Piezoelectric micropump preparation method based on array processing segmentation and prepared piezoelectric micropump

Abstract

The invention discloses a piezoelectric micropump preparation method based on array processing segmentation and a prepared piezoelectric micropump. The method comprises the following steps: processing a sheet material to form a plurality of same device units; and the plurality of flaky materials respectively form single-layer array structures corresponding to different device layers of the piezoelectric micropump body. And aligning and bonding to form a full-page array pump body structure comprising a plurality of pump bodies. And the independent pump body is separated by scribing. According to the invention, a single-layer array structure with array device units can be obtained through chemical etching, photoetching and laser processing; a plurality of independent piezoelectric micropumps can be synchronously obtained by bonding and scribing the single-layer array structures of different devices, the piezoelectric micropumps can be prepared into plates in the preparation process, the production efficiency of the piezoelectric micropumps is effectively improved, and the piezoelectric micropumps have higher stability and consistency.

Description

Technical Field

[0001] The invention belongs to the technical field of piezoelectric micropump production, and in particular relates to a piezoelectric micropump preparation method based on array processing and segmentation and the prepared piezoelectric micropump. Background Art

[0002] MEMS micropumps are highly integrated microfluid delivery devices that use micro-electromechanical system technology to precisely control the flow of fluids. This type of pump is usually made of silicon-based materials and uses micromachining technology to manufacture complex fluid channels and drive structures, such as piezoelectric, electrostatic or thermally driven output contacts. The size of MEMS micropumps can range from a few millimeters to hundreds of microns, and can achieve accurate metering and delivery of trace fluids, making them very suitable for applications that require precise control of fluid volume. In the medical field, MEMS micropumps can be used in drug delivery systems to achieve timed and quantitative release of drugs, improve therapeutic effects and reduce side effects. In the field of chemical analysis, they can be used as key components in microfluidic chips for precise distribution and mixing of samples. In the field of biosensing, MEMS micropumps can be used to control the flow of biological samples and reagents, and improve the sensitivity and accuracy of detection. The design and manufacture of MEMS micropumps is an interdisciplinary process involving multiple fields such as fluid mechanics, materials science, and microelectronics engineering. With the advancement of technology, the performance and application range of MEMS micropumps are also expanding, and they have broad application prospects in portable medical devices, environmental monitoring, food safety testing and other fields.

[0003] The fabrication process of MEMS piezoelectric micropumps is a complex process involving precision engineering and materials science. It usually starts with a detailed design phase, which requires determining the structural and functional parameters of the micropump according to the application requirements. Next, select a suitable piezoelectric material, such as lead zirconate titanate (PZT) or lead magnesium nucleate (PMN). Subsequently, advanced micromachining techniques such as photolithography, wet and dry etching, and thin film deposition are used to accurately construct the microfluidic channel and piezoelectric drive structure of the micropump on a silicon substrate. The accuracy and quality of these structures directly affect the performance of the micropump. After that, the piezoelectric material is combined with the silicon substrate to form a piezoelectric drive unit. This step requires precise control of the thickness of the piezoelectric material and the layout of the electrodes to ensure the best driving effect. Next is the packaging process, which not only protects the internal structure of the micropump, but also provides the necessary electrical connections and fluid interfaces. Finally, rigorous testing and verification, including functional testing, durability testing, and environmental adaptability testing, are carried out to ensure the reliability and stability of the micropump in actual applications. The entire preparation process requires interdisciplinary knowledge and skills, including mechanical engineering, electronic engineering, materials science and chemical engineering, to ensure the high performance and long-term stable operation of the micropump. The electrical interface of the piezoelectric micropump is usually located outside the pump body for connecting a power adapter or driver.

[0004] For example, the Chinese patent with patent number CN116887154A discloses a "Piezoelectric MEMS transducer and its operation method and preparation method", and paragraph 0018 of its specification specifically discloses the following content: "Etching the second piezoelectric composite layer to obtain a plurality of first piezoelectric composite structures on one side of the silicon support film; obtaining a second silicon wafer with a partial cavity; bonding the plurality of first piezoelectric composite structures to the cavity side of the second silicon wafer; removing the first silicon wafer on the side of the first piezoelectric composite layer, and etching the first piezoelectric composite layer to obtain a plurality of second piezoelectric composite structures on the other side of the silicon support film; etching the silicon support film to expose the first piezoelectric composite structure; etching the second silicon wafer to form a complete cavity in the second silicon wafer". It can be seen that due to the material limitation of the silicon-based MEMS micropump device, the Chinese patent can only use chemical etching or dry etching to perform structural processing on the first piezoelectric composite layer and the second piezoelectric composite layer. The method and process are very complicated, resulting in a slower processing speed and low efficiency in batch processing.

[0005] For another example, the Chinese patent with patent number TWI616350B discloses a "Method for Manufacturing Fluid Control Devices", and paragraph 0013 of its specification specifically discloses the following content: "Stack the shell 26, the piezoelectric actuator 23 and the deformable base structure 20 in sequence, and position and join them." It can be seen from the comparative document that after the various components of the fluid control device are manufactured, they are stacked and then positioned and joined, and then finally assembled to manufacture a single fluid control device. Such a preparation process can only prepare a single fluid control device, that is, the preparation is one by one. If it is prepared in large quantities, more machines are required, the time is longer, and the production efficiency is relatively low. Non-silicon micropumps are still prepared using precision machining and precision mold processes, with high mold costs, poor product consistency and repeatability, high mass production costs, and low mass production efficiency.

[0006] For another example, the Chinese patent with patent number CN117923417A discloses a "Method for Manufacturing a Microfluid Pump", and the following content is disclosed in paragraph 0006 of the specification of the reference document: "In order to achieve the above-mentioned purpose, the broader implementation of this case is to provide a method for manufacturing a microfluid pump, comprising: step 1. preparing a first substrate; step 2. etching an upper surface of the first substrate to form at least one first groove; step 3. etching the upper surface of the first substrate to form a second groove, wherein the at least one first groove is located at the bottom of the second groove; step 4. depositing a first bonding layer on the surface of the at least one first groove and the second groove of the first substrate; step 5. preparing a third substrate; step 6. depositing a second bonding layer on the surface of the third substrate; step 7. pattern-etching the second bonding layer; step 8. preparing a second substrate, and combining the second substrate with the pattern-etched second bonding layer of the third substrate; step 9. removing part of the second substrate; step 10. pattern-etching the second bonding layer; step 11. removing part of the second substrate; step 12. pattern-etching the second bonding layer; step 13. removing part of the second substrate; step 14. pattern-etching the second bonding layer; step 15. removing part of the second substrate; step 16. pattern-etching the second bonding layer; step 17. pattern-etching the second bonding layer; step 18. removing part of the second substrate; step 19. pattern-etching the second bonding layer; step 20. pattern-etching the second bonding layer; step 21. pattern-etching the second bonding layer; step 22. pattern-etching the second bonding layer; step 23. pattern-etching the second bonding layer; step 24. pattern-etching the second bonding layer; step 25. pattern-etching the second bonding layer; step 26. pattern-etching the second bonding layer; step 27. pattern-etching the second bonding layer; step 28. pattern Etching the second substrate: step 11. combining the surface of the first substrate having the at least one first groove and the second groove with the second substrate: step 12. removing part of the third substrate; step 13. depositing a lower electrode layer and a piezoelectric layer on the third substrate in sequence; step 14. pattern-etching the lower electrode layer and the piezoelectric layer: step 15. depositing a flow channel layer, and pattern-etching the flow channel layer: step 16. depositing an upper electrode layer, and pattern-etching the upper electrode layer: step 17. pattern-etching the flow channel layer and the third substrate: step 18. pattern-etching a lower surface of the first substrate: step 19. etching the first bonding layer". It can be seen that the Chinese patent adopts a semiconductor process to complete the structure of the microfluid pump, and its manufacturing method is also prepared based on a silicon-based semiconductor process, but the silicon-based semiconductor process has a high wafer cost, and the materials compatible with the semiconductor process are all brittle, the reliability, fatigue characteristics, roller test, and drop test of the prepared micro pump have high risks, and the performance is poor, and it is difficult to mass produce at low cost and high efficiency.

[0007] In addition, a single conductive layer of an existing piezoelectric micropump can often only lead out one electrode interface of the actuator, so it is necessary to provide a conductive layer on each side of the actuator to realize the lead-out of the actuator power supply interface. The reason is that if the same conductive layer is divided into two independent conductive parts, it is very difficult to position and install the two conductive parts on the same layer. In addition, it is also difficult to connect the two conductive parts on the same layer to the electrode interfaces on both sides of the actuator. Summary of the invention

[0008] The purpose of the present invention is to solve the problem of low efficiency of the existing preparation process of piezoelectric micropumps, and to provide a piezoelectric micropump preparation method based on array processing and segmentation and a piezoelectric micropump prepared. An array processing scheme is used, and a composite process such as chemical etching, photolithography and laser precision processing is adopted to process each layer of the three-dimensional structure, and the whole-piece array bonding is used to realize the array processing of the micropump. Finally, an overall one-time array slicing preparation process is adopted, which can achieve batch preparation, thereby improving the efficiency and processing consistency of batch production of piezoelectric micropumps.

[0009] In a first aspect, the present invention provides a method for preparing a piezoelectric micropump based on array processing and segmentation, which comprises the following steps: The sheet material is processed to form a plurality of identical device units; the plurality of sheet materials respectively form a single-layer array structure corresponding to different device layers of the piezoelectric micropump body.

[0010] The single-layer array structures corresponding to different device layers of the piezoelectric micropump body are precisely aligned and bonded in order to form a full-page array pump body structure containing multiple pump bodies.

[0011] The entire array pump body structure is sliced ​​to separate the independent pump bodies.

[0012] Preferably, on the sheet material, the segmentation path of the scriber encloses a plurality of segmentation areas. A single device layer structure is processed on a single segmentation area. The device layer includes an electrode layer. The process of processing the single-layer array structure corresponding to the electrode layer is as follows: a hollow structure of the electrode layer is processed in the segmentation area. The hollow structure of the electrode layer includes a central through groove, a first separation groove, and a second separation groove. One end of the first separation groove and the second separation groove are respectively connected to different positions at the central through groove. The first separation groove and the second separation groove both intersect with the segmentation path of the scriber. The first separation groove and the second separation groove divide the entity structure in the segmentation area into two conductive parts; the two conductive parts are respectively the first conductive part and the second conductive part. The first conductive part extends a terminal. Along the circumference of the central through groove, the coverage of the second conductive part is greater than the coverage of the first conductive part. After the scriber is completed, the first conductive part and the second conductive part are completely separated to avoid short circuit.

[0013] Preferably, a conductive region is provided on the single-layer array structure corresponding to the electrode layer; the conductive region passes through the second conductive part of the hollow structure of all electrode layers and is staggered with the first conductive part of the hollow structure of all electrode layers; before bonding, conductive glue is applied to the conductive region, and insulating glue is applied to the area outside the conductive region.

[0014] Therefore, after bonding, the second conductive part will be connected to the adjacent connection layer or diaphragm layer, while the first conductive part will be insulated from the adjacent connection layer or diaphragm layer.

[0015] Preferably, the device units on the single-layer array structure are arranged in a matrix. The conductive area includes a plurality of rectangular areas corresponding to the number of columns of the electrode layer hollow structures; each rectangular area corresponds to a row of the electrode layer hollow structures.

[0016] This arrangement of the conductive areas makes it easier to apply the conductive glue and the insulating glue, as they only need to be applied along a straight line, thereby simplifying the single-layer array structure corresponding to the electrode layer and the complexity of applying the conductive glue and the insulating glue.

[0017] Preferably, in addition to the piezoelectric micro pump body, a single-layer array structure corresponding to the valve body layer and the drive layer is also produced. The drive layer is provided with a circuit structure for driving the actuator. The single-layer array structure corresponding to the valve body layer and the drive layer is precisely aligned and bonded. Each pump body separated by dicing is inspected; the pump bodies that pass the inspection are bonded to different valve body layer units one by one.

[0018] Preferably, in addition to the piezoelectric micro pump body, a single-layer array structure corresponding to the valve body layer and the drive layer is also produced. The drive layer is provided with a circuit structure for driving the actuator. The different device layers of the valve body layer, the drive layer and the piezoelectric micro pump body are precisely aligned and bonded in sequence.

[0019] Preferably, when processing the single-layer array structure corresponding to the valve body layer, two conductive holes are opened on the valve body layer; two driving output contacts are provided on the driving layer; elastic conductive structural parts are installed in the two conductive holes; the two conductive structural parts respectively conduct the two conductive parts on the electrode layer and the two driving output contacts on the driving layer through contact conduction.

[0020] Preferably, the conductive structure is a spring.

[0021] Preferably, the sheet material is cleaned and planarized; the planarization process is to temporarily bond the sheet material and perform fine grinding or CMP (chemical mechanical polishing) according to the actual flatness requirements. Specifically, the temporary bonding steps include: first cleaning and pre-treating the sheet material, then coating a layer of temporary bonding material on the sheet material, then aligning the sheet material with the substrate and applying pressure and temperature to solidify the material to form a stable connection; grinding, CMP, cutting, and testing in the bonded state; finally, separating the sheet material from the substrate by heating, solvent dissolution, or UV irradiation, and cleaning and inspecting.

[0022] Preferably, the bonding method for the single-layer array structures corresponding to different device layers is adhesive bonding.

[0023] Preferably, the sheet material is processed by any one or more of etching, laser processing and photolithography processing.

[0024] Preferably, in the whole array pump body structure obtained by bonding, through holes and / or blind hole structures are provided in each layer of the single-layer array structure, and a conductive structure is formed to achieve three-dimensional electrical conduction between the layers. The formation of the conductive structure includes but is not limited to metallization in the hole, silver paste injection and conductor insertion.

[0025] Preferably, the slicing method is slicing by a knife wheel or laser cutting.

[0026] Preferably, the sheet material can be made of stainless steel, carbon fiber, or a product that has undergone primary processing by chemical etching.

[0027] In a second aspect, the present invention provides a piezoelectric micropump, which is made by the above-mentioned piezoelectric micropump preparation method; the piezoelectric micropump includes a flow channel layer, a resonance layer, a first connection layer, a diaphragm layer, a second connection layer and an electrode layer which are stacked in sequence. A pump flow chamber is formed between the flow channel layer and the resonance layer. A resonance cavity is formed between the diaphragm layer and the resonance layer; the resonance layer is provided with a first flow hole located at a central position, and a plurality of second flow holes surrounding the first flow hole. An actuator element is fixed on the diaphragm layer; one side of the actuator element is connected to the first conductive part through a wiring terminal; the other side of the actuator element is connected to the second conductive part through the diaphragm layer, the second connection layer and the conductive adhesive; In a third aspect, the present invention provides a piezoelectric micropump, which is made by the above-mentioned piezoelectric micropump preparation method; the piezoelectric micropump includes a pump body, a valve body layer and a drive layer stacked in sequence; the pump body includes an end cover layer, a flow channel layer, a resonance layer, a diaphragm layer and an electrode layer stacked in sequence. An actuator is fixed on the diaphragm layer; the valve body layer is connected to the electrode layer; the two drive output contacts on the drive layer are respectively connected to the two conductive parts of the electrode layer through the conductive structure in the valve body layer. An actuator is fixed on the diaphragm layer; one side of the actuator is connected to the first conductive part through a wiring terminal; the other side of the actuator is connected to the second conductive part through the diaphragm layer and conductive glue; The present invention has the following beneficial effects: 1. The present invention can obtain a single-layer array structure with array device units through chemical etching, photolithography and laser processing; multiple independent piezoelectric micropumps can be obtained synchronously by bonding the single-layer array structures of different devices and then slicing them as a whole. Such a preparation process can prepare the piezoelectric micropump into plates, effectively improving the production efficiency of the piezoelectric micropump and making the piezoelectric micropump have higher stability and consistency.

[0028] 2. The present invention sets two separation grooves intersecting with the segmentation path in the hollow structure of the electrode layer processed by the array; before dicing and segmentation, the entity of the entire electrode array structure is connected as a whole, so that the connection between the electrode array structure and other single-layer array structures is very convenient; and after dicing and segmentation, the entity part of each electrode layer unit is divided into two independent conductive parts due to the separation groove; based on this, the present invention realizes the same-layer integration of two conductive parts while avoiding complex positioning and assembly, further reducing the complexity and cost of the production process of the piezoelectric micropump.

[0029] 3. The present invention considers setting multiple rectangles as conductive areas in the electrode array structure, and applying conductive glue on the conductive areas, and applying insulating glue on the remaining areas; thereby completing the bonding of the electrode array structure, and making the two conductive parts of the same layer conduct differently, so that the device layers such as the diaphragm layer are used to electrically connect the actuator device, and avoiding the short circuit between the two conductive parts due to the device layers such as the diaphragm layer. At the same time, the conductive area is set as a rectangle, so that the conductive glue and the insulating glue only need to be applied along a straight line while realizing the function, which improves the convenience of glue application.

[0030] 4. The present invention uses a spring as a conductive structure between the driving layer and the electrode layer, which ensures that the conductive path of the piezoelectric micropump does not fail under high-frequency vibration at the three-dimensional electrical level of the micropump, and at the same time realizes elastic contact at the mechanical level to reduce the kinetic energy loss of vibration.

[0031] 5. The preparation method of the piezoelectric micropump used in the present invention is based on the non-silicon MEMS process of metal materials and composite materials, combining the advantages of laser precision processing and some semiconductor processing technologies, achieving flexible, high-yield, and low-cost mass production, and the micropump has high reliability and strong anti-drop ability. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Schematic diagram of the exploded structure of the valveless piezoelectric micropump prepared in Example 1 of the present invention; Figure 2 This is a schematic diagram of the preparation process of Example 1 of the present invention; Figure 3 is a schematic diagram of the combination of the single-layer array structures prepared in Example 1 of the present invention; Figure 4 is a schematic top view of the electrode array structure prepared in Example 1 of the present invention; Figure 5 Schematic diagram of the exploded structure of the piezoelectric micropump prepared in Example 2 of the present invention; Figure 6 Schematic diagram of the installation of the conductive structure in the piezoelectric micropump prepared in Example 2 of the present invention; Figure 7 This is a schematic diagram of the preparation process of Example 2 of the present invention; Figure 8 is a schematic diagram of the top surface of the array structure for preparing the diaphragm layer in Example 2 of the present invention; Fig. 9 is a schematic diagram of the bottom surface of the array structure for preparing the diaphragm layer in Example 2 of the present invention; Fig.10 is a schematic diagram of the top surface of the array structure for preparing the resonance layer in Example 2 of the present invention; Fig.11 It is a schematic diagram of the preparation process of Example 3 of the present invention.

[0033] Figure numerals: 100, flow channel layer; 200, resonance layer; 300, first connection layer; 400, diaphragm layer; 401, actuator element; 500, second connection layer; 600, electrode layer; 700, end cover layer; 800, valve body layer; 801, conduction hole; 802, conduction structure; 900, drive layer; 901, drive output contact; 1, flow channel array structure; 2, resonance array structure; 3, first connection array structure; 4, diaphragm array structure; 5, second connection array structure; 6, electrode array structure; 6-1, center through groove; 6-2, air inlet channel; 6-3, first dividing groove; 6-4, second dividing groove; 6-5, terminal; 6-6, first conductive part; 6-7, second conductive part; 6-8, conductive area. DETAILED DESCRIPTION

[0034] The present invention will be further described below in conjunction with the accompanying drawings.

[0035] Example 1

[0036] The invention discloses a method for preparing a piezoelectric micro pump, which is used for preparing a special valveless piezoelectric micro pump.

[0037] like Figure 1 As shown, the valveless piezoelectric micropump includes a pump body, which includes a plurality of device layers, namely, a flow channel layer 100, a resonance layer 200, a first connection layer 300, a diaphragm layer 400, a second connection layer 500 and an electrode layer 600 stacked from top to bottom.

[0038] A pump flow chamber is formed between the flow channel layer 100 and the resonance layer 200. A resonance cavity is formed between the diaphragm layer 400 and the resonance layer 200; a first flow hole is provided at the center of the resonance region of the resonance layer 200, and four second flow holes surrounding the first flow hole are provided around the periphery. The first flow hole and the second flow hole are used for fluid exchange between the pump flow chamber and the resonance cavity. An actuator 401 is fixed to the side of the diaphragm layer 400 away from the resonance layer 200; the actuator 401 vibrates by piezoelectric effect.

[0039] In this embodiment, the piezoelectric micropump is in the shape of a square as a whole; in some other embodiments, the piezoelectric micropump may also be in the shape of a circle, an ellipse, or a rectangle other than a square.

[0040] The center of the flow channel layer 100 is provided with an outlet hole connected to the pump flow chamber; all device layers except the flow channel layer 100 are provided with through holes at the four corners; the through holes at the four corners of each device layer are aligned with each other to form an air inlet channel 6-2. The flow channel layer 100 is provided with a flow channel structure that connects the air inlet channel 6-2 with the pump flow chamber.

[0041] In this embodiment, the outer edge contour shapes and sizes of the flow channel layer 100, the resonance layer 200, the first connection layer 300, the diaphragm layer 400, the second connection layer 500 and the electrode layer 600 are the same, which can facilitate the overall preparation and dicing of the piezoelectric micropump when preparing the piezoelectric micropump. The actuator 401 is a disc.

[0042] The fluid transmission principle of this piezoelectric micropump is: The transmission principle is: when the actuator 401 drives the central part of the diaphragm layer 400 to vibrate and deform upward, the surrounding part of the diaphragm layer 400 bends downward; at the same time, the central part of the resonance layer 200 bends and deforms downward, thereby increasing the volume of the central area of ​​the resonance cavity to form a low-pressure area; the downward-bending part around the diaphragm layer 400 and the upward-bending and deformed part around the resonance layer 200 are close to each other, thereby reducing the volume of the edge area of ​​the resonance cavity to form a high-pressure area. Since the flow resistance of the surrounding high-pressure area is greater than that of the central part, during the vibration stage, the airflow is sucked into the resonance cavity from the first through-flow hole in the center of the resonance layer 200, and the fluid in the high-pressure area is squeezed out from the second through-flow holes around the resonance layer 200 and discharged into the flow channel cavity.

[0043] Similarly, when the actuator 401 drives the central part of the diaphragm layer 400 to vibrate and deform downward, the airflow is squeezed into the edge area of ​​the resonance cavity from the second flow holes around the resonance layer 200; the fluid in the central area of ​​the resonance cavity flows out from the first flow hole in the center of the resonance layer 200; due to the high-speed vibration of the actuator 401 and the resonance layer 200, the fluid ejected from the resonance layer 200 can be regarded as a continuous state. When the continuous fluid enters the resonance cavity, the air pressure in the area where the gas flows at high speed is lower; the edge of the pump flow chamber on the flow channel layer 100 is connected to the atmospheric environment through the air inlet channel 6-2, and the cold airflow passes through the entire pump body into the flow channel cavity, mixes with the high-speed jet to form turbulence, and finally ejects from the air outlet hole in the center of the flow channel layer 100.

[0044] The preparation method provided in this embodiment performs array processing on each device layer on the same sheet material, and bonds the array structures corresponding to the obtained different device layers as a whole at one time. This method can prepare piezoelectric micropumps faster and thus has a higher output. Therefore, this embodiment is more suitable for preparation processes that require high output.

[0045] like Figure 2 As shown, the preparation method of the piezoelectric micropump comprises the following steps: S1: Cleaning the initial sheet material.

[0046] Each sheet material corresponds to a device layer. The sheet material includes raw materials such as stainless steel and carbon fiber or products that have undergone primary chemical etching processing. Except for the actuator 401, the materials used in other pump body layers are whole pieces of stainless steel sheets, carbon fiber sheets, or other products that have undergone primary chemical etching processing. In this embodiment, the initial sheet material is a carbon fiber sheet, and in some other embodiments, a stainless steel sheet may also be used.

[0047] S2: Flattening the sheet material.

[0048] In this embodiment, the initial material used is a carbon fiber sheet, and in some other embodiments, a stainless steel sheet can also be used; first, a single carbon fiber sheet is flattened; in this embodiment, the flattening operation is achieved by a temporary bonding method; the temporary bonding method is as follows: first, the carbon fiber sheet is pretreated, and then a layer of glue is applied to the carbon fiber sheet, and then the carbon fiber sheet is aligned and pressurized to solidify the material onto the glass substrate, and a temporary bonding state is achieved. In some other embodiments, other feasible connection methods can be used for flattening.

[0049] S3: Arraying the piezoelectric micropump device layer structure or body structure of the sheet material obtained in step S2 to form a full-plate array pump single-layer structure with a complete structure.

[0050] In this embodiment, the sheet material is rectangular, and laser processing is used to form a surface structure or a body structure to obtain a single-layer array structure corresponding to each device layer; in some other embodiments, other processing techniques including etching and photolithography can also be used; each single-layer array structure of the whole-plate array pump is pre-drawn, and the flattened carbon fiber sheet is placed on the table of the laser processing machine and automatically processed according to the pre-drawn structure; in this embodiment, each single-layer array structure includes a plurality of identical device units arranged in a matrix; each device unit corresponds to a device layer of a piezoelectric micropump; thereby, six different single-layer array structures corresponding to six types of device layers are formed, namely, a flow channel array structure 1, a resonance array structure 2, a first connection array structure 3, a diaphragm array structure 4, an insulation array structure, a second connection array structure 5 and an electrode array structure 6.

[0051] In this embodiment, the shape of each single-layer array structure after processing is as follows Figure 3 As shown, it can be seen that there are 16 device units on each single-layer array structure; after each single-layer structure of the entire array pump is fully processed, the steps are completed, and six carbon fiber sheets are obtained, each including 16 flow channel layers 100, a resonance layer 200, a first connection layer 300, a diaphragm layer 400, a second connection layer 500 and an electrode layer 600. In some other embodiments, other feasible device unit quantities and arrangements can be set on each single-layer array structure.

[0052] In this embodiment, the electrode array structure 6 is specially designed to automatically form two independent conductive parts by means of a splitting action after bonding. The processing process of the electrode array structure 6 is as follows: like Figure 4 As shown, multiple electrode layer hollow structures arranged in n×n order are processed on the sheet material. Each electrode layer hollow structure is located in the sheet material along the target segmentation path (corresponding to Figure 4 A segmentation area (i.e. Figure 4 The electrode layer hollow structure includes a central through groove 6-1, an air inlet channel 6-2, a first separation groove 6-3 and a second separation groove 6-4. Four air inlet channels 6-2 surround the central through groove 6-1. One end of the first separation groove 6-3 and the second separation groove 6-4 are connected to different positions of the central through groove 6-1. The other ends of the first separation groove 6-3 and the second separation groove 6-4 extend to the boundary of the segmentation area.

[0053] The first dividing groove 6-3 and the second dividing groove 6-4 divide the entity structure in a divided area into a first conductive part 6-6 and a second conductive part 6-7. Specifically, the first conductive part 6-6 is formed between the adjacent side areas of the first dividing groove 6-3 and the second dividing groove 6-4; the opposite side areas of the first dividing groove 6-3 and the second dividing groove 6-4 form the entity second conductive part 6-7. A terminal 6-5 is reserved in the central through groove 6-1. One end of the terminal 6-5 is connected to the first conductive part 6-6; the other end of the terminal 6-5 is suspended and used to connect to the node position of the actuator 401.

[0054] Before the electrode array structure 6 is segmented, the first conductive portion 6-6 and the second conductive portion 6-7 in the same segmented area are fixedly connected together through the physical structure on the adjacent segmented area, so that the first conductive portion 6-6 and the second conductive portion 6-7 maintain a fixed relative position. When the electrode array structure 6 is segmented, the first segmentation groove 6-3 and the second segmentation groove 6-4 intersect with the segmentation path, so that the first conductive part 6-6 and the second conductive part 6-7 are segmented into two completely independent parts. However, since the segmentation process is performed after each single-layer array structure is bonded, the first conductive part 6-6 and the second conductive part 6-7 are independent of each other but are kept in a fixed relative position by the remaining single-layer array structures. In this way, two conductive parts leading to the two poles of the actuator element 401 can be automatically formed on the electrode array structure 6 processed at one time.

[0055] S4: Apply a bonding dielectric layer to each single-layer array structure.

[0056] In this embodiment, multiple actuator elements 401 are respectively pasted on each diaphragm layer 400 unit of the diaphragm array structure 4; and a bonding medium is coated on the side surfaces of all single-layer array structures; in this embodiment, glue bonding is used for bonding, so the applied bonding medium is glue, and the machine used is a screen printer or a glue dispenser; in other embodiments, bonding methods such as anodic bonding, eutectic bonding or resin bonding may also be used, so the applied bonding medium may also be glass or metal.

[0057] The method of applying glue on the electrode array structure 6 is different from the method of applying glue on other single-layer array structures; specifically, as follows: only one type of colloid is applied on the outer frame area of ​​the flow channel array structure 1, the resonance array structure 2, the first connection array structure 3, the diaphragm array structure 4, the insulating array structure and the second connection array structure 5. Two different colloids are applied at different positions on the electrode array structure 6. Among them, each row of the electrode layer hollow structure of the electrode array structure 6 corresponds to a rectangular (straight strip) conductive area 6-8. The conductive area 6-8 only intersects with the second conductive part 6-7, and is staggered with the first conductive part 6-6 and the terminal 6-5. When applying glue, conductive glue is applied to the conductive area 6-8 of the electrode array structure 6, and insulating glue is applied to other areas of the electrode array structure 6.

[0058] S5: Precisely align the seven single-layer array structures.

[0059] In this embodiment, a CCD vision alignment system is used for automatic alignment to completely align the flow channel array structure 1, the resonance array structure 2, the first connection array structure 3, the diaphragm array structure 4 and the second connection array structure 5, thereby completing the process of step S5.

[0060] S6: Bonding the six single-layer array structures of the full-page array pump to form a full-page complete array pump structure.

[0061] The six single-layer array structures of the entire array pump are bonded. In this embodiment, the bonding is performed by adhesive bonding; the adhesive bonding can specifically be performed by resin bonding. In other embodiments, bonding methods such as anodic bonding and eutectic bonding can also be used. In this embodiment, the adhesive bonding is completed by heating, pressurizing and vacuuming, and after step S6, the entire piezoelectric micropump array can be obtained.

[0062] S7: Complete three-dimensional electrical conduction for each layer structure and lead the pump body terminal to the required position.

[0063] The electrode array structure of each layer is electrically connected in three dimensions, and the pump body terminal is led out to the desired position. In this embodiment, the three-dimensional electrical connection between each layer is achieved by preparing through-hole and / or blind-hole structures of each layer, and forming a flow channel layer and / or an electrode layer in the hole (methods include but are not limited to metallization in the hole, silver paste injection, and conductor insertion, etc.).

[0064] S8: Slice the piezoelectric micropump array to obtain a number of single piezoelectric micropumps.

[0065] The entire array pump structure is sliced ​​to obtain a number of single piezoelectric micro pumps. During the slicing process, the connection between the first conductive part and the second conductive part of each electrode layer unit in the electrode array structure is cut off, thereby automatically leading out the two electrodes.

[0066] In this embodiment, a dicing machine is used for dicing with a knife wheel. In some other embodiments, laser dicing can also be used to dice 16 single piezoelectric micropumps according to the size of a single piezoelectric micropump. The preparation process is completed to obtain 16 piezoelectric micropumps. Generally speaking, after the preparation is completed, the piezoelectric micropump is calibrated and tested.

[0067] Example 2 A piezoelectric micropump preparation method, used for preparing a piezoelectric micropump; like Figure 5 As shown, the piezoelectric micro pump includes a stacked pump body, a valve body layer 800 and a driving layer 900; the pump body includes an end cover layer 700, a flow channel layer 100, a resonance layer 200, a diaphragm layer 400 and an electrode layer 600 stacked from top to bottom. An actuator 401 is fixed to the side of the diaphragm layer 400 away from the resonance layer 200; a reinforcement layer is provided between the actuator 401 and the diaphragm layer 400. The actuator 401 vibrates through the piezoelectric effect, driving the reinforcement layer and the diaphragm layer 400 to vibrate together.

[0068] The piezoelectric micropump prepared in this embodiment integrates the driving part, namely the driving layer 900, into the piezoelectric micropump. Fig. 9 is an isometric diagram of a piezoelectric micropump of the present invention, which specifically shows the shape and structure of the piezoelectric micropump in this embodiment, such as Fig. 9 As shown; in this embodiment, the piezoelectric micropump is rectangular as a whole, and in this embodiment it is a special square, and in other usage scenarios it can also be circular, and in this embodiment; the piezoelectric micropump has no redundant external circuit interface, and has a strong integrity. The shape, length and width of each layer of the piezoelectric micropump as a whole are the same, and when preparing the piezoelectric micropump, the overall preparation and slicing of the piezoelectric micropump can be facilitated. The size of the piezoelectric micropump in this embodiment is only 15*15*2.43mm. In other implementation cases, the piezoelectric micropump can also be circular.

[0069] In this embodiment, the end cover layer 700, the flow channel layer 100, the resonance layer 200, the diaphragm layer 400, the electrode layer 600, the valve body layer 800 and the driving layer 900 have the same outer shape and size, and are all special squares with the same side length.

[0070] In this embodiment, Figure 5 As shown, the end cover layer 700 is a square sheet structure, and four air intake holes are distributed on the surface of the end cover layer 700; the four air intake holes are distributed at the four corners of the edge of the end cover layer 700; the flow channel layer 100 is also a square sheet structure, and an air intake chamber connected to the air intake holes is provided in the flow channel layer 100. The air intake chamber includes a large circular hole located in the center and rectangular flow channel grooves distributed around; the resonance layer 200 is also a square sheet structure, and the resonance holes corresponding to the diaphragm layer 400 and the flow channel layer 100 are distributed on the surface of the resonance layer 200.

[0071] In this embodiment, the reinforcement layer and the actuator element 401 have the same shape, both of which are circular; there is a circular vibrator in the middle of the diaphragm layer 400 with the same shape as the actuator element 401 and the reinforcement layer; the circular vibrator in the middle of the diaphragm layer 400 is connected to the surrounding support frames through an elastic structure; thereby, the actuator element 401 can drive the circular vibrator in the middle of the diaphragm layer 400 to vibrate reciprocatingly.

[0072] In this embodiment, the electrode layer 600 is also a square sheet structure, and the specific structure is consistent with the electrode layer 600 in Embodiment 1. The natural insulation between the first conductive part 6-6 and the second conductive part 6-7 is achieved by the separation groove and the cutting after bonding. The first conductive part 6-6 is electrically connected to one side of the actuator element 401 through the terminal 6-5; the second conductive part 6-7 is electrically connected to the other side of the actuator element 401 through the conductive glue and the diaphragm layer 400.

[0073] like Figure 5 and Figure 6 As shown, the driving layer 900 is integrated with a driving circuit and an algorithm circuit; the driving layer 900 is provided with a driving output contact 901, and the valve body layer 800 is provided with a conducting hole 801 at a position corresponding to the driving output contact 901 of the driving layer 900; two driving output contacts 901 are symmetrically distributed on one side of the driving layer 900, and the conducting holes 801 correspond to the driving output contacts 901, and two conducting holes 801 are also symmetrically distributed on one side of the valve body layer 800, one of the symmetrically distributed conducting holes 801 is aligned with the first conductive part 6-6, and the other is aligned with the second conductive part 6-7; and conducting structures 802 are provided in both conducting holes 801. The two ends of the conducting structure 802 respectively abut against the conductive part of the electrode layer 600 and the driving output contact 901 on the driving layer 900, so as to realize the conduction between the driving output contact 901 and the conductive part, thereby realizing the driving output contact 901 driving the actuator 401.

[0074] like Figure 6 As shown, the conductive structure 802 passes through the conductive hole 801. In this embodiment, the conductive structure 802 is a metal spring, which has good conductive properties. The spring is used because it has good shock-absorbing properties and can still maintain good strength under the high-frequency vibration of the piezoelectric micropump, which can ensure both conductive properties and strength.

[0075] The working principle of the piezoelectric micropump prepared in this embodiment is as follows: the driving layer 900 controls the operation of the piezoelectric micropump, and connects the conductive hole 801 in the valve body layer 800 through the driving output contact 901, the bottom of the conductive hole 801 is connected to the driving output contact 901 of the driving layer 900, the top of the conductive hole 801 is connected to the electrode layer 600, and there is a spring conductive structure 802 in the conductive hole 801, the top of the electrode layer 600 is connected to the diaphragm layer 400, the bottom of the electrode layer 600 is connected to the valve body layer 800, and there is a protruding cantilever on the inner side of the electrode layer 600, and the cantilever is connected to the actuator element 401, thereby driving the actuator element 401.

[0076] The fluid transmission principle of a piezoelectric micropump in this embodiment is as follows: when the actuator 401 vibrates upward, the diaphragm layer 400 bends downward, the convex part of the reinforcement layer is close to the resonance layer 200 to form a high-pressure area, and the diaphragm layer 400 is away from the resonance layer 200 to form a low-pressure area, and the fluid flows from the high-pressure area to the low-pressure area. Since the center is the high-pressure area with the largest flow resistance, and the surrounding is the low-pressure area with the smallest flow resistance, the flow rate flowing out through the high-pressure area to the outside is much smaller than the flow rate flowing into the pump cavity through the surrounding areas, thereby achieving the outflow of the fluid.

[0077] When the actuator 401 vibrates downward, the diaphragm layer 400 bends upward, and the diaphragm layer 400 is close to the resonance layer 200 to form a high-pressure area, while the reinforcement layer is far away from the resonance layer 200 to form a low-pressure area. The flow resistance in the high-pressure area is large, and the flow resistance in the low-pressure area is small, and the fluid flows in at a high speed through the fluid channel.

[0078] The piezoelectric micropump in this embodiment connects the driving layer 900 and the electrode layer 600 through the three-dimensional conductive structure 802 to control the fluid delivery of the piezoelectric micropump, and guides the terminals of the driving layer 900 and the electrode layer 600 to the appropriate positions. This not only makes the overall structure of the piezoelectric micropump simpler, thereby reducing the volume and area of ​​the piezoelectric micropump, but also makes the piezoelectric micropump an integral structure, which can facilitate the overall preparation and slicing of the piezoelectric micropump.

[0079] like Figure 7 As shown, a method for preparing a piezoelectric micropump provided in this embodiment includes the following steps: S1: Cleaning the initial sheet material.

[0080] Each sheet material corresponds to a device layer. The sheet material includes raw materials such as stainless steel and carbon fiber or products that have undergone primary chemical etching processing. Except for the actuator 401, the materials used in other pump body layers are whole stainless steel sheets, carbon fiber sheets, or products that have undergone primary chemical etching processing. In this embodiment, the initial sheet material is a stainless steel sheet, and in some other embodiments, a carbon fiber sheet may also be used.

[0081] S2: flattening the material; In this embodiment, the initial material is a stainless steel sheet. In some other embodiments, a carbon fiber sheet can also be used. First, a single stainless steel sheet is flattened. In this embodiment, the flattening is performed using a temporary bonding method. The temporary bonding steps include: first, the stainless steel sheet and the glass substrate are cleaned and pretreated, and then a layer of temporary bonding material is coated on the stainless steel sheet and / or the glass substrate, and then the two are aligned and a certain pressure and temperature are applied to solidify the material to form a stable connection; grinding, cutting, testing and other process treatments are performed in the bonded state; finally, the stainless steel sheet is separated from the glass substrate by heating, solvent dissolution or UV irradiation, and cleaned and inspected. In this embodiment, the stainless steel sheet is first pretreated, and then a layer of glue is coated on the stainless steel sheet, and then the stainless steel sheet is aligned and pressurized to solidify the material onto the glass substrate, and a temporary bonding state is achieved.

[0082] S3: forming each arrayed surface structure or body structure of the pump to form a single-layer array structure with a complete structure; In this embodiment, the sheet material is circular and laser processing is used. In some other embodiments, etching or photolithography can also be used. The structure of each layer is pre-drawn. The flattened sheet material is placed on the table of the laser processing machine and automatically processed according to the pre-set structure. Figure 8 This is a top-level diagram of a wafer of a method for preparing a piezoelectric micropump of the present invention. Fig. 9 This is a bottom layer diagram of a wafer of a method for preparing a piezoelectric micro pump of the present invention. Figure 8 and Fig. 9 The structure of the wafer of the diaphragm layer 400 in this embodiment is shown in FIG. 52. The flattened stainless steel sheet is placed on the table of the laser processing machine, and then the laser processing machine is used to process the pre-set structure. In this embodiment, since both sides of the diaphragm layer 400 need to be processed, the following structures are first processed: Figure 8 The top surface structure of the diaphragm layer 400 is shown in FIG. 1 . At this time, the bonding medium (i.e., glue) of the processed diaphragm layer 400 is dissolved, and the diaphragm layer 400 is turned over and temporarily bonded again to produce a diaphragm layer 400 as shown in FIG. Figure 7 The bottom surface structure of the diaphragm layer 400 shown in the figure is the laser processing of the diaphragm layer 400 is completed.

[0083] In this embodiment, a single-layer array structure is processed for each layer. Fig.10It is a diagram of another wafer of the invention of a method for preparing a piezoelectric micropump, that is, a diagram of the wafer of the diaphragm layer 400 in this embodiment. In this embodiment, except for the diaphragm layer 400, the remaining layers only need to be laser processed once. Another flattened stainless steel sheet is placed on the machine table of the laser processing machine to process the structure of the diaphragm layer 400. The processing process of the end cover layer 700 and the flow channel layer 100 is the same as that of the diaphragm layer 400. The processing process of the electrode layer 600 is the same as that of the electrode layer 600 in Example 1. After all the processing, use glue to stick the reinforcement layer and the actuator element 401 to the bottom of the diaphragm layer 400. The reinforcement layer and the actuator element 401 are pre-sticked together, that is, the processing of step 302 is completed; at this time, five single-layer array structures including 52 end cover layers 700, 52 flow channel layers 100, 52 diaphragm layers 400, 52 resonance layers 200 and 52 electrode layers 600 can be obtained.

[0084] S4: applying a bonding medium layer to the single-layer array structure of the full-page array pump; In this embodiment, the bonding is performed by glue bonding, so the bonding medium applied is glue, and the machine used is a screen printer or a glue dispenser. In other embodiments, bonding methods such as anodic bonding, eutectic bonding or resin bonding can also be used, so the bonding medium applied can also be glass or metal. The specific process is to apply glue on the flow channel layer 100, the flow channel layer 100, the diaphragm layer 400, the resonance layer 200 and the electrode layer 600 of the pump body. Specifically, for the flow channel layer 100 and the flow channel layer 100, the hollow parts, namely the heat dissipation holes and the flow channel holes, are not filled with glue, and the rest of the parts are filled with glue. For the resonance layer 200, the resonance holes and the positions corresponding to the flow channel holes are not filled with glue, and the rest of the parts are filled with glue. For the diaphragm layer 400 and the electrode layer 600, only one circle of glue needs to be filled on the outside, so that the process of step S303 is completed.

[0085] The process of applying the conductive glue and the insulating glue to the electrode layer 600 in this embodiment is the same as step S4 in embodiment 1.

[0086] S5: Accurately align each layer of the entire array pump structure; In this embodiment, a CCD vision alignment system is used for automatic alignment to completely align the five single-layer array structures of the entire array pump body.

[0087] S6: bonding each layer structure of the full-page array pump to form a full-page array pump body structure; In this embodiment, adhesive bonding is used for bonding. In other embodiments, anodic bonding, eutectic bonding, resin bonding, and other bonding methods may also be used. In this embodiment, adhesive bonding is completed by heating, pressurizing, and vacuuming. At this time, a wafer including 52 pump bodies can be obtained.

[0088] S7: Slice the entire array pump body structure to obtain a number of single pump bodies.

[0089] In this embodiment, a dicing machine is used for dicing, and the single pump body is sliced ​​into 52 individual pump bodies according to the size of the single pump body. At this time, an intermediate inspection can be carried out, and the performance of each pump body obtained by dicing is tested separately to screen out the pump bodies with abnormal performance. Since the failure rate of the pump body is higher in comparison, this step can effectively improve the yield of the overall pump preparation.

[0090] S8: Forming each arrayed surface structure or body structure of the valve body layer 800.

[0091] In this embodiment, this step is similar to step S1 and step S2. First, the initial material is flattened. The initial material of the valve body is also a stainless steel sheet. In some other embodiments, a carbon fiber sheet can also be used. The flattening method uses a temporary bonding method. In this embodiment, the stainless steel sheet is first pre-treated, and then a layer of glue is coated on the stainless steel sheet. Then the stainless steel sheet is aligned and pressurized to solidify the material onto the glass substrate, and a temporary bonding state is achieved. Then the structure of each layer of the valve body is laser processed (the structure of the valve body is not shown in the figure). The structure of each layer is pre-drawn. The flattened stainless steel sheet is placed on the machine table of the laser processing machine and automatically processed according to the pre-set structure. After all the processing, the drive layer 900 is connected to the valve body. The drive layer 900 is a pre-processed PCB board.

[0092] S9: Apply bonding medium to the array-arranged valve body array structure and drive array structure and perform bonding.

[0093] In this embodiment, this step is similar to steps S4, S5 and S6. In this embodiment, the bonding is performed by glue bonding, so the bonding medium applied is glue. In other embodiments, bonding methods such as anodic bonding, eutectic bonding or resin bonding can also be used, so the bonding medium applied can also be glass or metal. Glue is applied to both the valve body and the drive layer 900. Specifically, only a layer of glue needs to be applied to the outer ring frame of the valve body and the drive layer 900, and then the CCD visual alignment system is used for automatic alignment to completely align the valve body and the drive layer 900, and finally the valve body and the drive layer 900 are bonded. In this embodiment, the bonding is performed by glue bonding. In other embodiments, bonding methods such as anodic bonding, eutectic bonding or resin bonding can also be used. In this embodiment, the glue bonding between the drive layer 900 and the valve body is completed by heating, pressurizing and vacuuming.

[0094] S10: Paste the single pump body obtained in step S8 onto the full-plate valve body obtained in step S9 to obtain a full-plate complete array pump structure.

[0095] In this embodiment, a chip mounter or wafer machine is used to paste the pump bodies that have passed the inspection in step S7 onto the entire valve body. The pasting process also uses glue. After this step, the entire piezoelectric micropump wafer array can be obtained.

[0096] S11: Complete three-dimensional electrical conduction for each layer structure and lead the pump body terminal to the required position.

[0097] The two conductive parts on the electrode layer 600 are electrically connected to the two driving output contacts 901 in the driving layer 900 through the two conducting structures 802 in the valve body layer 800 .

[0098] S12, slicing the entire complete array pump structure to obtain a number of single piezoelectric micro pumps.

[0099] In the present embodiment, a dicing machine is used to perform knife wheel dicing. In some other embodiments, laser dicing can also be used to dicing into 52 single complete piezoelectric micropumps according to the size of a single piezoelectric micropump. The preparation process is completed to obtain 52 piezoelectric micropumps. When preparing again, the same steps can be adopted to achieve batch preparation of piezoelectric micropumps. When dicing is a circular pump, it is only necessary to make a bracket around the circular pump, and then the bracket can be cut open. Generally speaking, after the preparation is completed, the piezoelectric micropump must also be calibrated and tested.

[0100] In this embodiment, the preparation method is for an integrated piezoelectric micropump with a valve, and an intermediate inspection process is added during the preparation of the pump body. Since the valve body and the drive layer 900 are of high value and high yield, the pump body is inspected, which effectively increases the yield of the piezoelectric micropump preparation.

[0101] Example 3

[0102] A method for preparing a piezoelectric micro pump is different from Example 1 in that the pump body is no longer sliced ​​and inspected in advance, but the entire pump body, valve body layer 800 and drive layer 900 are directly bonded to improve production efficiency.

[0103] Fig.11 is a flow chart of this embodiment, which specifically shows the third embodiment process of the specific preparation method of the piezoelectric micropump in this embodiment.

[0104] A method for preparing a piezoelectric micropump provided in this embodiment comprises the following steps: Step S1: Cleaning the initial material.

[0105] The initial material includes raw materials such as stainless steel and carbon fiber or products that have undergone primary chemical etching processing. Except for the actuating element 401, the materials used for other pump body layers are whole pieces of stainless steel sheets, carbon fiber sheets or products that have undergone primary chemical etching processing. In this embodiment, the initial material is a stainless steel sheet, and in some other embodiments, a carbon fiber sheet may also be used.

[0106] Step S2: flattening the material.

[0107] In this embodiment, the initial material used is a stainless steel sheet. In some other embodiments, a carbon fiber sheet can also be used. First, a single piece of stainless steel sheet is flattened using a temporary bonding method. In this embodiment, the stainless steel sheet is first pretreated, and then a layer of glue is coated on the stainless steel sheet. The stainless steel sheet is then aligned and pressurized to solidify the material onto the glass substrate, thereby achieving a temporary bonding state.

[0108] Step S3 , forming each arrayed surface structure or body structure of the pump body and valve body layer 800 .

[0109] In this embodiment, a laser processing method is adopted. In some other embodiments, etching or photolithography processes can also be used. The structure of each layer is pre-drawn, and the flattened stainless steel sheet is placed on the table of the laser processing machine and automatically processed according to the pre-set structure. After each layer of the valve body is fully processed, the step is completed.

[0110] In addition, a drive layer array structure matching the pump body and valve body layer 800 is processed on a whole circuit substrate; the array structure corresponding to the valve body layer 800 and the array structure corresponding to the drive layer are bonded (eg, glued) together at matching positions.

[0111] In some other embodiments, each driving layer can also be prepared separately and arranged one by one or in an array and then bonded to the corresponding array structure of the valve body layer 800 at the same time.

[0112] Step S4, applying bonding medium to each layer structure of the entire array pump body and valve body layer 800.

[0113] In this embodiment, adhesive bonding is used for bonding, so the bonding medium applied is adhesive, and the machine used is a screen printer or a glue dispenser. In other embodiments, bonding methods such as anodic bonding, eutectic bonding or resin bonding can also be used, so the bonding medium applied can also be glass or metal. The specific process is to fill the outer circle of the pump body and the valve body and the designated position inside with adhesive.

[0114] Step S5, accurately aligning each layer structure of the pump body and valve body layer 800 of the entire array.

[0115] In this embodiment, a CCD vision alignment system is used for automatic alignment to completely align each layer of the pump body and valve body layer 800 .

[0116] Step S6, bonding each layer structure of the entire array of pumps and valves.

[0117] In this embodiment, adhesive bonding is used for bonding. In other embodiments, anodic bonding, eutectic bonding, resin bonding, etc. may also be used. In this embodiment, adhesive bonding is performed by heating, pressurizing, and vacuuming.

[0118] Step S7: Complete three-dimensional electrical conduction for each layer structure and lead the pump body terminal to the required position.

[0119] In this embodiment, three-dimensional electrical conduction between layers is achieved by preparing through-hole and / or blind-hole structures in each layer and forming a flow channel layer 100 and / or an electrode layer 600 in the hole (methods include but are not limited to metallization in the hole, silver paste injection, and conductor insertion, etc.).

[0120] Step S8, dicing the entire array of piezoelectric micropump structures to obtain a number of single piezoelectric micropumps.

[0121] In this embodiment, a dicing machine is used for dicing with a knife wheel. In some other embodiments, laser dicing can also be used to dice the single piezoelectric micropump according to the size of the single piezoelectric micropump. The preparation process is completed to obtain a plurality of piezoelectric micropumps. Generally speaking, after the preparation is completed, the piezoelectric micropump is calibrated and tested.

[0122] This embodiment is substantially the same as Embodiment 1, but this embodiment is applicable to a piezoelectric micropump having a pump body and a valve body structure. The pump body and the valve body are directly bonded at one time. This method allows the preparation of the piezoelectric micropump to be faster and thus have a higher yield. However, compared to Embodiment 2, this embodiment does not include the intermediate inspection process in the steps of Embodiment 2, and the pump cannot be inspected, which results in a decrease in yield and, in turn, an increase in cost. Therefore, this embodiment is more suitable for the preparation process of a valved piezoelectric micropump that requires a high yield.

Claims

1. A method for preparing a piezoelectric micropump based on array processing and segmentation, characterized in that: The following steps are involved: The sheet material is processed to form a plurality of identical device units; the plurality of sheet materials respectively form a single-layer array structure corresponding to different device layers of the piezoelectric micropump body; Aligning and bonding the single-layer array structures corresponding to different device layers of the piezoelectric micropump body to form a full-page array pump body structure including multiple pump bodies; The entire array pump body structure is sliced ​​to separate the independent pump bodies.

2. A method for preparing a piezoelectric micropump based on array processing and segmentation according to claim 1, characterized in that: On a sheet material, a dicing segmentation path encloses a plurality of segmentation areas; a single device layer structure is processed on a single segmentation area; the device layer includes an electrode layer; the process of processing a single-layer array structure corresponding to the electrode layer is as follows: a hollow electrode layer structure is processed in the segmentation area; the hollow electrode layer structure includes a central through groove (6-1), a first separation groove (6-3) and a second separation groove (6-4); one end of the first separation groove (6-3) and the second separation groove (6-4) are respectively connected to different positions of the central through groove (6-1); the first separation groove (6-3) and the second separation groove (6-4) both intersect with the dicing segmentation path; the first separation groove (6-3) and the second separation groove (6-4) divide the entity structure in the segmentation area into two conductive parts; the two conductive parts are a first conductive part (6-6) and a second conductive part (6-7); and a connection terminal (6-5) extends from the first conductive part (6-6).

3. A method for preparing a piezoelectric micropump based on array processing and segmentation according to claim 2, characterized in that: A conductive region (6-8) is provided on the single-layer array structure corresponding to the electrode layer; the conductive region (6-8) passes through the second conductive portion of the hollow structure of all electrode layers and is staggered with the first conductive portion of the hollow structure of all electrode layers; before bonding, a conductive glue is applied to the conductive region (6-8), and an insulating glue is applied to the region outside the conductive region (6-8).

4. A method for preparing a piezoelectric micropump based on array processing and segmentation according to claim 3, characterized in that: The device units on the single-layer array structure are arranged in a matrix shape; the conductive regions (6-8) include a plurality of rectangular regions corresponding to the number of columns of the electrode layer hollow structures; and each rectangular region corresponds to a row of the electrode layer hollow structures.

5. The method for preparing a piezoelectric micropump based on array processing and segmentation according to claim 3, characterized in that: In addition to the piezoelectric micro pump body, a single-layer array structure corresponding to the valve body layer and the driving layer is also produced; the driving layer is provided with a circuit structure of a driving actuator; the single-layer array structure corresponding to the valve body layer and the driving layer is aligned and bonded; Each pump body separated by dicing is inspected; the pump bodies that pass the inspection are bonded one by one to different valve body layer units.

6. The method for preparing a piezoelectric micropump based on array processing and segmentation according to claim 3, characterized in that: In addition to the piezoelectric micropump body, a single-layer array structure corresponding to the valve body layer and the drive layer is also produced; the drive layer is provided with a circuit structure of a drive actuator; the different device layers of the valve body layer, the drive layer and the piezoelectric micropump body are aligned and bonded together.

7. A method for preparing a piezoelectric micropump based on array processing and segmentation according to claim 5 or 6, characterized in that: When processing a single-layer array structure corresponding to the valve body layer, two conducting holes (801) are opened on the valve body layer; two driving output contacts (901) are provided on the driving layer; elastic conducting structural members (802) are installed in the two conducting holes (801); the two conducting structural members (802) respectively conduct the two conductive parts on the electrode layer and the two driving output contacts (901) on the driving layer.

8. The method for preparing a piezoelectric micropump based on array processing and segmentation according to claim 1, characterized in that: The sheet material is made of stainless steel or carbon fiber; the processing method of the sheet material includes any one or more of etching, laser processing and photolithography processing; the scribing method is scribing by a cutter wheel or laser cutting.

9. A piezoelectric micropump, characterized in that: The piezoelectric micropump is prepared by the preparation method of the piezoelectric micropump as claimed in claim 3; the piezoelectric micropump comprises a flow channel layer (100), a resonance layer (200), a first connection layer (300), a diaphragm layer (400), a second connection layer (500) and an electrode layer (600) which are stacked in sequence; a pump flow chamber is formed between the flow channel layer (100) and the resonance layer (200); a resonance cavity is formed between the diaphragm layer (400) and the resonance layer (200); a first flow hole located at a central position and a plurality of second flow holes surrounding the first flow hole are provided on the resonance layer (200); an actuating element (401) is fixed on the diaphragm layer (400); one side of the actuating element (401) is connected to the first conductive part (6-6) through a wiring terminal (6-5); the other side of the actuating element (401) is connected to the second conductive part (6-7) through the diaphragm layer (400), the second connection layer (500) and the conductive adhesive.

10. A piezoelectric micropump, characterized in that: The piezoelectric micropump is prepared by the piezoelectric micropump preparation method as claimed in claim 3; the piezoelectric micropump comprises a pump body, a valve body layer (800) and a driving layer (900) which are stacked in sequence; the pump body comprises an end cover layer (700), a flow channel layer (100), a resonance layer (200), a diaphragm layer (400) and an electrode layer (600) which are stacked in sequence; an actuator element (401) is fixed on the diaphragm layer (400); the valve body layer (800) is connected to the electrode layer (600); the driving layer The two driving output contacts (901) on (900) are respectively connected to the two conductive parts of the electrode layer (600) through the conductive structure (802) in the valve body layer (800); an actuating element (401) is fixed on the diaphragm layer (400); one side of the actuating element (401) is connected to the first conductive part (6-6) through the wiring terminal (6-5); the other side of the actuating element (401) is connected to the second conductive part (6-7) through the diaphragm layer (400) and the conductive glue.

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