically, the housing 101 of the mobile socket 100 may include an upper housing 3 and a lower housing 1 assembled therewith. The upper housing 3 may be connected to the lower housing 1 by, for example, snap-fitting, threading, or bonding. Figure 1 and Figure 3 As shown, in the embodiment shown, the upper shell 3 and the lower shell 1 may respectively include threaded connection parts 15 corresponding to each other, and the upper shell 3 and the lower shell 1 may be fixedly connected to each other by bolts or screws passing through the corresponding threaded connection parts 15. The upper shell 3 and the lower shell 1 may jointly define the internal space of the shell. Figures 1 to 3 The mobile socket 100 shown can be configured as a power strip, and its power supply assembly can include an extension cable 4 and a power supply interface (not shown), such as a plug. The extension cable 4 can be inserted through the threading hole 20 (see FIG. Figure 3 ) is inserted into the housing to supply power to the mobile socket 100. Here, the lower housing 1 of the mobile socket 100 can exist as the bottom surface of the mobile socket 100. In the general use state of the mobile socket 100, the bottom surface defined by the lower housing 1 can be used to be placed on a supporting surface, such as a desktop, or contact other facades, such as a wall surface, when the mobile socket 100 is hung.

[0045] The mobile socket 100 can be constructed as a smart socket. The smart socket can not only have a larger number and different types of sockets, but also have functions such as sensor interface, network relay, overload protection, timer switch, etc. In order to provide diversified functions under limited external dimensions and internal space, the functional components of the mobile socket 100 can be distributed at least on the first surface 30 and the second surface 310 of the shell. Specifically, in the illustrated embodiment, at least one, preferably multiple first sockets 31 can be opened in the first surface 30 of the mobile socket 100, which is the upper wall 33 of the upper shell 3 opposite to the lower shell 1. The first socket 31 can exist as a high-voltage socket, which is a five-hole socket. In addition, other functional components can be provided in other areas on the first surface 30, such as the mechanical / touch-sensitive button area 35 shown in the figure, LED / LCD indicators, etc. In order to integrate more functions, such as Figure 2As shown, at least one, preferably multiple, second plug holes 312 may be provided on the second surface 310 of the mobile socket 100, which is the first side wall 34 of the upper housing 3. The second plug holes 312 may also be provided as strong current plug holes, which are two-hole plug holes. Figure 2 At least one, preferably multiple, second plug holes 312 are also provided on the second side wall 36 opposite to the second surface 310 visible in the figure. Advantageously, in some embodiments, the first plug hole 31 and the second plug hole 312 corresponding to each other can share a metal socket structure component, so that more plug holes can be integrated in a limited space. Additionally or alternatively, as Figure 2 As shown, a weak current socket group 311 may be provided on the second surface 310 of the mobile socket 100, which may be connected to the corresponding weak current interface 22 located in the housing. The weak current socket or weak current interface 22 may include at least one of TYPE-A, TYPE-B, TYPE-C, Mini USB, Micro USB, Lighting interface, etc.

[0046] In order to realize the corresponding functions of the functional components, the mobile socket 100 further includes a circuit board assembly 200 disposed in the housing. The circuit board assembly 200 can be electrically connected to at least a portion of the functional components in each functional component, such as the mechanical / touch-sensitive key area 35, the LED / LCD indicator and / or the weak current interface 22. In order to comply with the power usage specification, the first jack 31, the second jack 312 and the corresponding metal sockets, the conductive member 27, etc. for the strong current path can be electrically isolated from the circuit board assembly 200 in the weak current path.

[0047] like Figure 2 As shown, the upper housing 3 can be constructed in a hood shape and form an internal installation space 300 for accommodating the internal components of the mobile socket 100, such as the circuit board assembly 2, the metal socket for the strong current socket, the conductive member 27, the protective door structure 28, 29 and other components. Generally, the height of the side wall of the upper housing 3 (which is basically equivalent to the distance between the upper wall of the upper housing 3 and the bottom surface of the lower housing 1 in the illustrated embodiment) is determined by the conductive member 27 and its protective door structure 28, 29 accommodated in the internal installation space 300. In addition, the height of the side wall of the upper housing 3 can also be determined by comprehensively considering the overall height of the circuit board assembly 2 to obtain a socket overall design that is as flat and compact as possible. In order to more reasonably utilize the internal installation space 300 and provide more functions, on the one hand, a single-layer circuit board design can be used here to reduce the height of the side wall of the upper housing 3. On the other hand, as mentioned above, the functions of the smart socket can be expanded by adding more functional components to the upper wall, each side wall and even the bottom surface of the mobile socket 100.

[0048] In some embodiments, Figure 3 As shown, in order to achieve miniaturization of the socket as much as possible, the first protective door structure 28 for the first jack 31 can be retained, for example, via the first retaining portion 37, and can be limited and slid in the first retaining portion 37. The second protective door structure 29 for the second jack 312 can be retained, for example, via the second retaining portion 32, and can be limited and slid in the second retaining portion 32. The first retaining portion 37 can be constructed on the inner side of the upper wall 33 of the upper shell 3 in the area where the first jack 31 is opened, and the second retaining portion 32 can be constructed on the inner side of the first side wall 34 of the upper shell 3 in the area where the second jack 312 is opened. Similarly, if a jack is opened in the second side wall 36 of the upper shell 3, a corresponding retaining portion can also be constructed in the corresponding area of ​​the second side wall 36 for retaining the corresponding protective door structure.

[0049] In some embodiments, Figure 1 As shown, a clamping rib 13 for fixing the conductive member 27 may be provided on the bottom surface 11 of the lower housing 1 to fix the conductive member 27 as compactly as possible.

[0050] In some embodiments, in order to obtain a configuration that is as flat and compact as possible, the circuit board 2 of the circuit board assembly 200 can extend parallel to the surface of the housing on which the high-voltage socket is constructed. High-voltage sockets, especially five-hole sockets or three-hole sockets, generally occupy a larger area, so the surface of the mobile socket 100 on which the high-voltage socket is constructed can generally have a larger, preferably the largest, area. By arranging the circuit board 2 parallel to this surface, a circuit board with a larger area can be selected, and more electronic components can be arranged on the circuit board 2, thereby providing more abundant functions. Specifically, in Figures 1 to 3 In the illustrated embodiment, the circuit board 2 of the circuit board assembly 200 may be arranged parallel to the upper wall 33 of the upper housing 3. In addition, the circuit board assembly 200 may include a key control unit 26, which may abut against a key 25 embedded in a key area 35 of the upper wall 33 to receive a control input, such as for turning on / off a relay element, setting an operating mode, a countdown and / or a network configuration function, etc.

[0051] In order to achieve heat dissipation of the mobile socket 100, as Figure 1As shown, the mobile socket 100 includes heat sinks 12 and 23, which are laid on the inner side of the housing and are configured to conduct heat through the housing. In order to achieve a good heat dissipation effect, in some embodiments, the heat sinks 12 and 23 can be arranged in or near the heat concentration area of ​​the mobile socket 100. The heat concentration area may include at least one of the area of ​​the power supply component, the area of ​​the functional component, and the area of ​​the circuit board component. In particular, the heat concentration area may include the area of ​​the isolation transformer component and / or the rectification / voltage stabilization circuit and / or the wireless module and / or the processor and / or the memory and / or the jack of the mobile socket 100.

[0052] exist Figures 1 to 3 In the illustrated embodiment, a heat sink may be provided in the region of the circuit board assembly 200. Advantageously, a first heat sink 23 and a second heat sink 12 may be provided on both sides of the circuit board assembly 200, respectively. It is understandable that a large number of electronic components are generally densely arranged on the circuit board assembly 200, and these electronic components may have a large amount of heat generation. Therefore, providing a heat sink in the region of the circuit board assembly 200 can achieve targeted heat dissipation for the circuit board assembly 200. The first heat sink 23 may be arranged between the upper side of the circuit board assembly 200 and the upper wall 33 of the upper shell 3, while the second heat sink 12 may be arranged between the bottom side of the circuit board assembly 200 (i.e., the back side of the circuit board 2) and the lower shell 1. Advantageously, the area of ​​at least one heat sink may be larger than the area of ​​the circuit board assembly 200 or the circuit board 2, so that the heat energy generated on the circuit board 2 can be well conducted to the upper shell 3 and / or the lower shell 1. As Figure 1 As shown, the area of ​​the second heat sink 12 arranged on the back side of the circuit board 2 can be larger than the area of ​​the circuit board 2 .

[0053] Alternatively or additionally, in some embodiments, a heat sink may be provided in an area of ​​the housing where functional components, especially functional components with high heat generation, are provided. Functional components with high heat generation may be, for example, jacks, indicating devices (such as LED lights, display screens, digital tubes), etc. The heat sink may be arranged, for example, around the jacks or indicating devices.

[0054] In some embodiments, the heat sink can be laid and fixed by bonding, injection molding, etc. For example, the heat sink can exist as a heat sink film with an adhesive backing, and the heat sink film can be bonded to the housing with the adhesive backing. For example, the heat sink can initially exist as a heat sink gel or heat sink silicone grease, and the heat sink gel or heat sink silicone grease can be injected and applied to the corresponding area and formed into a heat sink after a certain curing process if necessary. In some embodiments, for example, for a heat sink disposed between the circuit board 2 and the housing, the heat sink can also be directly clamped between the circuit board 2 and the housing without the need for an adhesive connection.

[0055] In some embodiments, the heat sink may be constructed as a composite layer. For example, the heat sink may include a metal layer and a thermally conductive adhesive layer located on one or both sides of the metal layer. The metal layer may be a highly thermally conductive metal member such as a copper sheet or an aluminum sheet. A thermally conductive adhesive layer may be applied on one or both sides of the metal layer, and the thermally conductive adhesive layer may be, for example, an insulating thermally conductive silicone material known in the prior art, a high-temperature insulating tape layer, a thermally conductive silicone grease, or a thermally conductive insulating elastic rubber layer.

[0056] In some embodiments, Figure 1 and Figure 2 As shown, a heat conducting element 21 may be provided between the heat sink and the circuit board assembly 200. The heat conducting element 21 may be provided at a position corresponding to the heat concentrating element of the circuit board assembly 200, and / or the heat conducting element may bridge the distance between the circuit board assembly 200 and the heat sink. Figure 1 As for the first heat sink 23 shown and arranged between the upper side of the circuit board assembly 200 and the upper wall 33 of the upper shell 3, a heat-conducting element 21 can be applied to some electronic components of the circuit board assembly 200. The electronic components that need to be applied with the heat-conducting element 21 may be, for example, so-called "heat-concentrating elements", that is, these electronic components may have a large amount of heat generation, such as isolation transformer assemblies, rectifiers / regulators, wireless signal processing units, processing units for providing a power transmission protocol for identification and operation of a charging module with a weak current interface 22, memories, etc. In this way, effective heat conduction and heat dissipation of these heat-concentrating elements can be ensured with the help of the heat-conducting element 21. In addition, the electronic components that need to be applied with the heat-conducting element 21 may also have a relatively low height, so that the heat sink laid on the shell cannot directly establish a thermal connection with such electronic components. In this case, the distance between such electronic components with a relatively low height and the heat sink can be bridged with the help of the heat-conducting element 21 to ensure the heat conduction and heat dissipation effect of these heat-concentrating elements. In addition, for example, for Figure 1 The second heat sink 12 shown as being arranged between the back side of the circuit board 2 and the lower housing 1 may also have a heat conducting element 21 attached therebetween. The position of the heat conducting element 21 may also correspond to the position of the heat concentrating element on the circuit board 2.

[0057] In some embodiments, alternatively or in addition to the sheet-shaped thermal conductive element 21, a thermal conductive element in the form of thermal conductive adhesive may be injected into the gap between the heat sink and the component that needs to dissipate heat (such as the circuit board 2, the heat concentrating element on the circuit board 2, etc.) to enhance the heat dissipation effect.

[0058] In some embodiments, the heat sink may have a clearance gap. The clearance gap allows other elements / structures to pass through the heat sink without problems. These elements / structures may be, for example, elements / structures of the mobile socket 100 itself, but may also be, for example, elements / structures outside the mobile socket 100, such as plugs of electrical appliances. For example, when the circuit board assembly 200 has relatively protruding parts, so that the distance between the protruding parts and the housing is very small, especially less than the thickness of the heat sink, a clearance gap may be opened at a position opposite to the protruding parts, so as to reliably install the heat sink without causing deformation, bending or even damage to these protruding parts. In addition, a clearance gap may also be opened at a position corresponding to a plug-in connector or a light guide. In some embodiments, a clearance gap may be opened at a position corresponding to, for example, a sensor or a wireless transceiver, so as to avoid affecting the function of the sensor or the wireless transceiver due to the presence of the heat sink. For example, a heat sink with a metal layer may have a certain shielding effect on electromagnetic waves, and opening a clearance gap at a position of the heat sink corresponding to the wireless transceiver may reduce or eliminate interference with the wireless transceiver.

[0059] In some embodiments, the heat sink may extend on at least two adjacent surfaces of the housing of the mobile socket 100. For example, Figure 1 The first heat sink 23 shown in the figure can extend from the upper wall 33 of the upper housing 3 to the first side wall 34 and / or the second side wall 36 adjacent to the upper wall 33. Thus, on the one hand, the adjacent side walls can be advantageously used as heat dissipation surfaces to improve heat dissipation efficiency; on the other hand, the design space of the original electronic circuit in the housing can be minimized.

[0060] In some embodiments, in order to maintain effective temperature control, the mobile socket 100 may include a temperature sensor and a processor electrically connected to the temperature sensor. The temperature sensor may be arranged in or near the heat concentration area of ​​the mobile socket 100. The temperature sensor may be used to monitor the internal temperature of the housing and ensure the normal operation of each component. The processor may obtain the temperature information measured by the temperature sensor in order to control the operation of the mobile socket 100. Specifically, the processor may, for example, limit or shut down at least a portion of the functions of the mobile socket 100, such as shutting down a portion of the electronic circuit or limiting the power of a portion of the electronic circuit, after the temperature measured by the temperature sensor exceeds a set threshold. This ensures that the mobile socket 100 operates at a safe temperature.

[0061] Figure 4 A mobile socket 100 according to another embodiment of the present application is schematically shown.

[0062] The mobile socket 100 can be configured as a portable conversion socket. The housing of the mobile socket 100 can include an upper housing 3 and a lower housing 1 assembled therewith. A first jack 31, for example, as a strong current jack, can be provided on the upper wall 33 and / or the side wall (for example, the first side wall 34 or the third side wall 38) of the upper housing 3. The first jack 31 is configured as a five-hole jack. Alternatively or additionally, a weak current jack 513 can also be provided on the upper wall 33 and / or the side wall, here the first side wall 34, of the upper housing 3, and the weak current interface 22 inside the housing can be aligned with the weak current jack 513 for the corresponding weak current plug to be connected. The weak current interface 22 can be configured as a TYPE-A interface. By arranging a strong current jack and a weak current jack in combination on the mobile socket 100, a comprehensive intelligent socket function can be provided. Here, the power interface of the mobile socket 100 can be configured as a plug pin 561 inserted on the bottom surface 560 of the lower housing 1, and the mobile socket 100 can be directly plugged into the corresponding power grid interface via the plug pin 561 to draw power from the power grid. In addition, an indicator device 515 can also be provided in the upper wall 33 of the mobile socket 100. The indicator device 515 can be configured as an LED lamp.

[0063] Combined with Figures 1 to 3 The mobile socket shown is different, in order to adapt to the square shape of the outer structure, Figure 4 The mobile socket 100 shown may include at least two circuit board assemblies, here exactly two circuit board assemblies, namely, a first circuit board assembly 201 having a first circuit board 52 and a second circuit board assembly 202 having a second circuit board 55. The first circuit board 52 and the second circuit board 55 may be parallel to each other and in a direction perpendicular to the circuit boards (i.e. Figure 4 The vertical direction in the figure is spaced apart from each other. Figure 4 , the first circuit board assembly 201 and the second circuit board assembly 202 can be arranged in a manner facing each other. Specifically, the second circuit board assembly 202 can be arranged in the housing in a so-called "upright" manner, where the second circuit board 55 is located at the bottom, and the electronic components carried by the upper side 550 of the second circuit board 55 are located above the second circuit board 55. In contrast, the first circuit board assembly 201 can be arranged in the housing in a so-called "inverted" manner, where the first circuit board 52 is located at the top, and the electronic components carried by the surface 521 of the first circuit board 52 are located below the first circuit board 52. As a result, the first circuit board 52 can be arranged closer to the upper wall 33 of the upper housing 3, and the second circuit board 55 can be arranged closer to the bottom surface 560 of the lower housing 1. By arranging the circuit board closer to the corresponding surface of the housing, it is beneficial to conduct heat and dissipate heat to the corresponding circuit board assembly through the heat sink laid on the inner side of the housing, which will be explained in more detail below.

[0064] Here, the first circuit board assembly 201 and the second circuit board assembly 202 can be electrically connected to each other, and a liner 53 can be provided between the first circuit board assembly 201 and the second circuit board assembly 202 for support and isolation. The liner 53 can have a positioning structure for accommodating the outer contours of the first circuit board assembly 201 and the second circuit board assembly 202 to achieve this stable support and isolation. For example, a side of the first side wall 34 of the liner 53 facing the housing can be provided with a positioning groove 533 to avoid the weak current interface 22 of the first circuit board assembly 201 from contacting the second circuit board assembly 202, and can provide force support when plugging and unplugging. Alternatively, in some embodiments, if the weak current interface 22 or the weak current jack 513 is replaced with a strong current interface, the positioning groove 533 can also be used to accommodate the corresponding metal plug sleeve. The electronic components of the mobile socket 100 can be distributed on the first circuit board assembly 201 and the second circuit board assembly 202 as needed. If necessary, the electronic components of the first circuit board assembly 201 can be connected to the electronic components of the second circuit board assembly 202 for synergy. Here, the second circuit board assembly 202 may include electronic components such as a signal processing unit and a storage unit.

[0065] In order to supply power to the circuit system of the mobile socket 100, a contact point that is in electrical contact with the electrical contact 564 on the lower housing 1 may be provided on the back side 551 of the second circuit board 55, and the contact point may be welded to the electrical contact 564. The electrical contact 564 and / or the contact point may be electrically connected to the conductive end of the metal socket 54 matched with the first socket 31 on the one hand, and may be electrically connected to the power supply component of the second circuit board assembly 202 on the other hand. The power supply component may include an isolation transformer 553, a rectifier / voltage stabilizing circuit, etc., so as to provide an adaptive voltage for the weak current system of the mobile socket 100. The power output of the second circuit board assembly 202 may be delivered to the first circuit board assembly 201 through one or more electrical connector interfaces 554 via the electrical contact pins 524, so as to supply power to the first circuit board assembly 201. The metal socket 54 may penetrate the opening 534 in the center of the liner 53 and the opening 522 at the corresponding position of the first circuit board assembly 201 side by side so as to align with the first socket 31.

[0066] In order to adapt to the square shape of the mobile socket 100, the first circuit board assembly 201, the liner 53 and the second circuit board 202 assembly can be stacked to form a relatively regular cubic structure as much as possible. The first circuit board assembly 201 can be fixed to the liner 53, for example, via a threaded connection. If necessary, the liner 53 can separate the electrical contact pins 524 or the electrical connector interface 554 by the support rod 532. A clamping rib 563 for clamping the second circuit board assembly 202 to a fixed position / height can be constructed on the lower shell 1, wherein the clamping rib 563 can be engaged with the clamping groove 552 on the second circuit board assembly 202, and can achieve physical isolation of the metal socket 54 after welding. The liner 53 can be fixed on the threaded connection portion 567 of the lower shell 56.

[0067] Advantageously, heat sinks (herein referred to as the third heat sink 516 and the fourth heat sink 565) may be respectively laid on the upper wall 33 of the upper shell 3 and the bottom surface 560 of the lower shell 1 for dissipating heat. Specifically, the third heat sink 516 laid on the upper wall 33 may be in thermal contact with the back side 520 of the first circuit board assembly 201. The heat conducting element 21 may be applied to some positions of the first circuit board assembly 201 (e.g., the heat concentration area or the position corresponding to the heat concentration element) so as to enhance the heat conduction effect through the heat conducting element 21. The heat sink 516 may at least partially surround the first plug hole 31 and have a corresponding avoidance notch at least in the area of ​​the first plug hole 31. The heat sink 516 may advantageously extend from the upper wall 33 to the side wall adjacent to the upper wall 33, which is the third side wall 38 in this case. The fourth heat sink 565 laid on the bottom surface 560 of the lower shell 1 can be arranged at least partially around the electrical contact 564 or the pin 561, and the fourth heat sink 565 can also have an avoidance gap for fixing parts such as the clamp 563 and the stud 567. In order to achieve a better heat conduction effect, the fourth heat sink 565 can be configured to cover the bottom surface 560 of the lower shell 1 as much as possible and extend a certain height to the side wall 562 of the lower shell when necessary. In addition, one or more heat-conducting elements 21 can be laid on the fourth heat sink 565, and the heat-conducting elements 21 can be located in the heat concentration area or at a position corresponding to the heat concentration element, especially at a position corresponding to certain processing chips. It can be understood that each heat-conducting element 21 can have different configurations (such as thickness, shape, material, etc.), and the correspondingly adapted heat-conducting elements can be selected according to the characteristics and requirements of the area where the heat-conducting element 21 is required.

[0068] It is understood that the heat sink does not have to be arranged in conjunction with the circuit board. Figure 4 The first side wall 34 of the mobile socket 100 with the weak current socket 513 is provided with a corresponding heat sink. Figures 1 to 3The mobile socket 100 shown in the figure can be provided with a heat sink in the area of ​​the upper wall 33 where the first socket 31 is provided, and / or a heat sink can be provided in the area of ​​the first side wall 34 where the second socket 312 is provided or in the area where the low-voltage socket group 311 is provided.

[0069] Although the present application has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present application. Any technical personnel in this field can use the methods and technical contents disclosed above to make possible changes and modifications to the technical solution of the present application without departing from the spirit and scope of the present application. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are within the protection scope of the technical solution of the present application.

Claims

1. A mobile socket, characterized in that: The mobile socket (100) comprises: Housing (101); A power supply component (102), the power supply component comprising a power supply interface for the mobile socket; A functional component (103), the functional component being distributed at least on the first surface (30) and the second surface (310) of the housing, the functional component comprising a socket; a circuit board assembly (104) disposed within the housing, the circuit board assembly being electrically connected to at least a portion of the functional components; and A heat sink (105) is applied to the housing on the inner side of the housing and is configured to dissipate heat via the housing.

2. The mobile socket according to claim 1, characterized in that: The heat sink is at least partially located on the first surface and / or the second surface of the housing.

3. The mobile socket according to claim 1 or 2, characterized in that: The heat sink extends on at least two adjacent surfaces of the housing.

4. The mobile socket according to any one of claims 1 to 3, characterized in that: The heat sink is disposed in or near a heat concentration region of the mobile socket, and the heat concentration region includes at least one of a region of the power supply assembly, a region of the functional component, and a region of the circuit board assembly.

5. The mobile socket according to claim 4, characterized in that: The heat concentration area includes the isolation transformer component and / or the rectification / voltage stabilization circuit and / or the wireless module and / or the processor and / or the memory and / or the socket area of ​​the mobile socket.

6. The mobile socket according to any one of claims 1 to 5, characterized in that: The heat sink is disposed between the housing and the circuit board assembly, and the heat sink is in direct or indirect contact with the housing and the circuit board assembly.

7. The mobile socket according to any one of claims 1 to 6, characterized in that: The heat sink has an avoidance notch; and / or a heat conducting element (21) is arranged between the heat sink and the circuit board assembly.

8. The mobile socket according to claim 7, characterized in that: The heat conducting element is disposed at a position corresponding to the heat concentrating element of the circuit board assembly; and / or the heat conducting element bridges the distance between the circuit board assembly and the heat sink.

9. The mobile socket according to any one of claims 1 to 8, characterized in that: The circuit board of the circuit board assembly extends parallel to a side of the housing having a high-voltage socket; and / or the mobile socket comprises two circuit board assemblies, the circuit boards of the two circuit board assemblies are parallel to each other and spaced apart from each other in a direction perpendicular to the circuit boards.

10. The mobile socket according to any one of claims 4 to 9, characterized in that: The mobile socket includes a temperature sensor and a processor electrically connected to the temperature sensor, wherein the temperature sensor is disposed in or near a heat concentration area of ​​the mobile socket.

11. The mobile socket according to claim 10, characterized in that: The processor is configured to limit or shut down at least a portion of the functions of the mobile socket according to the temperature measured by the temperature sensor.

12. The mobile socket according to any one of claims 1 to 11, characterized in that: The heat sink comprises a metal layer and a heat conductive adhesive layer located on one side or both sides of the metal layer.

13. The mobile socket according to any one of claims 1 to 12, characterized in that: The functional component further includes at least one of a manipulation device, an indication device, and a sensor interface.

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