Automatic welding packaging control method and system for LED lamp bead processing

Abstract

The invention relates to the technical field of packaging carriers, and particularly discloses an automatic welding packaging control method and system for LED lamp bead processing, and the method comprises the steps: welding adaptive temperature matching, welding operation control and packaging operation control, a feeding assembly monitors the initial performance of an LED lamp bead and collects data, an index is evaluated, the welding adaptive temperature is matched, and the packaging operation is controlled; the welding assembly performs preset welding after being preheated, obtains welding data, judges a quality evaluation value, and compares the quality evaluation value with a threshold value to determine whether to adjust welding operation or not so as to control a welding link; and then, the packaging assembly carries out preset packaging and quality detection on the welded LED lamp beads, evaluates the packaging quality index, verifies the preset index, and judges whether to adjust the preset packaging operation or not according to the packaging quality verification result, so that the control on the processing and packaging links of the LED lamp beads is realized, the production efficiency of the LED lamp beads is improved, and the self-adaptability of welding and packaging equipment is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging carriers, and in particular to an automatic welding packaging control method and system for processing LED lamp beads. Background Art

[0002] The production of LED lamp beads is a complex and delicate process, which usually includes chip inspection, packaging, welding, testing and other links. Among them, welding and packaging are key steps in the production of LED lamp beads, which directly affect the performance and stability of LED lamp beads. Due to the small size of LED lamp beads, high-precision positioning and control are required during the welding process to ensure the accurate docking of the pins and solder joints. With the development of automation technology, the welding and packaging process of LED lamp beads also needs to be gradually automated to improve the accuracy and efficiency of welding packaging.

[0003] For example, the invention patent with announcement number CN113284988B announces a RCLED lamp bead packaging process, which includes the following steps: applying solid crystal glue, installing chips, baking, welding bonding wires, applying a first layer of anti-reflection glue, baking, applying a second layer of anti-reflection glue, baking, and testing. By applying anti-reflection glue on the corresponding area of ​​the RCLED lamp bead, the reflective part of the RCLED lamp bead is blocked; the viscosity of the first layer of anti-reflection glue has a certain fluidity, so that the anti-reflection glue can quickly fill the designated area; the viscosity of the second layer of anti-reflection glue is higher, and it flows slowly after applying the glue to prevent the anti-reflection glue from blocking the light-emitting hole of the RCLED chip; when welding the bonding wires, the bracket is the first solder joint and the PAD of the RCLED chip is the second solder joint.

[0004] For example, the invention patent with announcement number CN113659053B announces a CSP lamp bead packaging structure and its manufacturing process. First, the metal substrate and the insulating substrate are bonded together, and then a preset metal substrate pattern is made on the metal substrate. Then, an opening for loading the LED chip is opened on the insulating substrate. Then, the LED chip is arranged in the opening, and a distance is formed between the electrode of the LED chip and the metal substrate. Then, a fluorescent adhesive film is used to package the LED chip, the insulating substrate and the metal substrate, so that the bottom surface of the electrode of the LED chip and the bottom surface of the metal substrate are exposed, and finally, it is cut into a single CSP lamp bead packaging structure.

[0005] In combination with the above technical solutions, it is found that there is a technical solution for welding and packaging of LED lamp beads. When performing welding and packaging operations, due to the diversity of LED lamp beads and the fixed operation of welding and packaging equipment, the flexibility and adaptability of LED lamp beads during welding and packaging are poor, which affects the processing flow of LED lamp beads and ultimately affects the use of LED lamp beads. Summary of the invention

[0006] In view of the deficiencies in the prior art, the present invention provides an automatic welding packaging control method and system for LED lamp bead processing, which can effectively solve the problems involved in the above-mentioned background technology.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: The first aspect of the present invention provides an automatic welding packaging control method for LED lamp bead processing, including: welding adaptation temperature matching: the feeding component monitors the initial performance of the LED lamp bead, collects the initial performance monitoring data of the LED lamp bead, evaluates the initial performance indicators of the LED lamp bead, and matches the welding adaptation temperature of the LED lamp bead, so that the welding component automatically performs preheating control according to the welding adaptation temperature of the LED lamp bead; welding operation control: after the welding component preheats the welding temperature to the welding adaptation temperature of the LED lamp bead, the LED lamp bead is subjected to a preset welding operation to obtain the LED lamp bead. The welding data of each soldering point determines the welding quality evaluation value of each soldering point of the LED lamp bead, compares it with the predefined welding quality evaluation threshold, obtains the welding quality comparison result and determines whether to adjust the preset welding operation, thereby completing the welding control of the LED lamp bead; packaging operation control: the packaging component will perform the preset packaging operation on the LED lamp bead that has completed the welding operation, and perform packaging quality inspection on the LED lamp bead, evaluate the packaging quality index of the LED lamp bead, and perform packaging quality verification with the predefined packaging quality preset index, obtain the packaging quality verification result and determine whether to adjust the preset packaging operation, thereby completing the packaging control of the LED lamp bead.

[0008] As a further method, the initial performance indicators of the LED lamp beads are evaluated, and the specific evaluation process is as follows: the initial performance monitoring data of the LED lamp beads specifically include the initial light-emitting wavelength of the LED lamp beads, the average forward voltage of the LED lamp beads during the performance monitoring period, and the average reverse leakage current of the LED lamp beads during the performance monitoring period; obtaining the thickness of the chip where the LED lamp beads are located; obtaining the light-emitting wavelength reference value, the forward voltage adaptation average, the reverse leakage current definition average, and the chip adaptation thickness from the LED lamp bead processing management library; comprehensively analyzing the initial light-emitting wavelength of the LED lamp beads, the average forward voltage of the LED lamp beads during the performance monitoring period, the average reverse leakage current of the LED lamp beads during the performance monitoring period, and the thickness of the chip where the LED lamp beads are located to obtain the initial performance indicators of the LED lamp beads.

[0009] As a further method, the welding quality evaluation value of each solder joint of the LED lamp bead is determined, and the specific determination process is as follows: the welding data of each solder joint of the LED lamp bead specifically includes the actual welding temperature of each solder joint of the LED lamp bead during each welding in the welding cycle, the welding pressure of each solder joint of the LED lamp bead during each welding in the welding cycle, and the welding time of each solder joint of the LED lamp bead during each welding in the welding cycle; the environmental data of the welding area is obtained, specifically including the real-time environmental temperature of the welding area during the welding cycle and the real-time environmental humidity of the welding area during the welding cycle; and the environmental data of the welding area is extracted from the LED lamp bead processing management library. The actual welding adaptation temperature, welding reference time, welding reference pressure, welding environment adaptation temperature and welding environment adaptation humidity are obtained; the actual welding temperature of each soldering point of the LED lamp bead during each welding in the welding cycle, the welding pressure of each soldering point of the LED lamp bead during each welding in the welding cycle, the welding time of each soldering point of the LED lamp bead during each welding in the welding cycle, the real-time ambient temperature of the welding area during the welding cycle, the real-time ambient humidity of the welding area during the welding cycle and the initial performance indicators of the LED lamp bead are comprehensively analyzed to obtain the welding quality evaluation value of each soldering point of the LED lamp bead. The specific method is as follows: In the formula, is the welding quality evaluation value of the dth solder joint of the LED lamp bead, d is the number of each solder joint, , D is the total amount of solder joints, is the actual welding temperature of the dth solder joint of the LED lamp bead at the fth welding time point t, f is the number of each welding, , F is the total number of welding times, t is the time variable, , is the welding start time point, is the welding end time point, To adapt the temperature to the actual welding, is the welding time of the dth solder joint of the LED lamp bead at the fth welding time point t, For welding reference time, is the welding pressure of the dth solder joint of the LED lamp bead during the fth welding at welding time point t, is the welding reference pressure, is the real-time ambient temperature of the welding area at welding time point t, Adapt the temperature to the welding environment. is the real-time ambient humidity of the welding area at welding time point t, Adapt humidity to the welding environment, It is the initial performance index of LED lamp beads. It is the welding quality influencing parameter corresponding to the initial performance index predefined in the LED lamp bead processing management library.

[0010] As a further method, the preset welding operation is adjusted, and the specific adjustment process is: the welding quality assessment value of the solder joint of the LED lamp bead is verified with a predefined second welding quality assessment threshold; if the welding quality assessment value of the solder joint of the LED lamp bead is greater than or equal to the second welding quality assessment threshold, an optimization adjustment plan is executed for the preset welding operation; if the welding quality assessment value of the solder joint of the LED lamp bead is less than the second welding quality assessment threshold, an emergency adjustment plan is executed for the preset welding operation.

[0011] As a further method, the packaging quality index of the LED lamp beads is evaluated, and the specific evaluation process is to obtain the packaging quality inspection data of the LED lamp beads by performing packaging quality inspection on the LED lamp beads, specifically including the packaging curing time of the LED lamp beads during the packaging cycle, the amount of packaging glue used in the LED lamp beads during the packaging cycle, and the average packaging curing speed of the LED lamp beads during the packaging cycle; obtain the maximum value of the ambient temperature of the packaging area during the packaging cycle and the maximum value of the ambient humidity of the packaging area during the packaging cycle; match the average forward voltage of the LED lamp beads during the performance monitoring cycle with the packaging curing reference time corresponding to each predefined forward voltage mean interval, thereby matching to obtain the packaging curing reference time of the LED lamp beads; and match the average forward voltage of the LED lamp beads during the performance monitoring cycle with the packaging curing reference time corresponding to each predefined forward voltage mean interval. The mean value of reverse leakage current in the measurement cycle is matched with the average adaptation speed of package curing corresponding to each predefined reverse leakage current mean interval, so as to obtain the average adaptation speed of package curing of LED lamp beads; the reference amount of packaging glue, the maximum adaptation temperature of the packaging environment and the maximum adaptation humidity of the packaging environment are obtained from the LED lamp bead processing management library; the package curing time of LED lamp beads in the packaging cycle, the amount of packaging glue of LED lamp beads in the packaging cycle, the average package curing speed of LED lamp beads in the packaging cycle, the welding quality evaluation value of each solder joint of LED lamp beads, the maximum ambient temperature of the packaging area in the packaging cycle and the maximum ambient humidity of the packaging area in the packaging cycle are comprehensively analyzed to obtain the packaging quality index of LED lamp beads.

[0012] As a further method, the packaging quality verification result is obtained and it is determined whether to adjust the preset packaging operation. The specific determination process is: the packaging quality verification result is the first packaging quality verification result or the second packaging quality verification result; the first packaging quality verification result is specifically that the packaging quality index of the LED lamp bead is greater than or equal to the preset packaging quality index; the second packaging quality verification result is specifically that the packaging quality index of the LED lamp bead is less than the preset packaging quality index; if the packaging quality verification result shows the first packaging quality verification result, there is no need to adjust the preset packaging operation; if the packaging quality verification result shows the second packaging quality verification result, it is necessary to adjust the preset packaging operation.

[0013] The second aspect of the present invention provides an automatic welding packaging control system for LED lamp bead processing, including: a welding adaptation temperature matching module, which is used for a feeding component to monitor the initial performance of LED lamp beads, collect initial performance monitoring data of LED lamp beads, evaluate the initial performance index of LED lamp beads, and match the welding adaptation temperature of LED lamp beads, so that the welding component automatically performs preheating control according to the welding adaptation temperature of LED lamp beads; a welding operation control module, which is used for the welding component to preheat the welding temperature to the welding adaptation temperature of LED lamp beads, perform a preset welding operation on the LED lamp beads, obtain welding data of each welding point of LED lamp beads, and judge The welding quality evaluation value of each soldering point of the LED lamp bead is determined, and compared with the predefined welding quality evaluation threshold value, the welding quality comparison result is obtained and it is determined whether to adjust the preset welding operation, thereby completing the welding control of the LED lamp bead; the packaging operation control module is used for the packaging component to perform the preset packaging operation on the LED lamp bead that has completed the welding operation, and to perform packaging quality detection on the LED lamp bead, evaluate the packaging quality index of the LED lamp bead, and perform packaging quality verification with the predefined packaging quality preset index, obtain the packaging quality verification result and determine whether to adjust the preset packaging operation, thereby completing the packaging control of the LED lamp bead.

[0014] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects: (1) The present invention provides an automatic welding packaging control method and system for LED lamp bead processing. The feeding component monitors the initial performance of the LED lamp bead and collects data and evaluation indicators to match the welding adaptation temperature to ensure that the welding process is in a relatively ideal temperature condition from the beginning. The welding component performs preset welding after preheating, obtains welding data to determine the quality evaluation value, and compares it with the threshold to decide whether to adjust the welding operation, thereby controlling the welding process; then, the packaging component performs preset packaging and quality inspection on the LED lamp bead that has completed welding, evaluates the packaging quality index, and then verifies it with the preset index. According to the packaging quality verification result, it is determined whether to adjust the preset packaging operation, thereby realizing the control of the LED lamp bead processing and packaging process, improving the production efficiency of the LED lamp bead, and ensuring the adaptability of the welding packaging equipment.

[0015] (2) The present invention evaluates the initial performance indicators of LED lamp beads and provides the most suitable preheating temperature according to the specific characteristics of the LED lamp beads. As a result, the welding assembly automatically controls the preheating operation according to the welding adaptation temperature of the LED lamp beads, so that the welding assembly can adapt well to the diversity of LED lamp beads and ensure that LED lamp beads with different characteristics can obtain high-quality welding effects.

[0016] (3) The present invention determines whether to adjust the preset welding operation and the preset packaging operation by determining the welding quality evaluation value of each solder joint of the LED lamp bead and the packaging quality index of the LED lamp bead. It can formulate personalized welding quality control strategies and packaging quality control strategies for different types of LED lamp beads. At the same time, through the evaluation and adjustment of the welding quality and packaging quality, the welding parameters, such as welding temperature and duration, can be optimized without changing the basic structure of the equipment, so that the fixed equipment can effectively respond to the changes of the LED lamp bead and improve the adaptability of the equipment to various welding packaging conditions, thereby controlling the welding packaging of the LED lamp bead processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0018] Figure 1 The figure is a schematic flow chart of the method steps of the present invention.

[0019] Figure 2 It is a schematic diagram of system module connection of the present invention. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0021] Reference Figure 1 As shown, the first aspect of the present invention provides an automatic welding packaging control method for LED lamp bead processing, including: welding adaptation temperature matching: the feeding component monitors the initial performance of the LED lamp bead, collects the initial performance monitoring data of the LED lamp bead, evaluates the initial performance indicators of the LED lamp bead, and matches the welding adaptation temperature of the LED lamp bead, thereby automatically performing preheating control according to the welding adaptation temperature of the LED lamp bead.

[0022] It needs to be explained that when processing new LED lamp beads, it is necessary to determine the optimal welding and packaging process and suitable welding components and packaging components. In this embodiment, the welding data of each welding point is recorded and the welding quality evaluation value is calculated to evaluate the applicability of the welding component to the LED lamp beads, thereby providing a basis for determining suitable welding processes and components for the LED lamp beads; similarly, in order to improve the packaging quality of LED lamp beads, when packaging new LED lamp beads, it is necessary to test their applicability before processing, so as to determine the applicability of new packaging processes and existing packaging components. In summary, this embodiment is used for adaptive adjustment of welding operations and packaging operations and parameter control of corresponding components, that is, the LED lamp beads involved in this embodiment are all test products.

[0023] The above-mentioned feeding assembly is a device used to transport LED lamp beads on the LED lamp bead processing production line, and to monitor and collect data on their initial performance during the transportation process. It is the starting part of the entire production process. Its main function is to ensure that the LED lamp beads can enter the welding station accurately and orderly, and obtain initial performance information that is crucial to subsequent welding operations in this process.

[0024] Specifically, the initial performance indicators of the LED lamp beads are evaluated in the following specific evaluation process: The initial performance monitoring data of the LED lamp bead specifically includes the initial light emission wavelength of the LED lamp bead, the average forward voltage of the LED lamp bead during the performance monitoring period, and the average reverse leakage current of the LED lamp bead during the performance monitoring period.

[0025] The above-mentioned performance monitoring cycle refers to the period of time during which the feeding component performs initial performance monitoring on the LED lamp beads. The performance monitoring cycle is determined by the welding packaging control personnel based on a comprehensive analysis of factors such as the initial state of the LED lamp beads, the performance of the feeding component, and actual monitoring needs.

[0026] The above initial performance monitoring data can be extracted from the monitoring report of the feeding component.

[0027] Get the thickness of the chip where the LED lamp bead is located, where the thickness of the chip can be measured using a ruler.

[0028] Obtain the luminous wavelength reference value, forward voltage adaptation mean value, reverse leakage current definition mean value and chip adaptation thickness from the LED lamp bead processing management library.

[0029] The initial light emission wavelength of the LED lamp bead, the average forward voltage of the LED lamp bead during the performance monitoring period, the average reverse leakage current of the LED lamp bead during the performance monitoring period, and the thickness of the chip where the LED lamp bead is located are comprehensively analyzed to obtain the initial performance index of the LED lamp bead. The specific method is as follows: In the formula, It is the initial performance index of LED lamp beads. is the initial emission wavelength of the LED lamp bead, is the reference value of the emission wavelength, is the average forward voltage of the LED lamp bead during the performance monitoring period, is the forward voltage adaptation mean value, is the average reverse leakage current of the LED lamp bead during the performance monitoring period, Defines the mean value for the reverse leakage current, is the thickness of the chip where the LED lamp bead is located, is the chip adaptation thickness, and e is a natural constant.

[0030] In this embodiment, the initial performance index of the LED lamp bead is expressed as a numerical value for a comprehensive evaluation of the initial performance of the LED lamp bead before welding and subsequent packaging operations. The larger the initial performance index, the better the initial performance of the LED lamp bead, and the easier it is to maintain stability in subsequent operations to achieve the expected welding and packaging effects.

[0031] It should be explained that the above-mentioned initial emission wavelength refers to the peak wavelength of the LED lamp bead during the initial performance monitoring, which is measured in nanometers (nm). It determines the color of the light. Different wavelength ranges correspond to different colors. For example, light with a wavelength between 620-760nm is red, and 492-577nm is green. The emission wavelength is usually expressed by a specific wavelength value; the emission wavelength reference value refers to the adaptation value corresponding to the pre-set emission wavelength; the forward voltage mean refers to the voltage required to make the current pass through the LED lamp bead when it is in the forward conduction state during the performance monitoring cycle. , the unit is volt (V); the forward voltage adaptation mean refers to the reference mean corresponding to the pre-set forward voltage; the reverse leakage current mean refers to the weak current flowing through the LED lamp bead when the reverse voltage is applied during the performance monitoring period, and the unit is microampere (μA). The smaller the reverse leakage current, the better the quality and reverse voltage resistance performance of the lamp bead; the reverse leakage current definition mean refers to the maximum value corresponding to the predefined reverse leakage current mean; the thickness of the chip refers to the longitudinal length part of the physical size of the chip where the LED lamp bead is located; the chip adaptation thickness refers to the reference value corresponding to the predefined chip thickness.

[0032] In this embodiment, the light emission of the LED is generated by the recombination of electrons and holes, and the forward voltage determines the energy injected by electrons and holes. When the forward voltage changes, it will affect the energy state of the electron-hole recombination. For LED lamp beads with different wavelengths, the forward voltage is different. When the forward voltage of the lamp bead is large and approaches the set adaptation value, it will bring higher energy to the electron transition, so that the light emission wavelength of the LED lamp bead is easier to approach the set reference wavelength, thereby increasing the performance of the LED lamp bead and improving its stability; and when the forward voltage is in a reasonable range, that is, closer to the adaptation value, the lamp bead The internal PN junction is in the forward conduction state, which reduces the reverse leakage current. If there are defects in the PN junction inside the lamp bead, such as lattice defects or uneven impurity diffusion, the reverse leakage current will increase, so that the forward voltage will deviate from the normal range, reducing the performance and stability of the lamp bead. In addition, thinner or thicker chip thickness will have a negative impact on the performance of the lamp bead. Thinner chips are more susceptible to electric field penetration when reverse biased, which reduces the performance of the lamp bead. Thicker chips may also cause local electric field concentration, thereby increasing local reverse leakage current and also reducing the performance of the LED lamp bead.

[0033] Furthermore, the matching obtains the welding adaptation temperature of the LED lamp bead, and the specific matching process is: The initial performance indicators of LED lamp beads are matched with the welding adaptation temperatures corresponding to each initial performance indicator interval predefined in the LED lamp bead processing management library. The specific matching process is: extracting the mapping set between the initial performance indicators of LED lamp beads and the welding adaptation temperature from the LED lamp bead processing management library, determining the interval to which the initial performance indicators of LED lamp beads belong, and assigning the welding adaptation temperature of the interval to the LED lamp beads corresponding to the initial performance indicators, so as to match the welding adaptation temperature of the LED lamp beads.

[0034] Welding operation control: After the welding component preheats the welding temperature to the welding adaptation temperature of the LED lamp beads, it performs a preset welding operation on the LED lamp beads, obtains the welding data of each soldering point of the LED lamp beads, determines the welding quality evaluation value of each soldering point of the LED lamp beads, and compares it with the predefined welding quality evaluation threshold to obtain the welding quality comparison result and determine whether to adjust the preset welding operation, thereby completing the welding control of the LED lamp beads.

[0035] The above-mentioned welding assembly is a collection of devices used to perform welding operations during the processing of LED lamp beads. Its main function is to weld the LED lamp beads according to preset welding parameters and procedures after preheating the welding temperature to the adaptation temperature, ensuring that the quality of the solder joints meets the requirements and that the various components of the LED lamp beads (such as chip pins and brackets) form good electrical and mechanical connections.

[0036] Specifically, the welding quality evaluation value of each solder joint of the LED lamp bead is determined by: The welding data of each soldering point of the LED lamp bead specifically includes the actual welding temperature of each soldering point of the LED lamp bead during each welding in the welding cycle, the welding pressure of each soldering point of the LED lamp bead during each welding in the welding cycle, and the welding time of each soldering point of the LED lamp bead during each welding in the welding cycle.

[0037] The above-mentioned welding cycle refers to the execution time of the welding component for performing the preset welding operation on the LED lamp beads, which starts from the time when the welding component starts to perform the preset welding operation on the first welding point to the time when the welding component completes the preset welding operation on the last welding point.

[0038] The above welding data can be extracted from the welding execution report of the welded assembly.

[0039] The environmental data of the welding area is obtained, specifically including the real-time environmental temperature of the welding area during the welding cycle and the real-time environmental humidity of the welding area during the welding cycle.

[0040] The above-mentioned ambient temperature can be monitored by a temperature sensor, and the ambient humidity can be monitored by a humidity sensor.

[0041] The actual welding adaptation temperature, welding reference time, welding reference pressure, welding environment adaptation temperature and welding environment adaptation humidity are extracted from the LED lamp bead processing management library.

[0042] The actual welding temperature of each soldering point of the LED lamp bead during each welding in the welding cycle, the welding pressure of each soldering point of the LED lamp bead during each welding in the welding cycle, the welding time of each soldering point of the LED lamp bead during each welding in the welding cycle, the real-time ambient temperature of the welding area during the welding cycle, the real-time ambient humidity of the welding area during the welding cycle, and the initial performance indicators of the LED lamp bead are comprehensively analyzed to obtain the welding quality evaluation value of each soldering point of the LED lamp bead. The specific method is as follows: In the formula, is the welding quality evaluation value of the dth solder joint of the LED lamp bead, d is the number of each solder joint, , D is the total amount of solder joints, is the actual welding temperature of the dth solder joint of the LED lamp bead at the fth welding time point t, f is the number of each welding, , F is the total number of welding times, t is the time variable, , is the welding start time point, is the welding end time point, To adapt the temperature to the actual welding, is the welding time of the dth solder joint of the LED lamp bead at the fth welding time point t, For welding reference time, is the welding pressure of the dth solder joint of the LED lamp bead during the fth welding at welding time point t, is the welding reference pressure, is the real-time ambient temperature of the welding area at welding time point t, Adapt the temperature to the welding environment. is the real-time ambient humidity of the welding area at welding time point t, Adapt humidity to the welding environment, It is the initial performance index of LED lamp beads. It is the welding quality influencing parameter corresponding to the initial performance index predefined in the LED lamp bead processing management library.

[0043] The above-mentioned initial performance indicators of the LED lamp beads are obtained by comprehensive analysis of the initial light-emitting wavelength of the LED lamp beads, the average forward voltage of the LED lamp beads during the performance monitoring period, the average reverse leakage current of the LED lamp beads during the performance monitoring period, and the thickness of the chip where the LED lamp beads are located.

[0044] In this embodiment, the welding quality evaluation value of each solder joint of the LED lamp bead is used to measure the execution quality of the welding component for the preset welding operation. The larger the welding quality evaluation value of each solder joint, the better the application effect of the preset welding operation on the LED lamp bead in this embodiment.

[0045] It should be explained that the above-mentioned actual welding temperature refers to the temperature change actually experienced by each solder point on the LED lamp bead during the entire welding cycle, each time the welding operation is performed; the actual welding adaptation temperature refers to the reference value corresponding to the predefined actual welding temperature; the welding time refers to the time from the beginning of contact between the welding component and the solder point to the time when the welding component leaves the solder point, for each solder point on the lamp bead during the entire welding operation cycle; the welding reference time refers to the standard value corresponding to the pre-set welding time; the welding pressure refers to the welding pressure of each solder point on the lamp bead during the entire welding operation cycle, each time the welding action is performed. The magnitude of the force applied by the component to the surface of the solder joint; welding reference pressure refers to the standard value corresponding to the pre-set welding pressure; real-time ambient temperature refers to the real-time temperature conditions around the specific area where the LED lamp beads are welded, from the start of welding to the end of welding. This temperature changes dynamically and will affect the welding process; welding environment adaptation temperature refers to the reference value corresponding to the pre-defined welding environment temperature; real-time ambient humidity refers to the real-time humidity conditions around the specific area where the LED lamp beads are welded, from the start of welding to the end of welding; welding environment adaptation humidity refers to the reference value corresponding to the pre-defined welding environment humidity.

[0046] The welding quality influencing parameters corresponding to the initial performance indicators are extracted from the LED lamp bead processing management library. In the LED lamp bead processing management library, there is a specific mapping relationship between the initial performance indicators and the welding quality influencing parameters. This mapping relationship can be in a one-to-one or many-to-one form. For example, by substituting the initial performance indicators detected in real time into the mapping set, the corresponding welding quality influencing parameters can be obtained. In this process, the initial performance indicators are used as input and the welding quality influencing parameters are used as output. The connection between the two is established through the mapping set. In this embodiment, the value range of the welding quality influencing parameters corresponding to the initial performance indicators is (0, 1).

[0047] In this embodiment, the welding time directly affects the actual welding temperature. During the welding process, the welding component transfers heat to the welding point. As time goes by, the heat absorbed by the welding point increases, and the actual welding temperature gradually rises. If the welding time continues to increase and deviates from the reference time, the actual welding temperature will also deviate from the adaptation temperature, so that the welding quality is greatly reduced; the welding pressure will affect the heat transfer efficiency, thereby affecting the actual welding temperature. The pressure close to the reference value can make the contact between the welding component and the welding point closer, and the heat transfer is more efficient, so that the actual welding temperature can reach the adaptation value faster, thereby increasing the quality of this welding; the real-time ambient temperature The temperature and humidity of the real-time environment are too high or too low, which will have a negative impact on the welding process. Under higher ambient temperature, the heat dissipation of the solder joint is relatively slow, and the heat transferred to the solder joint by the welding tool is more likely to accumulate, making the actual welding temperature more likely to increase, thereby deviating from the adaptation temperature to a large extent, reducing the welding quality. The lowered real-time ambient temperature is likely to cause the heat transferred to the solder joint by the welding tool to dissipate, so that the solder joint cannot reach the required temperature, which also affects the welding quality. In a high humidity environment, the welding area is more prone to oxidation, and the oxide layer will affect the heat transfer, so that the actual welding temperature required to achieve the same welding quality may increase, thereby having a negative impact on the welding quality.

[0048] In this embodiment, the larger the initial performance index of the LED lamp bead is, the better the consistency of the initial light emission wavelength of the LED lamp bead is. During welding, the thermal response of each part of the lamp bead is relatively more uniform, which helps to ensure that each solder joint is formed in a similar thermal environment, thereby improving the consistency of solder joint quality and reducing solder joint defects caused by local temperature differences, such as some solder joints are cold while other solder joints are normal; and the larger the initial performance index of the LED lamp bead is, the more the forward voltage is within a reasonable range and stable, the PN junction characteristics of the chip are good, and the impurity concentration and distribution are reasonable. During the welding process, this stable PN junction can better withstand the electric field changes and thermal shock during the welding process, improve the long-term reliability of the solder joint, and increase the welding quality.

[0049] Furthermore, the welding quality comparison result is obtained and it is determined whether to adjust the preset welding operation. The specific determination process is as follows: The welding quality comparison result is a first welding quality comparison result or a second welding quality comparison result.

[0050] The first welding quality comparison result, specifically the welding quality assessment value of each solder joint of the LED lamp bead, is greater than or equal to the welding quality assessment threshold predefined in the LED lamp bead processing management library.

[0051] The second welding quality comparison result is specifically that a welding quality evaluation value of a certain welding point of the LED lamp bead is less than a welding quality evaluation threshold.

[0052] If the welding quality comparison result is displayed as the first welding quality comparison result, there is no need to adjust the preset welding operation, and the preset packaging operation is directly performed.

[0053] If the welding quality comparison result is displayed as the second welding quality comparison result, the preset welding operation needs to be adjusted.

[0054] Specifically, the preset welding operation is adjusted, and the specific adjustment process is: The welding quality assessment value of the solder joint of the LED lamp bead is verified with the second welding quality assessment threshold predefined in the LED lamp bead processing management library. If the welding quality assessment value of the solder joint of the LED lamp bead is greater than or equal to the second welding quality assessment threshold, the optimization adjustment plan is executed for the preset welding operation. If the welding quality assessment value of the solder joint of the LED lamp bead is less than the second welding quality assessment threshold, the emergency adjustment plan is executed for the preset welding operation.

[0055] It should be explained that the second welding quality assessment threshold is smaller than the welding quality assessment threshold.

[0056] The above optimization and adjustment plan specifically checks the quality and composition of the solder. If there are too many impurities in the solder, it may affect the quality of the solder joint. For example, the oxide in the solder will reduce the fluidity of the solder and cause a cold solder joint. If it is a slight cold solder joint, that is, only part of the solder joint is not completely fused, and other parts of the LED lamp bead, such as the chip, bracket, etc. are not damaged, you can try to repair the soldering in this case; check whether the flux is invalid or insufficient, if so, you need to reapply an appropriate amount of flux; check whether the welding head of the welding component is worn, and the worn welding head will affect the heat transfer and welding accuracy; check the temperature and humidity of the welding environment. If the ambient temperature is too low or too high, the fluidity of the solder will deteriorate; if the humidity is too high or too low, it is easy to cause oxidation or loosening of the welding area.

[0057] It should be explained that the welding quality assessment value of the soldering point of the LED lamp bead applied to the above-mentioned optimization and adjustment plan is slightly smaller than the welding quality assessment threshold, but greater than or equal to the second welding quality assessment threshold, which means that the soldering point of the LED lamp bead can be re-welded and then packaged, and the LED lamp bead test product can continue to be used.

[0058] The above emergency adjustment plan is that if there is a large cold solder joint, it may be that the welding temperature is too low. At this time, the welding temperature can be appropriately increased. On the contrary, if the solder joint is overburned (excessive solder flow, irregular solder joint shape), it is likely that the welding temperature is too high and the welding temperature needs to be lowered; when a cold solder joint occurs, in addition to considering temperature factors, insufficient welding time may also be one of the reasons, and the welding time can be appropriately extended; if the solder joint is not full, it may be that the welding pressure is insufficient. The welding pressure can be increased by adjusting the pressure parameters of the robotic arm of the welding equipment to make the solder fill the solder better. If there are problems with the quality of multiple solder joints, it may be stress concentration caused by unreasonable welding sequence. Re-evaluate the welding sequence and try to use symmetrical welding or dispersed welding to reduce the thermal stress and mechanical stress generated during the welding process.

[0059] It should be explained that the welding quality assessment value of the soldering point of the LED lamp bead applied in the above emergency adjustment plan is far less than the welding quality assessment threshold, and is less than the second welding quality assessment threshold, which means that the soldering point of the LED lamp bead can no longer be welded again. At this time, the LED lamp bead test product can no longer be used and is scrapped. The corresponding parameters of the welding components are adjusted based on the welding data of the LED lamp bead test product, and the second LED lamp bead test product is welded and packaged.

[0060] Packaging operation control: The packaging component will perform preset packaging operations on the LED lamp beads that have completed the welding operation, and perform packaging quality inspection on the LED lamp beads, evaluate the packaging quality index of the LED lamp beads, and perform packaging quality verification with the predefined packaging quality preset index, obtain the packaging quality verification result and determine whether to adjust the preset packaging operation, thereby completing the packaging control of the LED lamp beads.

[0061] The above-mentioned packaging assembly is a collection of a series of devices used to perform packaging operations and packaging quality inspection on the LED lamp beads after welding during the processing of LED lamp beads. Its main function is to protect the LED lamp beads and chips from the external environment through a preset packaging process, while optimizing the luminous effect of the LED lamp beads and performing quality inspection on the packaged lamp beads to ensure that the packaging meets the requirements.

[0062] Furthermore, the specific evaluation process of evaluating the packaging quality index of the LED lamp beads is as follows: By performing packaging quality inspection on LED lamp beads, the packaging quality inspection data of the LED lamp beads are obtained, including the packaging curing time of the LED lamp beads during the packaging cycle, the amount of packaging glue used in the LED lamp beads during the packaging cycle, and the average packaging curing speed of the LED lamp beads during the packaging cycle.

[0063] The above-mentioned packaging cycle refers to the period of time that the packaging component performs the preset packaging operation on the LED lamp beads, starting from the dispensing of glue by the packaging component on the LED lamp beads to the completion of the curing of the LED lamp beads.

[0064] The above packaging quality inspection data can be extracted from the execution report of the packaging component.

[0065] The maximum value of the ambient temperature of the packaging area during the packaging cycle and the maximum value of the ambient humidity of the packaging area during the packaging cycle are obtained.

[0066] The above-mentioned ambient temperature can be monitored by a temperature sensor, and the ambient humidity can be monitored by a humidity sensor.

[0067] The average forward voltage of the LED lamp beads within the performance monitoring period is matched with the package curing reference time corresponding to each forward voltage average interval predefined in the LED lamp bead processing management library. The specific matching process is: obtain the mapping set between the average forward voltage of the LED lamp beads within the performance monitoring period and the package curing reference time from the LED lamp bead processing management library, determine the interval to which the average forward voltage of the LED lamp beads within the performance monitoring period belongs, and assign the package curing reference time corresponding to the interval to the LED lamp beads corresponding to the forward voltage average, so as to match and obtain the package curing reference time of the LED lamp beads.

[0068] The mean reverse leakage current of the LED lamp bead within the performance monitoring period is matched with the average adaptation speed of the package curing corresponding to each reverse leakage current mean interval predefined in the LED lamp bead processing management library. The specific matching process is: obtain the mapping set between the mean reverse leakage current of the LED lamp bead within the performance monitoring period and the average adaptation speed of the package curing from the LED lamp bead processing management library, determine the interval to which the mean reverse leakage current of the LED lamp bead within the performance monitoring period belongs, and assign the average adaptation speed of the package curing corresponding to the interval to the LED lamp bead corresponding to the mean reverse leakage current, so as to match the average adaptation speed of the package curing of the LED lamp bead.

[0069] The reference amount of packaging glue, the maximum value of the packaging environment adaptation temperature, and the maximum value of the packaging environment adaptation humidity are obtained from the LED lamp bead processing management library.

[0070] The LED lamp bead packaging quality index is obtained by comprehensively analyzing the packaging curing time of the LED lamp bead during the packaging cycle, the amount of packaging glue used in the LED lamp bead during the packaging cycle, the average packaging curing speed of the LED lamp bead during the packaging cycle, the welding quality evaluation value of each solder joint of the LED lamp bead, the maximum ambient temperature of the packaging area during the packaging cycle, and the maximum ambient humidity of the packaging area during the packaging cycle. The specific analysis process is as follows: In the formula, It is the packaging quality index of LED lamp beads. It is the packaging curing time of LED lamp beads during the packaging cycle. The reference time for the LED lamp bead encapsulation curing is The amount of packaging glue used during the packaging cycle of the LED lamp bead. Reference dosage for packaging glue: It is the average package curing speed of LED lamp beads during the packaging cycle. The average adaptation speed for LED lamp bead encapsulation curing, is the maximum value of the ambient temperature of the packaging area during the packaging cycle, max represents the maximum value, To adapt the maximum temperature of the packaging environment, is the maximum value of the ambient humidity in the packaging area during the packaging cycle, Adapt the maximum humidity value for the packaging environment. is the welding quality evaluation value of the dth solder joint of the LED lamp bead, d is the number of each solder joint, , D is the total amount of solder joints, It is the packaging quality influencing parameter corresponding to the welding quality assessment mean value predefined in the LED lamp bead processing management library.

[0071] The welding quality evaluation value of each solder joint of the above-mentioned LED lamp beads is obtained by comprehensively analyzing the actual welding temperature of each solder joint of the LED lamp beads during each welding in the welding cycle, the welding pressure of each solder joint of the LED lamp beads during each welding in the welding cycle, the welding time of each solder joint of the LED lamp beads during each welding in the welding cycle, the real-time ambient temperature of the welding area during the welding cycle, the real-time ambient humidity of the welding area during the welding cycle and the initial performance indicators of the LED lamp beads.

[0072] The packaging quality index of the LED lamp bead in this embodiment is used to measure the execution quality of the packaging component for the preset packaging operation. The larger the packaging quality index, the better the application effect of the preset packaging operation on the LED lamp bead in this embodiment.

[0073] It should be explained that the above-mentioned encapsulation curing time refers to the time from the coating of the encapsulation glue around the LED lamp bead chip during the encapsulation cycle to the time when the encapsulation glue reaches the final stable solid form through chemical reaction or physical process, such as heating curing, ultraviolet curing, etc.; the encapsulation curing reference time refers to the predefined adaptation time corresponding to the encapsulation curing; the encapsulation glue dosage refers to the volume of encapsulation glue used in the process of encapsulating the LED lamp bead during the encapsulation cycle; the encapsulation glue reference dosage refers to the predefined adaptation dosage corresponding to the encapsulation glue; the average encapsulation curing speed refers to the time it takes for the encapsulation glue to change from liquid to solid during the encapsulation cycle. The average value of the degree of curing per unit time during the curing process reflects the overall curing speed of the encapsulation glue during the entire curing stage; the average adaptation speed of encapsulation curing refers to the reference value corresponding to the pre-set average speed of encapsulation curing; the maximum ambient temperature refers to the highest temperature reached by the surrounding environment of the encapsulation area during the encapsulation cycle; the maximum adaptation temperature of the encapsulation environment refers to the reference maximum value corresponding to the pre-set encapsulation ambient temperature; the maximum ambient humidity refers to the highest humidity reached by the surrounding environment of the encapsulation area during the encapsulation cycle; the maximum adaptation humidity of the encapsulation environment refers to the reference maximum value corresponding to the pre-set encapsulation ambient humidity.

[0074] The packaging quality influencing parameters corresponding to the welding quality assessment mean are extracted from the LED lamp bead processing management library. In the LED lamp bead processing management library, there is a specific mapping relationship between the welding quality assessment mean and the packaging quality influencing parameters. This mapping relationship can be in a one-to-one or many-to-one form. For example, by substituting the real-time detected welding quality assessment mean into the mapping set, the corresponding packaging quality influencing parameters can be obtained. In this process, the welding quality assessment mean is used as input and the packaging quality influencing parameters are used as output. The connection between the two is established through the mapping set. In this embodiment, the value range of the packaging quality influencing parameters corresponding to the welding quality assessment mean is (0, 1).

[0075] In this embodiment, the amount of packaging glue used will affect the packaging curing time. Under the same other conditions, such as ambient temperature, curing speed and other conditions, the greater the amount of packaging glue used, the longer the curing time required. Therefore, when the amount of packaging glue is within a reasonable range, that is, closer to the reference amount, the packaging curing time will also be close to the reference time, so that the packaging quality is in the best state and the welding quality index is improved; the average packaging curing speed directly determines the packaging curing time, and there is an inverse relationship between them, that is, the faster the average curing speed, the shorter the curing time. Similarly, within a reasonable range, the closer the packaging curing speed is to the adaptation speed, the curing time is in the best state, so as to increase the packaging quality; a higher maximum ambient temperature usually accelerates the curing reaction of the packaging glue, thereby shortening the curing time, but if the maximum ambient temperature is too high and greater than the adaptation value, it may cause the packaging glue to have excessive thermal expansion, which has a negative impact on the packaging quality; an appropriate maximum ambient humidity can promote the curing reaction, shorten the curing time, and make it close to the reference time. If the humidity is too high and greater than the adaptation value, it may have a negative impact on the curing, causing the curing time to deviate from the reference value or even fail to cure normally, which may greatly reduce the packaging quality.

[0076] In this embodiment, the greater the welding quality evaluation value of each solder joint of the LED lamp bead, the stronger the welding between the LED lamp bead and the chip. During the packaging process, the firm solder joint can better withstand the packaging pressure, ensure the accurate position of the lamp bead in the packaging shell, and is conducive to the improvement of the packaging quality index; the solder joint with high welding quality can provide a better heat conduction path. During packaging, good heat conduction helps to maintain the stability of the internal temperature of the lamp bead. For example, when the packaging glue is in the curing process, a stable temperature environment is conducive to its uniform curing, avoiding the degradation of the packaging glue performance due to local overheating or overcooling, thereby improving the packaging quality index.

[0077] Specifically, the packaging quality verification result is obtained and it is determined whether to adjust the preset packaging operation. The specific determination process is as follows: The packaging quality verification result is the first packaging quality verification result or the second packaging quality verification result.

[0078] The first packaging quality verification result is specifically that the packaging quality index of the LED lamp bead is greater than or equal to a packaging quality preset index predefined in the LED lamp bead processing management library.

[0079] The second packaging quality verification result is specifically that the packaging quality index of the LED lamp bead is less than a preset packaging quality index.

[0080] If the packaging quality verification result shows the first packaging quality verification result, there is no need to adjust the preset packaging operation. If the packaging quality verification result shows the second packaging quality verification result, the preset packaging operation needs to be adjusted.

[0081] Furthermore, the preset encapsulation operation is adjusted, and the specific adjustment process is as follows: The packaging quality index of the LED lamp bead is matched with the packaging operation adjustment plan corresponding to each packaging quality index interval predefined in the LED lamp bead processing management library. The specific matching process is: obtain the mapping set between the packaging quality index of the LED lamp bead and the packaging operation adjustment plan from the LED lamp bead processing management library, determine the specific interval of the packaging quality index of the LED lamp bead, and assign the packaging operation adjustment plan corresponding to the interval to the LED lamp bead corresponding to the packaging quality index, so as to match the packaging operation adjustment plan of the packaging component to which the LED lamp bead belongs, so as to adjust the preset packaging operation of the packaging component through the packaging operation adjustment plan.

[0082] The above adjustment plan specifically checks the parameter settings of the dispensing equipment, such as the size of the glue valve opening, the dispensing pressure and time, etc. If the amount of glue is insufficient due to improper setting of these parameters, corresponding adjustments need to be made, for example, appropriately increase the opening of the glue valve, or extend the dispensing time to ensure that there is enough glue for the next batch of lamp beads packaging; if there is excessive glue due to excessive dispensing pressure, too long dispensing time or failure of the glue valve control. Re-adjust the parameters of the dispensing equipment, reduce the dispensing pressure and time, and check the opening and closing of the glue valve to ensure the accuracy of the glue amount for the next packaging; if there is a deviation in the position of the packaging shell, it can be repositioned to the correct position and fixed through the automated robotic arm adjustment device.

[0083] It should be explained that the adjustment plan in this embodiment indicates that the packaging operation of the LED lamp beads has not met the quality requirements. After executing the adjustment plan, the packaging operation can be performed on the LED lamp beads. This is because the packaging operation will not damage the welding quality of the LED lamp beads, and the LED lamp beads can maintain good performance.

[0084] Reference Figure 2 As shown, the second aspect of the present invention provides an automatic welding packaging control system for LED lamp bead processing, including: a welding adaptation temperature matching module, a welding operation control module and a packaging operation control module.

[0085] The second aspect of the present invention provides an automatic welding packaging control system for LED lamp bead processing, which also includes: an LED lamp bead processing management library, which is used to store the reference value of the emission wavelength, the forward voltage adaptation mean, the reverse leakage current adaptation mean, the chip adaptation thickness, the actual welding adaptation temperature, the welding reference time, the welding reference pressure, the welding environment adaptation temperature, the welding environment adaptation humidity, the packaging glue reference dosage, the packaging environment adaptation temperature maximum value, the packaging environment adaptation humidity maximum value and the preset values ​​of various factors.

[0086] The welding adaptation temperature matching module is connected to the welding operation control module, the welding operation control module is connected to the packaging operation control module, and the welding adaptation temperature matching module, the welding operation control module and the packaging operation control module are all connected to the LED lamp bead processing management library.

[0087] The welding adaptation temperature matching module is used for the feeding component to monitor the initial performance of the LED lamp beads, collect the initial performance monitoring data of the LED lamp beads, evaluate the initial performance indicators of the LED lamp beads, and match the welding adaptation temperature of the LED lamp beads, so that the welding component automatically performs preheating control according to the welding adaptation temperature of the LED lamp beads.

[0088] The welding operation control module is used to perform a preset welding operation on the LED lamp beads after the welding component preheats the welding temperature to the welding adaptation temperature of the LED lamp beads, obtain the welding data of each soldering point of the LED lamp beads, determine the welding quality evaluation value of each soldering point of the LED lamp beads, compare it with the predefined welding quality evaluation threshold, obtain the welding quality comparison result and determine whether to adjust the preset welding operation, thereby completing the welding control of the LED lamp beads.

[0089] The packaging operation control module is used for the packaging component to perform a preset packaging operation on the LED lamp beads that have completed the welding operation, and to perform packaging quality inspection on the LED lamp beads, evaluate the packaging quality index of the LED lamp beads, and perform packaging quality verification with a predefined packaging quality preset index, obtain the packaging quality verification result and determine whether to adjust the preset packaging operation, thereby completing the packaging control of the LED lamp beads.

[0090] The above contents are merely examples and explanations of the structure of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the present invention, they should all fall within the protection scope of the present invention.

Claims

1. A method for controlling automatic welding and packaging for LED lamp bead processing, characterized in that: include: Welding adaptation temperature matching: The feeding component monitors the initial performance of the LED lamp beads, collects the initial performance monitoring data of the LED lamp beads, evaluates the initial performance indicators of the LED lamp beads, and matches the welding adaptation temperature of the LED lamp beads. Thus, the welding component automatically performs preheating control according to the welding adaptation temperature of the LED lamp beads; Welding operation control: After the welding component preheats the welding temperature to the welding adaptation temperature of the LED lamp bead, the preset welding operation is performed on the LED lamp bead, the welding data of each soldering point of the LED lamp bead is obtained, the welding quality evaluation value of each soldering point of the LED lamp bead is determined, and the welding quality evaluation value is compared with the predefined welding quality evaluation threshold value to obtain the welding quality comparison result and determine whether to adjust the preset welding operation, thereby completing the welding control of the LED lamp bead; Packaging operation control: The packaging component will perform preset packaging operations on the LED lamp beads that have completed the welding operation, and perform packaging quality inspection on the LED lamp beads, evaluate the packaging quality index of the LED lamp beads, and perform packaging quality verification with the predefined packaging quality preset index, obtain the packaging quality verification result and determine whether to adjust the preset packaging operation, thereby completing the packaging control of the LED lamp beads.

2. According to claim 1, an automatic welding packaging control method for LED lamp bead processing is characterized in that: The specific evaluation process of evaluating the initial performance indicators of LED lamp beads is as follows: The initial performance monitoring data of the LED lamp bead specifically includes the initial emission wavelength of the LED lamp bead, the average forward voltage of the LED lamp bead during the performance monitoring period, and the average reverse leakage current of the LED lamp bead during the performance monitoring period; Get the thickness of the chip where the LED lamp bead is located; Obtain the reference value of luminous wavelength, forward voltage adaptation mean value, reverse leakage current definition mean value and chip adaptation thickness from the LED lamp bead processing management library; The initial light emission wavelength of the LED lamp bead, the average forward voltage of the LED lamp bead during the performance monitoring period, the average reverse leakage current of the LED lamp bead during the performance monitoring period, and the thickness of the chip where the LED lamp bead is located are comprehensively analyzed to obtain the initial performance indicators of the LED lamp bead.

3. According to claim 2, an automatic welding packaging control method for LED lamp bead processing is characterized in that: The matching obtains the welding adaptation temperature of the LED lamp bead, and the specific matching process is: The initial performance indicators of LED lamp beads are matched with the welding adaptation temperatures corresponding to the predefined initial performance indicator intervals. The specific matching process is: extracting the mapping set between the initial performance indicators of LED lamp beads and the welding adaptation temperatures from the LED lamp bead processing management library, determining the interval to which the initial performance indicators of the LED lamp beads belong, and assigning the welding adaptation temperature of the interval to the LED lamp beads corresponding to the initial performance indicators, so as to match the welding adaptation temperature of the LED lamp beads.

4. According to claim 1, an automatic welding packaging control method for LED lamp bead processing is characterized in that: The specific determination process of determining the welding quality evaluation value of each solder joint of the LED lamp bead is as follows: The welding data of each solder joint of the LED lamp bead specifically includes the actual welding temperature of each solder joint of the LED lamp bead during each welding in the welding cycle, the welding pressure of each solder joint of the LED lamp bead during each welding in the welding cycle, and the welding time of each solder joint of the LED lamp bead during each welding in the welding cycle; Obtaining environmental data of the welding area, specifically including the real-time ambient temperature of the welding area during the welding cycle and the real-time ambient humidity of the welding area during the welding cycle; The actual welding adaptation temperature, welding reference time, welding reference pressure, welding environment adaptation temperature and welding environment adaptation humidity are extracted from the LED lamp bead processing management library; The actual welding temperature of each soldering point of the LED lamp bead during each welding in the welding cycle, the welding pressure of each soldering point of the LED lamp bead during each welding in the welding cycle, the welding time of each soldering point of the LED lamp bead during each welding in the welding cycle, the real-time ambient temperature of the welding area during the welding cycle, the real-time ambient humidity of the welding area during the welding cycle, and the initial performance indicators of the LED lamp bead are comprehensively analyzed to obtain the welding quality evaluation value of each soldering point of the LED lamp bead. The specific method is as follows: In the formula, is the welding quality evaluation value of the dth solder joint of the LED lamp bead, d is the number of each solder joint, , D is the total amount of solder joints, is the actual welding temperature of the dth solder joint of the LED lamp bead at the fth welding time point t, f is the number of each welding, , F is the total number of welding times, t is the time variable, , is the welding start time point, is the welding end time point, To adapt the temperature to the actual welding, is the welding time of the dth solder joint of the LED lamp bead at the fth welding time point t, For welding reference time, is the welding pressure of the dth solder joint of the LED lamp bead during the fth welding at welding time point t, is the welding reference pressure, is the real-time ambient temperature of the welding area at welding time point t, Adapt the temperature to the welding environment. is the real-time ambient humidity of the welding area at welding time point t, Adapt humidity to the welding environment, It is the initial performance index of LED lamp beads. It is the welding quality influencing parameter corresponding to the initial performance index predefined in the LED lamp bead processing management library.

5. According to claim 1, the automatic welding packaging control method for LED lamp bead processing is characterized in that: The welding quality comparison result is obtained and it is determined whether to adjust the preset welding operation. The specific determination process is as follows: The welding quality comparison result is a first welding quality comparison result or a second welding quality comparison result; The first welding quality comparison result, specifically the welding quality evaluation value of each welding point of the LED lamp bead, is greater than or equal to the welding quality evaluation threshold; The second welding quality comparison result is specifically that there is a welding quality assessment value of a certain welding point of the LED lamp bead that is less than the welding quality assessment threshold; If the welding quality comparison result is displayed as the first welding quality comparison result, there is no need to adjust the preset welding operation, and the preset packaging operation is directly performed; If the welding quality comparison result is displayed as the second welding quality comparison result, the preset welding operation needs to be adjusted.

6. According to claim 5, an automatic welding packaging control method for LED lamp bead processing is characterized in that: The preset welding operation is adjusted, and the specific adjustment process is as follows: The welding quality assessment value of the solder joint of the LED lamp bead is checked with a predefined second welding quality assessment threshold. If the welding quality assessment value of the solder joint of the LED lamp bead is greater than or equal to the second welding quality assessment threshold, an optimization adjustment plan is executed for the preset welding operation. If the welding quality assessment value of the solder joint of the LED lamp bead is less than the second welding quality assessment threshold, an emergency adjustment plan is executed for the preset welding operation.

7. According to claim 1, the automatic welding packaging control method for LED lamp bead processing is characterized in that: The specific evaluation process of evaluating the packaging quality index of LED lamp beads is as follows: By performing packaging quality inspection on LED lamp beads, the packaging quality inspection data of LED lamp beads are obtained, including the packaging curing time of LED lamp beads in the packaging cycle, the amount of packaging glue used in the packaging cycle of LED lamp beads, and the average packaging curing speed of LED lamp beads in the packaging cycle; Obtain the maximum value of the ambient temperature of the packaging area during the packaging cycle and the maximum value of the ambient humidity of the packaging area during the packaging cycle; Match the average forward voltage of the LED lamp bead within the performance monitoring period with the package curing reference time corresponding to each predefined forward voltage average interval, so as to obtain the package curing reference time of the LED lamp bead; The average reverse leakage current of the LED lamp bead in the performance monitoring period is matched with the average package curing adaptation speed corresponding to each predefined reverse leakage current average interval, so as to obtain the average package curing adaptation speed of the LED lamp bead; Obtain the reference amount of packaging glue, the maximum value of the packaging environment adaptation temperature, and the maximum value of the packaging environment adaptation humidity from the LED lamp bead processing management library; The packaging quality index of LED lamp beads is obtained by comprehensively analyzing the packaging curing time of LED lamp beads during the packaging cycle, the amount of packaging glue used in the packaging cycle, the average packaging curing speed of LED lamp beads during the packaging cycle, the welding quality evaluation value of each solder joint of the LED lamp beads, the maximum ambient temperature of the packaging area during the packaging cycle, and the maximum ambient humidity of the packaging area during the packaging cycle.

8. According to claim 1, the automatic welding packaging control method for LED lamp bead processing is characterized in that: The packaging quality verification result is obtained and it is determined whether to adjust the preset packaging operation. The specific determination process is as follows: The packaging quality verification result is the first packaging quality verification result or the second packaging quality verification result; The first packaging quality verification result is specifically that the packaging quality index of the LED lamp bead is greater than or equal to the preset packaging quality index; The second packaging quality verification result is specifically that the packaging quality index of the LED lamp bead is less than the preset packaging quality index; If the packaging quality verification result shows the first packaging quality verification result, there is no need to adjust the preset packaging operation. If the packaging quality verification result shows the second packaging quality verification result, the preset packaging operation needs to be adjusted.

9. The automatic welding packaging control method for LED lamp bead processing according to claim 8, characterized in that: The preset encapsulation operation is adjusted, and the specific adjustment process is as follows: The packaging quality index of the LED lamp bead is matched with the packaging operation adjustment plan corresponding to each predefined packaging quality index interval. The specific matching process is: obtain the mapping set between the packaging quality index of the LED lamp bead and the packaging operation adjustment plan from the LED lamp bead processing management library, determine the specific interval of the packaging quality index of the LED lamp bead, assign the packaging operation adjustment plan corresponding to the interval to the LED lamp bead corresponding to the packaging quality index, and obtain the packaging operation adjustment plan of the packaging component to which the LED lamp bead belongs, so as to adjust the preset packaging operation of the packaging component through the packaging operation adjustment plan.

10. A system using the automatic welding packaging control method for LED lamp bead processing as claimed in any one of claims 1 to 9, characterized in that: include: The welding adaptation temperature matching module is used for the feeding component to monitor the initial performance of the LED lamp beads, collect the initial performance monitoring data of the LED lamp beads, evaluate the initial performance indicators of the LED lamp beads, and match the welding adaptation temperature of the LED lamp beads. Thus, the welding component automatically performs preheating control according to the welding adaptation temperature of the LED lamp beads; The welding operation control module is used for performing a preset welding operation on the LED lamp beads after the welding assembly preheats the welding temperature to the welding adaptation temperature of the LED lamp beads, obtaining the welding data of each soldering point of the LED lamp beads, determining the welding quality evaluation value of each soldering point of the LED lamp beads, comparing it with the predefined welding quality evaluation threshold, obtaining the welding quality comparison result and determining whether to adjust the preset welding operation, thereby completing the welding control of the LED lamp beads; The packaging operation control module is used for the packaging component to perform a preset packaging operation on the LED lamp beads that have completed the welding operation, and to perform packaging quality inspection on the LED lamp beads, evaluate the packaging quality index of the LED lamp beads, and perform packaging quality verification with the predefined packaging quality preset index, obtain the packaging quality verification result and determine whether to adjust the preset packaging operation, thereby completing the packaging control of the LED lamp beads.

Images