Fan module and electronic equipment

Abstract

The invention provides a fan module and electronic equipment. The fan module comprises a first circuit board, a fan single body, a packaging shell and an electric connecting piece. The fan monomer is electrically connected to the first circuit board; the packaging shell is provided with a containing space, and the containing space is used for containing the first circuit board and the fan single body. The electric connecting piece is used for electrically connecting the first circuit board to a mainboard located outside the packaging shell; wherein a part of the electric connecting piece is wrapped and fixed on the packaging shell, and the part, corresponding to the electric connecting piece, of the packaging shell is sealed. The fan module is good in integrity and has good waterproof and dustproof effects.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a fan module and an electronic device. Background Art

[0002] With the development of technology, electronic devices such as mobile phones are becoming more and more popular and more powerful. In some electronic devices, a fan module is usually included. The fan module can be used to dissipate heat from the heating components in the electronic device. However, the waterproof performance of the fan module of the electronic device in the related art is poor. Summary of the invention

[0003] In a first aspect, an embodiment of the present application provides a fan module, the fan module comprising:

[0004] a first circuit board;

[0005] A fan unit, wherein the fan unit is electrically connected to the first circuit board;

[0006] A packaging shell, wherein the packaging shell has a receiving space, and the receiving space is used to receive the first circuit board and the fan unit; and

[0007] An electrical connector, the electrical connector being used to electrically connect the first circuit board to a main board located outside the packaging shell;

[0008] Part of the electrical connector is wrapped and fixed to the packaging shell, and the packaging shell is sealed corresponding to the electrical connector.

[0009] In a second aspect, another embodiment of the present application provides an electronic device, the electronic device comprising:

[0010] The fan module as described in the first aspect; and

[0011] A main board is electrically connected to the first circuit board through the electrical connector.

[0012] In summary, the fan module provided in the embodiment of the present application includes an electrical connector, which is used to electrically connect the first circuit board located in the receiving space of the packaging shell and the mainboard located outside the packaging shell, and part of the electrical connector is wrapped in the packaging shell, and the packaging shell is sealed corresponding to the electrical connector. Therefore, the sealing performance between the packaging shell and the electrical connector is good, and dust and water vapor from the outside are not easy to enter the fan module. The fan module has a good dustproof and waterproof effect, and the fan module has a high dustproof and waterproof grade. Further, the packaging shell has a receiving space, and the receiving space is used to receive the first circuit board and the fan monomer. Therefore, the integrity of the fan module is good, and the waterproof and dustproof effects of the fan module are further improved. When the fan module is applied to an electronic device, the assembly between the other components of the electronic device and the fan module is relatively simple, and it is conducive to simplifying the waterproof structure of the electronic device to which the fan module is applied. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0014] Figure 1 A three-dimensional schematic diagram of an electronic device provided in one embodiment of the present application at one viewing angle;

[0015] Figure 2 For one embodiment Figure 1 A rear view of the electronic device shown in ;

[0016] Figure 3 for Figure 2 A schematic diagram of a portion of the structure of the electronic device shown in ;

[0017] Figure 4 for Figure 3 A three-dimensional exploded schematic diagram of a partial structure of an electronic device shown in ;

[0018] Figure 5 for Figure 3 A cross-sectional view of a portion of the fan module structure along line AA shown in FIG.

[0019] Figure 6 for Figure 3 A schematic diagram of a portion of the structure of the fan module from another perspective is shown;

[0020] Figure 7 for Figure 3A top view of a partial structure of the fan module shown in ;

[0021] Figure 8 for Figure 7 The back side schematic diagram of the fan module shown in FIG.

[0022] Fig. 9 for Figure 3 A top view of the fan module shown in ;

[0023] Fig.10 for Fig. 9 Sectional view along line BB;

[0024] Fig.11 for Fig.10 The enlarged schematic diagram of point I in the middle;

[0025] Fig.12 for Figure 3 A partial structural diagram of a fan module;

[0026] Fig.13 for Fig.12 A top view of

[0027] Fig.14 for Fig.13 The cross-section along the CC line;

[0028] Fig.15 for Fig.12 A partial structural diagram of a fan module;

[0029] Fig.16 A circuit block diagram of an electronic device provided in another embodiment of the present application;

[0030] Fig.17 for Figure 3 A schematic diagram of a portion of the structure of the light-emitting component in the fan module shown;

[0031] Fig.18 for Fig.17 A three-dimensional exploded schematic diagram of the structure shown in;

[0032] Fig.19 for Fig.10 The enlarged schematic diagram of II in the middle;

[0033] Fig. 20 For another embodiment Figure 1 A rear view of the electronic device shown in ;

[0034] Fig.21 A circuit block diagram of an electronic device provided in accordance with one embodiment of the present application. DETAILED DESCRIPTION

[0035] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described in the present application are only a part of the embodiments, not all of the embodiments. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the present application.

[0036] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it mutually exclusive, independent, or alternative to other embodiments. It can be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0037] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example: a component or device including one or more parts is not limited to the one or more parts listed, but optionally includes one or more parts that are not listed but inherent to the exemplified product, or one or more parts that it should have based on the described function.

[0038] The present application also provides a fan module 110 and an electronic device 1, and the electronic device 1 can be, but is not limited to, a mobile phone, a watch, a tablet computer, a laptop computer, or a computer case. In the present application, the electronic device 1 is illustrated and described as a mobile phone, which is understandable and should not be construed as a limitation on the present application. Next, the electronic device 1 provided in the present application is described in detail.

[0039] Please also read Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 A three-dimensional schematic diagram of an electronic device provided in one embodiment of the present application at one viewing angle; Figure 2 For one embodiment Figure 1 A rear view of the electronic device shown in ; Figure 3 for Figure 2 A schematic diagram of a portion of the structure of the electronic device shown in ; Figure 4 for Figure 3The electronic device 1 includes a fan module 110, which generates wind when in operation to cool down the functional components generating heat in the electronic device 1. In one embodiment, the electronic device 1 also includes a decorative component 120 and a light-emitting component 130. The decorative component 120 is used to decorate the fan module 110. The light-emitting component 130 is used to generate light, and the light-emitting component 130 is arranged corresponding to the fan module 110 to indicate and decorate the position where the fan module 110 is arranged in the electronic device 1.

[0040] It is understandable that the introduction of the electronic device 1 provided in the embodiment of the present application is only an introduction to an application scenario of the fan module 110 provided in the embodiment of the present application. In other embodiments, the electronic device 1 may not include the decorative component 120, or the electronic device 1 may not include the light-emitting component 130, or the electronic device 1 may not include the decorative component 120 and the light-emitting component 130. The introduction of the electronic device 1 to which the fan module 110 is applied in the embodiment of the present application should not be understood as a limitation on the fan module 110.

[0041] See also Figures 5 to 11 , Figure 5 for Figure 3 A cross-sectional view of a portion of the fan module structure along line AA shown in FIG. Figure 6 for Figure 3 A schematic diagram of a portion of the structure of the fan module from another perspective is shown; Figure 7 for Figure 3 A top view of a partial structure of the fan module shown in ; Figure 8 for Figure 7 The back side schematic diagram of the fan module shown in FIG. Fig. 9 for Figure 3 A top view of the fan module shown in ; Fig.10 for Fig. 9 Sectional view along line BB; Fig.11 for Fig.10 The fan module 110 includes a first circuit board 111, a fan unit 112, a packaging shell 113 and an electrical connector 114. The fan unit 112 is electrically connected to the first circuit board 111. The packaging shell 113 has a receiving space 113a, and the receiving space 113a is used to receive the first circuit board 111 and the fan unit 112. The electrical connector 114 is used to electrically connect the first circuit board 111 to the main board 310 located outside the packaging shell 113. Part of the electrical connector 114 is wrapped and fixed to the packaging shell 113, and the packaging shell 113 is sealed corresponding to the electrical connector 114.

[0042] The first circuit board 111 may be, but is not limited to, a printed circuit board or a flexible circuit board. The fan unit 112 is electrically connected to the first circuit board 111. In one embodiment, the fan unit 112 may receive a first control signal transmitted by the first circuit board 111, and work or stop working under the control of the first control signal. Generally speaking, the fan unit 112 includes one or more blades. When the first control signal controls the fan unit 112 to work, the first control signal may control the speed of the blades of the fan unit 112.

[0043] The electrical connector 114 may be, but is not limited to, a conductive metal connector or a conductive non-metal connector. When the electrical connector 114 is a conductive metal connector, the electrical connector 114 may be, but is not limited to, at least one of a steel sheet, a copper sheet, an aluminum sheet, and the like.

[0044] The specific connection method of the electrical connector 114 for electrically connecting the first circuit board 111 and the main board 310 will be described in detail later. The electrical connector 114 electrically connects the first circuit board 111 and the main board 310, and is used to transmit the signal of the main board 310 to the first circuit board 111. For example, the signal transmitted by the electrical connector 114 includes a positive signal, a negative signal, the first control signal and a feedback signal of the working state of the fan unit 112. The positive signal and the negative signal are used to provide electrical energy for the fan unit 112 to work. The first control signal can be, but is not limited to, a pulse width modulation signal (PWM). The first control signal can control the current flowing through the stator of the fan unit 112, thereby controlling the speed of the rotor of the fan unit 112 and the size of the operating speed of the fan blades connected to the rotor. The feedback signal is used to feed back to the main board 310 via the electrical connector 114, so that the main board 310 can further control the fan unit 112 according to the feedback signal.

[0045] The first circuit board 111 is located inside the packaging shell 113. When the fan module 110 is applied to the electronic device 1, the electronic device 1 further includes a mainboard 310. The mainboard 310 is located outside the packaging shell 113. Therefore, when the electrical connector 114 electrically connects the first circuit board 111 located inside the packaging shell 113, and electrically connects the mainboard 310 located outside the packaging shell 113: the connector is partially located inside the packaging shell 113 for electrically connecting to the first circuit board 111; a portion of the electrical connector 114 is wrapped in the packaging shell 113; another portion of the electrical connector 114 is located outside the packaging shell 113 to electrically connect to the circuit board.

[0046] In this embodiment, part of the electrical connector 114 is wrapped in and fixed to the packaging shell 113. For example, the electrical connector 114 can be molded together with the packaging shell 113 by, but not limited to, in-mold injection molding. Since part of the electrical connector 114 is wrapped in and fixed to the packaging shell 113, the electrical connector 114 and the packaging shell 113 can be regarded as an integral structure.

[0047] It can be seen that the fan module 110 provided in the embodiment of the present application, the first circuit board 111 and the fan unit 112 are accommodated in the encapsulation shell 113 of the fan module 110, and part of the electrical connector 114 is wrapped and fixed to the encapsulation shell 113. Therefore, the fan module 110 forms an independent sealed box. When the fan module 110 is used in the electronic device 1, it is convenient to assemble with other components in the electronic device 1, and it is conducive to simplifying the waterproof design of the electronic device 1.

[0048] In order to conveniently introduce the beneficial effects of the fan module 110 provided in the embodiment of the present application, the fan module 110 in the related art before the fan module 110 provided in the embodiment of the present application is improved is introduced. It can be understood that the fan module 110 in the related art is the fan module 110 before the fan module 110 provided in the embodiment of the present application is improved, and should not be understood as the fan module 110 of the prior art. In the fan module 110 in the related art, the encapsulation shell 113 has an opening, and part of the first circuit board 111 extends out of the encapsulation shell 113 through the opening of the encapsulation shell 113 to be electrically connected to the mainboard 310 outside the encapsulation shell 113. Since in the fan module 110 in the related art, the encapsulation shell 113 has an opening, dust or water vapor from the outside can enter the fan module 110 through the opening, so that the waterproof performance of the fan module 110 is poor.

[0049] In summary, the fan module 110 provided in the embodiment of the present application includes an electrical connector 114, the electrical connector 114 is used to electrically connect the first circuit board 111 located in the receiving space 113a of the packaging shell 113 and the mainboard 310 located outside the packaging shell 113, part of the electrical connector 114 is wrapped in the packaging shell 113, and the packaging shell 113 is sealed at the electrical connector 114. Therefore, the sealing performance between the packaging shell 113 and the electrical connector 114 is good, dust and water vapor from the outside are not easy to enter the fan module 110, the fan module 110 has a good dustproof and waterproof effect, and the fan module 110 has a high dustproof and waterproof grade. Furthermore, the packaging shell 113 has a receiving space 113a, and the receiving space 113a is used to receive the first circuit board 111 and the fan unit 112. Therefore, the integrity of the fan module 110 is good, and the waterproof and dustproof effects of the fan module 110 are further improved. When the fan module 110 is applied to the electronic device 1, the assembly between the other components of the electronic device 1 and the fan module 110 is relatively simple, and it is helpful to simplify the waterproof structure of the electronic device 1 to which the fan module 110 is applied.

[0050] For further information, please refer to Figures 7 to 10 The packaging shell 113 includes a first shell 1131 and a second shell 1132. The second shell 1132 cooperates with the first shell 1131 to form the receiving space 113a. Part of the electrical connector 114 is wrapped and fixed to one of the first shell 1131 and the second shell 1132, and the one is sealed corresponding to the electrical connector 114.

[0051] In the illustrated perspective of this embodiment, the first shell 1131 is located at the bottom, and the second shell 1132 is located at the top, so the first shell 1131 can also be called the lower shell of the encapsulation shell 113, and the second shell 1132 can also be called the upper shell of the encapsulation shell 113. It can be understood that as the placement posture of the fan module 110 is different, the positions of the first shell 1131 and the second shell 1132 will also change.

[0052] The first housing 1131 cooperates with the second housing 1132 to form the receiving space 113a. In one embodiment, the second housing 1132 has an air inlet 1131a, and when the fan unit 112 is working, air flows into the receiving space 113a through the air inlet 1131a.

[0053] Part of the electrical connector 114 is wrapped and fixed to one of the first shell 1131 and the second shell 1132. For example, part of the electrical connector 114 is wrapped and fixed to the first shell 1131, or part of the electrical connector 114 is wrapped and fixed to the second shell 1132. In the schematic diagram of this embodiment, the electrical connector 114 is wrapped and fixed to the first shell 1131.

[0054] In this embodiment, part of the electrical connector 114 is wrapped and fixed to at least one of the first shell 1131 and the second shell 1132. For example, the electrical connector 114 can be molded together with the part of the electrical connector 114 by, but not limited to, in-mold injection molding. Since part of the electrical connector 114 is wrapped and fixed to one of the first shell 1131 and the second shell 1132, and the one is sealed at the electrical connector 114, the electrical connector 114 and the one can be regarded as an integral structure.

[0055] The one is sealed at the electrical connector 114, so the sealing performance between the one and the electrical connector 114 is good, external dust and water vapor are not easy to enter the fan module 110, and the fan module 110 has a good dustproof and waterproof effect.

[0056] Furthermore, the first circuit board 111 and the electrical connector 114 are electrically connected at a first connection point P1, and the fan module 110 further includes a first sealing member 115. The first sealing member 115 is used to seal the first connection point P1.

[0057] The way in which the first circuit board 111 and the electrical connector 114 are electrically connected may be, but is not limited to, welding to form the first connection point P1. When the first circuit board 111 and the electrical connector 114 are welded to form the first connection point P1, the connection between the first circuit board 111 and the electrical connector 114 is relatively firm. It is understandable that in other embodiments, welding may not be required between the first circuit board 111 and the electrical connector 114, as long as the first circuit board 111 and the electrical connector 114 are electrically connected. In one embodiment, the first connection point P1 is located outside the packaging shell 113, and therefore, the first connection point P1 may also be referred to as an external feeding point.

[0058] The first closing member 115 may be, but is not limited to, a sealant or an adhesive. When the first closing member 115 is a sealant or an adhesive, the first closing member 115 may be formed by dispensing. When the first closing member 115 includes a sealant or an adhesive, the volume of the first closing member 115 is relatively small and simple and easy to use. In addition, when the first closing member 115 includes a sealant or an adhesive, the first closing member 115 can not only seal the first connection point P1, but also bond the first circuit board 111 and the electrical connector 114, thereby improving the reliability of the electrical connection between the first circuit board 111 and the electrical connector 114. In other embodiments, the first closing member 115 may also be other sealants, such as silicone, foam, etc.

[0059] The fan module 110 provided in the embodiment of the present application further includes a first sealing member 115 , which can seal the first connection point P1 to further enhance the dustproof and waterproof performance of the first circuit board 111 and the electrical connector 114 .

[0060] See also Figure 5 The packaging shell 113 has a pinhole 1131b corresponding to the electrical connector 114. The fan module 110 further includes a second sealing member 117, and the second sealing member 117 is used to seal the pinhole 1131b.

[0061] In one embodiment, the electrical connector 114 is fixed to the packaging shell 113 by in-mold injection molding. The mold for in-mold injection molding includes an ejector pin, which is used to support and fix the electrical connector 114 to prevent the electrical connector 114 from being misaligned relative to the packaging shell 113. After the injection molding is completed, a pinhole 1131b is provided on the packaging shell 113 at a position corresponding to the ejector pin. The pinhole 1131b exposes a portion of the surface of the electrical connector 114.

[0062] The second sealing member 117 may be, but is not limited to, a sealant, an adhesive, a silicone, or a foam, etc. In one embodiment, when the second sealing member 117 is a sealant or an adhesive, the volume of the second sealing member 240 is relatively small and simple and easy to operate. In addition, when the second sealing member 117 includes a sealant or an adhesive, the second sealing member 117 may be formed by dispensing.

[0063] The fan module 110 provided in the embodiment of the present application further includes a second sealing member 117 , which can seal the pinhole 1131 b , thereby further increasing the waterproof and dustproof performance between the packaging shell 113 and the electrical connector 114 .

[0064] For further information, see Figures 8 to 10 The fan module 110 further includes a heat sink 116 and a third sealing member 118. Part of the heat sink 116 is wrapped and fixed to the first housing 1131. The third sealing member 118 is used to seal the connection between the heat sink 116 and the first housing 1131.

[0065] The heat sink 116 may be, but is not limited to, a heat sink fin, or a heat sink channel with a condensing medium, etc., and this application does not limit this. The material of the heat sink 116 may be, but is not limited to, copper, aluminum, iron, etc. When the material of the heat sink 116 is copper, and the shape of the heat sink 116 is sheet-like or approximately sheet-like, the heat sink 116 may also be called a copper sheet. The heat sink 116 is thermally connected to the fan unit 112. The heat sink 116 is used to dissipate the heat generated by the fan unit 112 when it is working, so as to prevent the fan unit 112 from being overheated.

[0066] In one embodiment, the heat sink 116 satisfies at least one of the following conditions: the heat sink 116 is thermally connected to the fan unit 112 and the second housing 1132 ; the heat sink 116 is thermally connected to the fan unit 112 and the first housing 1131 .

[0067] In one embodiment, when the fan module 110 is applied to an electronic device 1, the electronic device 1 includes a middle frame 210, a back cover 220, and a display screen 230. The middle frame 210 cooperates with the back cover 220 to accommodate the fan module 110. In one embodiment, the back cover 220 and the display screen 230 are respectively arranged on opposite sides of the middle frame 210. The second housing 1132 of the fan module 110 is away from the back cover 220 compared to the first housing 1131.

[0068] When the heat sink 116 is thermally connected to the fan unit 112 and the second housing 1132, the heat generated by the fan unit 112 during operation can be dissipated through the heat sink 116 and the second housing 1132. Specifically, the heat generated by the fan unit 112 during operation can be conducted to the middle frame 210 and the rear cover 220 through the heat sink 116 and the second housing 1132, and dissipated through the middle frame 210 and the rear cover 220.

[0069] When the heat sink 116 is thermally connected to the fan unit 112 and the first housing 1131, the heat generated by the fan unit 112 when it is working can be dissipated through the heat sink 116 and the first housing 1131. Specifically, the heat generated by the fan unit 112 when it is working can be conducted to the middle frame 210 and the display screen 230 through the heat sink 116 and the first housing 1131, and dissipated through the middle frame 210 and the display screen 230.

[0070] In this way, the heat generated by the fan unit 112 when working can be quickly dissipated, thereby lowering the temperature of the fan module 110 and allowing the fan unit 112 to have better performance when working.

[0071] In one embodiment, the heat sink 116 is at least partially disposed corresponding to the second housing 1132 , and the heat generated by the fan unit 112 can be quickly dissipated through the second housing 1132 , so that the fan unit 112 can have better performance when working.

[0072] Part of the heat sink 116 is wrapped and fixed to the first housing 1131, so the integrity of the fan module 110 can be improved. When the fan module 110 is used in the electronic device 1, it is convenient to assemble the fan module 110 with other components of the electronic device 1. Part of the heat sink 116 is wrapped and fixed to the first housing 1131. For example, the heat sink 116 can be molded together with the first housing 1131 by, but not limited to, in-mold injection molding. Since part of the heat sink 116 is wrapped and fixed to the first housing 1131, the heat sink 116 and the first housing 1131 can be regarded as an integral structure.

[0073] The third closing member 118 may be, but is not limited to, a sealant, an adhesive, a silicone, or a foam, etc. In one embodiment, when the third closing member 118 is a sealant or an adhesive, the volume of the third closing member 118 is relatively small and simple and easy to use. Furthermore, when the third closing member 118 is a sealant or an adhesive, the third closing member 118 may connect the heat sink 116 and the first shell 1131 to improve the connection reliability between the heat sink 116 and the first shell 1131. In addition, when the third closing member 118 includes a sealant or an adhesive, the third closing member 118 may be formed by dispensing.

[0074] The fan module 110 provided in the embodiment of the present application further includes a third sealing member 118, and the third sealing member 118 is used to seal the connection between the heat sink 116 and the first shell 1131. Therefore, the sealing performance of the connection between the heat sink 116 and the first shell 1131 is relatively high, and external dust and water vapor are not easy to enter the connection between the heat sink 116 and the first shell 1131, thereby further improving the dustproof and waterproof performance of the fan module 110.

[0075] Next, the internal structure of the fan module 110 is described in detail. Figure 7 The first circuit board 111 includes a board body 1111 and an electronic device 1112 (see Fig.15 ). The electronic device is disposed on the board body 1111. The fan module 110 further includes a fourth sealing member 119. The fourth sealing member 119 seals the periphery of the board body 1111 and at least one of the electronic devices.

[0076] See also Figure 7 The board body 1111 of the first circuit board 111 may include but is not limited to a printed circuit board or a flexible circuit board, etc. The electronic device may include but is not limited to a controller or an electrostatic protection device, etc.

[0077] The fourth sealing member 119 of the fan module 110 may be but is not limited to sealant, adhesive, silicone, foam, etc. When the fourth sealing member 119 is sealant or adhesive, the fourth sealing member 119 may be but is not limited to ultraviolet curing adhesive.

[0078] The fourth sealing member 119 seals the periphery of the board body 1111 and at least one of the electronic device 1 , so that the first circuit board 111 can have better dustproof and waterproof performance.

[0079] Please also read Fig.12 , Fig.13 , Fig.14 and Fig.15 , Fig.12 for Figure 3 A partial structural diagram of a fan module; Fig.13 for Fig.12 A top view of Fig.14 for Fig.13 The cross-section along the CC line; Fig.15 for Fig.12Schematic diagram of a partial structure of a fan module in FIG. In this embodiment, the fan unit 112 includes a bearing 1121, and the bearing 1121 is connected to the rotor. The bearing 1121 can be sealed with oil. When the bearing 1121 is sealed with oil, the waterproof performance of the fan unit 112 can be improved.

[0080] Further, the fan unit 112 further includes a stator 1122 and a conductive wire 1123 connected to the stator 1122. The conductive wire 1123 may be, but is not limited to, a copper wire or an aluminum wire. The outer periphery of the conductive wire 1123 is provided with a waterproof paint. The outer periphery of the conductive wire 1123 is provided with a waterproof paint, so that the waterproof performance of the fan unit 112 can be further improved.

[0081] Next, other structures of the electronic device are introduced. Figures 1 to 10 , and see Fig.16 , Fig.16 This is a circuit block diagram of an electronic device provided in another embodiment of the present application. The electronic device 1 includes a fan module 110 and a main board 310. The main board 310 is electrically connected to the first circuit board 111 through the electrical connector 114. Please refer to the previous description of the fan module 110, which will not be repeated here.

[0082] The mainboard 310 is electrically connected to the first circuit board 111 through the electrical connector 114. The signal generated by the mainboard 310 is transmitted to the first circuit board 111 via the electrical connector 114. In one embodiment, the signal generated by the mainboard 310 includes a positive signal, a negative signal, a first control signal, and a feedback signal. Please refer to the previous description for details of the signal generated by the mainboard 310, which will not be repeated here.

[0083] The first circuit board 111 is located inside the packaging shell 113. In one embodiment, the main board 310 is located outside the packaging shell 113. Therefore, when the electrical connector 114 is electrically connected to the first circuit board 111 located inside the packaging shell 113, and is electrically connected to the main board 310 located outside the packaging shell 113: the electrical connector 114 is partially located inside the packaging shell 113 for electrically connecting to the first circuit board 111; a portion of the electrical connector 114 is wrapped in the packaging shell 113; another portion of the electrical connector 114 is located outside the packaging shell 113 for electrically connecting to the main board 310.

[0084] In this embodiment, part of the electrical connector 114 of the fan module 110 is wrapped in and fixed to the packaging shell 113. For example, the electrical connector 114 can be molded together with the packaging shell 113 by, but not limited to, in-mold injection molding. Since part of the electrical connector 114 is wrapped in and fixed to the packaging shell 113, the connector and the packaging shell 113 can be regarded as an integral structure.

[0085] It can be seen that the electronic device 1 provided in the embodiment of the present application includes a fan module 110 and a mainboard 310. The first circuit board 111 and the fan unit 112 of the fan module 110 are accommodated in the encapsulation shell 113 of the fan module 110, and part of the electrical connector 114 is wrapped and fixed to the encapsulation shell 113. Therefore, the fan module 110 forms an independent sealed box. This is conducive to simplifying the waterproof design of the fan module 110 of the electronic device 1 and other components of the electronic device 1.

[0086] Further, in one embodiment, please refer to Figure 8 The electronic device 1 further comprises an elastic connector (not shown) and a fifth sealing member 1161. The elastic connector electrically connects the mainboard 310 and the electrical connector 114. The fifth sealing member 1161 seals the contact surface between the elastic connector and the electrical connector 114.

[0087] The elastic connector may be, but is not limited to, a spring or the like. The elastic connector electrically connects the main board 310 and the electrical connector 114 to achieve electrical conduction between the main board 310 and the electrical connector 114. In addition, the electrical connector 114 is electrically connected to the first circuit board 111. Therefore, the main board 310 is electrically connected to the first circuit board 111 through the elastic connector and the electrical connector 114.

[0088] The fifth sealing member 1161 may be, but is not limited to, sealant, adhesive, silicone, foam, etc.

[0089] In this embodiment, the fifth sealing member 1161 seals the contact surface between the elastic connector and the electrical connector 114 , thereby improving the waterproof performance between the elastic connector and the electrical connector 114 .

[0090] For further information, see Figure 3 and Fig.10, the encapsulation shell 113 also has an air inlet 1131a. The electronic device 1 also includes a middle frame 210, a back cover 220 and a first seal. The back cover 220 and the middle frame 210 cooperate to accommodate the fan module 110, and the back cover 220 has a through hole 220a, and the through hole 220a is connected to the air inlet 1131a. The first seal is also called an air inlet seal 270. The air inlet seal 270 is arranged in the gap between the back cover 220 and the encapsulation shell 113, and the air inlet seal 270 is arranged corresponding to the through hole 220a and the air inlet 1131a.

[0091] When the fan unit 112 is working, external air flows into the air inlet 1131 a of the packaging shell 113 through the through hole 220 a of the rear cover 220 .

[0092] The air inlet seal 270 may be, but is not limited to, sealant, adhesive, silicone, foam, etc. When external dust or water vapor enters the interior of the encapsulation shell 113 of the fan module 110 through the through hole 220a and the air inlet 1131a, since the air inlet seal 270 is arranged in the gap between the back cover 220 and the encapsulation shell 113, the dust or water vapor entering the encapsulation shell 113 of the fan module 110 is not easy or cannot enter other positions of the electronic device 1. It can be seen that the electronic device 1 provided in the embodiment of the present application, wherein the electronic device 1 also includes an air inlet seal 270, can further improve the dustproof and waterproof performance of the electronic device 1.

[0093] For further information, see Figure 3 , Figure 4 , Figures 9 to 11 , Fig.17 and Fig.18 , Fig.17 for Figure 3 A schematic diagram of a portion of the structure of the light-emitting component in the fan module shown; Fig.18 for Fig.17 In one embodiment, the electronic device 1 further includes a light emitting component 130 and a decoration component 120 .

[0094] The decorative component 120 is used to decorate the fan module 110. The light-emitting component 130 is arranged outside the fan module 110. The light-emitting component 130 is arranged outside the fan module 110 to reduce or even avoid the fan module 110 from blocking the light-emitting component 130, so that the light-emitting component 130 has a better light effect when emitting light. At least part of the light-emitting component 130 is arranged corresponding to the decorative component 120, and the light-emitting component 130 also serves as a decoration for the fan module 110 to a certain extent.

[0095] The light emitting assembly 130 includes a second circuit board 131, a light emitting unit 132, an optical fiber 135, an optical fiber head 136, and a cover 134. The light emitting unit 132 is electrically connected to the second circuit board 131. In this embodiment, there are two light emitting units 132. For the convenience of describing the two light emitting units 132, the two light emitting units 132 are named as a first light emitting unit 1321 and a second light emitting unit 1322, respectively.

[0096] The first light emitting unit 1321 may be, but not limited to, a light emitting diode or an organic light emitting diode. The second light emitting unit 1322 may be, but not limited to, a light emitting diode or an organic light emitting diode. The type of the second light emitting unit 1322 may be the same as or different from the type of the first light emitting unit 1321, which is not limited here.

[0097] The color of the light emitted by the first light emitting unit 1321 may be, but not limited to, white, red, green, or blue. The color of the light emitted by the second light emitting unit 1322 may be, but not limited to, white, red, green, or blue. The color of the light emitted by the second light emitting unit 1322 may be the same as the color of the light emitted by the first light emitting unit 1321, or may be different, which is not limited here.

[0098] The optical fiber 135 surrounds the air inlet 1131a, and the optical fiber 135 includes a first end 1351 and a second end 1352. The first end 1351 is arranged corresponding to the first light-emitting unit 1321 for receiving the light of the first light-emitting unit 1321, and the second end 1352 is arranged corresponding to the second light-emitting unit 1322 for receiving the light of the second light-emitting unit 1322.

[0099] The first end portion 1351 has a light incident surface, and the first end portion 1351 is arranged corresponding to the first light emitting unit 1321, and the light emitted by the first light emitting unit 1321 can enter the optical fiber 135 via the light incident end surface of the first end portion 1351. Correspondingly, the second end portion 1352 has a light incident end surface, and the second end portion 1352 is arranged corresponding to the second light emitting unit 1322, and the light emitted by the second light emitting unit 1322 can enter the optical fiber 135 via the light incident end surface of the second end portion 1352.

[0100] The optical fiber 135 may be formed by, but is not limited to, hot bending or injection molding. The first end 1351 and the second end 1352 of the optical fiber 135 may be fixed by an optical fiber head 136. Since the optical fiber 135 surrounds the air inlet 1131a, the light emitted from the optical fiber 135 surrounds the air inlet 1131a. The light emitted from the optical fiber 135 enters the cover body 134 from the light incident surface of the cover body 134; the light entering the cover body 134 is emitted through the light exit surface of the cover body 134.

[0101] In this embodiment, the first light emitting unit 1321 and the second light emitting unit 1322 are disposed on the second circuit board 131. The optical fiber head 136 has a first hole 1361 and a second hole 1362. The first hole 1361 is disposed corresponding to the first end 1351 and the first light emitting unit 1321, and the light emitted by the first light emitting unit 1321 enters the first end 1351. Specifically, the first hole 1361 is used to receive the first end 1351 and the first light emitting unit 1321. The second hole 1362 is disposed corresponding to the second end 1352 and the second light emitting unit 1322, and the light emitted by the second light emitting unit 1322 enters the second end 1352. Specifically, the second hole 1362 is used to receive the second end 1352 and the second light emitting unit 1322.

[0102] The cover 134 is used for guiding light, and the cover 134 has a first opening 134c. Specifically, the first opening 134c of the cover 134 is connected to the air inlet 1131a of the fan module 110. In this embodiment, the cover 134 receives the light emitted by the optical fiber 135 and emits it to the outside of the electronic device 1. In this embodiment, the surface of the cover 134 from which the light is emitted constitutes part of the appearance surface of the electronic device 1. Therefore, the light emitted from the cover 134 can be observed, so that the electronic device 1 has a better light effect corresponding to the fan module 110.

[0103] For further information, see Figure 3 , Figure 4 , Fig.10 and Fig.11, the decorative component 120 includes a decorative base 121, a first decorative piece 122 and a second decorative piece 123. The decorative base 121 is disposed on one side of the back cover 220, and the decorative base 121 has a second opening 121a. The cover body 134 and the first decorative piece 122 are both disposed in the second opening 121a. The first decorative piece 122 has a third opening 122a, and the third opening 122a is connected to the air inlet 1131a. The second decorative piece 123 is disposed outside the second opening 121a and fixed to the decorative base 121. The electronic device 1 also includes at least one of a second seal 240, a third seal 250 and a fourth seal 260. When the electronic device 1 includes the second seal 240, the second seal 240 is disposed between the back cover 220 and the decorative base 121. When the electronic device 1 includes the third sealing member 250 , the third sealing member 250 is disposed between the cover 134 and the decorative base 121 . When the electronic device 1 includes the fourth sealing member 260 , the fourth sealing member 260 is disposed between the cover 134 and the back cover 220 .

[0104] The electronic device 1 further includes at least one of the second seal 240, the third seal 250 and the fourth seal 260. Specifically, in one embodiment, the electronic device 1 may further include the second seal 240; or the third seal 250; or the fourth seal 260; or the second seal 240 and the third seal 250; or the second seal 240 and the fourth seal 260; or the third seal 250 and the fourth seal 260; or the second seal 240, the third seal 250 and the fourth seal 260. In the schematic diagram of the present embodiment, the electronic device 1 includes the second seal 240, the third seal 250 and the fourth seal 260 as an example, which is understandable and should not be understood as limiting the embodiments of the present application.

[0105] The second seal 240 may be, but not limited to, glue, foam, or silicone. The third seal 250 may be, but not limited to, glue, foam, or silicone. The fourth seal 260 may be, but not limited to, glue, foam, or silicone. The material of the third seal 250 may be the same or different from that of the second seal 240, and there is no limitation on this. The material of the fourth seal 260 may be the same or different from that of the second seal 240, and there is no limitation on this. In one embodiment, the second seal 240 and the fourth seal 260 may be an integral structure, so that the electronic device 1 can be easily assembled. It can be understood that in other embodiments, the second seal 240 and the fourth seal 260 are not an integral structure, but a split structure. The embodiment of the present application does not limit whether the second seal 240 and the fourth seal 260 are an integral structure.

[0106] In one embodiment, the second sealing member 240 is glue, so that the second sealing member 240 can not only seal the gap between the back cover 220 and the decorative base 121, but also fix the back cover 220 and the decorative base 121. In one embodiment, the third sealing member 250 is glue, so that the third sealing member 250 can not only seal the gap between the cover body 134 and the decorative base 121, but also fix the cover body 134 and the decorative base 121. In one embodiment, the fourth sealing member 260 is glue, so that the fourth sealing member 260 can not only seal the gap between the cover body 134 and the back cover 220, but also fix the cover body 134 and the back cover 220.

[0107] The electronic device 1 provided in the embodiment of the present application further includes at least one of the second seal 240, the third seal 250 and the fourth seal 260, so that the waterproof performance of the electronic device 1 can be further improved. The adverse effects of external water vapor and dust entering the receiving space 113a on the fan module 110 can be further reduced or even prevented.

[0108] In one embodiment, the dustproof and waterproof level of the electronic device 1 can meet the requirements of IP68. In "IP68", "IP" is the abbreviation of Ingress Protection, which means "protection level", and is composed of two numbers. The first number "6" represents the dustproof level, indicating that the electronic device 1 can completely prevent dust from entering; the second number "8" represents the waterproof level. It can be understood that the dustproof and waterproof level of the electronic device 1 provided in the embodiment of the present application is only an example. In other embodiments, it can also be other levels, and the present application does not limit this.

[0109] See also Fig.10 and Fig.19 , Fig.19 for Fig.10 The enlarged schematic diagram of II in the figure. The packaging shell 113 also has an air outlet 113c. The middle frame 210 also has a through hole 210a, and the through hole 210a is connected to the air outlet 113c. The electronic device 1 also includes an air outlet seal 280. The air outlet seal 280 seals the packaging shell 113 and the middle frame 210, and the air outlet seal 280 is arranged corresponding to the air outlet 113c and the through hole 210a.

[0110] When the fan unit 112 is working, the airflow of the packaging shell 113 is discharged to the outside of the electronic device 1 through the air outlet 113 c of the packaging shell 113 and the through hole 210 a of the middle frame 210 .

[0111] The air outlet seal 280 may be, but is not limited to, sealant, adhesive, silicone, foam, etc. When external dust or water vapor enters the interior of the encapsulation shell 113 of the fan module 110 through the through hole 210a and the air inlet 1131a, since the electronic device 1 also includes an air outlet seal 280; the air outlet seal 280 seals the encapsulation shell 113 and the middle frame 210, and the air outlet seal 280 is arranged corresponding to the air outlet 113c and the through hole 210a, therefore, the dust or water vapor entering the encapsulation shell 113 of the fan module 110 is not easy or cannot enter other positions of the electronic device 1. It can be seen from this that the electronic device 1 provided in the embodiment of the present application, wherein the electronic device 1 also includes an air outlet seal 280, can further improve the dustproof and waterproof performance of the electronic device 1.

[0112] Furthermore, the middle frame 210 includes a frame side wall 211 and a convex rib 212. The frame side wall 211 has the through hole 210a. The convex rib 212 is disposed on the frame side wall 211 and corresponds to the periphery of the through hole 210a. The convex rib 212 is used to fix the air outlet seal 280.

[0113] In one embodiment, the air outlet seal 280 is sleeved on the convex rib portion 212. When the air outlet seal 280 is sleeved on the convex rib portion 212, the convex rib portion 212 can play a role in fixing the air outlet seal 280. When assembling the electronic device 1, it can prevent the air outlet seal 280 from being scraped over when assembling other components of the electronic device 1 after the air outlet seal 280 is assembled, thereby affecting the waterproof performance of the electronic device 1.

[0114] Furthermore, the middle frame 210 further includes a mounting portion 213. The mounting portion 213 is bent and connected to the frame side wall 211, and is used to carry the back cover 220. In the direction from the frame side wall 211 to the mounting portion 213, the mounting portion 213 protrudes from the air outlet seal 280.

[0115] In one embodiment, the mounting portion 213 and the back cover 220 may be fixed by a fixing member, which may be, but is not limited to, adhesive or the like.

[0116] The mounting portion 213 protrudes from the air inlet seal 270 , so the size of the mounting portion 213 can be relatively large, and the bearing of the rear cover 220 is more stable.

[0117] In the direction in which the frame side wall 211 points to the mounting portion 213, the mounting portion 213 protrudes out of the air inlet seal 270. Therefore, when assembling the electronic device 1, it can further prevent the air outlet seal 280 from being scraped over when assembling other components of the electronic device 1 after the air outlet seal 280 is assembled, thereby preventing the waterproof performance of the electronic device 1 from being affected.

[0118] Furthermore, the mounting portion 213 has a first surface 213a and a second surface 213b. The first surface 213a is connected to the frame side wall 211 and faces the rib portion 212, and the second surface 213b is disposed opposite to the frame side wall 211. A guide angle 213c is defined between the first surface 213a and the second surface 213b.

[0119] In an embodiment, the second surface 213b protrudes from the first surface 213a in a direction from the frame side wall 211 to the mounting portion 213. The first surface 213a and the second surface 213b are connected via a connecting surface, and thus, the first surface 213a and the second surface 213b form a guide angle 213c. In this embodiment, there is a guide angle 213c between the first surface 213a and the second surface 213b, and thus, the air outlet seal 280 can be easily assembled.

[0120] In one embodiment, the electronic device 1 further includes a heating device, which may be, but is not limited to, a processor or a memory. The present application does not limit the type of the heating device, as long as the heating device generates heat when working. The fan module 110 forms a heat dissipation channel with the heating device for dissipating heat from the heating device.

[0121] See also Fig. 20 , Fig. 20 For another embodiment Figure 1 In this embodiment, the electronic device 1 further includes a rear camera 350. The rear camera 350 and the fan module 110 share the same decorative base 121.

[0122] The rear camera 350 and the fan module 110 of the electronic device 1 provided in the embodiment of the present application share the same decorative base 121, which can enhance the decorative effect of the rear camera 350 and the overall aesthetic appearance of the electronic device 1. Furthermore, compared with the rear camera 350 and the fan module 110 using separate decorative bases 121, the rear camera 350 and the fan module 110 of the electronic device 1 provided in the embodiment of the present application share the same decorative base 121, which can reduce the number of parts of the electronic device 1 and facilitate assembly.

[0123] See also Fig.21 , Fig.21 The circuit block diagram of an electronic device provided in one embodiment of the present application. The electronic device 1 further includes a processor 290. The processor 290 is electrically connected to the light emitting unit 132. The processor 290 is used to generate a control signal to control whether the light emitting unit 132 is working, and to control the working state and rule of the light emitting unit 132 when the light emitting unit 132 is working. In one embodiment, the processor 290 may be disposed on the mainboard 310.

[0124] In summary, the electronic device 1 provided in the embodiment of the present application has a fan module 110 with high waterproof performance. In addition, the electronic device 1 also has good waterproof performance. For example, in one embodiment, the waterproof level of the electronic device 1 can reach IPX6, IPX8, or IPX9.

[0125] The above is part of the implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A fan module, characterized in that: The fan module comprises: a first circuit board; A fan unit, wherein the fan unit is electrically connected to the first circuit board; A packaging shell, wherein the packaging shell has a receiving space, and the receiving space is used to receive the first circuit board and the fan unit; and An electrical connector, the electrical connector being used to electrically connect the first circuit board to a main board located outside the packaging shell; Part of the electrical connector is wrapped and fixed to the packaging shell, and the packaging shell is sealed corresponding to the electrical connector.

2. The fan module according to claim 1, characterized in that: The packaging shell comprises: a first shell; a second shell, the second shell cooperates with the first shell to form the receiving space; Part of the electrical connector is wrapped and fixed to one of the first shell and the second shell, and the one is sealed corresponding to the electrical connection.

3. The fan module according to claim 1, characterized in that: The first circuit board is electrically connected to the electrical connector at a first connection point, and the fan module further includes: A first sealing member is provided, wherein the first sealing member is used for sealing the first connection point.

4. The fan module according to claim 3, characterized in that: The packaging shell has a pinhole corresponding to the electrical connector; The fan module also includes: A second sealing member is provided, wherein the second sealing member is used for sealing the needle hole.

5. The fan module according to claim 2, characterized in that: The fan module also includes: a heat sink, a portion of which is wrapped and fixed to the first housing; and A third sealing member is used to seal the connection between the heat sink and the first shell.

6. The fan module according to any one of claims 1 to 5, characterized in that: The first circuit board comprises: board body; An electronic device, wherein the electronic device is arranged on the board body; The fan module also includes: A fourth sealing member is used to seal the periphery of the board body and at least one of the electronic components.

7. An electronic device, characterized in that: The electronic device comprises: The fan module according to any one of claims 1 to 6; and A main board is electrically connected to the first circuit board through the electrical connector.

8. The electronic device according to claim 7, characterized in that: The packaging shell also has an air inlet; the electronic device also includes: Middle frame; A rear cover, wherein the rear cover cooperates with the middle frame to accommodate the fan module, and the rear cover has a through hole, and the through hole is connected to the air inlet; and An air inlet seal is disposed in a gap between the back cover and the packaging shell, and the air inlet seal is disposed corresponding to the through hole and the air inlet.

9. The electronic device according to claim 8, characterized in that: The packaging shell also has an air outlet; The middle frame also has a through hole, and the through hole is connected to the air outlet; The electronic device further comprises: An air outlet seal, the air outlet seal seals the packaging shell and the middle frame, and the air outlet seal is arranged corresponding to the air outlet and the through hole.

10. The electronic device according to claim 9, characterized in that: The middle frame includes: a frame side wall, wherein the frame side wall has the through hole; and A convex rib portion is arranged on the side wall of the frame body and corresponds to the periphery of the through hole, and the convex rib portion is used to fix the air outlet seal.

11. The electronic device according to claim 10, characterized in that: The middle frame also includes: The mounting portion is bent and connected to the side wall of the frame, and the mounting portion is used to support the back cover. In the direction where the side wall of the frame points to the mounting portion, the mounting portion protrudes from the air outlet sealing member.

12. The electronic device according to claim 11, characterized in that: The mounting portion has a first surface and a second surface, wherein the first surface is connected to the frame side wall and faces the rib portion, and the second surface is disposed opposite to the frame side wall, wherein a guide angle is defined between the first surface and the second surface.

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