Alignment welding device for semiconductor processing

Abstract

The invention discloses an alignment welding device for semiconductor processing, and relates to the technical field of semiconductor processing equipment. The alignment welding device for semiconductor processing comprises a workbench, four sets of supporting columns are fixedly installed at the bottom of the workbench, the four sets of supporting columns are arranged in an annular array, a limiting ring is fixedly installed at the top of the workbench, a fixing plate is arranged on the inner wall of the limiting ring, and a fixing block is fixedly installed at the top of the fixing plate; a fixing frame is fixedly installed on the top of the workbench. According to the alignment welding device for semiconductor processing, through the driving assembly, a semiconductor and a substrate can be driven to move to a right welding area, a welding gun can be driven to weld the semiconductor and the substrate, and in the welding process of welding the semiconductor and the substrate, feeding can be conducted on the interiors of a first positioning groove and a second positioning groove; and through cooperative use with the discharging port, automatic discharging can be carried out on the semiconductor and the substrate after welding.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to an alignment welding device for semiconductor processing. Background Art

[0002] Chinese patent document CN117066690B discloses an alignment welding device for semiconductor processing, which relates to the technical field of semiconductor processing. The device discloses a welding frame, on which two moving blocks are slidably mounted, on which a screw rod is rotatably mounted, and both screw rods are rotatably connected to the moving frame, on which two welding head frames are slidably mounted, on which a laser welding head is fixedly mounted, and on which a display screen is fixedly mounted. Two laser welding heads with adjustable spacing are arranged, and the welding surfaces of the semiconductor and two substrates can be welded synchronously. On the basis of meeting the welding of semiconductors of different thicknesses, the welding processing efficiency of the semiconductor is improved. A plurality of bottom fixing components and bottom fixing blocks are arranged on the rotating frame to meet the installation of substrates of different sizes, and a pneumatic finger that can move in two-axis directions is arranged to facilitate the alignment and installation of the semiconductor between the two substrates.

[0003] However, during the use of the above-mentioned welding device, the semiconductor and the substrate need to be placed in the welding area first, and then the semiconductor and the substrate are welded by a welding gun, and finally the welded semiconductor and substrate are taken out from the welding area before the next set of semiconductors and substrates can be welded. This welding method makes loading and unloading time-consuming and affects the semiconductor processing efficiency. Summary of the invention

[0004] The object of the present invention is to provide an alignment welding device for semiconductor processing to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an alignment welding device for semiconductor processing, comprising a workbench, four groups of support columns are fixedly installed on the bottom of the workbench, and the four groups of support columns are arranged in a ring array, a limit ring is fixedly installed on the top of the workbench, a fixed plate is provided on the inner wall of the limit ring, a fixed block is fixedly installed on the top of the fixed plate, a fixed frame is fixedly installed on the top of the workbench, a sliding rod is slidably installed on the fixed frame, a mounting block is fixedly installed on one end of the sliding rod, a welding gun is arranged at the bottom of the mounting block, and also includes a driving component installed on the bottom of the fixed plate, which is used to drive the fixed plate and the fixed block to rotate through the driving component, a moving component installed between the mounting block and the welding gun, which is used to drive the welding gun to move through the moving component, and a linkage structure installed on the workbench and the driving component, which is used to drive the welding gun to contact the welding point between the substrate and the semiconductor while the driving component rotates the fixed plate and the fixed block through the linkage structure.

[0006] Preferably, the fixing plate is provided with a first positioning groove, the fixing block is provided with a second positioning groove, and the fixing block, the first positioning groove and the second positioning groove are provided in four groups and are arranged in a ring array.

[0007] Preferably, the driving assembly includes a first servo motor, a rotating shaft, a toothless bevel gear, a rotating rod and a bevel gear. The first servo motor is fixedly mounted on the bottom of the workbench, one end of the rotating shaft is fixedly mounted on the output shaft of the first servo motor, the toothless bevel gear is fixedly mounted on the other end of the rotating shaft, the rotating rod is rotatably mounted on the workbench, and the top end of the rotating rod is fixedly mounted on the bottom of the fixed plate, the bevel gear is fixedly mounted on the outer wall of the rotating rod, and the bevel gear is meshed with the toothless bevel gear, which can drive the semiconductor and the substrate to move to the right welding area, drive the welding gun to weld the semiconductor and the substrate, and in the process of welding the semiconductor and the substrate, the inside of the first positioning groove and the second positioning groove can be loaded, which is convenient for welding the next group of semiconductors and substrates, and the welded semiconductors and substrates can also be automatically unloaded.

[0008] Preferably, the moving assembly includes a second servo motor, a reciprocating screw and a slider, the second servo motor is fixedly installed on the front side of the mounting block, a guide groove is provided at the bottom of the mounting block, the reciprocating screw is rotatably installed on the front and rear sides of the guide groove, the slider is slidably installed in the guide groove, and the slider is threadedly installed on the outer wall of the reciprocating screw, the welding gun is fixedly installed on the bottom of the slider, and the output shaft of the second servo motor is fixedly installed on one end of the reciprocating screw, which is used to drive the welding gun to move so that the welding gun can weld the semiconductor on the substrate.

[0009] Preferably, the linkage structure includes a sleeve, a guide groove, a bending rod frame and a fixed head, the sleeve is fixedly installed on the outer wall of the rotating rod, the sleeve is provided with a guide groove, the bending rod frame is slidably installed on the workbench, one end of the bending rod frame is cylindrically arranged, and one end of the bending rod frame is slidably installed in the guide groove, the fixed head is fixedly installed on the other end of the sliding rod, and the fixed head is in contact with the outer wall of the bending rod frame, so that the driving component rotates the fixed plate and the fixed block while driving the welding gun to contact the welding point between the substrate and the semiconductor, and is also used to press the start button.

[0010] Preferably, a return spring is sleeved on the outer wall of the sliding rod, and two ends of the return spring are in contact with the top of the fixing frame and the bottom of the fixing head respectively.

[0011] Preferably, a substrate is placed inside the first positioning groove, a semiconductor is placed on the top of the substrate, and the semiconductor is located inside the second positioning groove.

[0012] Preferably, a start button is fixedly mounted on the top of the fixing frame, and the start button is located below the other end of the bending rod frame.

[0013] Preferably, the workbench is provided with a discharge port, and a material guide plate is fixedly installed at the bottom of the workbench. The material guide plate is located below the discharge port, driving the semiconductors and substrates being unloaded to fall into the material box along the material guide plate, and can automatically collect the semiconductors and substrates after welding, thereby improving the practicality of the device.

[0014] Preferably, reinforcement plates are fixedly mounted on both side outer walls of the material guide plate, and two groups of reinforcement plates are fixedly mounted on the bottom of the workbench to strengthen the connection strength between the material guide plate and the workbench bracket.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] (1) The alignment welding device for semiconductor processing is divided into four processing areas in front, back, left and right by a fixing plate, a fixing block, a first positioning groove and a second positioning groove. The four processing areas are a left substrate loading area, a front semiconductor loading area, a right welding area and a rear unloading area. The driving component is used in coordination to drive the semiconductor and the substrate to move to the right welding area, drive the welding gun to weld the semiconductor and the substrate, and in the process of welding the semiconductor and the substrate, the first positioning groove and the second positioning groove can be loaded to facilitate welding the next group of semiconductors and substrates.

[0017] (2) The alignment welding device for semiconductor processing can automatically unload the semiconductor and substrate after welding through the coordinated use of the driving component and the discharge port, and drive the semiconductor and substrate being unloaded to fall into the material box along the guide plate, and can automatically collect the semiconductor and substrate after welding, thereby improving the practicality of the device.

[0018] (3) The alignment welding device for semiconductor processing uses a linkage structure, so that the driving component rotates the fixed plate and the fixed block at the same time, and is used to drive the welding gun to contact the welding point between the substrate and the semiconductor. It is also used to press the start button, which can make the moving component drive the welding gun to move, so that the welding gun can weld the semiconductor to the substrate, realizing dual use of one machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0020] Figure 1 It is a structural schematic diagram of the present invention;

[0021] Figure 2 for Figure 1 Front view of

[0022] Figure 3 is a cross-sectional view of a mounting block of the present invention;

[0023] Figure 4It is a schematic diagram of the structure of the driving assembly of the present invention;

[0024] Figure 5 It is a structural schematic diagram of the discharge port of the present invention;

[0025] Figure 6 It is a diagram for use of the present invention;

[0026] Figure 7 for Figure 6 Front view of.

[0027] : Illustrations: 1. workbench; 2. support column; 3. limit ring; 4. fixed plate; 5. fixed block; 6. first positioning groove; 7. second positioning groove; 8. substrate; 9. semiconductor; 10. first servo motor; 11. rotating shaft; 12. toothless bevel gear; 13. rotating rod; 14. bevel gear; 15. fixed frame; 16. sliding rod; 17. mounting block; 18. second servo motor; 19. reciprocating screw; 20. slider; 21. welding gun; 22. sleeve; 23. guide groove; 24. bending rod frame; 25. fixed head; 26. reset spring; 27. start button; 28. discharge port; 29. ​​reinforcement plate; 30. guide plate. DETAILED DESCRIPTION

[0028] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0029] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In the description of the present invention, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0031] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0032] See also Figure 1-7 The present invention provides a technical solution: an alignment welding device for semiconductor processing, comprising a workbench 1, four groups of support columns 2 are fixedly installed at the bottom of the workbench 1, and the four groups of support columns 2 are arranged in a ring array, a limit ring 3 is fixedly installed on the top of the workbench 1, a fixed plate 4 is arranged on the inner wall of the limit ring 3, a fixed block 5 is fixedly installed on the top of the fixed plate 4, a fixed frame 15 is fixedly installed on the top of the workbench 1, a sliding rod 16 is slidably installed on the fixed frame 15, a mounting block 17 is fixedly installed on one end of the sliding rod 16, a welding gun 21 is arranged at the bottom of the mounting block 17, and also includes a driving component installed at the bottom of the fixed plate 4, which is used to drive the fixed plate 4 and the fixed block 5 to rotate, a moving component installed between the mounting block 17 and the welding gun 21, which is used to drive the welding gun 21 to move, and a linkage structure installed on the workbench 1 and the driving component, which is used to drive the welding gun 21 to contact the welding point between the substrate 8 and the semiconductor 9 while the driving component rotates the fixed plate 4 and the fixed block 5 through the linkage structure.

[0033] The fixing plate 4 is provided with a first positioning groove 6 , the fixing block 5 is provided with a second positioning groove 7 , and the fixing block 5 , the first positioning groove 6 , and the second positioning groove 7 are all provided in four groups and are arranged in a ring array.

[0034] The driving assembly includes a first servo motor 10, a rotating shaft 11, a toothless bevel gear 12, a rotating rod 13 and a bevel gear 14. The first servo motor 10 is fixedly installed at the bottom of the workbench 1, one end of the rotating shaft 11 is fixedly installed at the output shaft of the first servo motor 10, the toothless bevel gear 12 is fixedly installed at the other end of the rotating shaft 11, the rotating rod 13 is rotatably installed on the workbench 1, and the top end of the rotating rod 13 is fixedly installed at the bottom of the fixed plate 4, the bevel gear 14 is fixedly installed at the outer wall of the rotating rod 13, and the bevel gear 14 is meshed with the toothless bevel gear 12. The substrate 8 is placed from the left substrate loading area into the first positioning groove 6 through a group of loading equipment, and the semiconductor 9 is placed from the front semiconductor loading area into the second positioning groove 7 through another group of loading equipment, and then the first servo motor 10 is started, and the first servo motor 1 0's output shaft drives the rotating shaft 11 and the toothless bevel gear 12 to rotate, and the rotation of the toothless bevel gear 12 drives the rotating rod 13, the bevel gear 14, the fixed plate 4, the fixed block 5, and the sleeve 22 to rotate intermittently, so that the fixed plate 4 and the fixed block 5 can intermittently move the substrate 8 and the semiconductor 9 to the right welding area, drive the welding gun 21 to weld the semiconductor and the substrate, and in the process of welding the semiconductor and the substrate, the inside of the first positioning groove 6 and the second positioning groove 7 can be loaded, so as to facilitate the welding of the next group of semiconductors and substrates. As the first servo motor 10 rotates the fixed plate 4 and the fixed block 5, the welded semiconductor 9 and the first servo motor 10 can be moved above the discharge port 28, driving the semiconductor 9 and the substrate 8 to be automatically discharged through the discharge port 28.

[0035] The moving assembly includes a second servo motor 18, a reciprocating screw 19 and a slider 20. The second servo motor 18 is fixedly installed on the front side of the mounting block 17. A guide groove is provided at the bottom of the mounting block 17. The reciprocating screw 19 is rotatably installed on the front and rear sides of the guide groove. The slider 20 is slidably installed in the guide groove, and the slider 20 is threadedly installed on the outer wall of the reciprocating screw 19. The welding gun 21 is fixedly installed on the bottom of the slider 20. The output shaft of the second servo motor 18 is fixedly installed on one end of the reciprocating screw 19. The start button 27 will start the second servo motor 18 and the welding gun 21, so that the output shaft of the second servo motor 18 drives the reciprocating screw 19 to rotate, and the rotation of the reciprocating screw 19 drives the slider 20 and the welding gun 21 to move back and forth, so that the welding gun 21 can weld the semiconductor 9 to the substrate 8, so that the welding gun 21 can weld the semiconductor to the substrate.

[0036] The linkage structure includes a sleeve 22, a guide groove 23, a bending rod frame 24 and a fixed head 25. The sleeve 22 is fixedly mounted on the outer wall of the rotating rod 13. The sleeve 22 is provided with a guide groove 23. The bending rod frame 24 is slidably mounted on the workbench 1. One end of the bending rod frame 24 is cylindrically arranged, and one end of the bending rod frame 24 is slidably mounted in the guide groove 23. The fixed head 25 is fixedly mounted on the other end of the sliding rod 16, and the fixed head 25 contacts the outer wall of the bending rod frame 24, so that the driving component can drive the fixed plate 4 and the fixed block 5. While rotating, the rotation of the sleeve 22 drives the guide groove 23 to rotate, and the rotation of the guide groove 23 drives the bending rod frame 24 to perform intermittent reciprocating lifting and lowering, so that the bending rod frame 24 and the reset spring 26 can drive the fixed head 25, the sliding rod 16, the mounting block 17, the moving assembly, and the welding gun 21 to perform intermittent reciprocating lifting and lowering, so that the support column 2 can contact the welding point between the substrate 8 and the semiconductor 9. As the bending rod frame 24 is descending, the bending rod frame 24 will press the start button 27.

[0037] The outer wall of the sliding rod 16 is sleeved with a return spring 26 , and two ends of the return spring 26 are in contact with the top of the fixing frame 15 and the bottom of the fixing head 25 respectively.

[0038] A substrate 8 is placed inside the first positioning groove 6 , a semiconductor 9 is placed on the top of the substrate 8 , and the semiconductor 9 is located inside the second positioning groove 7 .

[0039] A start button 27 is fixedly mounted on the top of the fixing frame 15 , and the start button 27 is located below the other end of the bending rod frame 24 .

[0040] The workbench 1 is provided with a discharge port, and a guide plate 30 is fixedly installed at the bottom of the workbench 1. The guide plate 30 is located below the discharge port, driving the semiconductors and substrates being unloaded to fall into the material box along the guide plate 30, and can automatically collect the semiconductors and substrates after welding, thereby improving the practicality of the device.

[0041] Reinforcing plates 29 are fixedly mounted on both side outer walls of the guide plate 30 , and two groups of reinforcing plates 29 are fixedly mounted on the bottom of the workbench 1 to strengthen the connection strength between the guide plate 30 and the bracket of the workbench 1 .

[0042] Working principle: The substrate 8 is placed from the left substrate loading area into the first positioning groove 6 through a group of loading equipment, and the semiconductor 9 is placed from the front semiconductor loading area into the second positioning groove 7 through another group of loading equipment, and then the first servo motor 10 is started, and the output shaft of the first servo motor 10 drives the rotating shaft 11 and the toothless bevel gear 12 to rotate, and the rotation of the toothless bevel gear 12 drives the rotating rod 13, the bevel gear 14, the fixed plate 4, the fixed block 5, and the sleeve 22 to rotate intermittently, so that the fixed plate 4 and the fixed block 5 can intermittently move the substrate 8 and the semiconductor 9 to the right welding area, and the rotation of the sleeve 22 drives the guide groove 23 to rotate, and the rotation of the guide groove 23 drives the bending rod frame 24 to intermittently reciprocate and lift, so that the bending rod frame 24 and the reset spring 26 can drive the fixed head 25, the sliding rod 16, the mounting block 17, and the moving The assembly and the welding gun 21 are intermittently lifted and reciprocated so that the support column 2 can contact the welding point between the substrate 8 and the semiconductor 9. As the bending rod frame 24 is descending, the bending rod frame 24 presses the start button 27, and the start button 27 starts the second servo motor 18 and the welding gun 21, so that the output shaft of the second servo motor 18 drives the reciprocating screw 19 to rotate, and the rotation of the reciprocating screw 19 drives the slider 20 and the welding gun 21 to move back and forth, so that the welding gun 21 can weld the semiconductor 9 to the substrate 8. As the first servo motor 10 rotates the fixed plate 4 and the fixed block 5, the welded semiconductor 9 and the first servo motor 10 can be moved to the top of the discharge port 28, and the semiconductor 9 and the substrate 8 fall onto the guide plate 30 through the discharge port 28, and can fall into the storage box along the guide plate 30.

[0043] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. An alignment welding device for semiconductor processing, comprising a workbench (1), four groups of support columns (2) are fixedly installed at the bottom of the workbench (1), and the four groups of support columns (2) are arranged in a ring array, a limit ring (3) is fixedly installed at the top of the workbench (1), a fixed plate (4) is arranged on the inner wall of the limit ring (3), a fixed block (5) is fixedly installed on the top of the fixed plate (4), a fixed frame (15) is fixedly installed on the top of the workbench (1), a sliding rod (16) is slidably installed on the fixed frame (15), a mounting block (17) is fixedly installed at one end of the sliding rod (16), and a welding gun (21) is arranged at the bottom of the mounting block (17), characterized in that: Also includes: A driving assembly installed at the bottom of the fixing plate (4), used to drive the fixing plate (4) and the fixing block (5) to rotate; A moving assembly installed between the mounting block (17) and the welding gun (21), and used to drive the welding gun (21) to move through the moving assembly; A linkage structure installed on a workbench (1) and a driving assembly enables the driving assembly to rotate a fixed plate (4) and a fixed block (5) through the linkage structure, and is used to drive a welding gun (21) to contact a welding point between a substrate (8) and a semiconductor (9).

2. The alignment welding device for semiconductor processing according to claim 1, characterized in that: The fixing plate (4) is provided with a first positioning groove (6), the fixing block (5) is provided with a second positioning groove (7), and the fixing block (5), the first positioning groove (6), and the second positioning groove (7) are each provided in four groups and arranged in a ring array.

3. The alignment welding device for semiconductor processing according to claim 2, characterized in that: The driving assembly comprises a first servo motor (10), a rotating shaft (11), a toothless bevel gear (12), a rotating rod (13) and a bevel gear (14); the first servo motor (10) is fixedly mounted on the bottom of the workbench (1); one end of the rotating shaft (11) is fixedly mounted on the output shaft of the first servo motor (10); the toothless bevel gear (12) is fixedly mounted on the other end of the rotating shaft (11); the rotating rod (13) is rotatably mounted on the workbench (1), and the top end of the rotating rod (13) is fixedly mounted on the bottom of the fixing plate (4); the bevel gear (14) is fixedly mounted on the outer wall of the rotating rod (13), and the bevel gear (14) is meshed with the toothless bevel gear (12).

4. The alignment welding device for semiconductor processing according to claim 3, characterized in that: The moving assembly comprises a second servo motor (18), a reciprocating screw rod (19) and a slider (20); the second servo motor (18) is fixedly mounted on the front side of the mounting block (17); a guide groove is provided at the bottom of the mounting block (17); the reciprocating screw rod (19) is rotatably mounted on the front and rear sides of the guide groove; the slider (20) is slidably mounted in the guide groove; the slider (20) is threadedly mounted on the outer wall of the reciprocating screw rod (19); the welding gun (21) is fixedly mounted on the bottom of the slider (20); and the output shaft of the second servo motor (18) is fixedly mounted on one end of the reciprocating screw rod (19).

5. The alignment welding device for semiconductor processing according to claim 4, characterized in that: The linkage structure comprises a sleeve (22), a guide groove (23), a bending rod frame (24) and a fixed head (25); the sleeve (22) is fixedly mounted on the outer wall of the rotating rod (13); the sleeve (22) is provided with a guide groove (23); the bending rod frame (24) is slidably mounted on the workbench (1); one end of the bending rod frame (24) is cylindrically arranged, and one end of the bending rod frame (24) is slidably mounted in the guide groove (23); the fixed head (25) is fixedly mounted on the other end of the sliding rod (16), and the fixed head (25) is in contact with the outer wall of the bending rod frame (24).

6. The alignment welding device for semiconductor processing according to claim 5, characterized in that: The outer wall of the sliding rod (16) is sleeved with a return spring (26), and the two ends of the return spring (26) are in contact with the top of the fixing frame (15) and the bottom of the fixing head (25) respectively.

7. The alignment welding device for semiconductor processing according to claim 6, characterized in that: A substrate (8) is placed inside the first positioning groove (6), a semiconductor (9) is placed on the top of the substrate (8), and the semiconductor (9) is located on the inner side of the second positioning groove (7).

8. The alignment welding device for semiconductor processing according to claim 7, characterized in that: A start button (27) is fixedly mounted on the top of the fixed frame (15), and the start button (27) is located below the other end of the bending rod frame (24).

9. The alignment welding device for semiconductor processing according to claim 8, characterized in that: The workbench (1) is provided with a material discharge port, and a material guide plate (30) is fixedly mounted on the bottom of the workbench (1), wherein the material guide plate (30) is located below the material discharge port.

10. The alignment welding device for semiconductor processing according to claim 9, characterized in that: Reinforcement plates (29) are fixedly mounted on both side outer walls of the guide plate (30), and two groups of reinforcement plates (29) are fixedly mounted on the bottom of the workbench (1).

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