Printed circuit board coating processing device

Abstract

The invention discloses a printed circuit board coating processing device, and belongs to the technical field of printed circuit board processing, the printed circuit board coating processing device comprises a processing table, and the middle position of the processing table is provided with a mounting groove; a plating layer surface treatment mechanism is arranged in the mounting groove, and a placing frame for placing a circuit board is arranged on the plating layer surface treatment mechanism; a horizontal moving structure is arranged at the top of the machining table, a machining scraping structure is arranged on the horizontal moving structure, and the machining scraping structure is rotationally connected with the horizontal moving structure. The coating surface treatment mechanism works to drive the position angle of the placing frame to swing and change, so that an activation solution can be in contact with the surface of the circuit board, no dead angle exists when the coating surface of the circuit board is treated, the coating surface layer treatment is comprehensive, and subsequent circuit board processing is facilitated.

Description

Technical Field

[0001] The invention belongs to the technical field of printed circuit board processing, and in particular relates to a printed circuit board plating processing device. Background Art

[0002] As an indispensable component of electronic equipment, printed circuit board (PCB) plays a vital role in the development of modern electronic technology. The development of printed circuit board can be traced back to the early 20th century. Initially, electronic components were directly connected together by wires, which was not only inefficient but also unreliable. With the continuous development of electronic technology, people began to try to print wires on insulating substrates, thus forming early printed circuit boards.

[0003] In the following decades, the technology of printed circuit boards has continued to advance. From single-sided boards to double-sided boards, and then to multi-layer boards, the integration and performance of printed circuit boards have continued to improve. At the same time, with the increasing demand for miniaturization and lightweight electronic devices, the manufacturing process of printed circuit boards has also been constantly innovating, such as the emergence of high-density interconnect technology (HDI) and embedded component technology, which enables printed circuit boards to meet the needs of more complex and high-performance electronic devices.

[0004] During the processing of the circuit board, the surface of the circuit board needs to be processed and must be thoroughly cleaned, including removing impurities such as oil, dust, oxides, etc. to ensure that the coating can adhere well.

[0005] However, in the existing process of cleaning the coating, the cleaning is not thorough enough, and there are some dead corners or the cleaning is not uniform enough, resulting in poor adhesion when the coating is subsequently copper-plated, nickel-plated or gold-plated, which affects the subsequent processing of the coating. Summary of the invention

[0006] The embodiment of the present invention provides a printed circuit board plating processing device to solve the problems in the prior art.

[0007] The embodiment of the present invention adopts the following technical scheme: a printed circuit board plating processing device, comprising a processing table, wherein a mounting groove is provided at the middle position of the processing table; a plating surface treatment mechanism is provided in the mounting groove, and a placement frame for placing the circuit board is provided on the plating surface treatment mechanism; a horizontal moving structure is provided on the top of the processing table, and a processing scraping structure is provided on the horizontal moving structure, and the processing scraping structure is rotatably connected to the horizontal moving structure, and the horizontal moving structure can drive the processing scraping structure to move along the length direction of the processing table.

[0008] The present invention can drive the position angle of the placement frame to swing and change through the operation of the coating surface treatment mechanism, so that the activation solution can complete the contact with the surface of the circuit board, so that there will be no dead angle when the coating surface of the circuit board is treated, so that the coating surface is treated comprehensively, which is beneficial to the subsequent processing of the circuit board.

[0009] A further technical solution is that the coating surface treatment mechanism includes a base plate, two support plates are arranged on the base plate, a rotating frame rotatably connected is arranged between the two support plates, a rotating motor is arranged on the base plate between the two support plates, an inclined rotating rod is arranged on the main shaft of the rotating motor, a vertically arranged rotating shaft is arranged on the rotating frame, the rotating shaft is rotatably connected to the rotating frame, and a horizontally arranged support plate is arranged on the top of the rotating shaft.

[0010] According to a further technical solution, both ends of the placement frame are open structures, each of the openings is provided with a sealing plate that slidably cooperates with it, a sealing strip is provided at the bottom of the sealing plate, and the placement frame is horizontally arranged on the top of the support plate.

[0011] According to a further technical solution, two symmetrically arranged locking screws are provided on the end side walls of the placement frame, and the locking screws are in conflict with the sealing plate.

[0012] According to a further technical solution, a water outlet is provided on the side wall of the placement frame, a filter is provided at the water outlet, a corrugated water outlet pipe is provided at the water outlet, and a water pump connected to the corrugated water outlet pipe is provided on the side of the bottom plate.

[0013] According to a further technical solution, the horizontal movable structure includes a movable frame and two horizontally arranged horizontal movable slides, the two horizontal movable slides are symmetrically arranged on both sides of the top mounting groove of the processing table, and the bottom of the movable frame is respectively connected to the movable ends of the two horizontal movable slides.

[0014] A further technical solution is that the processing scraping structure includes a lifting electric cylinder, a lifting frame, a scraping plate and a scraping motor. The lifting electric cylinder is located at the top of the movable frame, the lifting frame is connected to the telescopic end of the lifting electric cylinder, the scraping plate is provided with a horizontally arranged rotating shaft, the scraping plate is rotatably connected to the lifting frame via the rotating shaft, the scraping motor is located on the lifting frame and the scraping motor is transmission-connected to the rotating shaft.

[0015] According to a further technical solution, the lifting frame is provided with a plurality of discharge nozzles arranged at equal intervals, and a plurality of the discharge nozzles are provided with horizontally arranged and interconnected pipes.

[0016] At least one of the above technical solutions adopted in the embodiments of the present invention can achieve the following beneficial effects:

[0017] Firstly, when the angle position of the placement frame is swung, the rotating motor drives the rotating rod to rotate, which can drive the rotating shaft to swing, thereby driving the rotating frame to swing on the two support plates, thereby driving the angle position of the placement frame to swing, so that the surface of the circuit board can be completely in contact with the solution, so that the treatment effect is better; it can improve the activation uniformity, accelerate the activation reaction, prevent local overheating and improve the treatment efficiency and quality.

[0018] Secondly, after removing impurities on the surface of the circuit board, the present invention drives the lifting electric cylinder to move the lifting frame downward, and moves the scraper plate to the upper surface position of the circuit board. At the same time, the scraper motor drives the angle position of the rotating shaft to rotate, thereby driving the angle of the scraper plate to change, so that the scraper plate contacts the top of the circuit board. Subsequently, the two horizontal moving slides work at the same time to drive the scraper plate to move, and the impurities on the surface of the circuit board are scraped. According to the different thickness of impurities on the circuit board coating, the angle of the scraper plate is adjusted by the scraper motor to be suitable for scraping impurities of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0021] Figure 2 A top view of the present invention;

[0022] Figure 3 It is a schematic diagram of the three-dimensional structure of the first coating surface treatment mechanism in the present invention;

[0023] Figure 4 It is a schematic diagram of the three-dimensional structure of the second coating surface treatment mechanism in the present invention;

[0024] Figure 5 It is a third three-dimensional structural schematic diagram of the coating surface treatment mechanism in the present invention;

[0025] Figure 6 It is a schematic diagram of the three-dimensional structure of the placement frame in the present invention;

[0026] Figure 7 It is a first three-dimensional structural schematic diagram of the horizontal moving structure and the processing and scraping structure in the present invention;

[0027] Figure 8 It is a first three-dimensional structural schematic diagram of the horizontal moving structure and the processing and scraping structure in the present invention;

[0028] Reference numerals

[0029] Processing table 1, mounting groove 10, coating surface treatment mechanism 2, bottom plate 21, support plate 22, rotating motor 23, rotating rod 24, rotating shaft 25, support plate 26, rotating frame 27, placement frame 3, sealing plate 31, sealing strip 32, locking screw 33, filter screen 34, corrugated water outlet pipe 35, water pump 36, horizontal moving structure 4, moving frame 41, horizontal moving slide 42, processing scraping structure 5, lifting electric cylinder 51, lifting frame 52, scraping plate 53, scraping motor 54, discharge nozzle 55, pipeline 56. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0031] The technical solutions provided by various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0032] Reference Figures 1 to 8 As shown, an embodiment of the present invention provides a printed circuit board coating processing device, comprising a processing table 1, a mounting groove 10 is provided at the middle position of the processing table 1; a coating surface treatment mechanism 2 is provided in the mounting groove 10, and a placement frame 3 for placing a circuit board is provided on the coating surface treatment mechanism 2; a horizontal moving structure 4 is provided on the top of the processing table 1, and a processing scraping structure 5 is provided on the horizontal moving structure 4, and the processing scraping structure 5 is rotatably connected with the horizontal moving structure 4, and the horizontal moving structure 4 can drive the processing scraping structure 5 to move along the length direction of the processing table 1. .

[0033] When in use, the circuit board to be plated is placed in the placement frame 3, and then the position of the plurality of discharge nozzles 55 is moved to the top of the placement frame 3 through the operation of the horizontal moving structure 4, and the solution to be activated is sprayed onto the circuit board to activate the coating on the circuit board, which can effectively remove oxides, oil stains, impurities and organic pollutants on the surface of the printed circuit board, improve the quality and reliability of the coating, and provide a good foundation for the subsequent processing and use of the printed circuit board;

[0034] While the surface of the circuit board is being activated, the coating surface treatment mechanism 2 can drive the position angle of the placement frame 3 to swing and change, so that the activation solution can contact the surface of the circuit board, so that there will be no dead angle when the coating surface of the circuit board is treated, so that the coating surface is treated comprehensively, which is conducive to the subsequent processing of the circuit board;

[0035] After the surface of the circuit board is processed, the processing scraping structure 5 can be driven by the horizontal moving structure 4 to scrape off the impurities and residues activated from the circuit board, thereby ensuring comprehensive scraping of the residues.

[0036] Specifically, the coating surface treatment mechanism 2 includes a base plate 21, two support plates 22 are provided on the base plate 21, a rotating frame 27 rotatably connected is provided between the two support plates 22, a rotating motor 23 is provided on the base plate 21 between the two support plates 22, an inclined rotating rod 24 is provided on the main shaft of the rotating motor 23, a vertically arranged rotating shaft 25 is provided on the rotating frame 27, the rotating shaft 25 is rotatably connected to the rotating frame 27, and a horizontally arranged support plate 26 is provided on the top of the rotating shaft 25.

[0037] When the angular position of the placement frame 3 is swung, the rotating motor 23 drives the rotating rod 24 to rotate, which can drive the rotating shaft 25 to swing, thereby driving the rotating frame 27 to swing on the two support plates 22, thereby driving the angular position of the placement frame 3 to swing, so that the surface of the circuit board can be completely in contact with the solution, so that the treatment effect is better;

[0038] When activating the circuit board, oscillating and shaking the activation solution has the following benefits:

[0039] Ensure that the solution is fully in contact: By swinging and shaking the activation solution, the solution can flow fully over the entire circuit board surface, ensuring that every part is in full contact with the activation solution. This can avoid insufficient or excessive local activation and make the activation effect more uniform.

[0040] Prevent concentration differences: The activation solution may have uneven concentrations when it is stationary, especially after long-term use. Swinging and shaking can continuously mix the solution, reduce concentration differences, and ensure that the entire circuit board surface is activated uniformly.

[0041] Increase the probability of reactant collision: Swinging and shaking the activation solution can increase the probability of collision between the active ingredients in the activation solution and the substances on the surface of the circuit board. This helps to accelerate the activation reaction, improve the activation efficiency, and shorten the activation treatment time.

[0042] Promote material diffusion: Activation reactions usually produce some by-products or substances that need to be removed. Swinging and shaking can promote the diffusion of these substances, allowing them to leave the surface of the circuit board faster, providing more space and opportunities for activation reactions.

[0043] Evenly distribute heat: During the activation process, a certain amount of heat may be generated. If the activation solution is stationary, the heat may accumulate locally, causing local overheating of the circuit board. Swinging and shaking the activation solution can make the heat more evenly distributed, preventing local overheating from damaging the circuit board.

[0044] Stable temperature: Swinging and shaking can also help maintain a stable temperature of the activation solution by dissipating heat evenly. This is very important for some temperature-sensitive activation reactions to ensure consistent activation results.

[0045] Reduced processing time: Oscillating and shaking the activation solution can reduce the activation time due to accelerated activation reaction and improved activation uniformity. This can improve production efficiency and reduce costs for large-scale production of circuit boards.

[0046] Improve product quality: Uniform activation can make the coating of the circuit board more solid and uniform, improving the quality and reliability of the product. At the same time, preventing local overheating can also reduce the defects of the circuit board caused by thermal stress, further improving product quality.

[0047] In short, when activating the circuit board, oscillating and shaking the activation solution can improve the activation uniformity, accelerate the activation reaction, and prevent local overheating, thereby improving the processing efficiency and quality.

[0048] Specifically, both ends of the placement frame 3 are open structures, each of the openings is provided with a sealing plate 31 that slidably cooperates therewith, and a sealing strip 32 is provided at the bottom of the sealing plate 31. The placement frame 3 is horizontally arranged on the top of the support plate 26.

[0049] The sealing strip 32 at the bottom of the sealing plate 31 can make the opening on the placement frame 3 in a sealed and enclosed space to prevent the activated solution from overflowing when the activation treatment is performed.

[0050] Specifically, two symmetrically arranged locking screws 33 are provided on the end side walls of the placement frame 3 , and the locking screws 33 are in conflict with the sealing plate 31 .

[0051] After the two sealing plates 31 move downward to seal the opening of the placement frame 3, the two locking screws 33 can be rotated to lock and limit the position of the sealing plates 31, so that the sealing plates 31 are fixed at the opening of the placement frame 3, so that the placement frame 3 is in a sealed space, and when the surface of the circuit board is activated, it is easy to prevent it from overflowing.

[0052] Specifically, a water outlet is provided on the side wall of the placement frame 3 , a filter screen 34 is provided at the water outlet, a corrugated water outlet pipe 35 is provided at the water outlet, and a water pump 36 connected to the corrugated water outlet pipe 35 is provided on the side of the bottom plate 21 .

[0053] After the activation treatment of the surface of the circuit board coating is completed, the water pump 36 works to pump the activated liquid out through the corrugated outlet pipe 35 into the existing storage box. A filter screen 34 is provided at the outlet to separate and filter the activated impurities and filter residues to prevent the corrugated outlet pipe 35 from being blocked.

[0054] Specifically, the horizontal moving structure 4 includes a moving frame 41 and two horizontally arranged horizontal moving slides 42. The two horizontal moving slides 42 are symmetrically arranged on both sides of the top mounting groove 10 of the processing table 1, and the bottom of the moving frame 41 is respectively connected to the moving ends of the two horizontal moving slides 42.

[0055] Specifically, the processing scraping structure 5 includes a lifting electric cylinder 51, a lifting frame 52, a scraping plate 53 and a scraping motor 54. The lifting electric cylinder 51 is located at the top of the movable frame 41, and the lifting frame 52 is connected to the telescopic end of the lifting electric cylinder 51. The scraping plate 53 is provided with a horizontally arranged rotating shaft, and the scraping plate 53 is rotatably connected to the lifting frame 52 via the rotating shaft. The scraping motor 54 is located on the lifting frame 52 and the scraping motor 54 is transmission-connected to the rotating shaft.

[0056] When processing the surface of the circuit board, the two horizontal movable slides 42 can work simultaneously to drive the position of the movable frame 41 to move to the top of the placement frame 3;

[0057] First, when the solution is sprayed onto the circuit in the placement frame 3, the movement of the movable frame 41 can drive the positions of the plurality of discharge nozzles 55 to move to the top of the placement frame 3, and spray the solution onto the circuit board in the placement frame 3;

[0058] Second, after removing the impurities on the surface of the circuit board, the lifting electric cylinder 51 drives the lifting frame 52 to move downward, and moves the scraper plate 53 to the upper surface of the circuit board. At the same time, the scraper motor 54 drives the angle of the rotating shaft to rotate, thereby driving the angle of the scraper plate 53 to change, so that the scraper plate 53 contacts the top of the circuit board. Subsequently, the two horizontal moving slides 42 work at the same time to drive the scraper plate 53 to move, and the impurities on the surface of the circuit board are scraped off. According to the different thicknesses of the impurities on the circuit board coating, the scraper motor 54 is used to adjust the angle of the scraper plate 53 so as to be suitable for scraping impurities of different thicknesses.

[0059] The scraper plate 53 can effectively remove oxides, oil stains, impurities and organic pollutants on the surface of the printed circuit board, thereby improving the quality and reliability of the coating and providing a good foundation for the subsequent processing and use of the printed circuit board.

[0060] Specifically, the lifting frame 52 is provided with a plurality of discharge nozzles 55 arranged at equal intervals, and a plurality of discharge nozzles 55 are provided with horizontally arranged and interconnected pipes 56;

[0061] When the surface of the circuit board is activated, the pipe 56 transports the solution to the plurality of discharge nozzles 55, and the plurality of discharge nozzles 55 are moved to the top of the placement frame 3 by the horizontal moving structure 4, and the solution is transported to the placement frame 3 by the plurality of discharge nozzles 55 to activate the surface of the printed circuit board;

[0062] It should be noted that during the activation treatment, the following chemical activation treatment is used:

[0063] Acidic activation: Use acidic solutions, such as sulfuric acid-hydrogen peroxide mixture, hydrochloric acid, etc., to treat the surface of the circuit board. Acidic solutions can remove oxides and impurities on the surface of the circuit board, expose the copper surface, and increase its reactivity. When using acidic activators, the concentration, temperature, and treatment time of the solution need to be strictly controlled to avoid excessive corrosion of the circuit board surface.

[0064] Alkaline activation: Alkaline activators such as sodium hydroxide, sodium carbonate and other solutions can also be used for circuit board activation. Alkaline solutions can remove grease and organic pollutants on the surface of circuit boards, while creating a certain degree of roughness on the copper surface and increasing the adhesion of the coating. Compared with acidic activation, alkaline activation is less corrosive, but the treatment effect may be relatively weaker.

[0065] Different circuit boards can choose different activation treatment methods.

[0066] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A printed circuit board coating processing device, characterized in that: It comprises a processing table (1), wherein a mounting groove (10) is provided at the middle position of the processing table (1); A coating surface treatment mechanism (2) is provided in the installation groove (10), and a placement frame (3) for placing a circuit board is provided on the coating surface treatment mechanism (2); A horizontal moving structure (4) is provided on the top of the processing table (1), a processing scraping structure (5) is provided on the horizontal moving structure (4), and the processing scraping structure (5) is rotatably connected to the horizontal moving structure (4); The horizontal moving structure (4) can drive the processing and scraping structure (5) to move along the length direction of the processing table (1).

2. A printed circuit board coating processing device according to claim 1, characterized in that: The coating surface treatment mechanism (2) comprises a bottom plate (21), two support plates (22) are arranged on the bottom plate (21), and a rotating frame (27) rotatably connected is arranged between the two support plates (22); A rotating motor (23) is provided on the bottom plate (21) between the two supporting plates (22), and a rotating rod (24) is provided on the main shaft of the rotating motor (23) at an angle; A vertically arranged rotating shaft (25) is provided on the rotating frame (27), the rotating shaft (25) is rotatably connected to the rotating frame (27), and a horizontally arranged supporting plate (26) is provided on the top of the rotating shaft (25).

3. A printed circuit board coating processing device according to claim 2, characterized in that: Both ends of the placement frame (3) are open structures, and each of the openings is provided with a sealing plate (31) that is slidably matched therewith; A sealing strip (32) is provided at the bottom of the sealing plate (31), and the placement frame (3) is horizontally arranged on the top of the supporting plate (26).

4. A printed circuit board coating processing device according to claim 3, characterized in that: Two symmetrically arranged locking screws (33) are provided on the end side walls of the placement frame (3), and the locking screws (33) are in conflict with the sealing plate (31).

5. A printed circuit board coating processing device according to claim 3, characterized in that: A water outlet is provided on the side wall of the placement frame (3), a filter screen (34) is provided at the water outlet, and a corrugated water outlet pipe (35) is provided at the water outlet; A water pump (36) connected to the corrugated water outlet pipe (35) is provided on the side of the bottom plate (21).

6. A printed circuit board coating processing device according to claim 1, characterized in that: The horizontal moving structure (4) comprises a moving frame (41) and two horizontally arranged horizontal moving slides (42), wherein the two horizontally arranged horizontal moving slides (42) are symmetrically arranged on both sides of the top mounting groove (10) of the processing table (1); The bottom of the movable frame (41) is respectively connected to the movable ends of two horizontal movable slides (42).

7. A printed circuit board coating processing device according to claim 6, characterized in that: The processing scraping structure (5) comprises a lifting electric cylinder (51), a lifting frame (52), a scraping plate (53) and a scraping motor (54); The lifting electric cylinder (51) is located at the top of the moving frame (41), the lifting frame (52) is connected to the telescopic end of the lifting electric cylinder (51), the scraping plate (53) is provided with a horizontally arranged rotating shaft, and the scraping plate (53) is rotatably connected to the lifting frame (52) via the rotating shaft; The scraping motor (54) is located on the lifting frame (52) and is in transmission connection with the rotating shaft.

8. A printed circuit board coating processing device according to claim 7, characterized in that: The lifting frame (52) is provided with a plurality of discharge nozzles (55) arranged at equal intervals, and a plurality of discharge nozzles (55) are provided with horizontally arranged and interconnected pipes (56).

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