Method for processing PCB (Printed Circuit Board) capable of being directly inserted with cable and PCB

Abstract

The invention relates to a method for processing a PCB (Printed Circuit Board) capable of being directly inserted with a cable in the field of PCB manufacturing, and the method comprises the steps: superposing multiple layers of boards to form a multilayer board, and carrying out the drilling processing on the multilayer board, thereby obtaining a prefabricated PCB; grading slotting processing is carried out on the prefabricated PCB, a notch covers a drilling position on the multilayer board, and metallization processing is carried out on the notch subjected to primary slotting processing; performing alkaline etching treatment on the multilayer board after the last time of slotting treatment to obtain a PCB in which a cable can be directly inserted; when the PCB of the in-line cable cooperates with multiple modules, the cable is mainly arranged in the notch (clamping groove), it can be understood that the PCB has a connection function, transition connection does not need to be conducted through a connector, the signal transmission and shielding effects of the PCB are even better than those of the connector, and due to the fact that the PCB is a customized product, the PCB can be manufactured in the machining process of the PCB, the cost is low, and the cost is low. The use cost is reduced, and the defect that a connector needs to be used when a traditional PCB and other modules assist is overcome.

Description

Technical Field

[0001] The present application relates to the field of PCB manufacturing technology, and in particular to a PCB processing method and a PCB board capable of directly plugging cables. Background Art

[0002] With the rapid development of the high-speed communications industry, more and more products require multi-module collaboration. The connection between PCBs and other modules is mainly through cables and optical fibers. This requires adding connectors to the PCB. Connectors must have minimal signal loss, shielding against external interference, and protecting the plug. Good connectors are expensive, and many even require customization, further increasing costs. Summary of the Invention

[0003] The purpose of this application is to provide a PCB processing method and PCB board that can directly plug cables into the PCB, which can replace connectors so that cables can be directly plugged into the PCB, and the signal transmission and shielding effects are even better than those of connectors.

[0004] To achieve the above objectives, this application is implemented using the following technical solutions: In the first aspect, the present application discloses a PCB processing method for a plug-in cable, which comprises: Stacking multiple layers of sheet material to form a multilayer board, and drilling holes in the multilayer board to obtain a prefabricated PCB; Performing graded slotting on the prefabricated PCB, wherein the slots cover the drilled holes on the multilayer board, and performing metallization on the slots of the first slotting process; The multilayer board after the last slotting process is subjected to alkaline etching to obtain a PCB that can be directly plugged into cables.

[0005] Further solutions of this application, The drilling process includes two drilling stages; In a first drilling stage, at least one first hole is opened in the multilayer board; In the second drilling stage, a plurality of second holes are opened on the multilayer board, and the plurality of second holes surround the notches processed by the first notching.

[0006] According to a further solution of the present application, a plurality of the second holes are provided on the multilayer board along an elliptical array.

[0007] A further solution, The graded slotting process includes a primary slotting stage and a secondary slotting stage; In the first-level slotting stage, a first slot is opened on the multilayer board, and the diameter range of the first slot covers the first hole; Performing metallization treatment on the first notch and the inner wall of the first hole; In the secondary slotting stage, a second slot is opened in the first slot, and the second slot is located between the first slot and the first hole.

[0008] A further solution, The metallization process includes a first electroplating process and a second electroplating process; The first electroplating treatment comprises sequentially performing copper plating and surface pattern plating on the first notch and the inner wall of the first hole; The second electroplating treatment is based on the multilayer board treated by the first electroplating treatment, and further performs tin plating treatment on the first notch and the inner wall of the first hole.

[0009] In a further solution, the processing depth of the second notch is greater than the thickness of the metal plating layer after the metallization treatment of the first notch and the first hole.

[0010] In a further solution, the diameter of the first notch is between 1.5 mm and 2.5 mm.

[0011] In a further embodiment of the present application, the PCB processing method further includes a surface treatment process, wherein the surface treatment process includes one or more steps of organic coating, chemical nickel-gold plating, and silver immersion.

[0012] In a second aspect, the present application discloses a PCB board, which is manufactured by the above-mentioned PCB processing method for directly plugging cables.

[0013] The beneficial effects of this application are: When the PCB of the direct-plug cable in this application cooperates with multiple modules, the cable is mainly placed in the slot (card slot). It can be understood that this PCB has a connection function and does not require a transition connection through a connector. Its signal transmission and shielding effects are even better than those of the connector. Since the PCB itself is a customized product, the finished product can be produced during the PCB processing, which reduces the cost of use and changes the defect that the traditional PCB and other modules need to use connectors when cooperating. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 Schematic diagram of the process of the PCB processing method of the direct plug cable in the embodiment of this application Figure 1 Figure 2 Schematic diagram of the process of the PCB processing method of the direct plug cable in the embodiment of this application Figure 2 ; Figure 3 This is a top view of the PCB structure in Example 2 of this application.

[0015] Among them: 1. First hole; 2. Second hole; 3. First notch; 4. Second notch. DETAILED DESCRIPTION

[0016] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only some embodiments of the present application, rather than all embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present application, its application, or use. Example 1

[0017] This embodiment discloses a method for processing a PCB capable of directly plugging in cables, comprising stacking multiple layers of sheet material to form a multilayer board, drilling holes in the multilayer board to obtain a prefabricated PCB; performing graded slotting on the prefabricated PCB, wherein the slots cover the drilled holes on the multilayer board, and metallizing the slots subjected to the first slotting treatment; and alkaline etching the multilayer board after the final slotting treatment to obtain a PCB capable of directly plugging in cables.

[0018] like Figure 1 As shown, in some embodiments, a method for processing a PCB capable of directly plugging a cable is basically implemented as follows, specifically comprising the steps of: Step 1: Drilling holes and blind grooves in multilayer boards; 1) Stacking multiple layers of sheet materials to form a multilayer board. In this embodiment, the multilayer board is manufactured according to the design using the traditional PCB processing flow, namely, cutting - inner lamination film - exposure - development - etching - automatic optical inspection - punching positioning - brown oxidation - stacking - pressing - edge cutting.

[0019] 2) Perform multiple mechanical drilling on the multilayer board. In the first drilling stage, two first holes 1 (signal holes) are opened on the multilayer board. In the second drilling stage, ten second holes 2 (signal shielding holes) are opened on the multilayer board. Appropriate positioning holes can also be opened on the multilayer board to facilitate positioning of the multilayer board during machining. 3) Create blind slots in the board to create a slot for plugging and unplugging cables. The slotting process consists of two stages: a primary slotting stage and a secondary slotting stage. During the primary slotting stage, a first slot 3 is created in the multilayer board. The diameter of the first slot 3 covers the first hole 1. Typically, the diameter of the first slot 3 is controlled between 1.5mm and 3.5mm. Step 2: Blind slot and hole metallization; The metallization process includes a first electroplating process and a second electroplating process A first electroplating process is to sequentially perform copper plating and surface pattern electroplating on the first notch 3 and the inner wall of the first hole 1; In the second electroplating process, based on the multilayer board processed by the first electroplating process, the first notch 3 and the inner wall of the first hole 1 are subjected to tin plating.

[0020] Step 3: Control the depth of the drilling to form the second notch 4; The first hole 1 (signal hole) in the first slot 3 is depth-drilled, and the drill is drilled from the opening direction of the first slot 3. The depth is controlled to cut through the tin plating layer and the copper layer. That is, the processing depth of the second slot 4 is greater than the thickness of the metal plating after the metallization treatment of the first slot 3 and the first hole 1. The diameter of the drill needle needs to be greater than the diameter of the first hole 1 and cannot touch the slot wall during processing.

[0021] Step 4: Remaining process; 1) The multilayer board after the two slotting processes is subjected to alkaline etching to obtain a PCB that can be directly plugged into the cable. 2) AOI online monitoring equipment scans the PCB of the prepared plug-in cable to check whether there are open or short circuits; If qualified, surface treatment will be made according to customer needs, including one or more processes such as organic coating, chemical nickel-gold plating and immersion silver; if unqualified, the cause of the short circuit of the PCB board will be checked. The short circuit can be removed by laser or manual scraping. After surface treatment, electrical performance testing and appearance inspection are generally required (conventional techniques are not described here). After re-inspection, corrections will be made until the product is qualified.

[0022] Below is a product comparison table Relative value of signal transmission strength Relative shielding effect Relative value of cost Conventional PCB -9dBm 1 1 This application PCB -6dBm 1.2 0.7 The signal transmission strength, shielding effect and cost of the PCB in this application are better than those of traditional products. Example 2

[0023] As attached Figure 2 and 3 As shown, the present embodiment discloses a PCB, which is manufactured by the PCB processing method for directly plugging cables in the above-mentioned embodiment 1; conventional PCBs are produced by customization, and do not require the use of connectors when used with multiple modules.

[0024] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", etc. are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, "multiple" means two or more.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

Claims

1. A method for processing a PCB capable of directly plugging in cables, characterized in that: include Stacking multiple layers of sheet materials to form a multilayer board, and drilling holes on the multilayer board to obtain a prefabricated PCB; Performing graded slotting on the prefabricated PCB, wherein the slots cover the drilling positions on the multilayer board, and performing metallization on the slots of the first slotting process; The multilayer board after the last slotting process is subjected to alkaline etching to obtain a PCB that can be directly plugged into the cable.

2. The PCB processing method of the plug-in cable according to claim 1, characterized in that: The drilling process includes two drilling stages; In a first drilling stage, at least one first hole is opened in the multilayer board; In the second drilling stage, a plurality of second holes are opened on the multilayer board, and the plurality of second holes surround the notches processed by the first notching.

3. The PCB processing method of the pluggable cable according to claim 1, characterized in that: A plurality of the second holes are arranged on the multilayer board in an elliptical array.

4. The PCB processing method of the plug-in cable according to claim 2, characterized in that: The graded slotting process includes a primary slotting stage and a secondary slotting stage; In the first-level slotting stage, a first slot is opened on the multilayer board, and the diameter range of the first slot covers the first hole; Performing metallization treatment on the first notch and the inner wall of the first hole; In the secondary slotting stage, a second slot is opened in the first slot, and the second slot is located between the first slot and the first hole.

5. The PCB processing method of the pluggable cable according to claim 4, characterized in that: The metallization process includes a first electroplating process and a second electroplating process; The first electroplating treatment includes sequentially performing copper plating and surface pattern plating on the first notch and the inner wall of the first hole; The second electroplating treatment is based on the multilayer board treated by the first electroplating treatment, and further performs tin plating treatment on the first notch and the inner wall of the first hole.

6. The PCB processing method of the pluggable cable according to claim 4, characterized in that: The processing depth of the second notch is greater than the thickness of the metal plating layer of the first notch and the first hole after metallization treatment.

7. The PCB processing method of the pluggable cable according to claim 4, characterized in that: The diameter of the first notch is between 1.5 mm and 2.5 mm.

8. The PCB processing method of the plug-in cable according to claim 1, characterized in that: The PCB processing method also includes a surface treatment process, which includes one or more processes of organic coating, chemical nickel-gold plating and silver immersion.

9. A PCB board, characterized in that: The PCB board is manufactured by the PCB processing method of the direct-plug cable described in any one of claims 1 to 8 above.

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