Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a circuit board assembly which comprises at least two circuit boards which are arranged at intervals; the vapor chamber is connected with the at least two circuit boards, a waveguide structure is arranged on the vapor chamber, and the waveguide structure extends through the at least two circuit boards; and the at least two waveguide probes are respectively arranged on the at least two circuit boards, one end of each waveguide probe extends into the waveguide structure, and the other end of each waveguide probe is connected with the microstrip line on the corresponding circuit board.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] With the rapid development of electronic devices, more and more electronic devices are equipped with multiple circuit boards to improve performance, and there is a need for signal transmission between the multiple circuit boards.

[0003] In the related art, signal transmission between multiple circuit boards in an electronic device includes routing through PCB (Printed Circuit Board) and connecting through a test socket and a coaxial line converter. Among them, the PCB routing method occupies too much wiring area of ​​the circuit board, and the connection method of the test socket and the coaxial line converter needs to occupy the space above the circuit board, which affects the thickness of the electronic device. Therefore, how to transmit signals between multiple circuit boards without occupying too much space in the electronic device has become an urgent problem to be solved. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide an electronic device that solves the problem of excessive occupation of the internal space of the electronic device due to setting up additional communication structures when transmitting signals between multiple circuit boards.

[0005] In a first aspect, an embodiment of the present application provides an electronic device, comprising: a circuit board assembly, comprising at least two circuit boards spaced apart from each other; a heat spreader, connected to the at least two circuit boards, a waveguide structure being arranged on the heat spreader, the waveguide structure extending through the at least two circuit boards; at least two waveguide probes, respectively arranged on the at least two circuit boards, one end of the waveguide probe extending into the waveguide structure, and the other end of the waveguide probe connected to a microstrip line on the circuit board.

[0006] In the embodiment of the present application, a waveguide structure is arranged in a part of the space where a heat spreader is arranged in the electronic device, and the waveguide structure is arranged on the heat spreader, and the waveguide structure only occupies a small part of the space where the heat spreader is located, and the waveguide structure can transmit signals between at least two circuit boards without affecting the original heat dissipation function of the heat spreader. Since the waveguide structure is connected to the heat spreader and only occupies part of the space where the heat spreader is located, the waveguide structure does not occupy additional internal space of the electronic device, and the waveguide structure can be arranged at any position within the coverage range of the heat spreader, which is convenient for the RF routing design of the circuit board and the three-dimensional stacking design of the electronic device, and the signal transmitted by the waveguide structure has lower signal loss than the signal transmitted by the RF line, which is beneficial to signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1One of the structural schematic diagrams of an electronic device provided in some embodiments of the present application is shown;

[0008] Figure 2 A second structural schematic diagram of an electronic device provided in some embodiments of the present application is shown;

[0009] Figure 3 A third structural schematic diagram of an electronic device provided in some embodiments of the present application is shown;

[0010] Figure 4 A schematic diagram of the structure of a waveguide probe provided in some embodiments of the present application is shown;

[0011] Figure 5 A schematic diagram of field intensity distribution in a waveguide structure provided in some embodiments of the present application is shown;

[0012] Figure 6 One of the structural schematic diagrams of the heat spreader and the waveguide structure provided in some embodiments of the present application is shown;

[0013] Figure 7a One of the equivalent circuit diagrams of a waveguide cavity with a gap provided in some embodiments of the present application is shown;

[0014] Figure 7b The second equivalent circuit diagram of a waveguide cavity with a gap provided in some embodiments of the present application is shown;

[0015] Figure 8 A fourth structural schematic diagram of an electronic device provided in some embodiments of the present application is shown;

[0016] Fig. 9 The second structural schematic diagram of the heat spreader and waveguide structure provided in some embodiments of the present application is shown.

[0017] The reference numerals are as follows:

[0018] 100 electronic device, 110 circuit board assembly, 111 microstrip line, 112 first circuit board, 113 second circuit board, 114 circuit board, 120 waveguide heat spreader, 121 heat spreader, 1212 heat spreader cavity, 122 waveguide structure, 1221 shell, 1222 cavity, 1223 gap, 1224 waveguide cavity, 1225 edge gap, 123 partition, 124 thermally conductive protrusion, 125 capillary structure, 126 thermally conductive medium, 130 waveguide probe, 131 probe seat, 132 probe column, 140 back cover, 150 battery, 160 panel. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0020] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0021] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0022] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] The following is combined with Figures 1 to 9 , the electronic device provided in the embodiment of the present application is described in detail through specific embodiments and their application scenarios.

[0024] In some embodiments of the present application, an electronic device is provided. Figure 1 One of the structural schematic diagrams of the electronic device provided in some embodiments of the present application is shown, Figure 2 The second structural schematic diagram of the electronic device provided in some embodiments of the present application is shown. Figure 3 The third structural diagram of the electronic device provided in some embodiments of the present application is shown. Figure 4Schematic diagram of the structure of the waveguide probe provided in some embodiments of the present application is shown. Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the electronic device 100 includes: a circuit board assembly 110, including at least two circuit boards 114 arranged at an interval from each other; a heat spreader 121, connected to the at least two circuit boards 114, and a waveguide structure 122 is arranged on the heat spreader 121, and the waveguide structure 122 extends through the at least two circuit boards 114; at least two waveguide probes 130, respectively arranged on the at least two circuit boards 114, one end of the waveguide probe 130 extends into the waveguide structure 122, and the other end of the waveguide probe 130 is connected to the microstrip line 111 on the circuit board 114.

[0025] In the embodiment of the present application, the electronic device 100 includes a circuit board assembly 110, and the circuit board assembly 110 includes at least two circuit boards 114 spaced apart from each other, and signals need to be transmitted between the at least two circuit boards 114. A heat spreader 121 is provided in the electronic device 100, and the heat spreader 121 is connected to the at least two circuit boards 114, and a waveguide structure 122 is provided on the heat spreader 121, and the heat spreader 121 and the waveguide structure 122 both extend through at least two circuit boards 114, and the heat spreader 121 can dissipate heat for the at least two circuit boards 114 passing through, and the waveguide structure 122 can transmit signals between the at least two circuit boards 114 passing through.

[0026] Specifically, at least two circuit boards 114 are arranged in the electronic device 100, and at least two circuit boards 114 are distributed at different positions of the body of the electronic device 100. The heat spreader 121 is also arranged in the body of the electronic device 100, and the heat spreader 121 is connected to the at least two circuit boards 114. The heat spreader 121 can evenly dissipate the heat generated by the at least two circuit boards 114 to other positions of the body. It should be noted that the heat spreader 121 will span most of the body of the electronic device 100.

[0027] Exemplarily, the heat spreader 121 is a vacuum chamber heat spreader 121 , the interior of the heat spreader 121 has a vacuum chamber 1222 with a fine structure, and the vacuum chamber 1222 is filled with a heat conducting medium 126 .

[0028] In the embodiment of the present application, a waveguide structure 122 is provided on the heat spreader 121. The waveguide structure is a vacuum closed cavity 1222, which can completely confine the transmitted electromagnetic waves within the waveguide structure 122. The waveguide structure 122 extends along the heat spreader 121 and passes through at least two circuit boards 114. At least two circuit boards 114 are provided with waveguide probes 130 for connecting to the waveguide structure. The waveguide probes 130 are connected to the microstrip line 111 on the circuit board. The waveguide probes 130 are inserted into the waveguide structure. The waveguide probes 130 can transmit the signals transmitted by the microstrip line 111 to the waveguide structure to form electromagnetic waves. The waveguide probes 130 can also convert the electromagnetic waves transmitted in the waveguide structure into signals and transmit them to the circuit board through the microstrip line 111.

[0029] It should be noted that the microstrip line 111 is a microwave transmission line composed of a single conductor strip on a dielectric substrate, and is suitable for manufacturing a planar structure transmission line of a microwave integrated circuit. The microstrip line 111 is arranged on a circuit board and can transmit microwave signals or millimeter wave signals. The waveguide probe 130 is a key component for exciting, coupling or detecting electromagnetic waves in a waveguide system. The waveguide probe 130 can be inserted into the waveguide structure 122. The waveguide probe 130 can interact with the electromagnetic field in the waveguide structure 122, thereby transmitting the microwave signal or millimeter wave signal in the waveguide structure 122 to the microstrip line 111.

[0030] In the embodiment of the present application, a waveguide structure 122 is arranged at the edge of the heat spreader 121 so that the waveguide structure 122 occupies the space where the heat spreader 121 is located, and the waveguide structure 122 can transmit signals between multiple circuit boards without occupying the space of circuit boards or other devices.

[0031] Exemplarily, the waveguide structure 122 is set in millimeters in the upper width direction of the plane space where the heat spreader 121 is located, and the same size as the heat spreader 121 in the length direction, and the waveguide structure 122 is connected to the heat spreader 121 in the width direction to ensure that the waveguide structure 122 can transmit signals between multiple circuit boards without affecting the thermal conductivity of the heat spreader 121.

[0032] Specifically, a microstrip line 111 is arranged on the circuit board 114, and the microstrip line 111 is connected to the waveguide structure through a waveguide probe. The outer wall of the waveguide probe 130 is connected to the side wall of the waveguide structure part of the heat spreader 121, and part of the waveguide probe 130 extends into the interior of the waveguide structure, wherein the depth of the waveguide probe 130 extending into the waveguide structure and the size of the top disk of the waveguide probe 130 can be set according to actual needs.

[0033] It should be noted that the cutoff frequency of the RF signal transmitted in the waveguide can be calculated by the following formula (1):

[0034] λ=2a;(1)

[0035] Where λ is the RF wavelength and a is the broadside of the waveguide.

[0036] Exemplarily, the thickness of the heat spreader 121 ranges from 0.5 mm to 5 mm, and the thickness of the waveguide structure 122 is the same as the thickness of the heat spreader 121 . For example, the thickness of the heat spreader 121 is greater than 1.2 mm.

[0037] Figure 5 Schematic diagram of field intensity distribution in a waveguide structure provided in some embodiments of the present application is shown. Figure 5 As shown, the waveguide structure 122 is a rectangular waveguide structure, and the wave modes of electromagnetic waves in a uniform waveguide can be divided into electric waves and magnetic waves. There can be an infinite number of magnetic wave mn modes in a rectangular waveguide, and similarly, there can be an infinite number of electric wave mn modes, where mn is a wave mode index, and m and n represent the number of maximum values ​​of standing waves of the electromagnetic field along the wide side and narrow side of the waveguide, respectively, where m, n = 0, 1, 2, ... but cannot be zero at the same time.

[0038] Figure 1 The arrow A shows a first direction, which is the extension direction of the waveguide structure 122 and the heat spreader 121 , and the arrow B shows a second direction, which is the width direction of the waveguide structure 122 and the heat spreader 121 . .

[0039] Specifically, the first direction is the length direction of the electronic device 100, which is also the extension direction of the waveguide structure 122 and the heat spreader 121. The second direction is the width direction of the electronic device 100, which is also the width direction of the waveguide structure 122 and the heat spreader 121. At least two circuit boards 114 are arranged at intervals along the length direction of the electronic device 100. The heat spreader 121 and the waveguide structure 122 are extended along the first direction, so that the heat spreader 121 and the waveguide structure 122 can pass through each circuit board, so that the heat spreader 121 can evenly distribute heat to each circuit board, and the waveguide structure 122 can transmit signals between at least two circuit boards 114.

[0040] Exemplarily, the width of the heat spreader 121 in the second direction is 4 cm, and the width of the waveguide structure 122 in the second direction is 2.5 mm. The waveguide structure 122 can transmit millimeter wave signals within a wavelength of 5 mm, and the frequency corresponding to the millimeter wave signals is above 60 GHz.

[0041] In the embodiment of the present application, a waveguide structure 122 is provided in a part of the space where a heat spreader 121 is provided in the electronic device 100, and the waveguide structure 122 is provided on the heat spreader 121, and the waveguide structure 122 only occupies a small part of the space where the heat spreader 121 is located, and the waveguide structure 122 can transmit signals between at least two circuit boards 114 without affecting the original heat dissipation function of the heat spreader 121. Since the waveguide structure is connected to the heat spreader 121 and only occupies part of the space where the heat spreader 121 is located, the waveguide structure 122 does not occupy additional internal space of the electronic device 100, and the waveguide structure 122 can be provided at any position within the coverage range of the heat spreader 121, which is convenient for the RF routing design of the circuit board, and the three-dimensional stacking design of the electronic device 100, and the signal transmitted by the waveguide structure has lower signal loss than the signal transmitted by the RF line, which is beneficial to signal transmission.

[0042] like Figure 4 As shown, in some embodiments of the present application, the waveguide structure 122 includes: a shell 1221 , the shell 1221 encloses a cavity 1222 , and at least a portion of the waveguide probe 130 penetrates the shell 1221 and extends into the cavity 1222 .

[0043] In the embodiment of the present application, the waveguide structure 122 is an internally hollow structure, and a hollow cavity 1222 is arranged in the shell 1221. When the waveguide structure 122 transmits a signal, the signal can be transmitted in the cavity 1222, thereby improving the stability of the waveguide structure 122 in transmitting signals between at least two circuit boards 114.

[0044] Specifically, the cavity 1222 in the waveguide structure 122 is a closed cavity 1222, which can completely confine the transmitted electromagnetic waves within the shell 1221. The shell 1221 is processed from a conductive material to form a rectangular cavity 1222. The inner wall of the cavity 1222 of the shell 1221 can be plated to reduce signal loss. The waveguide structure 122 extends along with the heat spreader 121 through at least two circuit boards 114. At least two circuit boards 114 are provided with waveguide probes 130 for connecting to the waveguide structure 122. The waveguide probes 130 can penetrate the shell 1221 at an orthogonal or inclined angle. The end of the waveguide probe 130 extends into the cavity 1222 to form an impedance transformation, so that the waveguide structure 122 can transmit signals between at least two circuit boards 114.

[0045] Exemplarily, the width of the shell 1221 of the waveguide structure 122 is 2 mm, and the thickness and length of the shell 1221 are the same as the length and thickness of the heat sink 121 .

[0046] Figure 6 One of the schematic diagrams of the structure of the heat spreader and the waveguide structure provided in some embodiments of the present application is shown, such as Figure 6As shown, in some embodiments of the present application, at least two slits 1223 are provided on the shell 1221, and the at least two slits 1223 are spaced apart along the extension direction of the waveguide structure 122, and the slits 1223 extend along the extension direction of the waveguide structure 122; wherein, at least two slits 1223 connect the interior of the cavity 1222 with the exterior of the shell 1221, and at least two slits 1223 are used to radiate signals outside the waveguide structure 122.

[0047] In the embodiment of the present application, at least two slits 1223 are provided on the shell 1221 of the waveguide structure 122, and the extension direction of the at least two slits 1223 is consistent with the extension direction of the waveguide structure 122, and the spacing distribution direction of the at least two slits 1223 is also consistent with the extension direction of the waveguide structure 122. The inside and outside of the cavity 1222 are connected by at least two slits 1223, and when the waveguide structure 122 transmits a signal, the electromagnetic field of the corresponding wavelength inside the cavity 1222 cannot continue to be conducted through the cavity 1222 when passing through the slits 1223, thereby radiating energy outward.

[0048] It should be noted that at least two slots 1223 are spaced apart in the second direction, that is, at least two slots 1223 are spaced apart in the width direction of the waveguide structure 122, that is, at least two slots 1223 are arranged in an array on the shell 1221. By setting a plurality of slots 1223 on the shell 1221, the signal quality of the signal radiated outward through the cavity 1222 can be effectively improved.

[0049] Exemplarily, at least two slits 1223 are disposed on at least one wall surface of the upper surface and the lower surface of the shell 1221 , which can effectively increase the coverage area of ​​the slits 1223 on the shell 1221 .

[0050] In the embodiment of the present application, by opening a plurality of slits 1223 on the shell 1221, the waveguide structure 122 can have the function of radiating signals outward, thereby increasing the number of available antennas of the electronic device 100 and improving the signal receiving and sending capabilities of the electronic device 100 in different holding states.

[0051] like Figure 6 As shown, in some embodiments of the present application, in the first direction, two adjacent gaps 1223 are spaced apart by a first spacing, and the value range of the first spacing is 1 / 3 to 2 / 3 of the signal wavelength of the target signal; or in the first direction, the edge gap 1225 is spaced apart from the edge of the shell 1221 by a second spacing, and the edge gap 1225 is the gap 1223 close to the edge of the shell 1221 among at least two gaps 1223 in the first direction, and the value range of the second spacing is 1 / 5 to 1 / 3 of the signal wavelength of the target signal.

[0052] Figure 1 and Figure 6 Arrow A shows a first direction, and arrow B shows a second direction.

[0053] In the embodiment of the present application, the slot 1223 opened on the shell 1221 and connected to the cavity 1222 serves as the parallel admittance of the waveguide structure 122. By setting the numerical relationship between a first spacing between at least two slots 1223 and the signal wavelength of the target signal, and the numerical relationship between a second spacing between an edge slot 1225 located at the edge of the shell 1221 and the edge of the shell 1221 and the signal wavelength of the target signal, the input admittance and input impedance in the cavity 1222 can be set, thereby improving the ability of the waveguide structure 122 to radiate signals outward.

[0054] Specifically, by designing the value range of the first spacing to be 1 / 3 to 2 / 3 of the signal wavelength of the target signal, an input impedance can be provided between two adjacent gaps 1223. By designing the value range of the second spacing to be 1 / 5 to 1 / 3 of the signal wavelength of the target signal, the edge gap 1225 and the edge of the shell 1221 can be regarded as an open circuit.

[0055] Figure 7a One of the equivalent circuit diagrams of a housing 1221 with a gap 1223 provided in some embodiments of the present application is shown. Figure 7b FIG. 2 shows a second equivalent circuit diagram of a housing 1221 with a gap 1223 provided in some embodiments of the present application, such as Figure 6 , Figure 7a and Figure 7b As shown, exemplarily, the first spacing between two adjacent slots 1223 in the first direction is L1, the second spacing between the edge slot 1225 and the edge of the shell 1221 in the first direction is L2, and the length of the slot 1223 in the first direction is L3, wherein L1 is designed to be 1 / 2 signal wavelength, L2 is designed to be 1 / 4 signal wavelength, and L3 is designed to be 1 / 2 signal wavelength, then the input impedance seen from the half-wavelength position is Z ohms, and the quarter-wavelength transmission line can be regarded as an open circuit, and the input admittance and input impedance of the array of N slots 1223 can be calculated by the following formulas (2) and (3), respectively:

[0056] Y in =NY S ; (2)

[0057] Z in =1 / NY S ; (3)

[0058] Among them, Y in is the input admittance, Z in is the input impedance, N is the number of slots 1223, Y Sis the admittance of each gap 1223.

[0059] In the embodiment of the present application, by setting at least two slots 1223 at equal intervals, and setting the numerical relationship between the first spacing between two adjacent slots 1223 and the signal wavelength, and the numerical relationship between the second spacing between the edge slot 1225 near the edge of the shell 1221 and the edge of the shell 1221 and the signal wavelength, the ability of the cavity 1222 in the shell 1221 to radiate signals outward is improved.

[0060] In some embodiments of the present application, the length of the slot 1223 ranges from 1 / 3 to 2 / 3 of the signal wavelength of the target signal; or the width of the slot 1223 ranges from 1 / 12 to 1 / 8 of the signal wavelength of the target signal.

[0061] In the embodiment of the present application, at least two slots 1223 have the same size, and the length of each slot 1223 is greater than or equal to 1 / 3 of the signal wavelength and less than or equal to 2 / 3 of the signal wavelength, and the width of each slot 1223 is greater than or equal to 1 / 12 of the signal wavelength and less than or equal to 1 / 8 of the signal wavelength, so that the electromagnetic field in the cavity 1222 can be intercepted when passing through the slot 1223, thereby radiating energy outward. It should be noted that the extension direction of the slot 1223 is the first direction, that is, the length of the slot 1223 is the size of the slot 1223 in the first direction, and the width of the slot 1223 is the size of the slot 1223 in the second direction.

[0062] In the embodiment of the present application, by setting the dimensions of at least two slots 1223, and setting the numerical relationship between the length of each slot 1223 and the signal wavelength, as well as the numerical value of the width of each slot 1223 and the signal wavelength, the interception effect of the slot 1223 on the electromagnetic field within the waveguide structure 122 is improved, thereby improving the ability of the cavity 1222 to radiate signals outward.

[0063] Figure 8 FIG. 4 shows a fourth structural diagram of an electronic device provided in some embodiments of the present application, such as Figure 1 and Figure 8 As shown, in some embodiments of the present application, the electronic device 100 further includes a battery 150 and a back cover 140, and the circuit board assembly 110 includes a first circuit board 112 and a second circuit board 113;

[0064] The first circuit board 112 and the second circuit board 113 are respectively disposed on both sides of the battery 150 , the waveguide structure 122 is disposed on a side of the circuit board assembly 110 facing the back cover 140 , and the gap 1223 is opened on a side of the waveguide structure 122 facing the back cover 140 .

[0065] In the embodiment of the present application, at least two circuit boards 114 of the electronic device 100 include a first circuit board 112 and a second circuit board 113, the first circuit board 112 and the second circuit board 113 are located between the panel 160 and the back cover 140, and the first circuit board 112 and the second circuit board 113 are respectively located on both sides of the battery 150, the heat spreader 121 and the waveguide structure 122 are both arranged on the side of the circuit board assembly 110 facing the back cover 140, and the gap 1223 opened on the waveguide structure 122 faces the side of the back cover 140, so that the signal radiated outwardly from the gap 1223 is radiated to the outside of the electronic device 100 through the back panel, thereby improving the signal strength of the signal radiated outwardly by the waveguide structure 122, and reducing the influence of the internal structure of the electronic device 100 on the ability to radiate signals outwardly.

[0066] Exemplarily, the panel 160 is a display panel of the electronic device 100 , the circuit board assembly 110 is located between the panel 160 and the back plate, and the battery 150 is located between the circuit board assembly 110 and the back plate.

[0067] Exemplarily, the first circuit board 112 is the main board of the electronic device 100, and the second circuit board 113 is the sub-board of the electronic device 100. The main board and the sub-board are distributed at both ends of the battery 150 along the first direction. The two ends of the heat spreader 121 are respectively connected to the main board and the sub-board, and the waveguide structure 122 is respectively connected to the waveguide probe 130 on the main board and the waveguide probe 130 on the sub-board, so that signals can be transmitted between the main board and the sub-board through the waveguide structure 122.

[0068] Exemplarily, a network module, a camera module, an audio output module, a main chip, etc. are provided on the main board, and an audio input module, an external device interface module, etc. are provided on the sub-board.

[0069] Exemplarily, the electronic device 100 includes but is not limited to any of the following: a mobile phone, a tablet computer, a smart watch, a wireless communication device, and a smart home device.

[0070] In some embodiments of the present application, the heat spreader 121 and the waveguide structure 122 extend along a first direction through at least two circuit boards 114, and the heat spreader 121 and the waveguide structure 122 are distributed along a second direction, and the ratio of the width of the waveguide structure 122 in the second direction to the width of the heat spreader 121 in the second direction ranges from 1:20 to 1:10.

[0071] In the embodiment of the present application, the first direction is the length direction of the electronic device 100, the second direction is the width direction of the electronic device 100, and at least two circuit boards 114 are arranged at intervals along the length direction of the electronic device 100. Then, the heat spreader 121 is extended along the first direction, so that the heat spreader 121 can pass through each circuit board, thereby performing heat dissipation on each circuit board. In addition, the waveguide structure 122 is arranged to extend along the first direction, so that the waveguide structure 122 can pass through each circuit board, so that each circuit board can transmit signals through the corresponding waveguide probe 130 and the waveguide structure 122.

[0072] In the embodiment of the present application, the waveguide structure 122 is arranged side by side with the heat spreader 121, and the length and thickness of the waveguide structure 122 are the same as the length and thickness of the heat spreader 121. The ratio of the width of the waveguide structure 122 to the width of the heat spreader 121 is set between 1:20 and 1:10, which can effectively make the waveguide structure 122 occupy a smaller part of the space where the heat spreader 121 is located, so that while the waveguide structure 122 can effectively transmit signals, it can also ensure that the heat spreader 121 has good heat dissipation performance for the circuit board assembly 110.

[0073] Exemplarily, the width of the heat spreader 121 in the second direction is 4 cm, and the width of the waveguide structure 122 in the second direction is 2.5 mm. The waveguide structure 122 can transmit millimeter wave signals within a wavelength of 5 mm, and the frequency corresponding to the millimeter wave signals is above 60 GHz.

[0074] In some embodiments of the present application, the waveguide probe 130 includes: a probe seat 131, which is arranged on the circuit board assembly 110; a probe column 132, which is arranged on the probe seat 131, one end of the probe column 132 is connected to the microstrip lines 111 of at least two circuit boards 114, and the other end of the probe column 132 extends into the waveguide structure 122.

[0075] In the embodiment of the present application, the waveguide probe 130 includes a probe seat 131 and a probe column 132. The probe seat 131 is used to fix the probe column 132 on the circuit board. One end of the probe column 132 is connected to the microstrip line 111 on the circuit board, and the other end extends into the waveguide structure 122. Specifically, the bottom surface of the probe seat 131 is fixedly connected to the circuit board, and the top surface of the probe seat 131 is fixedly connected to the heat spreader 121, thereby improving the stability of the probe column 132 extending into the waveguide structure 122.

[0076] Exemplarily, the probe seat 131 is a pad formed on the circuit board assembly 110, and the pad can fix the probe post 132 on the circuit board assembly 110, and the pad is arranged on the microstrip line 111 of the circuit board assembly 110, so that the probe post 132 is electrically connected to the microstrip line 111. The probe post 132 can penetrate into the waveguide structure 122 at an orthogonal or inclined angle.

[0077] Fig. 9 FIG. 2 shows a second schematic diagram of a heat spreader and a waveguide structure provided in some embodiments of the present application. Fig. 9 As shown, in some embodiments of the present application, the waveguide structure 122 and the heat sink 121 are integrally formed.

[0078] In the embodiment of the present application, the waveguide structure 122 and the heat spreader 121 are an integrally formed structure, and the waveguide structure 122 and the heat spreader 121 can be produced simultaneously. It can be understood that the heat spreader 121 and the waveguide structure 122 are both hollow structures. Therefore, after processing a metal plate having at least two cavities, different processing can be performed on the inside of the at least two cavities, so that the at least two cavities are used to transmit signals in the waveguide structure 122 and to conduct heat in the heat spreader 121 after being filled with the heat conductive medium 126. In addition, during production and processing, the heat spreader 121 and the waveguide structure 122 can be processed together without the need for an additional process to combine and splice the two, thereby improving the consistency of the two and the convenience of processing.

[0079] Exemplarily, a copper plate with two cavities is processed, a capillary structure 125 is set in one of the cavities and filled with a heat-conducting medium 126, so that the copper plate corresponding to the cavity forms a heat spreader 121, and a coating is set on the inner wall of the other cavity to improve the signal transmission effect, so that the copper plate corresponding to the cavity forms a waveguide structure 122.

[0080] like Fig. 9 As shown, in some embodiments of the present application, the electronic device 100 includes: a waveguide heat spreader 120; a separator 123, which is arranged on the waveguide heat spreader 120, and the separator 123 separates the waveguide heat spreader 120 into a heat spreader 121 and a waveguide structure 122.

[0081] In the embodiment of the present application, the waveguide heat spreader 120 is a component formed by an integral molding of a heat spreader 121 and a waveguide structure 122, and a partition 123 is arranged in the waveguide structure 122, and the partition 123 extends along a first direction, that is, the extension direction of the partition 123 is consistent with the extension direction of the waveguide structure 122 and the extension direction of the heat spreader 121, and the partition 123 divides the waveguide heat spreader 120 into two parts: the waveguide structure 122 and the heat spreader 121.

[0082] It can be understood that since cavities are provided inside the heat spreader 121 and the waveguide structure 122, and the cavity inside the heat spreader 121 needs to be filled with the heat conductive medium 126, while the cavity inside the waveguide structure 122 is not filled with contents, the interior of the waveguide heat spreader 120 is separated by the partition 123 to prevent the heat conductive medium 126 in the heat spreader 121 from flowing into the waveguide structure 122, thereby further ensuring the heat dissipation performance of the heat spreader 121 and the stability of the signal transmission of the waveguide structure 122.

[0083] In the embodiment of the present application, the waveguide heat spreader 120 is divided into a heat spreader plate 121 and a waveguide structure 122 by a partition 123. The waveguide heat spreader 120 can be formed at one time during production and processing, which improves the consistency of the two and the convenience of processing, and further saves the internal space of the electronic device 100.

[0084] like Fig. 9 As shown, in some embodiments of the present application, a heat-saturating cavity 1212 is disposed in the heat-saturating plate 121, and a waveguide cavity 1224 is disposed in the waveguide structure 122;

[0085] The heat-averaging cavity 1212 is filled with a heat-conducting medium 126 and a capillary structure 125 , a heat-conducting protrusion 124 is provided on the cavity wall of the heat-averaging cavity 1212 , and the roughness of the cavity wall of the waveguide cavity 1224 is smaller than that of the cavity wall of the heat-averaging cavity 1212 .

[0086] In the embodiment of the present application, a cavity is provided in the waveguide heat spreader 120, and the cavity is divided into a heat spreader cavity 1212 in the heat spreader 121 and a waveguide cavity 1224 in the waveguide structure 122 by a partition 123. A heat conducting medium 126 and a capillary structure 125 are filled in the heat spreader cavity 1212, and the heat conducting medium 126 can flow in the capillary structure 125, so that the heat spreader 121 can dissipate heat for the circuit board assembly 110, and a heat conducting protrusion 124 is also provided in the heat spreader cavity 1212, and the heat conducting protrusion 124 can transfer the heat on the circuit board assembly 110 to the inside of the heat spreader cavity 1212, thereby improving the heat exchange efficiency between the heat conducting medium 126 in the heat spreader cavity 1212 and the circuit board assembly 110, and further improving the heat dissipation performance of the heat spreader 121 to the circuit board assembly 110. The roughness of the cavity wall of the waveguide cavity 1224 is smaller than that of the cavity wall of the heat-averaging cavity 1212 , so that the inner wall of the waveguide cavity 1224 is designed to be a smooth surface, which can help reduce the signal loss during signal transmission in the waveguide cavity 1224 and improve the signal transmission effect.

[0087] Exemplarily, the waveguide heat-saturating member 120 is a copper plate with a cavity, the cavity in the copper plate is a partition 123 which is a copper wall structure arranged in the cavity, and the heat-saturating cavity 1212 and the waveguide cavity 1224 are isolated in the cavity by the copper wall structure, wherein the volume of the heat-saturating cavity 1212 is greater than the volume of the waveguide cavity 1224, and a capillary structure 125 capable of transmitting a heat-conducting medium 126 is arranged in the heat-saturating cavity 1212, and the heat-conducting medium 126 is injected to improve the heat-saturating capacity of the heat-saturating cavity 1212, and the capillary structure 125 for increasing the heat-conducting capacity is not arranged in the waveguide cavity 1224, and the heat-conducting medium 126 is not injected to ensure the signal transmission capacity of the waveguide cavity 1224. Specifically, for example, the capillary structure 125 can be a porous metal material, such as a copper powder sintered layer, a same fiber braided layer or a metal foam.

[0088] like Fig. 9 As shown, in some embodiments of the present application, the number of the heat spreaders 121 is at least two, and the waveguide structure 122 is located between at least two heat spreaders 121; or the heat spreader 121 is located on one side of the waveguide structure 122.

[0089] In the embodiment of the present application, the number of the heat spreaders 121 can be set to one, or can be set to at least two, and the positional relationship between the heat spreaders 121 and the waveguide structure 122 can also be adjusted according to actual needs.

[0090] Specifically, when there are one vapor chamber and one waveguide structure 122 , the vapor chamber 121 is located at one side of the waveguide structure. When there are at least two vapor chambers, the waveguide structure 122 is disposed between at least two vapor chambers 121 .

[0091] like Figure 1 As shown, illustratively, the number of the heat spreader 121 and the number of the waveguide structure 122 are both one, and the heat spreader and the waveguide structure are distributed on the left and right.

[0092] like Figure 2 As shown, exemplarily, there are two heat spreaders 121 , one waveguide structure, and the two heat spreaders 121 are distributed on the left and right sides of the waveguide structure.

[0093] like Figure 3 As shown, illustratively, both the heat spreader 121 and the waveguide structure 122 are in an "L" shape, the number of the heat spreader 121 and the waveguide structure are both one, and the heat spreader and the waveguide structure are distributed left and right.

[0094] In the embodiment of the present application, the positional relationship between the heat spreader 121 and the waveguide structure 122, as well as the number of heat spreaders and waveguide structures can be flexibly adjusted according to actual needs, so as to facilitate the setting of the heat spreader and the waveguide structure in combination with the routing of at least two circuits.

[0095] In some embodiments of the present application, the width of the heat spreader 121 ranges from 2 cm to 5 cm; or the thickness of the heat spreader 121 ranges from 0.5 mm to 5 mm.

[0096] In the embodiment of the present application, by setting the width range of the heat spreader 121 between 2 cm and 5 cm, the heat spreader 121 in the electronic device 100 can be guaranteed to have a heat spreader effect, and by setting the thickness range of the heat spreader 121 between 0.5 mm and 5 mm, the influence of the heat spreader 121 on the thickness of the electronic device 100 can be reduced.

[0097] Exemplarily, the width of the heat spreader 121 is 4 cm, and the thickness of the heat spreader 121 is 1.3 mm.

[0098] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0099] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A circuit board assembly, comprising at least two circuit boards spaced apart from each other; A heat spreader connected to at least two of the circuit boards, wherein a waveguide structure is disposed on the heat spreader, and the waveguide structure extends through at least two of the circuit boards; At least two waveguide probes are respectively arranged on at least two of the circuit boards, one end of the waveguide probe extends into the waveguide structure, and the other end of the waveguide probe is connected to the microstrip line on the circuit board.

2. The electronic device according to claim 1, characterized in that: The waveguide structure comprises: The shell is enclosed to form a cavity, and at least part of the waveguide probe passes through the shell and extends into the cavity.

3. The electronic device according to claim 2, characterized in that: At least two slits are provided on the shell, and at least two of the slits are spaced apart and distributed along the extension direction of the waveguide structure, and the slits extend along the extension direction of the waveguide structure; Among them, at least two of the gaps connect the interior of the cavity with the exterior of the shell, and at least two of the gaps are used to radiate signals outside the waveguide structure.

4. The electronic device according to claim 3, characterized in that: The electronic device further comprises a battery and a back cover, and the circuit board assembly comprises a first circuit board and a second circuit board; The first circuit board and the second circuit board are respectively arranged on two sides of the battery, the waveguide structure is arranged on a side of the circuit board assembly facing the back cover, and the gap is opened on a side of the waveguide structure facing the back cover.

5. The electronic device according to claim 1, characterized in that: The heat spreader and the waveguide structure extend along a first direction through at least two of the circuit boards, and the heat spreader and the waveguide structure are distributed along a second direction, and a ratio of a width of the waveguide structure in the second direction to a width of the heat spreader in the second direction ranges from 1:20 to 1:

10.

6. The electronic device according to claim 1, characterized in that: The waveguide probe comprises: A probe seat, arranged on the circuit board assembly; A probe column is arranged on the probe seat, one end of the probe column is connected to the microstrip lines of at least two circuit boards, and the other end of the probe column extends into the waveguide structure.

7. The electronic device according to claim 1, characterized in that: The waveguide structure and the heat sink are integrally formed.

8. The electronic device according to claim 7, characterized in that: The electronic device comprises: Waveguide heat sink; A separator is arranged on the waveguide heat spreader, and the separator separates the waveguide heat spreader into the heat spreader and the waveguide structure.

9. The electronic device according to claim 7, characterized in that: A heat soaking cavity is provided in the heat soaking plate, and a waveguide cavity is provided in the waveguide structure; The heat-averaging cavity is filled with a heat-conducting medium and a capillary structure, a heat-conducting protrusion is arranged on the cavity wall of the heat-averaging cavity, and the roughness of the cavity wall of the waveguide cavity is smaller than the roughness of the cavity wall of the heat-averaging cavity.

10. The electronic device according to claim 1, characterized in that: The number of the vapor chambers is at least two, and the waveguide structure is located between at least two of the vapor chambers; or The heat spreader is located at one side of the waveguide structure.

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