Tapered semiconductor laser separation electrode test fixture

Abstract

The invention provides a conical semiconductor laser separation electrode test fixture. The conical semiconductor laser separation electrode test fixture comprises a water cooling base; a first refrigeration device; the base is arranged on the upper surface of the first refrigeration equipment in the first direction, and a second groove is formed in the upper surface of the base; the upper cover plate is arranged on the upper surface of the water cooling base in the first direction; the pull ring connector assembly comprises a first pull ring connector and a second pull ring connector; the spring electrode assembly comprises a PA electrode unit and an MO electrode unit, the PA electrode unit sequentially penetrates through the first pull ring connector and the third groove in the first direction to be in contact with the COS packaging conical semiconductor laser chip, and the MO electrode unit sequentially penetrates through the second pull ring connector and the third groove in the first direction to be in contact with the COS packaging conical semiconductor laser chip; the PA electrode unit can be pulled up in the first direction through the first pull-tab connector, and the MO electrode unit can be pulled up in the first direction through the second pull-tab connector and move in the third groove in the third direction.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor lasers, in particular to a cone-shaped semiconductor laser separation electrode testing fixture. Background Art

[0002] In recent years, with the rapid development of semiconductor laser technology, its application fields have been continuously expanding. It is widely used in advanced manufacturing, space communications, medical cosmetology, lidar and other occasions, and has broad market prospects, but at the same time it also puts higher requirements on the performance of semiconductor lasers.

[0003] Conical semiconductor lasers have gradually become a research hotspot due to their advantages such as high output power and good beam quality. The basic working principle of a conical semiconductor laser is to use the ridge region (MO) to provide a single-mode seed light with low power and good beam quality, and then amplify the power of the seed light in the conical region (PA) to achieve high power and high beam quality. However, the common test fixtures for conical semiconductor lasers currently use a set of electrodes shared by the ridge region and the conical region. The current flowing through the ridge region and the conical region is distributed according to the size of the two areas, and cannot be controlled separately. This means that under high current injection conditions, the current injected into the ridge region is too large, resulting in poor seed light beam quality, distortion of the device output power curve, and affecting the overall performance of the device.

[0004] The above information disclosed in this section is only for understanding the background of the inventive concept of the present invention and therefore the above information may contain information that does not constitute the prior art. Summary of the invention

[0005] In view of at least one aspect of the above technical problems, the present invention provides a conical semiconductor laser separation electrode test fixture, comprising: a water-cooled base; a first refrigeration device, arranged in a first groove of the water-cooled base; a base, arranged on the upper surface of the first refrigeration device along a first direction, wherein a second groove is arranged on the upper surface of the base for placing a COS packaged conical semiconductor laser chip; an upper cover plate, arranged on the upper surface of the water-cooled base along a first direction, wherein two third grooves are arranged in parallel on the upper cover plate along a second direction; a pull-ring connector assembly, comprising a first pull-ring connector and a second pull-ring connector, both of which are arranged on the two third grooves along the first direction; a spring electrode assembly, comprising a PA electrode unit and an MO electrode unit, wherein the PA electrode unit sequentially passes through the first pull-ring connector and the third groove along the first direction to contact the COS packaged conical semiconductor laser chip, and the MO electrode unit sequentially passes through the second pull-ring connector and the third groove along the first direction to contact the COS packaged conical semiconductor laser chip; and the PA electrode unit can be pulled up along the first direction through the first pull-ring connector, and the MO electrode unit can be pulled up along the first direction through the second pull-ring connector and move in the third groove along the third direction.

[0006] In some exemplary embodiments of the present invention, the water cooling base includes a water inlet and a water inlet, wherein the water inlet and the water inlet are symmetrically arranged on the lower side of the first groove along the first direction, and both the water inlet and the water inlet are connected to the water cooling device.

[0007] In some exemplary embodiments of the present invention, the upper cover plate includes a plurality of first screw holes symmetrically arranged along the third direction, and the upper cover plate is connected to the upper surface of the water-cooling base along the first direction by a plurality of bolts passing through corresponding first screw holes.

[0008] In some exemplary embodiments of the present invention, a first circular hole is provided at one end of the two third grooves along the third direction, and a first long hole is provided at the other end.

[0009] In some exemplary embodiments of the present invention, the first pull ring connector and the second pull ring connector both include a pull hole and second circular holes symmetrically arranged at both ends of the pull ring connector along a third direction, wherein the position of each second circular hole of the first pull ring connector along the first direction corresponds to the first circular hole in the third groove.

[0010] In some exemplary embodiments of the present invention, the PA electrode unit includes a first spring electrode and a second spring electrode, wherein the first spring electrode and the second spring electrode respectively pass through the second circular hole of the first pull-ring connector in sequence along the first direction, and the first circular hole contacts the COS packaged conical semiconductor laser chip; and the PA electrode unit can be pulled up along the first direction through the pull hole of the first pull-ring connector to control the contact distance between the first spring electrode and the second spring electrode and the COS packaged conical semiconductor laser chip along the first direction.

[0011] In some exemplary embodiments of the present invention, the MO electrode unit includes a third spring electrode and a fourth spring electrode, wherein the third spring electrode and the fourth spring electrode respectively pass through the second circular hole and the first long hole of the second pull ring connector in sequence along the first direction to contact the COS packaged conical semiconductor laser chip; and the MO electrode unit can be pulled up along the first direction through the pull hole of the second pull ring connector and move in the first long hole along the third direction.

[0012] In some exemplary embodiments of the present invention, a COS packaged conical semiconductor laser chip includes a conical laser chip body, a PA electrode first contact surface, a PA electrode second contact surface, a MO electrode first contact surface and a MO electrode second contact surface, wherein a first spring electrode contacts the PA electrode first contact surface, a second spring electrode contacts the PA electrode second contact surface; and a third spring electrode contacts the MO electrode first contact surface, and a fourth spring electrode contacts the MO electrode second contact surface.

[0013] In some exemplary embodiments of the present invention, one end of any of the first spring electrode, the second spring electrode, the third spring electrode and the fourth spring electrode contacts the COS packaged tapered semiconductor laser chip, and the other end is connected to an external power source.

[0014] In some exemplary embodiments of the present invention, the first direction, the second direction and the third direction are all perpendicular to each other.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The overall structure of a tapered semiconductor laser separation electrode test fixture according to an embodiment of the present invention is schematically shown;

[0017] Figure 2 A schematic diagram of the water-cooling base structure of a tapered semiconductor laser separation electrode test fixture according to an embodiment of the present invention is shown;

[0018] Figure 3 A schematic diagram of the base structure of a tapered semiconductor laser separation electrode test fixture according to an embodiment of the present invention is shown;

[0019] Figure 4 A schematic diagram of the structure of a COS packaged tapered semiconductor laser chip of a tapered semiconductor laser separation electrode test fixture according to an embodiment of the present invention is shown;

[0020] Figure 5 A schematic diagram of the structure of an upper cover plate of a tapered semiconductor laser separation electrode test fixture according to an embodiment of the present invention is shown;

[0021] Figure 6 The structure of the pull-ring connector of the tapered semiconductor laser separation electrode test fixture according to an embodiment of the present invention is schematically shown. DETAILED DESCRIPTION

[0022] The specific embodiments of the present invention will be described in detail below. It should be noted that the embodiments described herein are only for illustration and are not intended to limit the present invention. In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is obvious to those of ordinary skill in the art that these specific details do not have to be adopted to implement the present invention. In other examples, in order to avoid confusing the present invention, known structures, materials or methods are not specifically described.

[0023] Throughout the specification, references to "one embodiment," "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "in one embodiment," "in an embodiment," "an example," or "an example" appearing in various places throughout the specification do not necessarily all refer to the same embodiment or example. In addition, particular features, structures, or characteristics may be combined in one or more embodiments or examples in any suitable combination and / or subcombination. In addition, it should be understood by those of ordinary skill in the art that the term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0024] The terms used herein are only for describing specific embodiments and are not intended to limit the present invention. The terms "comprise", "include", etc. used herein indicate the existence of features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0025] All terms used herein, including technical and scientific terms, have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification, and should not be interpreted in an idealized or overly rigid manner.

[0026] The embodiment of the present invention provides a conical semiconductor laser separation electrode test fixture. The problem that the currents in the ridge region and the conical region of the conical semiconductor laser cannot be arbitrarily controlled under the condition of a common electrode is solved. When the conical semiconductor laser separation electrode test fixture is used for testing, the ridge region and the conical region can be powered separately, which solves the problem of mode hopping of the seed light when a large current is injected, and is conducive to improving the stability of the output mode, so that a larger current can be applied to the conical region to obtain a higher power high beam quality laser output.

[0027] Combine the following Figures 1 to 6 An embodiment of a tapered semiconductor laser separation electrode test jig according to an embodiment of the present invention will be described in detail.

[0028] Figure 1 The overall structure of a tapered semiconductor laser separation electrode test fixture according to an embodiment of the present invention is schematically shown. Figure 2 A schematic diagram of the water-cooling base structure of a tapered semiconductor laser separation electrode test fixture according to an embodiment of the present invention is shown;

[0029] like Figure 1As shown, the conical semiconductor laser separation electrode test fixture includes a water-cooled base 1; a first refrigeration device 4, which is arranged in a first groove 16 of the water-cooled base 1; a base 5, which is arranged on the upper surface of the first refrigeration device 4 along the first direction X1, wherein the upper surface of the base 5 is provided with a second groove 17 for placing a COS packaged conical semiconductor laser chip 6; an upper cover plate 8, which is arranged on the upper surface of the water-cooled base 1 along the first direction X1, wherein two third grooves 27 are arranged in parallel on the upper cover plate 8 along the second direction X2; a pull ring connector assembly 34, including a first pull ring connector 13 and a second pull ring connector 14, both of which are arranged in the two third grooves 27 along the first direction X1. On; a spring electrode assembly 35, including a PA electrode unit and a MO electrode unit, wherein the PA electrode unit sequentially passes through the first pull-ring connector 13 and the third groove 27 along the first direction X1 to contact the COS-packaged conical semiconductor laser chip 6, and the MO electrode unit sequentially passes through the second pull-ring connector 14 and the third groove 27 along the first direction X1 to contact the COS-packaged conical semiconductor laser chip 6; and the PA electrode unit can be pulled up along the first direction X1 through the first pull-ring connector 13, and the MO electrode unit can be pulled up along the first direction X1 through the second pull-ring connector 14 and move in the third groove 27 along the third direction X3.

[0030] Specifically, if Figure 1 and Figure 2 As shown, the water-cooling base 1 is provided with a first groove 16 and a water flow channel, and the water flow channel includes a water inlet 2 and a water inlet 3. The water inlet 2 and the water inlet 3 are symmetrically arranged on the lower side of the first groove 16 along the first direction X1, and the water inlet 2 and the water inlet 3 are connected to the water cooling device. The water-cooling base 1 is used to dissipate heat for the first refrigeration device 4 arranged in the first groove 16. In addition, second screw holes 15 are provided on both end sides of the water-cooling base 1 along the second direction X2, which are used to connect with the upper cover plate 8 by setting a plurality of bolts 7. For example, Figure 2 As shown, there are four second screw holes 15. In the embodiment of the present invention, the water-cooled base 1 is made of a metal material with good thermal conductivity, generally copper, so as to ensure that the heat conducted from the conical laser chip body 18 to the first refrigeration device 4 can be dissipated in time.

[0031] Further, such as Figure 1 As shown, the first cooling device 4 is disposed in the first groove 16 of the water-cooled base 1 , and is used to dissipate heat for the COS packaged conical semiconductor laser chip 6 disposed in the second groove of the base 5 .

[0032] Figure 3 The base structure diagram of the tapered semiconductor laser separation electrode test fixture according to an embodiment of the present invention is schematically shown. Figure 4The structure diagram of a COS packaged tapered semiconductor laser chip of a tapered semiconductor laser separation electrode test fixture according to an embodiment of the present invention is schematically shown.

[0033] See also Figure 3 A second groove 17 is provided on the surface of the base 5 for placing the COS packaged conical semiconductor laser chip 6 to position the COS packaged conical semiconductor laser chip 6 to be tested. In the embodiment of the present invention, the base 5 is made of a metal material with good thermal conductivity, generally copper.

[0034] Further, such as Figure 4 As shown, the COS packaged tapered semiconductor laser chip 6 includes a tapered laser chip body 18 to be tested, a PA electrode first contact surface 19, a PA electrode second contact surface 20, a MO electrode first contact surface 21, and a MO electrode second contact surface 22. Among them, the PA electrode first contact surface 19 and the PA electrode second contact surface 20 are the ridge area of ​​the COS packaged tapered semiconductor laser chip 6, and the MO electrode first contact surface 21 and the MO electrode second contact surface 22 are the tapered area of ​​the COS packaged tapered semiconductor laser chip 6. In addition, insulating grooves 23 are provided between each contact surface and between each contact surface and the tapered laser chip body 18 to ensure that the ridge area and the tapered area can be powered separately.

[0035] In the embodiment of the present invention, the COS packaged conical semiconductor laser chip 6 is a conical semiconductor laser chip that has been processed by wire bonding, and its substrate is generally AlN ceramic, and gold is plated on the contact surfaces on both sides of the chip along the second direction X2 to ensure good conductivity.

[0036] Figure 5 The structure of the upper cover plate of the tapered semiconductor laser separation electrode test fixture according to an embodiment of the present invention is schematically shown. Figure 6 The structure of the pull-ring connector of the tapered semiconductor laser separation electrode test fixture according to an embodiment of the present invention is schematically shown.

[0037] In the embodiment of the present invention, the upper cover plate 8 is connected to the upper surface of the water-cooling base 1 along the first direction X1 by a plurality of bolts 7 passing through corresponding first screw holes 24. In addition, two third grooves 27 are arranged in parallel on the upper cover plate 8 along the second direction X2.

[0038] Specifically, see Figure 5The upper cover plate 8 includes four first screw holes 24 symmetrically arranged along the third direction X3. It should be noted that the number of the first screw holes 24 and the number of the second screw holes 15 provided on the water-cooling base 1 need to be the same and the positions are also corresponding, so that the upper cover plate 8 is connected to the water-cooling base 1 after the four bolts 7 pass through the first screw holes 24 and the second screw holes 15 in sequence. In the embodiment of the present invention, the upper cover plate 8 is an insulating material, generally a hard plastic material.

[0039] Further, such as Figure 5 As shown, two third grooves 27 on the upper cover plate 8 are each provided with a first circular hole 29 at one end along the third direction X3, and a first long hole 25 at the other end.

[0040] In the embodiment of the present invention, the pull ring connector assembly 34 includes a first pull ring connector 13 and a second pull ring connector 14, both of which are arranged on two third grooves 27 along the first direction X1. The first pull ring connector 13 and the second pull ring connector 14 can be spring connectors.

[0041] Specifically, if Figure 1 and Figure 6 As shown, the first pull-ring connector 13 and the second pull-ring connector 14 both include a pull hole 33 and second circular holes 31 symmetrically arranged at both ends of the pull-ring connector along the third direction X3, wherein each second circular hole 31 of the first pull-ring connector 13 is located along the first direction X1 corresponding to the first circular hole 29 in the third groove 27. In the embodiment of the present invention, the first pull-ring connector 13 and the second pull-ring connector 14 are both made of insulating materials, generally hard plastic materials, to prevent the spring electrodes from being connected.

[0042] Please continue reading Figure 1 The spring electrode assembly 35 includes a PA electrode unit and a MO electrode unit, wherein the PA electrode unit sequentially passes through the first pull-ring connector 13 and the third groove 27 along the first direction X1 to contact the COS packaged conical semiconductor laser chip 6, and the MO electrode unit sequentially passes through the second pull-ring connector 14 and the third groove 27 along the first direction X1 to contact the COS packaged conical semiconductor laser chip 6.

[0043] Specifically, if Figure 1 , Figure 5 and Figure 6 As shown, the PA electrode unit includes a first spring electrode 9 and a second spring electrode 10, wherein the first spring electrode 9 and the second spring electrode 10 respectively pass through the second circular hole 31 and the first circular hole 29 of the first pull-ring connector 13 in sequence along the first direction X1 to contact the COS packaged conical semiconductor laser chip 6.

[0044] Further, such as Figure 1 and Figure 4As shown, the first spring electrode 9 contacts the first contact surface 19 of the PA electrode of the COS package conical semiconductor laser chip 6 , and the second spring electrode 10 contacts the second contact surface 20 of the PA electrode of the COS package conical semiconductor laser chip 6 .

[0045] In the embodiment of the present invention, the PA electrode unit can be pulled up along the first direction X1 through the pull hole 33 of the first pull ring connector 13 to control the contact distance between the first spring electrode 9 and the second spring electrode 10 and the COS packaged tapered semiconductor laser chip 6 along the first direction X1.

[0046] It can be understood that the first spring electrode 9 and the second spring electrode 10 included in the PA electrode unit can only be pulled up by the first pull ring connector 13 to move up and down along the first direction X1 after passing through the second circular hole 31 of the first pull ring connector 13 and the first circular hole 29 of the upper cover plate 8 along the first direction X1.

[0047] Please continue reading Figure 1 , Figure 5 and Figure 6 The MO electrode unit includes a third spring electrode 11 and a fourth spring electrode 12, wherein the third spring electrode 11 and the fourth spring electrode 12 respectively pass through the second circular hole 31 and the first long hole 25 of the second pull-ring connector 14 in the first direction X1 and contact the COS packaged conical semiconductor laser chip 6.

[0048] Further, such as Figure 1 and Figure 4 As shown, the third spring electrode 11 contacts the first contact surface 21 of the MO electrode, and the fourth spring electrode 12 contacts the second contact surface 22 of the MO electrode.

[0049] In the embodiment of the present invention, the MO electrode unit can be pulled up along the first direction X1 through the pull hole 33 of the second pull ring connector 14 and move within the first long hole 25 along the third direction X3.

[0050] It is understandable that if Figure 1 and Figure 4 As shown, after the third spring electrode 11 and the fourth spring electrode 12 included in the MO electrode unit pass through the second circular hole 31 and the first long hole 25 of the second pull-ring connector 14 in sequence along the first direction X1, they can not only be pulled up along the first direction X1 by the second pull-ring connector 14 to control the contact distance between the electrode and the COS packaged conical semiconductor laser chip 6, but also can move in the third groove 27 along the third direction X3 at the same time.

[0051] In the embodiment of the present invention, the first direction X1, the second direction X2 and the third direction X3 are all perpendicular to each other.

[0052] In the embodiment of the present invention, any of the first spring electrode 9 , the second spring electrode 10 , the third spring electrode 11 and the fourth spring electrode 12 is made of a metal material with good electrical conductivity, generally copper plated with gold.

[0053] In an embodiment of the present invention, Figure 1 As shown, a boss is provided in the middle of any of the first spring electrode 9, the second spring electrode 10, the third spring electrode 11 and the fourth spring electrode 12 to fix the position of the spring. The length of the spring electrode should be sufficient to contact the contact surface of the COS package conical semiconductor laser chip 6, and the upper end of the spring electrode also has some redundancy to connect an external power supply.

[0054] In the embodiment of the present invention, one end of any of the first spring electrode 9, the second spring electrode 10, the third spring electrode 11 and the fourth spring electrode 12 in the MO electrode unit and the PA electrode unit is in contact with the COS packaged tapered semiconductor laser chip 6, and the other end is connected to an external power source. That is, the lower end of each spring electrode is in contact with and connected to the COS packaged tapered semiconductor laser chip 6, and the upper end is connected to the external power source, thus forming a conductive loop for supplying power to the COS packaged tapered semiconductor laser chip 6.

[0055] Specifically, the MO electrode unit can apply current to the ridge region of the COS packaged tapered semiconductor laser chip, and the PA electrode unit can apply current to the tapered region of the COS packaged tapered semiconductor laser chip.

[0056] Through the embodiments of the present invention, the above-mentioned tapered semiconductor laser separated electrode test fixture solves the problem that the currents in the ridge region and the tapered region cannot be controlled separately during the test of the tapered semiconductor laser, and overcomes the problem of seed light mode hopping in the ridge region under the condition of large injection current, so that a larger current can be applied to the tapered region to obtain a higher power high beam quality laser output, thereby making up for the shortcomings of the existing semiconductor laser test fixture.

[0057] Based on the above description of the tapered semiconductor laser separated electrode test fixture, the following describes in detail the process of using the tapered semiconductor laser separated electrode test fixture to perform a test.

[0058] In an embodiment of the present invention, the MO electrode unit is first pulled up along the first direction X1 by the second pull-ring connector 14, and moved in the third groove 27 along the third direction X3 to the edge of the second groove 17 on the base 5; then the PA electrode unit is pulled up along the first direction X1 by the first pull-ring connector 13, and the COS packaged conical semiconductor laser chip 6 is placed in an appropriate position in the second groove 17, and then the PA electrode unit is lowered to ensure that the first spring electrode 9 and the second spring electrode 10 of the PA electrode unit are in contact with the first contact surface 19 and the second contact surface 20 of the PA electrode, respectively; further, the MO electrode unit is pulled up along the first direction X1 by the second pull-ring connector 14, and moved in the third groove 27 along the third direction X3 to an appropriate position, so that the third spring electrode 11 of the MO electrode unit is in contact with the first contact surface 21 of the MO electrode, and the fourth spring electrode 12 is in contact with the second contact surface 22 of the MO electrode. Finally, the first spring electrode 9 and the second spring electrode 10 are respectively connected to a power source to apply current to the conical region of the COS packaged conical semiconductor laser chip to achieve separate control of the current; and the third spring electrode 11 and the fourth spring electrode 12 are respectively connected to a power source to apply current to the ridge region of the COS packaged conical semiconductor laser chip to achieve separate control of the current.

[0059] Through the embodiments of the present invention, the conical semiconductor laser separation electrode test fixture is used for testing, and the current injected into the ridge region and the conical region are individually controlled in an adjustable manner, which is beneficial to improving the stability of the output mode, thereby obtaining high output power while obtaining better beam quality.

[0060] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0061] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents. It will be appreciated by those skilled in the art that the features described in the various embodiments of the present invention and / or the claims may be combined in various combinations and / or combinations, even if such combinations or combinations are not explicitly described in the present invention. In particular, the features described in the various embodiments of the present invention and / or the claims may be combined in various combinations and / or combinations without departing from the spirit and teachings of the present invention. All of these combinations and / or combinations fall within the scope of the present invention.

Claims

1. A conical semiconductor laser separation electrode test fixture, characterized in that: include: Water cooling base (1); A first refrigeration device (4) is arranged in a first groove (16) of the water-cooling base (1); A base (5) is arranged on the upper surface of the first refrigeration device (4) along a first direction, wherein the upper surface of the base (5) is provided with a second groove (17) for placing a COS packaged conical semiconductor laser chip (6); An upper cover plate (8) is arranged on the upper surface of the water-cooling base (1) along a first direction, wherein two third grooves (27) are arranged in parallel on the upper cover plate (8) along a second direction; A pull ring connector assembly (34), comprising a first pull ring connector (13) and a second pull ring connector (14), both of which are arranged on the two third grooves (27) along the first direction; A spring electrode assembly (35) comprising a PA electrode unit and a MO electrode unit, wherein the PA electrode unit sequentially passes through a first pull-ring connector (13) and a third groove (27) along a first direction to contact the COS packaged conical semiconductor laser chip (6), and the MO electrode unit sequentially passes through a second pull-ring connector (14) and a third groove (27) along the first direction to contact the COS packaged conical semiconductor laser chip (6); and The PA electrode unit can be pulled up along the first direction via the first pull ring connector (13), and the MO electrode unit can be pulled up along the first direction via the second pull ring connector (14) and moved within the third groove (27) along a third direction.

2. The tapered semiconductor laser separation electrode test fixture according to claim 1, characterized in that: The water-cooling base (1) comprises a water inlet (2) and a water inlet (3), wherein the water inlet (2) and the water inlet (3) are respectively arranged symmetrically on the lower side of the first groove (16) along the first direction, and the water inlet (2) and the water inlet (3) are both connected to a water cooling device.

3. The tapered semiconductor laser separation electrode test fixture according to claim 1 or 2, characterized in that: The upper cover plate (8) comprises a plurality of first screw holes (24) symmetrically arranged along the third direction, and the upper cover plate (8) is connected to the upper surface of the water-cooling base (1) along the first direction by means of a plurality of bolts (7) passing through corresponding first screw holes (24).

4. The tapered semiconductor laser separation electrode test fixture according to claim 3, characterized in that: A first circular hole (29) is provided at one end of the two third grooves (27) along the third direction, and a first long hole (25) is provided at the other end.

5. The tapered semiconductor laser separation electrode test fixture according to claim 4, characterized in that: The first pull-ring connector (13) and the second pull-ring connector (14) both comprise a pull hole (33) and second circular holes (31) symmetrically arranged at both ends of the pull-ring connector along the third direction, wherein the position of each of the second circular holes (31) of the first pull-ring connector (13) along the first direction corresponds to the first circular hole (29) in the third groove (27).

6. The tapered semiconductor laser separation electrode test fixture according to claim 1 or 5, characterized in that: The PA electrode unit comprises a first spring electrode (9) and a second spring electrode (10), wherein the first spring electrode (9) and the second spring electrode (10) respectively pass through the second circular hole (31) and the first circular hole (29) of the first pull-ring connector (13) in sequence along the first direction to contact the COS packaged conical semiconductor laser chip (6); and The PA electrode unit can be pulled up along the first direction through the pulling hole (33) of the first pulling ring connector (13) to control the contact distance between the first spring electrode (9) and the second spring electrode (10) and the COS packaged conical semiconductor laser chip (6) along the first direction.

7. The tapered semiconductor laser separation electrode test fixture according to claim 6, characterized in that: The MO electrode unit comprises a third spring electrode (11) and a fourth spring electrode (12), wherein the third spring electrode (11) and the fourth spring electrode (12) respectively pass through the second circular hole (31) and the first long hole (25) of the second pull-ring connector (14) in sequence along the first direction to contact the COS packaged conical semiconductor laser chip (6); and The MO electrode unit can be pulled up along the first direction through the pulling hole (33) of the second pull ring connector (14) and can be moved within the first long hole (25) along the third direction.

8. The tapered semiconductor laser separation electrode test fixture according to claim 1 or 7, characterized in that: The COS packaged conical semiconductor laser chip (6) comprises a conical laser chip body (18), a PA electrode first contact surface (19), a PA electrode second contact surface (20), a MO electrode first contact surface (21) and a MO electrode second contact surface (22), wherein the first spring electrode (9) contacts the PA electrode first contact surface (19), and the second spring electrode (10) contacts the PA electrode second contact surface (20); and The third spring electrode (11) contacts the first contact surface (21) of the MO electrode, and the fourth spring electrode (12) contacts the second contact surface (22) of the MO electrode.

9. The tapered semiconductor laser separation electrode test fixture according to claim 8, characterized in that: One end of any one of the first spring electrode (9), the second spring electrode (10), the third spring electrode (11) and the fourth spring electrode (12) is in contact with the COS packaged conical semiconductor laser chip (6), and the other end is connected to an external power supply.

10. The tapered semiconductor laser separation electrode test fixture according to claim 1, characterized in that: The first direction, the second direction and the third direction are all perpendicular to each other.

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