Heat capacity laser
By using the phase change process of the first phase change medium and the second phase change medium in the heat capacitance laser, rapid cooling and efficient heat management of the laser light source are achieved, and the problem of limited heat capacity of energy storage medium in the prior art is solved, and the cooling needs of high-power lasers are met.
Patent Information
- Application Number
- CN202510479914.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-17
- Publication Date
- 2025-05-13
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing heat capacity of the energy storage medium of the heat capacity of the heat capacity of the energy storage medium is difficult to meet the needs of higher power lasers.
A heat capacitance laser is adopted to absorb heat by the first phase change medium flowing in the pipeline and the second phase change medium provided in the condenser by using the phase change process to reduce the heat of the first phase change medium, thereby achieving rapid cooling of the laser light source.
It realizes efficient heat management and rapid cooling, has a large heat storage capacity, and can meet the cooling needs of high-power lasers.
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Figure CN119994631A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of lasers, and in particular to a heat capacity laser. Background Art
[0002] Lasers have been widely used in various fields of the national economy. With the development of practical engineering, the output power of lasers is getting higher and higher, and the heat power density is also higher, which poses a higher thermal management challenge to cooling technology.
[0003] Lasers that work at high power in a short time can use the working mode of heat capacity lasers, that is, the heat generated by the laser working material is absorbed by the energy storage medium and slowly released after the work is completed, separating the emission and cooling processes in time. Heat capacity lasers can achieve high-power laser output in a short working time, and reduce size and weight, making it easy to use during movement.
[0004] In the process of realizing the present invention, the inventors found that there are at least the following problems in the prior art: the existing heat capacity laser energy storage medium has limited heat capacity and is difficult to meet the needs of higher power lasers. Summary of the invention
[0005] The present invention aims to solve one of the technical problems in the related art at least to a certain extent.
[0006] Therefore, the object of the present invention is to provide a heat capacity laser capable of achieving efficient heat management and rapid cooling.
[0007] To achieve the above object, the present invention provides a heat capacity laser, comprising: a first phase change medium, a second phase change medium, a pipeline, a compression pump, a condenser, an expansion valve, a storage tank, an evaporator and a laser light source.
[0008] The compression pump, the condenser, the expansion valve, the storage tank and the evaporator are sequentially connected to form a loop through the pipeline; the laser light source is arranged on the evaporator;
[0009] The first phase change medium is stored in the storage tank and flows in the pipeline; the second phase change medium is arranged in the condenser and is used to cool the first phase change medium.
[0010] According to the heat capacity laser of the present invention, by making the first phase change medium flow in the pipeline and arranging the second phase change medium in the condenser, the second phase change medium can absorb heat from the first phase change medium through the phase change process, effectively reduce the heat of the first phase change medium, realize rapid cooling of the laser light source, have a large heat storage capacity, and can meet the cooling requirements of high-power lasers.
[0011] According to an embodiment of the present invention, the first phase change medium transforms between a liquid state and a gaseous state, and the second phase change medium transforms between a solid state and a liquid state.
[0012] According to an embodiment of the present invention, the first phase change medium is made of tetrafluoroethane.
[0013] According to an embodiment of the present invention, the second phase change medium is made of paraffin.
[0014] According to an embodiment of the present invention, the laser light source is a single semiconductor laser tube.
[0015] According to an embodiment of the present invention, the laser light source is sintered on the evaporator.
[0016] According to an embodiment of the present invention, there are multiple evaporators, and the multiple evaporators are connected in parallel.
[0017] According to one embodiment of the present invention, the condenser has a condenser pipeline therein, and the condenser pipeline has a plurality of continuous "U"-shaped pipe sections.
[0018] According to an embodiment of the present invention, it further comprises fins, wherein the fins are connected to the condenser, the condenser pipeline is arranged at the bottom of the condenser, the fins are arranged above the condenser pipeline, and the fins extend into the second phase change medium.
[0019] According to an embodiment of the present invention, the cross-sectional shape of the fin is sinusoidal, triangular or square.
[0020] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. Among them:
[0022] Figure 1 Schematic diagram of the structure of a heat capacity laser in one embodiment of the present invention.
[0023] Figure 2 It is a structural schematic diagram of a heat capacity laser from another perspective in one embodiment of the present invention.
[0024] Figure 3 Schematic diagram of the flow path of the first phase change medium in one embodiment of the present invention.
[0025] Figure 4 It is a partial cross-sectional schematic diagram of the flow path of the first phase change medium in one embodiment of the present invention.
[0026] Figure 5 FIG. 4 is a cross-sectional view of a second phase change medium according to an embodiment of the present invention.
[0027] Description of reference numerals:
[0028] 1-first phase change medium; 2-liquid pipeline; 3-expansion valve; 4-storage tank; 5-laser light source; 6-evaporator; 7-evaporator pipeline; 8-gas pipeline; 9-compression pump; 10-condenser; 11-condenser pipeline; 12-fin; 13-second phase change medium. DETAILED DESCRIPTION
[0029] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limitations of the present invention. On the contrary, embodiments of the present invention include all changes, modifications and equivalents that fall within the spirit and connotation of the appended claims.
[0030] Reference below Figures 1 to 5 , describing a heat capacity laser according to an embodiment of the present invention.
[0031] The heat capacity laser according to the embodiment of the present invention comprises: a first phase change medium 1, a second phase change medium 13, pipelines, a compression pump 9, a condenser 10, an expansion valve 3, a storage tank 4, an evaporator 6 and a laser light source 5.
[0032] The compression pump 9, the condenser 10, the expansion valve 3, the storage tank 4 and the evaporator 6 are connected in sequence through pipelines to form a loop. The laser light source 5 is arranged on the evaporator 6. The first phase change medium 1 is stored in the storage tank 4 and flows in the pipeline; the second phase change medium 13 is arranged in the condenser 10 for cooling the first phase change medium 1. The specific type of the compression pump 9 is selected according to actual needs. For example, the compression pump 9 can select a centrifugal compressor, a scroll compressor, etc. The laser light source 5 can be attached to the outer surface of the evaporator 6 by welding, sintering, brazing, etc. or a combination thereof.
[0033] Phase change is the process of a substance changing from one phase to another, and phase change is the process of heat transfer. The heat capacity laser realizes the heat transfer of the laser light source through the first phase change medium 1 and the second phase change medium 13. The first phase change medium 1 and the second phase change medium 13 are both used as refrigerants, and their manufacturing materials are set according to actual needs, and there is no specific restriction on this.
[0034] The working process of the heat capacity laser of the embodiment of the present invention is as follows: the first phase change medium 1 in the pipeline enters the compression pump 9 in the form of low-temperature and low-pressure gas, is compressed into a high-temperature and high-pressure gas, and then flows into the condenser 10. In addition to heat exchange with the second phase change medium 13, the first phase change medium 1 also exchanges heat with the outside air, and the heat released by the first phase change medium 1 and the second phase change medium 13 is finally discharged to the external environment. The second phase change medium 13 undergoes a phase change during the heat exchange process, for example, from a solid to a liquid. Next, the first phase change medium 1 passes through the expansion valve 3, which is a throttling device. The pressure drops sharply here, causing the first phase change medium 1 to become a mixed state of low temperature and low pressure. After the low-temperature and low-pressure first phase change medium 1 enters the evaporator 6, it begins to absorb the heat generated by the operation of the laser light source 5 and evaporates into gas, thereby achieving cooling of the laser light source 5. Subsequently, the gaseous first phase change medium 1 flows into the compression pump 9, and the above process continues to circulate.
[0035] According to the heat capacity laser of the embodiment of the present invention, by making the first phase change medium flow in the pipeline and arranging the second phase change medium in the condenser, the second phase change medium can absorb heat from the first phase change medium through the phase change process, effectively reduce the heat of the first phase change medium, realize rapid cooling of the laser light source, have a large heat storage capacity, and can meet the cooling requirements of high-power lasers.
[0036] In some embodiments, the first phase change medium 1 is transformed between liquid and gas, and the second phase change medium 13 is transformed between solid and liquid. The first phase change medium 1 is made of tetrafluoroethane. The second phase change medium 13 is made of paraffin. Tetrafluoroethane has the advantages of good environmental protection, easy replacement, and efficient heat exchange. Paraffin has the advantages of high latent heat value, good chemical stability and low cost.
[0037] like Figure 1 As shown, the first phase change medium 1 in the pipelines between different components has different states, for example, in the pipeline between the condenser 10 and the expansion valve 3, i.e., the liquid pipeline 2, the first phase change medium 1 is in liquid state. In the pipeline between the evaporator 6 and the compression pump 9, i.e., the gas pipeline 8, the first phase change medium 1 is in gaseous state.
[0038] The specific type of the laser light source 5 is selected according to actual needs and is not limited thereto. For example, a single semiconductor laser tube is used. The laser light source 5 is sintered on the evaporator 6. At least one laser light source 5 can be sintered on each evaporator 6. At the same time, the number of evaporators 6 can be multiple, and multiple evaporators 6 can be connected in parallel to achieve cooling of more laser light sources 5. Figure 3 and Figure 4 As shown, each evaporator 6 is provided with a plurality of evaporator pipelines 7, and the evaporator pipelines 7 are connected in parallel with each other and communicated with external pipelines.
[0039] The condenser 10 has a condenser pipeline 11, which has a plurality of continuous "U"-shaped pipe sections. The plurality of "U"-shaped pipe sections can increase the total length of the pipeline within the limited space of the condenser, increase the contact area between the first phase change medium and the condenser 10, and improve the heat exchange efficiency.
[0040] like Figure 5 As shown, in some embodiments, the heat capacity laser further includes a fin 12, the fin 12 is connected to the condenser 10, the condenser pipeline 11 is arranged at the bottom of the condenser 10, the fin 12 is arranged above the condenser pipeline 11, and the fin 12 extends into the second phase change medium 13. The second phase change medium 13 is in contact with both the upper and lower surfaces of the fin 12. The top of the second phase change medium 13 may be in contact with the external environment, or may not be in direct contact with the external environment. The second phase change medium 13 cooperates with the fin 12 to enhance the heat exchange efficiency between the second phase change medium 13 and the condenser 10. The specific type of the fin 12 is set according to actual needs, and there is no specific restriction on this. For example, the cross-sectional shape of the fin 12 can be a sine shape, a triangle or a square shape. In one example, the condenser 10 is a structure approximately cuboid, without a top cover. For example, the cross-sectional shape of the fin 12 is wavy, has a larger heat exchange area, and has a higher heat exchange efficiency. The second phase medium 13 is in contact with both the upper and lower surfaces of the corrugated fins 12. The edge of the fin 12 is connected to the side wall of the condenser 10, shortening the heat conduction path from the fin to the condenser shell and improving the overall heat exchange efficiency. The edge of the fin 12 and the side wall of the condenser 10 can be welded, brazed, mechanically fixed, integrally formed, or a combination thereof. Figure 5 In the illustrated embodiment, the condenser 10 has no top cover, and the second phase change medium 13 is in direct contact with the external environment and is directly exposed to the external environment, thereby rapidly releasing heat, simplifying the heat dissipation structure, and reducing costs.
[0041] It should be noted that, in the description of the present invention, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.
[0042] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0043] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0044] In the description of the present invention, the directions or positional relationships indicated by the terms "left", "right", "front", "rear", etc. are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.
[0045] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code that includes one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present invention belong.
[0046] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0047] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.
Claims
1. A heat capacity laser, characterized in that: include: A first phase change medium (1), a second phase change medium (13), a pipeline, a compression pump (9), a condenser (10), an expansion valve (3), a storage tank (4), an evaporator (6), and a laser light source (5), The compression pump (9), the condenser (10), the expansion valve (3), the storage tank (4) and the evaporator (6) are connected in sequence through the pipeline to form a loop; the laser light source (5) is arranged on the evaporator (6); The first phase change medium (1) is stored in the storage tank (4) and flows in the pipeline; the second phase change medium (13) is arranged in the condenser (10) and is used to cool the first phase change medium (1).
2. The heat capacity laser according to claim 1, characterized in that: The first phase change medium (1) transforms between a liquid state and a gaseous state, and the second phase change medium (13) transforms between a solid state and a liquid state.
3. The heat capacity laser according to claim 2, characterized in that: The first phase change medium (1) is made of tetrafluoroethane.
4. The heat capacity laser according to claim 2, characterized in that: The second phase change medium (13) is made of paraffin.
5. The heat capacity laser according to claim 1, characterized in that: The laser light source (5) is a single semiconductor laser tube.
6. The heat capacity laser according to claim 1, characterized in that: The laser light source (5) is sintered on the evaporator (6).
7. The heat capacity laser according to claim 1, characterized in that: There are a plurality of evaporators (6), and the plurality of evaporators (6) are connected in parallel.
8. The heat capacity laser according to claim 1, characterized in that: The condenser (10) has a condenser pipeline (11) therein, and the condenser pipeline (11) has a plurality of continuous "U"-shaped pipe sections.
9. The heat capacity laser according to claim 8, characterized in that: It also comprises a fin (12), the fin (12) being connected to the condenser (10), the condenser pipeline (11) being arranged at the bottom of the condenser (10), the fin (12) being arranged above the condenser pipeline (11), and the fin (12) extending into the second phase change medium (13).
10. The heat capacity laser according to claim 9, characterized in that: The cross-sectional shape of the fin (12) is sinusoidal, triangular or square.
Citation Information
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