Quartz resonator transparent electrode pattern implementation device

Abstract

The utility model discloses a device for realizing a transparent electrode pattern of a quartz resonator. The device comprises an upper metal coating cover plate and a lower metal coating cover plate which have the same size and are provided with annular organic cushions. A film coating hole is formed in the film coating cover plate, a circular quartz placing bin is arranged on the inner side of the film coating cover plate, and an annular organic soft cushion is connected into the placing bin. The two coated cover plates are in an antisymmetric pattern and are connected and fixed through fastening bolts and nuts. And after the cover plate is closed and the bolt is tightened, evaporation of the quartz resonator electrode can be carried out. And electrode gas forms a film on the surface of the quartz wafer through the film coating hole. And the annular organic cushion has certain elasticity, so that the quartz wafer can be better fixed and sealed, and the precision of the boundary dimension of an electrode pattern is ensured.

Description

Technical Field

[0001] The utility model relates to the field of quartz wafer processing equipment, in particular to a quartz wafer transparent electrode pattern realization device. Background Art

[0002] In addition to its piezoelectric properties that can be used as a resonator, quartz crystals also have a wide band gap, which allows a portion of ultraviolet light and all visible and infrared light to pass through, making them suitable for use as window materials or substrate materials for optoelectronic devices. Using transparent conductive films as electrodes to make quartz crystal resonators can enable quartz resonators to have the characteristics of both electromechanical coupling and optical transmission. Since transparent electrodes are generally prepared using sputtering or atomic layer deposition technology with diffraction characteristics, precise control of their shape patterns is very important, which poses a challenge to traditional masks used for evaporation and deposition of metal electrodes. Reducing the gap between the mask and the quartz wafer can effectively avoid the shadow area of ​​the coating and improve the accuracy of the electrode coating pattern. For existing rigid masks, it is impossible to completely achieve a closed fit with the quartz wafer. In addition, the quartz wafer is thin and fragile, and rigid contact can easily cause defects on the quartz wafer, and even cause the quartz wafer to break.

[0003] In view of the above problems, the utility model proposes a device for realizing transparent electrode patterns of quartz resonators. The device aims to improve the accuracy and consistency of quartz wafers in the process of depositing transparent electrodes, ensure the standardization of electrode patterns, and avoid contact damage to quartz wafers, thereby improving the reliability of quartz resonators with transparent electrodes and broadening application scenarios. Utility Model Content

[0004] The utility model provides a device for realizing transparent electrode patterns of a quartz resonator, which is realized by the following technical means:

[0005] 1. Two metal-coated cover plates 1 of the same size and antisymmetric structure overlap, with a thickness of 1-2 mm. A coating hole 2 is provided on the coating cover plate, which penetrates the cover plate so that the electrode gas can pass through the coating hole to form an electrode film on the surface of the quartz wafer. The coating hole 2 is in the shape of a pattern consisting of a small circle with a radius smaller than the circular quartz placement chamber 3 and a rectangle. The center of the small circle coincides with the center of the circular quartz placement chamber 3. The radius of the small circle is r0, and the rectangle extends to the outer edge of the circular quartz placement chamber 3.

[0006] 2. A circular quartz placement chamber 3 is provided inside the cover plate for placing quartz wafers. The depth of the placement chamber is about 200-300 μm, and the specific height is determined according to the actual thickness of the quartz wafer. The radius r3 of the placement chamber is about 100 μm larger than the radius r4 of the quartz wafer.

[0007] 3. An annular organic soft pad 4 is provided in the placement chamber for sealed contact with the quartz wafer. The annular organic soft pad can be made of silicone, nitrile rubber, chloroprene rubber, epoxy resin or other organic materials with good elasticity and stable properties. The annular organic soft pad coincides with the center of the circular quartz placement chamber 3, the inner diameter is r1, the outer diameter is r2, the radius of the quartz placement chamber is r3, and the radius of the quartz wafer to be plated with the electrode is r4, wherein r3>r4, r0=r1, r0<r2<r3, that is, the inner ring of the annular organic soft pad 4 is aligned with the coating hole 2, the outer ring is located between the circular quartz placement chamber 3 and the coating hole 2, and the thickest part of the annular organic soft pad is located at the inner ring and distributed around the edge of the coating hole. The height of the organic soft pad is about 50-100μm, which is less than the depth of the circular quartz placement chamber. The annular organic soft pad can be formed in the placement chamber using an injection molding process or a thermal evaporation process. The width r2-r1 of the annular organic soft pad is about 300 μm, and the specific width is determined according to the material used for the soft pad and the production precision requirements. The cross section of the annular organic soft pad can be triangular, semicircular, wedge-shaped or arc-shaped.

[0008] 4. The number of circular quartz placement chambers 3 configured on the metal-coated cover plate 1 can be increased or decreased according to actual needs, and the shape of the cover plate can be rectangular or other axially symmetrical polygons. After the two coated cover plates overlap, they are connected and fixed by tightening bolts and nuts 5. The bolts and nuts can also serve as brackets for the device to avoid contamination.

[0009] Through the above-mentioned structural design, the utility model effectively solves the problem in the prior art that it is difficult to evaporate regular transparent electrode patterns due to the lightness, thinness and brittleness of the quartz wafer, improves the stability and fixation effect of the quartz wafer during the coating process, ensures the accuracy of the electrode pattern, and avoids the quartz wafer from falling off or being damaged, thereby improving the reliability of the resonator with transparent electrodes and broadening its application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a top view of a single device in an embodiment of the utility model, wherein: 1 is a metal coating cover plate, 2 is a coating hole, 3 is a circular quartz placement chamber, 4 is an annular organic cushion, 6 is the radius r0 of the circular coating hole, 7 is the inner diameter r1 of the annular organic cushion, 8 is the outer diameter r2 of the annular organic cushion, and 9 is the radius r3 of the circular quartz placement chamber.

[0011] Figure 2 It is a top view of one of the two metal-coated cover plates of the same size and antisymmetric structure in the utility model, wherein 1 is the metal-coated cover plate, 2 is the coating hole, 3 is the circular quartz placement chamber, 4 is the annular organic cushion, and 5 is the fixing bolt and nut hole.

[0012] Figure 3It is a cross-sectional view of a single coating unit after the paired device in the utility model is installed, wherein: 1 is a metal coating cover plate, 2 is a coating hole, 3 is a circular quartz placement chamber, 4 is an annular organic cushion, and 10 is a quartz wafer.

[0013] Figure 4 7 is a cross-sectional view of the annular organic soft pad in the present invention, 7 is the inner diameter r1 of the annular organic soft pad, and 8 is the outer diameter r2 of the annular organic soft pad. DETAILED DESCRIPTION

[0014] In order to further understand the content, features and effects of the present invention, the following embodiments are given as examples and described in conjunction with the accompanying drawings:

[0015] See also Figure 1-3 , two rectangular metal coating cover plates 1 of the same size and antisymmetric structure overlap, and the coating cover plate thickness is 1.5mm. The coating cover plate is provided with a coating hole 2, which penetrates the cover plate so that the electrode gas can pass through the coating hole to form an electrode film on the surface of the quartz wafer. The coating hole is in the shape of a pattern composed of a small circle with a radius of r0 and a rectangle of a certain width. The center of the small circle coincides with the center of the circular quartz placement chamber 3, and the rectangle extends to the outer edge of the circular quartz placement chamber 3.

[0016] There is a circular quartz placement chamber 3 on the inner side of the cover plate. When the electrode is evaporated, the quartz wafer is placed in the placement chamber 3. The depth of the placement chamber is greater than the thickness of the quartz wafer. The radius of the placement chamber is r3, which is about 100μm larger than the radius r4 of the quartz wafer. An annular organic soft pad 4 is connected to the placement chamber to further fix the sealed quartz wafer. The annular organic soft pad material uses silicone, nitrile rubber, chloroprene rubber, epoxy resin or other organic materials with good elasticity and stable properties. The annular organic soft pad 4 and the circular quartz placement chamber 3 are at the same point. The inner diameter of the annular organic soft pad is r1, and the outer diameter is r2. R2-r1 is about 300μm, wherein r3>r4, r0=r1, r0<r2<r3, that is, the inner ring of the annular organic soft pad 4 is aligned with the coating hole 2, and is distributed around the edge of the coating hole. The outer ring is located between the circular quartz placement chamber 3 and the coating hole 2, and the thickest part of the annular organic soft pad is located at the inner ring. The height of the annular organic soft pad is 50-100 μm, and the organic soft pad is formed in the placement chamber by using an injection molding process or a thermal evaporation process. The cross section of the annular organic soft pad can be triangular, semicircular, wedge-shaped or arc-shaped.

[0017] There are a certain number of circular quartz placement chambers on the metal coating cover plate 1. When in use, open the cover plate, place the quartz wafers one by one in the placement chamber 3, cover the coating cover plate, and use five pairs of fastening bolts and nuts 5 to connect and fix them at the four corners and the center. The bolts and nuts can also be used as brackets for placing the device to avoid contamination. After installation, put the device into the vacuum coating equipment and start the first evaporation. After the first evaporation is completed, turn the device over and perform the second evaporation. After the second evaporation is completed, take out the quartz wafer.

[0018] The working principle of the utility model is as follows:

[0019] In this device, the quartz wafer is placed in the placement chamber 3. The annular organic soft pad 4 connected to the placement chamber 3 has good elasticity, which can more stably fix the sealed quartz wafer without damaging the quartz wafer. In addition, the clamping effect of the metal-coated cover plate 1 on the upper and lower sides makes the quartz wafer stably placed between the cover plates. During the evaporation process, the electrode gas passes through the coating hole 2 and forms a uniform film on the surface of the quartz wafer. Due to the sealing effect of the annular organic soft pad, the electrode gas will not migrate and diffuse to the non-electrode forming area, ensuring the accuracy of the electrode pattern shape. After two coatings, the quartz wafer is plated with metal electrodes on both sides, and the passage for external connection is retained.

[0020] It should be noted that the above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Any simple modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model are within the scope of the technical solution of the utility model. At the same time, the orientation or position relationship indicated by the terms "upper" and "lower" is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the application. Unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two components. The radius and thickness mentioned in the utility model can be adjusted according to production needs. The present invention uses a circular quartz wafer as an example, and the circular coating hole, circular quartz placement chamber, and annular organic soft pad are only used to better illustrate the present invention, and do not limit the present invention. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

Claims

1. A quartz resonator transparent electrode pattern realization device, characterized in that: The invention comprises two metal coating cover plates (1) of the same size and antisymmetric structure, wherein a coating hole (2) is provided on the coating cover plate, a circular quartz placement chamber (3) is provided on the inner side of the cover plate, an annular organic soft pad (4) is provided in the placement chamber, the radius of the coating hole (2) is the same as the electrode radius of the quartz resonator, which is r0, the annular organic soft pad (4) coincides with the center of the circular quartz placement chamber (3) and is distributed around the edge of the coating hole, the inner diameter of the annular organic soft pad is r1, the outer diameter is r2, the radius of the quartz placement chamber is r3, and the radius of the quartz wafer of the electrode to be plated is r4, wherein r3>r4, r0=r1, r0<r2<r3, that is, the inner ring of the annular organic soft pad (4) is aligned with the coating hole (2), the outer ring is located between the circular quartz placement chamber (3) and the coating hole (2), and the thickest part of the annular organic soft pad is located at the inner ring, and the two coating cover plates are overlapped and connected and fixed by fastening bolts and nuts (5).

2. The device for realizing a transparent electrode pattern of a quartz resonator according to claim 1, characterized in that: The annular organic soft pad (4) can be made of silica gel, nitrile rubber, chloroprene rubber, or epoxy resin, and the cross section of the annular ring can be triangular, semicircular, wedge-shaped, or arc-shaped.

3. The device for realizing transparent electrode pattern of quartz resonator according to claim 1, characterized in that: The thickest part of the annular organic soft pad (4) is about 50-100 μm, which is less than the depth of the circular quartz placement chamber (3). The annular organic soft pad can be formed in the placement chamber by using an injection molding process or a thermal evaporation process.

4. The device for realizing transparent electrode pattern of quartz resonator according to claim 1, characterized in that: The circular ring width r2-r1 of the annular organic soft pad (4) is approximately 300 μm.

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