Apparatus for thermally treating material

Abstract

The invention relates to a device (1) for the heat treatment of a material (2), in particular a solid, comprising a process chamber (5) and at least one device (6) for providing a plasma, the process chamber (5) having an inlet (56) and an outlet (57) for a gaseous fluid, and the outlet (57) of the process chamber (5) being in flow connection with at least one heat exchanger (58) having a heat accumulator (61), wherein the heat exchanger (58) has an inlet (59) and an outlet (60) for a gaseous fluid.

Description

Technical Field

[0001] The invention relates to an apparatus for thermally treating materials, in particular solids, comprising a treatment chamber and at least one device for providing a plasma, wherein the treatment chamber has an inlet and an outlet for a gaseous fluid.

[0002] The invention also relates to a method for operating an apparatus for thermally treating a material, in particular a solid, comprising at least one device for providing a plasma and a treatment chamber, the treatment chamber having an inlet and an outlet for a gaseous fluid, wherein the material is exposed in the treatment chamber to a hot gas flow and / or a plasma flow, the hot gas flow and / or the plasma flow being generated from a process gas by means of the device for providing a plasma, and wherein at least a portion of the exhaust gases generated during the thermal treatment of the material are discharged from the treatment chamber via the outlet. Background Art

[0003] The use of so-called plasma burners in various embodiments for melting substances, in particular metals, is already documented in the prior art.

[0004] For example, document DE10 2020 202 484A1 describes a device for melting metal having a melting temperature of less than 1000° C., wherein a device for forming plasma is provided on a furnace, wherein the device is connected to an electrical power source and at least one first supply for a plasma gas, through which a plasma can be formed, is connected to the device, and the device is constructed, sized, arranged and / or oriented such that the formed plasma is spaced apart from the metal as melt, and a hot gas flow can be formed by means of the plasma, which is oriented in the direction of the melt, and in order to accommodate the molten metal, a melting tank or crucible is arranged in the furnace.

[0005] From document EP 1 433 366 A1 an induction plasma burner is known, comprising: a tubular burner body with a proximal end and a distal end, which furthermore has an inner cylindrical surface of a first diameter; a plasma-surrounding tube, which is made of a material having a high thermal conductivity, which defines an axial cavity, in which the high-temperature plasma is contained, and has a cylindrical outer surface of a second diameter, which is slightly smaller than the first diameter, wherein the plasma-surrounding tube is mounted in the tubular burner body and the cylindrical inner and outer surfaces are oriented coaxially with each other so as to form a thin annular cavity of equal thickness between the inner surface and the outer surface; a gas distribution head, which is mounted on the proximal end of the burner body, in order to introduce at least one gaseous substance into the axial cavity, which is defined by the plasma-surrounding tube; a cooling fluid source, which is connected to the thin annular cavity, in order to form a high-velocity cooling fluid flow in the annular cavity, wherein not only the high thermal conductivity of the material, from which the plasma-surrounding tube is manufactured, but also the high-velocity flow of the cooling fluid effectively contributes to the heat transfer from the plasma-surrounding tube to the cooling fluid, thereby effectively cooling the plasma-surrounding tube. a first power supply including a higher frequency output; a second power supply including a lower frequency output having a first and a second connection terminal; a series of induction coils disposed on the tubular burner body substantially coaxially with the tubular burner body between the proximal end and the distal end of the burner body, having a first induction coil connected to the higher frequency output of the first power supply so as to inductively apply energy to at least one gaseous substance, the energy being fed into the axial cavity; and a plurality of second induction coils disposed between the first induction coils and the distal end of the tubular burner body, wherein each of the second induction coils has a corresponding connection terminal; and a connecting circuit disposed between the first and second connection terminals of the lower frequency output of the second power supply and the connection terminals of the second induction coils so that the second induction coils are interconnected between the first and second connection terminals in a series and / or parallel circuit so that the input impedance of the second induction coils matches the output impedance of the second power supply and inductively applies energy to at least one gaseous substance, the energy being fed into the axial cavity.

[0006] Document US2004 / 107796 A1 describes a plasma-supported melting method, comprising: forming a plasma in a cavity by subjecting a first gas to electromagnetic radiation having a frequency less than about 333 GHz in the presence of a plasma catalyst; heating a second gas using the plasma; adding a solid to the melting vessel; and directing the heated second gas toward the solid sufficient to at least melt the solid.

[0007] From document DE 69216970 T2 an induction plasma burner is known, which comprises: a tubular burner body, which comprises a cylindrical inner surface of a first diameter; a plasma surrounding tube, which consists of a heat-conducting ceramic material and comprises a first end, a second end and a cylindrical outer surface, the outer surface having a second diameter smaller than the first diameter, wherein the plasma surrounding tube is arranged in the tubular burner body and an annular cavity is formed between the cylindrical inner surface and the outer surface; a gas distributor, which is arranged on the tubular burner body at the first end of the plasma surrounding tube and supplies the plasma surrounding tube with at least one gaseous substance , wherein at least one gaseous substance flows through a plasma surrounding tube from its first end to its second end; an induction coil, to which an electric current is supplied so as to inductively supply energy to the at least one gaseous substance flowing through the plasma surrounding tube so as to form and obtain plasma in the surrounding tube, wherein the induction coil is coaxial with the cylindrical inner and outer surfaces of the annular cavity; and a device for forming a cooling fluid flow in the annular cavity; wherein the induction coil is embedded in the tubular burner body, and the cylindrical inner and outer surfaces are machined and coaxial so that the annular cavity has a uniform thickness.

[0008] Document EP 3 314 989 B1 describes an induction plasma burner, comprising: a tubular burner body, comprising a leading region and a trailing region, wherein the leading region and the trailing region each define an inner surface; and a plasma surrounding tube, provided in the tubular burner body, having an inner surface and an outer surface coaxial with the tubular burner body and having a constant inner diameter; and a tubular insert, mounted on the inner surface of the trailing region of the tubular burner body, wherein the tubular insert has an inner surface; an annular channel, defined between the inner surface of the leading region of the tubular burner body, the inner surface of the tubular insert and the outer surface of the plasma surrounding tube, wherein the annular channel is configured to guide a cooling liquid for cooling the plasma surrounding tube; and wherein the plasma surrounding tube has a tubular wall, which has a thickness that decreases in the axial direction of the plasma flow in at least one region of the plasma surrounding tube.

[0009] Document EP 2 671 430 B1 describes an inductive plasma burner comprising: a tubular burner body having an inner surface; a plasma surrounding tube coaxially arranged in the tubular burner body, wherein the plasma surrounding tube has an outer surface; a gas distributor head arranged at the end of the plasma surrounding tube and configured to supply at least one gaseous substance into the plasma surrounding tube; an inductive coupling element for applying energy to the gaseous substance to generate and maintain plasma in the plasma surrounding tube; and a capacitive shielding element comprising a conductive material layer applied to the outer surface of the plasma surrounding tube or the inner surface of the tubular burner body; wherein the conductive material layer is divided into axial strips and the axial strips are connected to each other at the ends, and wherein the inductive coupling element is embedded in the tubular burner body and axial grooves are formed in the outer surface of the plasma surrounding tube or the inner surface of the tubular burner body, wherein one of the axial grooves is arranged between a pair of laterally adjacent axial strips. Summary of the invention

[0010] The object of the present invention is to provide improved possibilities for the thermal treatment of materials.

[0011] The object of the invention is achieved by the above-mentioned device for thermally treating materials, wherein the outlet of the treatment chamber is in flow connection with at least one heat exchanger having a heat storage element and having an inlet and an outlet for a gaseous fluid.

[0012] The object of the invention is also achieved by the method described in the introduction, according to which it is provided that the exhaust gas is fed to a first heat exchanger and in the first heat exchanger the heat is discharged to at least one heat storage element.

[0013] The advantage here is that by using a heat accumulator, thermal energy can be extracted from the exhaust gas and transferred to a recipient of the thermal energy as required. In this case, the thermal energy can be stored and transferred at a later time. This thermal energy can thus also be used more easily in other processes. However, the stored thermal energy can also be used in the process itself, for example for preheating the process gas.

[0014] According to a variant embodiment of the invention, it can be provided that a fresh gas feed is provided at or before the inlet of the heat exchanger for the gaseous fluid. In this way, part of the thermal energy can be used to preheat the fresh gas before the heat is transferred to the heat storage element, so that part of the thermal energy can be transferred loss-free in the process gas of the device for generating plasma without having to bypass at least one heat storage element.

[0015] According to another embodiment of the invention, it can be provided that the outlet of the heat exchanger is fluidically connected to a gas conveyor for a gaseous fluid in order to convey the process gas in the system by means of the gas conveyor. Thus, an overpressure can be generated in the gas guide, thereby preventing the infiltration of oxygen-containing gases from the environment of the system and thus preventing oxidation problems.

[0016] According to this embodiment variant, it can be provided that a supply element for supplying a cooling medium to the gaseous fluid is provided before the gas conveying element in the flow direction of the gaseous fluid, so as to cool the process gas before entering the gas conveying element. Alternatively, the process gas can also be cooled in the gas conveying element. As a result, the gaseous fluid can be further cooled, so that gas conveying elements with lower thermal loads, such as fans or turbines, can be used or their service life can be extended.

[0017] According to another embodiment of the invention, it can be provided that the outlet of the heat exchanger can be connected in flow to the inlet of at least one second heat exchanger, which also has at least one heat storage element. Thus, the first heat exchanger and the second heat exchanger can be contacted with the hot exhaust gas alternately, so that the heat storage element can become very hot even after a short contact time with the gaseous fluid, and this heat can then be used better to preheat the process gas.

[0018] To this end, in a special embodiment variant, it can be provided that the second heat exchanger has an outlet which is in flow connection with the inlet of the process chamber. It is thus possible to avoid overheating of the plasma generating element by regulating the temperature in the plasma generating element by means of preheated circulating gas from the second heat exchanger, as will be explained in detail below.

[0019] According to another embodiment of the invention, it can be provided that the heat exchanger has a plurality of rotatably arranged heat storage elements, so that the gaseous fluid from the treatment chamber can be applied alternately to the heat storage elements. With this embodiment, when using two heat exchangers, the above-mentioned effect can be achieved with only one heat exchanger.

[0020] Preferably, according to a variant embodiment of the invention, at least one heat exchanger is arranged in a fluid circuit which connects the outlet of the treatment chamber to the inlet of the treatment chamber. When heat treatment is carried out using plasma, in particular ICP and DC arc, the temperatures are very high when the plasma is formed. These temperatures are usually undesirable for the material in the treatment chamber. The circulation of the exhaust gas from the treatment chamber enables the exhaust gas to adjust the temperature of the plasma torch in a controlled manner, in such a way that the peak temperature is adjusted downward in a targeted manner. This reduces the risk of undesirable chemical reactions in the treatment chamber and the risk of material failure in the treatment chamber.

[0021] According to another embodiment of the present invention, a third heat exchanger can be provided upstream of the gas conveying element. The third heat exchanger can also be used to reduce the temperature of the medium to be conveyed, in order to thereby better protect the gas conveying element from damage.

[0022] According to a variant embodiment of the device, it can be provided that the process chamber is fluidically connected to an exhaust gas line, wherein at least one valve and / or at least one sliding element and / or at least one cross-section reducing element is provided in the exhaust gas line. This makes it possible to easily adjust the pressure in the plasma generating element, whereby an additional pressure regulation in the process chamber can be omitted if necessary.

[0023] For the reasons stated above, according to one embodiment variant of the method, provision can be made for the process gas to be heated using a heat storage element.

[0024] According to one embodiment variant of the method, it can be provided that the thermal energy extracted from the process gas during the cooling of the process gas is used as heating energy for space heating and / or water heating and / or power generation. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to better understand the present invention, the present invention is further explained according to the following drawings. They are respectively shown in simplified schematic diagrams:

[0026] Figure 1 An apparatus for heat treating a material is shown;

[0027] Figure 2 showing a portion of an apparatus for providing a plasma;

[0028] Figure 3 A part of an embodiment variant of a device for providing plasma is shown;

[0029] Figure 4 A portion of another variant embodiment of the device for providing plasma is shown;

[0030] Figure 5 A portion of another variant embodiment of the device for providing plasma is shown;

[0031] Figure 6 shows an arrangement of a plurality of plasma generating members;

[0032] Figure 7 Another arrangement of a plurality of plasma generating members is shown;

[0033] Figure 8 A longitudinal section of a jet pump is shown;

[0034] Fig. 9 A part of an embodiment variant of a device for providing plasma is shown;

[0035] Fig.10 An embodiment variant of an apparatus for heat treating a material is shown;

[0036] Fig.11 A further embodiment variant of a device for the thermal treatment of materials is shown. DETAILED DESCRIPTION

[0037] First of all, it should be pointed out that in the different described embodiments, identical parts are provided with the same reference numerals or the same component names, wherein the disclosure contained in the entire description can be transferred to the same parts with the same reference numerals or the same component names in a meaningful manner. In addition, the positional descriptions selected in the description, such as, for example, top, bottom, side, etc., relate to the direct description and the figures shown and can be transferred to the new position in a meaningful manner in the case of a change in position.

[0038] In the following, the first and second gaseous fluids and the further gaseous fluid are mentioned. Here, these fluids can be different gases or the same gas. In addition, the gaseous fluid can be a pure gas or a gas mixture.

[0039] Furthermore, the terms fresh gas, cycle gas, waste gas and process gas (also referred to as plasma gas) are used hereinafter. Fresh gas and process gas can be formed from at least one of the gaseous fluids mentioned in the above paragraphs. The cycle gas - as the name already indicates - is guided in a cycle in the device according to the invention and is used again for plasma generation. It thus changes from waste gas to process gas again.

[0040] Furthermore, the terms "hot fluid" or "hot fluid flow" are used in this description. These terms are used in the sense of the description not only for plasma flows, which are directed directly onto the material to be treated, but also for hot gas flows, i.e. gas flows that are heated by the plasma and which are then directed onto the material to be treated or used for thermally treating the material.

[0041] As gaseous fluids, all gases suitable for forming plasma can be used, such as, for example, nitrogen, argon, neon, xenon, air, carbon dioxide, carbon monoxide, hydrogen, gaseous water or a mixture of at least two of these gases.

[0042] exist Figure 1 2 shows an apparatus 1 for heat treating a material 2 (hereinafter simply referred to as apparatus 1 ).

[0043] The material 2 can be a liquid or a gas. Preferably, however, the material 2 is a solid, in particular a metallic solid.

[0044] The heat treatment may be the melting of the material 2 or the temperature control of the material 2, for example the maintenance of a certain temperature or the heating of the material 2. However, the heat treatment may also include a chemical reaction carried out at an elevated temperature. This enumeration of the possible applications of the device 2 is to be understood only as an example, wherein the melting of metallic solids is one of the preferred applications.

[0045] Because the application field of device 1 is different, Figure 1 The schematic diagrams in the figures are also non-limiting, but should be understood merely as an illustration of the present invention.

[0046] The device 1 comprises a receptacle 3 for the material 2. The receptacle 3 can be formed by a separate container in which the material 2 is located. In the case of gas or in general, the receptacle 3 can however also be simply a housing 4 of a treatment chamber 5 or a cavity of a treatment chamber 5 in which the material 2 for the thermal treatment is located. The separate container - if present - is also arranged in the treatment chamber 5.

[0047] It should be mentioned merely for the sake of completeness that more than one receptacle 3 for material 2 may also be provided in the process chamber 5 , wherein different materials 2 may also be accommodated in the individual receptacles 3 , for example in order to carry out a chemical reaction.

[0048] Furthermore, the device 1 comprises a device 6 for providing a plasma (hereinafter referred to simply as the device 6), by means of which the thermal energy for thermally treating the material 2 is provided. The device 6 is arranged on the housing 4 of the process chamber 5 in such a way that a plasma torch or a plasma stream or a hot gas stream 7, which is generated by means of plasma in the process gas, extends into the process chamber 5 or in the direction thereof.

[0049] With regard to the other components of the device 1 which are not mentioned or implemented below, reference should be made to the relevant prior art in order to avoid repetitions.

[0050] The device 6 comprises at least one plasma generating member 8 .

[0051] The plasma generating element 8 (also referred to as a plasma burner) is implemented in a variant Figure 2 The middle part is shown in longitudinal section.

[0052] The plasma generating element 8 has a component body 9 (also referred to as a burner body). At least one electrical induction coil 10 for plasma generation is arranged in or on the component body 9. It is also possible to use a plurality of induction coils 10, which can be adjusted and / or controlled independently of each other if necessary. A plurality of induction coils 10 can be arranged one after another along the flow direction of one or more gaseous fluids.

[0053] Plasma generation can also be achieved in other ways, for example by means of a magnetron or generally using microwaves (eg generated by means of a solid-state microwave generator) or by means of two electrodes, etc.

[0054] Furthermore, a first flow channel 11 for a first gaseous fluid and a concentrically arranged second flow channel 12 for a second gaseous fluid are provided in the component body 9. The first flow channel 11 is arranged at least in sections, for example in the area above the arrangement of the induction coil 10 or in a partial area of ​​the arrangement of the induction coil, in the second flow channel 12. The first and second flow channels 11, 11 can be tubular, for example with a circular cross section. The first and / or second flow channels 11, 11 can be formed, for example, by a quartz glass tube or an aluminum oxide tube or a boron nitride tube or the like.

[0055] Second flow channel 12 may be arranged at a distance 13 from a surface 14 of component body 9 , in particular surface 9 behind which induction coil 10 is arranged, which is selected from a range of 0 mm to 30 mm, in particular 0 mm to 20 mm.

[0056] The first flow channel 11 can be arranged at a radial spacing 15 from the second flow channel 12, which spacing is selected from the range of 0.1 mm to 40 mm, in particular 0.4 mm to 30 mm. The speed of the protective gas flow 20 can also be adjusted via this spacing.

[0057] The first flow channel 11 has a first connection 16, ie, a first supply, for a first gaseous fluid, and the second flow channel 12 has a second connection 17, ie, a second supply, for a second gaseous fluid. Figure 2 It is clearly visible that the first and second connections 16, 17 can be fed by a common supply line 18 for the gaseous fluid. However, completely mutually separate / independent supplies for the first and second gaseous fluids can also be provided.

[0058] A first gaseous fluid is supplied to the first flow channel 11 via a first connection 16 to form a heated gas flow (central gas flow 19). A second gaseous fluid is supplied to the second flow channel 12 via a second connection 17, which forms a protective volume flow (protective gas flow 20) between the plasma generating element 8, i.e., the surface 14 of the component body 9, and the heated gas flow or plasma flow. The two gas flows, i.e., the central gas flow 19 and the protective gas flow 20, jointly leave the plasma generating element 8 through an outlet 21, i.e., a flow outlet, so that they can be used for heat treatment of the material 2.

[0059] It should be noted that the plasma generating member 8 is Figure 2The illustrations in FIG. 8 have exemplary characteristics. The specific arrangement of the individual components in the plasma generating element 8 can also be realized in other ways as long as the functionality is retained.

[0060] exist Figure 3 In the figure, a further and possibly independent embodiment of the plasma generating element 8 is shown schematically and in longitudinal section, wherein the same parts are again applied as in the figure. Figure 1 and 2 In order to avoid unnecessary repetition, the above description is indicated or referred to.

[0061] If Figure 3 It can be seen that the first flow channel 11 ends at a distance from the outlet 21 of the plasma generating element 8, thereby further improving the effect of the induction coil 10 on the central gas flow 19. The specific distance from the outlet 21 depends on the respective structural embodiment of the plasma generating element 8.

[0062] It can also be seen that no separate channel element (tube) is used for the second flow channel 12, but that according to a variant embodiment of the plasma generating element 8, the second flow channel 12 is delimited to the outside by the surface 14 of the component body 9 of the plasma generating element 8, that is, it is formed by the plasma generating element 8 itself. Alternatively, it can be provided that the second flow channel 12 is formed by its own channel element 22, as is the case in the embodiment according to Figure 2 In the case of a variant implementation of Figure 3 The channel element 22 is shown in dashed lines, but the channel element 22 is arranged directly on the surface 14 of the component body 9. If necessary, the channel element 22 can also be formed as a coating on the surface 14 of the component body 9. The coating can be formed, for example, at least partially of silver, gold, aluminum, etc. Naturally, according to Figure 3 In the embodiment variation of the plasma generating member 8, the channel member 22 is Figure 2 A spaced-apart arrangement as shown in FIG. 1 is also possible.

[0063] Depend on Figure 3 It can also be seen that the induction coil 10 can be arranged at a small distance from the surface 14 of the component body 9. Figure 3 It can be seen that the induction coil 10 can be implemented in a cooled manner, for which purpose it can have a cooling channel 23. As a cooling medium that can flow through the cooling channel 23, water, cooling oil or the like can be used, for example.

[0064] In accordance with Figure 3In a variant embodiment of the plasma generating part 8 of the present invention, it is provided that at least one further flow channel 24 is arranged or formed in the plasma generating part 8. For example, the further flow channel 24 can be formed in the component body 9 of the plasma generating part 8. The further flow channel 24 is flow-connected to another interface 25 for another gaseous fluid. If necessary, the further interface 25 can also be connected to the supply line 18 (see Figure 2 ) are connected so that all three gaseous fluids are composed identically. However, it is also possible to supply another gaseous fluid completely independently of the supply of the first and second gaseous fluids.

[0065] If Figure 3 It can be seen that the other flow channel 24 is formed to extend obliquely to the first flow channel 11 and the second flow channel 12, wherein the angle 26 between the flow channels 11 or 12 and 24 is formed in such a way that the flow direction of the gas flow formed by the third fluid, in particular the cooling gas flow 27, extends in the middle direction or in the direction of the longitudinal center axis 28.

[0066] exist Figure 3 The other flow channel 24 in the plasma generating part 8, that is, in the component body 9, extends with the same inclination angle over the entire length of the other flow channel. However, it can also be provided that only the end section is configured to extend obliquely at the angle 26. The end section starts at the outflow opening 29 of the other flow channel 24 in the plasma generating part 8. The other flow channel 24 can therefore be configured to have different inclination angles viewed over its length, or the other flow channel 24 can also have a curved course.

[0067] A further flow channel 24 enables the supply of a further gaseous fluid for changing the temperature of the hot gas flow 7 or plasma flow formed by the protective gas flow 20 and the central gas flow 19. If necessary, the position of the hot gas flow 7 or plasma flow or the plasma torch can also be changed thereby.

[0068] According to a preferred embodiment of the plasma generating element 8, the angle 26 formed by at least the end section of the further flow channel 24 and the first and second flow channels 11, 12 can be selected from the range of 10° to 80°, in particular, the range of 15° to 70°. For example, the angle 26 can be 20°, 30°, 40°, 45°, 50°, or 60°.

[0069] It is possible within the scope of the invention to form only a single further flow channel 24. Figure 4, which shows a top view of a part of an embodiment variant of the plasma generating part 8 in cross section, may be provided with a plurality of additional flow channels 24, for example, four or only two or three or more than four, for example, five or six, etc. The plurality of additional flow channels 24 are distributed, in particular evenly distributed or symmetrically distributed, along the circumference (or periphery) defined by the second flow channel 12. A connecting piece 30 of the component body 9 may be formed between each additional flow channel 24.

[0070] It should be mentioned here that the second flow channel 12 can also be divided into a plurality of second flow channels 12 which are arranged distributed around the circumference of the first flow channel 11 .

[0071] Each of the plurality of additional flow channels 24, such as in Figure 4 ——extending on a circular ring segment (or circular ring segment). The circular ring segment can be selected from a range of 2° to 88° according to an embodiment of the plasma generating member 8. For example, the circular ring segment can extend in a range of 10° to 80° or in a range of 20° to 70°. However, a single circular ring segment can also extend in a range of 10° to 358°. In general, the circular ring segment can extend in a range of 2° to the following value, which is defined by 360° / the number of circular ring segments-1°, in particular, to the following value, which is defined by 360° / the number of circular ring segments-5°.

[0072] The plurality of circular ring segments may all have the same length in the circumferential direction. However, at least one of the circular ring segments may also have a length different from that of the other circular ring segments in the circumferential direction.

[0073] If Figure 1 It can be seen that according to another embodiment of the device 6, there is the possibility that the device has a gas supply device 31. Here, there is the possibility that the plasma generating element 8 is supplied with not only the first gaseous fluid but also the second and another gaseous fluid by the gas supply device 31, as in Figure 1 For this purpose, the first connection 16 for the first gaseous fluid and the second connection 17 for the second gaseous fluid and / or the further connection 25 for the further gaseous fluid can be flow-connected to the gas supply device 31 .

[0074] However, it is also possible for some or each of the connections 16 , 17 and 25 to be flow-connected to a separate gas supply device 31 .

[0075] Thus, the first connection 16 for the first gaseous fluid, the second connection 17 for the second gaseous fluid, and the further connection 25 for the further gaseous fluid can each be supplied with or supplied with the same gaseous fluid, or at least two or all of them can be supplied with or supplied with different gaseous fluids. For example, fresh gas can be supplied to the first connection 16 and circulating gas can be supplied to the second connection 17 and / or the further connection 25. Thus, according to another embodiment of the device 6, it can be provided that at least one fresh gas supply 32 and at least one circulating gas supply 33 are connected to the gas supply device 31 for providing at least a part of at least one of the gaseous fluids, such as in Figure 1 The dotted line shows that the circulating gas supply can be connected to the device 1 for heat treating the material 2, in particular to a furnace, into which the hot gas or plasma generated by means of the plasma generating element 8 can be introduced.

[0076] According to another embodiment variant of the device 6, it can be provided that the circulating gas is introduced directly into the plasma generating element 8 through the gas supply device 31 without bypassing, as in this case Figure 1 As shown by the solid line.

[0077] According to another embodiment variant of the device 6, it can be provided that at least one conveying element 34 for the circulating gas, for example a jet pump, is provided in the circulating gas supply. With regard to the conveying element 34, reference is also made to the following description.

[0078] According to another embodiment variant of the device 6 , it can be provided that the plasma generating element 8 has a connection 35 for an ignition gas 36 , for example argon, in order to thereby improve or accelerate the generation of the plasma or to also be able to feed gases that are less suitable for providing plasma into the device 6 .

[0079] According to a variant embodiment of the device 6, it can also be provided that at least one heat exchanger 37 for heating the newly supplied gaseous fluid (fresh gas) is provided in the fresh gas supply 32. The heat exchanger can be designed according to the prior art.

[0080] It should be mentioned here that Figure 1 In the embodiment, the fresh gas supply 32 is connected to the gas supply device 31. However, it can also be provided that, alternatively or additionally, the fresh gas supply 32 is directly connected to the plasma generating part 8, such as in Figure 1 It is shown in dashed lines.

[0081] exist Figure 5 In the figure, a further and possibly independent embodiment of the plasma generating element 8 is shown schematically and in longitudinal section, wherein the same parts are again applied as in the figure. Figures 1 to 4 In order to avoid unnecessary repetition, the above description is indicated or referred to.

[0082] In this embodiment variant of the device 6 or the plasma generating part 8, it is provided that the first flow channel 11 has a reflective coating 38 inside and / or the second flow channel 12 has a reflective coating 38 inside. The coating 38 can extend over the entire length of the first flow channel 11 and / or the second flow channel 12 or only a part of the length, for example, only in the beginning area or end area and / or middle area of ​​the first flow channel 11 and / or the second flow channel 12. The coating 38 can also be composed of sections of different compositions, so as to better correspond to the temperature distribution of the plasma generating part 8, because the radiation maximum occurs under different wavelengths depending on the temperature. In this way, the radiation maximum moves to a shorter wavelength at a higher temperature. In this way, the material for the coating section can be selected according to the corresponding wavelength or wavelength range, and the material is particularly effective under the corresponding maximum of the radiation. For example, a coating composed of aluminum can be more effective than a coating composed of gold or silver under a shorter wavelength. This can be exactly the opposite in the case of a longer wavelength.

[0083] The coating 38 can be realized, for example, in a metallic form. For example, the coating 38 can be formed of silver, gold, platinum, aluminum or an alloy with at least one of these metals. It is thereby possible, among other things, to adjust or change or increase the quality of the reflected radiation and / or the wavelength range of the reflected radiation. In particular, the reflected radiation can also be covered by the alloy or alloy part to a wavelength range of less than 500 nanometers or less than 200 nanometers in order to increase the proportion of the reflected radiation in this wavelength range.

[0084] In addition to a comprehensive embodiment of the coating 38, according to one embodiment, there is also the possibility for this to be designed in the form of strips or columns, as in Figure 5 The strip 39 shown in dashed lines is indicated in FIG. The strip 39 may have a width in the circumferential direction of the first flow channel 11 or the second flow channel 12 selected from a range between 0.1% and 20%, in particular between 1% and 10%, of the circumference of the first flow channel 11 or the second flow channel 12.

[0085] The strips 39 may be arranged at a spacing 40 from one another, the spacing being selected from a range between 0.1% and 20%, in particular between 1% and 10%, of the circumference of the first flow channel 11 or the second flow channel 12 .

[0086] Furthermore, it can be provided that only a partial region of the circumference or the entire circumference is provided with strips 39 of first flow channels 11 or second flow channels 12 which are spaced apart from one another.

[0087] The strips 39 can all consist of the same material. However, they can also consist of different materials, for example, strips 39 made of metals that reflect with different strengths can be combined with one another in the plasma generating element 8. Different materials can also be provided in the case of a continuous coating 38, in that the coating is formed in sections from different materials, as has been achieved above.

[0088] The strip 39 has a longitudinal extension in the direction of the longitudinal center axis 28 through the first flow channel 11. According to a variant embodiment, the strip shape of the coating 38 can also be realized by one or more spiral formations, wherein here again, the spacing between the coated sections can also be formed (for example in the form of spiral, uncoated sections).

[0089] The strip 39 can be realized as a coating 38. However, it can also be produced as a separate component and then connected to the first flow channel 11 or the second flow channel 12. The same applies to the coating 38 itself, in that it is produced as a tube and the tube is inserted into the first flow channel 11 or the second flow channel 12. There is also the possibility that the first flow channel 11 or the second flow channel 12 is produced from a correspondingly reflective material or has a correspondingly reflective surface (for example due to a structured surface structuring).

[0090] exist Figure 6 and 7 In the diagram, a further and possibly independent embodiment of the device 6 is schematically and partially shown, wherein the same parts are again applied as in Figures 1 to 5 In order to avoid unnecessary repetition, the above description is indicated or referred to.

[0091] In the above-described embodiments of the device 6, the device always has only one plasma generating element 8. However, it is also possible to provide a plurality of plasma generating elements 8 in the device 6. For this purpose, Figure 6 and 7 , an embodiment variant with three or five plasma generating elements 8 is shown as an example. It is also possible that only two or four or more than five, for example six, etc. plasma generating elements 8 are arranged in the device 6.

[0092] The plasma generating elements 8 can all have the same heating power or different heating powers, as in Figure 6 and 78. In this regard, it should also be pointed out that the specific illustrations are to be understood as examples. Other embodiments are also possible, such as, for example, three plasma generating elements 8 with the same large heating power and one plasma generating element 8 with a smaller heating power than the other, so that, for example, peak loads can be balanced with the "smaller" plasma generating element 8.

[0093] For example, in the case of three plasma generators 8 with a maximum power of 300 kW each (when three powers are fed into the gaseous fluid), it can be provided that: in the case of a desired power of 900 kW, the plasma generators 8 are operated at 100% power (300 kW each), or in the case of a desired power of 700 kW, the plasma generators 8 are operated at 78% power each, or in the case of a desired power of 600 kW, two plasma generators 8 are operated at 100% power each and the third plasma generator is operated at 0% power, or in the case of a desired power of 300 kW, one plasma generator 8 is operated at 100% power each and the other two plasma generators are operated at 0%. It can also be provided that in the case of a maximum load of 400 kW, two plasma generators 8 are operated at 100% power and one plasma generator 8 is operated at 25% power. It can be provided that in the case of a maximum load of 400 kW, two plasma generators 8 are operated at 0% power and one plasma generator 8 is operated at 25% power in order to obtain a desired power of 100 kW.

[0094] It should be noted here that this example is intended to be illustrative only and not limiting.

[0095] The plurality of plasma generating elements 8 may all be implemented identically, so that the embodiments for the plasma generating elements 8 in this specification may be applied to all plasma generating elements 8 .

[0096] According to a variant embodiment of the device 1, it can be provided that the process chamber 5 is in flow connection with an exhaust gas line 41, wherein at least one valve 42 and / or at least one slide and / or at least one cross-section reducing element 43 are provided in the exhaust gas line 41. The cross-section reducing element 43 can be designed, for example, as a baffle, optionally an adjustable baffle with a variable diameter of a through hole.

[0097] By means of at least one valve 42 or at least one slide or at least one cross-section reducer 43 it is possible to control or regulate the volume flow of the exhaust gas which leaves the system 1 via a discharge element 44 , for example a chimney.

[0098] The remaining part of the exhaust gas becomes circulating gas and can be fed back to the process itself via the circulating gas supply 32. The part leaving the device 1 via the discharge element 44 can be replaced by fresh gas via the fresh gas supply 33. The volume flow ratio of circulating gas / fresh gas can then be controlled and / or regulated by means of control and / or regulation by means of at least one valve 42 and / or at least one slide and / or at least one cross-section reducing element 43. In addition, pressure regulation of the pressure in the process chamber 5 can also be achieved thereby.

[0099] According to another embodiment of the invention, Figure 1 The embodiment variant shown in the figure can provide that the process chamber 5 and / or the device 6 for providing plasma has a supply device 45 for introducing solid particles that increase the thermal radiation. The supply device 45 can be, for example, a nozzle, so that a fine distribution of the solid particles into the process chamber 5 or the plasma generating element 8 or generally the device 6 can be achieved. The supply device 45 can also be designed in other ways.

[0100] The solid particles can be formed from graphite, metals such as iron or copper or aluminum. Solid particles that react with the material 2 in the process chamber 5, for example to form an alloy, can also be used. The solid particles can have an average particle size of, for example, between 0.1 μm and 1000 μm.

[0101] The device 6 can be used to provide a plasma which can heat a gas stream, so that the hot gas stream 7 or the plasma stream itself generated thereby can be used to thermally treat the material 2. For this purpose, a gaseous fluid is introduced into at least one plasma generating element 8 of the device 6 and a plasma is generated in the plasma generating element 8. For better protection of the plasma generating element 8, it is provided that the gaseous fluid is guided in the plasma generating element 8 in the form of a central gas stream 19 surrounded by a protective gas stream 20.

[0102] Provision can be made to admix a further gaseous fluid to the gaseous fluid formed from the shielding gas flow 20 and the central gas flow 19 in the plasma generating element 8 , wherein the temperature and / or the position of the plasma torch can optionally be set or regulated using the further gaseous fluid.

[0103] In order to regulate and / or control the volume flow of the device 1 or the arrangement 6, in particular of a gaseous fluid, it can be provided according to an embodiment variant that the temperature of the induction coil 10 and / or the temperature increase of the cooling liquid flowing through the cooling channel 23 of the induction coil 10 and / or the temperature change of the wall of the plasma generating element 8 in the region of the hot gas outlet or plasma outlet from the plasma generating element 8 is measured. Based on these measured values, the volume flow of the central gas flow 20, for example, can be varied in the event of a temperature change.

[0104] The temperature can be measured using known methods. For example, at least one thermocouple can be arranged in or on the wall of the plasma generating element 8 in the region of the plasma gas outlet.

[0105] Furthermore, it is possible to measure the temperature of the shielding gas flow 20 and, depending on the measured value, to change the volume flow of the shielding gas flow 20 in the event of a change in temperature; and / or to regulate the gas pressure in the plasma generating element 8 by changing the volume flow from the process chamber 5 in the exhaust line 41 .

[0106] Furthermore, it is possible to calculate the temperature of the central gas flow 19 and to vary at least one volume flow of the supplied gas, in particular the volume flow of the central gas flow 19, according to this calculated value in the event of a change in temperature. For this purpose, the calculation can be performed using the formula T calc x cp calc xΣVi=Σ(V i XT i x cp i )+P Induktion Here, T calc represents the calculated temperature, cp calc represents the calculated specific heat capacity of the thermal fluid, ΣVi represents the sum of the volume flows, Σ(V i x T i xcp i ) represents the sum of the products of the corresponding volume flow multiplied by the temperature of the corresponding volume flow multiplied by the specific heat capacity of the corresponding volume flow, and P Induktion represents the power introduced inductively. The volume flow is the protective gas flow 20, the central gas flow 19 and the volume flow supplied via at least one further flow channel 24 if present. The temperature to be calculated can be obtained by a corresponding modification of the equation.

[0107] However, it is also possible to measure the temperature of the central gas flow 19 , in particular contactlessly, for example by means of a pyrometer.

[0108] The features of the following embodiments can form independent inventions either by themselves or in combination with the features of the previous embodiments. In particular, for the following embodiment variants of the device 6 or the apparatus 1 , it is not absolutely necessary to separate the gaseous fluid into a central gas flow 19 and a protective gas flow 20 .

[0109] One of these independent inventions is a device 6 for providing plasma, comprising at least one plasma generating part 8, which comprises at least one inlet 46 and an outlet 47 for a gaseous fluid, wherein a first flow channel 11 is arranged or formed in the plasma generating part 8, and if necessary, a second flow channel 12 arranged concentrically therewith is also provided, the second flow channel at least partially surrounding the first flow channel 11, wherein the first flow channel 11 is flow-connected to a first interface 16 for a gaseous fluid for forming a heated gas flow or plasma flow. At least one inlet 46 is formed by the interface 16 for a gaseous fluid. Since a plurality of gaseous fluids can be introduced into the plasma generating part 8, as this has been realized before and this is also a preferred embodiment variant of the device 6 or the plasma generating part 8, the plasma generating part 8 can also have a plurality of inlets 46, through which additional gaseous fluids can be introduced into the plasma generating part 8. Reference should be made to the above embodiments for this.

[0110] In this embodiment variant, a conveyor element 34 for the gaseous fluid or a plurality of conveyor elements 34 for the gaseous fluid is also present or provided. The conveyor element 34 or the plurality of conveyor elements 34 are in flow connection with the inlet 46 of the plasma generating element 8 .

[0111] In the following, only one conveyor element 34 will be discussed in more detail. If a plurality of conveyor elements 34 are present, some or all of the conveyor elements 34 may be designed identically, so that the following embodiments may also be transferred to these conveyor elements 34 .

[0112] The gaseous fluid conveyed by the conveyor element 34 can be accelerated or the gaseous fluid can be accelerated thereby.

[0113] According to an embodiment variant, the plasma generating element 8 can be in flow connection with a gas supply device 31, which can preferably also have a fresh gas supply 32 and / or a circulating gas supply 33 for circulating gas. For these embodiment variants, the above-described explanations are applicable.

[0114] According to a variant embodiment, it can be provided that the conveying element 34 is arranged in a circulating gas supply for the circulating gas, which is in flow connection with the outlet 47 of the plasma generating element 8. Figure 1 In the embodiment of the device 1, the outlet of the plasma generating element 8 is not directly connected to the conveying element 34, but at least the processing chamber 5 is arranged between them. Two implementation variants, namely the direct flow connection of the outlet 47 to the conveying element 34 and the indirect flow connection of the outlet 47 to the conveying element 34 are possible, wherein the latter implementation variant is preferred.

[0115] According to a preferred embodiment variant of the device 6, the conveying element 34 can be a jet pump 48, as shown in the example Figure 8 Shown in.

[0116] The jet pump 48 has a first gas connection 49 and a drive medium connection 50 as well as an exhaust port 51. The first gas connection 49 can be connected to the fresh gas supply 32 or preferably the circulating gas supply (see Figure 1 ) so that fresh gas or recycle gas, in particular exhaust gas from the treatment chamber 5, can be accelerated.

[0117] Under overpressure, a particularly gaseous drive medium is supplied to the drive medium connection 50. The overpressure is converted into a velocity in the jet pump 48 by the cross-sectional constriction 52 through which the drive medium must pass. This generates a negative pressure in the first gas connection 49, which entrains and accelerates the gas supplied there.

[0118] In principle, any suitable drive medium can be used, wherein a gaseous drive medium is preferred. In a preferred embodiment of the device 6, however, fresh gas is used as the drive medium, which is also supplied to the plasma generating element 8, so that the drive medium interface 50 in this embodiment is connected to a fresh gas supply, for example via a gas supply device 31, as in Figure 1 Shown in.

[0119] According to a variant embodiment, it can be provided that the volume flow of the circulating gas flow is adjusted by the volume flow of the fresh gas supplied to the injection pump 48. This can be achieved, for example, by means of a regulating element 52, which is arranged in the fresh gas supply to the injection pump, such as this also by Figure 1 The regulating member 52 can be, for example, a valve, a sliding member or a valve.

[0120] It should generally be noted that the device 1 or the apparatus 6 can have a regulating and / or control device 53, to which corresponding data can be provided wirelessly or by wire by a measured value provider of the device 1 or the apparatus 6, and the regulating and / or control device can output corresponding regulating and / or control signals, for example for changing the volume flow of the process gas.

[0121] Alternatively or in addition to the adjusting element 52 , the adjustable jet pump 48 can also be used to change or adjust the volume flow. For this purpose, the adjustable jet pump 48 can be designed with a control of the volume flow or flow rate of fresh gas, which is supplied to the jet pump 48 as drive medium.

[0122] exist Fig. 9 2 shows schematically a further and possibly independent embodiment of a device 6 for providing a plasma, wherein the same parts as in the embodiment of the present invention are again applied. Figures 1 to 8 In order to avoid unnecessary repetition, the above description is indicated or referred to.

[0123] In this embodiment variant, the inlet 46 of the plasma generating element 8 is in flow connection with a further fresh gas supply 32 .

[0124] According to a further variant embodiment, a heat exchanger 54 is provided upstream of the conveying element 34 in the flow direction of the gaseous fluid, in particular the circulating gas.

[0125] Furthermore, according to an embodiment variant of the device 6 , a further heat exchanger 55 can be provided in the further fresh gas supply 32 .

[0126] The heat exchanger 54 and the further heat exchanger 55 can be constructed according to the prior art.

[0127] Furthermore, it is possible that a further heat exchanger 55 is flow-connected to the heat exchanger 54 upstream of the conveyor 34. This makes it possible to cool the circulating gas in the heat exchanger 54 and transfer the thermal energy obtained thereto to the fresh gas, which is supplied to the plasma generating element 8 via a further fresh gas supply 32.

[0128] Alternatively, the heat exchanger 54 can also be connected in the circulating gas supply 33 to the heat exchanger 37 of the device 1 (see Figure 1 ) connection is used to transfer heat energy.

[0129] With the cooling of the circulating gas upstream of the conveying element 34 , it is in particular also possible to use conveying elements 34 which can be subjected to a lower thermal load, such as, for example, a fan or a turbine according to an embodiment variant of the device 6 .

[0130] Further applicable conveying elements 34 are pumps, vacuum pumps, compressors, ejectors, etc.

[0131] According to one embodiment, at least one filter element may be provided in the flow direction upstream of the conveyor element 34 in order to supply purer gas to the conveyor element 34. This may reduce or avoid wear or clogging of the conveyor element 34 and the plasma generating element 8, for example.

[0132] The features of the following embodiments can form independent inventions by themselves or in combination with the features of the preceding embodiments. In particular, for the following embodiment variants of the device 1 , it is not absolutely necessary to separate the gaseous fluid into a central gas flow 19 and a protective gas flow 20 and / or to use a conveying element 34 .

[0133] exist Fig.10 and 11 A further and possibly independent embodiment of the device 1 is schematically shown in FIG. 1 , in which the same parts as in FIG. 1 are again applied. Figures 1 to 9 In order to avoid unnecessary repetition, the above description is indicated or referred to.

[0134] The device 1 for thermally treating a material 2 of this embodiment variant again comprises a treatment chamber 5 and at least one device 6 for providing a plasma, wherein the treatment chamber 5 has an inlet 56 and an outlet 57 for supplying a gaseous fluid into the treatment chamber 5 and removing it therefrom.

[0135] In both embodiments, it is provided that the outlet 57 of the process chamber 5 is in flow connection with at least one heat exchanger 58 , wherein the heat exchanger 58 has an inlet 59 and an outlet 60 for supplying and removing the gaseous fluid.

[0136] The gaseous fluid is preferably exhaust gas from the treatment chamber 5 , which is conducted through the device 1 in circulation.

[0137] The heat exchanger 58 has at least one heat storage element 61. The heat storage element 61 can be formed, for example, of a material based on or having aluminum oxide (Al2O3), silicon dioxide (SiO2), iron (III) oxide (Fe2O3), titanium dioxide (TiO2), potassium oxide (K2O), calcium oxide (CaO), sodium oxide (Na2O), etc.

[0138] At least one heat storage element 61 serves to receive heat from the gaseous fluid guided through the heat exchanger 58 and to store it for subsequent use.

[0139] In accordance with Fig.10 In a variant embodiment, at least one further heat exchanger 58 is provided, which also has at least one heat storage element 61. However, it is also possible that there is only one heat exchanger 58 with at least one heat storage element 61. In this case, the thermal energy extracted from the process gas and stored in the heat storage element 61 can be used, for example, for other processes. It can also be provided that in the case of cooling the process gas, the thermal energy extracted from the process gas is used as heating energy for space heating and / or water heating and / or power generation. For this variant embodiment, it can be provided that at least one heat exchanger 58 is arranged in a fluid circulation, which connects the outlet 57 of the treatment chamber 5 to the inlet 56 of the treatment chamber.

[0140] In a preferred embodiment variant, the process gas, ie the cycle gas in this case, is however used again in the process itself.

[0141] In a variant embodiment of the device 1, this is achieved by using at least two heat exchangers 58, each with at least one heat storage element 61. For this purpose, the hot circulating gas is conducted from the outlet 57 into the first heat exchanger 58. Fig.10 In the illustration in , this is the upper one of the two heat exchangers 58. In this first heat exchanger 58, the circulating gas is cooled and the extracted thermal energy is stored in its heat storage element 61.

[0142] After the first heat exchanger 58, the cooled circulating gas is introduced into a gas conveying element 62, such as, for example, a fan or one of the above-mentioned conveying elements 34. For this purpose, the outlet 60 of the first heat exchanger 58 can be flow-connected to the gas conveying element 62. The gas conveying element 62 can build up pressure in order to guide the circulating gas through the heat exchanger 68 or to guide the circulating gas in a circuit.

[0143] If the circulating gas is still too hot for introduction into the gas conveying element 62, then according to one embodiment variant of the device 1, there is the possibility of mixing the circulating gas with cooler fresh gas before the gas conveying element 62. The fresh gas can be injected into the cooled circulating gas, for example. The fresh gas can be supplied, for example, via the gas supply device 31. In the device 1, in this embodiment variant, a supply element can be arranged before the gas conveying element 62 in the flow direction of the gaseous fluid, which is used to supply a cooling medium, such as, for example, fresh gas, into the gaseous fluid.

[0144] Generally, the (pre)cooling of the circulating gas can also be realized at another location. It is also possible to branch off a partial flow of the circulating gas and, if necessary, feed it to a separate cooling device with a further heat exchanger in order to avoid thermal overloading of the heat storage element 61. It can be provided that the separately cooled partial gas flow is fed to the heat exchanger 58, i.e. to at least one heat storage element 61, which is not heated but (heat) released.

[0145] According to another embodiment variant, it can be provided alternatively or additionally to this that cooler fresh gas is introduced into the hot circulating gas flow already before or at the inlet 59 , for which purpose a fresh gas feed can be provided at or before the inlet 59 for the gaseous fluid of the heat exchanger 58 .

[0146] The gas conveying element 62 can also be arranged at another location of the device 1 .

[0147] After the first heat exchanger 58, the cooled circulating gas preferably reaches the second (lower) heat exchanger 58 via inlet 59 using a gas supply 61. For this purpose, inlet 59 of the second heat exchanger 58 is flow-connected directly or indirectly via a gas supply 61 to outlet 60 of the first heat exchanger 58.

[0148] At least one heat storage element 61 of the second heat exchanger 58 is already heated in normal operation, ie not in the startup phase of the device 1, so that the circulating gas is heated again in the second heat exchanger 58. In the process, the heat storage element 61 of the second heat exchanger 58 is cooled.

[0149] The heated cycle gas is supplied again as process gas via the outlet 60 of the second heat exchanger 58, which is flow-connected to the inlet 56 of the treatment chamber via the plasma generator 8. The process gas is also heated beforehand in the plasma generator 8 to the desired process temperature.

[0150] This process is continued until the first heat exchanger 58 reaches a critical temperature. This critical temperature can be predetermined, for example, by the temperature loadability of the gas conveying element 62 .

[0151] At this moment, the flow direction of the circulating gas is reversed. For this purpose, the corresponding cycle valve 63 or other suitable components for changing the flow direction of the gas can change its position accordingly, so that the exhaust gas from the process chamber 5 is then firstly guided through the second (lower) heat exchanger 58 for cooling and then through the first (upper) heat exchanger 58 for reheating. In other words, in this cycle, the second heat exchanger 58 becomes the first heat exchanger 58 and the first heat exchanger 58 becomes the second heat exchanger 58. The cycle then continues in this way until the critical temperature is reached again and the cycle valve 63 changes its position again.

[0152] The corresponding pipeline scheme for periodization is given by Fig.10 Clearly visible.

[0153] The change of the position of the cycle valve 63 or of the component is preferably effected fully automatically. To this end, a temperature sensor can be provided in each of the heat exchangers 58 , which supplies a corresponding measurement signal.

[0154] According to another aspect of the device 1 and Fig.11 The embodiment variant shown in can provide that the heat exchanger 58 has a plurality of heat storage elements 61 which are rotatably arranged so that the heat storage elements 61 can be acted upon alternately by a gaseous fluid, in particular hot exhaust gas or circulating gas from the treatment chamber 5 .

[0155] Hot gas or hot waste gas (circulating gas) can be supplied through the upper part of the heat exchanger 58. Here, the hot gas or hot waste gas outputs its heat to the heat storage element 61, that is, the corresponding heat storage element 61 that is in the correct rotational position. The cooled waste gas (circulating gas) is then supplied to the plasma generating element 8 as process gas. The thermal energy reaches the likewise fixed lower part of the heat exchanger 58 via the heat storage element 61 and can heat the supplied cold fresh gas there. The fresh gas is thus heated and the heat storage element 61 is cooled again and can be used for new loading.

[0156] This process can be controlled by a temperature sensor in the cold exhaust gas, for example a thermocouple. The amount of heat stored by each heat storage element 61 can be predetermined by the number of revolutions of the heat exchanger 58 .

[0157] The heated fresh gas can then be supplied to the plasma generating element 8 .

[0158] exist Fig.11 In the illustration of , eight heat storage elements 61 are provided. However, less than or more than eight heat storage elements 61 may also be used, for example three or four or five or six or seven or nine or ten, or significantly more than eight, such as for example more than 100 or the like.

[0159] The heat storage element 61 can be realized as a honeycomb body, a ball packing or generally as a packing, a foam, a body produced by an additive method, etc. The space requirement can be predetermined in the form of a permissible pressure loss, etc.

[0160] The heat storage element 61 may be provided with a coating, for example a catalytic coating.

[0161] After the heat or thermal energy is preferably used again in the same process, provision can also be made in this embodiment variant for at least one heat exchanger 58 to be arranged in a fluid circuit which connects the outlet 57 of the treatment chamber 5 to the inlet 56 of the treatment chamber 5 .

[0162] According to another embodiment of the device, a third heat exchanger 64 can be provided in the flow direction upstream of the gas conveyor 62 in order to cool the gaseous fluid again after leaving the first heat exchanger 58. The third heat exchanger 64 can be implemented without the heat storage element 61.

[0163] In the above-described embodiments, it is assumed that the remaining volume flow is completely cooled, except for the partial volume flow which is completely withdrawn from the process via the discharge element 44. However, it is also possible to cool only a portion of the remaining volume flow. In this case, this portion can be used, for example, to cool components in the plasma generating element 8.

[0164] The exemplary embodiments show possible embodiment variants, wherein combinations of individual embodiment variants with one another are also possible.

[0165] For reasons of clarity it should finally be pointed out that, in order to achieve a better understanding of the structure, individual components are partially not shown to scale and / or are shown enlarged and / or reduced in size.

[0166] Reference numerals list

[0167] 1 device

[0168] 2 Materials

[0169] 3. Accommodation

[0170] 4 Shell

[0171] 5. Processing Chamber

[0172] 6. Device

[0173] 7 Hot Gas Flow

[0174] 8 Plasma generating parts

[0175] 9-part body

[0176] 10 Induction coil

[0177] 11 Flow channels

[0178] 12 flow channels

[0179] 13 interval

[0180] 14 Surface

[0181] 15 intervals

[0182] 16 interfaces

[0183] 17 interfaces

[0184] 18 Supply pipeline

[0185] 19 Central Gas Flow

[0186] 20 Protective gas flow

[0187] 21 Exit

[0188] 22 channel pieces

[0189] 23 cooling channels

[0190] 24 flow channels

[0191] 25 interfaces

[0192] 26 angles

[0193] 27 Cooling gas flow

[0194] 28 longitudinal center axis

[0195] 29 Flow outlet

[0196] 30 Connecting piece

[0197] 31 Gas supply device

[0198] 32Fresh gas supplier

[0199] 33 Circulation gas supplier

[0200] 34 conveyor parts

[0201] 35 interfaces

[0202] 36 Ignition gas

[0203] 37Heat exchanger

[0204] 38 coating

[0205] 39 articles

[0206] 40 intervals

[0207] 41 Exhaust pipe

[0208] 42 valves

[0209] 43 Cross-section reduction piece

[0210] 44 Exports

[0211] 45 Supply device

[0212] 46 Entrance

[0213] 47 Exit

[0214] 48 Jet Pump

[0215] 49 Gas interface

[0216] 50 drive medium interface

[0217] 51 discharge port

[0218] 52 Adjustment parts

[0219] 53 Control device

[0220] 54Heat exchanger

[0221] 55Heat exchanger

[0222] 56 entrance

[0223] Exit 57

[0224] 58 Heat Exchanger

[0225] 59 entrance

[0226] Exit 60

[0227] 61 heat storage parts

[0228] 62 Gas conveying parts

[0229] 63 cycle valve

[0230] 64 Heat Exchanger

Claims

1. A device (1) for thermally treating a material (2), in particular a solid, comprising a treatment chamber (5) and at least one device (6) for providing a plasma, wherein: The treatment chamber (5) has an inlet (56) and an outlet (57) for a gaseous fluid, characterized in that the outlet (57) of the treatment chamber (5) is fluidically connected to at least one heat exchanger (58) having a heat storage element (61), and the heat exchanger (58) has an inlet (59) and an outlet (60) for the gaseous fluid.

2. The device (1) according to claim 1, characterized in that A fresh gas supply (32) is arranged at or before the inlet (59) for the gaseous fluid of the heat exchanger (58).

3. The device (1) according to claim 1 or 2, characterized in that The outlet (60) of the heat exchanger (58) is in flow connection with a gas conveyor (62) for a gaseous fluid.

4. The device (1) according to claim 3, characterized in that A supply element for supplying a cooling medium to the gaseous fluid is provided before the gas conveying element (62) along the flow direction of the gaseous fluid.

5. The device (1) according to any one of claims 1 to 4, characterized in that The outlet (60) of the heat exchanger (58) is fluidically connected to the inlet (59) of at least one second heat exchanger (58), which likewise has at least one heat storage element (61).

6. The device (1) according to claim 5, characterized in that The second heat exchanger (58) has an outlet (60) which is in flow connection with the inlet (57) of the process chamber (5).

7. The device (1) according to any one of claims 1 to 4, characterized in that The heat exchanger (58) has a plurality of heat storage elements (61) which are rotatably arranged so that the gaseous fluid from the treatment chamber (5) can be applied alternately to the heat storage elements (61).

8. The device (1) according to any one of claims 1 to 7, characterized in that The at least one heat exchanger (58) is arranged in a fluid circuit which connects an outlet (57) of the treatment chamber (5) with an inlet (56) of the treatment chamber (5).

9. The device (1) according to any one of claims 3 to 8, characterized in that A third heat exchanger (64) is arranged upstream of the gas supply element (61).

10. The device (1) according to any one of claims 1 to 9, characterized in that The treatment chamber (5) is flow-connected to an exhaust gas line (41), wherein at least one valve (42) and / or at least one sliding element and / or at least one cross-section reducing element (43) are arranged in the exhaust gas line (41).

11. Method for operating a device (1) for thermally treating a material (2), in particular a solid, comprising at least one device (6) for providing a plasma and a treatment chamber (5) having an inlet (56) and an outlet (57) for a gaseous fluid, wherein: The material (2) is exposed to a hot gas flow and / or plasma flow in the treatment chamber (5), which is generated from a process gas using a device (6) for providing plasma, and at least a part of the exhaust gas generated during the heat treatment of the material (2) is discharged from the treatment chamber (5) via an outlet (57), characterized in that the exhaust gas is supplied to a first heat exchanger (58) and the heat is discharged to at least one heat storage element (61) in the first heat exchanger (58).

12. The method according to claim 11, characterized in that The process gas is heated by utilizing the heat storage element (61).

13. The method according to claim 11 or 12, characterized in that: The process gas is conveyed in the device (1) by means of a gas conveying element (62).

14. The method according to claim 13, characterized in that The process gas is cooled before entering the gas conveyor (62) or in the gas conveyor (62).

15. The method according to claim 14, characterized in that The thermal energy extracted from the process gas during the cooling of the process gas is used as heating energy for space heating and / or water heating and / or power generation.

Images