Sheet storage mechanism, turnover mechanism, turnover device and transmission system

Abstract

The invention discloses a chip storage mechanism, a turnover mechanism, a turnover device and a transmission system, and relates to the field of semiconductor equipment. The wafer storage mechanism comprises a plurality of limiting ends, each limiting end can move in the direction from the middle area to the edge area of the wafer storage mechanism, and multiple layers of limiting grooves used for limiting multiple wafers are formed in the side, facing the middle area, of each limiting end. A turnover mechanism comprises a turnover component, a first clamping end and a second clamping end, the first clamping end and the second clamping end are connected with the turnover component and can be close to or far away from each other, the first clamping end is provided with multiple layers of first clamping grooves, and the second clamping end is provided with multiple layers of second clamping grooves. The plurality of layers of first clamping grooves and the plurality of layers of second clamping grooves are correspondingly arranged and are used for clamping a plurality of wafers; the turnover device comprises the sheet storage mechanism and a turnover mechanism. The conveying system comprises the turnover device. According to the invention, the problems of low wafer overturning and transmission efficiency and the like can be solved at least.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor equipment, and specifically relates to a wafer storage mechanism, a flipping mechanism, a flipping device and a transmission system. Background Art

[0002] Compared with tank cleaning machines, single-wafer cleaning machines have better cleaning effects but lower efficiency because they clean single wafers. This requires single-wafer cleaning machines to shorten the cycle time as much as possible to increase the working efficiency of the equipment. Single-wafer cleaning machines need to flip the wafer 180 degrees to clean the back side. The original wafer flipping device can only flip one wafer at a time, resulting in low flipping efficiency, which affects the efficiency of the entire process. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a film storage mechanism, a flipping mechanism, a flipping device and a transmission system, which can at least solve the problem of low flipping efficiency.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] An embodiment of the present application provides a wafer storage mechanism, comprising: a plurality of limit ends, each of the limit ends being movable in the direction from the middle area to the edge area of ​​the wafer storage mechanism, and each of the limit ends is provided with a plurality of limit grooves on a side facing the middle area, and the plurality of limit grooves are respectively used to limit a plurality of wafers.

[0006] The embodiment of the present application further provides a flipping mechanism, comprising: a flipping component, a first clamping end and a second clamping end, wherein the first clamping end and the second clamping end are both connected to the flipping component, and the first clamping end and the second clamping end can be relatively close to or far away from each other;

[0007] The first clamping end is provided with multiple layers of first clamping grooves, and the second clamping end is provided with multiple layers of second clamping grooves, and the multiple layers of the first clamping grooves and the multiple layers of the second clamping grooves are respectively arranged correspondingly for clamping multiple wafers;

[0008] The flipping component is used to drive the first clamping end and the second clamping end to flip, and drives the plurality of wafers to flip through the first clamping end and the second clamping end.

[0009] The embodiment of the present application also provides a flipping device, including the above-mentioned film storage mechanism and flipping mechanism;

[0010] The flipping mechanism is used to flip the multiple wafers on the wafer storage mechanism.

[0011] The embodiment of the present application further provides a transmission system for transmitting wafers in a wafer storage box to a process chamber, the transmission system comprising: a front transmission device, a rear transmission device and the above-mentioned flipping device;

[0012] The front transmission device has a plurality of first picking ends, and the plurality of first picking ends are respectively used to pick up a plurality of the wafers from the wafer storage box and transmit the plurality of the wafers to the flipping device;

[0013] The flipping device is used to flip the wafer;

[0014] The post-transfer device has a plurality of second picking ends, and the plurality of second picking ends are respectively used to pick up a plurality of wafers after being turned over from the turning device, and transfer the plurality of wafers after being turned over to the process chamber.

[0015] In the embodiment of the present application, the wafer storage mechanism can simultaneously carry multiple wafers through multiple limit slots, and facilitate the placement or removal of wafers, so as to facilitate the subsequent simultaneous flipping of multiple wafers. Based on the above settings, the wafer storage mechanism in the embodiment of the present application can store multiple wafers at one time, which can improve the subsequent flipping efficiency of wafers to a certain extent, and lay the foundation for the subsequent efficient transmission of wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the structure of the flipping device and wafer disclosed in the embodiment of the present application;

[0017] Figure 2 It is a structural schematic diagram of the flipping mechanism disclosed in the embodiment of the present application;

[0018] Figure 3 A schematic diagram of the structure of the first clamping block or the second clamping block disclosed in the embodiment of the present application;

[0019] Figure 4 A schematic diagram of the structure of the wafer storage mechanism and wafer disclosed in the embodiment of the present application;

[0020] Figure 5 It is a structural schematic diagram of the film storage mechanism disclosed in the embodiment of the present application;

[0021] Figure 6 A schematic diagram of the structure of the load-bearing assembly disclosed in the embodiment of the present application;

[0022] Figure 7 This is a structural schematic diagram of the load-bearing assembly disclosed in an embodiment of the present application without the cover;

[0023] Figure 8 This is a disassembly diagram of the load-bearing assembly disclosed in the embodiment of the present application;

[0024] Fig. 9 A schematic diagram of the structure of a drive assembly disclosed in an embodiment of the present application;

[0025] Fig.10 A schematic diagram of the structure of the limit block disclosed in the embodiment of the present application;

[0026] Fig.11 This is a schematic diagram of the structure of the elastic sleeve disclosed in the embodiment of the present application;

[0027] Fig.12 It is a schematic diagram of a structure in which a plurality of the limit ends disclosed in the embodiment of the present application are all in a retracted state;

[0028] Fig.13 It is a schematic diagram of a structure in which a plurality of the limit ends disclosed in the embodiment of the present application are all in an extended state;

[0029] Fig.14 It is a schematic diagram of the layout of the transmission system disclosed in the embodiment of the present application for transferring wafers between the wafer storage box and the process chamber.

[0030] Description of reference numerals:

[0031] 100 - flip mechanism; 110 - base; 120 - first rotating block; 130 - second rotating block;

[0032] 140-first clamping assembly; 141-first clamping arm; 142-first clamping block; 1421-first clamping groove; 143-first pressing plate;

[0033] 150 - second clamping assembly; 151 - second clamping arm; 152 - second clamping block; 1521 - second clamping groove; 153 - second pressing plate;

[0034] 200-film storage mechanism;

[0035] 210-bearing assembly; 211-mounting seat; 2111-fixing plate; 2112-ring member; 2113-cover body; 2114-accommodating cavity; 212-driving assembly; 2121-linear driving member; 2122-connecting rod; 213-limiting member; 2131-limiting groove;

[0036] 220-sealing assembly; 221-elastic sleeve; 222-fastening sleeve; 230-base; 240-leveling assembly;

[0037] 300-front transmission device;

[0038] 400-rear transmission device;

[0039] 500-film storage box;

[0040] 600-process chamber;

[0041] MN-first axis; PQ-second axis. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0043] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0044] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0045] refer to Figures 1 to 14 The embodiment of the present application discloses a flipping device for flipping a wafer to enable the wafer to flip to a desired angle, such as 45°, 90°, 180°, etc. The disclosed flipping device includes a flipping mechanism 100 and a wafer storage mechanism 200, wherein the flipping mechanism 100 is used to flip the wafer on the wafer storage mechanism 200.

[0046] In some embodiments, the wafer can be transferred to the wafer storage mechanism 200 through the wafer transfer mechanism, the wafer can be flipped to a preset angle through the flipping mechanism 100, and then the flipped wafer can be transferred away by the wafer transfer mechanism. In order to improve the efficiency of flipping and subsequent wafer transfer, the flipping mechanism 100 in the embodiment of the present application can flip multiple wafers at a time, and the wafer storage mechanism 200 can store multiple wafers at a time. Compared with some devices that can only flip and store a single wafer, the flipping device in the embodiment of the present application has a higher flipping efficiency.

[0047] In order to achieve temporary storage of multiple wafers, the wafer storage mechanism 200 has multiple limiting ends, and each limiting end is provided with a multi-layer limiting groove 2131 on one side facing the middle area of ​​the wafer storage mechanism 200, and the multi-layer limiting groove 2131 is used to limit the multiple wafers respectively.

[0048] In some embodiments, both sides of each limiting groove 2131 are connected, and a support platform is provided at the bottom to support the wafer; the side wall of the limiting groove 2131 can limit the edge of the wafer. Based on this, the wafer can be stably supported and the wafer can be effectively prevented from moving at will.

[0049] Exemplarily, the longitudinal section of the support table can be trapezoidal. This design can make the contact area between the support table and the wafer smaller. When the support table and the wafer move relative to each other, the friction can be reduced to a certain extent, avoiding wear on the wafer or moving the wafer.

[0050] Taking into account that multiple wafers are stacked and temporarily stored by the wafer storage mechanism 200, in order to avoid interference during the wafer transfer process, the limit end needs to be able to move appropriately to achieve a avoidance effect, thereby ensuring that the limit end does not touch the wafer during the wafer transfer process; and after the wafer transfer is completed, the limit end needs to support and limit the wafer.

[0051] Based on the above situation, each limiting end in the embodiment of the present application can move in the direction from the middle area to the edge area of ​​the wafer storage mechanism 200 to facilitate the avoidance and support of the wafer.

[0052] Specifically, in the process of placing multiple wafers on the wafer storage mechanism 200, it is necessary to move the multiple limit ends toward the edge area respectively before placing the wafers to provide sufficient placement space for the multiple wafers; when the multiple wafers are placed in the corresponding positions, the multiple limit ends are moved toward the middle area respectively, that is, the multiple limit ends are contracted, so that the multi-layer limit groove 2131 of each limit end can be stuck into the edge of the multiple wafers, thereby achieving support and limitation of the wafers.

[0053] It should be noted here that after the multiple limit ends move toward the edge area to provide sufficient placement space for multiple wafers, the front robot can be used to place or remove the wafer. Specifically, when placing a wafer, after the multiple limit ends move to the edge area respectively, the front robot descends, and then the multiple limit ends move toward the middle area, so that the wafers are clamped by the multiple limit ends respectively; when taking a wafer, the rear robot first holds up the wafer, and then the multiple limit ends move toward the edge area respectively, so that the rear robot can take the wafer away.

[0054] For example, when the wafer storage mechanism 200 is circular as a whole, the direction from the middle area to the edge area can be regarded as the radial direction of the wafer storage mechanism 200; of course, when the wafer is placed in the wafer storage mechanism 200, the direction from the middle area to the edge area can also be regarded as the radial direction of the wafer.

[0055] In the embodiment of the present application, the wafer storage mechanism 200 can simultaneously carry multiple wafers through multiple limiting grooves 2131, and facilitate the placement or removal of wafers, so as to facilitate the subsequent simultaneous flipping of multiple wafers. Based on the above settings, the wafer storage mechanism in the embodiment of the present application can store multiple wafers at one time, which can improve the subsequent flipping efficiency of wafers to a certain extent, and lay the foundation for the subsequent efficient transmission of wafers.

[0056] In some embodiments, the wafer storage mechanism 200 may include a bearing assembly 210, which is used to carry multiple wafers. The bearing assembly 210 may include a mounting seat 211, multiple driving assemblies 212, and multiple limiting members 213 as limiting ends, wherein the mounting seat 211 is a basic mounting component, which can provide a mounting base for the driving assembly 212 and the limiting member 213; the driving assembly 212 is used to provide a driving force for the movement of the limiting member 213; and the limiting member 213 is used to support and limit the wafer.

[0057] Specifically, a plurality of driving components 212 are respectively disposed on the mounting seat 211 , a plurality of limiting members 213 are respectively connected to the plurality of driving components 212 , and the driving components 212 are used to drive the limiting members 213 to move in a direction from the middle area to the edge area.

[0058] Based on the above settings, in the process of placing wafers, first, multiple driving components 212 are used to drive multiple limiting members 213 to move toward the edge area to make way for multiple wafers; after the multiple wafers reach the preset position, the multiple driving components 212 are used to drive multiple limiting members 213 to move toward the middle area to support and limit the multiple wafers through the multi-layer limiting grooves 2131 provided at the limiting end of each limiting member 213.

[0059] Exemplarily, the bearing assembly 210 may include three driving assemblies 212 and three limiting members 213, each limiting member 213 is connected to the corresponding driving assembly 212 to form a limiting pair, and the three limiting pairs are arranged in a non-uniform manner in the circumferential direction of the film storage mechanism 200. For example, the angle between the first limiting pair and the second limiting pair is 150°, the angle between the second limiting pair and the third limiting pair is 60°, and the angle between the third limiting pair and the first limiting pair can be 150°. Of course, other asymmetric arrangements can also be adopted; in addition, the three limiting pairs can also be arranged in a symmetrical manner in the circumferential direction of the film storage mechanism 200, that is, the angle between two adjacent limiting pairs is 120°. It should be noted here that when the three limiting pairs are arranged in a non-uniform manner in the circumferential direction of the film storage mechanism 200, the space between two of the limiting pairs can be made larger, thereby providing a larger space for the robot to transfer the film, and effectively preventing the robot from colliding with the film storage mechanism 200. When the three limit pairs are evenly arranged in the circumferential direction of the wafer storage mechanism 200, the three limit pairs can make the edge of the wafer more evenly stressed, which is beneficial to improving the stability of wafer storage.

[0060] In some embodiments, the driving assembly 212 may include a linear driving member 2121 and a connecting rod 2122, wherein the connecting rod 2122 is connected between the corresponding linear driving member 2121 and the limiting member 213, and the linear driving member 2121 may drive the limiting member 213 to move through the connecting rod 2122. Exemplarily, the linear driving member 2121 may be a cylinder, a hydraulic cylinder, an electric cylinder, etc.

[0061] Optionally, a fixing block may be provided at one end of the connecting rod 2122 away from the linear driving member 2121, and the limiting member 213 may be mounted to the fixing block by means of screws.

[0062] In order to install the linear drive 2121, in the embodiment of the present application, a receiving cavity 2114 may be provided near the middle area of ​​the mounting seat 211, and the linear drive 2121 of each of the plurality of drive assemblies 212 is respectively arranged in the receiving cavity 2114, and the respective connecting rods 2122 respectively pass through the side wall of the receiving cavity 2114. Based on this arrangement, on the one hand, the receiving cavity 2114 can provide installation space for the plurality of linear drive 2121, and on the other hand, the receiving cavity 2114 can be used to surround the plurality of linear drive 2121, so as to separate the plurality of linear drive 2121 from the wafer supported and limited by the limiting member 213, thereby effectively alleviating the problem of contamination of the wafer by particles generated during the movement of the linear drive 2121, and further improving the product yield.

[0063] In order to further prevent the particles generated by the linear drive member 2121 from leaking from the accommodating cavity 2114, the film storage mechanism 200 may also include a sealing assembly 220, which is used to seal the position of the accommodating cavity 2114 for passing through the connecting rod 2122 to ensure the sealing of the accommodating cavity 2114 and meet the movement requirements of the connecting rod 2122.

[0064] The sealing assembly 220 may include an elastic sleeve 221 and a fastening sleeve 222, one end of the elastic sleeve 221 is connected to the side wall of the accommodating cavity 2114, and the other end of the elastic sleeve 221 is connected to the fastening sleeve 222. In addition, the elastic sleeve 221 and the fastening sleeve 222 are respectively sleeved on the outside of the connecting rod 2122, and the fastening sleeve 222 is fixed to the connecting rod 2122. Based on this arrangement, the elastic sleeve 221 and the fastening sleeve 222 can realize a sealed connection between the connecting rod 2122 and the side wall of the accommodating cavity 2114, so as to prevent the particles generated by the linear drive member 2121 from leaking from the accommodating cavity 2114 and causing contamination to the wafer. At the same time, during the movement of the connecting rod 2122, the fastening sleeve 222 can move with the connecting rod 2122, and the elastic sleeve 221 generates elastic deformation to adapt to the movement of the connecting rod 2122, thereby ensuring the sealing and avoiding interference with the movement of the connecting rod 2122.

[0065] For example, the side wall of the accommodating cavity 2114 may be provided with a plurality of through holes, and the plurality of connecting rods 2122 may pass through the corresponding through holes. In addition, the two ends of the elastic sleeve 221 may be provided with threaded structures, which are respectively matched with the threaded through holes of the fastening sleeve 222 and the side wall of the accommodating cavity 2114 to facilitate disassembly and assembly. The elastic sleeve 221 may be a corrugated tube, and of course, other forms of deformable pipes may also be used, which are not specifically limited here.

[0066] In addition, the side wall of the fastening sleeve 222 may be provided with a threaded hole, in which a screw is provided. By screwing the screw, the end of the screw can be pressed against the connecting rod 2122 to achieve a fastened connection between the fastening sleeve 222 and the connecting rod 2122 .

[0067] In some embodiments, the mounting seat 211 may include a fixed disk 2111, an annular member 2112 and a cover 2113, wherein the annular member 2112 is disposed in the middle of the fixed disk 2111, and the cover 2113 is detachably connected to an end of the annular member 2112 away from the fixed disk 2111, so that the fixed disk 2111, the annular member 2112 and the cover 2113 together form a receiving cavity 2114. In order to prevent the mounting seat 211 from interfering with the wafer supported by the stopper 213, the top surface of the cover 2113 is made lower than the lowest supporting surface of the stopper 213 for the wafer, thereby preventing the wafer from contacting the cover 2113.

[0068] Exemplarily, a circular ring may be provided on the edge of the fixed disk 2111, a circular disk may be provided in the middle, and a plurality of connecting ribs may be connected between the circular disk and the circular ring to ensure a stable connection between the circular disk and the circular ring; the annular member 2112 may be an annular cylinder, one end of which is connected to the circular disk, and one end of the annular cylinder is sealed by the circular disk; the other end of the annular cylinder is closed by the cover body 2113 to ensure the airtightness of the accommodating cavity 2114, which is a closed cavity formed by the disk of the accommodating cavity 2114, the annular cylinder and the cover body 2113.

[0069] In addition, the disc can be provided with a plurality of openings, some of which are wiring holes, such as for threading sensors for detecting the linear drive mechanism, and other openings are avoidance holes, for avoiding partial structures of the linear drive mechanism, such as pneumatic joints.

[0070] The side wall of the annular member 2112 is provided with a plurality of threaded through holes, and the connecting rod 2122 passes through the accommodating cavity 2114 from the corresponding threaded through holes so as to be connected with the limiting member 213 .

[0071] In addition, the fastening sleeve 222 may be provided with an internal thread, and both ends of the elastic sleeve 221 may be provided with external threads, so that the elastic sleeve 221 is threadedly connected to the fastening sleeve 222 and the annular member 2112, respectively, to facilitate assembly and disassembly.

[0072] In some embodiments, the wafer storage mechanism 200 may also include a base 230 and multiple leveling components 240, wherein the multiple leveling components 240 are respectively connected between the mounting base 211 and the base 230, and are used to level the mounting base 211 to ensure the horizontality of the multiple wafers carried by the supporting component 210.

[0073] The leveling assembly 240 may include an adjusting screw and a locking nut, wherein the adjusting screw is connected between the base 230 and the mounting seat 211. Exemplarily, the adjusting screw may be fixedly connected to the base 230 and threadedly connected to the mounting seat 211. By rotating the adjusting screw, the distance between a part of the mounting seat 211 and the base 230 may be changed. In this way, the mounting seat 211 may be leveled by a plurality of adjusting screws to ensure the horizontality of the mounting seat 211, thereby ensuring the horizontality of the wafer. Of course, the adjusting screw may also be fixedly connected to the mounting seat 211 and threadedly connected to the base 230, and the mounting seat 211 may also be leveled.

[0074] After the leveling is completed, tighten the locking nut to lock the adjusting screw to prevent the adjusting screw from accidentally rotating and affecting the levelness of the wafer.

[0075] The embodiment of the present application also discloses a flipping mechanism 100, and the disclosed flipping mechanism 100 includes: a flipping component, a first clamping end and a second clamping end, the first clamping end and the second clamping end are both connected to the flipping component, and the first clamping end and the second clamping end can be relatively close or far away, and the flipping component is used to drive the first clamping end and the second clamping end to flip, and drive multiple wafers to flip through the first clamping end and the second clamping end. Specifically, when it is necessary to clamp the wafer, the first clamping end and the second clamping end are first relatively far away from each other to avoid collision with the wafer and damage to the wafer; when the relatively far distance is greater than the diameter of the wafer, the wafer on the wafer storage mechanism 200 can be clamped, so that the wafer is driven to move through the flipping component through the first clamping end and the second clamping end, and a flip at a preset angle is achieved.

[0076] In order to achieve a one-time flipping of multiple wafers, the embodiment of the present application is redesigned for the first clamping end and the second clamping end respectively. Specifically, the first clamping end is provided with a multi-layer first clamping groove 1421, and the second clamping end is provided with a multi-layer second clamping groove 1521, and the multi-layer first clamping groove 1421 and the multi-layer second clamping groove 1521 are respectively arranged correspondingly. In this way, when the first clamping end and the second clamping end are relatively close to each other, the edges of the multiple wafers can be made to enter the first clamping groove 1421 and the second clamping groove 1521 of the corresponding layer respectively, thereby achieving clamping and limiting of the multiple wafers, so as to facilitate the subsequent one-time flipping of the multiple wafers through the flipping mechanism 100.

[0077] It should be noted here that before flipping, multiple wafers are temporarily stored on the wafer storage mechanism 200, and there is a certain gap between two adjacent wafers. Therefore, when designing the first clamping end and the second clamping end, there is also a certain gap between two adjacent layers of first clamping grooves 1421, and there is also a certain gap between two adjacent layers of second clamping grooves 1521, so as to adapt to the relative position relationship between the multiple wafers.

[0078] In some embodiments, the flipping component may include a base 110, a first rotating block 120 and a second rotating block 130, wherein the first rotating block 120 is rotatably disposed on the base 110 around a first axis MN, and the second rotating block 130 is rotatably disposed on the first rotating block 120 about a second axis PQ perpendicular to the first axis MN; in addition, the flipping mechanism 100 may also include a first clamping assembly 140 and a second clamping assembly 150, wherein the first clamping assembly 140 and the second clamping assembly 150 are respectively disposed on the second rotating block 130, and the two may be relatively close to or far away from each other. Among them, the first axis MN may extend in the horizontal direction, and the second axis PQ may form a certain angle with the horizontal direction. Exemplarily, the first rotating block 120 may be a 45° rotating block, and the second rotating block 130 may be a 180° rotating block.

[0079] Based on the above arrangement, when the first rotating block 120 rotates around the first axis MN, it can drive the second rotating block 130, the first clamping assembly 140 and the second clamping assembly 150 to rotate together around the first axis MN. This process can enable the wafer clamped by the first clamping assembly 140 and the second clamping assembly 150 to separate from the wafer storage mechanism 200, thereby providing sufficient space for flipping the wafer to avoid interference during the wafer flipping process.

[0080] When the second rotating block 130 rotates around the second axis PQ, it can drive the first clamping assembly 140 and the second clamping assembly 150 to rotate around the second axis PQ together. This process can enable the wafer clamped by the first clamping assembly 140 and the second clamping assembly 150 to flip at a preset angle, such as flipping 180°.

[0081] After the wafer flipping process is completed, the first rotating block 120 drives the second rotating block 130 , the first clamping assembly 140 and the second clamping assembly 150 to rotate in the opposite direction around the first axis MN again, so as to place the flipped wafer on the wafer storage mechanism 200 again.

[0082] In addition, the first rotating block 120 can be connected to the first rotating drive member in a transmission manner so as to drive the first rotating block 120 to rotate around the first axis MN through the first rotating drive member. For example, the first rotating drive member can be a motor, such as a servo motor, etc. Of course, other components can also be used, which are not specifically limited here.

[0083] The first rotating block 120 may include a second rotating driving member, and the second rotating block 130 is in transmission connection with the second rotating driving member, so as to drive the second rotating block 130 to rotate around the second axis PQ through the second rotating driving member. Exemplarily, the second rotating driving member may be a motor, such as a servo motor, etc. Of course, other components may also be used, which are not specifically limited here.

[0084] The second rotating block 130 may include a clamping drive member having two driving ends, which are respectively connected to the first clamping assembly 140 and the second clamping assembly 150 to drive the first clamping assembly 140 to move relatively closer or farther away. For example, the clamping drive member may be a clamping cylinder, and of course, may also be other components, which are not specifically limited here.

[0085] In some embodiments, the first clamping assembly 140 may include a first clamping arm 141 and a first clamping block 142 as a first clamping end, wherein one end of the first clamping arm 141 is connected to the second rotating block 130, and the first clamping block 142 is connected to an end of the first clamping arm 141 facing away from the second rotating block 130; accordingly, the second clamping assembly 150 may include a second clamping arm 151 and a second clamping block 152 as a second clamping end, wherein one end of the second clamping arm 151 is connected to the second rotating block 130, and the second clamping block 152 is connected to an end of the second clamping arm 151 facing away from the second rotating block 130; and, the first clamping block 142 is provided with a multi-layer first clamping groove 1421 on a side facing the second clamping block 152, and the second clamping block 152 is provided with a multi-layer second clamping groove 1521 on a side facing the first clamping block 142, and the multi-layer first clamping groove 1421 and the multi-layer second clamping groove 1521 are respectively arranged opposite to each other.

[0086] Based on the above settings, when the first clamping arm 141 and the second clamping arm 151 are relatively close to each other, the first clamping block 142 and the second clamping block 152 can be relatively close to each other, so that the multi-layer first clamping groove 1421 and the multi-layer second clamping groove 1521 can respectively accommodate the edge of the wafer, that is, each first clamping groove 1421 is clamped into the local edge of a wafer, and the corresponding second clamping groove 1521 is clamped into the edge of other areas of the same wafer, thereby, the multi-layer first clamping groove 1421 and the corresponding second clamping groove 1521 cooperate with each other to achieve the limitation of the multi-layer wafer; when the first clamping arm 141 and the second clamping arm 151 are relatively far away from each other, the first clamping block 142 and the second clamping block 152 can be relatively far away from each other, so that the multi-layer first clamping groove 1421 and the multi-layer second clamping groove 1521 are respectively far away from the edge of the wafer to achieve the release of the wafer.

[0087] Exemplarily, the first clamping assembly 140 may further include a first pressure plate 143, which is mounted to the first clamping arm 141 by screws, and a first clamping block 142 is disposed between the first pressure plate 143 and the first clamping arm 141 so as to firmly fix the first clamping block 142 on the first clamping arm 141 through the first pressure plate 143.

[0088] Similarly, the second clamping assembly 150 may also include a second pressure plate 153, which is mounted to the second clamping arm 151 by screws, and a second clamping block 152 is disposed between the second pressure plate 153 and the second clamping arm 151 so that the second clamping block 152 is firmly fixed to the second clamping arm 151 through the second pressure plate 153.

[0089] Based on the above-mentioned flipping device, the embodiment of the present application further discloses a transmission system for transmitting the wafers in the wafer storage box 500 to the process chamber 600. The disclosed transmission system includes a front transmission device 300, a rear transmission device 400 and the above-mentioned flipping device;

[0090] Among them, the front transmission device 300 has multiple first picking ends, and the multiple first picking ends are respectively used to pick up multiple wafers from the wafer storage box 500 and transfer the multiple wafers to the flipping device. Specifically, the multiple first picking ends can place multiple wafers in the wafer storage mechanism 200, and support and limit them through multiple limiting members 213. In the process of placing the wafer, first, the multiple limiting members 213 are moved to the edge area respectively to provide a large enough space for the wafer; the front transmission device 300 carries multiple wafers and moves between the multiple limiting members 213. At this time, the multiple limiting members 213 move to the middle area respectively until each limiting member 213 cooperates with the wafer respectively to achieve support and limit of the wafer.

[0091] The flipping device is used to flip the wafer.

[0092] The post-transmission device 400 has a plurality of second pick-up ends, which are respectively used to pick up a plurality of wafers after flipping from the flipping device, and transfer the plurality of wafers after flipping to the process chamber 600. Specifically, the plurality of second pick-up ends can pick up a plurality of wafers from the wafer storage mechanism 200 and transfer them. In the process of taking out the wafer, the post-transmission device 400 is first moved to the position where the wafer is located, and the wafer is picked up, and then the plurality of limit members 213 are respectively moved to the edge area to release the limit on the wafer, and the post-transmission device 400 takes the wafer away.

[0093] Exemplarily, the first picking end and the second picking end can each be a clamping claw, a suction cup or other components, and the specific form is not limited.

[0094] It should be noted here that both the front transmission device 300 and the rear transmission device 400 can pick up and transmit multiple wafers. Their specific structures are not within the scope of protection in the embodiments of the present application, and existing technologies can be adopted, which will not be elaborated here.

[0095] The working process of the transmission system in the embodiment of the present application is as follows:

[0096] When the front transmission device 300 takes out multiple wafers from the wafer storage box 500 and transmits them to the wafer storage mechanism 200 of the flipping device, at this time, the multiple linear drive members 2121 are respectively in an extended state, and correspondingly, the multiple limit members 213 are in an expanded state, so as to provide sufficient placement space for the wafers. In addition, the first rotating block 120 of the flipping mechanism 100 is at an angle of 45° with the horizontal plane to prevent interference with the wafer transmission; when the front transmission device 300 places the multiple wafers on the support surface of the limit member 213 (i.e., the bottom wall of the limit groove 2131) above a preset distance (such as 1mm to 9mm, etc.), the multiple linear drive members 2121 retract at the same time, and at the same time, the front transmission device 300 continues to descend until the multiple wafers are placed on the support surface of the limit member 213; the front transmission device 300 is retracted.

[0097] The flipping device is started, and the first rotating block 120 rotates from a position at an angle of 45° to the horizontal plane to a position at an angle of 0° to the horizontal plane. At this time, the first clamping assembly 140 and the second clamping assembly 150 are respectively located on both sides of the wafer; the first clamping assembly 140 and the second clamping assembly 150 are close to each other and clamp the wafer; multiple linear driving members 2121 are respectively extended to make multiple limit members 213 completely move outside the edge of the wafer to prevent the limit members 213 from touching the wafer and causing damage to the wafer; the first rotating block 120 rotates from a position at an angle of 0° to the horizontal plane to lift the wafer; the second rotating block 130 drives the wafer to flip 180°; the first rotating block 120 rotates from a position at an angle of 45° to the horizontal plane to a position at an angle of 0° to the horizontal plane to lower the wafer; multiple linear driving members 2121 are respectively retracted to make multiple limit members 213 clamp the wafer, so that multiple wafers are placed in the wafer storage mechanism 200.

[0098] When the rear-end transmission device 400 takes wafers from the wafer storage mechanism 200 of the flipping device, the rear-end transmission device 400 first supports the multiple wafers on the wafer storage mechanism 200, and then the multiple linear drive members 2121 switch to the extended state, and correspondingly, the multiple limit members 213 switch to the expanded state, and the rear-end transmission device 400 carries the multiple wafers out of the wafer storage mechanism 200, and transfers the multiple wafers to the process chamber 600 for process processing.

[0099] To sum up, the flipping device in the embodiment of the present application can realize the temporary storage and flipping of multiple wafers, and avoid the position during the process of taking and placing multiple wafers, thereby improving the flipping and transmission efficiency of the wafers and ensuring the integrity of multiple wafers.

[0100] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A film storage mechanism, characterized in that: include: A plurality of limiting ends, each of which is movable in the direction from the middle area to the edge area of ​​the wafer storage mechanism (200), and each of which is provided with a multi-layer limiting groove (2131) on the side facing the middle area, and the multi-layer limiting groove (2131) is respectively used to limit a plurality of wafers.

2. The film storage mechanism according to claim 1, characterized in that: The film storage mechanism (200) comprises a bearing assembly (210), wherein the bearing assembly (210) comprises a mounting seat (211), a plurality of driving assemblies (212), and a plurality of limiting members (213) serving as limiting ends; The plurality of driving components (212) are respectively arranged on the mounting seat (211), the plurality of limiting members (213) are respectively connected to the plurality of driving components (212) in correspondence, and the driving components (212) are used to drive the limiting members (213) to move in a direction from the middle area to the edge area.

3. The film storage mechanism according to claim 2, characterized in that: The driving assembly (212) comprises a linear driving member (2121) and a connecting rod (2122), wherein the connecting rod (2122) is connected between the corresponding linear driving member (2121) and the limiting member (213); A accommodating cavity (2114) is provided at a position close to the middle area of ​​the mounting seat (211), and the linear driving members (2121) of each of the plurality of driving assemblies (212) are respectively arranged in the accommodating cavity (2114), and the respective connecting rods (2122) respectively pass through the side walls of the accommodating cavity (2114).

4. The film storage mechanism according to claim 3, characterized in that: The sheet storage mechanism (200) further comprises a sealing assembly (220), wherein the sealing assembly (220) comprises an elastic sleeve (221) and a fastening sleeve (222); One end of the elastic sleeve (221) is connected to the side wall of the accommodating cavity (2114), and the other end of the elastic sleeve (221) is connected to the fastening sleeve (222); The elastic sleeve (221) and the fastening sleeve (222) are respectively sleeved on the outside of the connecting rod (2122), and the fastening sleeve (222) is fixedly connected to the connecting rod (2122).

5. The film storage mechanism according to claim 4, characterized in that: The mounting seat (211) comprises a fixing plate (2111), an annular member (2112) and a cover body (2113); The annular member (2112) is arranged at the middle position of the fixed disk (2111), and the cover body (2113) is detachably connected to one end of the annular member (2112) away from the fixed disk (2111), and the fixed disk (2111), the annular member (2112) and the cover body (2113) together form the accommodating cavity (2114).

6. The film storage mechanism according to claim 5, characterized in that: The side wall of the annular member (2112) is provided with a plurality of threaded through holes, and the connecting rod (2122) passes through the corresponding threaded through holes and out of the accommodating cavity (2114); The fastening sleeve (222) is provided with an internal thread, and both ends of the elastic sleeve (221) are respectively provided with external threads, and the elastic sleeve (221) is respectively threadedly connected to the fastening sleeve (222) and the annular member (2112).

7. The film storage mechanism according to claim 2, characterized in that: The film storage mechanism (200) further comprises a base (230) and a plurality of leveling components (240); The plurality of leveling components (240) are respectively connected between the mounting seat (211) and the base (230) and are used to level the mounting seat (211).

8. A turning mechanism, characterized in that: include: A flip component, a first clamping end and a second clamping end, wherein the first clamping end and the second clamping end are both connected to the flip component, and the first clamping end and the second clamping end can be relatively close to or far away from each other; The first clamping end is provided with multiple layers of first clamping grooves (1421), and the second clamping end is provided with multiple layers of second clamping grooves (1521), and the multiple layers of the first clamping grooves (1421) and the multiple layers of the second clamping grooves (1521) are respectively arranged correspondingly and are used to clamp multiple wafers; The flipping component is used to drive the first clamping end and the second clamping end to flip, and drives the plurality of wafers to flip through the first clamping end and the second clamping end.

9. The turning mechanism according to claim 8, characterized in that: The turning component comprises a base (110), a first rotating block (120) and a second rotating block (130); The first rotating block (120) is rotatably arranged on the base (110) around a first axis (MN); The second rotating block (130) is rotatably arranged on the first rotating block (120) around a second axis (PQ) perpendicular to the first axis (MN); The flipping mechanism (100) further comprises a first clamping assembly (140) and a second clamping assembly (150); the first clamping assembly (140) and the second clamping assembly (150) are respectively arranged on the second rotating block (130), and the two can be relatively close to or far away from each other.

10. The turning mechanism according to claim 9, characterized in that: The first clamping assembly (140) comprises a first clamping arm (141) and a first clamping block (142) serving as the first clamping end, one end of the first clamping arm (141) being connected to the second rotating block (130), and the first clamping block (142) being connected to an end of the first clamping arm (141) facing away from the second rotating block (130); The second clamping assembly (150) comprises a second clamping arm (151) and a second clamping block (152) serving as the second clamping end, one end of the second clamping arm (151) being connected to the second rotating block (130) and being arranged corresponding to the first clamping arm (141), and the second clamping block (152) being connected to one end of the second clamping arm (151) facing away from the second rotating block (130); The first clamping block (142) is provided with multiple layers of the first clamping grooves (1421) on one side facing the second clamping block (152), and the second clamping block (152) is provided with multiple layers of the second clamping grooves (1521) on one side facing the first clamping block (142).

11. A turning device, characterized in that: It comprises the film storage mechanism (200) as described in any one of claims 1 to 7 and the flipping mechanism (100) as described in any one of claims 8 to 10; The flipping mechanism (100) is used to flip a plurality of wafers on the wafer storage mechanism (200).

12. A transfer system for transferring wafers in a wafer storage box (500) to a process chamber (600), characterized in that: The transmission system comprises: a front transmission device (300), a rear transmission device (400) and the flipping device according to claim 11; The front transmission device (300) has a plurality of first picking ends, and the plurality of first picking ends are respectively used to pick up a plurality of wafers from the wafer storage box (500) and transmit the plurality of wafers to the flipping device; The flipping device is used to flip the wafer; The post-transfer device (400) has a plurality of second pick-up ends, and the plurality of second pick-up ends are respectively used to pick up a plurality of wafers after flipping from the flipping device, and transfer the plurality of wafers after flipping to the process chamber (600).

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