Product grinding treatment method, grinding device and storage medium

Abstract

The invention discloses a product grinding treatment method, a grinding device and a storage medium. The method comprises the steps that a target to-be-ground image, installed on the grinding device, of a product is obtained; determining a first position of a to-be-analyzed cross section of a product in the target to-be-ground image; determining a second position of a grinding platform in the grinding device in the target to-be-ground image; determining a first to-be-ground thickness corresponding to the product according to the first position and the second position, and controlling the grinding device to grind the product according to the first to-be-ground thickness; in the process that the grinding device executes the grinding operation, multiple frames of grinding images of the product installed on the grinding device are collected; according to the multiple frames of grinding images, determining a second to-be-ground thickness of the product in the target frame and a third to-be-ground thickness of the product in the next frame of grinding image adjacent to the target frame; and according to the second to-be-ground thickness and the third to-be-ground thickness, operation of the grinding device is controlled. According to the method, the grinding treatment of the product can be effectively improved.

Description

Technical Field

[0001] The present application belongs to the field of product processing technology, and in particular, relates to a product grinding method, a grinding device and a storage medium. Background Art

[0002] With the development of electronic technology, the use of electronic products is becoming more and more extensive. During the use of electronic products, there are problems of functional failure. It is necessary to conduct failure analysis on electronic products to determine the cause and mechanism of failure and provide improvement suggestions for product design and manufacturing. In the process of failure analysis of electronic products, it is often necessary to slice and analyze a cross section inside the product to determine whether the electronic product has a cold solder joint or circuit board delamination on this surface. This process requires grinding the product that has been embedded with the electronic device to be analyzed.

[0003] However, when grinding products, the grinding thickness is currently controlled by manual operation and observation. There is a risk of excessive grinding resulting in product scrapping due to inaccurate or untimely manual control, and the accuracy of product grinding is poor. Summary of the invention

[0004] The embodiments of the present application provide a product grinding processing method, a grinding device and a storage medium to solve the problem of low accuracy in product grinding processing.

[0005] A first aspect of an embodiment of the present application provides a product grinding processing method, which is applied to a grinding device, and the product grinding processing method includes: obtaining a target image to be ground of a product installed on the grinding device, the target image to be ground includes the product and the grinding device; determining a first position of a cross section to be analyzed of the product in the target image to be ground; determining a second position of a grinding platform in the grinding device in the target image to be ground; determining a first thickness to be ground corresponding to the product according to the first position and the second position, and controlling the grinding device to grind the product according to the first thickness to be ground; during the grinding operation performed by the grinding device, collecting multiple frames of grinding images of the product installed on the grinding device; determining a second thickness to be ground corresponding to the product in the target frame and a third thickness to be ground of the product in the next frame of grinding image adjacent to the target frame according to the multiple frames of grinding images; and controlling the operation of the grinding device according to the second thickness to be ground and the third thickness to be ground.

[0006] Furthermore, in the above-mentioned product grinding processing method provided in the embodiment of the present application, the grinding device includes an image acquisition device, and the acquisition of the target image to be ground of the product installed on the grinding device includes: calling the image acquisition device to acquire an initial image to be ground of the product installed on the grinding device, wherein the initial image to be ground includes the product and the grinding device; determining the boundary points corresponding to the initial image to be ground and all pixel points between the boundary points; binarizing each pixel point to obtain a binary image to be ground; and performing Hough transform on the binary image to be ground to obtain the target image to be ground.

[0007] Furthermore, in the above-mentioned product grinding processing method provided in the embodiment of the present application, after obtaining the target image to be ground of the product installed on the grinding device, the method also includes: determining multiple straight line arrays corresponding to the target image to be ground and the first slope corresponding to each straight line array; selecting the first straight line array corresponding to the grinding platform from the multiple straight line arrays; determining the second slope corresponding to the first straight line array; selecting a second straight line array perpendicular to the first straight line array from the multiple straight line arrays based on the first slope and the second slope; and determining a third straight line array corresponding to the product from the second straight line array as the side profile corresponding to the product.

[0008] Furthermore, in the above-mentioned product grinding processing method provided in the embodiment of the present application, the determining the first position of the cross section to be analyzed of the product in the target image to be ground includes: monitoring the touch position corresponding to the target image to be ground and the first coordinate corresponding to the touch position; obtaining all pixel points in the target image to be ground and the second coordinate of each pixel point; determining the third slope of the multiple straight lines formed by each pixel point and the touch position according to the first coordinate and the second coordinate; selecting multiple target pixel points corresponding to the straight lines parallel to the first straight line array from the multiple straight lines according to the third slope, and generating the cross section to be analyzed of the product corresponding to the target image to be ground according to the multiple target pixel points, for the user to confirm whether it meets the requirements. When the user confirms, the touch position is used as the first position of the cross section to be analyzed of the product.

[0009] Furthermore, in the above-mentioned product grinding processing method provided in the embodiment of the present application, the determining of the second position of the grinding platform in the grinding device in the target image to be ground includes: making a straight line array perpendicular to the first straight line array through the first position of the cross section to be analyzed of the product as a fourth straight line array; and taking the intersection of the fourth straight line array and the first straight line array as the second position of the grinding platform in the grinding device corresponding to the target image to be ground.

[0010] Furthermore, in the above-mentioned product grinding processing method provided in the embodiment of the present application, determining the second thickness to be ground of the product corresponding to the target frame based on the multiple frames of grinding images includes: using the straight line length corresponding to the third straight line array as the first side contour length corresponding to the product; determining the second side contour length corresponding to the product in the grinding image corresponding to the target frame; determining a first difference between the first side contour length and the first thickness to be ground; and using a second difference between the second side contour length and the first difference as the second thickness to be ground of the product corresponding to the target frame.

[0011] Furthermore, in the above-mentioned product grinding processing method provided in an embodiment of the present application, determining the third thickness to be ground of the product in the next frame of grinding image adjacent to the target frame based on multiple frames of grinding images includes: determining the thickness to be ground corresponding to each frame of grinding image; determining a straight line function of the side contour corresponding to the product in the next frame of grinding image adjacent to the target frame based on the thickness to be ground corresponding to adjacent frames; and determining the third thickness to be ground of the product in the next frame of grinding image adjacent to the target frame based on the straight line function.

[0012] Furthermore, in the above-mentioned product grinding processing method provided in the embodiment of the present application, the operation of the grinding device is controlled according to the second thickness to be ground and the third thickness to be ground, including: if the second thickness to be ground is less than or equal to a preset value, or the third thickness to be ground is less than or equal to the preset value, then the grinding device is turned off; if the second thickness to be ground is greater than the preset value, and the third thickness to be ground is greater than the preset value, then the grinding device is kept turned on.

[0013] A second aspect of an embodiment of the present application further provides a grinding device, which includes a controller and a memory, and the controller is used to implement the above-mentioned product grinding processing method when executing a computer program stored in the memory.

[0014] A third aspect of the embodiments of the present application further provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a controller, the above-mentioned product grinding processing method is implemented.

[0015] The above-mentioned product grinding processing method provided in the embodiment of the present application determines a target image to be ground in which the product is installed on the grinding device; determines a first position of the cross section to be analyzed of the product in the target image to be ground and a second position of the grinding platform in the grinding device in the target image to be ground; determines a first thickness to be ground corresponding to the product according to the first position and the second position, and starts the grinding device according to the first thickness to be ground; collects multiple frames of grinding images of the product installed on the grinding device during the grinding operation of the grinding device; determines a second thickness to be ground corresponding to the product in the target frame and a third thickness to be ground of the product in the next frame of grinding image adjacent to the target frame according to the multiple frames of grinding images; and controls the operation of the grinding device according to the second thickness to be ground and the third thickness to be ground. The above embodiment can accurately and quickly determine the first thickness of the product to be ground by determining the target image to be ground of the product installed on the grinding device and marking the first position and the second position of the target image to be ground; then, multiple frames of grinding images of the product installed on the grinding device are collected, and the multiple frames of grinding images are analyzed to obtain the second thickness of the product to be ground corresponding to the target frame and the third thickness of the product to be ground in the next frame of grinding image adjacent to the target frame; according to the second thickness to be ground and the third thickness to be ground, the operation of the grinding device is controlled, which can avoid the risk of product scrapping due to excessive grinding due to inaccurate or untimely human control, and effectively improve the grinding process of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a structural schematic diagram of a grinding device provided in an embodiment of the present application;

[0017] Figure 2 It is a schematic diagram of a process of a product grinding treatment method provided in an embodiment of the present application;

[0018] Figure 3 It is a schematic diagram of a process for determining a target image to be ground provided in an embodiment of the present application;

[0019] Figure 4 is a schematic diagram of an initial image to be ground provided in an embodiment of the present application;

[0020] Figure 5 It is a schematic diagram of a process for determining a side profile of a product provided in an embodiment of the present application;

[0021] Figure 6 A schematic diagram of a process for determining a first position provided in an embodiment of the present application;

[0022] Figure 7 is a schematic diagram of a second position determination process provided in an embodiment of the present application;

[0023] Figure 8 is a schematic diagram of a process for determining a second thickness to be ground provided in an embodiment of the present application;

[0024] Fig. 9 It is a schematic diagram of the process of determining the third thickness to be ground provided in an embodiment of the present application. DETAILED DESCRIPTION

[0025] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0026] In the description of the present application, it should be understood that the terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, it should be noted that the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0027] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication, it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0029] Figure 1 is a schematic diagram of the structure of a grinding device provided in an embodiment of the present application, such as Figure 1As shown, the grinding device 10 includes a product clamping device 11, a grinding platform 12, an image acquisition device 13, a memory 14, at least one controller 15 and at least one communication bus 16. The product clamping device 11 is used to clamp or adsorb the product 20 and place the product 20 on the grinding platform 12; the grinding platform 12 is used to support and grind the product 20; the image acquisition device 13 is used to capture the image of the product 20 installed on the grinding device 10 to be ground and multiple frames of grinding images during the grinding process. The grinding image includes the product 20 and the grinding platform 12, wherein the horizontal direction is the horizontal axis, the vertical direction is the longitudinal axis, and one end of the grinding platform 12 is used as the origin to establish a coordinate system. The side view straight line corresponding to the upper surface of the grinding platform 12 within the field of view of the image acquisition device 13 extends from the minimum position of the horizontal axis to the maximum position, that is, to ensure that the image acquisition device 13 can capture the complete grinding platform 12, thereby effectively improving the grinding process of the product. In some embodiments, at least one communication bus 16 is configured to realize the connection and communication between the grinding platform 12, the image acquisition device 13, the memory 14 and at least one controller 15. The controller 15 is used to implement the product grinding processing method when executing the computer program stored in the memory 14. Exemplarily, the image acquisition device 13 acquires the image to be ground of the product 20 mounted on the grinding device 10 and multiple frames of grinding images during the grinding process, and inputs the image to be ground and the multiple frames of grinding images into the controller 15. When the controller 15 executes the computer program stored in the memory 14, it controls the opening and closing of the grinding platform 12, thereby realizing the product grinding processing.

[0030] In one embodiment, the grinding device 10 may further include a display device (not shown in the figure) for displaying the grinding progress of the product 20 .

[0031] Those skilled in the art should understand that Figure 1 The structure of the grinding device 10 shown does not constitute a limitation of the embodiment of the present application. The grinding device 10 may also include more or less other hardware or software than shown in the figure, or a different arrangement of components.

[0032] It should be noted that the grinding device 10 is only an example, and other existing or future electronic products that are suitable for the present application should also be included in the protection scope of the present application and included here by reference.

[0033] Figure 2 Schematic diagram of a product grinding process provided in an embodiment of the present application. The product grinding process is applied to a grinding device, such as Figure 2 As shown, the following process is included:

[0034] S11, acquiring a target image to be ground in which a product is mounted on the grinding device, wherein the target image to be ground includes the product and the grinding device.

[0035] In one embodiment, the product is clamped or adsorbed by a product clamping device in the grinding device, and the product is placed on the grinding platform. The grinding platform supports and grinds the product, and an image acquisition device is called to acquire an initial image to be ground of the product installed on the grinding device. The initial image to be ground includes a complete grinding platform, thereby ensuring that the complete product is captured, effectively improving the grinding process of the product. The initial image to be ground refers to an image containing a complete product and a grinding platform with an image clarity greater than a preset clarity threshold, wherein the preset clarity threshold may be a preset value. In one embodiment, the initial image to be ground is binarized and Hough transformed, so that the product and the grinding platform in the initial image to be ground are converted into a line structure, which facilitates accurate analysis of the grinding process of the product and effectively improves the grinding process of the product.

[0036] S12, determining a first position of a cross section to be analyzed of the product in the target image to be ground.

[0037] In one embodiment, the first position refers to the position of the cross section for performing product failure analysis in the target to-be-grinded image. The first position can be set according to actual needs and is not limited here.

[0038] In one embodiment, the target image of the product to be ground is displayed by the display device in the grinding device, and the target image to be ground includes the side profile of the product. The relevant personnel select the position to be analyzed on the display device by touch or non-touch. The position selected by the relevant personnel can be a point position, that is, the relevant personnel select a point on the cross section for product failure analysis, and then the controller processes the position to be analyzed, and after the user confirms, the first position of the cross section to be analyzed is obtained, and the cross section to be analyzed is parallel to the plane corresponding to the grinding platform. Among them, the touch method can include keyboard, mouse, touchpad and other methods for human-computer interaction, and the non-touch method can include remote control, voice control equipment and other methods for human-computer interaction.

[0039] S13, determining a second position of the grinding platform in the grinding device in the target image to be ground.

[0040] In one embodiment, the second position refers to the position of a designated point on the plane corresponding to the grinding platform in the target image to be ground, and the plane here refers to the upper plane of the grinding platform, and the array of straight lines passing through the first position and the second position should be perpendicular to the upper plane of the grinding platform. In one embodiment, the plane corresponding to the grinding platform can be selected by relevant personnel, and the selection method is as described in the first position above, which will not be repeated here. In other embodiments, the position of the grinding platform and the position of the plane corresponding to the grinding platform can also be determined by analyzing the position of the line structure in the target image to be ground, which are the product clamping device, the product and the grinding platform from top to bottom. In another embodiment, when calling the image acquisition device to acquire the initial image to be ground of the product installed on the grinding device, the initial image to be ground can be identified and marked for the grinding platform, and then after the initial image to be ground is binarized and Hough transformed to obtain the target image to be ground, the position of the grinding platform in the target image to be ground is determined by determining the mark in the target image to be ground, wherein the marking method can be by coding marking, color marking or other methods, which are not limited here.

[0041] S14, determining a first thickness to be ground corresponding to the product according to the first position and the second position, and controlling the grinding device to grind the product according to the first thickness to be ground.

[0042] In one embodiment, the distance between the first position and the second position is determined, and the distance is used as the first thickness to be ground corresponding to the product. Thereafter, the grinding device is turned on, and the grinding platform in the grinding device grinds the product according to the first thickness to be ground until an instruction to close the grinding platform is received.

[0043] S15, while the grinding device is performing a grinding operation, collecting a plurality of grinding images of the product installed on the grinding device.

[0044] In one embodiment, during the grinding operation of the grinding device, an image of the product installed on the grinding device is captured at a preset frame rate, and the product has started to be ground. In this way, the captured multiple frames of images are used as initial ground images, and the initial ground images are binarized and Hough transformed to obtain a ground image. The preset frame rate can be set according to actual needs and is not limited here.

[0045] S16, determining, according to the multiple frames of grinding images, a second thickness to be ground of the product corresponding to the target frame and a third thickness to be ground of the product in the next frame of grinding images adjacent to the target frame.

[0046] In one embodiment, the target frame may refer to the frame corresponding to the current moment. For example, the collected grinding image is 3 frames, which are the first frame, the second frame and the third frame in chronological order from front to back, wherein the third frame is the frame at the current moment (i.e., the target frame). The second thickness to be ground refers to the thickness of the product remaining to be ground after the grinding process of the grinding platform at the current moment. In one embodiment, the side contour length corresponding to the product before the grinding process (also referred to as the "first side contour length" in the embodiment of the present application) and the side contour length of the product in the grinding image corresponding to the target frame (also referred to as the "second side contour length" in the embodiment of the present application) are determined, and the first difference between the first side contour length and the first thickness to be ground and the second difference between the second side contour length and the first difference are used as the second thickness to be ground corresponding to the product in the target frame.

[0047] In one embodiment, the third grinding thickness refers to the grinding thickness of the product that needs to be ground by the grinding platform in the next frame adjacent to the target frame. The grinding images between adjacent frames are analyzed to obtain the variation law of the grinding thickness of the product, and the grinding thickness of subsequent frames is estimated based on the variation law.

[0048] S17, controlling the operation of the grinding device according to the second thickness to be ground and the third thickness to be ground.

[0049] In one embodiment, the operation of the grinding device is controlled by comparing the size relationship between the second thickness to be ground and the preset value, and the size relationship between the third thickness to be ground and the preset value, wherein the preset value is a value preset according to the actual grinding requirements, for example, the preset value is 0. Wherein, the operation may include turning off the grinding device and keeping the grinding device turned on. In one embodiment, if the second thickness to be ground is less than or equal to 0, or the third thickness to be ground is less than or equal to 0, the grinding device is turned off; if the second thickness to be ground is greater than 0, and the third thickness to be ground is greater than 0, the grinding device is kept turned on; if the second thickness to be ground is greater than 0, and the third thickness to be ground is less than or equal to 0, the grinding device is turned off, and the product is manually micro-grinded to avoid over-grinding of the product; or, the grinding rate of the grinding device is reduced so that the grinding device micro-grinds the product to avoid over-grinding of the product.

[0050] The above-mentioned product grinding processing method provided in the embodiment of the present application can accurately and quickly determine the first thickness of the product to be ground by determining the target image to be ground of the product installed on the grinding device, and marking the first position and the second position of the target image to be ground; then, multiple frames of grinding images of the product installed on the grinding device are collected, and the multiple frames of grinding images are analyzed to obtain the second thickness of the product to be ground corresponding to the target frame and the third thickness of the product to be ground in the next frame of grinding image adjacent to the target frame, and the operation of the grinding device is controlled according to the second thickness to be ground and the third thickness to be ground, so as to avoid the risk of product scrapping due to excessive grinding due to inaccurate or untimely human control, and effectively improve the grinding processing of the product.

[0051] In one embodiment, an image acquisition device is called to acquire an image of the product to be ground installed on the grinding device, and the grinding progress of the product is determined by monitoring the side contour length of the product in the image to be ground. Figure 3 1 is a schematic diagram of a process for determining a target image to be ground provided by an embodiment of the present application, and a method for determining a target image to be ground is applied to a grinding device. Figure 3 As shown, the following steps are included:

[0052] S21, calling the image acquisition device to acquire an initial image to be ground of the product installed on the grinding device, wherein the initial image to be ground includes the product and the grinding device.

[0053] In one embodiment, the image acquisition device is called to acquire an initial image of the product installed on the grinding device. After acquiring the initial image, the initial image is cropped to remove the redundant background in the image, thereby improving the rate of subsequent image analysis. Figure 4 As shown, Figure 4 is a schematic diagram of an initial image to be ground provided in an embodiment of the present application. The initial image to be ground may be a grayscale image, including a product clamping device 11 , a product 20 , and a grinding platform 12 .

[0054] S22, determining the boundary points corresponding to the initial image to be ground and all the pixel points between the boundary points.

[0055] In one embodiment, four boundary points corresponding to the initial image to be ground and all pixel points included between the boundary points are determined.

[0056] S23, performing binarization processing on each pixel to obtain a binary image to be ground.

[0057] In one embodiment, each pixel is binarized and assigned a value. If the pixel satisfies the following conditions, the pixel is assigned a value of 1; otherwise, the pixel is assigned a value of 0. The conditions satisfied by the pixel are as follows:

[0058] If the pixel is one of the four boundary points of the initial image to be ground, and the gray value of the pixel is different from the gray values ​​of the three adjacent pixels, the pixel is assigned a value of 1;

[0059] If a pixel is any point on the four edges of the initial image to be ground and is not a boundary point, and the grayscale value of the pixel is different from the grayscale value of any of the five adjacent pixels, then the pixel is assigned a value of 1;

[0060] If a pixel point is not on any of the four edges of the initial image to be ground, and the grayscale value of the pixel point is different from the grayscale value of any of the eight adjacent pixel points, the pixel point is assigned a value of 1.

[0061] S24, performing Hough transform on the binary image to be ground to obtain the target image to be ground.

[0062] In one embodiment, the Hough transform is used to detect straight lines in the binary image to be ground. There is a corresponding transform algorithm for the Hough transform. By calling the algorithm, the binary image to be ground can be subjected to the Hough transform to obtain the target image to be ground.

[0063] The embodiment of the present application obtains a target image to be ground containing a line structure by binarizing and Hough processing the initial image to be ground acquired by the image acquisition device, which can simplify the difficulty of subsequent analysis of the target image to be ground and effectively improve the grinding process of the product.

[0064] In one embodiment, the line structure in the target image to be ground is analyzed to obtain the side contour length of the product in the target image to be ground, and then the grinding progress of the product is determined based on the change in the side contour length of the product in multiple frames of grinding images. Figure 5 1 is a schematic diagram of a process for determining a side profile of a product provided in an embodiment of the present application, and a method for determining a side profile of a product is applied to a grinding device. Figure 5 As shown, the following steps are included:

[0065] S31, determining a plurality of straight line arrays corresponding to the target image to be ground and a first slope corresponding to each straight line array.

[0066] In one embodiment, the target image to be ground includes a product holding device, a product, and a grinding platform, and the product holding device, the product, and the grinding platform are all composed of a plurality of linear arrays. In the embodiment of the present application, a straight line including a plurality of pixel points is simplified as a linear array. For each pixel point, its corresponding coordinates are known, so according to the pixel point and the slope calculation function, the slope corresponding to each linear array can be obtained as the first slope.

[0067] S32, selecting a first linear array corresponding to the grinding platform from the plurality of linear arrays.

[0068] In one embodiment, if Figure 4 As shown in the figure, a rectangular coordinate system is established with the upper left corner of the initial image to be ground as the origin, and the leftmost point on the surface of the grinding platform is recorded as A 1 , A 1 The coordinates are (0, Y a1 ), the rightmost point on the upper surface of the grinding platform is marked as A 2 , A 2 The coordinates of (X max , Y a2 ). In multiple straight line arrays, 1 With A 2 The linear array is used as the first linear array corresponding to the grinding platform, wherein the slope corresponding to the first linear array is K a =((Y a2 -Y a1 ) / (X max -0)), the corresponding straight line equation is Y a =((Y a2 -Y a1 ) / (X max -0))X a +Y a1 .

[0069] S33, determining a second slope corresponding to the first straight line array.

[0070] In one embodiment, the product is placed on the grinding platform. Thus, the side profile corresponding to the product should be perpendicular to the first linear array corresponding to the grinding platform. The slope corresponding to the first linear array is K a , then the second slope is K = (-1 / K a ).

[0071] S34, selecting a second straight line array perpendicular to the first straight line array from the plurality of straight line arrays according to the first slope and the second slope.

[0072] In one embodiment, the number of the second linear arrays may be multiple, which is not limited herein.

[0073] S35, determining a third straight line array corresponding to the product from the second straight line array as a side contour corresponding to the product.

[0074] In one embodiment, a third straight line array is determined among multiple second straight line arrays, and an endpoint element in the third straight line array satisfies the straight line equation corresponding to the upper surface of the grinding platform, indicating that the second straight line array and the grinding platform have common points, so that the corresponding side profile of the product can be obtained.

[0075] The embodiment of the present application analyzes the line structure in the target image to be ground, obtains the slope and straight line equation of multiple straight line arrays in the target image to be ground according to the coordinate information of each pixel point, and obtains the side contour length of the product in the target image to be ground according to the slope and the straight line equation, thereby improving the accuracy and speed of determining the side contour of the product, thereby effectively improving the grinding process of the product.

[0076] In one embodiment, before grinding the product, the thickness of the product to be ground needs to be determined, that is, the cross section of the product to be analyzed needs to be determined, and the cross section to be analyzed can be selected by relevant personnel. Figure 6 The first position determination process diagram provided in the embodiment of the present application is a first position determination method applied to a grinding device. Figure 6 As shown, the following steps are included:

[0077] S41, monitoring a touch position corresponding to the target image to be ground and a first coordinate corresponding to the touch position.

[0078] In one embodiment, the target image to be ground is displayed by a display device in the grinding device, and the target image to be ground includes the side contour of the product. A relevant person selects a position to be analyzed on the display device by touch or non-touch. Taking the touch method as an example, the position where the mouse of the relevant person on the display device stops is the touch position of the target image to be ground. Since the coordinate information of each pixel point in the target image to be ground is known, the first coordinate corresponding to the touch position can be obtained.

[0079] S42, acquiring all pixel points in the target image to be ground and the second coordinate of each pixel point.

[0080] In one embodiment, the second coordinates of the remaining pixel points in the target image to be ground except the touch position are determined.

[0081] S43, determining third slopes of a plurality of straight lines formed by each pixel point and the touch position according to the first coordinate and the second coordinate.

[0082] In one embodiment, the first coordinate is denoted as M(X m, Y m ), and label the second coordinate as I(X i , Y j ), according to the first coordinate and the second coordinate, the third slope corresponding to the straight line array passing through the first coordinate and the second coordinate can be obtained, and the third slope is recorded as (Y j -Y m ) / (X i -X m ).

[0083] S44, selecting a plurality of target pixel points corresponding to the straight lines parallel to the first straight line array from the plurality of straight lines according to the third slope, and determining the cross-section to be analyzed of the product corresponding to the target image to be ground according to the plurality of target pixel points, so that the user can confirm whether it meets the requirements.

[0084] In one embodiment, if the third slope (Y j -Y m ) / (X i -X m )=K a , it indicates that the straight line array is parallel to the first straight line array, and the straight line array is used as the target image to be ground corresponding to the cross section to be analyzed of the product, and then the cross section to be analyzed is displayed on the display device, and the user confirms whether it meets the requirements.

[0085] S45, after the user confirms, the touch position is used as the first position of the cross section to be analyzed of the product.

[0086] In one embodiment, after receiving the user's confirmation information, the touch position is used as the first position of the cross-section of the product to be analyzed, wherein the confirmation information may include but is not limited to the user's voice confirmation information (for example, outputting a voice message "confirm that the cross-section is correct") or touch confirmation information (for example, the user touches the relevant confirmation control on the display device).

[0087] In the embodiment of the present application, before grinding the product, an array of straight lines parallel to the grinding platform and passing through the touch position is obtained by analyzing the touch position and the slope. After confirmation by the user, the touch position at this time is used as the first position of the cross section to be analyzed of the target image to be ground, thereby determining the cross section to be analyzed of the product, improving the accuracy of determining the thickness to be ground of the product, and effectively improving the grinding process of the product.

[0088] In one embodiment, before grinding the product, the thickness of the product to be ground needs to be determined, that is, the position of the upper surface of the grinding platform needs to be determined in the target image to be ground. Figure 7 is a schematic diagram of a second position determination process provided in an embodiment of the present application, and the second position determination method is applied to a grinding device. Figure 7 As shown, the following steps are included:

[0089] S51, making a straight line array perpendicular to the first straight line array through the first position of the cross section to be analyzed of the product as a fourth straight line array.

[0090] In one embodiment, the first linear array refers to the linear array corresponding to the grinding platform, and a straight line perpendicular to the first linear array is drawn through the touch position as the fourth linear array. The fourth linear array refers to the linear array perpendicular to the grinding platform and passing through the touch position.

[0091] S52, taking the intersection of the fourth straight line array and the first straight line array as the second position of the target image to be ground corresponding to the grinding platform in the grinding device.

[0092] In one embodiment, an intersection point between the fourth line array and the first line array is determined, and the intersection point is used as the second position of the grinding platform in the grinding device corresponding to the target image to be ground.

[0093] Before grinding the product, the embodiment of the present application can obtain the second position of the grinding platform corresponding to the touch position by analyzing the touch position and the slope, and then determine the thickness to be ground according to the touch position and the second position, thereby improving the accuracy of determining the thickness to be ground of the product, thereby effectively improving the grinding process of the product.

[0094] Figure 8 1 is a schematic diagram of a second determination process of the thickness to be ground provided in an embodiment of the present application, and the method for determining the second thickness to be ground is applied to a grinding device. Figure 8 As shown, the following steps are included:

[0095] S61, taking the straight line length corresponding to the third straight line array as the first side edge contour length corresponding to the product.

[0096] In one embodiment, when the product has not been ground, the length of the straight line corresponding to the third straight line array is used as the first side edge contour length corresponding to the product.

[0097] S62, determining a second side edge contour length corresponding to the product in the grinding image corresponding to the target frame.

[0098] In one embodiment, after the product has been ground, in the ground image corresponding to the target frame, the side contour length corresponding to the product is used as the second side contour length.

[0099] S63, determining a first difference between the first side edge profile length and the first to-be-grinded thickness.

[0100] S64, taking a second difference between the second side edge contour length and the first difference as a second to-be-grinded thickness of the product corresponding to the target frame.

[0101] The embodiment of the present application determines the second thickness of the product to be ground corresponding to the target frame based on the first side contour length of the product before grinding, the first thickness of the product to be ground, and the second side contour length after grinding, and controls the operation of the grinding device according to the second thickness to be ground. When the second thickness of the product to be ground is less than a preset value, the grinding device can be controlled to be closed in time, thereby effectively improving the grinding process of the product.

[0102] Fig. 9 1 is a schematic diagram of a process for determining a third thickness to be ground provided in an embodiment of the present application, and a method for determining a third thickness to be ground is applied to a grinding device. Fig. 9 As shown, the following steps are included:

[0103] S71, determining the thickness to be ground corresponding to each frame of the grinding image.

[0104] In one embodiment, in combination Figure 7 The thickness to be ground corresponding to each frame of the grinding image is determined in the manner described above, which will not be described in detail here.

[0105] S72, determining a straight line function of the side contour corresponding to the product in the next grinding image frame adjacent to the target frame according to the to-be-grinded thickness corresponding to the adjacent frame.

[0106] In one embodiment, the collected grinding images are 3 frames, for example, which are the first frame, the second frame and the third frame from front to back in time order, wherein the third frame is the frame number at the current moment (that is, the target frame, denoted as M). At this time, the second frame is denoted as M-1, and the first frame is denoted as M-2. The thickness to be ground corresponding to the Mth frame is D m , the thickness to be ground corresponding to the M-1 frame is D m-1 , the thickness to be ground corresponding to the M-2 frame is D m-2 .

[0107] In one embodiment, since the change in grinding thickness of each frame depends on the pressure of the product clamping device, the rotation speed of the grinding platform and the surface roughness of the grinding platform, when the pressure of the product clamping device and the rotation speed of the grinding platform are controlled unchanged, the change in grinding thickness of each frame depends only on the surface roughness of the grinding platform, and the grinding platform will become smoother and smoother with use. In this way, the change in grinding thickness between adjacent frames will become smaller and smaller in a certain regular manner, and the change trend of the previous frame can be used to estimate the change in grinding thickness of the subsequent frame. m-2 ) and (M-1,D m-1 ) is fitted into the actual straight line Y of the M-1 frame m-1=K m-1 X+b m-1 , substitute the two points and calculate K m-1 =D m-1 -D m-2 ; b m-1 =D m-2 *(M-1)-D m-1 *(M-2). m-1 ) and (M,D m ) is fitted into the actual straight line Y of the Mth frame m =K m X+b m Substitute the two points to calculate K m =D m -D m-1 ; b m =D m-1 *MD m *(M-1). Estimate straight line Y′ for the M+1th frame m+1 =K′ m+1 X+b′ m+1 ; For the reasons mentioned above, it can be estimated that the slope is related to K′ m+1 –K m =K m –K m-1 =K′ m+1 =2D m -3D m-1 +D m-2 , point (M,D m ) into the equation to calculate b′ m+1 =(1-2M)*D m +3M*D m-1 -M*D m-2 , thereby the straight line function of the side contour of the next frame adjacent to the target frame can be obtained.

[0108] S73, determining a third to-be-grinded thickness of the product in the next grinding image frame adjacent to the target frame according to the straight line function.

[0109] In one embodiment, point (M+1, D′ m+1 ) into the equation Y′ m+1 Calculate D′ m+1 =3D m -3D m-1 +D m-2 , this value is used as the third to-be-grinded thickness of the product in the next frame adjacent to the target frame.

[0110] The embodiment of the present application predicts the third thickness to be ground in the next frame corresponding to the target frame number, determines the operation information of the grinding device according to the third thickness to be ground, and thus controls the opening and closing of the grinding device. This can avoid the risk of product scrapping due to excessive grinding due to inaccurate or untimely human control, and effectively improve the grinding process of the product.

[0111] then Figure 1 Although not shown in the description of the grinding device 10, the grinding device 10 may also include a power source (such as a battery) for powering each component. Preferably, the power source may be logically connected to at least one controller 15 through a power management device, so that the power management device can manage charging and discharging and other functions. The grinding device 10 may also include a variety of sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be described in detail here.

[0112] In some embodiments, a computer program is stored in the memory 14, and when the computer program is executed by at least one controller 15, all or part of the steps in the product grinding processing method are implemented. The memory 14 includes a read-only memory device (ROM), a programmable read-only memory device (PROM), an erasable programmable read-only memory device (EPROM), a one-time programmable read-only memory device (OTPROM), an electronically erasable rewritable read-only memory device (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage devices, magnetic disk storage devices, magnetic tape storage devices, or any other computer-readable medium that can be used to carry or store data.

[0113] Furthermore, the computer-readable storage medium may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function, etc.; the data storage area may store data created according to the use of the grinding device 10, etc.

[0114] In some embodiments, at least one controller 15 is the control core (Control Unit) of the grinding device 10, and uses various interfaces and lines to connect various components of the entire grinding device 10, and executes various functions and processes data of the product preparation device 30 by running or executing programs or modules stored in the memory 14, and calling data stored in the memory 14. For example, when at least one controller 15 executes a computer program stored in a storage device, it implements all or part of the steps of the product grinding processing method in the embodiment of the present application; or implements all or part of the functions of the grinding device 10. At least one controller 15 can be composed of an integrated circuit, for example, it can be composed of a single packaged integrated circuit, or it can be composed of multiple integrated circuits with the same or different functions, including one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and combinations of various control chips.

[0115] The above integrated unit implemented in the form of software function modules can be stored in a computer-readable storage medium. The above software function modules are stored in a storage medium and include several instructions for a processor to execute parts of the methods of various embodiments of the present application.

[0116] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of modules is only a logical function division, and there may be other division methods in actual implementation.

[0117] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, and may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0118] In addition, each functional module in each embodiment of the present application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The above integrated unit can be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0119] It is obvious to those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and that the present application can be implemented in other specific forms without departing from the spirit or basic features of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present application is limited by the attached claims rather than the above description, so it is intended to include all changes that fall within the meaning and scope of the equivalent elements of the claims in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is obvious that the word "including" does not exclude other units or, and the singular does not exclude the plural. Multiple units or devices stated in the specification can also be implemented by one unit or device through software or hardware. The words first, second, etc. are used to indicate names, and do not indicate any particular order.

[0120] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A product grinding method, applied to a grinding device, characterized in that: The product grinding treatment method comprises: Acquire a target image to be ground in which a product is mounted on the grinding device, wherein the target image to be ground includes the product and the grinding device; Determining a first position of a cross section to be analyzed of the product in the target image to be ground; Determine a second position of a grinding platform in the grinding device in the target to-be-grinded image; Determining a first thickness to be ground corresponding to the product according to the first position and the second position, and controlling the grinding device to grind the product according to the first thickness to be ground; During the process of the grinding device performing a grinding operation, collecting a plurality of frames of grinding images of the product mounted on the grinding device; Determine, according to the multiple frames of grinding images, a second thickness of the product to be ground corresponding to the target frame and a third thickness of the product to be ground in the next frame of grinding images adjacent to the target frame; The operation of the grinding device is controlled according to the second thickness to be ground and the third thickness to be ground.

2. The product grinding method according to claim 1, characterized in that: The grinding device includes an image acquisition device, and the method of acquiring an image of a target to be ground of a product mounted on the grinding device includes: Calling the image acquisition device to acquire an initial image to be ground of the product installed on the grinding device, wherein the initial image to be ground includes the product and the grinding device; Determine the boundary points corresponding to the initial image to be ground and all pixel points between the boundary points; Perform binarization on each pixel to obtain a binary image to be ground; Performing Hough transform on the binary image to be ground to obtain the target image to be ground.

3. The product grinding method according to claim 2, characterized in that: After acquiring the target image to be ground of the product mounted on the grinding device, the method further includes: Determine a plurality of straight line arrays corresponding to the target image to be ground and a first slope corresponding to each of the straight line arrays; Selecting a first linear array corresponding to the grinding platform from the plurality of linear arrays; Determine a second slope corresponding to the first straight line array; According to the first slope and the second slope, selecting a second straight line array perpendicular to the first straight line array from the plurality of straight line arrays; A third straight line array corresponding to the product is determined from the second straight line array as a side contour corresponding to the product.

4. The product grinding method according to claim 3, characterized in that: The determining a first position of a cross section to be analyzed of the product in the target to-be-grinded image comprises: Monitoring a touch position corresponding to the target image to be ground and a first coordinate corresponding to the touch position; Acquire all pixel points in the target image to be ground and the second coordinate of each pixel point; Determining third slopes of a plurality of straight lines formed by each pixel point and the touch position according to the first coordinate and the second coordinate; Selecting a plurality of target pixel points corresponding to the straight lines parallel to the first straight line array from the plurality of straight lines according to the third slope, and generating a cross section to be analyzed of the target image to be ground corresponding to the product according to the plurality of target pixel points, for the user to confirm whether it meets the requirements; After the user confirms, the touch position is used as the first position of the cross section to be analyzed of the product.

5. The product grinding method according to claim 4, characterized in that: The step of determining a second position of a grinding platform in the grinding device in the target to-be-grinded image comprises: A straight line array perpendicular to the first straight line array is made through a first position of the cross section to be analyzed of the product as a fourth straight line array; The intersection of the fourth line array and the first line array is used as the second position of the target image to be ground corresponding to the grinding platform in the grinding device.

6. The product grinding method according to claim 3, characterized in that: The step of determining the second to-be-grinded thickness of the product corresponding to the target frame according to the multiple frames of grinding images includes: Using the straight line length corresponding to the third straight line array as the first side edge contour length corresponding to the product; Determine a second side edge contour length corresponding to the product in the grinding image corresponding to the target frame; Determine a first difference between the first side profile length and the first to-be-ground thickness; A second difference between the second side edge profile length and the first difference is used as a second to-be-grinded thickness of the product corresponding to the target frame.

7. The product grinding method according to claim 3, characterized in that: The step of determining a third to-be-grinded thickness of the product in a next grinding image frame adjacent to the target frame according to the multiple grinding image frames includes: Determine the thickness to be ground corresponding to each frame of the grinding image; Determine, according to the to-be-grinded thickness corresponding to the adjacent frames, a straight line function of the side contour corresponding to the product in the next grinding image frame adjacent to the target frame; A third to-be-grinded thickness of the product in a next grinding image frame adjacent to the target frame is determined according to the straight line function.

8. The product grinding method according to claim 1, characterized in that: The step of controlling the operation of the grinding device according to the second to-be-grinded thickness and the third to-be-grinded thickness includes: If the second thickness to be ground is less than or equal to a preset value, or the third thickness to be ground is less than or equal to the preset value, shutting down the grinding device; If the second thickness to be ground is greater than the preset value, and the third thickness to be ground is greater than the preset value, the grinding device is kept turned on.

9. A grinding device, characterized in that: The grinding device includes a controller and a memory, and the controller is used to implement the product grinding processing method according to any one of claims 1 to 8 when executing the computer program stored in the memory.

10. A computer-readable storage medium, characterized in that: A computer program is stored on the computer-readable storage medium, and when the computer program is executed by the controller, the product grinding processing method as described in any one of claims 1 to 8 is implemented.

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