Structure and function integrated phased-array antenna multi-physics field collaborative simulation optimization method

Abstract

The invention provides a structure and function integrated phased-array antenna multi-physics field co-simulation optimization method. The method comprises the following steps: splitting an overall model of an antenna; electromagnetic simulation is carried out on the power division network electromagnetic simulation model, circuit simulation is carried out on the chip equivalent spice cascade circuit simulation model, full-array thermal simulation is carried out on the full-array thermal simulation model, force simulation is carried out on the radome force simulation model, and circuit simulation is carried out again on the chip equivalent spice cascade circuit simulation model in sequence; performing electromagnetic simulation by each antenna sub-array electromagnetic simulation model; all the sub-array directional diagrams are subjected to full-array directional diagram synthesis; judging whether the parameters output by each simulation model in the co-simulation optimization whole process meet the preset requirements or not, and if so, completing the road, heat, force and electromagnetic multi-physical field co-simulation optimization; otherwise, adopting an optimization algorithm to adjust the optimization variable of the simulation model of the corresponding module; according to the method, efficient collaborative joint simulation optimization of the antenna under the coupling action of multiple physical fields such as force, heat and electricity is realized.

Description

Technical Field

[0001] The present invention belongs to the technical field of microwave antennas and relates to a multi-physical field collaborative simulation optimization method for a phased array antenna with integrated structure and function. Background Art

[0002] A structurally and functionally integrated phased array antenna refers to a phased array antenna in which the antenna's radiation unit, radio frequency circuit, load-bearing and heat dissipation are integrated with the structural shape. Its functional density is more compact and is deeply related to multiple factors such as the carrier platform's geometric configuration and working conditions. A structurally and functionally integrated phased array antenna usually has the advantage of high-density integration, but the integrated molding manufacturing and working process involves composite loading of multiple energies. The final performance is greatly affected by multiple physical fields such as electromagnetic fields, thermal fields, and stress fields. For example, under the actual working conditions of the antenna, actual factors such as thermal deformation caused by external aerodynamic loads, processing errors caused by the integrated molding process, and local thermal effects caused by high-density integrated active circuits will all deteriorate the overall performance of the antenna.

[0003] The design of traditional phased array antennas is mostly a discrete design between the antenna array, RF circuit and heat dissipation structure modules, which are simulated and optimized using simulation software for different field quantities. The antenna architecture is relatively scattered, and the coupling effects of multi-physical field quantities such as force, heat and electricity between modules cannot be analyzed by overall joint simulation. The performance optimization of different physical fields is often in a contradictory state, and independent single field quantity simulation optimization is difficult to obtain the optimal design of overall performance. In addition, due to the high functional density and complex overall structure of the structural and functional integrated phased array antenna, if the overall structure is fully modeled and then directly subjected to multi-physical field joint simulation, the simulation model will be too large and complex, the calculation amount of joint simulation will be too large, and the optimization efficiency will be low. Summary of the invention

[0004] The present invention aims to solve at least one of the problems existing in the prior art.

[0005] To this end, the present invention provides a multi-physical field collaborative simulation and optimization method for a structurally integrated phased array antenna, which can solve the problem of high-efficiency collaborative joint simulation and optimization of a structurally integrated phased array antenna with high functional density under the coupling of multiple physical fields such as force, heat, and electricity, and can also solve the problem of large amount of calculation and low optimization efficiency in the joint simulation of the complete model of the phased array antenna.

[0006] The technical solution of the present invention is:

[0007] A multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function, the specific steps of the method are as follows:

[0008] Step 1: split the overall model of the structure-function integrated phased array antenna into five simulation models, which are respectively a radar cover force simulation model, an electromagnetic simulation model of M antenna subarrays, a chip equivalent spice cascade circuit simulation model, a power division network electromagnetic simulation model, and a full array thermal simulation model, and extract the optimization variables of each simulation model;

[0009] Step 2: Perform electromagnetic simulation on the power division network electromagnetic simulation model, circuit simulation on the chip equivalent spice cascade circuit simulation model, full array thermal simulation on the full array thermal simulation model + force simulation on the antenna cover force simulation model, second circuit simulation on the chip equivalent spice cascade circuit simulation model, and electromagnetic simulation on each antenna subarray electromagnetic simulation model, and carry out collaborative simulation optimization of multi-physics fields such as path-heat-force-electromagnetic.

[0010] Determine whether the parameters output by each simulation model in the entire collaborative simulation optimization process meet the preset requirements. If so, complete the collaborative simulation optimization of multi-physics fields including path, heat, force, and electromagnetic. Otherwise, use the optimization algorithm to adjust the optimization variables of the simulation model of the corresponding module, and repeat step 2 until all indicators are qualified. Complete the collaborative simulation optimization of multi-physics fields including path, heat, force, and electromagnetic.

[0011] Furthermore, the process of carrying out the path-heat-force-electromagnetic multi-physics field collaborative simulation optimization in step 2 is as follows: firstly, electromagnetic simulation is performed on the electromagnetic simulation model of the power division network, and the port amplitude and phase output by the electromagnetic simulation are transmitted to the chip equivalent spice cascade circuit simulation model for circuit simulation, and the heat dissipation power output by the circuit simulation is transmitted to the full array thermal simulation model for full array thermal simulation, and the full array temperature distribution output by the thermal simulation is transmitted to the antenna subarray electromagnetic simulation model, and at the same time, the temperature of each chip output by the thermal simulation is fed back to the chip equivalent spice cascade circuit simulation model for a second circuit simulation, and the amplitude and phase of the output signal power output by the second circuit simulation are transmitted to the antenna subarray electromagnetic simulation model; in addition, the stress deformation output by the force simulation of the antenna cover force simulation model is transmitted to the antenna subarray electromagnetic simulation model;

[0012] The electromagnetic simulation model of each antenna subarray is simulated according to the received temperature distribution and stress deformation of the whole array, and the dielectric constant and loss tangent of the antenna body and antenna cover medium of each subarray area are automatically calculated and modified. After the dielectric constant and loss tangent are updated, the electromagnetic simulation model of each antenna subarray uses the output signal power and phase output by the second circuit simulation as excitation for electromagnetic simulation. The electromagnetic simulation outputs the subarray radiation pattern and the subarray port standing wave ratio; the M subarray radiation patterns are synthesized into the full array radiation pattern, and the transmitting full array EIRP or the receiving full array G / T value is calculated.

[0013] Further, in step 1, the power division network is used to affect the amplitude and phase of the input signal of the radio frequency channel, and an electromagnetic simulation model of a one-point-M power division network is established according to the power division network;

[0014] The radio frequency channel is encapsulated in a multifunctional chip, and the multifunctional chip is divided into a transmitting multifunctional chip and a receiving multifunctional chip. Each transmitting multifunctional chip or receiving multifunctional chip includes P channels. A chip equivalent spice cascade circuit simulation model is established according to the radio frequency channel. The chip equivalent spice cascade circuit simulation model includes a transmitting chip equivalent spice cascade circuit simulation model and a receiving chip equivalent spice cascade circuit simulation model.

[0015] The cold plate is the heat dissipation structure of the phased array antenna and adopts a microfluidic structure. A full array thermal simulation model including the full array chip, antenna cover, antenna body simplified structure, and cold plate is established.

[0016] The radome is the external load of the antenna. Its structural size determines the antenna's bearing strength against external force loads. A radome force simulation model is established.

[0017] The antenna array surface is an array composed of several antenna units arranged at a set spacing, which is used to affect the standing wave ratio and gain pattern of the phased array antenna; the full array of the antenna array is divided into M sub-arrays, each sub-array has P array elements, and a single sub-array is selected to model the antenna sub-array electromagnetic simulation model, and the antenna sub-array electromagnetic simulation model includes a radome structure.

[0018] Furthermore, the power division network structure size parameters, substrate dielectric constant and temperature-dependent characteristic parameters of the power division network electromagnetic simulation model are extracted as a local variable group 1;

[0019] Extract the channel gain and phase shift of the chip equivalent spice cascade circuit simulation model as local variable group 2;

[0020] Extract the size and number of the microchannel structure of the cold plate and the main channel size of the full array thermal simulation model as local variable group three;

[0021] Extracting the radome structural dimension parameters in the radome force simulation model as local variable group four;

[0022] Extract the size parameters of the antenna unit in the antenna subarray electromagnetic simulation model, the dielectric constant of the antenna body and the antenna cover dielectric material, and the characteristic parameters of the loss tangent changing with temperature as the local variable group 5 of the antenna subarray electromagnetic simulation model;

[0023] The local variable group one, the local variable group two, the local variable group three, the local variable group four, and the local variable group five are the optimization variables.

[0024] Furthermore, after the electromagnetic simulation of the power division network electromagnetic simulation model is performed, the amplitude and phase of each port outputted are used as the global variable group 1;

[0025] After the equivalent spice cascade circuit simulation model performs circuit simulation, the heat dissipation power of each chip, the amplitude and phase of the output signal power are output as the global variable group 2;

[0026] After the full array thermal simulation model performs thermal simulation, the outputs of each chip temperature, the full array temperature distribution and the maximum temperature difference of the array surface are used as the global variable group three;

[0027] After the radome force simulation model performs force simulation, the output stress deformation is used as a global variable group four;

[0028] After the antenna subarray electromagnetic simulation model performs electromagnetic simulation, the subarray port standing wave ratio and the subarray directivity diagram outputted are used as global variable group five.

[0029] Furthermore, in step 2, the specific steps for carrying out road-heat-force-electromagnetic multi-physics field collaborative simulation optimization are as follows:

[0030] For a transmit array of size M×P:

[0031] Step 2-1, perform electromagnetic simulation on the electromagnetic simulation model of the one-point M power division network:

[0032] Define the common input power Var_Pin0 as the signal input power of the common port of the one-to-M power division network electromagnetic simulation model, perform electromagnetic simulation on the one-to-M power division network electromagnetic simulation model, and output the global variable group 1 of the M ports by the electromagnetic simulation, and pass the global variable group 1 to the equivalent spice cascade circuit simulation model of the transmitting chip;

[0033] Step 2-2, perform circuit simulation on the transmitter chip equivalent spice cascade circuit simulation model:

[0034] Define room temperature Char_temp0 as the initial operating temperature of the transmitter chip equivalent spice cascade circuit simulation model. The transmitter chip equivalent spice cascade circuit simulation model performs circuit simulation according to the received global variable group 1. Each channel of the circuit simulation outputs the global variable group 2 of each transmitter chip, and passes the global variable group 2 to the full array thermal simulation model.

[0035] Step 2-3, perform thermal simulation on the full array thermal simulation model and perform force simulation on the radome force simulation model:

[0036] ① Input the external heat load to the full array thermal simulation model. The full array thermal simulation model performs full array thermal simulation according to the received external heat load and the heat dissipation power in the global variable group 2 of each transmitting chip. The thermal simulation outputs the global variable group 3, and the global variable group 3 is passed to the antenna subarray electromagnetic simulation model. At the same time, the global variable group 3 is fed back to the transmitting chip equivalent spice cascade circuit simulation model; the transmitting chip equivalent spice cascade circuit simulation model performs circuit simulation again according to the temperature of each chip in the received global variable group 3. The circuit simulation outputs a new round of global variable group 2, and the new round of global variable group 2 is passed to the antenna subarray electromagnetic simulation model.

[0037] ② Input the external force load to the radome force simulation model, the radome force simulation model performs force simulation according to the received external force load, the force simulation outputs global variable group four, and the global variable group four is passed to the antenna subarray electromagnetic simulation model;

[0038] Step 2-4, perform electromagnetic simulation on the electromagnetic simulation models of the M antenna subarrays respectively:

[0039] The antenna subarray electromagnetic simulation model performs simulation based on the received full array temperature distribution of global variable group three and the stress deformation of global variable group four, and automatically calculates and modifies the dielectric constant and loss tangent of the antenna body and radome medium at the current average temperature of each subarray area. Specifically, in order to reduce the amount of simulation calculation, the full array temperature distribution is divided into M areas, and the M areas correspond to the M subarrays one by one, and the size of each area is the same as the area of ​​the subarray at the corresponding position. The average temperature of each area is taken as the subarray operating temperature at the corresponding position. The dielectric constant and loss tangent of the subarray antenna body and radome medium material in different areas are automatically calculated according to the subarray operating temperature in different areas, and the dielectric constant and loss tangent of different areas are substituted into the subarray electromagnetic simulation model of the corresponding area;

[0040] After updating the dielectric constant and loss tangent, the electromagnetic simulation model of each antenna subarray uses the amplitude and phase of the output signal power of the new round of global variable group 2 output in the received circuit simulation as the amplitude and phase of the excitation signal of each port of the subarray, and performs electromagnetic simulation of the subarray port standing wave ratio and antenna gain. The electromagnetic simulation outputs the global variable group 5, i.e., the subarray radiation pattern and the subarray port standing wave ratio; the electromagnetic simulation model of M antenna subarrays outputs M subarray radiation patterns and M subarray port standing wave ratios;

[0041] Step 2-5, combining the amplitude and phase of the excitation signal of each port of the subarray, passing the M subarray patterns to the Matalab array synthesis pattern program for full array pattern synthesis, and calculating the transmit full array EIRP;

[0042] Step 2-6, using the chip temperature and the maximum temperature difference of the array surface of the global variable group 3 output by the whole process above, the standing wave ratio of the M sub-array ports of the global variable group 5, and the calculated EIRP of the entire transmitting array as the qualified criterion of the simulation optimization;

[0043] If the temperature of each chip, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports and the EIRP of the entire transmitting array all meet the preset requirements, the multi-physics field collaborative simulation optimization of path, heat, force and electromagnetic is completed;

[0044] If any of the chip temperatures, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports, and the EIRP of the entire transmitting array do not meet the requirements, the optimization algorithm is used to adjust the parameters in the local variable group of the corresponding module simulation model, and steps 2-1 to 2-6 are repeated to start a new round of collaborative simulation optimization of multi-physics fields such as path, heat, force, and electromagnetics until all indicators are qualified.

[0045] Furthermore, in step 2, the specific steps for carrying out road-heat-force-electromagnetic multi-physics field collaborative simulation optimization are as follows:

[0046] For a receiving array of size M×P:

[0047] Step 2-1, perform electromagnetic simulation on the electromagnetic simulation model of the one-point M power division network:

[0048] The electromagnetic simulation model of the one-to-M power division network is used to perform electromagnetic simulation, and the global variable group one of the M ports is electromagnetically output, and the global variable group one is passed to the equivalent spice cascade circuit simulation model of the receiving chip;

[0049] Step 2-2, perform circuit simulation on the equivalent spice cascade circuit simulation model of the receiving chip:

[0050] Define room temperature Char_temp0 as the initial operating temperature of the receiving chip equivalent spice cascade circuit simulation model. The receiving chip equivalent spice cascade circuit simulation model performs circuit simulation according to the received global variable group 1. Each channel of the circuit simulation outputs the global variable group 2 of each receiving chip, and passes the global variable group 2 to the full array thermal simulation model.

[0051] Step 2-3, perform thermal simulation on the full array thermal simulation model and perform force simulation on the radome force simulation model:

[0052] ① Input the external heat load to the full array thermal simulation model. The full array thermal simulation model performs full array thermal simulation according to the received external heat load and the heat dissipation power in the global variable group 2 of each receiving chip. The thermal simulation outputs the global variable group 3, and the global variable group 3 is passed to the antenna subarray electromagnetic simulation model. At the same time, the global variable group 3 is fed back to the receiving chip equivalent spice cascade circuit simulation model; the receiving chip equivalent spice cascade circuit simulation model performs circuit simulation again according to the temperature of each chip in the received global variable group 3. The circuit simulation outputs a new round of global variable group 2, and the new round of global variable group 2 is passed to the antenna subarray electromagnetic simulation model.

[0053] ② Input the external force load to the radome force simulation model, the radome force simulation model performs force simulation according to the received external force load, the force simulation outputs global variable group four, and the global variable group four is passed to the antenna subarray electromagnetic simulation model;

[0054] Step 2-4, perform electromagnetic simulation on the electromagnetic simulation models of the M antenna subarrays respectively:

[0055] The antenna subarray electromagnetic simulation model performs simulation based on the received full array temperature distribution of global variable group three and the stress deformation of global variable group four, and automatically calculates and modifies the dielectric constant and loss tangent of the antenna body and radome medium at the current average temperature of each subarray area. Specifically, in order to reduce the amount of simulation calculation, the full array temperature distribution is divided into M areas, and the M areas correspond to the M subarrays one by one, and the size of each area is the same as the area of ​​the subarray at the corresponding position. The average temperature of each area is taken as the subarray operating temperature at the corresponding position. The dielectric constant and loss tangent of the subarray antenna body and radome medium material in different areas are automatically calculated according to the subarray operating temperature in different areas, and the dielectric constant and loss tangent of different areas are substituted into the subarray electromagnetic simulation model of the corresponding area;

[0056] After updating the dielectric constant and loss tangent, the electromagnetic simulation model of each antenna subarray uses the amplitude and phase of the output signal power of the new round of global variable group 2 output in the received circuit simulation as the amplitude and phase of the excitation signal of each port of the subarray, and performs electromagnetic simulation of the subarray port standing wave ratio and antenna gain. The electromagnetic simulation outputs the global variable group 5, i.e., the subarray radiation pattern and the subarray port standing wave ratio; the electromagnetic simulation model of M antenna subarrays outputs M subarray radiation patterns and M subarray port standing wave ratios;

[0057] Step 2-5, combining the amplitude and phase of the excitation signal of each port of the subarray, passing the M subarray directional patterns to the Matalab array synthesis directional pattern program for full array directional pattern synthesis, and calculating the G / T value of the receiving full array;

[0058] Step 2-6, using the chip temperature and the maximum temperature difference of the array surface of the global variable group 3 output by the whole process, the standing wave ratio of the M sub-array ports of the global variable group 5, and the calculated G / T value of the receiving array as the qualified criterion of the simulation optimization;

[0059] If the temperature of each chip, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports and the G / T value of the receiving array all meet the preset requirements, the multi-physics field collaborative simulation optimization of path, heat, force and electromagnetic is completed;

[0060] If any of the indicators including the temperature of each chip, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports and the G / T value of the receiving full array do not meet the requirements, the optimization algorithm is used to adjust the parameters in the optimization variables of the corresponding module simulation model, and steps 2-1 to 2-6 are repeated to start a new round of collaborative simulation optimization of multi-physics fields such as path, heat, force and electromagnetic until all indicators are qualified.

[0061] Furthermore, after step 2, the final values ​​of the parameters in the optimization variables of the simulation models of each module and the final performance parameters of the structural and functional integrated phased array antenna are output. The final performance parameters include the temperature of each chip, the temperature distribution of the entire array, the maximum temperature difference of the array surface, the standing wave ratio of the sub-array port, the synthesized full array radiation pattern, the transmitting full array EIPR, and the receiving full array G / T value.

[0062] According to the final values ​​of the parameters in the optimization variables obtained in step three, a three-dimensional model of the optimized structural and functional integrated phased array antenna is established in UG.

[0063] Furthermore, the architecture of the collaborative simulation platform that can realize the multi-physics field collaborative simulation optimization process of the structural and functional integrated phased array antenna includes HFSS, ADS, ANSYS, UG and MATLAB; ADS is used as a circuit performance simulation tool, HFSS is used as a three-dimensional electromagnetic simulation tool, ANSYS is used as a thermal / stress simulation tool, and UG is used as a three-dimensional modeling tool; MATLAB is used as the interaction center of HFSS, ADS, and ANSYS simulation data, and an integrated platform is built that can call UG, HFSS, ADS, and Ansys for automatic model parameter transfer and simulation optimization iteration.

[0064] Furthermore, when the optimization algorithm is used to adjust the parameters in the optimization variables of the corresponding module simulation model in step 2, the optimization algorithm includes a genetic algorithm GA and an fmincon algorithm; and the genetic algorithm GA and the fmincon algorithm are integrated with the simulation software.

[0065] By applying the above technical solution, the present invention has the following beneficial effects:

[0066] (1) The present invention proposes a multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function. The method extracts the key influencing factors between the functional modules of the phased array antenna, splits the key components, simplifies the model, and designs an efficient equivalent simulation method. The method can perform path-heat-force-electromagnetic multi-physics field collaborative simulation optimization on each module of the phased array antenna on the same platform, efficiently analyze the mutual influence between the modules of the phased array antenna, and comprehensively consider the optimal design under the multi-physics field coupling effect of the phased array antenna, thereby greatly improving the efficiency of multi-physics field joint simulation optimization and enhancing the robustness of the design of the phased array antenna with integrated structure and function.

[0067] (2) The present invention decomposes the complete structural model of the complex structural and functional integrated phased array antenna into modules, comprehensively considers the key influencing factors of the overall performance indicators of the antenna, constructs five key component models suitable for efficient collaborative simulation of multi-physical fields, extracts key local variables and global variables, simplifies the multi-physical field coupling mechanism between modules, and effectively improves the overall efficiency of the multi-physical field collaborative simulation optimization closed-loop process.

[0068] (3) In order to solve the problem of large amount of calculation and low efficiency in full array pattern simulation considering thermal effects, the present invention adopts a uniformly divided subarray model in the electromagnetic simulation of the antenna array surface, takes the average temperature of each subarray area of ​​the array surface calculated by thermal simulation, extracts the dielectric constant and loss tangent of the dielectric material at the current temperature, simulates the pattern of each subarray at the current temperature, and then performs full array beam synthesis. This can effectively examine the impact of uneven temperature distribution on the array surface on the array synthesis pattern and effectively reduce the amount of simulation calculation. For the simulation calculation of the full array pattern under the influence of thermal effects, the present invention shortens the simulation time by more than 85% compared with direct simulation calculation.

[0069] (4) The present invention comprehensively considers the multi-physical field coupling effects of the structure-function integrated phased array antenna, and uses MATLAB to develop a multi-physical field collaborative simulation platform that can call simulation software to transfer multi-physical field simulation variables, thereby realizing a one-click simulation function under the influence of the path, heat, force, and electromagnetic multi-physical field coupling of the complex structure-function integrated phased array antenna.

[0070] (5) The present invention utilizes genetic algorithm GA and fmincon optimization algorithm to perform multi-objective optimization on key indicators such as standing wave ratio, G / T, EIRP, chip temperature, and array surface temperature difference of phased array antenna, thereby realizing multi-objective automatic optimization of the overall performance of the structure-function integrated phased array antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0071] The included drawings are used to provide a further understanding of the embodiments of the present invention, which constitute a part of the specification, are used to illustrate the embodiments of the present invention, and together with the text description, explain the principles of the present invention. Obviously, the drawings in the following description are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0072] Figure 1 A diagram of a multi-physics field collaborative simulation optimization method of the present invention;

[0073] Figure 2 Input interface for multiphysics simulation;

[0074] Figure 3 One-click simulation output interface for receiving antenna array;

[0075] Figure 4 Set up interface for multi-objective optimization;

[0076] Figure 5 It is the parameter diagram of the local variable group 5 of the antenna subarray electromagnetic simulation model;

[0077] Figure 6 This is the receiving subarray gain result curve before optimization;

[0078] Figure 7 This is the curve diagram of the receiving subarray gain result after optimization;

[0079] Figure 8 This is a curve diagram of the synthetic gain result of the receiving array before optimization;

[0080] Fig. 9 This is a curve diagram of the synthetic gain result of the whole array after optimization;

[0081] Fig.10 This is the S11 diagram before optimization;

[0082] Fig.11 This is the optimized S11 graph;

[0083] Fig.12 It is the parameter diagram of the local variable group 3 of the full array thermal simulation model;

[0084] Fig.13 The simulation results of the array surface temperature of the phased array antenna before optimization, (a) temperature distribution, (b) the lowest temperature data on the array surface;

[0085] Fig.14 The simulation results of the array surface temperature of the optimized phased array antenna include (a) temperature distribution and (b) the lowest temperature data on the array surface. DETAILED DESCRIPTION

[0086] It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0087] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0088] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0089] Embodiment 1:

[0090] This embodiment provides a multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function. The specific steps of the method are as follows:

[0091] Step 1: Decompose the key component models of the structural and functional integrated phased array antenna and extract the optimization variables:

[0092] The structural and functional integrated phased array antenna is mainly composed of a radome, an antenna array surface, a radio frequency channel, a power division network, a cold plate and a wave control board. Its main performance indicators are affected by five parts: the radome, the antenna array surface, the radio frequency channel, the power division network and the cold plate. Therefore, according to the performance indicators of the antenna, the overall model of the antenna is divided into a radome force simulation model, an antenna subarray electromagnetic simulation model, a chip equivalent spice cascade circuit simulation model, a power division network electromagnetic simulation model and a full array thermal simulation model.

[0093] The power division network mainly affects the amplitude and phase of the input signal of the RF channel. A one-to-M power division network electromagnetic simulation model is established based on the power division network. The power division network structure size parameters, substrate dielectric constant and temperature-dependent characteristic parameters of the power division network electromagnetic simulation model are extracted as a local variable group one. The port amplitude, phase and return loss output of each port (i.e., M ports) simulated by the power division network electromagnetic simulation model are extracted as a global variable group one.

[0094] The radio frequency channel is encapsulated in a multifunctional chip, and the multifunctional chip is divided into a transmitting multifunctional chip and a receiving multifunctional chip. Each transmitting multifunctional chip or receiving multifunctional chip contains P channels. A chip equivalent spice cascade circuit simulation model is established according to the radio frequency channel. The chip equivalent spice cascade circuit simulation model includes a transmitting chip equivalent spice cascade circuit simulation model and a receiving chip equivalent spice cascade circuit simulation model. The channel gain and phase shift phase of the chip equivalent spice cascade circuit simulation model are extracted as a local variable group 2, and the heat dissipation power of each chip output by the equivalent spice cascade circuit simulation model, the amplitude of the output signal power, and the phase are extracted as a global variable group 2.

[0095] The cold plate is the heat dissipation component of the phased array antenna and adopts a microfluidic structure. A full array thermal simulation model including the full array chip, antenna cover and simplified antenna body structure, and cold plate is established. The size and number of the microfluidic structure of the cold plate of the full array thermal simulation model and the size of the main channel are extracted as the local variable group three, and the temperature of each chip, the temperature distribution of the entire array and the maximum temperature difference of the array surface are the global variable group three.

[0096] The radome serves as the external load-bearing device of the antenna, and its structural dimensions determine the bearing strength of the antenna against external force loads. A radome force simulation model is established, and the radome structural dimension parameters in the radome force simulation model are extracted as local variable group four, and the stress deformation output by the radome force simulation model becomes global variable group four.

[0097] The antenna array surface is an array composed of several antenna units arranged at a certain interval, which mainly affects the standing wave ratio and gain radiation pattern of the phased array antenna; the full-array full-wave electromagnetic simulation of a large-scale antenna array has too much calculation amount and low simulation efficiency. Therefore, in this embodiment, the full array of the antenna array is divided into M sub-arrays, each sub-array has P array elements, and the M sub-arrays are simulated separately first, and the sub-array radiation patterns of each sub-array are simulated and output, and the electric field distribution of each sub-array is extracted (for calculating the synthetic radiation pattern), and then all the sub-array radiation patterns are rotated and superimposed and synthesized according to the sub-array position coordinates; in this embodiment, a single sub-array is selected to model the antenna sub-array electromagnetic simulation model, and the antenna sub-array electromagnetic simulation model includes a radome structure, and the size parameters of the antenna unit in the antenna sub-array electromagnetic simulation model, the dielectric constant of the antenna body and the radome dielectric material, and the characteristic parameters of the loss tangent changing with temperature are extracted as the local variable group five of the antenna sub-array electromagnetic simulation model, and the sub-array port standing wave ratio and sub-array radiation pattern output by the antenna sub-array electromagnetic simulation model are the global variable group five.

[0098] Among them, the local variable group one, the local variable group two, the local variable group three, the local variable group four, and the local variable group five are optimization variables.

[0099] Step 2, see attached Figure 1 , carry out road-heat-force-electromagnetic multi-physics field collaborative simulation optimization, determine the coupling mechanism, and the specific steps of collaborative simulation optimization are:

[0100] For the transmitting array (size M×P):

[0101] Step 2-1, perform electromagnetic simulation on the electromagnetic simulation model of the one-point M power division network:

[0102] Define the common input power Var_Pin0 as the signal input power of the common port of the one-to-M power division network electromagnetic simulation model, perform electromagnetic simulation on the one-to-M power division network electromagnetic simulation model, and output the global variable group 1 of the M ports by the electromagnetic simulation, and pass the global variable group 1 to the equivalent spice cascade circuit simulation model of the transmitting chip;

[0103] Step 2-2, perform circuit simulation on the transmitter chip equivalent spice cascade circuit simulation model:

[0104] Define room temperature Char_temp0 as the initial operating temperature of the transmitter chip equivalent spice cascade circuit simulation model. The transmitter chip equivalent spice cascade circuit simulation model performs circuit simulation according to the received global variable group 1. Each channel of the circuit simulation outputs the global variable group 2 of each transmitter chip, and passes the global variable group 2 to the full array thermal simulation model.

[0105] Step 2-3, perform thermal simulation on the full array thermal simulation model and perform force simulation on the radome force simulation model:

[0106] ① Input the external heat load to the full array thermal simulation model. The full array thermal simulation model performs full array thermal simulation according to the received external heat load and the heat dissipation power in the global variable group 2 of each transmitting chip. The thermal simulation outputs the global variable group 3, and the full array temperature distribution in the global variable group 3 is passed to the antenna subarray electromagnetic simulation model. At the same time, the global variable group 3 is fed back to the transmitting chip equivalent spice cascade circuit simulation model; the transmitting chip equivalent spice cascade circuit simulation model performs circuit simulation again according to the temperature of each chip in the received global variable group 3. The circuit simulation outputs a new round of global variable group 2, and the new round of global variable group 2 is passed to the antenna subarray electromagnetic simulation model.

[0107] ② Input the external force load to the radome force simulation model, the radome force simulation model performs force simulation according to the received external force load, the force simulation outputs global variable group four, and the global variable group four is passed to the antenna subarray electromagnetic simulation model;

[0108] Step 2-4, perform electromagnetic simulation on the electromagnetic simulation models of the M antenna subarrays respectively:

[0109] The antenna subarray electromagnetic simulation model performs simulation based on the received full array temperature distribution of global variable group three and the stress deformation of global variable group four, and automatically calculates and modifies the dielectric constant and loss tangent of the antenna body and radome medium at the current average temperature of each subarray area. Specifically, in order to reduce the amount of simulation calculation, the full array temperature distribution is divided into M areas, and the M areas correspond to the M subarrays one by one, and the size of each area is the same as the area of ​​the subarray at the corresponding position. The average temperature of each area is taken as the subarray operating temperature at the corresponding position. The dielectric constant and loss tangent of the subarray antenna body and radome medium material in different areas are automatically calculated according to the subarray operating temperature in different areas, and the dielectric constant and loss tangent of different areas are substituted into the subarray electromagnetic simulation model of the corresponding area;

[0110] After updating the dielectric constant and loss tangent, the electromagnetic simulation model of each antenna subarray uses the amplitude and phase of the output signal power of the new round of global variable group 2 output in the received circuit simulation as the amplitude and phase of the excitation signal of each port of the subarray, and performs electromagnetic simulation of the subarray port standing wave ratio and antenna gain. The electromagnetic simulation outputs the global variable group 5, i.e., the subarray radiation pattern and the subarray port standing wave ratio; the electromagnetic simulation model of M antenna subarrays outputs M subarray radiation patterns and M subarray port standing wave ratios;

[0111] Step 2-5, combining the amplitude and phase of the excitation signal of each port of the subarray, passing the M subarray patterns to the Matalab array synthesis pattern program for full array pattern synthesis, and calculating the EIRP (equivalent isotropic radiated power) of the transmitting full array;

[0112] Step 2-6, using the chip temperature and the maximum temperature difference of the array surface of the global variable group 3 output by the whole process above, the standing wave ratio of the M sub-array ports of the global variable group 5, and the calculated EIRP of the entire transmitting array as the qualified criterion of the simulation optimization;

[0113] If the temperature of each chip, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports and the EIRP of the entire transmitting array all meet the preset requirements, the multi-physics field collaborative simulation optimization of path, heat, force and electromagnetic is completed;

[0114] If any of the chip temperatures, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports, and the EIRP of the entire transmitting array do not meet the requirements, the optimization algorithm is used to adjust the parameters in the local variable group of the corresponding module simulation model (this process is a prior art and will not be described in detail here), and steps 2-1 to 2-6 are repeated to start a new round of collaborative simulation optimization of multi-physics fields such as path, heat, force, and electromagnetics until all indicators are qualified.

[0115] For the receiving array (size M×P):

[0116] Step 2-1, perform electromagnetic simulation on the electromagnetic simulation model of the one-point M power division network:

[0117] The electromagnetic simulation model of the one-to-M power division network is used to perform electromagnetic simulation, and the global variable group one of the M ports is electromagnetically output, and the global variable group one is passed to the equivalent spice cascade circuit simulation model of the receiving chip;

[0118] Step 2-2, perform circuit simulation on the equivalent spice cascade circuit simulation model of the receiving chip:

[0119] Define room temperature Char_temp0 as the initial operating temperature of the receiving chip equivalent spice cascade circuit simulation model. The receiving chip equivalent spice cascade circuit simulation model performs circuit simulation according to the received global variable group 1. Each channel of the circuit simulation outputs the global variable group 2 of each receiving chip, and passes the global variable group 2 to the full array thermal simulation model.

[0120] Step 2-3, perform thermal simulation on the full array thermal simulation model and perform force simulation on the radome force simulation model:

[0121] ① Input the external heat load to the full array thermal simulation model. The full array thermal simulation model performs full array thermal simulation according to the received external heat load and the heat dissipation power in the global variable group 2 of each receiving chip. The thermal simulation outputs the global variable group 3, and the full array temperature distribution in the global variable group 3 is passed to the antenna subarray electromagnetic simulation model. At the same time, the global variable group 3 is fed back to the receiving chip equivalent spice cascade circuit simulation model; the receiving chip equivalent spice cascade circuit simulation model performs circuit simulation again according to the temperature of each chip in the received global variable group 3. The circuit simulation outputs a new round of global variable group 2, and the new round of global variable group 2 is passed to the antenna subarray electromagnetic simulation model.

[0122] ② Input the external force load to the radome force simulation model, the radome force simulation model performs force simulation according to the received external force load, the force simulation outputs global variable group four, and the global variable group four is passed to the antenna subarray electromagnetic simulation model;

[0123] Step 2-4, perform electromagnetic simulation on the electromagnetic simulation models of the M antenna subarrays respectively:

[0124] The antenna subarray electromagnetic simulation model performs simulation based on the received full array temperature distribution of global variable group three and the stress deformation of global variable group four, and automatically calculates and modifies the dielectric constant and loss tangent of the antenna body and radome medium at the current average temperature of each subarray area. Specifically, in order to reduce the amount of simulation calculation, the full array temperature distribution is divided into M areas, and the M areas correspond to the M subarrays one by one, and the size of each area is the same as the area of ​​the subarray at the corresponding position. The average temperature of each area is taken as the subarray operating temperature at the corresponding position. The dielectric constant and loss tangent of the subarray antenna body and radome medium material in different areas are automatically calculated according to the subarray operating temperature in different areas, and the dielectric constant and loss tangent of different areas are substituted into the subarray electromagnetic simulation model of the corresponding area;

[0125] After updating the dielectric constant and loss tangent, the electromagnetic simulation model of each antenna subarray uses the amplitude and phase of the output signal power of the new round of global variable group 2 output in the received circuit simulation as the amplitude and phase of the excitation signal of each port of the subarray, and performs electromagnetic simulation of the subarray port standing wave ratio and antenna gain. The electromagnetic simulation outputs the global variable group 5, i.e., the subarray radiation pattern and the subarray port standing wave ratio; the electromagnetic simulation model of M antenna subarrays outputs M subarray radiation patterns and M subarray port standing wave ratios;

[0126] Step 2-5, combining the amplitude and phase of the excitation signal of each port of the subarray, passing the M subarray directional patterns to the Matalab array synthesis directional pattern program for full array directional pattern synthesis, and calculating the G / T value of the receiving full array;

[0127] Step 2-6, using the chip temperature and the maximum temperature difference of the array surface of the global variable group 3 output by the whole process, the standing wave ratio of the M sub-array ports of the global variable group 5, and the calculated G / T value of the receiving array as the qualified criterion of the simulation optimization;

[0128] If the temperature of each chip, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports and the G / T value of the receiving array all meet the preset requirements, the multi-physics field collaborative simulation optimization of path, heat, force and electromagnetic is completed;

[0129] If any of the chip temperatures, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports, and the G / T value of the receiving full array do not meet the requirements, the optimization algorithm is used to adjust the parameters in the optimization variables of the corresponding module simulation model (i.e., the antenna cover force simulation model, the antenna sub-array electromagnetic simulation model, the chip equivalent spice cascade circuit simulation model, the power division network electromagnetic simulation model, and the full array thermal simulation model) (this process is a prior art and will not be described in detail here), and steps 2-1 to 2-6 are repeated to start a new round of path, heat, force, and electromagnetic multi-physics field collaborative simulation optimization until all indicators are qualified.

[0130] Step 3: Output the variable values ​​of each module and the overall performance parameters of the antenna:

[0131] When all indicators are qualified, it means that the collaborative simulation optimization of multi-physics fields such as path, heat, force, and electromagnetic is completed, and the final values ​​of the parameters in the optimization variables of each module simulation model (that is, the parameters of the local variable group) and the final performance parameters of the structural and functional integrated phased array antenna are output. The final performance parameters include the temperature of each chip, the temperature distribution of the entire array, the maximum temperature difference of the array surface, the standing wave ratio of the sub-array port, the synthesized full array radiation pattern, the EIPR of the transmitting full array, and the G / T value of the receiving full array.

[0132] Step 4: Based on the final values ​​of the parameters of the local variable group obtained in step 3, a three-dimensional model of the optimized structural and functional integrated phased array antenna is established in UG to facilitate subsequent production.

[0133] Based on the above steps 1 to 4, in order to realize the multi-physics collaborative simulation optimization process of the structure-function integrated phased array antenna, it is necessary to develop a collaborative simulation platform. The specific architecture of the platform consists of five parts: HFSS, ADS, ANSYS, UG and MATLAB. ADS is used as a circuit performance simulation tool, HFSS is used as a three-dimensional electromagnetic simulation tool, ANSYS is used as a thermal / stress simulation tool, and UG is used as a three-dimensional modeling tool; HFSS, ADS, ANSYS, and UG are all EDA software; MATLAB is used as the interaction center of the simulation data of each EDA software, and an integrated platform is built that can call UG, HFSS, ADS, and Ansys for automatic model parameter transfer and simulation optimization iteration.

[0134] By developing interfaces between various physical field simulation software (i.e. HFSS, ADS, ANSYS) and the data interaction center MATLAB and conducting secondary development of the API (application software interface program) of existing EDA software, simulation software of different physical fields are integrated together. To ensure that the data interaction between different software during the simulation process is seamless, script programs are developed to ensure data transmission, processing and synchronization between different simulation software, and to achieve automated simulation (this process is a prior art and will not be elaborated on here).

[0135] Among them, when the optimization algorithm is used to adjust the parameters in the optimization variables of the corresponding module simulation model in step 2, the optimization algorithm includes a genetic algorithm GA and an fmincon algorithm; the genetic algorithm GA and the fmincon algorithm are integrated with the simulation software to achieve multi-objective automatic optimization of the overall performance of the structural and functional integrated phased array antenna.

[0136] Embodiment 2:

[0137] Based on Example 1, this embodiment takes the receiving antenna array as an example, and the simulation optimization process is as follows:

[0138] The first step is to input the initial parameters of the optimization variables of each module simulation model and set the optimization interval of each parameter of the optimization variable; secondly, perform simulation settings for each physical field. Electromagnetic simulation includes initial temperature, simulation frequency, maximum number of grid divisions, convergence judgment conditions, array size, etc. Circuit simulation includes amplifier voltage, initial amplitude of input power, etc. Force simulation includes grid division size, number of simulation iterations, water inlet temperature and ambient temperature, etc. The specific settings are as follows: Figure 2 shown.

[0139] The second step is to perform electromagnetic simulation on the electromagnetic simulation model of the power division network, transfer the S parameter amplitude and phase matrix output by the electromagnetic simulation to the equivalent spice cascade circuit simulation model of the receiving chip for circuit simulation, and transfer the heat dissipation power output by the circuit simulation to the full array thermal simulation model for full array thermal simulation to obtain the temperature of each chip, the temperature distribution of the entire array, and the maximum temperature difference of the array surface; the obtained temperature of each chip is transmitted to the electromagnetic simulation model of the antenna subarray, and at the same time transmitted back to the equivalent spice cascade circuit simulation model of the receiving chip for a second circuit simulation, and the output signal power and phase obtained by the second circuit simulation are output to the electromagnetic simulation model of the antenna subarray; the antenna cover force simulation model performs force simulation, and the stress deformation output by the force simulation is transmitted to the electromagnetic simulation model of the antenna subarray;

[0140] The antenna subarray electromagnetic simulation model simulates the antenna deformation based on the received full array temperature distribution and stress deformation, automatically calculates and modifies the dielectric constant and loss tangent of the antenna body and radome medium at the current average temperature of each subarray area, and uses the new round of output signal power and phase output in the circuit simulation as excitation to perform electromagnetic simulation of each antenna subarray. Finally, the output radiation patterns of each subarray are synthesized into the full array radiation pattern in MATLAB, and the results are post-processed in MATLAB to output the G / T value of the received full array.

[0141] All simulation output results are as follows Figure 3 As shown, sub-array S11, sub-array S21, two-dimensional H-plane radiation pattern, two-dimensional E-plane radiation pattern, synthetic radiation pattern and G / T value of the whole array are the output results of electromagnetic simulation, the temperature distribution diagram of the whole array and the stress deformation distribution diagram are the output results of thermal simulation and force simulation, and the heat dissipation power, output signal power and phase of each chip are the output results of circuit simulation.

[0142] The third step is to determine whether the temperature of each chip, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports and the G / T value of the entire receiving array meet the preset requirements. If the temperature of each chip, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports and the G / T value of the entire receiving array meet the preset requirements, the multi-physics field collaborative simulation optimization of path, heat, force and electromagnetic is completed;

[0143] If any of the indicators including the temperature of each chip, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports and the G / T value of the receiving full array do not meet the requirements, the optimization algorithm is used to adjust the parameters in the optimization variables of the corresponding module simulation model, that is, the parameters in the optimization variables of the phased array antenna are optimized by multiple objectives. The optimization settings are as follows: Figure 4 As shown;

[0144] Taking the electromagnetic simulation optimization related data in the multi-physics field collaborative optimization process of phased array antenna as an example, the patch antenna size, feed point position, and matching line size in local variable group 5 are selected as the parameters of the optimization variables, such as Figure 5 As shown in the figure, the sub-array gain, the whole array synthesis pattern and S11 simulation results before and after optimization are shown in the figure. Figure 6-11 ( Figure 6-11 The vertical axis is the gain (unit: dB): From the comparison of the simulation results before and after optimization, it can be seen that after optimization by the multi-physics field simulation optimization platform, the gain is increased from 9.35dB to 9.56dB, S11 is optimized from -14.6dB to -25.4dB, G / T value is increased from -16.27dB / K to -16.06dB / K, and the gain of the entire array is increased from 20.28dB to 20.45dB.

[0145] For the thermal simulation in the multi-physics field collaborative optimization process of phased array antenna, the microchannel width, microchannel height, number of microchannels, main channel width, and main channel height in the local variable group 3 are selected as the parameters of the optimization variables, such as Fig.12 As shown; the simulation results of the temperature distribution of the entire array before and after optimization are shown in Figure 13-14 As shown in the figure, from the comparison of simulation results before and after optimization, it can be seen that due to the small heat dissipation power of the actual chip (only 0.5W), the original cold plate has a strong heat dissipation capacity, with only a 5°C temperature rise under an external ambient temperature of 60°C. However, after optimization by the multi-physics field simulation optimization platform, the maximum temperature of the phased array antenna during operation is further reduced from 65.30°C to 65.11°C, and the array surface temperature difference is also reduced from 0.51°C to 0.42°C, making the temperature distribution more uniform.

[0146] In summary, the overall performance indicators of the phased array antenna can be improved after platform optimization. It can be seen that the platform can realize multi-physical field collaborative optimization for the phased array antenna.

[0147] Regarding simulation efficiency, taking a computer with 768GB memory and Intel(R)Xeon(R)Platinum 8269CY CPU@2.50GHz2.49GHz (2 processors) as an example, full-array full-wave electromagnetic simulation of a 128-element antenna taking into account thermal effects takes about 72 hours. Simulation using partitioned sub-array synthesis takes about 11 hours, with an efficiency improvement of 85%. The larger the array, the more significant the improvement.

[0148] Although the invention is described on the basis of the above embodiments, the invention is not limited thereto, and a person with background knowledge in the relevant field can make various modifications on this basis. For example, based on different phased array antenna forms, changing each physical field simulation model, setting different local variable group parameters, embedding different optimization algorithms, etc., these modifications and other ideas that conform to the invention should all fall within the scope of protection of the invention.

[0149] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0150] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0151] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function, characterized in that: The specific steps of this method are as follows: Step 1: split the overall model of the structure-function integrated phased array antenna into five simulation models, which are respectively a radar cover force simulation model, an electromagnetic simulation model of M antenna subarrays, a chip equivalent spice cascade circuit simulation model, a power division network electromagnetic simulation model, and a full array thermal simulation model, and extract the optimization variables of each simulation model; Step 2: Perform electromagnetic simulation on the power division network electromagnetic simulation model, circuit simulation on the chip equivalent spice cascade circuit simulation model, full array thermal simulation on the full array thermal simulation model + force simulation on the antenna cover force simulation model, second circuit simulation on the chip equivalent spice cascade circuit simulation model, and electromagnetic simulation on each antenna subarray electromagnetic simulation model, and carry out collaborative simulation optimization of multi-physics fields such as path-heat-force-electromagnetic. Determine whether the parameters output by each simulation model in the entire collaborative simulation optimization process meet the preset requirements. If so, complete the collaborative simulation optimization of multi-physics fields including path, heat, force, and electromagnetic. Otherwise, use the optimization algorithm to adjust the optimization variables of the simulation model of the corresponding module, and repeat step 2 until all indicators are qualified. Complete the collaborative simulation optimization of multi-physics fields including path, heat, force, and electromagnetic.

2. The multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function as claimed in claim 1, characterized in that: The process of carrying out the road-heat-force-electromagnetic multi-physics field collaborative simulation optimization in step two is as follows: first, electromagnetic simulation is performed on the electromagnetic simulation model of the power division network, and the port amplitude and phase output by the electromagnetic simulation are transmitted to the chip equivalent spice cascade circuit simulation model for circuit simulation, and the heat dissipation power output by the circuit simulation is transmitted to the full array thermal simulation model for full array thermal simulation, and the full array temperature distribution output by the thermal simulation is transmitted to the antenna subarray electromagnetic simulation model, and at the same time, the temperature of each chip output by the thermal simulation is fed back to the chip equivalent spice cascade circuit simulation model for a second circuit simulation, and the amplitude and phase of the output signal power output by the second circuit simulation are transmitted to the antenna subarray electromagnetic simulation model; in addition, the antenna cover force simulation model performs force simulation and outputs the stress deformation to the antenna subarray electromagnetic simulation model; The electromagnetic simulation model of each antenna subarray is simulated according to the received temperature distribution and stress deformation of the whole array, and the dielectric constant and loss tangent of the antenna body and antenna cover medium of each subarray area are automatically calculated and modified. After the dielectric constant and loss tangent are updated, the electromagnetic simulation model of each antenna subarray uses the output signal power and phase output by the second circuit simulation as excitation for electromagnetic simulation. The electromagnetic simulation outputs the subarray radiation pattern and the subarray port standing wave ratio; the M subarray radiation patterns are synthesized into the full array radiation pattern, and the transmitting full array EIRP or the receiving full array G / T value is calculated.

3. The multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function as claimed in claim 1, characterized in that: In step 1, the power division network is used to affect the amplitude and phase of the input signal of the radio frequency channel, and an electromagnetic simulation model of a one-point-M power division network is established according to the power division network; The radio frequency channel is encapsulated in a multifunctional chip, and the multifunctional chip is divided into a transmitting multifunctional chip and a receiving multifunctional chip. Each transmitting multifunctional chip or receiving multifunctional chip includes P channels. A chip equivalent spice cascade circuit simulation model is established according to the radio frequency channel. The chip equivalent spice cascade circuit simulation model includes a transmitting chip equivalent spice cascade circuit simulation model and a receiving chip equivalent spice cascade circuit simulation model. The cold plate is the heat dissipation structure of the phased array antenna and adopts a microfluidic structure. A full array thermal simulation model including the full array chip, antenna cover, antenna body simplified structure, and cold plate is established. The radome is the external load of the antenna. Its structural size determines the antenna's bearing strength against external force loads. A radome force simulation model is established. The antenna array surface is an array composed of several antenna units arranged at a set spacing, which is used to affect the standing wave ratio and gain pattern of the phased array antenna; the full array of the antenna array is divided into M sub-arrays, each sub-array has P array elements, and a single sub-array is selected to model the antenna sub-array electromagnetic simulation model, and the antenna sub-array electromagnetic simulation model includes a radome structure.

4. The multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function as claimed in claim 3, characterized in that: Extract the power division network structure size parameters, substrate dielectric constant and loss tangent characteristic parameters of the power division network electromagnetic simulation model as local variable group 1; Extract the channel gain and phase shift of the chip equivalent spice cascade circuit simulation model as local variable group 2; Extract the size and number of the microchannel structure of the cold plate and the main channel size of the full array thermal simulation model as local variable group three; Extracting the radome structural dimension parameters in the radome force simulation model as local variable group four; Extract the size parameters of the antenna unit in the antenna subarray electromagnetic simulation model, the dielectric constant of the antenna body and the antenna cover dielectric material, and the characteristic parameters of the loss tangent changing with temperature as the local variable group 5 of the antenna subarray electromagnetic simulation model; The local variable group one, the local variable group two, the local variable group three, the local variable group four, and the local variable group five are the optimization variables.

5. The multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function as claimed in claim 4, characterized in that: After the electromagnetic simulation of the power division network electromagnetic simulation model is performed, the amplitude and phase of each port outputted are used as the global variable group 1; After the equivalent spice cascade circuit simulation model performs circuit simulation, the heat dissipation power of each chip, the amplitude and phase of the output signal power are output as the global variable group 2; After the full array thermal simulation model performs thermal simulation, the outputs of each chip temperature, the full array temperature distribution and the maximum temperature difference of the array surface are used as the global variable group three; After the radome force simulation model performs force simulation, the output stress deformation is used as a global variable group four; After the antenna subarray electromagnetic simulation model performs electromagnetic simulation, the subarray port standing wave ratio and the subarray directivity diagram outputted are used as global variable group five.

6. The multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function as claimed in claim 5, characterized in that: In step 2, the specific steps for carrying out road-heat-force-electromagnetic multi-physics field collaborative simulation optimization are as follows: For a transmit array of size M×P: Step 2-1, perform electromagnetic simulation on the electromagnetic simulation model of the one-point M power division network: Define the common input power Var_Pin0 as the signal input power of the common port of the one-to-M power division network electromagnetic simulation model, perform electromagnetic simulation on the one-to-M power division network electromagnetic simulation model, and output the global variable group 1 of the M ports by the electromagnetic simulation, and pass the global variable group 1 to the equivalent spice cascade circuit simulation model of the transmitting chip; Step 2-2, perform circuit simulation on the transmitter chip equivalent spice cascade circuit simulation model: Define room temperature Char_temp0 as the initial operating temperature of the transmitter chip equivalent spice cascade circuit simulation model. The transmitter chip equivalent spice cascade circuit simulation model performs circuit simulation according to the received global variable group 1. Each channel of the circuit simulation outputs the global variable group 2 of each transmitter chip, and passes the global variable group 2 to the full array thermal simulation model. Step 2-3, perform thermal simulation on the full array thermal simulation model and perform force simulation on the radome force simulation model: ① Input the external heat load to the full array thermal simulation model. The full array thermal simulation model performs full array thermal simulation according to the received external heat load and the heat dissipation power in the global variable group 2 of each transmitting chip. The thermal simulation outputs the global variable group 3, and the global variable group 3 is passed to the antenna subarray electromagnetic simulation model. At the same time, the global variable group 3 is fed back to the transmitting chip equivalent spice cascade circuit simulation model; the transmitting chip equivalent spice cascade circuit simulation model performs circuit simulation again according to the temperature of each chip in the received global variable group 3. The circuit simulation outputs a new round of global variable group 2, and the new round of global variable group 2 is passed to the antenna subarray electromagnetic simulation model. ② Input the external force load to the radome force simulation model, the radome force simulation model performs force simulation according to the received external force load, the force simulation outputs global variable group four, and the global variable group four is passed to the antenna subarray electromagnetic simulation model; Step 2-4, perform electromagnetic simulation on the electromagnetic simulation models of the M antenna subarrays respectively: The antenna subarray electromagnetic simulation model performs simulation based on the received full array temperature distribution of global variable group three and the stress deformation of global variable group four, and automatically calculates and modifies the dielectric constant and loss tangent of the antenna body and radome medium at the current average temperature of each subarray area. Specifically, in order to reduce the amount of simulation calculation, the full array temperature distribution is divided into M areas, and the M areas correspond to the M subarrays one by one, and the size of each area is the same as the area of ​​the subarray at the corresponding position. The average temperature of each area is taken as the subarray operating temperature at the corresponding position. The dielectric constant and loss tangent of the subarray antenna body and radome medium material in different areas are automatically calculated according to the subarray operating temperature in different areas, and the dielectric constant and loss tangent of different areas are substituted into the subarray electromagnetic simulation model of the corresponding area; After updating the dielectric constant and loss tangent, the electromagnetic simulation model of each antenna subarray uses the amplitude and phase of the output signal power of the new round of global variable group 2 output in the received circuit simulation as the amplitude and phase of the excitation signal of each port of the subarray, and performs electromagnetic simulation of the subarray port standing wave ratio and antenna gain. The electromagnetic simulation outputs the global variable group 5, i.e., the subarray radiation pattern and the subarray port standing wave ratio; the electromagnetic simulation model of M antenna subarrays outputs M subarray radiation patterns and M subarray port standing wave ratios; Step 2-5, combining the amplitude and phase of the excitation signal of each port of the subarray, passing the M subarray patterns to the Matalab array synthesis pattern program for full array pattern synthesis, and calculating the transmit full array EIRP; Step 2-6, using the chip temperature and the maximum temperature difference of the array surface of the global variable group 3 output by the whole process above, the standing wave ratio of the M sub-array ports of the global variable group 5, and the calculated EIRP of the entire transmitting array as the qualified criterion of the simulation optimization; If the temperature of each chip, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports and the EIRP of the entire transmitting array all meet the preset requirements, the multi-physics field collaborative simulation optimization of path, heat, force and electromagnetic is completed; If any of the chip temperatures, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports, and the EIRP of the entire transmitting array do not meet the requirements, the optimization algorithm is used to adjust the parameters in the local variable group of the corresponding module simulation model, and steps 2-1 to 2-6 are repeated to start a new round of collaborative simulation optimization of multi-physics fields such as path, heat, force, and electromagnetics until all indicators are qualified.

7. The multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function as claimed in claim 5, characterized in that: In step 2, the specific steps for carrying out road-heat-force-electromagnetic multi-physics field collaborative simulation optimization are as follows: For a receiving array of size M×P: Step 2-1, perform electromagnetic simulation on the electromagnetic simulation model of the one-point M power division network: The electromagnetic simulation model of the one-to-M power division network is used to perform electromagnetic simulation, and the global variable group one of the M ports is electromagnetically output, and the global variable group one is passed to the equivalent spice cascade circuit simulation model of the receiving chip; Step 2-2, perform circuit simulation on the equivalent spice cascade circuit simulation model of the receiving chip: Define room temperature Char_temp0 as the initial operating temperature of the receiving chip equivalent spice cascade circuit simulation model. The receiving chip equivalent spice cascade circuit simulation model performs circuit simulation according to the received global variable group 1. Each channel of the circuit simulation outputs the global variable group 2 of each receiving chip, and passes the global variable group 2 to the full array thermal simulation model. Step 2-3, perform thermal simulation on the full array thermal simulation model and perform force simulation on the radome force simulation model: ① Input the external heat load to the full array thermal simulation model. The full array thermal simulation model performs full array thermal simulation according to the received external heat load and the heat dissipation power in the global variable group 2 of each receiving chip. The thermal simulation outputs the global variable group 3, and the global variable group 3 is passed to the antenna subarray electromagnetic simulation model. At the same time, the global variable group 3 is fed back to the receiving chip equivalent spice cascade circuit simulation model; the receiving chip equivalent spice cascade circuit simulation model performs circuit simulation again according to the temperature of each chip in the received global variable group 3. The circuit simulation outputs a new round of global variable group 2, and the new round of global variable group 2 is passed to the antenna subarray electromagnetic simulation model. ② Input the external force load to the radome force simulation model, the radome force simulation model performs force simulation according to the received external force load, the force simulation outputs global variable group four, and the global variable group four is passed to the antenna subarray electromagnetic simulation model; Step 2-4, perform electromagnetic simulation on the electromagnetic simulation models of the M antenna subarrays respectively: The antenna subarray electromagnetic simulation model performs simulation based on the received full array temperature distribution of global variable group three and the stress deformation of global variable group four, and automatically calculates and modifies the dielectric constant and loss tangent of the antenna body and radome medium at the current average temperature of each subarray area. Specifically, in order to reduce the amount of simulation calculation, the full array temperature distribution is divided into M areas, and the M areas correspond to the M subarrays one by one, and the size of each area is the same as the area of ​​the subarray at the corresponding position. The average temperature of each area is taken as the subarray operating temperature at the corresponding position. The dielectric constant and loss tangent of the subarray antenna body and radome medium material in different areas are automatically calculated according to the subarray operating temperature in different areas, and the dielectric constant and loss tangent of different areas are substituted into the subarray electromagnetic simulation model of the corresponding area; After updating the dielectric constant and loss tangent, the electromagnetic simulation model of each antenna subarray uses the amplitude and phase of the output signal power of the new round of global variable group 2 output in the received circuit simulation as the amplitude and phase of the excitation signal of each port of the subarray, and performs electromagnetic simulation of the subarray port standing wave ratio and antenna gain. The electromagnetic simulation outputs the global variable group 5, i.e., the subarray radiation pattern and the subarray port standing wave ratio; the electromagnetic simulation model of M antenna subarrays outputs M subarray radiation patterns and M subarray port standing wave ratios; Step 2-5, combining the amplitude and phase of the excitation signal of each port of the subarray, passing the M subarray directional patterns to the Matalab array synthesis directional pattern program for full array directional pattern synthesis, and calculating the G / T value of the receiving full array; Step 2-6, using the chip temperature and the maximum temperature difference of the array surface of the global variable group 3 output by the whole process, the standing wave ratio of the M sub-array ports of the global variable group 5, and the calculated G / T value of the receiving array as the qualified criterion of the simulation optimization; If the temperature of each chip, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports and the G / T value of the receiving array all meet the preset requirements, the multi-physics field collaborative simulation optimization of path, heat, force and electromagnetic is completed; If any of the indicators including the temperature of each chip, the maximum temperature difference of the array surface, the standing wave ratio of the M sub-array ports and the G / T value of the receiving full array do not meet the requirements, the optimization algorithm is used to adjust the parameters in the optimization variables of the corresponding module simulation model, and steps 2-1 to 2-6 are repeated to start a new round of collaborative simulation optimization of multi-physics fields such as path, heat, force and electromagnetic until all indicators are qualified.

8. The multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function as claimed in claim 1, characterized in that: After step 2, the final values ​​of the parameters in the optimization variables of the simulation model of each module and the final performance parameters of the structural and functional integrated phased array antenna are output. The final performance parameters include the temperature of each chip, the temperature distribution of the entire array, the maximum temperature difference of the array surface, the standing wave ratio of the sub-array port, the synthesized full array radiation pattern, the transmitting full array EIPR, and the receiving full array G / T value. According to the final values ​​of the parameters in the optimization variables obtained in step three, a three-dimensional model of the optimized structural and functional integrated phased array antenna is established in UG.

9. The multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function as claimed in claim 8, characterized in that: The architecture of the collaborative simulation platform that can realize the multi-physics field collaborative simulation optimization process of the structure-function integrated phased array antenna includes HFSS, ADS, ANSYS, UG and MATLAB; ADS is used as a circuit performance simulation tool, HFSS is used as a three-dimensional electromagnetic simulation tool, ANSYS is used as a thermal / stress simulation tool, and UG is used as a three-dimensional modeling tool; MATLAB is used as the interaction center of HFSS, ADS, and ANSYS simulation data, and an integrated platform is built that can call UG, HFSS, ADS, and Ansys for automatic model parameter transfer and simulation optimization iteration.

10. The multi-physics field collaborative simulation optimization method for a phased array antenna with integrated structure and function as claimed in claim 9, characterized in that: When the optimization algorithm is used to adjust the parameters in the optimization variables of the corresponding module simulation model in step 2, the optimization algorithm includes a genetic algorithm GA and an fmincon algorithm; and the genetic algorithm GA and the fmincon algorithm are integrated with the simulation software.

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