High-speed VCSEL semiconductor chip protection packaging device and packaging method

Abstract

The invention relates to the technical field of packaging devices, in particular to a high-speed VCSEL (Vertical Cavity Surface Emitting Laser) semiconductor chip protection packaging device and a packaging method, which can better improve the filling quality and the filling efficiency of filling glue while realizing chip packaging glue dispensing, are better in chip packaging quality, are more practical, and are higher in reliability. Comprising a supporting bracket, a rotating dispensing system and a transposition clamping system, the rotating dispensing system comprises a conveying pump, a first servo motor, a rotating cylinder and a plurality of material distribution pipes, the conveying pump and the first servo motor are both installed on the supporting bracket, and the rotating cylinder is rotationally connected into the supporting bracket; the first servo motor is used for driving the rotating cylinder to rotate relative to the supporting support, a vertical pipe is fixedly connected into the rotating cylinder, the multiple material distribution pipes communicate with the vertical pipe, the vertical pipe communicates with the conveying pump, the transposition clamping system comprises a suspension support and a second servo motor, and the suspension support is fixedly connected with the supporting support. A rotating shaft is rotationally connected between the suspension support and the supporting support, and the second servo motor is installed on the suspension support.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging devices, and in particular to a high-speed VCSEL semiconductor chip protection packaging device and a packaging method. Background Art

[0002] As we all know, high-speed VCSEL semiconductor chips play a key role in modern communication and sensing technology. In order to facilitate the protection and packaging operation in the preparation process of high-speed VCSEL semiconductor chips, we propose a high-speed VCSEL semiconductor chip protection packaging device and packaging method.

[0003] After searching, the Chinese patent announcement number CN115831823A discloses an integrated circuit semiconductor chip packaging device and a packaging method thereof, which is roughly described as including a base, a support rod, a top plate, a support bracket, a transmission part, a rotating motor, a sliding limit rod, a lifting part, a threaded transmission part, a sliding support part, a horizontal sliding motor, a limit part and a pressing part. The top of the base is connected to the support rod, the end of the support rod away from the base is connected to the top plate, the top of the top plate is connected to the support bracket, and the support bracket is hollow inside. When in use, the chip is placed on a limit groove of corresponding shape and size, and the semi-finished chip is formed by vertical pressing. A metal protective shell is pressed and installed on the top of the surface. The Chinese patent announcement number CN218647911U discloses a limit clamp suitable for semiconductor chip packaging, which is roughly described as including a base and a clamping part. The base is fixedly connected to the workbench by four fixing bolts. The base is a convex structure, and when the fixing bolts are tightened, the left and right sides of the base are elastically bent. The clamping part is composed of a clamp seat, an elastic telescopic rod, a clamping plate, a piston bottle, a connecting pipe and an air jet pipe, and there are eight clamping parts in total, and the eight clamping parts are arranged opposite to each other in groups of two. When in use, the semiconductor chip is clamped and positioned by the clamping plates on the left and right sides.

[0004] Both of the above-mentioned two existing technical solutions cover the auxiliary clamping and positioning structure in the chip packaging process. Although both sets of clamping and positioning structures can form auxiliary compression and positioning for matching chips, the chip packaging process mostly includes glue coating operations, especially the chip gluing process of flip-chips. Since the flip-chip is connected to the substrate of the circuit board by bumps, if there is a difference in thermal expansion, stress will be generated on the connection point. Therefore, bottom filling glue needs to be filled between the chip and the substrate to relieve stress fatigue of the connection point. The gluing quality requirements for this part of the filling glue are higher, and parameters such as the gluing amount need to be strictly controlled during the packaging process. Summary of the invention

[0005] In view of the problems in the prior art, the present invention provides a high-speed VCSEL semiconductor chip protection packaging device and packaging method, which can improve the filling quality and filling efficiency of the filling glue while realizing chip packaging dispensing, and the chip packaging quality is better and more practical.

[0006] The technical solution adopted by the present invention to solve its technical problem is: a high-speed VCSEL semiconductor chip protection packaging device, including a support bracket, a rotating dispensing system and a transfer clamping system; The rotary dispensing system includes a delivery pump, a first servo motor, a rotating cylinder and a plurality of material dispensing tubes. The delivery pump and the first servo motor are both installed at the bottom end of the support bracket. The rotating cylinder is rotatably connected in the support bracket. The first servo motor is used to drive the rotating cylinder to rotate relative to the support bracket. A vertical tube is fixedly connected in the rotating cylinder. The plurality of material dispensing tubes are all connected to the vertical tube, and the vertical tube is connected to the delivery pump. The transfer clamping system includes a suspension bracket and a second servo motor, the suspension bracket is fixedly connected to the supporting bracket, and a swivel shaft is rotatably connected between the suspension bracket and the supporting bracket, the second servo motor is installed on the suspension bracket, the second servo motor is used for rotational driving of the swivel shaft, a swivel plate frame is fixedly connected to the swivel shaft, a plurality of circular openings are opened on the swivel plate frame, a plurality of centrifugal cylinders are arranged in the plurality of circular openings, a plurality of positioning clamps are installed in the plurality of centrifugal cylinders, a plurality of centrifugal cylinders are rotatably connected to the outside with support rings, a plurality of support springs are connected between the plurality of support rings and the swivel plate frame, a driving structure matching the centrifugal cylinder is installed on the suspension bracket, the driving structure is used for the press-in drive and rotation drive of the centrifugal cylinder relative to the rotating cylinder.

[0007] Specifically, multiple positioning fixtures include a fixed base frame, multiple centrifugal cylinders are fixedly connected with multiple flat plates, multiple fixed base frames are respectively fixedly connected to multiple flat plates, multiple fixed base frames are installed with double-pressure elastic parts, multiple fixed base frames are slidably connected with lifting brackets, multiple fixed base frames are threadedly connected with limiting bolts, multiple limiting bolts are respectively used for relative compression and limiting of multiple lifting brackets relative to multiple fixed base frames, multiple lifting brackets are slidably connected with sliding frames, multiple sliding frames are respectively connected to multiple lifting brackets with auxiliary pressure springs, multiple sliding frames are respectively connected to multiple double-pressure elastic parts with synchronous through shafts, multiple sliding frames are slidably connected with expanded pressure plate frames, multiple expanded pressure plate frames are rotatably connected with threaded rods, and multiple threaded rods are respectively threadedly connected to multiple sliding frames.

[0008] Specifically, multiple double-pressure elastic members include an installed synchronization shaft, multiple installed synchronization shafts are respectively rotatably connected in multiple fixed bases, multiple fixed bases are respectively fixedly connected with synchronization springs, multiple synchronization springs are respectively fixedly connected with multiple installed synchronization shafts, multiple installed synchronization shafts are respectively fixedly connected with a first spring pressure plate and a second spring pressure plate, multiple synchronization through-shafts are respectively provided with two strip hole frames, and multiple strip hole frames are respectively fixedly connected with multiple first spring pressure plates and multiple second spring pressure plates.

[0009] Specifically, a transverse fine-tuning hole matching the synchronous penetrating shaft is provided on the sliding frame, and a transverse wide-adjusting hole matching the synchronous penetrating shaft is provided in the lifting bracket.

[0010] Specifically, a plurality of the support rings are fixedly connected to the outside with a support limit plate and a plurality of outwardly extending mounting ears, a plurality of the support limit plates are provided with guide holes, a plurality of the guide holes are slidably connected with guide rods, a plurality of the guide rods are fixedly connected to the revolving plate frame, a plurality of guide rods are fixedly connected with a synchronization ring, and a plurality of the outwardly extending mounting ears are respectively fixedly connected to a plurality of the support springs.

[0011] Specifically, the driving structure includes an electric lifting rod and a third servo motor. The electric lifting rod is installed at the top of the suspension bracket. A lifting shell is fixedly connected to the lifting rod of the electric lifting rod. A downward pressure calibration block is rotatably connected in the lifting shell. The tops of multiple centrifugal cylinders are all provided with recessed grooves matching the downward pressure calibration block. The third servo motor is installed on the lifting shell. The third servo motor is used for rotational driving of the downward pressure calibration block relative to the lifting shell.

[0012] Specifically, the output shafts of the first servo motor and the third servo motor are both equipped with driving gears, and the two driving gears are both meshed with transmission gear rings, and the two transmission gear rings are respectively fixedly connected to the rotating cylinder and the downward pressure calibration block.

[0013] Specifically, the delivery pump is connected to a fixed pipe, the vertical pipe is connected to the fixed pipe, and the vertical pipe is rotatably connected to the fixed pipe.

[0014] Specifically, a support and limiting ring is rotatably connected inside the rotating cylinder, and the support and limiting ring is used for auxiliary limiting of the centrifugal cylinder.

[0015] A packaging method for a high-speed VCSEL semiconductor chip protection packaging device comprises the following steps: S1. Before use, first install a control circuit for the delivery pump, the first servo motor, the second servo motor and the drive structure, so that the delivery pump, the first servo motor, the second servo motor and the drive structure can be powered on and operated through the control circuit. Then, install a filling glue storage container that needs to be dispensed on the suction end of the delivery pump, so that the delivery pump can absorb the filling glue in the filling glue storage container and pump it into the vertical pipe when it is powered on; S2. When the chip needs to be packaged, the matching clamping operation of the chip to be packaged and the matching circuit board is completed by the positioning fixture. A single centrifugal cylinder is equipped with multiple positioning fixtures, so multiple sets of circuit boards and chips can be clamped and installed in the single centrifugal cylinder. After the matching positioning of the circuit boards and chips is completed, the second servo motor is started, and the second servo motor is powered on to realize the rotation drive of the rotary shaft, the rotation of the rotary shaft realizes the rotation drive of the rotary plate rack, and the rotation of the rotary plate rack realizes the synchronous revolution and rotation of multiple centrifugal cylinders, until the axis of the centrifugal cylinder holding the chip inside is in a mutually overlapping state relative to the axis of the rotating cylinder; S3, after the axis of the centrifugal cylinder with the chip is aligned with the axis of the rotating cylinder, the second servo motor is stopped, and then the driving structure is powered on to push the centrifugal cylinder located directly below the driving structure downward, so that the centrifugal cylinder is inserted into the rotating cylinder. Before the centrifugal cylinder is inserted into the rotating cylinder, the driving structure controls the centrifugal cylinder to rotate and align itself, so that the positioning fixture in the centrifugal cylinder can be rotated and misaligned with respect to the multiple distribution tubes, so as to avoid interference between the positioning fixture and the distribution tubes during the insertion of the centrifugal cylinder relative to the rotating cylinder; S4, after the centrifugal cylinder is inserted into place relative to the rotating cylinder, the plurality of distributing tubes will respectively form an upper and lower oblique offset correspondence with the plurality of chips to be glued, and then according to the specific position of the chip, the centrifugal cylinder inserted into the rotating cylinder and the rotating cylinder are powered on and operated to realize relative rotation adjustment between the centrifugal cylinder and the rotating cylinder, so that the distributing tube and the chip form an upper and lower glue coating alignment; S5. Then the driving structure and the first servo motor are powered on to realize synchronous rotation between the centrifugal cylinder and the rotating cylinder, so that the matching circuit board and chip are in a state of bearing centrifugal force. Then the delivery pump is operated to pump filling glue into the vertical pipe. The filling glue entering the vertical pipe is dispersed and guided by multiple distribution tubes. The filling glue guided by the distribution tubes will flow out from the holes at the bottom of the end of the distribution tube and finally drip and fill the gap between the chip and the circuit board. The filling glue entering the gap will form flow coverage and tight filling under the action of its own gravity and centrifugal force.

[0016] The beneficial effects of the present invention are: The high-speed VCSEL semiconductor chip protection packaging device described in the present invention forms a positioning clamping structure that matches the circuit board and the chip through the design of the indexing clamping system. On the one hand, it can realize the relative position determination of the circuit board and the chip during the chip packaging process, and on the other hand, it can also make the mutually matched circuit board and chip enter a state of bearing centrifugal force, so as to improve the filling quality of the filling glue after dispensing during the chip packaging process.

[0017] The high-speed VCSEL semiconductor chip protection packaging device described in the present invention can form a dispensing operation in conjunction with a rotating circuit board and chip through the design of a rotating dispensing system. On the one hand, it can realize dynamic dispensing in conjunction with a rotating circuit board and chip, and on the other hand, it can also realize synchronous dispensing operations of multiple groups of circuit boards and chips, which is more practical and has a higher chip packaging efficiency.

[0018] The high-speed VCSEL semiconductor chip protection packaging device described in the present invention facilitates the downward pressure adjustment and rotational drive adjustment of the centrifugal cylinder relative to the rotating cylinder through the design of the driving structure, and then facilitates the relative position matching adjustment of multiple distribution tubes relative to multiple chips, thereby finally forming the dispensing position of the dispensing point relative to the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0020] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 For the present invention Figure 1 A schematic diagram of the local enlarged structure at point A in the middle; Figure 3 It is a schematic diagram of the exploded three-dimensional structure of the expanded pressing plate frame, the threaded rod and the installation synchronous shaft of the present invention; Figure 4 It is a schematic diagram of the exploded three-dimensional structure of the suspension bracket, the second servo motor and the lifting shell of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the delivery pump, the material distribution pipe and the vertical pipe of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the swing plate frame, the support ring and the support spring of the present invention; Figure 7 It is a schematic diagram of the three-dimensional structure of the supporting bracket, the rotating drum and the material distributing pipe of the present invention; Figure 8 It is a schematic diagram of the overall three-dimensional structure of the present invention when viewed from above; Fig. 9 For the present invention Figure 8 A schematic diagram of the local enlarged structure at B in the middle; Fig.10 For the present invention Figure 8 A schematic diagram of the local enlarged structure at C in the middle; Fig.11 It is a schematic diagram of a three-dimensional structure of the suspension bracket, the lifting shell and the downward pressure correction block of the present invention, which is viewed from above; Fig.12 It is a bottom-up schematic diagram of the three-dimensional structure of the delivery pump, vertical pipe and fixed pipe of the present invention; Fig.13 It is a bottom-up three-dimensional structural schematic diagram of the flat plate, lifting bracket and enlarged pressing plate frame of the present invention; Fig.14 It is a schematic diagram of the exploded three-dimensional structure of the sliding frame, the auxiliary pressure spring and the synchronous through-shaft of the present invention; Fig.15 It is a schematic diagram of the three-dimensional structure of the centrifugal cylinder and the rotating cylinder of the present invention, in which the axes of the centrifugal cylinder and the rotating cylinder coincide with each other and before being inserted into each other.

[0021] In the figure: 1, support bracket; 2, delivery pump; 3, first servo motor; 4, rotating cylinder; 5, material distribution pipe; 6, vertical pipe; 7, suspension bracket; 8, second servo motor; 9, rotary shaft; 10, rotary plate frame; 11, centrifugal cylinder; 12, support ring; 13, support spring; 14, fixed base frame; 15, flat plate; 16, lifting bracket; 17, limit bolt; 18, sliding frame; 19, auxiliary pressure spring; 20, synchronous through-axis; 21, expanded pressure plate frame; 22, threaded rod; 23. Install the synchronous shaft; 24. Synchronous spring; 25. First spring plate; 26. Second spring plate; 27. Strip hole frame; 28. Horizontal fine-tuning hole; 29. ​​Horizontal wide-adjusting hole; 30. Support limit plate; 31. Extended mounting ear; 32. Guide rod; 33. Synchronous ring; 34. Electric lifting rod; 35. Lifting shell; 36. Press down calibration block; 37. Recessed groove; 38. Driving gear; 39. Transmission gear ring; 40. Fixed tube; 41. Support limit ring; 42. Third servo motor. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0023] For examples, see Figure 1-Figure 15, a high-speed VCSEL semiconductor chip protection packaging device, including a support bracket 1, a rotating dispensing system and a transfer clamping system, the rotating dispensing system includes a delivery pump 2, a first servo motor 3, a rotating cylinder 4 and a plurality of material dispensing tubes 5, the delivery pump 2 and the first servo motor 3 are both installed at the bottom end of the support bracket 1, the rotating cylinder 4 is rotatably connected in the support bracket 1, the first servo motor 3 is used for rotating the rotating cylinder 4 relative to the support bracket 1. A vertical tube 6 is fixedly connected in the rotating cylinder 4, and a plurality of material dispensing tubes 5 are all connected to the vertical tube 6, and the vertical tube 6 is connected to the delivery pump 2. Through the design of the rotating dispensing system, it is possible to form a dispensing operation with a rotating circuit board and a chip. On the one hand, it can realize dynamic dispensing with a rotating circuit board and a chip, and on the other hand, it can also realize synchronous dispensing of multiple groups of circuit boards and chips, which is more practical and has a higher chip packaging efficiency. The delivery pump 2 is connected with a fixed tube 40, the vertical tube 6 is connected with the fixed tube 40, and the vertical tube 6 is rotatably connected with the fixed tube 40, so as to ensure the communication effect between the vertical tube 6 and the delivery pump 2 while enabling the vertical tube 6 to form synchronous rotation with the rotating cylinder 4.

[0024] It should be further explained that the indexing clamping system includes a suspension bracket 7 and a second servo motor 8, the suspension bracket 7 is fixedly connected to the support bracket 1, and a swivel shaft 9 is rotatably connected between the suspension bracket 7 and the support bracket 1, the second servo motor 8 is installed on the suspension bracket 7, and the second servo motor 8 is used for driving the swivel shaft 9 to rotate, and a swivel plate frame 10 is fixedly connected to the swivel shaft 9, and a plurality of circular openings are opened on the swivel plate frame 10, and a plurality of circular openings are each provided with a centrifugal cylinder 11, and a plurality of positioning fixtures are each installed in the plurality of centrifugal cylinders 11, and the plurality of positioning fixtures each include a fixed base frame 14, and a plurality of planar plates 15 are each fixedly connected to the plurality of centrifugal cylinders 11, and a plurality of fixed base frames 14 are fixedly connected to a plurality of plane plates 15, a plurality of fixed base frames 14 are each installed with a double-pressure elastic member, a plurality of fixed base frames 14 are slidably connected to a lifting bracket 16, a plurality of fixed base frames 14 are threadedly connected with a limiting bolt 17, a plurality of limiting bolts 17 are respectively used for the relative compression and limiting of the plurality of lifting brackets 16 relative to the plurality of fixed base frames 14, a plurality of lifting brackets 16 are slidably connected to a sliding frame 18, a plurality of sliding frames 18 are respectively connected to a plurality of lifting brackets 16 with auxiliary pressure springs 19, a plurality of sliding frames 18 are respectively connected to a plurality of double-pressure elastic members with a synchronous through-shaft 20, a plurality of sliding frames 18 are slidably connected with The expanded pressure plate frame 21, the plurality of expanded pressure plate frames 21 are rotatably connected with threaded rods 22, the plurality of threaded rods 22 are respectively threadedly connected with the plurality of sliding frames 18, the plurality of double-pressure elastic members include installation synchronization shafts 23, the plurality of installation synchronization shafts 23 are respectively rotatably connected in the plurality of fixed base frames 14, the plurality of fixed base frames 14 are fixedly connected with synchronization springs 24, the plurality of synchronization springs 24 are respectively fixedly connected with the plurality of installation synchronization shafts 23, the plurality of installation synchronization shafts 23 are fixedly connected with the first spring pressure plate 25 and the second spring pressure plate 26, the plurality of synchronization through-shafts 20 are each provided with two strip hole frames 27, the plurality of strip hole frames 27 are respectively fixedly connected with the plurality of first spring pressure plates 25 It is fixedly connected to multiple second spring pressure plates 26, and through the design of the indexing and clamping system, a positioning and clamping structure matching the circuit board and the chip is formed. On the one hand, it can realize the relative position determination of the circuit board and the chip during the chip packaging process, and on the other hand, it can also make the mutually matched circuit board and chip enter a state of bearing centrifugal force, so as to improve the filling quality of the filling glue after dispensing during the chip packaging process. A horizontal fine-tuning hole 28 matching the synchronous through-axis 20 is opened on the sliding frame 18, and a horizontal wide adjustment hole 29 matching the synchronous through-axis 20 is opened in the lifting bracket 16, so as to realize the sequential and coherent driving of the expansion pressure plate frame 21 and the first spring pressure plate 25 and the second spring pressure plate 26.

[0025] It should be further explained that, a plurality of centrifugal barrels 11 are rotatably connected to the outside with support rings 12, a plurality of support springs 13 are connected between the plurality of support rings 12 and the rotating plate frame 10, a driving structure matching the centrifugal barrel 11 is installed on the suspension bracket 7, the driving structure is used for the press-in drive and rotation drive of the centrifugal barrel 11 relative to the rotating barrel 4, the driving structure comprises an electric lifting rod 34 and a third servo motor 42, the electric lifting rod 34 is installed on the top of the suspension bracket 7, a lifting shell 35 is fixedly connected to the lifting rod of the electric lifting rod 34, a downward pressure calibration block 36 is rotatably connected in the lifting shell 35, a recessed groove 37 matching the downward pressure calibration block 36 is provided on the top of the plurality of centrifugal barrels 11, the third servo motor 42 is installed on the lifting shell 35, the third servo motor 42 is used for the rotation drive of the downward pressure calibration block 36 relative to the lifting shell 35, through the design of the driving structure, the downward pressure placement adjustment and rotation drive adjustment of the centrifugal barrel 11 relative to the rotating barrel 4 are facilitated, thereby facilitating the relative positions of the plurality of distribution tubes 5 relative to the plurality of chips respectively. The positions are matched and adjusted to finally form the dispensing position of the dispensing point relative to the chip. A plurality of support rings 12 are fixedly connected to support limit plates 30 and a plurality of outwardly extending mounting ears 31. A plurality of support limit plates 30 are provided with guide holes. A plurality of guide holes are slidably connected with guide rods 32 to form the direction guidance of the support ring 12 during the height adjustment process. A plurality of guide rods 32 are fixedly connected to the rotary plate frame 10. A plurality of guide rods 32 are fixedly connected with a synchronous ring 33 to improve the structural strength between the plurality of guide rods 32. A plurality of outwardly extending mounting ears 31 are respectively fixedly connected with a plurality of support springs 13 to form a specific connection structure at the top of the support spring 13. A driving gear 38 is installed on the output shaft of the first servo motor 3 and the third servo motor 42. The two driving gears 38 are meshed with a transmission gear ring 39. The two transmission gear rings 39 are respectively fixedly connected to the rotating cylinder 4 and the downward pressure calibration block 36. A support limit ring 41 is rotatably connected in the rotating cylinder 4. The support limit ring 41 is used for auxiliary limiting of the centrifugal cylinder 11.

[0026] The delivery pump 2, the first servo motor 3, the second servo motor 8, the electric lifting rod 34 and the third servo motor 42 in this embodiment are all conventional equipment purchased on the market and known to technicians in this field. In the present invention, we only use them and do not improve their structure and function. For technicians in this field, their setting method, installation method and electrical connection method only need to be debugged according to the requirements of their instruction manual, and they will not be described in detail here.

[0027] In summary, the working principle of the high-speed VCSEL semiconductor chip protection packaging device and packaging method is that before use, a control circuit is first installed for the delivery pump 2, the first servo motor 3, the second servo motor 8 and the drive structure. The control circuit can realize the power-on operation of the delivery pump 2, the first servo motor 3, the second servo motor 8 and the drive structure. Then, a filling glue storage container that needs to be dispensed is installed for the suction end of the delivery pump 2, so that the delivery pump 2 can absorb the filling glue in the filling glue storage container and pump it into the vertical pipe 6 when it is powered on. When the chip needs to be packaged, the auxiliary pressure spring 19 is first elastically stretched by pulling the expansion plate frame 21. During this process, the sliding frame 18 is relative to the lifting bracket 1 6 forms a sliding separation. Due to the effect of the horizontal fine-tuning hole 28, when the sliding frame 18 is initially pulled, the synchronous through-shaft 20 forms a relative position change in the horizontal fine-tuning hole 28 until the synchronous through-shaft 20 relatively moves to the limit position in the horizontal fine-tuning hole 28. Thereafter, the synchronous through-shaft 20 forms a synchronous movement with the sliding frame 18. The horizontal fine-tuning hole 29 provides sufficient movement space for the synchronous through-shaft 20. The movement of the synchronous through-shaft 20 realizes the rotation drive of the first spring plate 25 and the second spring plate 26 respectively through the two strip hole frames 27 set at both ends of the synchronous through-shaft 20. The synchronous rotation of the first spring plate 25 and the second spring plate 26 will drive the installation synchronous shaft 23 between the two to rotate, so that the synchronous spring 24 forms an elastic expansion and contraction, and the circuit corresponding to the packaged chip is The board is placed on the lifting bracket 16, and the pulling of the sliding frame 18 is partially relaxed first, so that the first spring plate 25 and the second spring plate 26 form a reverse movement reset, until the first spring plate 25 and the second spring plate 26 are in relative contact and compression with respect to the circuit board, and then the chip is placed at a suitable position relative to the circuit board, and the pulling action of the sliding frame 18 is completely released. Under the elastic reset action of the auxiliary pressure spring 19, the expanded pressure plate frame 21 forms a contact and compression with respect to the chip, and finally the relative positioning between the chip and the circuit board and the common positioning of the chip and the circuit board in the centrifugal cylinder 11 are achieved, and there is a sequence between the expanded pressure plate frame 21 and the first spring plate 25 and between the expanded pressure plate frame 21 and the second spring plate 26, so it is more It is convenient to position and install the circuit board and the chip in sequence, and by loosening the limit bolt 17 to press the lifting bracket 16, the height of the lifting bracket 16 can be adjusted to achieve the adaptation and adjustment of circuit boards of various specifications. By rotating the threaded rod 22, the relative height adjustment between the expanded pressure plate frame 21 and the sliding frame 18 can also be achieved, and finally the matching adjustment of the installation position of different chips relative to different circuit boards is achieved, and finally when the centrifugal cylinder 11 is inserted relative to the rotating cylinder 4, the circuit board and chip installed and positioned in the centrifugal cylinder 11 by the positioning fixture in the centrifugal cylinder 11 have a suitable relative height with the cloth tube 5, so that the cloth gap between the cloth tube 5 and the circuit board and the chip has a suitable distance and relative position.

[0028] Furthermore, the matching clamping operation of the chip to be packaged and the matching circuit board is completed by the positioning fixture. A single centrifugal cylinder 11 is equipped with multiple positioning fixtures, so multiple sets of circuit boards and chips can be clamped and installed in the single centrifugal cylinder 11. After the matching positioning of the circuit boards and chips is completed, the second servo motor 8 is started, and the second servo motor 8 is powered on to realize the rotation drive of the rotary shaft 9. The rotation of the rotary shaft 9 realizes the rotation drive of the rotary plate frame 10. The rotation of the rotary plate frame 10 realizes the synchronous revolution and rotation of multiple centrifugal cylinders 11 until the internal clamps are The axis of the centrifugal cylinder 11 of the chip is in a mutually coincident state with respect to the axis of the rotating cylinder 4. After the axis of the centrifugal cylinder 11 with the chip is in a mutually coincident state with respect to the axis of the rotating cylinder 4, the second servo motor 8 is suspended, and then the driving structure is powered on to realize the downward push of the centrifugal cylinder 11 located directly below the driving structure, so that the centrifugal cylinder 11 is inserted into the rotating cylinder 4. Before the centrifugal cylinder 11 is inserted into the rotating cylinder 4, the driving structure controls the centrifugal cylinder 11 to form its own rotation alignment, so that the positioning fixture in the centrifugal cylinder 11 can form a rotation relative to the multiple material distribution tubes 5. The centrifugal cylinder 11 is inserted into the rotating cylinder 4 to prevent the positioning fixture from interfering with the material dispensing tube 5. That is, the electric lifting rod 34 in the driving structure is powered on to realize the falling adjustment of the lifting shell 35 relative to the suspension bracket 7. During this process, the downward pressure calibration block 36 will fall synchronously with the falling of the lifting shell 35. That is, the downward pressure calibration block 36 is close to the centrifugal cylinder 11 below it until it contacts each other. Since the third servo motor 42 will limit the rotational freedom between the downward pressure calibration block 36 and the lifting shell 35 in the parked state, the downward pressure calibration block 36 During the process of falling, the positioning block 36 will be inserted into the recessed groove 37 on the centrifugal cylinder 11, so that the centrifugal cylinder 11 can form active rotation adjustment. At the same time, after the first servo motor 3 and the second servo motor 8 enter the parked state, there is a fixed angle between the downward pressure positioning block 36 and the suspension bracket 7, and there is also a fixed angle between the rotating cylinder 4 and the supporting bracket 1, so as to ensure that the multiple centrifugal cylinders 11 have a suitable angle with the rotating cylinder 4 during the insertion process relative to the rotating cylinder 4, so that the positioning fixtures in each centrifugal cylinder 11 form a fixed rotational misalignment with the fabric pipe 5.

[0029] Furthermore, if the downward pressure calibration block 36 continues to fall, it will form a downward pressure drive on the centrifugal cylinder 11. After the centrifugal cylinder 11 is inserted into place relative to the rotating cylinder 4, the support limit ring 41 forms a support limit on the bottom wall of the centrifugal cylinder 11, and the multiple material distribution tubes 5 will respectively form an upper and lower oblique offset correspondence with respect to the multiple chips to be glued. Then, according to the specific position of the chip, the driving structure and the first servo motor 3 are powered on, that is, the third servo motor 42 in the driving structure is powered on, and the rotation drive of the downward pressure calibration block 36 is realized through the meshing transmission of the driving gear 38 and the transmission gear ring 39. The pressure calibration block 36 rotates to realize the rotation drive of the centrifugal cylinder 11 abutting against it from top to bottom, and the first servo motor 3 is powered on to run, and the rotation drive of the rotating cylinder 4 is realized through the meshing transmission of the driving gear 38 and the transmission gear ring 39. The relative rotation adjustment of the centrifugal cylinder 11 inserted into the rotating cylinder 4 and the rotating cylinder 4 can be realized by controlling the rotation speed of the third servo motor 42 and the rotation speed of the first servo motor 3, so that the material distribution tube 5 and the chip form an upper and lower glue coating alignment, and then the first servo motor 3 and the third servo motor 42 in the driving structure are controlled to run synchronously to realize the synchronization between the centrifugal cylinder 11 and the rotating cylinder 4. The plurality of distribution tubes 5 are respectively relatively stationary relative to the plurality of chips, and then the delivery pump 2 is operated to pump the filling glue into the vertical tube 6. The filling glue entering the vertical tube 6 is dispersed and guided by the plurality of distribution tubes 5. The filling glue guided by the distribution tubes 5 will flow out from the holes at the bottom of the end of the distribution tubes 5 and finally drip and fill the gap between the chip and the circuit board. The filling glue entering the gap will form flow coverage and tight filling under the action of its own gravity and centrifugal force. During the filling glue cloth filling process, By controlling the synchronous rotation speed of the rotating cylinder 4 and the centrifugal cylinder 11, the centrifugal force exerted on the filling glue entering the gap between the circuit board and the chip can be adjusted and controlled, and finally the pressing force exerted on the filling glue can be controlled. Since the filling glue is in a viscous state as a whole and the centrifugal force is strictly controlled to prevent a large sudden change, the filling glue entering the gap between the circuit board and the chip can be prevented from deviating from the gap between the circuit board and the chip. At the same time, in order to improve the curing efficiency of the filling glue, a heating device can be added to create a dry heat environment in the rotating cylinder 4 to promote the rapid curing of the filling glue.

[0030] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0031] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A high-speed VCSEL semiconductor chip protection packaging device, characterized in that: It comprises a support bracket (1), a rotating glue dispensing system and a transposition clamping system; The rotary dispensing system comprises a delivery pump (2), a first servo motor (3), a rotating cylinder (4) and a plurality of material dispensing tubes (5); the delivery pump (2) and the first servo motor (3) are both mounted at the bottom end of the support bracket (1); the rotating cylinder (4) is rotatably connected in the support bracket (1); the first servo motor (3) is used to drive the rotating cylinder (4) to rotate relative to the support bracket (1); a vertical tube (6) is fixedly connected in the rotating cylinder (4); the plurality of material dispensing tubes (5) are all connected to the vertical tube (6), and the vertical tube (6) is connected to the delivery pump (2); The indexing clamping system comprises a suspension bracket (7) and a second servo motor (8), wherein the suspension bracket (7) is fixedly connected to the support bracket (1), and a swivel shaft (9) is rotatably connected between the suspension bracket (7) and the support bracket (1), wherein the second servo motor (8) is mounted on the suspension bracket (7), and the second servo motor (8) is used for rotatably driving the swivel shaft (9), and a swivel plate frame (10) is fixedly connected to the swivel shaft (9), wherein the swivel plate frame (10) is provided with a plurality of circular openings, wherein a centrifugal cylinder (11) is disposed in each of the plurality of circular openings, wherein a plurality of positioning fixtures are installed in each of the plurality of centrifugal cylinders (11), wherein a support ring (12) is rotatably connected to the outside of each of the plurality of centrifugal cylinders (11), wherein a plurality of support springs (13) are connected between each of the plurality of support rings (12) and the swivel plate frame (10), and wherein a driving structure matching the centrifugal cylinder (11) is mounted on the suspension bracket (7), wherein the driving structure is used for pressing-in driving and swivel driving of the centrifugal cylinder (11) relative to the rotating cylinder (4).

2. A high-speed VCSEL semiconductor chip protection packaging device according to claim 1, characterized in that: The plurality of positioning fixtures each comprise a fixed base frame (14), the plurality of centrifugal barrels (11) are each fixedly connected to a plurality of planar plates (15), the plurality of fixed base frames (14) are respectively fixedly connected to the plurality of planar plates (15), the plurality of fixed base frames (14) are each installed with a double-pressure elastic member, the plurality of fixed base frames (14) are each slidably connected to a lifting bracket (16), the plurality of fixed base frames (14) are each threadedly connected to a limiting bolt (17), the plurality of limiting bolts (17) being respectively used for the plurality of lifting brackets (16) to move relative to the plurality of fixed base frames ( 14), a plurality of lifting brackets (16) are slidably connected to a sliding frame (18), a plurality of the sliding frames (18) are respectively connected to the plurality of lifting brackets (16) with auxiliary pressure springs (19), a plurality of the sliding frames (18) are respectively connected to the plurality of double-pressure elastic members with synchronous through-shafts (20), a plurality of the sliding frames (18) are slidably connected to an enlarged pressure plate frame (21), a plurality of the enlarged pressure plate frames (21) are rotatably connected to a threaded rod (22), and a plurality of the threaded rods (22) are respectively threadedly connected to a plurality of the sliding frames (18).

3. A high-speed VCSEL semiconductor chip protection packaging device according to claim 2, characterized in that: The plurality of double-pressure elastic members each include a mounting synchronous shaft (23), the plurality of mounting synchronous shafts (23) are rotatably connected in the plurality of fixed base frames (14), the plurality of fixed base frames (14) are each fixedly connected with a synchronous spring (24), the plurality of synchronous springs (24) are each fixedly connected with the plurality of mounting synchronous shafts (23), the plurality of mounting synchronous shafts (23) are each fixedly connected with a first spring-pressure plate (25) and a second spring-pressure plate (26), the plurality of synchronous through-shafts (20) are each provided with two strip hole frames (27), the plurality of strip hole frames (27) are each fixedly connected with the plurality of first spring-pressure plates (25) and the plurality of second spring-pressure plates (26).

4. A high-speed VCSEL semiconductor chip protection packaging device according to claim 3, characterized in that: The sliding frame (18) is provided with a transverse fine adjustment hole (28) matching the synchronous through-axis (20), and the lifting bracket (16) is provided with a transverse wide adjustment hole (29) matching the synchronous through-axis (20).

5. A high-speed VCSEL semiconductor chip protection packaging device according to claim 4, characterized in that: A plurality of the support rings (12) are fixedly connected to support limit plates (30) and a plurality of outwardly extending mounting ears (31) on the outside, a plurality of the support limit plates (30) are provided with guide holes, a plurality of the guide holes are slidably connected to guide rods (32), a plurality of the guide rods (32) are fixedly connected to the revolving plate frame (10), a plurality of the guide rods (32) are fixedly connected to a synchronization ring (33), and a plurality of the outwardly extending mounting ears (31) are respectively fixedly connected to a plurality of the support springs (13).

6. A high-speed VCSEL semiconductor chip protection packaging device according to claim 5, characterized in that: The driving structure comprises an electric lifting rod (34) and a third servo motor (42); the electric lifting rod (34) is mounted on the top end of the suspension bracket (7); a lifting shell (35) is fixedly connected to the lifting rod of the electric lifting rod (34); a downward pressure calibration block (36) is rotatably connected inside the lifting shell (35); the top ends of the plurality of centrifugal barrels (11) are all provided with a recessed groove (37) matching the downward pressure calibration block (36); the third servo motor (42) is mounted on the lifting shell (35); and the third servo motor (42) is used for driving the downward pressure calibration block (36) to rotate relative to the lifting shell (35).

7. A high-speed VCSEL semiconductor chip protection packaging device according to claim 6, characterized in that: A driving gear (38) is mounted on the output shafts of the first servo motor (3) and the third servo motor (42), and the two driving gears (38) are meshed with a transmission gear ring (39). The two transmission gear rings (39) are respectively fixedly connected to the rotating cylinder (4) and the downward pressure calibration block (36).

8. The high-speed VCSEL semiconductor chip protection packaging device according to claim 7, characterized in that: The delivery pump (2) is connected to a fixed pipe (40), the vertical pipe (6) is connected to the fixed pipe (40), and the vertical pipe (6) is rotatably connected to the fixed pipe (40).

9. A high-speed VCSEL semiconductor chip protection packaging device according to claim 8, characterized in that: A support and limiting ring (41) is rotatably connected inside the rotating cylinder (4), and the support and limiting ring (41) is used for auxiliary limiting of the centrifugal cylinder (11).

10. A packaging method for a high-speed VCSEL semiconductor chip protection packaging device, characterized in that: A high-speed VCSEL semiconductor chip protection packaging device and packaging method according to any one of claims 1 to 9 is used, comprising the following steps: S1. Before use, firstly, a control circuit is installed for the delivery pump (2), the first servo motor (3), the second servo motor (8) and the drive structure, so that the delivery pump (2), the first servo motor (3), the second servo motor (8) and the drive structure can be powered on and operated by the control circuit. Then, a filling glue storage container that needs to be dispensed is installed at the suction end of the delivery pump (2), so that when the delivery pump (2) is powered on and operated, it can absorb the filling glue in the filling glue storage container and pump it into the vertical pipe (6); S2. When it is necessary to package the chip, the chip to be packaged and the matching circuit board are matched and clamped by a positioning fixture. A single centrifugal cylinder (11) is equipped with multiple positioning fixtures, so that multiple sets of circuit boards and chips can be clamped and installed in the single centrifugal cylinder (11). After the matching positioning of the circuit boards and chips is completed, the second servo motor (8) is started, and the second servo motor (8) is powered on to realize the rotation drive of the rotary shaft (9). The rotation of the rotary shaft (9) realizes the rotation drive of the rotary plate frame (10). The rotation of the rotary plate frame (10) realizes the synchronous revolution rotation of multiple centrifugal cylinders (11), until the axis of the centrifugal cylinder (11) holding the chip inside is in a mutually overlapping state relative to the axis of the rotating cylinder (4); S3, after the axis of the centrifugal cylinder (11) to be loaded with the chip is in a mutually overlapping state relative to the axis of the rotating cylinder (4), the second servo motor (8) is stopped, and then the driving structure is powered on to operate, so as to push the centrifugal cylinder (11) located directly below the driving structure downward, so that the centrifugal cylinder (11) is inserted into the rotating cylinder (4). Before the centrifugal cylinder (11) is inserted into the rotating cylinder (4), the driving structure controls the centrifugal cylinder (11) to form its own rotational alignment, so that the positioning fixture in the centrifugal cylinder (11) can form a rotational misalignment relative to the plurality of distribution tubes (5), so as to avoid interference between the positioning fixture and the distribution tubes (5) during the process of the centrifugal cylinder (11) being inserted into the rotating cylinder (4); S4, after the centrifugal cylinder (11) is inserted into position relative to the rotating cylinder (4), the plurality of material dispensing tubes (5) will respectively form an upper and lower oblique offset correspondence relative to the plurality of chips to be glued, and then according to the specific position of the chip, the driving structure and the first servo motor (3) are powered on to realize the relative rotation adjustment of the centrifugal cylinder (11) inserted into the rotating cylinder (4) and the rotating cylinder (4), so that the material dispensing tubes (5) and the chip form an upper and lower glue coating alignment; S5, then the driving structure and the first servo motor (3) are powered on to realize synchronous rotation between the centrifugal cylinder (11) and the rotating cylinder (4), so that the matching circuit board and chip enter a state of bearing centrifugal force, and then the delivery pump (2) is operated to pump filling glue into the vertical pipe (6). The filling glue entering the vertical pipe (6) is dispersed and guided by a plurality of distribution tubes (5). The filling glue guided by the distribution tubes (5) will flow out from the holes at the bottom of the ends of the distribution tubes (5) and finally drip and fill the gap between the chip and the circuit board. The filling glue entering the gap will form a flow covering and tight filling under the action of its own gravity and centrifugal force.

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