Resistance mask covering device for circuit board etching
By designing a resistive mask covering device for circuit board etching, including a spray thickness adjustment mechanism and a circuit board surface pretreatment mechanism, the problem of unstable resistance film thickness on the circuit board surface is solved, the accuracy and stability of the resistor are achieved, and the corrosion resistance and long-term reliability of the circuit board are enhanced.
Patent Information
- Application Number
- CN202510443993.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-10
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2045-04-10
AI Technical Summary
In the prior art, the thickness of the resistive film sprayed on the surface of the circuit board is affected by the height and movement speed, resulting in unstable thickness or exceeding the specified range, affecting the resistance performance and the stability and reliability of the circuit board.
A resistive mask covering device for circuit board etching is designed, including a spray thickness adjustment mechanism and a circuit board surface pretreatment mechanism. The spray thickness adjustment mechanism controls the height and movement speed of the sprayer through the coordination of the moving plate and the resistance plate; the circuit board surface pretreatment mechanism cleans up impurities on the surface of the circuit board through the coordination of the gas storage box and the piston rod.
Accurate control of the thickness of the resistor film is achieved, the accuracy and stability of the resistor is improved, the corrosion resistance of the circuit board is enhanced, the risk of resistance layer falling off is reduced, and the long-term reliability and heat dissipation stability of the circuit board are ensured.
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Figure CN119967719A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of circuit board production, in particular to a resistance mask covering device for circuit board etching. Background Art
[0002] The resistor mask is a conductive film covering the circuit board. It can directly form a resistor with a specific resistance value on the circuit board during the production process without the need for additional resistor components. This can simplify the manufacturing process and save costs. During the production of the circuit board, a spraying device is usually required to evenly spray the resistor mask on the surface of the circuit board. In the process of spraying circuit boards with existing spraying devices, the thickness of the resistor film sprayed on the surface is different due to the different sizes of the circuit boards. The control of the thickness of the sprayed paint by the spraying device is relatively cumbersome and requires repeated data debugging. Because the paint thickness is affected by many factors, such as spraying distance and spraying speed, the thickness of the resistor mask sprayed on the surface of the circuit board is unstable or exceeds the specified range, which will not only cause the resistance value to deviate from the design requirements, resulting in unstable or inaccurate resistance performance, but also in the subsequent operation of the circuit board, the circuit board will not be able to effectively dissipate heat under high-power working conditions of the resistor, thereby affecting its stability and reliability.
[0003] Therefore, we propose a resistance mask covering device for circuit board etching to solve the above problems. Summary of the invention
[0004] 1. Technical issues to be resolved In view of the deficiencies of the prior art, the present invention provides a resistor mask covering device for etching a circuit board, which can effectively solve the problem in the prior art that the thickness of the resistor film sprayed on the surface of the circuit board is affected by the height and the moving speed.
[0005] (II) Technical solution To achieve the above object, the object of the present invention can be achieved by the following technical solutions: A resistance mask covering device for etching a circuit board comprises a conveying platform, a cover body is fixedly connected to the center of the upper end surface of the conveying platform, a lifting plate is arranged inside the cover body, a sprayer is slidably connected to the lifting plate, the lifting plate is vertically slidably connected in the cover body, a spraying thickness adjustment mechanism is arranged between the lifting plate and the cover body, the spraying thickness adjustment mechanism comprises a moving plate, the moving plate is fixedly connected to the upper end surface of the sprayer, the spraying thickness adjustment mechanism is used to control the height and moving speed of the sprayer, a circuit board surface pretreatment mechanism is arranged on the right side of the spraying thickness adjustment mechanism, the circuit board surface pretreatment mechanism is used to remove impurities remaining on the surface of the circuit board in advance.
[0006] As a further solution of the present invention: the spray thickness adjustment mechanism also includes a horizontal plate, a threaded rod is threadedly connected through the center of the horizontal plate, the threaded rod is rotatably connected to the center of the upper end surface of the cover body, and the lower end surface of the horizontal plate is symmetrically fixedly connected with connecting columns, the connecting columns are all slidably connected to the cover body, and the lower ends of the connecting columns are fixedly connected to the upper end surface of the lifting plate.
[0007] As a further solution of the present invention: a resistance plate is symmetrically attached to the upper end surface of the movable plate, and sliding columns are symmetrically fixedly connected to the upper end surfaces of the resistance plates, and the sliding columns are all slidably connected to the cover body, and springs are fixedly connected between the resistance plate and the top surface of the cover body, and the springs are all mounted on the sliding columns.
[0008] As a further solution of the present invention: a knob is fixedly connected to the upper end of the threaded rod, a support frame is rotatably connected to the upper end of the outer surface of the threaded rod, the support frame is fixedly connected to the upper end surface of the cover body, a limiting groove is provided on the upper end surface of the support frame, a circular ring is vertically slidably connected to the outer surface of the knob, blocks are symmetrically provided on the outer surface of the circular ring, the blocks are all matched with the limiting grooves, and an arc plate is symmetrically fixedly connected to the upper end surface of the circular ring.
[0009] As a further solution of the present invention: the circuit board surface pretreatment mechanism includes an air storage box, which is fixedly connected to the right side wall of the cover body, and a piston rod is equidistantly penetrated and slidably connected to the upper end of the air storage box, and a connecting plate is fixedly connected between the upper ends of the piston rods, and air inlet holes are equidistantly opened at the lower end of the air storage box on the side away from the conveying platform, and air outlet holes are equidistantly opened at the lower end of the air storage box on the side close to the conveying platform.
[0010] As a further solution of the present invention: a connecting rod is rotatably connected at the center of the upper end surface of the connecting plate, a through groove is opened on the side of the connecting rod away from the connecting plate, a shift rod is slidably connected in the through groove, and the shift rod is fixedly connected to the side wall of the movable plate at one end away from the connecting rod.
[0011] As a further solution of the present invention: the front and rear sides of the connecting plate are fixedly connected with connecting blocks, the lower ends of the connecting blocks are fixedly connected with elastic telescopic columns, and the ends of the elastic telescopic columns away from the connecting blocks are fixedly connected to the gas storage box.
[0012] As a further solution of the present invention: a side of the conveying platform away from the gas storage box is fixedly connected with an adsorption plate, and a side of the adsorption plate close to the gas storage box is a sticky surface.
[0013] (III) Beneficial effects Compared with the prior art, the present invention provides a resistance mask covering device for circuit board etching, which has the following beneficial effects: 1. By setting up the spraying thickness adjustment mechanism, the staff can apply resistance to the sprayer while adjusting the height of the sprayer, slowing down the speed of the sprayer's horizontal movement spraying, so that the staff can control the thickness of the resistor film sprayed by the sprayer covering the surface of the circuit board. It can not only accurately adjust the resistance value to meet the requirements of different circuit boards and improve the accuracy and stability of the resistors on the circuit board, but also help to improve the corrosion resistance of the circuit board, reduce the risk of resistance layer falling off, and improve the long-term reliability of the circuit board, ensuring the stability of heat dissipation of the subsequent circuit board during operation.
[0014] 2. By setting the limit groove to limit the block, the threaded rod can be prevented from rotating due to the vibration of the conveyor platform and the sprayer. This not only enhances the stability of the sprayer during the spraying process on the circuit board surface, ensuring the consistency of the thickness of the resistor film sprayed on the circuit board surface, but also enables the sprayer to spray the resistor film evenly on the circuit board surface, thereby improving the overall aesthetics and functionality of the circuit board.
[0015] 3. Through the circuit board surface pretreatment mechanism set up, during the process of the sprayer reciprocatingly spraying the circuit board surface inside the cover body, the impurities on the subsequent circuit board surface can be cleaned at the same time, which not only avoids the interference of impurities, dust and other pollutants on the adhesion of the resistor film, ensures good adhesion between the resistor film and the circuit board, and strengthens the adhesion of the resistor film, but also keeps the circuit board surface clean by cleaning impurities, which helps to ensure that the resistor film has good conductivity.
[0016] 4. By setting up the adsorption plate, the dust cleaned from the surface of the circuit board can be adhered and collected on the adsorption plate during the process of the gas storage box cleaning the dust on the circuit board surface. This not only makes it convenient for the staff to centrally deal with the cleaned dust, but also avoids the dust from being scattered to the conveyor platform and subsequent circuit boards, thereby ensuring the cleanliness of the working environment. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.
[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the connection structure of the spraying thickness adjustment mechanism of the present invention; Figure 3 For the present invention Figure 2 A schematic diagram of the enlarged structure of the middle A area; Figure 4 For the present invention Figure 2 Schematic diagram of the enlarged structure of the middle B area; Figure 5This is a schematic diagram of the connection structure of the circuit board surface pretreatment mechanism of the present invention; Figure 6 For the present invention Figure 5 Schematic diagram of the enlarged structure of the middle C area; Figure 7 For the present invention Figure 5 Schematic diagram of the structure from another perspective.
[0019] In the figure: 1. conveyor platform; 2. cover body; 3. lifting plate; 4. sprayer; 5. Spraying thickness adjustment mechanism; 501. Horizontal plate; 502. Threaded rod; 503. Connecting column; 504. Support frame; 505. Knob; 506. Moving plate; 507. Resistance plate; 508. Sliding column; 509. Spring; 510. Limiting groove; 511. Ring; 512. Block; 513. Arc plate; 6. Circuit board surface pretreatment mechanism; 601. Gas storage box; 602. Connecting plate; 603. Adsorption plate; 604. Air inlet; 605. Connecting rod; 606. Through slot; 607. Push rod; 608. Elastic telescopic column; 609. Piston rod; 610. Connecting block; 611. Air outlet. DETAILED DESCRIPTION
[0020] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0021] A resistance mask covering device for etching a circuit board according to this embodiment, such as Figure 1 - Figure 7 As shown, it includes a conveying platform 1, a cover body 2 is fixedly connected to the center of the upper end surface of the conveying platform 1, a lifting plate 3 is arranged inside the cover body 2, a sprayer 4 is slidably connected to the lifting plate 3, the lifting plate 3 is vertically slidably connected in the cover body 2, a spraying thickness adjustment mechanism 5 is arranged between the lifting plate 3 and the cover body 2, the spraying thickness adjustment mechanism 5 includes a moving plate 506, the moving plate 506 is fixedly connected to the upper end surface of the sprayer 4, and the spraying thickness adjustment mechanism 5 is used to control the height and moving speed of the sprayer 4.
[0022] In this embodiment, Figure 2As shown, the spray thickness adjustment mechanism 5 also includes a horizontal plate 501, and a threaded rod 502 is threadedly connected at the center of the horizontal plate 501, and the threaded rod 502 is rotatably connected to the center of the upper end surface of the cover body 2, and the lower end surface of the horizontal plate 501 is symmetrically fixedly connected with a connecting column 503, and the connecting column 503 is slidably connected to the cover body 2, and the lower end of the connecting column 503 is fixedly connected to the upper end surface of the lifting plate 3. When the threaded rod 502 rotates, the lifting plate 3 can be synchronously driven to rise inside the cover body 2 through the horizontal plate 501 and the connecting column 503, so as to adjust the height of the sprayer 4 connected to the lifting plate 3.
[0023] In this embodiment, Figure 3 As shown, the upper end surface of the movable plate 506 is symmetrically fitted with a resistance plate 507, and the upper end surfaces of the resistance plates 507 are symmetrically fixedly connected with sliding columns 508, and the sliding columns 508 are all slidably connected to the cover body 2, and springs 509 are fixedly connected between the resistance plate 507 and the top surface of the cover body 2, and the springs 509 are all sleeved on the sliding columns 508. When the movable plate 506 follows the sprayer 4 to rise, the resistance plate 507 can be driven to squeeze the spring 509 at the same time. The pressure applied by the spring 509 to the resistance plate 507 can strengthen the friction between the resistance plate 507 and the movable plate 506, thereby increasing the resistance encountered by the movable plate 506 during the movement, and slowing down the movement speed of the sprayer 4 connected to the lower end surface of the movable plate 506.
[0024] In this embodiment, Figure 4 As shown, a knob 505 is fixedly connected to the upper end of the threaded rod 502, and a support frame 504 is rotatably connected to the upper end of the outer surface of the threaded rod 502. The support frame 504 is fixedly connected to the upper end surface of the cover body 2, and a limiting groove 510 is provided on the upper end surface of the support frame 504. A circular ring 511 is vertically slidably connected to the outer surface of the knob 505. Blocks 512 are symmetrically provided on the outer surface of the circular ring 511. The blocks 512 are all adapted to the limiting groove 510. An arc plate 513 is symmetrically fixedly connected to the upper end surface of the circular ring 511. The block 512 and the limiting groove 510 are mutually engaged, so that the circular ring 511, the knob 505 and the threaded rod 502 can be limited to prevent them from rotating due to external factors.
[0025] The effects achieved here are as follows: In the prior art, because the coating thickness is affected by many factors, such as spraying distance and spraying speed, etc., the thickness of the resistor mask sprayed on the surface of the circuit board is unstable or exceeds the specified range, which not only causes the resistance value to deviate from the design requirements, resulting in unstable or inaccurate resistance performance, but also causes the circuit board to be unable to effectively dissipate heat under high-power working conditions of the resistor during the subsequent circuit board operation, thereby affecting its stability and reliability. Compared with the prior art, while the staff adjusts the height of the sprayer 4, resistance can be applied to the sprayer 4 to slow down the speed of the sprayer 4 moving horizontally to spray, so that it is convenient for the staff to control the thickness of the resistor film sprayed by the sprayer 4 and covering the surface of the circuit board. Not only can the resistance value be accurately adjusted to meet the requirements of different circuit boards and improve the accuracy and stability of the resistor on the circuit board, but it also helps to improve the corrosion resistance of the circuit board, reduce the risk of the resistor layer falling off, and improve the long-term reliability of the circuit board, ensuring the stability of heat dissipation of the subsequent circuit board during operation; By setting the limit groove 510 to limit the block 512, the threaded rod 502 can be prevented from rotating due to the vibration generated by the conveying platform 1 and the sprayer 4. This not only enhances the stability of the sprayer 4 during the spraying process on the surface of the circuit board and ensures the consistency of the thickness of the resistor film sprayed on the surface of the circuit board, but also enables the sprayer 4 to further spray the resistor film evenly on the surface of the circuit board, thereby improving the overall aesthetics and functionality of the circuit board.
[0026] In other aspects, this embodiment also provides a circuit board surface pretreatment mechanism 6 for removing impurities remaining on the circuit board surface in advance, such as Figure 1 , Figure 5 - Figure 7 As shown, the circuit board surface pretreatment mechanism 6 includes a gas storage box 601, which is fixedly connected to the right side wall of the cover body 2, and a piston rod 609 is equidistantly penetrated and slidably connected to the upper end of the gas storage box 601, and a connecting plate 602 is fixedly connected between the upper ends of the piston rods 609. The lower end of the gas storage box 601 away from the conveying platform 1 is provided with air inlet holes 604 equidistantly, and the lower end of the gas storage box 601 close to the conveying platform 1 is provided with air outlet holes 611 equidistantly.
[0027] In this embodiment, Figure 5 and Figure 6As shown, a connecting rod 605 is rotatably connected at the center of the upper end surface of the connecting plate 602, and a through groove 606 is opened on the side of the connecting rod 605 away from the connecting plate 602. A lever 607 is slidably connected in the through groove 606. The lever 607 is fixedly connected to the side wall of the movable plate 506 at one end away from the connecting rod 605. When the movable plate 506 moves back and forth following the sprayer 4, it can drive the lever 607 to slide back and forth in the through groove 606, and drive the connecting rod 605 to reciprocate, thereby driving the connecting plate 602 rotatably connected to the other end of the connecting rod 605 to reciprocate up and down.
[0028] In this embodiment, Figure 5 and Figure 6 As shown, the front and rear sides of the connecting plate 602 are fixedly connected with connecting blocks 610, the lower ends of the connecting blocks 610 are fixedly connected with elastic telescopic columns 608, and the ends of the elastic telescopic columns 608 away from the connecting blocks 610 are fixedly connected to the gas storage box 601. The rebound force of the elastic telescopic columns 608 can make it easier for the connecting rod 605 to pull the connecting plate 602 to move upward.
[0029] In this embodiment, Figure 5 and Figure 7 As shown, the conveying platform 1 is fixedly connected with an adsorption plate 603 on the side away from the gas storage box 601, and the adsorption plate 603 is a sticky surface on the side close to the gas storage box 601. The dust and impurities cleaned out of the gas storage box 601 can be collected in a centralized manner through the adsorption plate 603.
[0030] The effects achieved by this place are as follows: compared with the prior art, during the process of the spraying machine 4 spraying the circuit board surface inside the cover body 2 back and forth, the impurities existing on the subsequent circuit board surface can be cleaned at the same time, which not only avoids the interference of impurities, dust and other pollutants on the adhesion of the resistor film, ensures good adhesion between the resistor film and the circuit board, and strengthens the adhesion of the resistor film, but also keeps the circuit board surface clean by cleaning the impurities, which helps to ensure good conductivity of the resistor film; Secondly, by setting up the adsorption plate 603, during the process of cleaning the dust on the surface of the circuit board by the air storage box 601, the cleaned dust can be adhered and collected on the adsorption plate 603, which not only makes it convenient for the staff to centrally handle the cleaned dust, but also avoids the dust from being dispersed to the conveyor platform 1 and subsequent circuit boards, thereby ensuring the cleanliness of the working environment.
[0031] The working process and principle involved in the overall content of the above embodiment are as follows: When the staff needs to spray the resistance film on the surface of the circuit board, the circuit boards are first placed on the upper end surface of the conveyor platform 1 in turn, and then the conveyor platform 1 is opened to send the circuit boards into the cover body 2 in turn. After the circuit boards are transported to the designated position, the staff lifts up the arc plate 513 symmetrically connected to the upper end surface of the ring 511 according to the thickness requirement of the resistance film covered on the surface of the circuit board, and drives the ring 511 to slide upward on the outer surface of the knob 505. As the ring 511 rises, the block 512 can be synchronously driven to slide out of the limiting groove 510 opened on the upper end surface of the support frame 504, and separate from the limiting groove 510. 0 is completely separated, the staff can drive the arc plate 513 to rotate horizontally, drive the knob 505 to rotate synchronously through the ring 511, and drive the threaded rod 502 connected to the lower end of the knob 505 to rotate synchronously on the support frame 504 and the cover body 2. During the rotation of the threaded rod 502, through the threaded connection with the horizontal plate 501, the horizontal plate 501 can move upward on the outer surface of the threaded rod 502, and synchronously drive the connecting column 503 symmetrically connected to the lower end surface of the horizontal plate 501 to slide out of the cover body 2, and pull the lifting plate 3 connected to the lower end of the connecting column 503 to rise inside the cover body 2, so as to adjust the height of the sprayer 4 connected to the lifting plate 3; When the lifting plate 3 rises to adjust the height of the sprayer 4, the movable plate 506 connected to the upper end surface of the sprayer 4 will push the resistance plate 507 to move upward synchronously, driving the sliding column 508 connected to the upper end surface of the resistance plate 507 to slide out of the cover body 2 and squeeze the spring 509 at the same time. As the spring 509 is squeezed, a downward pressure will be continuously applied to the resistance plate 507 to strengthen the friction between the resistance plate 507 and the movable plate 506, thereby increasing the resistance of the movable plate 506 during the movement process and slowing down the speed of the sprayer 4 during the reciprocating spraying process, so as to facilitate the staff to control the thickness of the resistance film sprayed by the sprayer 4 covering the surface of the circuit board, which can not only accurately adjust the resistance value to meet the requirements of different circuit boards and improve the accuracy and stability of the resistors on the circuit boards, but also help to improve the corrosion resistance of the circuit boards, reduce the risk of the resistance layer falling off, and improve the long-term reliability of the circuit boards, ensuring the stability of the heat dissipation of the subsequent circuit boards during operation; When the height adjustment of the lifting plate 3 is completed, the staff can release the arc plate 513. At this time, the arc plate 513 and the ring 511 will automatically slide downward on the outer surface of the knob 505 under the influence of gravity, driving the block 512 connected to the outer surface of the ring 511 to automatically slide into the limiting groove 510, limiting the ring 511, thereby preventing the threaded rod 502 from rotating due to the vibration generated by the conveying platform 1 and the sprayer 4. This not only enhances the stability of the sprayer 4 during the spraying process of the circuit board surface, ensures the consistency of the thickness of the resistor film sprayed on the circuit board surface, but also enables the sprayer 4 to evenly spray the resistor film on the circuit board surface, thereby improving the overall aesthetics and functionality of the circuit board. When the sprayer 4 moves back and forth on the lifting plate 3 to evenly spray the resistance film on the surface of the circuit board, the movable plate 506 connected to the upper end of the sprayer 4 can drive the lever 607 to move back and forth synchronously. When the lever 607 moves, it will first slide along the through groove 606 opened on the connecting rod 605. When the connecting rod 605 cannot slide in the through groove 606, it will pull one end of the connecting rod 605 to move back and forth horizontally. At this time, the connecting rod 605 will reciprocate from a nearly horizontal state to a nearly vertical state. When the connecting rod 605 moves to a nearly horizontal state, the connecting plate 602 connected to the other end of the connecting rod 605 will be pulled upward, driving the piston rod 609 connected to the lower end of the connecting plate 602 to slide out of the air storage box 601, and sucking the outside air from the air inlet 604 into the air storage box 601. During the upward movement of the connecting plate 602, the rebound force of the elastic telescopic column 608 will push the connecting plate 602 to rise synchronously, so that the connecting rod 605 can pull the connecting plate 602 to move upward. When the connecting rod 605 moves to a nearly vertical state, the connecting rod 605 facilitates to push the connecting plate 602 to move downward, driving the piston rod 609 connected to the connecting rod 605 to slide into the gas storage box 601, and driving the elastic telescopic column 608 to contract through the connecting block 610, squeezing the elastic telescopic column 608, and when the piston rod 609 slides into the gas storage box 601, the air sucked into the gas storage box 601 will be discharged through the air outlet 611 and blown to the surface of the circuit board that has not entered the cover body 2, and the impurities existing on the surface of the subsequent circuit board are cleaned, which not only avoids the interference of impurities and dust and other pollutants on the adhesion of the resistor film, ensures the good adhesion between the resistor film and the circuit board, and strengthens the adhesion of the resistor film, but also keeps the surface of the circuit board clean by cleaning the impurities, which helps to ensure the good conductivity of the resistor film; When the gas storage box 601 is used to clean the dust and impurities remaining on the surface of the subsequent circuit boards, the dust and impurities blown up will float to the side away from the gas storage box 601, contact the adsorption plate 603, and adhere to the side wall of the adsorption plate 603. This not only makes it convenient for the staff to centrally process the cleaned dust, but also avoids the dust from being dispersed to the conveyor platform 1 and the subsequent circuit boards, thereby ensuring the cleanliness of the working environment.
[0032] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.
Claims
1. A resistance mask covering device for etching a circuit board, comprising a conveying platform (1), a cover body (2) fixedly connected at the center of the upper end surface of the conveying platform (1), a lifting plate (3) arranged inside the cover body (2), a sprayer (4) slidably connected to the lifting plate (3), characterized in that: The lifting plate (3) is vertically slidably connected inside the cover body (2); A spraying thickness adjustment mechanism (5) is provided between the lifting plate (3) and the cover body (2), the spraying thickness adjustment mechanism (5) comprising a moving plate (506), the moving plate (506) being fixedly connected to the upper end surface of the spraying machine (4), the spraying thickness adjustment mechanism (5) being used to control the height and moving speed of the spraying machine (4); A circuit board surface pretreatment mechanism (6) is arranged on the right side of the spraying thickness adjustment mechanism (5), and the circuit board surface pretreatment mechanism (6) is used to remove impurities remaining on the surface of the circuit board in advance.
2. The resistance mask covering device for circuit board etching according to claim 1, characterized in that: The spraying thickness adjustment mechanism (5) further comprises a horizontal plate (501), a threaded rod (502) is threadedly connected through the center of the horizontal plate (501), the threaded rod (502) is rotatably connected to the center of the upper end surface of the cover body (2), and a connecting column (503) is symmetrically fixedly connected to the lower end surface of the horizontal plate (501), the connecting columns (503) are all slidably connected to the cover body (2), and the lower ends of the connecting columns (503) are fixedly connected to the upper end surface of the lifting plate (3).
3. The resistance mask covering device for circuit board etching according to claim 2, characterized in that: The upper end surface of the movable plate (506) is symmetrically fitted with a resistance plate (507), and the upper end surface of the resistance plate (507) is symmetrically fixedly connected with a sliding column (508), and the sliding column (508) is slidably connected to the cover body (2), and a spring (509) is fixedly connected between the resistance plate (507) and the inner top surface of the cover body (2), and the spring (509) is sleeved on the sliding column (508).
4. The resistance mask covering device for circuit board etching according to claim 2, characterized in that: The upper end of the threaded rod (502) is fixedly connected to a knob (505); the upper end of the outer surface of the threaded rod (502) is rotatably connected to a support frame (504); the support frame (504) is fixedly connected to the upper end surface of the cover body (2); a limiting groove (510) is provided on the upper end surface of the support frame (504); the outer surface of the knob (505) is vertically slidably connected to a circular ring (511); the outer surface of the circular ring (511) is symmetrically provided with clamping blocks (512); the clamping blocks (512) are all adapted to the limiting groove (510); and the upper end surface of the circular ring (511) is symmetrically fixedly connected to an arc-shaped plate (513).
5. The resistance mask covering device for circuit board etching according to claim 1, characterized in that: The circuit board surface pretreatment mechanism (6) comprises an air storage box (601), wherein the air storage box (601) is fixedly connected to the right side wall of the cover body (2), a piston rod (609) is equidistantly penetrated and slidably connected to the upper end of the air storage box (601), a connecting plate (602) is fixedly connected between the upper ends of the piston rods (609), and air inlet holes (604) are equidistantly opened at the lower end of the air storage box (601) on a side away from the conveying platform (1), and air outlet holes (611) are equidistantly opened at the lower end of the air storage box (601) on a side close to the conveying platform (1).
6. The resistance mask covering device for circuit board etching according to claim 5, characterized in that: A connecting rod (605) is rotatably connected at the center of the upper end surface of the connecting plate (602); a through groove (606) is provided on the side of the connecting rod (605) away from the connecting plate (602); a shifting rod (607) is slidably connected in the through groove (606); and one end of the shifting rod (607) away from the connecting rod (605) is fixedly connected to the side wall of the movable plate (506).
7. The resistance mask covering device for circuit board etching according to claim 5, characterized in that: The front and rear sides of the connection plate (602) are fixedly connected to connection blocks (610), the lower ends of the connection blocks (610) are fixedly connected to elastic telescopic columns (608), and the ends of the elastic telescopic columns (608) away from the connection blocks (610) are fixedly connected to the gas storage box (601).
8. The resistance mask covering device for circuit board etching according to claim 5, characterized in that: A side of the conveying platform (1) away from the gas storage box (601) is fixedly connected to an adsorption plate (603), and a side of the adsorption plate (603) close to the gas storage box (601) is a sticky surface.
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