Cavity structure and phase shifter

Abstract

The invention belongs to the technical field of mobile communication, and particularly relates to a cavity structure and a phase shifter. The cavity comprises two horizontal packaging walls oppositely arranged in the horizontal direction and two vertical packaging walls oppositely arranged in the vertical direction, the cavity is formed by sequentially bending a metal plate along the same axis through a metal plate technology, and at least one vertical packaging wall is provided with a plurality of protruding structures at intervals in the length direction of the cavity. The protruding structure is used for being connected with a feeder line outer conductor in a tin soldering mode. The cavity structure provided by the invention is a metal plate structure, and is formed by stamping and bending a metal plate, so that the processing efficiency is high, the surface is free of burrs, the processing time can be greatly saved, the processing cost is reduced, and the product quality is improved; according to the cavity structure provided by the invention, the cavity electroplating area can be greatly reduced and the cost can be saved only by carrying out local electroplating treatment or metal coating plating treatment on the bulge structure welded with the feeder line outer conductor.

Description

Technical Field

[0001] The present invention belongs to the technical field of mobile communications, and in particular relates to a cavity structure and a phase shifter. Background Art

[0002] In mobile communication systems, phase shifters are key components for beamforming and signal phase adjustment. Traditional phase shifters mostly use the architecture of "cavity + RF circuit + sliding medium", where the cavity serves as the core support and electromagnetic shielding structure, and its performance directly affects the reliability and cost of the product. Currently, the mainstream cavity uses aluminum alloy profiles made by pultrusion, but it has the following significant defects:

[0003] Heavy weight: Limited by the pultrusion process, the minimum wall thickness of the cavity needs to be ≥1.3mm, resulting in an overall weight that is too high; Complex processing: Surface holes and slots need to be machined, which is costly and inefficient; Burr problem: Machining can easily produce internal burrs, which may cause the intermodulation index to deteriorate; High electroplating cost: The cavity needs to be electroplated as a whole, which requires a large amount of consumables.

[0004] Therefore, a new cavity structure is urgently needed to solve the above problems and improve product competitiveness. Summary of the invention

[0005] The primary purpose of the present invention is to provide a cavity structure that is lightweight, efficient in processing, burr-free, and requires only partial electroplating, thereby solving the problems of traditional pultrusion cavities, such as heavy weight, low processing efficiency, burrs, and high electroplating costs.

[0006] To achieve the purpose of the present invention, the following technical solutions are adopted:

[0007] A first aspect of the present invention proposes a cavity structure, which includes two horizontal packaging walls arranged opposite to each other in the horizontal direction and two vertical packaging walls arranged opposite to each other in the vertical direction. The cavity is formed by sequentially bending metal plates along the same axis through sheet metal processing. At least one of the vertical packaging walls is provided with multiple protrusion structures at intervals along the length direction of the cavity, and the protrusion structures are used to be soldered to the outer conductor of the feeder.

[0008] A further improvement is that at least one end of the same axis of the metal plate constitutes a closed area, and the closed area is located outside the inner cavity of the cavity structure. The closed area is an angle connection area formed by the extension section of one of the horizontal packaging walls of the cavity structure and the outer surface of an adjacent vertical packaging wall. The closed area is closed by welding so that the inner cavity constitutes an electromagnetic shielding cavity.

[0009] A further improvement is that the two horizontal packaging walls are respectively an upper packaging wall and a lower packaging wall, one end of the lower packaging wall extends to the outer surface of an adjacent vertical packaging wall and its inner surface is fitted or connected to an end face of the adjacent vertical packaging wall to form the closed area.

[0010] A further improvement is that the protruding structure is an endogenous structure on the vertical packaging wall, and the endogenous structure is pre-processed on the metal plate before the metal plate is bent and formed by a sheet metal process.

[0011] A further improvement is that the protruding structure consists of a bending transition zone and a functional zone for soldering connection with the outer conductor of the feeder, and the functional zone is connected to the metal plate as a whole through the bending transition zone.

[0012] A further improvement is that the surface of the functional area is plated and fits with the outer conductor of the feeder line.

[0013] A further improvement is that a plurality of feeder holes are arranged at intervals on the vertical packaging wall where the protruding structure is located, and the feeder holes are pre-processed on the metal plate before the metal plate is bent and formed by a sheet metal process.

[0014] A further improvement is that a plurality of operating holes corresponding one-to-one to the input port and output port of the RF circuit in the cavity are arranged on the horizontal packaging wall, and a plurality of mounting holes facilitating the installation and positioning of the cavity are arranged on the horizontal packaging wall and / or the vertical packaging wall.

[0015] A further improvement is that the method for manufacturing the cavity structure comprises the following steps:

[0016] Prepare double-sided coated metal sheets;

[0017] Process the holes required for the cavity structure on the metal plate by CNC punching or laser cutting;

[0018] A raised structure is formed on a metal plate by performing sheet metal convex forming;

[0019] A laser cutting process is used to form an auxiliary tear-off line on the single-side covering film where the protruding structure is located, wherein the contour of the auxiliary tear-off line completely covers the contour of the functional area on the protruding structure for soldering connection with the outer conductor of the feeder;

[0020] The coating at the functional area is peeled off along the auxiliary tearing line, and the exposed functional area is locally plated;

[0021] Removing the remaining coating on the metal plate, and bending the metal plate along a preset bending baseline to form a cavity structure;

[0022] The cavity is welded and sealed so that the inner cavity of the cavity structure forms an electromagnetic shielding cavity.

[0023] A second aspect of the present invention provides a phase shifter, comprising the cavity structure according to any one of the first aspects, and a phase shift component built into the cavity, wherein the phase shift component comprises:

[0024] A radio frequency circuit board is fixed to the inner cavity of the cavity through a temperature-resistant foam support;

[0025] A sliding medium is attached to the radio frequency circuit board;

[0026] The pull rod is connected to the external driving mechanism and is used to drive the sliding medium to move.

[0027] The beneficial effects of the present invention are:

[0028] The cavity structure proposed in the present invention is a sheet metal structure, which is formed by stamping and then bending a piece of metal plate. It has high processing efficiency and no burrs on the surface, which can greatly save processing time, reduce processing costs, and improve product quality.

[0029] The cavity structure proposed in the present invention only needs to perform local electroplating or metal coating treatment on the protruding structure welded to the outer conductor of the feeder, which can greatly reduce the electroplating area of ​​the cavity and save costs.

[0030] The cavity structure proposed by the present invention adopts cold-processed sheet metal bending, which can flexibly adjust the internal cavity size to quickly meet diverse design requirements, and avoid the influence of low dimensional accuracy of hot processing in aluminum alloy pultrusion, thus better ensuring the stability and consistency of RF circuit performance. In addition, the present invention is thin and has uniform wall thickness, which can effectively reduce weight while ensuring structural strength.

[0031] The phase shifter using the cavity structure of the present invention is a single-cavity structure, which avoids the hidden dangers of different precision of each cavity of the phase shifter and uncontrollable batch changes caused by differences in the structural size or structural strength of each cavity mold in the multi-cavity integrated molding of aluminum alloy pultrusion profiles, heat dissipation and cooling during pultrusion molding. The phase shifter using the cavity structure of the present invention is a single-cavity structure, which can be flexibly combined in practical applications, which is helpful for layout optimization in product design. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A cross-sectional view of the cavity structure of an embodiment of the present invention;

[0033] Figure 2 A process diagram of a cavity according to an embodiment of the present invention;

[0034] Figure 3 For use Figure 1 A three-dimensional exploded view of the phase shifter of the cavity structure shown;

[0035] Figure 4 For use Figure 1 A cross-sectional view of a phase shifter having a cavity structure as shown;

[0036] Figure 5 For use Figure 1 A schematic diagram of a partial structure of a phase shifter having a cavity structure as shown;

[0037] Figure 6 A cross-sectional view of a cavity structure according to another embodiment of the present invention;

[0038] Figure 7 For use Figure 6 A three-dimensional diagram of the phase shifter of the cavity structure shown;

[0039] Figure 8 for Figure 7 A cross-sectional view of the phase shifter shown;

[0040] Fig. 9 for Figure 7 A magnified view of the structure in the middle;

[0041] Fig.10 A cross-sectional view of a cavity structure according to another embodiment of the present invention;

[0042] Fig.11 For use Fig.10 A three-dimensional diagram of a phase shifter with a cavity structure shown;

[0043] Fig.12 for Fig.11 A cross-sectional view of the phase shifter shown;

[0044] Fig.13 for Fig.11 A magnified view of the structure at B in the middle;

[0045] Fig.14 For a simultaneous use of multiple Figure 3 A schematic diagram of the structure of the phase shifter shown;

[0046] Fig.15 For a simultaneous use of multiple Figure 7 Schematic diagram of the structure of the phase shifter shown.

[0047] Description of reference numerals:

[0048] 1. Cavity; 2. Metal plate; 3. Feeder; 4. RF circuit board; 5. Sliding medium; 6. Foam support; 7. Phase shifter; 8. Clip; 10. Side wall; 11. Enclosed area; 12. Inner cavity; 13. Protruding structure; 14. Feeder hole; 15. Operation hole; 16. Mounting hole; 20. End; 30. Outer conductor; 31. Inner conductor; 32. Dielectric component; 40. Feeding point; 100. Horizontal packaging wall; 101. Vertical packaging wall; 130. Bending transition zone; 131. Functional area; 1000. Upper packaging wall; 1001. Lower packaging wall; 1010. Left packaging wall; 1011. Right packaging wall; 17. Coating; 18. Auxiliary tearing line; 19. Bending baseline. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described herein are only used to explain the present invention and do not limit the scope of protection of the present invention.

[0050] It should be noted that when an element is referred to as being "fixed to", "disposed on", "fixed on" or "installed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. Furthermore, when an element is considered to be "transmission-connected" to another element, the two can achieve power transmission, and its specific implementation method can be implemented using the existing technology, which will not be repeated here. When an element is perpendicular or approximately perpendicular to another element, it means that the ideal state of the two is vertical, but due to the influence of manufacturing and assembly, there may be a certain vertical error. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only and do not represent the only implementation method.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0052] The “first” and “second” involved in the present invention do not represent specific quantities and orders, but are merely used to distinguish names.

[0053] Please refer to the attached Figure 1 -Attached Fig.15 In a first aspect of an embodiment of the present invention, a cavity 1 structure is proposed. In this embodiment, as Figure 1-Figure 5 As shown, the cavity 1 has a plurality of side walls 10. Specifically, the cavity 1 includes two horizontal packaging walls 100 arranged opposite to each other in the horizontal direction and two vertical packaging walls 101 arranged opposite to each other in the vertical direction. The cavity 1 is formed by bending a metal plate 2 in sequence along the same axis through a sheet metal process. A plurality of protrusion structures 13 are arranged on at least one of the vertical packaging walls 101 at intervals along the length direction of the cavity 1. The protrusion structures 13 are used for soldering connection with the outer conductor 30 of the feeder 3.

[0054] It is understandable that the entire cavity 1 is formed by bending a metal plate 2 in sequence along the same axis through a sheet metal process (a process involving plastic deformation of metal plates to form various shapes). On at least one vertical packaging wall 101, a plurality of protrusion structures 13 are arranged at intervals along the length direction of the cavity 1. These protrusion structures 13 are used to achieve soldering connection with the outer conductor 30 of the feeder 3 (a cable for transmitting signals). Soldering is a technology that uses an alloy with a low melting point (usually a lead-containing or lead-free tin alloy) to permanently connect two metal materials.

[0055] The present invention can ensure good electrical contact and mechanical fixation by directly welding and fixing the protruding structure 13 to the outer conductor 30 of the feeder 3. In addition, the prior art method of placing the feeder 3 by recessing the side wall into the cavity 1 will cause the inner cavity 12 to be uneven and occupy the space of the inner cavity 12. However, the inner cavity 12 of the present invention has very good flatness.

[0056] In this embodiment, if Figure 1-Figure 5 As shown, at least one end 20 of the same axis of the metal plate 2 constitutes a closed area 11, and the closed area 11 is located outside the inner cavity 12 of the cavity 1 structure. The closed area 11 is an angle connection area formed by connecting an extended section of one of the horizontal packaging walls 100 of the cavity 1 structure with the outer surface of an adjacent vertical packaging wall 101. The closed area 11 is closed by laser welding so that the inner cavity 12 constitutes an electromagnetic shielding cavity.

[0057] It can be understood that in order to ensure that the inner cavity 12 of the cavity 1 can constitute an effective electromagnetic shielding cavity, the closed area 11 is sealed by welding, which can effectively prevent electromagnetic interference from entering or leaving the cavity 1 through unsealed gaps, thereby improving the electromagnetic compatibility of the entire cavity 1.

[0058] Specifically, in this embodiment, the two horizontal packaging walls 100 are respectively an upper packaging wall 1000 and a lower packaging wall 1001, and the two vertical packaging walls 101 are respectively a left packaging wall 1010 and a right packaging wall 1011, and one end of the lower packaging wall 1001 extends toward the outer surface of an adjacent vertical packaging wall 101 and its inner surface is fitted or connected to an end face of the adjacent vertical packaging wall 101 to form the closed area 11.

[0059] It can be understood that one end of the lower packaging wall 1001 extends to the outer surface of an adjacent vertical packaging wall 101 (the left packaging wall 1010 in this embodiment), and its inner surface is fitted or connected to one end face of the adjacent vertical packaging wall 101, thereby forming the above-mentioned closed area 11. The cavity 1 is closed by laser welding along the gap of the closed area 11 to ensure the electromagnetic shielding effect.

[0060] Specifically, the protruding structure 13 is an endogenous structure on the vertical packaging wall 101 , and the endogenous structure is pre-processed on the metal plate 2 before the metal plate 2 is bent and formed by a sheet metal process.

[0061] Specifically, the protruding structure 13 is formed by sheet metal convex forming on the metal plate 2 before the metal plate 2 is bent into the cavity 1. It can be understood that the protruding structure 13, as an "intrinsic structure" of the vertical packaging wall 101, is pre-stamped before the metal plate 2 is bent, and is integrally connected with the cavity 1, avoiding the stress concentration problem caused by welding or riveting, and improving the anti-mechanical vibration performance.

[0062] The protruding structure 13 is composed of a bending transition area 130 and a functional area 131 for soldering connection with the outer conductor 30 of the feeder 3. The functional area 131 is connected to the metal plate 2 as a whole through the bending transition area 130. The surface of the functional area 131 is plated and is welded and fixed after being attached to the outer conductor 30 of the feeder 3. Generally, for the consideration of the soldering connection effect, the length of the functional area 131 is preferably 5-10 mm.

[0063] Specifically, the plating process can be electro-tin plating or metal coating plating. Similarly, the plating process is also pre-processed before the metal plate 2 is bent into the cavity 1.

[0064] In this embodiment, if Figure 1-Figure 5As shown, the protruding structure 13 is located on the right packaging wall 1011, and the protruding structure 13 includes a functional area 131 and two bending transition areas 130. The two ends of the functional area 131 of the protruding structure 13 are connected to the corresponding positions of the plate body of the metal plate 2 through a bending transition area 130, and the bending transition area 130 is a slope structure. In this way, when the metal plate 2 is bent sequentially along the same axis into the shape of the cavity 1 through the sheet metal process, the protruding structure 13 will be located on the right packaging wall 1011, and the protruding structure 13 as a whole protrudes out of the plane of the right packaging wall 1011.

[0065] In another embodiment, if Figure 6-Figure 9 As shown, the difference from the above embodiment is that the protruding structure 13 is connected to the lower packaging wall 1001 and protrudes out of the plane of the left packaging wall 1010, and the protruding structure 13 includes a functional area 131 and a bending transition area 130. One end of the functional area 131 of the protruding structure 13 is connected to an end 20 of the metal plate 2 through the bending transition area 130 and protrudes out of the end 20. The bending transition area 130 is a slope structure. In this way, when the metal plate 2 is bent sequentially along the same axis into the shape of the cavity 1 through the sheet metal process, the protruding structure 13 will be connected to the lower packaging wall 1001 and protrude out of the plane of the left packaging wall 1010.

[0066] In yet another embodiment, Figure 10-13 As shown, the difference from the above two embodiments is that the protruding structure 13 is connected to the lower packaging wall 1001 and protrudes out of the plane of the left packaging wall 1010, and the protruding structure 13 includes a functional area 131 and two bending transition areas 130, and one end of the functional area 131 of the protruding structure 13 is connected to one end 20 of the metal plate 2 through a bending transition area 130 and protrudes out of the end 20, and the other end of the functional area 131 of the protruding structure 13 is connected to another bending transition area 130, and the bending transition area 130 is a slope structure. In this way, when the metal plate 2 is bent sequentially along the same axis into the shape of the cavity 1 through the sheet metal process, the protruding structure 13 will be connected to the lower packaging wall 1001 and protrude out of the plane of the left packaging wall 1010.

[0067] In this embodiment, a plurality of feeder holes 14 are arranged at intervals on the vertical packaging wall 101 where the protruding structure 13 is located. The feeder holes 14 are pre-processed on the metal plate 2 before the metal plate 2 is bent and formed by a sheet metal process.

[0068] It is understandable that the feeder hole 14 is used to pass the inner conductor 31 and the dielectric member 32 of the feeder 3 through the RF circuit of the inner cavity 12 of the cavity 1 for soldering connection. The dielectric member 32 prevents the inner conductor 31 from contacting the inner wall of the feeder hole 14 .

[0069] In particular, the feed line hole 14 and the protruding structure 13 are arranged on the same vertical packaging wall 101 , and the distance between the feed line hole 14 and the protruding structure 13 is as small as possible to ensure the grounding effect of the feed line 3 .

[0070] In addition, a plurality of operation holes 15 are provided on the horizontal packaging wall 100 for corresponding one-to-one with the input port and output port of the RF circuit in the cavity 1; a plurality of mounting holes 16 are provided on the horizontal packaging wall 100 and / or the vertical packaging wall 101 for facilitating the installation and positioning of the cavity 1. In this embodiment, the mounting holes 16 are provided on the vertical packaging wall 101. In other embodiments, the mounting holes 16 may also be provided on the horizontal packaging wall 100, and of course, the mounting holes 16 may also be provided on both the vertical packaging wall 101 and the horizontal packaging wall 100.

[0071] In this embodiment, if Figure 2 As shown, the manufacturing method of the cavity structure comprises the following steps:

[0072] Step S1: Prepare a metal plate 2 with double-sided coating 17 .

[0073] It is understandable that the metal plate 2 that has been pre-coated with a machine-automated double-sided film 17 can be directly used. Generally, the film 17 is made of a material that is resistant to corrosion by the plating solution, easy to peel without leaving adhesive residue, and tightly adheres to the metal plate 2 to prevent penetration, such as PP, PE, PTFE, etc., and its thickness is preferably ≤0.1mm.

[0074] Step S2: Process the holes required for the cavity 1 structure on the metal plate 2 by CNC punching or laser cutting; form a protruding structure 13 on the metal plate 2 by sheet metal embossing; and form an auxiliary tear-off line 18 on the single-sided coating 17 where the protruding structure 13 is located by laser cutting, wherein the contour of the auxiliary tear-off line 18 completely covers the contour of the functional area 131 on the protruding structure 13 for soldering connection with the outer conductor 30 of the feeder 3.

[0075] It is understandable that the protrusion structure 13 is formed by convex forming of sheet metal when the hole position required by the cavity 1 structure is processed by CNC punching, or the hole position required by the cavity 1 structure is processed by laser cutting and then convex forming of sheet metal by punching. The auxiliary tearing line 18 is formed by laser cutting process to separate the film 17 of the functional area 131 from the film 17 of other areas of the metal plate 2, so as to facilitate the removal of the film 17 of the functional area 131. The shape of the auxiliary tearing line 18 can be circular, square or any other shape, as long as its outline can completely cover the outline of the functional area 131 to be plated.

[0076] Step S3: peeling off the coating 17 at the functional area 131 along the auxiliary tearing line 18 , and performing a local plating treatment on the exposed functional area 131 .

[0077] It is understandable that the plating process may be electro-tin plating or metal coating.

[0078] Step S4: removing the remaining coating 17 on the metal plate 2 and bending the metal plate 2 along a preset bending baseline 19 to form a cavity 1 structure.

[0079] Step S5: The cavity 1 is welded and sealed so that the inner cavity 12 of the cavity 1 structure forms an electromagnetic shielding cavity.

[0080] Specifically, the lower packaging wall 1001 and the left packaging wall 1010 can be welded and sealed along the length direction of the closed area 11 by a laser welding process, so that the inner cavity 12 of the cavity 1 constitutes an electromagnetic shielding cavity. Generally, during welding, the gap between the upper side of the lower packaging wall 1001 and the lower side of the left packaging wall 1010 should be ≤0.1 mm. The parameters of laser welding should be set to avoid defects such as pores and leaking welds.

[0081] The integrated pre-processing method of the present invention reduces the connection time and error accumulation between working procedures, and improves the continuity and efficiency of production.

[0082] The cavity 1 structure proposed in the present invention is a sheet metal structure, which is formed by stamping and bending a metal plate 2, with high processing efficiency and no burrs on the surface, which can greatly save processing time, reduce processing costs, and improve product quality. The entire manufacturing process integrates multiple key steps in the metal plate 2 stage to improve production efficiency.

[0083] The cavity 1 structure proposed in the present invention only needs to perform local electroplating or metal coating treatment on the protruding structure 13 welded to the outer conductor 30 of the feed line 3, which can greatly reduce the electroplating area of ​​the cavity 1 and save costs.

[0084] The cavity 1 structure proposed by the present invention adopts cold-processed sheet metal bending, which can flexibly adjust the internal cavity size to quickly meet diverse design requirements, and avoid the influence of low dimensional accuracy of hot processing in aluminum alloy pultrusion, and better ensure the stability and consistency of RF circuit performance. In addition, the present invention is thin and has uniform wall thickness, which can effectively reduce weight while ensuring structural strength.

[0085] A second aspect of an embodiment of the present invention provides a phase shifter 7, comprising a cavity 1 structure as described in any one of the first aspects, and a phase shift component built into the cavity 1, wherein the phase shift component comprises:

[0086] The RF circuit board 4 is fixed to the inner cavity 12 of the cavity 1 through a heat-resistant foam support 6; specifically, a block-shaped heat-resistant foam support 6 corresponding to the feeding point 40 of the RF circuit board 4 is provided on the opposite side to the feeding point 40 of the RF circuit board 4 to stably support the RF circuit board 4 in the inner cavity 12.

[0087] The sliding medium 5 is attached to the radio frequency circuit board 4 .

[0088] The pull rod (not shown in the figure) is connected to an external driving mechanism (not shown in the figure) and is used to drive the sliding medium 5 to move.

[0089] like Fig.14 Shown is a method of using multiple Figure 3 The structural diagram of the phase shifter 7 is shown; Fig.15 Shown is a method of using multiple Figure 7 The schematic diagram of the structure of the phase shifter 7 is shown. A plurality of phase shifters 7 are stacked and fixed by means of the clamps 8 and the mounting holes 16 .

[0090] The phase shifter 7 using the cavity 1 structure of the present invention is a single-cavity structure, which avoids the hidden dangers of different precision of each cavity of the phase shifter 7 and uncontrollable batch changes caused by factors such as differences in the structural size or structural strength of each cavity mold in the multi-cavity integrated molding of aluminum alloy pultrusion profiles, heat dissipation and cooling during pultrusion molding. The phase shifter 7 using the cavity 1 structure of the present invention is a single-cavity structure, which can be flexibly combined in practical applications, which is helpful for layout optimization in product design.

[0091] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The above-mentioned embodiments only express the specific implementation of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A cavity structure, characterized in that: The cavity includes two horizontal packaging walls arranged opposite to each other in the horizontal direction and two vertical packaging walls arranged opposite to each other in the vertical direction. The cavity is formed by bending a metal plate in sequence along the same axis through a sheet metal process. At least one of the vertical packaging walls is provided with a plurality of protrusion structures spaced apart along the length direction of the cavity. The protrusion structures are used to be connected to the outer conductor of the feeder by soldering.

2. A cavity structure according to claim 1, characterized in that: At least one end of the same axis of the metal plate constitutes a closed area, and the closed area is located outside the inner cavity of the cavity structure. The closed area is an angle connection area formed by the extension section of one of the horizontal packaging walls of the cavity structure and the outer surface of an adjacent vertical packaging wall. The closed area is closed by welding so that the inner cavity constitutes an electromagnetic shielding cavity.

3. A cavity structure according to claim 2, characterized in that: The two horizontal packaging walls are an upper packaging wall and a lower packaging wall respectively. One end of the lower packaging wall extends to the outer surface of an adjacent vertical packaging wall and its inner surface is attached to or connected to an end surface of the adjacent vertical packaging wall to form the closed area.

4. A cavity structure according to claim 1, characterized in that: The protruding structure is an endogenous structure on the vertical packaging wall, and the endogenous structure is pre-processed on the metal plate before the metal plate is bent and formed by a sheet metal process.

5. A cavity structure according to claim 4, characterized in that: The protruding structure consists of a bending transition zone and a functional zone for soldering connection with the outer conductor of the feeder, and the functional zone is connected to the metal plate as a whole through the bending transition zone.

6. A cavity structure according to claim 5, characterized in that: The surface of the functional area is plated and is in contact with the outer conductor of the feeder line.

7. The cavity structure according to claim 1, characterized in that: A plurality of feeder holes are arranged at intervals on the vertical packaging wall where the protruding structure is located. The feeder holes are pre-processed on the metal plate before the metal plate is bent and formed by a sheet metal process.

8. The cavity structure according to claim 1, characterized in that: A plurality of operation holes corresponding one-to-one to the input port and output port of the RF circuit in the cavity are arranged on the horizontal packaging wall, and a plurality of installation holes facilitating the installation and positioning of the cavity are arranged on the horizontal packaging wall and / or the vertical packaging wall.

9. A cavity structure according to any one of claims 1 to 8, characterized in that: The manufacturing method of the cavity structure comprises the following steps: Prepare double-sided coated metal sheets; Process the holes required for the cavity structure on the metal plate by CNC punching or laser cutting; A raised structure is formed on a metal plate by performing sheet metal convex forming; A laser cutting process is used to form an auxiliary tear-off line on the single-side covering film where the protruding structure is located, wherein the contour of the auxiliary tear-off line completely covers the contour of the functional area on the protruding structure for soldering connection with the outer conductor of the feeder; The coating at the functional area is peeled off along the auxiliary tearing line, and the exposed functional area is locally plated; Removing the remaining coating on the metal plate, and bending the metal plate along a preset bending baseline to form a cavity structure; The cavity is welded and sealed so that the inner cavity of the cavity structure forms an electromagnetic shielding cavity.

10. A phase shifter, characterized in that: The invention comprises a cavity structure as claimed in any one of claims 1 to 9, and a phase shifting component built into the cavity, wherein the phase shifting component comprises: A radio frequency circuit board is fixed to the inner cavity of the cavity through a temperature-resistant foam support; A sliding medium is attached to the radio frequency circuit board; The pull rod is connected to the external driving mechanism and is used to drive the sliding medium to move.

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