Ultrafine silica powder preparation equipment capable of removing sticking substances

Abstract

The invention relates to the technical field of superfine silica powder preparation, in particular to superfine silica powder preparation equipment capable of removing sticking substances, the superfine silica powder preparation equipment comprises an equipment main body, the bottom of the equipment main body is fixedly connected with a discharging pipe, the outer side of the equipment main body is fixedly connected with a controller, the inner wall of the equipment main body is internally provided with a moving groove, and the moving groove is fixedly connected with the controller. A sliding rod is slidably connected to the interior of the moving groove, a filtering plate is fixedly connected to the outer side of the sliding rod, a reset spring is fixedly connected to the bottom of the sliding rod, a motor is fixedly connected to the outer side of the equipment body, a rotating shaft is fixedly connected to the output end of the motor, and a poke rod is fixedly connected to the outer side of the rotating shaft; the device is simple in structure and convenient to use, sticking substances on the surface of superfine silica powder can be rapidly removed, meanwhile, the sticking substances are prevented from blocking a filtering device, and the stability of the device can be enhanced while the damping effect on the preparation device can be achieved.

Description

Technical Field

[0001] The invention relates to ultrafine silicon micropowder preparation equipment capable of removing adhesives, belonging to the technical field of ultrafine silicon micropowder preparation. Background Art

[0002] Ultrafine silicon powder is made by ultrafine deep processing of refined silicon powder. It has the characteristics of fine particles, narrow particle size distribution, large specific surface area, good anti-sedimentation performance, and certain reinforcement effect. It is particularly suitable for silicone rubber, coatings, paints, precision manufacturing, ceramics, engineering plastics, adhesives and other industries, and has a wide range of uses.

[0003] There are still some problems in the use of existing ultrafine silicon powder preparation equipment. A lot of adhesives will be adsorbed on the surface of the ultrafine silicon powder. These adhesives need to be cleaned before preparation. The existing cleaning method is generally to remove them by filtering. However, the existing filtering method is relatively inefficient. At the same time, the adhesives will remain on the top of the filter device, affecting the subsequent filtering and removal treatment. At the same time, the equipment will vibrate during operation, resulting in instability of the preparation equipment. Summary of the invention

[0004] The object of the present invention is to provide an ultrafine silicon micropowder preparation device that can remove adhesives. The present invention has a simple structure and is easy to use. It can quickly remove adhesives on the surface of ultrafine silicon micropowder and prevent the adhesives from clogging the filtering device. It can also reduce shock to the preparation equipment while enhancing the stability of the equipment to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] The ultrafine silicon micropowder preparation equipment that can remove adhesives includes an equipment main body, a discharge pipe is fixedly connected to the bottom of the equipment main body, a controller is fixedly connected to the outside of the equipment main body, a movable groove is opened in the inner wall of the equipment main body, a sliding rod is slidably connected inside the movable groove, a filter plate is fixedly connected to the outside of the sliding rod, a reset spring is fixedly connected to the bottom of the sliding rod, a motor is fixedly connected to the outside of the equipment main body, a rotating shaft is fixedly connected to the output end of the motor, a toggle rod is fixedly connected to the outside of the rotating shaft, a belt is connected to the outside of the rotating shaft for transmission, a rotating rod is connected to the top inner side of the belt for transmission, a screw rod is fixedly connected to the outside of the rotating rod, a ferrule is threadedly connected to the outside of the screw rod, a connecting rod is fixedly connected to the bottom of the ferrule, a cleaning plate is fixedly connected to the bottom of the connecting rod, a limiting rod is fixedly connected to the outside of the cleaning plate, and a sliding groove is opened inside the equipment main body.

[0007] Furthermore, a connecting block is fixedly connected to the outer side of the device body, a supporting rod is fixedly connected to the bottom of the connecting block, the bottom of the supporting rod is movably connected to a stabilizing plate, the bottom of the supporting rod is fixedly connected to an extrusion rod, a shock-absorbing airbag is fixedly connected to the inside of the stabilizing plate, a sliding ring is fixedly connected to the outer side of the stabilizing plate, a pushing rod is fixedly connected to the outer side of the shock-absorbing airbag, and a reinforcing plate is fixedly connected to the bottom of the pushing rod.

[0008] Furthermore, the slide bars are symmetrically distributed on the outside of the filter plate, and the filter plate is installed inside the device body through the slide bars and the return spring.

[0009] Furthermore, the bottom of the return spring is fixedly connected to the inner bottom wall of the movable groove, and the motor is electrically connected to the controller.

[0010] Furthermore, the rotating shaft is rotatably connected to the inside of the device body, the toggle rods are evenly distributed on the outside of the rotating shaft, and the toggle rods are located below the filter plate.

[0011] Furthermore, the screw rod is rotatably connected to the top of the filter plate through a belt and a rotating rod, the cleaning plate is slidably connected to the top of the filter plate, and the limiting rod is slidably connected to the inside of the slide groove.

[0012] Furthermore, the connecting blocks and the supporting rods are symmetrically distributed on the outside of the device body, and the stabilizing plate is located at the bottom of the device body.

[0013] Furthermore, the extrusion rod is located on the top of the shock-absorbing airbag, and the reinforcement plates are symmetrically distributed on the outside of the stabilizing plate.

[0014] The beneficial effects of the present invention are:

[0015] (I) The present invention is provided with an equipment body, and a filter plate is installed inside the equipment body. First, ultrafine silicon micropowder is placed on the top of the filter plate inside the equipment body, so as to filter the adhesive on the surface of the ultrafine silicon micropowder. At this time, the motor is started by the controller, so that the motor drives the rotating shaft to rotate, and the rotation of the rotating shaft drives the toggle rod to rotate. At this time, the toggle rod will intermittently squeeze the bottom of the filter plate. Since the filter plate is installed inside the equipment body through the cooperation of the slide rod and the return spring, the filter plate will move up and down inside the equipment body, so as to quickly filter the adhesive on the surface of the ultrafine silicon micropowder. Through the cooperation of the rotating shaft and the belt, the screw rod is rotated at the top of the filter plate. At this time, the screw rod will drive the ring to rotate, and the cleaning plate is slidably connected to the top of the filter plate through the cooperation of the ring and the connecting rod, and the limit rod on the outside of the cleaning plate is slidably connected to the inside of the slide groove. Therefore, when the screw rod rotates, it can drive the cleaning plate to move on the top of the filter plate, thereby moving the filtered adhesive to one end of the filter plate to prevent it from clogging the filter plate.

[0016] (ii) The present invention provides an equipment body, a support rod is fixedly connected to the outside of the equipment body, and a stabilizing plate is installed at the bottom of the support rod. When the equipment body is working, vibration will occur, and the support rod will move downward inside the stabilizing plate. The support rod and the extrusion rod are used in coordination, so that the extrusion rod squeezes the shock-absorbing airbag inside the stabilizing plate, thereby buffering the equipment body. When the shock-absorbing airbag is squeezed, the shock-absorbing airbag drives the push rod to move inside the sliding ring, so that the push rod drives the reinforcement plate to move outside the stabilizing plate. At this time, the contact area between the bottom of the equipment body and the ground can be increased, thereby improving the stability of the equipment body. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the specific embodiments of the present invention, but do not constitute a limitation of the present invention.

[0018] Figure 1 It is a structural schematic diagram of the ultrafine silicon powder preparation device capable of removing adhesives according to the present invention;

[0019] Figure 2 It is a schematic structural diagram of the filter plate and the outer side of the rotating shaft of the ultrafine silicon micropowder preparation equipment capable of removing adhesives of the present invention;

[0020] Figure 3 It is a schematic diagram of the structure of the outer side and the inner side of the main body of the ultrafine silicon micropowder preparation device capable of removing adhesives of the present invention;

[0021] Figure 4It is a structural schematic diagram of the lead screw and the outer side of the motor of the ultrafine silicon micropowder preparation equipment capable of removing adhesives of the present invention;

[0022] Figure 5 It is a schematic diagram of the structure inside the stabilizing plate prepared by ultrafine silicon micropowder capable of removing adhesives in the present invention;

[0023] Numbers in the figure: 1. Equipment body; 2. Discharge pipe; 3. Controller; 4. Moving groove; 5. Sliding rod; 6. Filter plate; 7. Reset spring; 8. Motor; 9. Rotating shaft; 10. Toggle rod; 11. Belt; 12. Rotating rod; 13. Screw rod; 14. Ring; 15. Connecting rod; 16. Cleaning plate; 17. Limiting rod; 18. Sliding groove; 19. Connecting block; 20. Support rod; 21. Stabilizing plate; 22. Extrusion rod; 23. Shock-absorbing airbag; 24. Sliding ring; 25. Push rod; 26. Reinforcement plate. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] Example 1 Please refer to Figure 1-Figure 5 , the present invention provides a technical solution:

[0026] The ultrafine silicon powder preparation device capable of removing adhesives comprises a device body 1, a discharge pipe 2 is fixedly connected to the bottom of the device body 1, a controller 3 is fixedly connected to the outside of the device body 1, a movable groove 4 is opened in the inner wall of the device body 1, a slide rod 5 is slidably connected inside the movable groove 4, a filter plate 6 is fixedly connected to the outside of the slide rod 5, a reset spring 7 is fixedly connected to the bottom of the slide rod 5, a motor 8 is fixedly connected to the outside of the device body 1, a rotating shaft 9 is fixedly connected to the output end of the motor 8, a toggle rod 10 is fixedly connected to the outside of the rotating shaft 9, a belt 11 is transmission-connected to the outside of the rotating shaft 9, a rotating rod 12 is transmission-connected to the top inner side of the belt 11, a screw rod 13 is fixedly connected to the outside of the rotating rod 12, a ferrule 14 is threadedly connected to the outside of the screw rod 13, a connecting rod 15 is fixedly connected to the bottom of the ferrule 14, a cleaning plate 16 is fixedly connected to the bottom of the connecting rod 15, a limiting rod 17 is fixedly connected to the outside of the cleaning plate 16, and a slide groove 18 is opened inside the device body 1.

[0027] Specifically, Figure 1As shown, the slide rod 5 is symmetrically distributed on the outside of the filter plate 6, and the filter plate 6 is installed inside the device body 1 through the slide rod 5 and the reset spring 7, the bottom of the reset spring 7 is fixedly connected to the inner bottom wall of the movable groove 4, the motor 8 is electrically connected to the controller 3, the rotating shaft 9 is rotatably connected inside the device body 1, the toggle rod 10 is evenly distributed on the outside of the rotating shaft 9, and the toggle rod 10 is located below the filter plate 6, the screw rod 13 is rotatably connected to the top of the filter plate 6 through the belt 11 and the rotating rod 12, the cleaning plate 16 is slidably connected to the top of the filter plate 6, and the limit rod 17 is slidably connected to the inside of the slide groove 18.

[0028] In this embodiment: by setting up the device body 1, a filter plate 6 is installed inside the device body 1, firstly, the ultrafine silicon powder is put into the top of the filter plate 6 inside the device body 1, so as to filter the adhesive on the surface of the ultrafine silicon powder, then the motor 8 is started by the controller 3, so that the motor 8 drives the rotating shaft 9 to rotate, and the rotation of the rotating shaft 9 drives the toggle rod 10 to rotate, and then the toggle rod 10 will intermittently squeeze the bottom of the filter plate 6, because the filter plate 6 is installed inside the device body 1 through the cooperation of the slide bar 5 and the reset spring 7, so the filter plate 6 will be inside the device body 1 It moves up and down, so as to quickly filter the adhesive on the surface of the ultrafine silicon powder. The screw 13 is rotated on the top of the filter plate 6 by the cooperation of the rotating shaft 9 and the belt 11. At this time, the screw 13 will drive the ring 14 to rotate, and the cleaning plate 16 is slidably connected to the top of the filter plate 6 through the cooperation of the ring 14 and the connecting rod 15, and the limiting rod 17 on the outside of the cleaning plate 16 is slidably connected to the inside of the slide groove 18. Therefore, when the screw 13 rotates, it can drive the cleaning plate 16 to move on the top of the filter plate 6, thereby moving the filtered adhesive to one end of the filter plate 6 to prevent it from clogging the filter plate 6.

[0029] Example 2 Please refer to Figure 1 , Figure 2 and Figure 5 The difference between this embodiment and embodiment 1 is that: a connecting block 19 is fixedly connected to the outer side of the device body 1, a support rod 20 is fixedly connected to the bottom of the connecting block 19, the bottom of the support rod 20 is movably connected to a stabilizing plate 21, the bottom of the support rod 20 is fixedly connected to an extrusion rod 22, a shock-absorbing airbag 23 is fixedly connected to the inside of the stabilizing plate 21, a sliding ring 24 is fixedly connected to the outer side of the stabilizing plate 21, a push rod 25 is fixedly connected to the outer side of the shock-absorbing airbag 23, and a reinforcement plate 26 is fixedly connected to the bottom of the push rod 25.

[0030] Specifically, Figure 1-5As shown, the connecting block 19 and the support rod 20 are symmetrically distributed on the outside of the device body 1, the stabilizing plate 21 is located at the bottom of the device body 1, the extrusion rod 22 is located on the top of the shock-absorbing airbag 23, and the reinforcement plate 26 is symmetrically distributed on the outside of the stabilizing plate 21.

[0031] In this embodiment: by setting up a device main body 1, a support rod 20 is fixedly connected to the outside of the device main body 1, and a stabilizing plate 21 is installed at the bottom of the support rod 20. When the device main body 1 is working, it will vibrate. At this time, the support rod 20 will move downward inside the stabilizing plate 21. Through the cooperation of the support rod 20 and the extrusion rod 22, the extrusion rod 22 will squeeze the shock-absorbing airbag 23 inside the stabilizing plate 21, thereby playing a buffering role for the device main body 1. When the shock-absorbing airbag 23 is squeezed, the shock-absorbing airbag 23 will drive the push rod 25 to move inside the sliding ring 24, so that the push rod 25 drives the reinforcement plate 26 to move outside the stabilizing plate 21. At this time, the contact area between the bottom of the device main body 1 and the ground can be increased, thereby improving the stability of the device main body 1.

[0032] Working principle: by setting up the device body 1, a filter plate 6 is installed inside the device body 1, firstly, the ultrafine silicon powder is put into the top of the filter plate 6 inside the device body 1, so as to filter the adhesive on the surface of the ultrafine silicon powder, then the controller 3 is used to start the motor 8, so that the motor 8 drives the rotating shaft 9 to rotate, and the rotation of the rotating shaft 9 drives the toggle rod 10 to rotate, and then the toggle rod 10 will intermittently squeeze the bottom of the filter plate 6, because the filter plate 6 is installed inside the device body 1 through the cooperation of the slide bar 5 and the return spring 7, so the filter plate 6 will move up and down inside the device body 1, so as to quickly filter the adhesive on the surface of the ultrafine silicon powder, through the cooperation of the rotating shaft 9 and the belt 11, the screw rod 13 is rotated at the top of the filter plate 6, and the screw rod 13 will drive the ring 14 to rotate, and the cleaning plate 16 is slidably connected to the top of the filter plate 6 through the cooperation of the ring 14 and the connecting rod 15, and the limit rod 1 on the outside of the cleaning plate 16 7 is slidably connected inside the slide groove 18, so when the screw rod 13 rotates, it can drive the cleaning plate 16 to move on the top of the filter plate 6, so as to move the filtered adhesive to one end of the filter plate 6 to prevent it from clogging the filter plate 6. By setting the device main body 1, the support rod 20 is fixedly connected to the outside of the device main body 1, and a stabilizing plate 21 is installed at the bottom of the support rod 20. When the device main body 1 is working, it will vibrate. At this time, the support rod 20 will move downward inside the stabilizing plate 21. Through the cooperation of the support rod 20 and the extrusion rod 22, the extrusion rod 22 squeezes the shock-absorbing airbag 23 inside the stabilizing plate 21, so as to play a buffering role for the device main body 1. When the shock-absorbing airbag 23 is squeezed, the shock-absorbing airbag 23 will drive the push rod 25 to move inside the sliding ring 24, so that the push rod 25 drives the reinforcing plate 26 to move outside the stabilizing plate 21. At this time, the contact area between the bottom of the device main body 1 and the ground can be increased, thereby improving the stability of the device main body 1.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An ultrafine silicon powder preparation device capable of removing adhesives comprises a device body (1), characterized in that: The bottom of the device body (1) is fixedly connected to a discharge pipe (2), the outer side of the device body (1) is fixedly connected to a controller (3), a movable groove (4) is provided in the inner wall of the device body (1), a sliding rod (5) is slidably connected inside the movable groove (4), a filter plate (6) is fixedly connected to the outer side of the sliding rod (5), a return spring (7) is fixedly connected to the bottom of the sliding rod (5), a motor (8) is fixedly connected to the outer side of the device body (1), a rotating shaft (9) is fixedly connected to the output end of the motor (8), and a rotating shaft (9) is fixedly connected to the outer side of the rotating shaft (9). A toggle rod (10), the outer side of the rotating shaft (9) is connected to a belt (11) for transmission, the inner side of the top of the belt (11) is connected to a rotating rod (12), the outer side of the rotating rod (12) is fixedly connected to a screw rod (13), the outer side of the screw rod (13) is threadedly connected to a ring (14), the bottom of the ring (14) is fixedly connected to a connecting rod (15), the bottom of the connecting rod (15) is fixedly connected to a cleaning plate (16), the outer side of the cleaning plate (16) is fixedly connected to a limiting rod (17), and a slide groove (18) is provided inside the device body (1).

2. The ultrafine silicon powder preparation device capable of removing adhesives according to claim 1 is characterized in that: The outer side of the device body (1) is fixedly connected with a connecting block (19), the bottom of the connecting block (19) is fixedly connected with a support rod (20), the bottom of the support rod (20) is movably connected to a stabilizing plate (21), the bottom of the support rod (20) is fixedly connected with an extrusion rod (22), the inside of the stabilizing plate (21) is fixedly connected with a shock-absorbing airbag (23), the outer side of the stabilizing plate (21) is fixedly connected with a sliding ring (24), the outer side of the shock-absorbing airbag (23) is fixedly connected with a push rod (25), and the bottom of the push rod (25) is fixedly connected with a reinforcement plate (26).

3. The ultrafine silicon powder preparation device capable of removing adhesives according to claim 1 is characterized in that: The slide bars (5) are symmetrically distributed on the outside of the filter plate (6), and the filter plate (6) is installed inside the device body (1) through the slide bars (5) and the return spring (7).

4. The ultrafine silicon powder preparation device capable of removing adhesives according to claim 1 is characterized in that: The bottom of the return spring (7) is fixedly connected to the inner bottom wall of the movable groove (4), and the motor (8) is electrically connected to the controller (3).

5. The ultrafine silicon powder preparation device capable of removing adhesives according to claim 1 is characterized in that: The rotating shaft (9) is rotatably connected to the inside of the equipment body (1), and the toggle rods (10) are evenly distributed on the outside of the rotating shaft (9), and the toggle rods (10) are located below the filter plate (6).

6. The ultrafine silicon powder preparation device capable of removing adhesives according to claim 1 is characterized in that: The screw rod (13) is rotatably connected to the top of the filter plate (6) through a belt (11) and a rotating rod (12); the cleaning plate (16) is slidably connected to the top of the filter plate (6); and the limiting rod (17) is slidably connected to the inside of the slide groove (18).

7. The ultrafine silicon powder preparation device capable of removing adhesives according to claim 2 is characterized in that: The connecting block (19) and the supporting rod (20) are symmetrically distributed on the outside of the device body (1), and the stabilizing plate (21) is located at the bottom of the device body (1).

8. The ultrafine silicon powder preparation device capable of removing adhesives according to claim 2 is characterized in that: The extrusion rod (22) is located on the top of the shock-absorbing airbag (23), and the reinforcement plates (26) are symmetrically distributed on the outside of the stabilizing plate (21).

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