Jumper monitoring device in silicon wafer cutting

Abstract

The invention discloses a jumper monitoring device in silicon wafer cutting, and relates to the technical field of silicon wafers. The jumper monitoring device in silicon wafer cutting comprises a rack, the rack comprises a base, the top of the base is fixedly connected with a front fixing plate, the top of the base is fixedly connected with a rear mounting table, the front face of the rear mounting table is rotationally connected with a main winding roller, the front face of the rear mounting table is rotationally connected with a paying-off roller, and the front face of the main winding roller is rotationally connected with the paying-off roller. A tension adjusting mechanism is fixedly connected to the front face of the rear mounting table, a comprehensive detection mechanism is fixedly connected to the front face of the rear mounting table, a take-up roller is rotationally connected to the back face of the front fixing plate, and an electric control cabinet is fixedly connected to the front face of the front fixing plate. According to the wire jumper monitoring device in silicon wafer cutting, the comprehensive detection mechanism and the tension adjusting mechanism are arranged, and an infrared distance measuring sensor and a temperature probe are utilized, so that the detection precision of the wire jumper condition of the cutting wire is improved, and the cutting efficiency and the cutting quality of the silicon wafer are improved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer cutting, in particular to a jumper monitoring device in silicon wafer cutting. Background Art

[0002] Wire cutting machines mainly use the high-speed movement and cutting action of cutting wires to cut materials. Their cutting accuracy and quality are both at a high level. In the process of cutting silicon wafers, diamond wire cutting machines are the main equipment for cutting. The patent application with publication number CN202656335U discloses a wire arrangement detection device for a solar silicon wafer wire cutting machine, including a fixed bracket and a swing brake plate, the fixed bracket includes two side plates, the swing brake plate and the two side plates are parallel to each other, the swing brake plate is located between the two side plates, and the two sides of the swing brake plate are symmetrically provided with proximity switches and limit components fixed to the side plates, and the two sides of the swing brake plate are also symmetrically provided with spring strikers, one end of the spring striker is fixed to the swing brake plate, and the other end of the spring striker is fixed to the side plate, and one end of the swing brake plate is also provided with a limit ring for the steel wire to be cut to pass through; The wire arrangement detection device provided by this patent is not sensitive to the tiny displacement of the cutting line and cannot detect in time when the wire jump trend occurs, which is not conducive to improving the safety of the equipment, maintaining the processing efficiency of silicon wafers and improving the cutting quality of silicon wafers. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a device for monitoring jumpers during silicon wafer cutting to solve the problems raised in the above-mentioned background technology.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a device for monitoring jumpers in silicon wafer cutting, comprising a stand, the stand comprising a base, a front fixed plate fixedly connected to the top of the base, a rear mounting table fixedly connected to the top of the base, a main winding roller rotatably connected to the front of the rear mounting table, a pay-off roller rotatably connected to the front of the rear mounting table, a tension adjustment mechanism fixedly connected to the front of the rear mounting table, a comprehensive detection mechanism fixedly connected to the front of the rear mounting table, a crystal rod fixing frame slidably connected to the inside of the rear mounting table, a motor group fixedly connected to the top of the base, a take-up roller rotatably connected to the back of the front fixed plate, and an electric control cabinet fixedly connected to the front of the front fixed plate; The comprehensive testing organization includes: An F-shaped bracket, the bottom of which is fixedly connected to the top of the front fixing plate, and the left side cross-section of the F-shaped bracket is F-shaped, which is the installation basis of the entire comprehensive detection mechanism; An infrared distance measuring sensor, which is plugged into a horizontal plate near the top of the F-shaped bracket and is used to detect changes in the distance of the cutting line at the bottom of the infrared distance measuring sensor; The temperature probe is plugged into the horizontal plate near the bottom of the F-shaped bracket and is used to detect the temperature of the cutting line surface at the top of the temperature probe.

[0005] Preferably, the front fixing plate is located at the front side of the rear mounting platform, a concave block is fixedly connected to the front side of the front fixing plate, a rectangular groove is opened on the top of the rear mounting platform, and the front side of the rear mounting platform is fixedly connected to the back side of the front fixing plate through a cross plate for carrying the cut silicon wafers.

[0006] Preferably, the front side of the main winding roller is rotatably connected to the front fixed plate, the number of the main winding rollers is three, two of which are symmetrically distributed about the front side of the rear mounting platform, and the third is located at the bottom of the horizontal plate on the front side of the rear mounting platform, which is used to cooperate with the cutting line to form a cutting line network to achieve cutting of the crystal rod, and the pay-off roller is located on the left side of the rear mounting platform, the pay-off roller is used to pay out the cutting line, and the main winding roller and the pay-off roller are connected through the cutting line transmission.

[0007] Preferably, the tension adjustment mechanism is located between the pay-off roller and the main winding roller on the left, and the tension adjustment mechanism includes an electromagnetic coil group, the back of the electromagnetic coil group is fixedly connected to the front of the rear mounting table, the electromagnetic coil group is electrically connected to the electric control cabinet through a wire, and a metal slide bar is slidably connected inside the electromagnetic coil group, the top of the metal slide bar is fixedly connected to the top of the electromagnetic coil group through a spring, and the bottom of the metal slide bar is rotatably connected to a tensioning pressure wheel through an L-shaped plate.

[0008] Preferably, the tensioning wheel is formed by butting two truncated cones with smaller diameters on one side thereof, the front side of the tensioning wheel is rotatably connected to the back side of the L-shaped plate at the bottom of the metal slide bar, and the surface of the tensioning wheel and the metal slide bar is covered with rubber to reduce direct contact with the cutting line.

[0009] Preferably, the bottom of the F-shaped bracket is fixedly connected to the top of the concave block of the front fixing plate, the number of the F-shaped brackets is two, and they are symmetrically distributed about the front side of the front fixing plate, the infrared ranging sensors are evenly arranged on the horizontal plate near the top of the F-shaped bracket, and the temperature probes are evenly arranged on the horizontal plate near the bottom of the F-shaped bracket.

[0010] Preferably, the top horizontal plate of the F-shaped bracket is located at the top of the cutting wire connected to the main winding roller above, so that the infrared ranging sensor can detect the vertical displacement of the cutting wire mesh at the bottom of the infrared ranging sensor at the top, and the bottom horizontal plate of the F-shaped bracket is located inside the cutting wire mesh connected to the main winding roller, so that the temperature probe can detect the surface temperature of the cutting wire at the top of the cutting wire mesh part used to cut silicon wafers.

[0011] Preferably, the crystal rod fixing frame includes a slide, which is slidably connected to the rectangular groove at the top of the rear mounting table, an electric push rod is fixedly connected to the bottom of the rectangular groove of the rear mounting table, the bottom of the electric push rod is electrically connected to the electric control cabinet through a wire, the top of the electric push rod is fixedly connected to the bottom of the slide through a push rod, an induction plate is fixedly connected to the left side of the slide, a clamping seat is fixedly connected to the bottom of the slide, the clamping seat includes a base and a clamping jaw, the top of the clamping jaw is slidably connected to the base, a circular threaded hole is opened at the bottom of the clamping jaw, the bottom of the clamping jaw is fixed by bolts, and a distance sensor is fixedly connected to the front of the rear mounting table.

[0012] Preferably, the distance sensor is located directly below the sensing plate, the distance sensor is located on the right side of the tension adjustment mechanism, and the distance sensor is located on the top of the left main winding roller, and is used to cooperate with the sensing plate to detect the stroke of the slide, and then detect the progress of cutting the crystal rod.

[0013] Preferably, the motor group is located on the right side of the main winding roller, the motor group includes a motor and a bracket at the bottom of the motor, the motor is electrically connected to the electric control cabinet through a wire, the front of the motor group is fixedly connected to a take-up roller through the motor shaft of the motor, the take-up roller is transmission-connected to the main winding roller at the bottom through the cutting line, and a PLC controller is arranged inside the electric control cabinet.

[0014] The present invention provides a jumper monitoring device for silicon wafer cutting, which has the following beneficial effects: 1. This device for monitoring wire jumpers during silicon wafer cutting, by setting up a comprehensive detection mechanism, uses an infrared distance sensor to detect the distance change of the cutting line in real time, thereby improving the detection accuracy of wire jumpers in the cutting line, thereby ensuring the safety of the cutting machine, and further improving the detection accuracy of wire jumpers in the cutting line by cooperating with a temperature probe and a distance sensor, thereby improving the cutting efficiency and quality of silicon wafers.

[0015] 2. This device for monitoring wire jumpers during silicon wafer cutting sets a tension adjustment mechanism and uses an electromagnetic slide bar in conjunction with a pay-off roller and a take-up roller to achieve precise control of the tension of the cutting wire. The device cooperates with a comprehensive detection mechanism and a tension adjustment mechanism to improve the control accuracy of the tension of the cutting wire, thereby reducing the probability of wire jumpers in the cutting wire and helping to improve the cutting efficiency and quality of the silicon wafer.

[0016] 3. This device for monitoring jumper wires during silicon wafer cutting drives the slide up and down by an electric push rod, thereby achieving precise and smooth control of the feed amount of crystal rod cutting, thereby helping to improve the cutting quality of silicon wafers. Through the cooperation of the slide and the distance sensor, accurate perception of the progress of the cutting wire in cutting the crystal rod is achieved, thereby improving the intelligence level of the device.

[0017] 4. This device for monitoring jumper wires during silicon wafer cutting realizes precise control of the detection process of wire-cut silicon wafers by cooperating with a control cabinet, a comprehensive detection mechanism, a tension adjustment mechanism, and a distance sensor. By limiting the jumper wire detection process, it reduces the misjudgment of jumper wire conditions at the beginning and end of cutting by the cutting machine, further improves the detection accuracy of jumper wire conditions, and improves the working efficiency and reliability of the cutting machine in cutting silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the front side of the present invention; Figure 2 It is a schematic diagram of the overall structure of the back side of the present invention; Figure 3 It is a schematic diagram of the structure of the position relationship between the stand and the main winding roller of the present invention; Figure 4 It is a schematic diagram of the overall structure of the tension adjustment mechanism of the present invention; Figure 5 It is a schematic diagram of the overall structure of the comprehensive detection mechanism of the present invention; Figure 6 It is a schematic diagram of the position relationship between the comprehensive detection mechanism and the main winding roller of the present invention; Figure 7 This is a schematic diagram of the overall structure of the crystal rod fixing frame of the present invention; Figure 8 It is a schematic diagram of the position relationship between the tension adjustment mechanism and the crystal rod fixing frame of the present invention.

[0019] In the figure: 1. Stand; 11. Base; 12. Front fixing plate; 13. Rear mounting table; 2. Main winding roller; 3. Pay-off roller; 4. Tension adjustment mechanism; 41. Electromagnetic coil group; 42. Metal slide bar; 43. Tensioning pressure wheel; 5. Comprehensive detection mechanism; 51. F-shaped bracket; 52. Infrared distance sensor; 53. Temperature probe; 6. Crystal rod fixing frame; 61. Slide; 62. Induction plate; 63. Clamp seat; 64. Distance sensor; 7. Motor group; 8. Take-up roller; 9. Electric control cabinet. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0022] Embodiment 1 See also Figure 1-4 The present invention provides a technical solution: a jumper monitoring device during silicon wafer cutting, comprising a stand 1, the stand 1 comprising a base 11, a front fixing plate 12 is fixedly connected to the top of the base 11, a rear mounting platform 13 is fixedly connected to the top of the base 11, the front fixing plate 12 is located on the front of the rear mounting platform 13, a concave block is fixedly connected to the front of the front fixing plate 12, a rectangular groove is provided on the top of the rear mounting platform 13, and the front of the rear mounting platform 13 is fixedly connected to the back of the front fixing plate 12 through a horizontal plate, so as to carry the cut silicon wafer; The front of the rear mounting platform 13 is rotatably connected to the main winding roller 2, and the front of the main winding roller 2 is rotatably connected to the front fixed plate 12. There are three main winding rollers 2, two of which are symmetrically distributed about the front of the rear mounting platform 13, and the third one is located at the bottom of the front horizontal plate of the rear mounting platform 13, which is used to cooperate with the cutting line to form a cutting line network to achieve cutting of the crystal rod. The front of the rear mounting platform 13 is rotatably connected to the pay-off roller 3, which is located on the left side of the rear mounting platform 13. The pay-off roller 3 is used to pay out the cutting line, and the main winding roller 2 and the pay-off roller 3 are connected through the cutting line transmission; A tension adjustment mechanism 4 is fixedly connected to the front of the rear mounting table 13. The tension adjustment mechanism 4 is located between the pay-off roller 3 and the main winding roller 2 on the left. The tension adjustment mechanism 4 includes an electromagnetic coil group 41. The back of the electromagnetic coil group 41 is fixedly connected to the front of the rear mounting table 13. The electromagnetic coil group 41 is electrically connected to the electric control cabinet 9 through a wire. A metal slide bar 42 is slidably connected inside the electromagnetic coil group 41. The top of the metal slide bar 42 is fixedly connected to the top of the electromagnetic coil group 41 through a spring. The bottom of the metal slide bar 42 is rotatably connected to a tensioning pressure wheel 43 through an L-shaped plate. The tensioning pressure wheel 43 is formed by connecting two truncated cone bodies with a smaller diameter on one side. The front of the tensioning pressure wheel 43 is rotatably connected to the back of the L-shaped plate at the bottom of the metal slide bar 42. The surface of the tensioning pressure wheel 43 and the metal slide bar 42 are covered with rubber to reduce direct contact with the cutting line. A comprehensive detection mechanism 5 is fixedly connected to the front of the rear mounting platform 13 for real-time detection of the vertical distance of the cutting line network, thereby improving the accurate monitoring of the cutting line jump situation. A crystal rod fixing frame 6 is slidably connected inside the rear mounting platform 13, a motor group 7 is fixedly connected to the top of the base 11, a wire take-up roller 8 is rotatably connected to the back of the front fixing plate 12, and an electric control cabinet 9 is fixedly connected to the front of the front fixing plate 12.

[0023] When in use, before starting the device, fix the cutting line and evenly wind it on the surface of the main winding roller 2, then pass the remaining cutting line through the bottom of the tensioning pressure wheel 43, and put it on the surface of the main winding roller 2 on the left, the main winding roller 2 on the right, and the main winding roller 2 at the bottom to form a cutting line net, which is circulated in sequence. When the cutting line is wrapped around the position close to the left side of the take-up roller 8, the cutting line is close to the surface of the bottom main winding roller 2, and then it is evenly wound and fixed on the surface of the take-up roller 8. Then adjust the position of the metal slide bar 42 so that the bottom center of the tensioning pressure wheel 43 contacts the cutting line, and the adjustment before the cutting machine is completed. Then fix the crystal rod at the bottom of the crystal rod fixing frame 6, and start the cutting machine through the electric control cabinet 9. After the electric control cabinet 9 is started, the motor group 7 drives the take-up roller 8 to rotate, and then the take-up roller 8 drives the pay-off roller 3 and the main winding roller 2 to rotate in sequence through the cutting line to realize the movement of the cutting line. Subsequently, driven by the electric push rod, the crystal rod fixing frame 6 slides downward, and the crystal rod contacts the moving cutting line on the top of the main winding roller 2 to realize the cutting of the crystal rod. The cut silicon wafer falls on the horizontal plate on the front of the rear mounting table 13. After all the cutting is completed, the cutting machine is stopped through the electric control cabinet 9 to take out the silicon wafer. During the cutting process, the comprehensive detection mechanism 5 monitors the vertical displacement of the cutting line and the surface temperature of the cutting line in real time, and transmits the monitoring data back to the electric control cabinet 9. The electric control cabinet 9 adjusts the current transmitted to the electromagnetic coil group 41 and the rotation speed of the motor group 7 in real time according to the feedback data, and then the travel speed of the cutting line and the stroke position of the metal slide bar 42, thereby adjusting the position of the tensioning wheel 43, and realizing the adjustment of the tensioning degree of the cutting line by the tensioning wheel 43.

[0024] Embodiment 2 See also Figure 1-6 Based on the first embodiment, the present invention provides a technical solution: the comprehensive detection mechanism 5 includes: An F-shaped bracket 51, the bottom of the F-shaped bracket 51 is fixedly connected to the top of the front fixing plate 12, the left side cross section of the F-shaped bracket 51 is F-shaped, and it is the installation base of the entire integrated detection mechanism 5, the top horizontal plate of the F-shaped bracket 51 is located at the top of the cutting line connected to the upper main winding roller 2, the bottom of the F-shaped bracket 51 is fixedly connected to the top of the concave block of the front fixing plate 12, the number of the F-shaped bracket 51 is two, and they are symmetrically distributed about the front of the front fixing plate 12, and the bottom horizontal plate of the F-shaped bracket 51 is located inside the cutting line net connected to the main winding roller 2; The infrared distance measuring sensor 52 is plugged into the horizontal plate near the top of the F-shaped bracket 51. The infrared distance measuring sensor 52 is evenly arranged on the horizontal plate near the top of the F-shaped bracket 51, so that the infrared distance measuring sensor 52 detects the vertical displacement of the cutting line network at the bottom of the infrared distance measuring sensor 52 at the top. The infrared distance measuring sensor 52 is used to detect the distance change of the cutting line at the bottom of the infrared distance measuring sensor 52; The temperature probe 53 is inserted into the horizontal plate near the bottom of the F-shaped bracket 51. The temperature probes 53 are evenly arranged on the horizontal plate near the bottom of the F-shaped bracket 51 so that the temperature probe 53 can detect the surface temperature of the cutting wire of the cutting wire mesh part at its top for cutting silicon wafers. The temperature probe 53 is used to detect the temperature of the cutting wire surface at the top of the temperature probe 53.

[0025] During use, after the cutting machine is started, the infrared ranging sensor 52 emits infrared pulses to the cutting wire mesh at its bottom in real time, and obtains the vertical distance data from the wire bundle of the cutting wire mesh to the infrared ranging sensor 52 by receiving the reflected infrared pulses in real time, and transmits the data back to the electric control cabinet 9 in real time. At the same time, the temperature probe 53 detects the surface temperature of the wire bundle of the cutting wire mesh at its top, and transmits it back to the electric control cabinet 9 in real time. When the displacement data fed back by the infrared ranging sensor 52 exceeds the set safety value, the electric control cabinet 9 determines that a jumper has occurred, and then controls the motor group 7 to stop, and then stops cutting the crystal rod to prevent the quality of the cut silicon wafer from being reduced, and prevents safety accidents from occurring. When the temperature data fed back by the temperature probe 53 exceeds the set safety value, in order to prevent the physical properties of the cutting line from deteriorating under high temperature conditions and causing jumpers, the electric control cabinet 9 controls the motor group 7 to stop and then stops cutting. When the temperature returns to a safe range, the motor group 7 is restarted to continue cutting.

[0026] Embodiment 3 See also Figure 1-8 , on the basis of the first and second embodiments, the present invention provides a technical solution: the crystal rod fixing frame 6 includes a slide 61, the slide 61 is slidably connected to the rectangular groove at the top of the rear mounting table 13, the bottom of the rectangular groove of the rear mounting table 13 is fixedly connected with an electric push rod, the bottom of the electric push rod is electrically connected to the electric control cabinet 9 through a wire, the top of the electric push rod is fixedly connected to the bottom of the slide 61 through a push rod, the left side of the slide 61 is fixedly connected with a sensing plate 62, the bottom of the slide 61 is fixedly connected with a clamping seat 63, the clamping seat 63 includes a base and a clamping claw, the top of the clamping claw is slidably connected to the base, a circular threaded hole is opened at the bottom of the clamping claw, and the bottom of the clamping claw is fixed by a bolt, and the front of the rear mounting table 13 is fixedly connected with a distance sensor 64, the distance sensor 64 is located directly below the sensing plate 62, the distance sensor 64 is located on the right side of the tension adjustment mechanism 4, and the distance sensor 64 is located on the top of the left main winding roller 2, which is used to cooperate with the sensing plate 62 to detect the stroke of the slide 61, and then detect the process of cutting the crystal rod; The motor group 7 is located on the right side of the main winding roller 2. The motor group 7 includes a motor and a bracket at the bottom of the motor. The motor is electrically connected to the electric control cabinet 9 through a wire. The front of the motor group 7 is fixedly connected to a take-up roller 8 through the motor shaft of the motor. The take-up roller 8 is transmission-connected to the main winding roller 2 at the bottom through the cutting line. A PLC controller is arranged inside the electric control cabinet 9.

[0027] When in use, the crystal rod is placed at the bottom of the clamp seat 63, the claws are fixed to the two ends of the crystal rod and clamped, the crystal rod is fixed by bolts, and then the cutting machine is started for cutting. When the slide 61 drives the crystal rod to move downward, the distance sensor 64 monitors the distance from the top of the distance sensor 64 to the bottom of the induction plate 62 in real time and transmits it back to the electric control cabinet 9 in real time. The electric control cabinet 9 determines the degree of crystal rod cutting according to the data returned by the distance sensor 64. When the monitoring data of the distance sensor 64 fed back by the electric control cabinet 9 determines that the crystal rod has been cut 10% in the vertical direction, the stop detection process in Example 2 is started. If the comprehensive detection mechanism 5 detects abnormal data, it stops rotating. When the monitoring data of the distance sensor 64 fed back by the electric control cabinet 9 determines that the crystal rod has been cut 90% in the vertical direction, the stop detection process in Example 2 is released.

[0028] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A device for monitoring jumpers during silicon wafer cutting, comprising a stand (1), characterized in that: The stand (1) comprises a base (11), the top of the base (11) is fixedly connected to a front fixing plate (12), the top of the base (11) is fixedly connected to a rear mounting platform (13), the front of the rear mounting platform (13) is rotatably connected to a main winding roller (2), the front of the rear mounting platform (13) is rotatably connected to a pay-off roller (3), the front of the rear mounting platform (13) is fixedly connected to a tension adjustment mechanism (4), the front of the rear mounting platform (13) is fixedly connected to a comprehensive detection mechanism (5), the rear of the rear mounting platform (13) is slidably connected to a crystal rod fixing frame (6), the top of the base (11) is fixedly connected to a motor group (7), the back of the front fixing plate (12) is rotatably connected to a take-up roller (8), and the front of the front fixing plate (12) is fixedly connected to an electric control cabinet (9); The comprehensive detection mechanism (5) comprises: An F-shaped bracket (51), the bottom of the F-shaped bracket (51) being fixedly connected to the top of the front fixing plate (12), the left side cross section of the F-shaped bracket (51) being F-shaped, and being the installation base of the entire integrated detection mechanism (5); An infrared distance measuring sensor (52), the infrared distance measuring sensor (52) being plugged into a horizontal plate near the top of the F-shaped bracket (51) and used to detect a change in the distance of the cutting line at the bottom of the infrared distance measuring sensor (52); A temperature probe (53) is inserted into a horizontal plate near the bottom of the F-shaped bracket (51) and is used to detect the temperature of the surface of the cutting line at the top of the temperature probe (53).

2. The device for monitoring jumper wires during silicon wafer cutting according to claim 1, characterized in that: The front fixing plate (12) is located on the front side of the rear mounting platform (13); a concave block is fixedly connected to the front side of the front fixing plate (12); a rectangular groove is provided on the top of the rear mounting platform (13); the front side of the rear mounting platform (13) is fixedly connected to the back side of the front fixing plate (12) via a transverse plate, and is used to carry the cut silicon wafers.

3. The device for monitoring jumper wires during silicon wafer cutting according to claim 2, characterized in that: The front face of the main winding roller (2) is rotatably connected to the front fixing plate (12). The number of the main winding rollers (2) is three, two of which are symmetrically distributed about the front face of the rear mounting platform (13), and the third is located at the bottom of the front cross plate of the rear mounting platform (13) and is used to cooperate with the cutting line to form a cutting line network to achieve cutting of the crystal rod. The pay-off roller (3) is located on the left side of the rear mounting platform (13). The pay-off roller (3) is used to pay out the cutting line. The main winding roller (2) and the pay-off roller (3) are connected to each other through a cutting line transmission.

4. The device for monitoring jumper wires during silicon wafer cutting according to claim 1, characterized in that: The tension adjustment mechanism (4) is located between the pay-off roller (3) and the main winding roller (2) on the left side, and comprises an electromagnetic coil group (41). The back of the electromagnetic coil group (41) is fixedly connected to the front of the rear mounting platform (13). The electromagnetic coil group (41) is electrically connected to the electric control cabinet (9) via a wire. A metal slide bar (42) is slidably connected inside the electromagnetic coil group (41). The top of the metal slide bar (42) is fixedly connected to the top of the electromagnetic coil group (41) via a spring. The bottom of the metal slide bar (42) is rotatably connected to a tensioning pressure wheel (43) via an L-shaped plate.

5. The device for monitoring jumper wires during silicon wafer cutting according to claim 4, characterized in that: The tensioning wheel (43) is formed by butting two truncated cones with smaller diameters on one side thereof. The front side of the tensioning wheel (43) is rotatably connected to the back side of the L-shaped plate at the bottom of the metal slide bar (42). The surface of the tensioning wheel (43) and the metal slide bar (42) are covered with rubber to reduce direct contact with the cutting line.

6. The device for monitoring jumper wires during silicon wafer cutting according to claim 1, characterized in that: The bottom of the F-shaped bracket (51) is fixedly connected to the top of the concave block of the front fixing plate (12), the number of the F-shaped brackets (51) is two, and they are symmetrically distributed with respect to the front of the front fixing plate (12), the infrared distance measuring sensors (52) are evenly arranged on the horizontal plate near the top of the F-shaped bracket (51), and the temperature probes (53) are evenly arranged on the horizontal plate near the bottom of the F-shaped bracket (51).

7. The device for monitoring jumper wires during silicon wafer cutting according to claim 6, characterized in that: The top horizontal plate of the F-shaped bracket (51) is located at the top of the cutting wire connected to the main winding roller (2) above, so that the infrared distance sensor (52) can detect the vertical displacement of the cutting wire net at the bottom of the infrared distance sensor (52) at the top, and the bottom horizontal plate of the F-shaped bracket (51) is located inside the cutting wire net connected to the main winding roller (2), so that the temperature probe (53) can detect the surface temperature of the cutting wire net part at the top for cutting silicon wafers.

8. The device for monitoring jumper wires during silicon wafer cutting according to claim 1, characterized in that: The crystal rod fixing frame (6) comprises a slide (61), the slide (61) is slidably connected to a rectangular groove at the top of the rear mounting platform (13), an electric push rod is fixedly connected to the bottom of the rectangular groove of the rear mounting platform (13), the bottom of the electric push rod is electrically connected to the electric control cabinet (9) through a wire, the top of the electric push rod is fixedly connected to the bottom of the slide (61) through the push rod, the left side of the slide (61) is fixedly connected to a sensing plate (62), the bottom of the slide (61) is fixedly connected to a clamping seat (63), the clamping seat (63) comprises a base and a clamping claw, the top of the clamping claw is slidably connected to the base, the bottom of the clamping claw is provided with a circular threaded hole, the bottom of the clamping claw is fixed by a bolt, and the front of the rear mounting platform (13) is fixedly connected to a distance sensor (64).

9. The device for monitoring jumper wires during silicon wafer cutting according to claim 8, characterized in that: The distance sensor (64) is located directly below the sensing plate (62), the distance sensor (64) is located on the right side of the tension adjustment mechanism (4), and the distance sensor (64) is located on the top of the left main winding roller (2), and is used to cooperate with the sensing plate (62) to detect the stroke of the slide (61), thereby detecting the progress of cutting the crystal rod.

10. The device for monitoring jumper wires during silicon wafer cutting according to claim 1, characterized in that: The motor group (7) is located on the right side of the main winding roller (2), the motor group (7) comprises a motor and a bracket at the bottom of the motor, the motor is electrically connected to an electric control cabinet (9) via a wire, a take-up roller (8) is fixedly connected to the front of the motor group (7) via the motor shaft of the motor, the take-up roller (8) is transmission-connected to the main winding roller (2) at the bottom via a cutting line, and a PLC controller is arranged inside the electric control cabinet (9).

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