Bundling type high-vacuum wafer bonding equipment

Abstract

The invention relates to the technical field of wafer bonding, in particular to cluster type high-vacuum wafer bonding equipment, and mainly solves the technical problem that relatively mature cluster type high-vacuum wafer bonding equipment is lacked in the prior art. A plurality of functional devices such as a feeding device, a baking device, a plasma activating device, a visual alignment device, a bonding device and a discharging device are arranged on the periphery of an operating device, the operating device is provided with butt joint windows corresponding to the functional devices, each functional device is provided with an operating window, the operating windows are in butt joint with the corresponding butt joint windows through valves, and the operating windows are connected with the corresponding butt joint windows through valves. Therefore, connection and disconnection between the operation device and each functional device are realized, the independence of the operation device and each functional device space is ensured, the vacuum degree of each working step of wafer processing is ensured, and the requirement on the purification grade of a clean room is relatively low; the wafer can be transferred among the functional devices through the manipulator, and the automation degree is high.

Description

Technical Field

[0001] The invention relates to the technical field of wafer bonding, and in particular to a cluster-type high-vacuum wafer bonding device. Background Art

[0002] Wafer bonding is the process of tightly combining two mirror-polished homogeneous or heterogeneous wafers through chemical and physical effects to achieve vertical stacking and electrical interconnection in 3D integration and advanced packaging.

[0003] At present, wafer bonding equipment is changing from a single machine to a multi-chamber integration capable of performing multiple processes, and clustered wafer bonding equipment has emerged. Since particles and contamination on the surface of the wafer directly affect key indicators such as wafer bonding strength and void ratio, the entire wafer bonding process must be carried out in a high vacuum environment. Therefore, clustered high-vacuum wafer bonding equipment has gradually become the development trend of wafer bonding. However, the existing technology lacks more mature clustered high-vacuum wafer bonding equipment, so there is an urgent need for a clustered high-vacuum wafer bonding equipment with a high degree of automation and low requirements for the cleanroom purification level to meet the development trend of wafer bonding. Summary of the invention

[0004] In order to overcome the technical defect of the prior art that there is a lack of relatively mature clustered high-vacuum wafer bonding equipment, the present invention provides a clustered high-vacuum wafer bonding equipment.

[0005] The cluster-type high-vacuum wafer bonding equipment provided by the present invention comprises a frame, on which an operating device and a plurality of functional devices spaced apart along the circumference of the operating device are arranged, wherein the functional devices comprise a feeding device, a baking device, a plasma activation device, a visual alignment device, a bonding device and a discharging device; The operating device is provided with an operating cavity, and the side wall of the operating cavity is provided with docking windows corresponding to each functional device, and a manipulator is installed in the operating cavity, and the manipulator is used to penetrate the docking window and extend into the corresponding functional device to realize the transfer of the wafer; The feeding device is provided with a feeding cavity, a side wall of the feeding cavity is provided with a first operating window, and the first operating window is docked with a corresponding docking window through a first valve; The baking device is provided with a baking cavity, a side wall of the baking cavity is provided with a second operating window, and the second operating window is docked with a corresponding docking window through a second valve; The plasma activation device is provided with an activation cavity, a side wall of the activation cavity is provided with a third operating window, and the third operating window is docked with a corresponding docking window through a third valve; The visual alignment device is provided with an alignment cavity, a side wall of the alignment cavity is provided with a fourth operating window, and the fourth operating window is docked with the corresponding docking window through a fourth valve; The bonding device is provided with a bonding cavity, and a side wall of the bonding cavity is provided with a fifth operating window, and the fifth operating window is docked with the corresponding docking window through a fifth valve; The discharging device is provided with a discharging cavity, and a side wall of the discharging cavity is provided with a sixth operating window, and the sixth operating window is docked with the corresponding docking window through a sixth valve.

[0006] Optionally, the feeding device, baking device, plasma activation device, bonding device, visual alignment device and discharging device are distributed in sequence and at intervals along the circumference of the operating device.

[0007] Optionally, the robot arm is driven to rotate along a vertical axis and to extend and retract radially along the operating cavity, and each functional device is provided with a lifting structure for lifting the wafer, and the lifting structure cooperates with the robot arm to complete the placement and removal of the wafer.

[0008] Optionally, storage racks for storing wafers are installed in both the feed cavity and the discharge cavity, and the storage racks are provided with multiple layers of storage positions distributed along the vertical direction. The storage racks are driven to rise and fall so that the robot can dock with different layers of storage positions of the storage racks and the storage racks can also serve as the lifting structure.

[0009] Optionally, the baking device comprises: A baking oven, which is fixed on the frame, and the front side wall of the baking oven is provided with the second operating window; A vacuum pumping mechanism, which is fixed on the frame and communicated with the inner cavity of the baking oven; A hot plate carrier box is installed in the baking oven and can slide in the vertical direction, the front side of the hot plate carrier box is open and butts against the front side wall of the baking oven, and a plurality of horizontally arranged heating plates are fixed in the hot plate carrier box and the plurality of heating plates are spaced apart in the vertical direction; A first lifting rod, which seals and penetrates the bottom wall of the baking box and is connected to the bottom wall of the hot plate carrier box, the first lifting rod is connected to a first driving member for driving the first lifting rod to move up and down, the first driving member drives the hot plate carrier box to move up and down through the first lifting rod so that each heating plate can be aligned with the operation window; A supporting mechanism, which serves as a lifting structure of the baking device and comprises a mounting frame installed in the baking box and capable of sliding in a vertical direction, a plurality of supporting assemblies are arranged on the mounting frame, and the plurality of supporting assemblies are arranged one by one corresponding to the heating plates, a plurality of avoidance windows are provided on the rear side wall of the hot plate carrier box corresponding to the plurality of supporting assemblies, the supporting assembly comprises a mounting plate, a rear end of the mounting plate is fixedly connected to the mounting frame, a front end of the mounting plate extends into the hot plate carrier box through the corresponding avoidance window and is located below the corresponding heating plate, an ejector pin is fixed above the front end of the mounting plate, and a through hole is provided on the heating plate corresponding to the ejector pin; A second lifting rod, which seals and passes through the bottom wall of the baking oven and is located directly below the mounting frame, is connected to a second driving member for driving the second lifting rod to lift the supporting mechanism via the second lifting rod so that the ejector pin can pass through the corresponding through hole and lift the corresponding wafer.

[0010] Optionally, a first heat reflection screen is provided on the inner side of the top wall, the inner side of the bottom wall, the inner side of the left wall, the inner side of the right wall and the inner side of the rear wall of the hot plate carrier box, and a second heat reflection screen is provided on the inner side of the front wall of the baking oven.

[0011] Optionally, the visual alignment device includes: A box body, which is fixed on the frame, and a side wall of the box body is provided with the fourth operating window; A gantry frame, which is fixed in the alignment cavity; An upper electrostatic chuck, which is fixed below the top beam of the gantry; An alignment driving member, which is located in the gantry and mounted on the bottom wall of the box, wherein the output portion of the alignment driving member is located at the top thereof and is used to output six-degree-of-freedom motion in space; A lower electrostatic chuck, which is indirectly fixed above the output portion of the alignment drive member through a mounting seat; A pin mechanism, which serves as a lifting structure of the visual alignment device and includes a lifting plate, the lifting plate is located below the lower electrostatic chuck, the lower electrostatic chuck is provided with at least three lifting holes distributed along the circumferential direction, the lifting plate is provided with pin bodies corresponding to the lifting holes, the lifting plate is mounted on the mounting seat and is driven to lift vertically so that the pin bodies pass through the lifting holes to lift the upper wafer or the lower wafer; A pre-bonding driving member, whose shell is fixed on the frame and located below the box body, the output shaft seal of the pre-bonding driving member passes through the bottom wall of the box body, a first avoidance hole arranged vertically is provided in the middle of the alignment driving member, and a second avoidance hole arranged vertically is provided in the middle of the lower electrostatic chuck, and the output shaft of the pre-bonding driving member is used to lift the lower wafer after passing through the first avoidance hole and the second avoidance hole in sequence; An optical mechanism is installed on the gantry, the lower electrostatic chuck and / or the upper electrostatic chuck is provided with an imaging window, and the optical mechanism is used to obtain an upper wafer image and a lower wafer image through the imaging window.

[0012] Optionally, the optical mechanism includes an upper visual component and a lower visual component that are symmetrically distributed, the upper visual component and the lower visual component are fixedly connected via a connecting frame, the lower electrostatic chuck and the upper electrostatic chuck are both provided with imaging windows, the upper visual component is mounted on a top beam of the gantry and is used to acquire the image of the upper wafer through the imaging window of the upper electrostatic chuck, and the lower visual component is located below the lower electrostatic chuck and is used to acquire the image of the lower wafer through the imaging window of the lower electrostatic chuck.

[0013] Optionally, the bonding device comprises: A chamber shell, which is fixed on the frame and has an open top, and a fifth operating window is provided on a side wall of the chamber shell; A cover assembly, comprising a cover plate, the cover plate being connected to an opening and closing driving member, the opening and closing driving member driving the cover plate to move so that the cover plate has a closed state in which it is sealed and covered on the top of the cavity shell and an open state in which it is detached from the top of the cavity shell; A bonding assembly, comprising an inverted barrel-shaped lower bonding stage, the bottom open end of the lower bonding stage is sealed and fixed to the bottom of the cavity shell so that the lower bonding stage, the cavity shell and the cover plate form a closed bonding cavity, the bonding assembly also comprises an upper heating plate and a lower heating plate, the upper heating plate is suspended in the bonding cavity by a lifting shaft that seals and penetrates the cover plate, the lifting shaft is connected to a first lifting drive member installed above the cover plate, the lower heating plate is supported on the inner side of the lower bonding stage by a plurality of support columns fixed to the bottom of the cavity shell, the lower heating plate and the top end plate of the lower bonding stage are connected by a first lifting drive member A graphite pad is in contact with the lower bonding platform, the side wall of the lower bonding platform is provided with a deformation part for axial buffering, the top edge of the lower bonding platform is uniformly provided with a plurality of notch grooves along the circumferential direction, the bonding assembly also includes a pin structure, the pin structure is used as a lifting structure of the bonding device and includes a lifting ring located outside the lower bonding platform and coaxially arranged, the lifting ring is connected with a second lifting driving member, the housing of the second lifting driving member is fixed under the cavity shell and the output shaft seal passes through the bottom of the cavity shell, the inner ring of the lifting ring is provided with a needle member, the needle member corresponds to the notch groove one by one and is placed in the corresponding notch groove; A cooling assembly, comprising an upper cooling plate and a lower cooling plate, wherein the upper cooling plate is suspended in a bonding cavity by a first water pipe that is sealed and passes through the cover plate, the upper cooling plate is an annular plate and is slidably sleeved on the lifting shaft, the first water pipe is connected to a third lifting drive component installed above the cover plate, the lower cooling plate is a porous plate and is slidably sleeved on all support columns, the lower cooling plate is connected to a second water pipe that passes through the bottom of the cavity shell, and a fourth lifting drive component for driving the lower cooling plate to rise and fall is installed at the bottom of the cavity shell.

[0014] Optionally, a second graphite pad is provided on the upper surface of the upper heating plate and the lower surface of the lower heating plate, and the second graphite pad located on the lower surface of the lower heating plate is adapted to the shape of the lower cooling plate.

[0015] The technical solution provided by the present invention has the following advantages compared with the prior art: The clustered high-vacuum wafer bonding equipment provided by the present invention is provided with a plurality of functional devices such as a feeding device, a baking device, a plasma activation device, a visual alignment device, a bonding device and a discharging device around the operating device. The operating device is provided with a docking window corresponding to each functional device, and each functional device is provided with an operating window. The operating window is docked with the corresponding docking window through a valve, so that the operation device and each functional device are connected and disconnected, thereby ensuring the independence of the operating device and the space of each functional device, and then ensuring the vacuum degree of each step of wafer processing, and having a low requirement on the purification level of the clean room. In addition, a manipulator is provided in the operating device, and the wafer can be transferred between the various functional devices by the manipulator. The degree of automation is relatively high, so that the device can meet the development trend of wafer bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 It shows the overall layout of the equipment in the embodiment of the present invention; Figure 2 A schematic diagram showing the structure of a manipulator in an embodiment of the present invention; Figure 3 A schematic diagram showing the overall structure of a baking device according to an embodiment of the present invention; Figure 4A cutaway perspective view of a baking oven and its inner structure along the front-to-back direction in an embodiment of the present invention; Figure 5 A three-dimensional diagram showing the assembly structure of the hot plate carrier box and the top support mechanism in an embodiment of the present invention; Figure 6 A three-dimensional diagram showing a top support mechanism according to an embodiment of the present invention; Figure 7 A cutaway perspective view showing the assembly structure of the hot plate carrier box and the top support mechanism in the embodiment of the present invention along the left and right directions; Figure 8 A cutaway perspective view showing a lifting drive-related structure in the embodiment of the present invention along the left and right directions; Fig. 9 A schematic diagram showing the overall structure of a visual alignment device in an embodiment of the present invention; Fig.10 A schematic diagram showing the internal structure of the visual alignment device in an embodiment of the present invention (excluding the box); Fig.11 A schematic diagram showing the assembly structure of the lower electrostatic chuck, the ejector mechanism and the alignment driving member in an embodiment of the present invention; Fig.12 A schematic diagram showing the cooperation between the lower electrostatic chuck and the ejector mechanism in an embodiment of the present invention; Fig.13 An exploded view showing the assembly structure of the gantry, the lower electrostatic chuck and the ejection drive member in an embodiment of the present invention; Fig.14 A schematic diagram showing the structure of an optical mechanism in an embodiment of the present invention; Fig.15 A schematic diagram showing the overall structure of a bonding device according to an embodiment of the present invention; Fig.16 A cross-sectional view showing a bonding device according to an embodiment of the present invention; Fig.17 express Fig.16 A partial enlarged view of the middle A; Fig.18 A schematic diagram showing a cover assembly and ancillary structures in an embodiment of the present invention; Fig.19 A schematic diagram showing the structure of a bonding assembly in an embodiment of the present invention; Fig. 20 An exploded view showing an upper heating plate and related structures in an embodiment of the present invention; Fig.21 An exploded view of the lower heating plate and related structures in an embodiment of the present invention is shown.

[0019] In the figure: 1. Frame; 2. Operating device; 21. First valve; 22. Second valve; 23. Third valve; 24. Fourth valve; 25. Fifth valve; 26. Sixth valve; 27. Manipulator; 28. Center axis; 3. Feeding device; 4. baking device; 41. baking box; 411. second operating window; 412. fixing frame; 413. guide rail; 414. second reflecting screen; 415. vacuum gauge; 416. adapter; 42. vacuum pumping mechanism; 43. hot plate carrier; 431. heating plate; 432. avoidance window; 433. first reflecting screen; 434. vertical plate; 4341. card slot; 44. first lifting rod; 441. first driving member; 45. top support mechanism; 451. mounting frame; 452. top Support assembly; 4521, mounting plate; 4522, ejector pin; 46, second lifting rod; 461, second driving member; 47, sliding seal assembly; 471, bellows; 472, connecting plate; 473, flange; 4731, mounting groove; 474, oil-free bushing; 48, motor screw pair; 481, fixing plate; 482, guide rod; 483, screw; 484, servo motor; 485, nut member; 4851, lifting member; 4852, nut; 49, cooling pipe; 5. Plasma activation device; 6. Visual alignment device; 61. Box; 611. Alignment cavity; 612. Operation window; 613. Illumination glass; 62. Gantry; 63. Upper electrostatic suction cup; 631. Through hole; 64. Alignment drive; 641. First avoidance hole; 642. Six-axis platform; 643. Piezoelectric platform; 644. Damping spring; 65. Lower electrostatic suction cup; 651. Mounting seat; 652. Lifting hole; 653. Second avoidance hole; 66. Ejector mechanism; 661. Lifting plate; 662. Needle body; 67. Pre-bonding drive; 68. Optical mechanism; 681. Imaging window; 682. Upper visual component; 683. Lower visual component; 684. Connecting frame; 685. Guide pair; 686. Vacuum slide; 69. Ejector drive; 7. Bonding device; 71. Cavity shell; 711. Fifth operating window; 712. Flange; 7121. First through hole; 713. Bottom plate; 72. Cover assembly; 721. Cover plate; 7211. Second through hole; 722. Opening and closing drive member; 7221. Fixed seat; 7222. Linear telescopic pair; 723. Mounting plate; 724. Mounting space; 725. Connecting column; 726. Buffer; 73. Bonding assembly; 731. Upper heating plate; 7311. Plate body; 7312. Third graphite pad; 7313. Paste plate; 7314. Fourth graphite pad; 732. Lower heating plate; 733. Lifting shaft; 7331. Press block; 73311. Connecting shaft; 73312. Press plate; 7332. Support ring; 7333, bolt; 7334, pad; 7335, annular block; 7336, pressure ring; 734, first lifting drive; 735, support column; 736, lower bonding platform; 7361, deformation part; 7362, notch groove; 737, first graphite pad; 738, ejector pin structure; 7381, lifting ring; 7382, second lifting drive; 7383, needle; 739, second graphite pad; 74, cooling assembly; 741, upper cooling plate; 742, lower cooling plate; 7421, cooling substrate; 7422, cooling cover; 74211, water storage tank; 743, first water pipe; 744, third lifting drive; 745, fourth lifting drive; 746, cooling pipe group; 75, fixing column; 8. Discharging device. DETAILED DESCRIPTION

[0020] In order to more clearly understand the above-mentioned objectives, features and advantages of the present invention, the scheme of the present invention will be further described below. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0021] In the description, it should be noted that the terms "first" and "second" are only used for descriptive purposes and should not be understood as indicating or implying relative importance. It should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two elements. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0022] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0024] Reference Figure 1 and Figure 2 The present embodiment provides a cluster-type high-vacuum wafer bonding device, including a frame 1, on which an operating device 2 and a plurality of functional devices spaced apart along the circumference of the operating device 2 are provided, the functional devices including a feeding device 3, a baking device 4, a plasma activation device 5, a visual alignment device 6, a bonding device 7 and a discharging device 8; the operating device 2 is provided with an operating cavity, and a docking window is provided on the side wall of the operating cavity corresponding to each functional device, and a manipulator 27 is installed in the operating cavity, and the manipulator 27 is used to penetrate the docking window and extend into the corresponding functional device to realize the transfer of the wafer; the feeding device 3 is provided with a feeding cavity, and a first operating window 612 is provided on the side wall of the feeding cavity, and the first operating window 612 is docked with the corresponding docking window through a first valve 21; the baking device 4 is provided with a baking cavity, and a second operating window 4 is provided on the side wall of the baking cavity 11, the second operating window 411 is docked with the corresponding docking window through the second valve 22; the plasma activation device 5 is provided with an activation cavity, and the side wall of the activation cavity is provided with a third operating window 612, and the third operating window 612 is docked with the corresponding docking window through the third valve 23; the visual alignment device 6 is provided with an alignment cavity 611, and the side wall of the alignment cavity 611 is provided with a fourth operating window 612, and the fourth operating window 612 is docked with the corresponding docking window through the fourth valve 24; the bonding device 7 is provided with a bonding cavity, and the side wall of the bonding cavity is provided with a fifth operating window 711, and the fifth operating window 711 is docked with the corresponding docking window through the fifth valve 25; the discharging device 8 is provided with a discharging cavity, and the side wall of the discharging cavity is provided with a sixth operating window 612, and the sixth operating window 612 is docked with the corresponding docking window through the sixth valve 26.

[0025] Specifically, the feeding device 3, baking device 4, plasma activation device 5, bonding device 7, visual alignment device 6 and discharging device 8 of this embodiment are sequentially spaced and distributed along the circumference of the operating device 2. The purpose of such arrangement is mainly to avoid space so that each device does not interfere with each other. In other embodiments, the position of each functional device can be adjusted according to specific circumstances.

[0026] Specifically, the manipulator 27 of this embodiment is driven to rotate along the vertical axis and to extend and retract along the radial direction of the operating chamber. Each functional device is provided with a lifting structure for lifting the wafer, and the lifting structure cooperates with the manipulator 27 to complete the placement and removal of the wafer. When in operation, the manipulator 27 rotates to dock with each functional device, and the manipulator 27 is extended and retracted to allow the manipulator 27 to extend into or take out of the corresponding functional device.

[0027] More specifically, the rotation of the manipulator 27 can be achieved by a rotary power part such as a rotary motor or a rotary cylinder, and the extension and retraction of the manipulator 27 can be achieved by a linear power part such as an electric push rod or a telescopic cylinder, or by a scissor structure, etc. For example, in this embodiment, the arm of the manipulator 27 adopts a scissor-type connecting rod, and the end of the scissor-type connecting rod is rotatably mounted on the central shaft 28. When the end of the scissor-type connecting rod rotates synchronously, the rotation of the manipulator 27 is achieved. When the end of the scissor-type connecting rod produces relative rotation, the movement of the head end in the radial direction of the operating cavity is achieved by changing the angle of the scissor-type connecting rod.

[0028] It should be noted that the robot 27 of this embodiment is limited to two degrees of freedom: rotation and radial extension, and a lifting structure is provided in each functional device to cooperate with the robot 27 to complete the wafer placement. Such a design can simplify the structure of the robot 27, and since the robot 27 does not need to be lifted, the size of the operation window 612 and the docking window can be designed to be smaller, which is more conducive to ensuring the vacuum degree.

[0029] Specifically, the first valve 21, the second valve 22, the third valve 23, the fourth valve 24, the fifth valve 25 and the sixth valve 26 of the present embodiment all adopt a plug valve structure, which has a compact structure and reliable performance.

[0030] The specific structure of each device is introduced in detail below.

[0031] Feed chamber and discharge chamber: Storage racks for storing wafers are installed in both the feeding cavity and the discharging cavity. The storage racks are provided with multiple layers of storage positions distributed in the vertical direction. The storage racks are driven to rise and fall so that the robot 27 can dock with the storage positions of different layers of the storage racks and the storage racks also serve as a lifting structure. When in motion, the storage racks are lifted and lowered so that the storage positions of the target layer dock with the robot 27 to achieve the picking up or placement of the wafers of the target layer.

[0032] Baking device 4: Reference Figures 3 to 8 The baking device 4 of this embodiment includes a baking box 41, a vacuum pumping mechanism 42, a hot plate carrier box 43, a first lifting rod 44, a supporting mechanism 45 and a second lifting rod 46.

[0033] The baking oven 41 is fixed on the frame 1 , and the front side wall of the baking oven 41 is provided with the second operating window 411 .

[0034] It is easy to understand that the baking oven 41 is a closed structure with a sealed cavity formed therein.

[0035] The vacuum pumping mechanism 42 is fixed on the frame 1 and communicated with the inner cavity of the baking oven 41 .

[0036] Specifically, the vacuuming mechanism 42 is connected to the rear wall of the baking oven 41 to form a vacuum environment in the sealed cavity.

[0037] The hot plate carrier box 43 is installed in the baking box 41 and can slide in the vertical direction. The front side of the hot plate carrier box 43 is open and docked with the front side wall of the baking box 41. A plurality of horizontally arranged heating plates 431 are fixed in the hot plate carrier box 43 and the plurality of heating plates 431 are distributed at intervals in the vertical direction. When working, the hot plate carrier box 43 slides vertically to align different heating plates 431 with the second operating window 411 in sequence, and then the robot 27 places the wafer on the corresponding heating plate 431 through the second operating window 411, so as to achieve the purpose of baking multiple wafers at the same time.

[0038] It should be noted that since the heat source during baking comes from the heating plate 431, that is, the effective space for baking the wafers is the inner cavity of the hot plate carrier box 43, the front side of the hot plate carrier box 43 is docked with the front side wall of the baking box 41 to form a closed cavity in the inner cavity of the hot plate carrier box 43, which is beneficial to reduce heat loss.

[0039] Specifically, the heating plate 431 adopts an electric heating method, and the temperature uniformity is good. The connecting cable of the heating plate 431 is led out through a ceramic tube, which is more conducive to reducing heat loss.

[0040] Specifically, a fixing frame 412 is provided in the baking oven 41 at the rear side of the hot plate carrier box 43, a vertically arranged guide rail 413 is fixed to the front side of the fixing frame 412, and the hot plate carrier box 43 is slidably connected to the guide rail 413, so that the hot plate carrier box 43 can slide in the vertical direction.

[0041] Among them, the first lifting rod 44 seals and passes through the bottom wall of the baking oven 41 and is connected to the bottom wall of the hot plate carrier box 43. The first lifting rod 44 is connected to a first driving member 441 for driving the first lifting rod 44 to lift and lower the hot plate carrier box 43. The first driving member 441 drives the hot plate carrier box 43 to lift and lower through the first lifting rod 44 so that each heating plate 431 can be aligned with the second operating window 411.

[0042] Specifically, the first lifting rod 44 passes through the bottom wall of the baking oven 41 through the sliding sealing assembly 47. The sliding sealing assembly 47 includes a bellows 471 sleeved on the outside of the first lifting rod 44. Both ends of the bellows 471 are provided with connecting plates 472. The connecting plate 472 at the upper end of the bellows 471 is sealed and connected to the lower surface of the bottom wall of the baking oven 41. The connecting plate 472 at the lower end of the bellows 471 is sealed and connected to a flange 473. The upper surface of the flange 473 is provided with a mounting groove 4731. The bottom end of the first lifting rod 44 is sleeved and fixed in the mounting groove 4731. The bellows 471 can be compressed and deformed or stretched and deformed with the lifting and lowering of the first lifting rod 44, and cooperates with the flange 473 to always maintain the seal between the first lifting rod 44 and the bottom wall of the baking oven 41 during the movement of the first lifting rod 44. Compared with the sliding sealing structure such as rubber sleeve, this sliding sealing method will not produce debris due to wear, thereby avoiding the contamination of the sealed cavity by the debris, ensuring the vacuum degree of the sealed cavity, and then ensuring the quality of wafer bonding. At the same time, this sliding sealing method has a long service life and does not require frequent maintenance and replacement. More specifically, the connection plate 472 is sealed and connected to the lower surface of the bottom wall of the baking box 41 and the flange plate 473 through a sealing ring.

[0043] Furthermore, the sliding seal assembly 47 further includes an oil-free bushing 474, which is disposed in the bottom wall of the baking box 41, and the first lifting rod 44 is slidably sleeved in the oil-free bushing 474. It is easy to understand that a through hole 631 is provided in the bottom wall of the baking box 41 at a position corresponding to the first lifting rod 44, and the oil-free bushing 474 is sleeved in the through hole 631, and the first lifting rod 44 is sleeved in the oil-free bushing 474. The oil-free bushing 474 can guide the first lifting rod 44, thereby ensuring the movement accuracy of the first lifting rod 44, and the oil-free bushing 474 does not require a medium such as lubricating oil, which can avoid contamination of the closed cavity and ensure the vacuum degree of the closed cavity.

[0044] Specifically, the first driving member 441 is a motor screw pair 48, which includes a fixed plate 481 located below the baking box 41, and the fixed plate 481 is fixedly connected to the baking box 41 through a vertically arranged guide rod 482. The motor screw pair 48 also includes a screw rod 483, the bottom end of the screw rod 483 is rotatably connected to the fixed plate 481, and the top end of the screw rod 483 is connected to a servo motor 484 for driving the rotation thereof. The housing of the servo motor 484 is fixed to the lower surface of the bottom wall of the baking box 41, and a nut member 485 is screwed on the screw rod 483, which is fixedly connected to the flange 473 and slidably sleeved on the guide rod 482. The output shaft of the servo motor 484 rotates to drive the screw rod 483 to rotate, thereby driving the nut member 485 to move up and down, and then driving the first lifting rod 44 to move up and down, and finally realizing the lifting and lowering of the hot plate carrier box 43. In detail, the nut member 485 includes a lifting member 4851 and a nut 4852 fixed in the lifting member 4851 , the lifting member 4851 is slidably connected to the guide rod 482 , and the nut 4852 is threadedly connected to the screw rod 483 .

[0045] Among them, the supporting mechanism 45 serves as the lifting structure of the baking device 4 and includes a mounting frame 451 installed in the baking box 41 and capable of sliding in the vertical direction. A plurality of supporting assemblies 452 are provided on the mounting frame 451. The plurality of supporting assemblies 452 are arranged one-to-one corresponding to the heating plates 431. A plurality of avoidance windows 432 are provided on the rear side wall of the hot plate carrier box 43 corresponding to the plurality of supporting assemblies 452. The supporting assembly 452 includes a mounting plate 4521. The rear end of the mounting plate 4521 is fixedly connected to the mounting frame 451. The front end of the mounting plate 4521 extends into the hot plate carrier box 43 through the corresponding avoidance window 432 and is located below the corresponding heating plate 431. A ejector pin 4522 is fixed above the front end of the mounting plate 4521, and a through hole is provided on the heating plate 431 corresponding to the ejector pin 4522. During operation, when the robot 27 carries the wafer through the second operating window 411 and moves to the top of the corresponding heating plate 431, the mounting frame 451 rises and drives the ejector pin 4522 to move upward, so that the ejector pin 4522 passes through the through hole and lifts the wafer to separate from the robot 27. At this time, the robot 27 retracts, and then the mounting frame 451 descends and drives the ejector pin 4522 to move downward, so that the ejector pin 4522 is lower than the upper surface of the heating plate 431, so that the wafer is directly placed on the heating plate 431.

[0046] It is easy to understand that since the multiple support assemblies 452 are all set on the mounting frame 451, all the support assemblies 452 are lifted and lowered synchronously, that is, when a certain wafer needs to be lifted, other wafers located on the heating plate 431 will also be lifted and then dropped back.

[0047] It should be noted that since the supporting mechanism 45 needs to produce vertical movement relative to the hot plate carrier box 43, the vertical dimension of the avoidance window 432 opened on the hot plate carrier box 43 should be larger than the vertical dimension of the mounting plate 4521, so as to reserve room for movement for the lifting and lowering of the mounting plate 4521.

[0048] Specifically, in order to ensure the stability of the wafer support, at least three ejector pins 4522 need to be provided on each mounting plate 4521 , which is well known to those skilled in the art.

[0049] Specifically, a fixing frame 412 is provided in the baking oven 41 at the rear side of the mounting frame 451, a vertically arranged guide rail 413 is fixed to the front side of the fixing frame 412, and the mounting frame 451 is slidably connected to the guide rail 413, so that the mounting frame 451 can slide in the vertical direction. It should be noted that the mounting frame 451 and the hot plate carrier box 43 are both slidably installed through the fixing frame 412, and two sets of guide rails 413 need to be provided at the front side of the fixing frame 412, and the two sets of guide rails 413 are respectively connected to the mounting frame 451 and the hot plate carrier box 43. The number of each set of guide rails 413 is not limited, but in order to ensure the stability of sliding, it is preferred to set each set of guide rails 413 to two or more.

[0050] Among them, the second lifting rod 46 seals and passes through the bottom wall of the baking oven 41 and is located directly below the mounting frame 451. The second lifting rod 46 is connected to a second driving member 461 for driving its lifting and lowering. The second driving member 461 lifts the supporting mechanism 45 through the second lifting rod 46 so that the ejector pin 4522 can pass through the corresponding through hole and lift the corresponding wafer.

[0051] Specifically, the second lifting rod 46 and the first lifting rod 44 adopt the same sliding sealing structure, that is, the second lifting rod 46 also passes through the bottom wall of the baking oven 41 through the sliding sealing assembly 47 .

[0052] More specifically, the second driving member 461 and the first driving member 441 adopt the same structure, that is, the second driving member 461 is also a motor screw pair 48 .

[0053] It should be noted that the second lifting rod 46 is used to lift the mounting frame 451, but the second lifting rod 46 and the mounting frame 451 may be fixedly connected or may not be connected. The latter is preferred for the following reasons: when the hot plate carrier box 43 is lifted or lowered, the supporting assembly 452 corresponding to the heating plate 431 is also lifted or lowered accordingly. If the second lifting rod 46 and the mounting frame 451 are fixedly connected, then when the first lifting rod 44 moves, the second lifting rod 46 needs to move synchronously, which increases the difficulty of control. If the second lifting rod 46 and the mounting frame 451 are fixedly connected, then when the first lifting rod 44 moves, the second lifting rod 46 needs to move synchronously, which increases the difficulty of control. When there is no connection between the racks 451, the lifting and lowering of the hot plate carrier 43 will cause the support assembly 452 to rise and fall synchronously, and the second lifting rod 46 will be detached from the mounting rack 451. When the hot plate carrier 43 is lifted and into place and the ejector pin 4522 needs to be actuated, the second lifting rod 46 will be actuated and the displacement of the second lifting rod 46 will be controlled to be equal to the displacement of the first lifting rod 44 + the sum of the relative displacements of the ejector pin 4522 and the heating plate 431. There is no need to maintain the synchronization between the first lifting rod 44 and the second lifting rod 46 during the movement, thereby reducing the control difficulty.

[0054] In addition, in order to reduce the heat loss in the hot plate carrier box 43, the present embodiment further provides a first heat reflection screen on the inner side of the top wall, the inner side of the bottom wall, the inner side of the left wall, the inner side of the right wall and the inner side of the rear wall of the hot plate carrier box 43, and provides a second heat reflection screen on the inner side of the front side wall of the baking box 41. The five first heat reflection screens and one second heat reflection screen can cover all surfaces of the hot plate carrier box 43, reduce the heat loss by heat reflection, thereby avoiding uneven temperature caused by excessive local heat dissipation, and further improving the temperature uniformity during baking.

[0055] It should be noted that the first heat reflecting screen and the second heat reflecting screen can be separately provided to directly serve as the box walls, or they can be fixed on the original box walls as additional structures. For example, in the present embodiment, the first heat reflecting screens provided on the left and right walls of the hot plate carrier box 43 are both separately provided to directly serve as the box walls, while the first heat reflecting screens provided on the rear side wall, top wall and bottom wall of the hot plate carrier box 43 and the second heat reflecting screen on the front wall of the baking oven 41 are both fixed on the original box walls as additional structures.

[0056] It should be noted that since the front end of the mounting plate 4521 of the supporting mechanism 45 needs to pass through the rear side wall of the hot plate carrier box 43 and extend into the hot plate carrier box 43, the first heat reflection screen located on the rear side wall of the hot plate carrier box 43 needs to be provided with a hollow area corresponding to the avoidance window 432 to avoid the installation and lifting of the mounting plate 4521.

[0057] Specifically, the first heat reflection screen and the second heat reflection screen are formed by stacking multiple layers of heat reflection glass at intervals.

[0058] Furthermore, vertical plates 434 are fixed to the inner sides of the first heat reflection screens on the left and right sides, and the inner surfaces of the vertical plates 434 are provided with a plurality of slots 4341 spaced apart in the vertical direction corresponding to the heating plate 431, and the left and right ends of the heating plate 431 are connected to the slots 4341 of the corresponding vertical plates 434. After the first heat reflection screen is arranged on the inner side of the box wall of the hot plate carrier box 43, the fixing of the heating plate 431 becomes a technical problem due to the structural particularity of the first heat reflection screen. In this embodiment, vertical plates 434 are fixed to the inner sides of the first heat reflection screens on the left and right sides, and the heating plate 431 is fixed by the slots 4341 arranged on the vertical plates 434, so that the structure is more reliable.

[0059] In addition, in this embodiment, a cooling pipe 49 is provided on the outside of the baking oven 41 , and the baking oven 41 is cooled by a circulating coolant filled in the cooling pipe 49 .

[0060] Specifically, cooling pipes 49 are provided on the outer side of the rear side wall, the outer side of the left side wall and the outer side of the right side wall of the baking oven 41, and the cooling effect is better; the top wall of the baking oven 41 is provided with a vacuum gauge 415 and an adapter 416 for connecting a detection device, the vacuum gauge 415 is used to detect the vacuum degree of the closed cavity, and the adapter 416 is used to connect the detection equipment to realize automatic control of baking.

[0061] The working process of the baking device 4 of this embodiment is as follows: S1. The baking oven 41 is connected to the vacuum operation chamber through the second operation window 411, and the gate valve is opened; S2. Control the first lifting rod 44 to move, driving the hot plate carrier box 43 up and down, until the target heating plate 431 is aligned with the operating window 612; S3. The robot 27 picks up the wafer and extends into the interior of the hot plate carrier box 43 through the operation window 612. At this time, the wafer is located directly above the heating plate 431 and supported on the robot 27; S4. Control the movement of the second lifting rod 46 to drive the mounting frame 451 to rise and fall until the ejector pin 4522 lifts the wafer and separates the wafer from the robot 27; S5. The robot 27 retracts and controls the second lifting rod 46 to move, driving the mounting frame 451 to descend, so that the wafer falls on the heating plate 431; S6. Repeat steps S2 to S5 until all the heating plates 431 of the hot plate carrier box 43 are loaded with wafers; S7. Close the gate valve, turn on the heating plate 431 to heat up, and bake the wafer; S8. After baking is completed, the gate valve is opened, the ejector pin 4522 lifts up the wafer, the robot 27 extends into the hot plate carrier box 43, the ejector pin 4522 descends to make the wafer fall on the robot 27, and the robot 27 retracts to take away the wafer.

[0062] Plasma Activation Device 5: The plasma activation device 5 used in this embodiment is a mature structure in the art and will not be described in detail here.

[0063] Visual counterpoint device 6: Reference Figures 9 to 14 The visual alignment device 6 of this embodiment includes a box 61, a gantry 62, an upper electrostatic suction cup 63, an alignment drive member 64, a lower electrostatic suction cup 65, a pin mechanism 66, a pre-bonding drive member 67 and an optical mechanism 68.

[0064] The box body 61 is fixed on the frame 1 , and a fourth operating window 612 is provided on the side wall of the box body 61 .

[0065] It is easy to understand that since the visual alignment needs to be carried out in a vacuum environment, the box 61 should be installed with a vacuum pumping structure and a vacuum gauge 415 for detecting the vacuum degree during actual design; at the same time, an adapter 416 can be provided as needed to connect the detection mechanism, a hanger can be provided to connect the sling, and other structures can be provided to assist the operation.

[0066] Furthermore, in this embodiment, a lighting glass 613 is sealed and installed on the side wall of the box body 61. The lighting glass 613 can adjust the brightness in the alignment cavity 611 to meet the brightness requirement of the optical mechanism 68 during operation.

[0067] Furthermore, in this embodiment, a silicone plate is provided on the outer wall of the box body 61. The silicone plate has a certain flexibility and can reduce the shock caused by collision to the internal structure of the device, thereby reducing the impact on the position accuracy of the internal structure of the device.

[0068] The gantry 62 is fixed in the alignment cavity 611 .

[0069] It is easy to understand that the gantry 62 is mainly used to install other components, and at the same time divides the alignment cavity 611 into multiple installation areas such as above the top beam of the gantry 62 and inside the gantry 62, so as to more fully and effectively utilize the space in the alignment cavity 611.

[0070] It is easy to understand that the gantry 62 is composed of a top beam and two columns. The structure of the top beam and the columns is not limited. For example, in this embodiment, the top beam and the columns are both configured as H-shaped structures.

[0071] The upper electrostatic suction cup 63 is fixed below the top beam of the gantry 62 .

[0072] It is easy to understand that the electrostatic chuck is a mature structure in the art, and its surface is provided with electrode holes for connecting electrodes. When working, the electrodes provide a uniform electric field for the entire disk surface, and the charge polarization on the wafer surface is realized according to Coulomb's law and Lorentz's law, thereby achieving the effect of wafer adsorption. The upper electrostatic chuck 63 and the lower electrostatic chuck 65 mentioned later are both made using this principle.

[0073] It should be noted that, in order to cooperate with other components, the upper electrostatic suction cup 63 is also provided with an imaging window 681 and a through hole 631. For better understanding, the specific functions of the imaging window 681 and the through hole 631 are explained in conjunction with the corresponding components in the following text.

[0074] The alignment driving member 64 is located in the gantry 62 and is installed on the bottom wall of the box body 61 . The output portion of the alignment driving member 64 is located at the top thereof and is used to output six-degree-of-freedom motion in space.

[0075] Specifically, the alignment drive member 64 of this embodiment includes a six-axis platform 642 and a piezoelectric platform 643. The bottom of the six-axis platform 642 is fixed on the bottom wall of the box 61, the piezoelectric platform 643 is connected to the top of the six-axis platform 642, and the mounting seat 651 is fixed to the top of the piezoelectric platform 643. When working, the six-axis platform 642 drives the piezoelectric platform 643, the mounting seat 651 and the lower electrostatic suction cup 65 to move along the six degrees of freedom in space, so as to achieve arbitrary adjustment of the position of the lower wafer in space, and then achieve rough alignment of the lower wafer and the upper wafer; the piezoelectric platform 643 uses its own high-precision characteristics to further adjust the position of the lower wafer after the rough alignment of the lower wafer and the upper wafer, so as to achieve fine alignment of the lower wafer and the upper wafer. The rough alignment is achieved through the six-axis platform 642, and the fine alignment is achieved through the piezoelectric platform 643, so that the alignment accuracy can be effectively improved under the premise of ensuring the alignment efficiency. More specifically, the six-axis platform 642 includes a ring plate located at the top and a fixed plate 481 located at the bottom, the ring plate is connected to the piezoelectric platform 643, the fixed plate 481 is connected to the bottom of the box 61, the ring plate and the fixed plate 481 are movably connected through six telescopic drive pairs, and the six-degree-of-freedom spatial movement of the ring plate is realized through the cooperation of the six telescopic drive pairs; the piezoelectric platform 643 is a square ring structure, the piezoelectric platform 643 includes a base and an output part, the output part is installed on the top of the base through a piezoelectric drive structure and is connected to the mounting seat 651, the piezoelectric drive structure utilizes the inverse piezoelectric effect of the piezoelectric ceramic material, and generates spatial movement by controlling the mechanical deformation of the piezoelectric ceramic material, thereby realizing the spatial movement of the output part.

[0076] It should be noted that the operation of traditional motors will emit tiny particles and molecular precipitation, which can easily pollute the vacuum environment of the alignment cavity 611. The alignment drive 64 of this embodiment adopts a combined structure of a six-axis platform 642 and a piezoelectric platform 643, which can avoid the precipitation of tiny particles and molecules, thereby avoiding the pollution of the vacuum environment.

[0077] Furthermore, in this embodiment, a damping spring 644 is provided between the mounting seat 651 and the top of the six-axis platform 642. The damping spring 644 can share part of the weight of the mounting seat 651 and the accessory structure, thereby reducing the load-bearing capacity of the piezoelectric platform 643, and further preventing the piezoelectric platform 643 from being crushed. Specifically, the damping spring 644 includes a pin shaft and a spring body, the lower end of the pin shaft is fixed to the top of the six-axis platform 642, the upper end gap of the pin shaft passes through the bottom of the mounting seat 651, the spring body is sleeved on the pin shaft and is in a compressed posture, and the two ends of the spring body are respectively abutted against the six-axis platform 642 and the mounting seat 651, so that the elastic force generated by the compression of the spring body is used to share part of the weight of the mounting seat 651 and the accessory structure.

[0078] It should be noted that, in order to cooperate with other components, the positioning drive member 64 is also provided with a first avoidance hole 641. For better understanding, the specific function of the first avoidance hole 641 will be explained in conjunction with the corresponding components in the following text.

[0079] The lower electrostatic suction cup 65 is indirectly fixed above the output portion of the alignment driving member 64 through the mounting seat 651 .

[0080] It should be noted that, in order to cooperate with other components, the lower electrostatic suction cup 65 is also provided with an imaging window 681, a lifting hole 652 and a second avoidance hole 653. For better understanding, the specific functions of the imaging window 681, the lifting hole 652 and the second avoidance hole 653 are explained in conjunction with the corresponding components in the following text.

[0081] Among them, the pin mechanism 66 serves as the lifting structure of the visual alignment device 6 and includes a lifting plate 661. The lifting plate 661 is located below the lower electrostatic suction cup 65. The lower electrostatic suction cup 65 is provided with at least three lifting holes 652 distributed along the circumferential direction. The lifting plate 661 is provided with a needle body 662 corresponding to the lifting hole 652. The lifting plate 661 is installed on the mounting seat 651 and is driven to be lifted vertically so that the needle body 662 passes through the lifting hole 652 to lift the upper wafer or the lower wafer. During operation, the robot 27 first sends the upper wafer into the alignment chamber 611, and the needle body 662 rises to lift the upper wafer until it contacts the lower surface of the upper electrostatic suction cup 63. At the same time, the upper electrostatic suction cup 63 adsorbs the upper wafer through static electricity; then the needle body 662 falls back to its original position, and the robot 27 sends the lower wafer into the alignment chamber 611, and the needle body 662 rises to lift the lower wafer. After the robot 27 exits the alignment chamber 611, the needle body 662 falls back to its original position, so that the lower wafer is adsorbed on the upper surface of the lower electrostatic suction cup 65.

[0082] It is easy to understand that there are at least three lifting holes 652, the main purpose of which is to ensure the stability of the needle body 662 in lifting the wafer; the main purpose of the lifting hole 652 is to avoid the movement of the needle body 662 so that the needle body 662 can penetrate the lower electrostatic suction cup 65 to contact the wafer.

[0083] Among them, the shell of the pre-bonding drive 67 is fixed on the frame 1 and is located below the box 61. The output shaft of the pre-bonding drive 67 is sealed and passes through the bottom wall of the box 61. The middle part of the alignment drive 64 is provided with a vertically arranged first avoidance hole 641, and the middle part of the lower electrostatic suction cup 65 is provided with a vertically arranged second avoidance hole 653. The output shaft of the pre-bonding drive 67 is used to sequentially pass through the first avoidance hole 641 and the second avoidance hole 653 and then lift the lower wafer. After the lower wafer completes the visual alignment with the upper wafer, the pre-bonding drive 67 moves to make its output shaft rise and pass through the first avoidance hole 641 and the second avoidance hole 653 in sequence, and then lift the lower wafer to contact the upper wafer, so as to complete the pre-bonding of the upper wafer and the lower wafer.

[0084] It should be noted that during rough alignment, the six-axis platform 642 has adjusted the gap between the upper wafer and the lower wafer to a smaller size, so the pre-bonding drive 67 has little impact on the position accuracy of the lower wafer when lifting the lower wafer, which can meet the process requirements.

[0085] It is easy to understand that the inner hole of the ring plate of the six-axis platform 642 and the inner hole of the square ring structure of the piezoelectric platform 643 together form the first avoidance hole 641. The first avoidance hole 641 and the second avoidance hole 653 are mainly used to avoid the movement of the output shaft of the pre-bonding drive 67, so that the output shaft of the pre-bonding drive 67 can sequentially pass through the alignment drive 64 and the lower electrostatic suction cup 65 to contact the lower wafer.

[0086] Specifically, the pre-bonding driving member 67 of this embodiment is an electric cylinder with high precision.

[0087] The optical mechanism 68 is mounted on the gantry 62, and the lower electrostatic chuck 65 and / or the upper electrostatic chuck 63 are provided with an imaging window 681, and the optical mechanism 68 is used to obtain the upper wafer image and the lower wafer image through the imaging window 681. When working, the optical mechanism 68 obtains the upper wafer image and the lower wafer image, and determines the direction and magnitude of the compensation displacement of the lower wafer by the position difference between the upper wafer mark and the lower wafer mark.

[0088] It should be understood that the imaging window 681 can be opened only on the lower electrostatic chuck 65. In this case, the optical mechanism 68 needs to be arranged below the lower electrostatic chuck 65, and a penetrating infrared optical element needs to be used to simultaneously acquire the upper wafer image and the lower wafer image; the imaging window 681 can also be opened only on the upper electrostatic chuck 63. In this case, the optical mechanism 68 needs to be arranged above the upper electrostatic chuck 63, and a penetrating infrared optical element needs to be used to simultaneously acquire the upper wafer image and the lower wafer image; the imaging window 681 can also be set on both the upper electrostatic chuck 63 and the lower electrostatic chuck 65. The optical mechanism 68 needs to have two sets of visual components and be respectively located below the lower electrostatic chuck 65 and above the upper electrostatic chuck 63 to respectively acquire the upper wafer image and the lower wafer image. This embodiment adopts this solution.

[0089] Specifically, the optical mechanism 68 of the present embodiment includes an upper visual component 682 and a lower visual component 683 that are symmetrically distributed. The upper visual component 682 and the lower visual component 683 are fixedly connected by a connecting frame 684. The lower electrostatic chuck 65 and the upper electrostatic chuck 63 are both provided with an imaging window 681. The upper visual component 682 is mounted on the top beam of the gantry 62 and is used to obtain the upper wafer image through the imaging window 681 of the upper electrostatic chuck 63. The lower visual component 683 is located below the lower electrostatic chuck 65 and is used to obtain the lower wafer image through the imaging window 681 of the lower electrostatic chuck 65. It is easy to understand that since the upper visual component 682 and the lower visual component 683 are fixedly connected and symmetrically distributed by the connecting frame 684, the relative position of the upper visual component 682 and the lower visual component 683 is determined, and the relative position of the acquired upper wafer image and lower wafer image is also determined. During operation, the upper wafer image and the lower wafer image are acquired respectively through the upper visual component 682 and the lower visual component 683, so as to achieve the purpose of high definition and low distortion, thereby being more conducive to ensuring the pre-bonding accuracy.

[0090] Furthermore, the upper visual component 682 of this embodiment is slidably mounted on the top beam of the gantry 62 through a guide rail pair 685, the sliding direction of the upper visual component 682 is perpendicular to the in-and-out direction of the robot 27, and the upper visual component 682 is connected to a driving member for driving its sliding. The guide rail pair 685 can make the upper visual component 682 and the lower visual component 683 move on both sides relative to the in-and-out direction of the robot 27, so that it can be suitable for visual alignment of wafers of different specifications or different marks.

[0091] Furthermore, the upper visual component 682 of this embodiment is equipped with a guide rail pair 685 on one side of its sliding direction, and the upper visual component 682 is equipped with a vacuum slide 686 on the other side of its sliding direction as a driving member. The vacuum slide 686 not only serves as a power element but also has a supporting and guiding function, which can further save space and is more conducive to reducing the overall volume of the device.

[0092] It should be noted that, in the present embodiment, both the upper electrostatic chuck 63 and the lower electrostatic chuck 65 are provided with two imaging windows 681, two marks are provided on the upper wafer and the lower wafer, and the optical mechanism 68 is provided with two sets symmetrically distributed on the left and right. The two sets of optical mechanisms 68 respectively capture the two marks on the upper wafer or the lower wafer through the two imaging windows 681 to more accurately determine the position of the upper wafer or the lower wafer.

[0093] In addition, the visual alignment device 6 of this embodiment also includes an ejection drive 69, the shell of the ejection drive 69 is fixed above the top beam of the gantry 62, and the upper electrostatic suction cup 63 is also provided with a through hole 631. The output shaft of the ejection drive 69 is arranged downward and is used to eject the pre-bonded wafer after passing through the through hole 631. During operation, after the lower wafer and the upper wafer are pre-bonded, even if the upper electrostatic suction cup 63 is powered off, there may still be residual static electricity between the upper wafer and the upper electrostatic suction cup 63, causing the wafer not to fall off. Therefore, this embodiment adds an ejection drive 69 to eject the wafer after pre-bonding, so that the wafer is separated from the upper electrostatic suction cup 63 and falls on the robot 27 to ensure the smooth progress of subsequent processes.

[0094] It is easy to understand that the through hole 631 is mainly used to prevent the output shaft of the ejection driving member 69 from moving, so that the output shaft of the ejection driving member 69 can pass through the upper electrostatic chuck 63 to contact the upper wafer.

[0095] Specifically, the ejection driving member 69 of this embodiment is an electric push rod.

[0096] The working process of the visual alignment device 6 of this embodiment is as follows: S1. The chamber 611 surrounded by the box 61 is evacuated so that the vacuum degree of the chamber 611 meets the process requirements; S2. The robot 27 carries the upper wafer and delivers the upper wafer into the alignment chamber 611 through the fourth operating window 612. The ejector pin 4522 rises to lift the upper wafer to the lower surface of the upper electrostatic chuck 63. The upper electrostatic chuck 63 is energized and absorbs the upper wafer by static electricity. The robot 27 exits the alignment chamber 611. S3. The robot 27 carries the lower wafer and delivers the lower wafer into the alignment chamber 611 through the fourth operating window 612. The ejector pin 4522 rises to lift the lower wafer to detach from the robot 27. The robot 27 exits the alignment chamber 611. The ejector pin 4522 falls back to make the lower wafer fall on the upper surface of the lower electrostatic chuck 65. The lower electrostatic chuck 65 is energized and absorbs the lower wafer by static electricity. S4. The upper visual component 682 acquires the upper wafer image through the imaging window 681 of the upper electrostatic chuck 63, and the lower visual component 683 acquires the lower wafer image through the imaging window 681 of the lower electrostatic chuck 65, and determines the direction and magnitude of the compensation displacement of the lower wafer by the position difference between the mark of the upper wafer image and the mark of the lower wafer image; S5. The lower wafer is roughly aligned by the six-axis platform 642, and the lower wafer is finely aligned by the piezoelectric platform 643, so that the mark of the lower wafer image and the mark of the upper wafer image overlap, and the alignment is completed; S6. The pre-bonding drive 67 moves to lift the lower wafer to contact the upper wafer, and the lower wafer and the upper wafer are adsorbed by electrostatic attraction to complete pre-bonding; S7. The robot 27 enters the alignment chamber 611 through the fourth operating window 612, and the ejection drive 69 is actuated to eject the pre-bonded wafer to detach it from the upper electrostatic chuck 63 and drop it onto the robot 27. The robot 27 carries the pre-treated wafer out of the alignment chamber 611.

[0097] Bonding device 7: Reference Figures 15 to 21 The bonding device 7 of this embodiment includes a cavity shell 71, a cover assembly 72, a bonding assembly 73 and a cooling assembly 74.

[0098] The cavity shell 71 is fixed on the frame 1 and has an open top, and a fifth operating window 711 is provided on a side wall of the cavity shell 71 .

[0099] Specifically, the on-off valve of this embodiment is a gate valve, which is easy to operate and has good sealing performance.

[0100] It should be noted that the bottom of the cavity shell 71 is closed, and the bottom of the cavity shell 71 can be integrally formed with the main body of the cavity shell 71, or can be sealed and connected using a split structure. For example, in this embodiment, in order to facilitate the installation of the internal parts of the cavity shell 71, an installation opening is opened in the middle of the bottom of the cavity shell 71, and a bottom plate 713 is detachably connected below the installation opening.

[0101] The cover assembly 72 includes a cover plate 721, which is connected to an opening and closing driving member 722. The opening and closing driving member 722 drives the cover plate 721 to move so that the cover plate 721 has a closed state in which it is sealed and covered on the top of the cavity shell 71, and an open state in which it is detached from the top of the cavity shell 71.

[0102] It is easy to understand that a sealing ring can be provided between the cover plate 721 and the cavity shell 71 to ensure sealing.

[0103] Specifically, in this embodiment, a mounting plate 723 is provided above the cover plate 721, the mounting plate 723 is parallel to the cover plate 721 and a mounting space 724 is left between them, and the cover plate 721 and the mounting plate 723 are fixedly connected by a connecting column 725. The mounting space 724 and the top of the mounting plate 723 can be used to install other components, which is more suitable for the scene where more components need to be installed above the cover plate 721.

[0104] Specifically, the opening and closing driving member 722 of this embodiment includes a fixed seat 7221 provided on the frame 1, a mounting plate 723 is movably connected to the fixed seat 7221 and is connected to a linear telescopic pair 7222 installed on the frame 1, and the linear telescopic pair 7222 drives the mounting plate 723 to rotate to achieve the state switching of the cover plate 721. More specifically, the linear telescopic pair 7222 of this embodiment adopts a cylinder with a locking function, which can lock the cover plate 721 when it is in a closed state to ensure the safety of the equipment operation.

[0105] Furthermore, a fixing column is provided on the frame 1, and the cover 721 is provided with a buffer 726 extending outward from below it. The buffer 726 cooperates with the fixing column to provide buffering before the cover 721 switches to a closed state, thereby avoiding collision between the cover 721 and the cavity shell 71 and causing structural damage.

[0106] The bonding assembly 73 includes an inverted barrel-shaped lower bonding stage 736, the bottom open end of the lower bonding stage 736 is sealed and fixed to the bottom of the cavity shell 71 so that the lower bonding stage 736, the cavity shell 71 and the cover plate 721 form a closed bonding cavity, and the bonding assembly 73 also includes an upper heating plate 731 and a lower heating plate 732. The upper heating plate 731 is suspended in the bonding cavity by a lifting shaft 733 that seals and penetrates the cover plate 721. The lifting shaft 733 is connected to a first lifting drive member 734 installed above the cover plate 721. The lower heating plate 732 is supported on the inner side of the lower bonding stage 736 by a plurality of support columns 735 fixed to the bottom of the cavity shell 71. The lower heating plate 732 and the top end plate of the lower bonding stage 736 are connected. Contacted by the first graphite pad 737, the side wall of the lower bonding platform 736 is provided with a deformation portion 7361 for axial buffering, and the top edge of the lower bonding platform 736 is evenly distributed with a plurality of notch grooves 7362 along the circumferential direction. The bonding assembly 73 also includes a pin structure 738, and the pin structure 738 includes a lifting ring 7381 located on the outer side of the lower bonding platform 736 and coaxially arranged, and the lifting ring 7381 is connected to a second lifting drive member 7382, and the shell of the second lifting drive member 7382 is fixed under the cavity shell 71 and the output shaft seal passes through the bottom of the cavity shell 71, and the inner ring of the lifting ring 7381 is provided with a needle member 7383, and the needle member 7383 corresponds to the notch groove 7362 one by one and is placed in the corresponding notch groove 7362. During operation, the robot 27 sends the wafer into the bonding chamber from the fifth operating window 711, and the second lifting drive 7382 drives the lifting ring 7381 to rise, so that the needle 7383 supports the wafer, and then the robot 27 withdraws from the bonding chamber, and the opening and closing valve is closed. Then the second lifting drive 7382 drives the lifting ring 7381 to descend so that the wafer falls on the upper surface of the lower bonding table 736, and finally the first lifting drive 734 drives the upper heating plate 731 to descend to press the wafer, and the wafer completes bonding under the combined action of pressure and heat.

[0107] Specifically, the first lifting drive member 734 of the present embodiment is an electric cylinder, the housing of which is fixed above the mounting plate 723 , the output shaft of which passes through the mounting plate 723 and the lower end of which is fixedly connected to the lifting shaft 733 .

[0108] It should be noted that the first graphite pad 737 has two functions: first, the first graphite pad 737 itself has toughness, so that the distance between the lower heating plate 732 and the lower bonding platform 736 has a certain adjustment range, and then cooperates with the deformation part 7361 to compensate for the dimensional change of the upper heating plate 731 or the lower heating plate 732 in the thickness direction due to heat, thereby avoiding the upper heating plate 731 from exerting excessive pressure on the wafer after it descends a set distance; second, the first graphite pad 737 has good thermal conductivity, and can evenly transfer the heat of the lower heating plate 732 to the entire surface of the first graphite pad 737, thereby making the heat distribution of the lower bonding platform 736 more uniform.

[0109] Specifically, the deformation portion 7361 of the present embodiment is configured as a rectangular bellows 471 segment. The force required for deformation of the rectangular bellows 471 segment should be less than the maximum pressure that the wafer can withstand. Thus, the rectangular bellows 471 segment will be deformed before the wafer is subjected to the maximum pressure. This can prevent the wafer from being damaged due to excessive pressure.

[0110] It is easy to understand that the bonding chamber needs to be connected to a vacuum pumping assembly and a vacuum gauge 415 for detecting the vacuum degree to meet the vacuum degree requirement of the bonding chamber, which is well known to those skilled in the art.

[0111] Specifically, the support columns 735 of this embodiment are height-adjustable adjustment rods. When installing, the lower heating plate 732 can be leveled by adjusting the height of each support column 735.

[0112] Furthermore, in this embodiment, a flange 712 is formed on the top edge of the chamber shell 71, and the flange 712 is uniformly distributed with a plurality of first through holes 7121 along the axial direction. The cover plate 721 is provided with a second through hole 7211 corresponding to the first through hole 7121. When the cover plate 721 is in a closed state, it is leveled by a pair of bolts 7333 inserted in the first through hole 7121 and the second through hole 7211. Since the chamber shell 71 is fixed on the frame 1, the levelness of the top surface of the chamber shell 71 is guaranteed by the structural accuracy. Therefore, when the cover plate 721 is in a closed state, the levelness of a local position of the cover plate 721 can be adjusted by screwing the nuts 4852 of the pair of bolts 7333, and the levelness of the entire cover plate 721 can be adjusted by a plurality of pairs of bolts 7333. Since the upper heating plate 731 is installed on the cover plate 721, the horizontality of the upper heating plate 731 is also adjusted when the cover plate 721 is leveled, so as to cooperate with the leveling of the aforementioned lower heating plate 732, so that the upper heating plate 731 and the lower heating plate 732 can be basically parallel, thereby ensuring uniform pressure during wafer bonding.

[0113] Furthermore, in this embodiment, a pressure block 7331 is provided below the lifting shaft 733. The pressure block 7331 is a type structure formed by a connecting shaft 73311 and a pressure plate 73312. The connecting shaft 73311 is screwed to the middle part of the bottom surface of the lifting shaft 733. A support ring 7332 is sleeved on the connecting shaft 73311 and the outer diameter of the support ring 7332 is larger than the diameter of the lifting shaft 733. The support ring 7332 is clamped between the lifting shaft 733 and the pressure plate 73312. The upper heating plate 731 is hoisted on the support ring 7332 by vertically arranged bolts 7333. The upper heating plate 731 is in contact with the pressure plate 73312 through a gasket 7334 to transmit pressure, and the lower surface of the pressure plate 73312 is set to be a spherical surface. During operation, the wafer is placed on the lower bonding table 736. When the upper heating plate 731 contacts the wafer, if there is a slight tilt, it can be fine-tuned through the cooperation of the spherical surface and the pad 7334 until the upper heating plate 731 is attached to the wafer in a parallel posture, further ensuring uniform pressure during wafer bonding.

[0114] Specifically, in this embodiment, an annular block 7335 is provided between the support ring 7332 and the upper heating plate 731, a pressure ring 7336 is provided above the support ring 7332, and a bolt 7333 passes through the pressure ring 7336, the support ring 7332, the annular block 7335 and the upper heating plate 731 from top to bottom in sequence. The annular block 7335 makes the upper heating plate 731 indirectly contact with the support ring 7332, which can improve the stability of the lower heating plate 732 during bonding. The pressure transmitted to the support ring 7332 by the bolt 7333 is more uniform through the pressure ring 7336, avoiding local deformation. It should be understood that when the upper heating plate 731 is fine-tuned with the cooperation of the spherical surface and the pad 7334, the adjustment range is very small, which can be ensured by the assembly gap between the structures.

[0115] Specifically, the upper heating plate 731 of the present embodiment includes a plate body 7311, and the lower surface of the plate body 7311 is detachably fixed with a third graphite pad 7312 and a pasting plate 7313 in turn, and the lower surface of the pasting plate 7313 is provided with a fourth graphite pad 7314. Since the upper heating plate 731 has a relatively complex structure and a relatively high cost, if the upper heating plate 731 is directly used to contact the wafer for bonding, the upper heating plate 731 is very likely to be damaged by collision, so the present embodiment adds a pasting plate 7313 below the upper heating plate 731, and adds a third graphite pad 7312 between the pasting plate 7313 and the upper heating plate 731, so that the pasting plate 7313 and the third graphite pad 7312 can protect the upper heating plate 731 and ensure the service life of the upper heating plate 731, and the pasting plate 7313 can be replaced when it is damaged. Similarly, the lower bonding stage 736 can also protect the lower heating plate 732, and the lower bonding stage 736 can be replaced when it is damaged. More specifically, the third graphite pad 7312, the pasting plate 7313 and the fourth graphite pad 7314 can be fixed by means of clips located on the side walls or other common methods.

[0116] Specifically, the second lifting drive member 7382 of this embodiment is a cylinder.

[0117] Among them, the cooling assembly 74 includes an upper cooling plate 741 and a lower cooling plate 742. The upper cooling plate 741 is suspended on the inner side of the cavity shell 71 through a first water pipe 743 that is sealed and penetrates the cover plate 721. The upper cooling plate 741 is an annular plate and is slidably sleeved on the lifting shaft 733. The first water pipe 743 is connected to a third lifting drive member 744 installed above the cover plate 721. The lower cooling plate 742 is a porous plate and is slidably sleeved on all support columns 735. The lower cooling plate 742 is connected to a second water pipe that penetrates the bottom of the cavity shell 71. The bottom of the cavity shell 71 is installed with a fourth lifting drive member 745 for driving the lower cooling plate 742 to rise and fall.

[0118] Specifically, the third lifting drive member 744 is a cylinder, the cylinder body of which is located in the installation space 724 and fixed on the cover plate 721, and the piston rod of the cylinder is fixedly connected to the first water pipe 743; the fourth lifting drive member 745 is also a cylinder, the cylinder body of which is fixed under the cavity shell 71, and the piston rod of the cylinder passes through the bottom of the cavity shell 71 and is used to lift the lower cooling plate 742.

[0119] Specifically, the lower cooling plate 742 includes a cooling base plate 7421 and a cooling cover plate 7422. A water storage tank 74211 is provided on the surface of the cooling base plate 7421. The cooling cover plate 7422 is fixed on the surface of the cooling base plate 7421 to close the water storage tank 74211 to form a circulating water channel.

[0120] It is easy to understand that both the first water pipe 743 and the second water pipe need to be provided with two, one as the water inlet pipe and the other as the water outlet pipe. The circulating cooling water enters the upper cooling plate 741 or the lower cooling plate 742 from the water inlet pipe and is then discharged from the water outlet pipe. In this way, the heat of the upper heating plate 731 or the lower heating plate 732 is taken away by the circulating cooling water, thereby achieving cooling.

[0121] It should be noted that the second water pipe is not shown in the drawings, and its arrangement is the same as the first water pipe 743 . However, since the lower cooling plate 742 is outside the bonding cavity, the second water pipe does not need to be sealed through the bottom of the cavity shell 71 .

[0122] Furthermore, in this embodiment, a second graphite pad 739 is provided on the upper surface of the upper heating plate 731 and the lower surface of the lower heating plate 732, and the second graphite pad 739 located on the lower surface of the lower heating plate 732 is adapted to the shape of the lower cooling plate 742. The main function of the second graphite pad 739 is to utilize its good thermal conductivity to facilitate heat conduction from the upper heating plate 731 to the upper cooling plate 741 or from the lower heating plate 732 to the lower cooling plate 742, thereby achieving uniform and rapid heat dissipation. Specifically, the second graphite pad 739 can be fixed by a buckle located on the side wall or other common methods.

[0123] Furthermore, the cooling assembly 74 of this embodiment also includes a cooling pipe group 746 provided on the outer wall of the cavity shell 71. The cooling pipe group 746 can cool the bonding cavity to improve the cooling efficiency.

[0124] It should be noted that the lower bonding table 736, the cavity shell 71 and the cover plate 721 form a closed bonding cavity, so the lifting shaft 733, the first water pipe 743, the output shaft of the second lifting drive member 7382 and other components located in the bonding cavity all need to be subjected to sliding sealing treatment to ensure the sealing; however, the second water pipe, the output shaft of the fourth lifting drive member 745 and other components located outside the bonding cavity do not need to be sealed, and an ordinary sliding structure can be used.

[0125] The working process of the bonding device 7 used in the wafer bonding equipment of this embodiment is as follows: S1. Evacuate the bonding chamber to make its vacuum degree meet the requirements; S2. The robot 27 picks up the wafer and delivers the wafer to the bonding chamber through the fifth operating window 711. The needle 7383483 rises to lift the wafer to detach from the robot 27. The robot 27 exits the bonding chamber, and the needle 7383483 falls to make the wafer fall on the lower bonding table 736. S3. The upper heating plate 731 descends to bond the wafer; S4. Bonding is completed, and the upper heating plate 731 is reset; S5. The upper cooling plate 741 descends to contact the upper heating plate 731 to cool the upper heating plate 731 , and at the same time, the lower cooling plate 742 ascends to contact the lower heating plate 732 to cool the lower heating plate 732 .

[0126] The working process of the cluster type high vacuum wafer bonding equipment of this embodiment is as follows: S1. Vacuum the operating device 2 and each functional device to meet the process requirements; S2. The first valve 21 is opened, the robot 27 moves to transfer the wafer from the feed chamber to the operating chamber, and then the first valve 21 is closed; S3. The second valve 22 is opened, the robot 27 moves the wafer from the operating chamber to the baking chamber, the second valve 22 is closed, and the wafer is baked. After baking, the second valve 22 is opened again, the robot 27 transfers the wafer from the baking chamber to the operating chamber, and the second valve 22 is closed; S4. The third valve 23 is opened, the manipulator 27 moves to transfer the wafer from the operating chamber to the activation chamber, the third valve 23 is closed, and the wafer is subjected to plasma activation processing. After the activation is completed, the third valve 23 is opened again, the manipulator 27 transfers the wafer from the activation chamber to the operating chamber, and the third valve 23 is closed; S5. The fourth valve 24 is opened, the robot 27 moves to transfer the wafer from the operation chamber to the alignment chamber 611, the fourth valve 24 is closed, and the wafer is visually aligned and pre-bonded. After the pre-bonding is completed, the fourth valve 24 is opened again, the robot 27 transfers the wafer from the alignment chamber 611 to the operation chamber, and the fourth valve 24 is closed; S6. The fifth valve 25 is opened, the manipulator 27 moves to transfer the wafer from the operating chamber to the bonding chamber, the fifth valve 25 is closed, and the wafer is bonded. After the bonding is completed, the fifth valve 25 is opened again, the manipulator 27 transfers the wafer from the bonding chamber to the operating chamber, and the fifth valve 25 is closed; S7. The sixth valve 26 is opened, the robot 27 moves to transfer the wafer from the operating chamber to the discharge chamber, and the sixth valve 26 is closed.

[0127] It should be noted that the various functional devices can be operated simultaneously without interference to ensure production efficiency.

[0128] The above is only a specific implementation of the present invention, which enables those skilled in the art to understand or implement the present invention. Although detailed descriptions are given with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments, and they should all be covered by the protection scope of the claims.

Claims

1. A cluster type high vacuum wafer bonding equipment, characterized in that: The machine frame (1) comprises an operating device (2) and a plurality of functional devices spaced apart along the circumference of the operating device (2), wherein the functional devices comprise a feeding device (3), a baking device (4), a plasma activation device (5), a visual alignment device (6), a bonding device (7) and a discharging device (8); The operating device (2) is provided with an operating cavity, and a docking window is provided on the side wall of the operating cavity corresponding to each functional device. A robot (27) is installed in the operating cavity, and the robot (27) is used to penetrate the docking window and extend into the corresponding functional device to realize the transfer of the wafer; The feeding device (3) is provided with a feeding cavity, a side wall of the feeding cavity is provided with a first operating window (612), and the first operating window (612) is docked with a corresponding docking window via a first valve (21); The baking device (4) is provided with a baking cavity, a side wall of the baking cavity is provided with a second operating window (411), and the second operating window (411) is docked with a corresponding docking window via a second valve (22); The plasma activation device (5) is provided with an activation cavity, a side wall of the activation cavity is provided with a third operating window (612), and the third operating window (612) is docked with a corresponding docking window via a third valve (23); The visual alignment device (6) is provided with an alignment cavity (611), a side wall of the alignment cavity (611) is provided with a fourth operating window (612), and the fourth operating window (612) is docked with a corresponding docking window via a fourth valve (24); The bonding device (7) is provided with a bonding cavity, a side wall of the bonding cavity is provided with a fifth operating window (711), and the fifth operating window (711) is docked with a corresponding docking window via a fifth valve (25); The discharge device (8) is provided with a discharge cavity, and a side wall of the discharge cavity is provided with a sixth operating window (612), and the sixth operating window (612) is docked with a corresponding docking window through a sixth valve (26).

2. The cluster-type high vacuum wafer bonding equipment according to claim 1, characterized in that: The feeding device (3), the baking device (4), the plasma activation device (5), the bonding device (7), the visual alignment device (6) and the discharging device (8) are sequentially spaced apart along the circumference of the operating device (2).

3. The cluster-type high vacuum wafer bonding equipment according to claim 1 or 2, characterized in that: The robot (27) is driven to rotate along a vertical axis and to extend and retract along the radial direction of the operating cavity. Each functional device is provided with a lifting structure for lifting a wafer. The lifting structure cooperates with the robot (27) to complete the placement and removal of the wafer.

4. The cluster-type high vacuum wafer bonding equipment according to claim 3, characterized in that: Storage racks for storing wafers are installed in both the feed cavity and the discharge cavity. The storage racks are provided with multiple layers of storage positions distributed in the vertical direction. The storage racks are driven to rise and fall so that the robot (27) can dock with different layers of storage positions on the storage racks and the storage racks can also serve as the lifting structure.

5. The cluster-type high vacuum wafer bonding equipment according to claim 3, characterized in that: The baking device (4) comprises: A baking oven (41), which is fixed on the frame (1), and the front side wall of the baking oven (41) is provided with the second operating window (411); A vacuum extraction mechanism (42) fixed on the frame (1) and connected to the inner cavity of the baking oven (41); a hot plate carrier box (43) installed in the baking oven (41) and capable of sliding in a vertical direction, the front side of the hot plate carrier box (43) being open and butted against a front side wall of the baking oven (41), a plurality of horizontally arranged heating plates (431) being fixed in the hot plate carrier box (43), and the plurality of heating plates (431) being spaced apart in a vertical direction; A first lifting rod (44), which seals and penetrates the bottom wall of the baking box (41) and is connected to the bottom wall of the hot plate carrier box (43); the first lifting rod (44) is connected to a first driving member (441) for driving the first lifting rod (44) to move up and down; the first driving member (441) drives the hot plate carrier box (43) to move up and down through the first lifting rod (44) so ​​that each heating plate (431) can be aligned with the operating window (612); A supporting mechanism (45) is provided as a lifting structure of the baking device (4) and comprises a mounting frame (451) mounted in the baking box (41) and capable of sliding in a vertical direction, a plurality of supporting assemblies (452) being provided on the mounting frame (451), the plurality of supporting assemblies (452) being arranged in a one-to-one correspondence with the heating plates (431), a plurality of avoidance windows (432) being provided on the rear side wall of the hot plate carrier box (43) corresponding to the plurality of supporting assemblies (452), the supporting assemblies (452) being arranged in a one-to-one correspondence with the heating plates (431), 452) comprises a mounting plate (4521), the rear end of the mounting plate (4521) is fixedly connected to the mounting frame (451), the front end of the mounting plate (4521) extends into the hot plate carrier box (43) through the corresponding avoidance window (432) and is located below the corresponding heating plate (431), a ejector pin (4522) is fixed above the front end of the mounting plate (4521), and a through hole is opened on the heating plate (431) at a position corresponding to the ejector pin (4522); A second lifting rod (46) sealably passes through the bottom wall of the baking oven (41) and is located directly below the mounting frame (451). The second lifting rod (46) is connected to a second driving member (461) for driving the lifting of the second lifting rod (46). The second driving member (461) lifts the supporting mechanism (45) via the second lifting rod (46) so that the ejector pin (4522) can pass through the corresponding through hole and lift the corresponding wafer.

6. The cluster-type high vacuum wafer bonding equipment according to claim 5, characterized in that: The inner sides of the top wall, bottom wall, left wall, right wall and rear wall of the hot plate carrier box (43) are all provided with a first heat reflection screen, and the inner side of the front wall of the baking box (41) is provided with a second heat reflection screen.

7. The cluster-type high vacuum wafer bonding equipment according to claim 1, characterized in that: The visual alignment device (6) comprises: A box body (61) fixed on the frame (1), the side wall of the box body (61) being provided with the fourth operating window (612); A gantry (62) fixed in the alignment cavity (611); An upper electrostatic suction cup (63) fixed below the top beam of the gantry (62); An alignment driving member (64) is located in the gantry (62) and mounted on the bottom wall of the box (61), wherein an output portion of the alignment driving member (64) is located at the top thereof and is used to output spatial six-degree-of-freedom motion; A lower electrostatic suction cup (65) which is indirectly fixed above the output portion of the alignment driving member (64) via a mounting seat (651); A pin mechanism (66) serving as a lifting structure of the visual alignment device (6) and comprising a lifting plate (661), wherein the lifting plate (661) is located below the lower electrostatic chuck (65), wherein the lower electrostatic chuck (65) is provided with at least three lifting holes (652) distributed along the circumferential direction, wherein a pin body (662) is provided on the lifting plate (661) corresponding to the lifting hole (652), and wherein the lifting plate (661) is mounted on the mounting seat (651) and is driven to be lifted vertically so that the pin body (662) passes through the lifting hole (652) to lift the upper wafer or the lower wafer; A pre-bonding drive member (67), the shell of which is fixed on the frame (1) and is located below the box body (61); the output shaft of the pre-bonding drive member (67) is sealed and passes through the bottom wall of the box body (61); a first avoidance hole (641) arranged vertically is provided in the middle of the alignment drive member (64); a second avoidance hole (653) arranged vertically is provided in the middle of the lower electrostatic suction cup (65); the output shaft of the pre-bonding drive member (67) is used to pass through the first avoidance hole (641) and the second avoidance hole (653) in sequence and then lift the lower wafer; An optical mechanism (68) is mounted on the gantry (62); the lower electrostatic chuck (65) and / or the upper electrostatic chuck (63) are provided with an imaging window (681); and the optical mechanism (68) is used to obtain an upper wafer image and a lower wafer image through the imaging window (681).

8. The cluster-type high vacuum wafer bonding equipment according to claim 7, characterized in that: The optical mechanism (68) comprises an upper visual component (682) and a lower visual component (683) which are symmetrically distributed. The upper visual component (682) is fixedly connected to the lower visual component (683) via a connecting frame (684). Both the lower electrostatic chuck (65) and the upper electrostatic chuck (63) are provided with imaging windows (681). The upper visual component (682) is mounted on the top beam of the gantry (62) and is used to obtain an image of an upper wafer through the imaging window (681) of the upper electrostatic chuck (63). The lower visual component (683) is located below the lower electrostatic chuck (65) and is used to obtain an image of a lower wafer through the imaging window (681) of the lower electrostatic chuck (65).

9. The cluster-type high vacuum wafer bonding equipment according to claim 1, characterized in that: The bonding device (7) comprises: A chamber shell (71) fixed on the frame (1) and having an open top, wherein a fifth operating window (711) is provided on a side wall of the chamber shell (71); A cover assembly (72), comprising a cover plate (721), the cover plate (721) being connected to an opening and closing driving member (722), the opening and closing driving member (722) driving the cover plate (721) to move so that the cover plate (721) has a closed state in which it is sealed and covered on the top of the cavity shell (71), and an open state in which it is detached from the top of the cavity shell (71); A bonding assembly (73) comprises an inverted barrel-shaped lower bonding stage (736), the bottom open end of the lower bonding stage (736) being sealed and fixed to the bottom of the chamber shell (71) so that the lower bonding stage (736), the chamber shell (71) and the cover plate (721) form a closed bonding chamber, the bonding assembly (73) further comprises an upper heating plate (731) and a lower heating plate (732), the upper heating plate (731) being suspended in the bonding chamber by a lifting shaft (733) sealingly penetrating the cover plate (721), the lifting shaft (733) being connected to a first lifting drive member (734) installed above the cover plate (721), the lower heating plate (732) being supported on the inner side of the lower bonding stage (736) by a plurality of support columns (735) fixed to the bottom of the chamber shell (71), the lower heating plate (732) and the top end plate of the lower bonding stage (736) being connected by a first graphite The lower bonding platform (736) is in contact with the pad (737), the side wall of the lower bonding platform (736) is provided with a deformation portion (7361) for axial buffering, the top edge of the lower bonding platform (736) is uniformly distributed with a plurality of notch grooves (7362) along the circumferential direction, the bonding assembly (73) further comprises a pin structure (738), the pin structure (738) serves as a lifting structure of the bonding device (7) and comprises a lifting ring (7381) located outside the lower bonding platform (736) and coaxially arranged, the lifting ring (7381) is connected with a second lifting drive member (7382), the shell of the second lifting drive member (7382) is fixed below the cavity shell (71) and the output shaft seal passes through the bottom of the cavity shell (71), the inner ring of the lifting ring (7381) is provided with a needle member (7383), the needle member (7383) corresponds to the notch groove (7362) one by one and is placed in the corresponding notch groove (7362); A cooling assembly (74), comprising an upper cooling plate (741) and a lower cooling plate (742), wherein the upper cooling plate (741) is suspended in a bonding cavity by means of a first water pipe (743) which is sealed and passes through the cover plate (721), wherein the upper cooling plate (741) is a ring plate and is slidably sleeved on the lifting shaft (733), wherein the first water pipe (743) is connected to a third lifting drive member (744) which is installed above the cover plate (721), wherein the lower cooling plate (742) is a porous plate and is slidably sleeved on all supporting columns (735), wherein the lower cooling plate (742) is connected to a second water pipe which passes through the bottom of the cavity shell (71), and wherein a fourth lifting drive member (745) which is used to drive the lower cooling plate (742) to rise and fall is installed at the bottom of the cavity shell (71).

10. The cluster-type high vacuum wafer bonding equipment according to claim 9, characterized in that: The upper surface of the upper heating plate (731) and the lower surface of the lower heating plate (732) are both provided with a second graphite pad (739), and the second graphite pad (739) located on the lower surface of the lower heating plate (732) is adapted to the shape of the lower cooling plate (742).

Images