High-pressure substrate processing apparatus

Abstract

The present invention relates to a high-pressure substrate processing apparatus, comprising: an inner chamber formed to accommodate a substrate to be processed; an outer chamber provided with: a housing formed so as to accommodate the inner chamber; an outer door formed to move between a closed state in which the housing is closed and an open state in which the housing is opened; and a fastening module formed to connect the housing and the outer door in the closed state to maintain a process gas for processing the substrate in the inner chamber at a first pressure higher than atmospheric pressure, and to maintain a shielding gas in the outer chamber at a second pressure set with respect to the first pressure, the fastening module including: a support protrusion configured to support the housing and the outer door; the shell is mounted on the shell; and a locking protrusion mounted on the outer door and supported by the support protrusion when the locking protrusion is converted from a first relationship offset with respect to the support protrusion to a second relationship corresponding to the support protrusion, one of the support protrusion and the locking protrusion including: a protrusion body; and a friction reducing member mounted on the protrusion body to contact the other of the support protrusion and the locking protrusion during transition from the first relationship to the second relationship, and having a lower coefficient of friction than the protrusion body and the other.

Description

Technical Field

[0001] The present invention relates to an apparatus for processing a substrate under high pressure. Background Art

[0002] Generally, in the manufacturing process of semiconductor elements, various processing is performed on the semiconductor chip. The processing includes oxidation, nitridation, vapor deposition, silicide and ion implantation. There is also a hydrogen or deuterium heat treatment process for improving the interface performance of the semiconductor element.

[0003] The gas used for processing is supplied to the chamber at high pressure and acts on the semiconductor chip. In order to maintain the high pressure inside the chamber, the connection between the chamber housing and the door must be strong. For this purpose, a fastening structure is adopted in which a part of the housing and a part of the door are joined to each other, and one supports the other.

[0004] In the process of reaching the state where one supports the other, friction is generated due to the relative movement between each other. Friction causes wear and particles. The airtightness between the housing and the door may deteriorate due to wear. The particles may contaminate the object to be processed.

[0005] The above-mentioned background technology refers to the technology that the inventor possesses in order to derive the embodiments of the present invention, or the technical information obtained in the derivation process, and therefore, it is not necessarily the known technology that has been disclosed to the public before the present application. Summary of the invention

[0006] Technical issues

[0007] An object of the present invention is to provide a high pressure substrate processing apparatus that minimizes wear and particles that may occur in the fastening structure of the chamber.

[0008] Technical Solution

[0009] To achieve the above-mentioned object, a high-pressure substrate processing device according to one aspect of the present invention may include: an inner chamber formed to accommodate a substrate to be processed; an outer chamber having: an outer shell and an outer door, wherein the outer shell is formed to accommodate the inner chamber, and the outer door is formed to move between a closed state in which the outer shell is closed and an open state in which the outer shell is opened; and a fastening module formed to connect the outer shell and the outer door in the closed state, so as to maintain a processing gas used for processing the substrate in the inner chamber at a first pressure higher than the atmospheric pressure, and to maintain a protective gas in the outer chamber at a second pressure set relative to the first pressure. Second pressure, the fastening module module includes: a support protrusion installed on the shell; and a locking protrusion installed on the outer door, and when the locking protrusion is converted from a first relationship offset relative to the support protrusion to a second relationship corresponding to the support protrusion, the support protrusion and one of the locking protrusions include: a protrusion body; and a friction reducing member installed on the protrusion body to contact the other of the support protrusion and the locking protrusion during the conversion from the first relationship to the second relationship, and has a lower friction coefficient than the protrusion body and the other.

[0010] Here, the protrusion body and the other may be formed of a first metal, and the friction reducing member may be formed of one of a reinforced plastic and a second metal softer than the first metal.

[0011] Here, it can be that the protrusion body includes: a receiving portion; and a peripheral portion, formed on at least one of the two sides of the receiving portion and protruding more than the receiving portion, and the friction reducing member includes: an insertion portion, inserted into the receiving portion; and a contact portion, supported on the peripheral portion and contacting the other in the closed state.

[0012] Here, the accommodation portion may extend along a direction intersecting the moving direction.

[0013] Here, the receiving portion may have a shape in which a width gradually narrows in a direction away from the protrusion body, and the insertion portion may have a shape corresponding to the shape of the receiving portion.

[0014] Here, one of the supporting protrusion and the locking protrusion may further include a fixing piece that fixes the friction reducing member to the protrusion body.

[0015] Here, the fastening module may further include a rotating member forming a second plane parallel to a first plane formed by the supporting protrusion and one of the locking protrusions, the supporting protrusion being formed to protrude from the rotating member and being used to support the locking protrusion when the rotating member rotates.

[0016] Here, the rotating member may include a rotating ring rotatably mounted on the housing.

[0017] Here, it may be that the supporting protrusion includes the friction reducing member, and the friction reducing member is arranged at an upper side of the protrusion body.

[0018] Here, the inner chamber may include an inner shell and an inner door, and the inner door is connected to the outer door and closes or opens the inner shell as it moves with the outer door.

[0019] Here, the second pressure may be a pressure higher than atmospheric pressure.

[0020] According to another aspect of the present invention, a high-voltage substrate processing device may include: a chamber having a shell and a door for opening and closing the shell; and a fastening module formed to fasten the shell and the door to maintain the process gas injected into the chamber at a pressure higher than atmospheric pressure, the fastening module including: a support protrusion mounted on the shell; and a locking protrusion mounted on the door and supported by the support protrusion when switching from a first relationship offset relative to the support protrusion to a second relationship corresponding to the support protrusion, one of the support protrusion and the locking protrusion including: a protrusion body; and a friction reducing member mounted on the protrusion body to contact the other of the support protrusion and the locking protrusion during the switching from the first relationship to the second relationship, and having a lower friction coefficient than the protrusion body and the other.

[0021] Here, the fastening module may further include a rotating ring rotatably mounted on the housing, and the supporting protrusion may be formed to protrude from the rotating ring and support the locking protrusion as the rotating ring rotates.

[0022] Here, the protrusion body and the other may be formed of a first metal, and the friction reducing member may be formed of one of a reinforced plastic and a second metal softer than the first metal.

[0023] Here, the protrusion body may include: a receiving portion; and a peripheral portion formed on at least one of the two sides of the receiving portion and protruding more than the receiving portion, and the friction reducing member may include: an insertion portion inserted into the receiving portion; and a contact portion supported on the peripheral portion and in contact with the other.

[0024] Effects of the Invention

[0025] According to the high-voltage substrate processing device of the present invention constructed as described above, the fastening module for fastening the shell and door of the chamber has a supporting protrusion and a locking protrusion supported thereon, and is provided with a friction reducing component one of which has a lower friction coefficient than the other, thereby significantly reducing wear or particle generation during the fastening process.

[0026] With less wear, the airtightness of the chamber can be maintained for a long time in a tightened state. Moreover, with less particle generation, the possibility of particle contamination of the object to be processed can be significantly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 FIG. 1 is a conceptual diagram of a high voltage substrate processing apparatus 100 according to an embodiment of the present invention.

[0028] Figure 2 To show Figure 1 FIG. 1 is a perspective view of a high-voltage substrate processing apparatus 100 in an open state in which an outer door 125 of a housing 121 is opened.

[0029] Figure 3 To show Figure 2 A cross-sectional view showing the relationship between the support protrusion 153 and the locking protrusion 157 when the inner and outer door 125 closes the housing 121 in a closed state.

[0030] Figure 4 To show Figure 2 A partial perspective view of a fastening state between a housing 121 and an outer door 125 in a high-voltage substrate processing apparatus 100 .

[0031] Figure 5 for Figure 2 An enlarged cross-sectional view of the support protrusion 153.

[0032] Figure 6 To show the basis Figure 5 FIG. 1 is a cross-sectional view of a support protrusion 153 ′ according to a modified example of the support protrusion 153 . DETAILED DESCRIPTION

[0033] Hereinafter, a high voltage substrate processing apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the drawings. In this specification, even in different embodiments, the same and similar reference numerals are given to the same and similar configurations, and the first description is substituted for the description.

[0034] Figure 1 FIG. 1 is a conceptual diagram of a high voltage substrate processing apparatus 100 according to an embodiment of the present invention.

[0035] Referring to the figure, the high-pressure substrate processing apparatus 100 may include an inner chamber 110 , an outer chamber 120 , a gas supply module 130 , and an exhaust module 140 .

[0036] The inner chamber 110 forms a receiving space for receiving a substrate to be processed. The inner chamber 110 may be made of a non-metallic material, such as quartz, to reduce the risk of contamination of the substrate in a high temperature and high pressure working environment. By operating a heater (not shown) disposed outside the inner chamber 110, the temperature of the inner chamber 110 may reach hundreds to thousands of degrees Celsius. The substrate may be, for example, mounted in a holder 113 (see Figure 2 ) on the semiconductor chip w (refer to Figure 2 ). The substrate is not limited to a chip (wafer), and can be used as long as the basic structure of the circuit can be manufactured. For example, the substrate can also include glass (glass) for manufacturing a display. The holder 113 can be a wafer boat (boat) that can stack the substrate into multiple layers.

[0037] The outer chamber 120 is arranged to accommodate the inner chamber 110. Unlike the inner chamber 110, the outer chamber 120 may be made of a metal material because it is not subject to contamination problems. The outer chamber 120 is formed in a hollow shape having an inner space so as to accommodate the inner chamber 110.

[0038] The gas supply module 130 is a structure for supplying gas to the inner chamber 110 and the outer chamber 120. The gas supply module 130 has a gas supplier 131 as a gas source. The gas supplier 131 can selectively supply a processing gas, such as hydrogen / deuterium gas, fluorine gas, ammonia gas, chlorine gas, nitrogen gas, etc., to the inner chamber 110. The gas supplier 131 can provide a protective gas, such as nitrogen gas as an inert gas, to the outer chamber 120. These processing gases and protective gases are respectively introduced into the inner chamber 110 or the outer chamber 120 through the processing gas pipeline 133 or the protective gas pipeline 135. The protective gas introduced into the outer chamber 120 is specifically supplied to the space between the outer chamber 120 and the inner chamber 110. The processing gas and the protective gas can be referred to as process gas.

[0039] The process gas can be supplied at a pressure higher than atmospheric pressure, for example, to form a high pressure of several atmospheres to tens of atmospheres. When the pressure of the process gas is a first pressure and the pressure of the protective gas is a second pressure, these can be maintained within a set relationship (range). For example, the second pressure can be set to be substantially equal to or slightly greater than the first pressure. This pressure relationship provides the advantage of preventing the reaction gas from leaking from the inner chamber 110 and preventing the inner chamber 110 from rupturing. The second pressure can be set to be slightly lower than the first pressure, and even in this case, a similar effect as before can be achieved.

[0040] The exhaust module 140 is used to exhaust the process gas. In order to exhaust the process gas from the inner chamber 110, an exhaust pipe 141 may be connected to the upper portion of the inner chamber 110. In order to exhaust the protective gas from the outer chamber 120, an exhaust pipe 145 connected to the outer chamber 120 may be similarly provided. Since the exhaust pipe 141 and the exhaust pipe 145 are connected to each other, the process gas is diluted by the protective gas during the exhaust process, and its concentration is reduced.

[0041] Reference Figures 2 to 4 The fastening structure of the outer chamber 120 will be described. Figure 2 To show Figure 1 A perspective view of the high-voltage substrate processing apparatus 100 in which the outer door 125 is opened and the housing 121 is opened, Figure 3 To show Figure 2 A cross-sectional view showing the relationship between the support protrusion 153 and the locking protrusion 157 when the outer door 125 closes the housing 121 in the closed state, Figure 4 To show Figure 2 A partial perspective view of a fastening state between a housing 121 and an outer door 125 in a high-voltage substrate processing apparatus 100 .

[0042] Referring to these figures, the inner chamber 110 includes an inner shell 111 and an inner door 115. The inner shell 111 forms a storage space for accommodating the substrate W, and its lower portion may have an open shape. The inner door 115 has a shape that closes the open lower portion of the inner shell 111. The inner door 115 may have a groove shape that is open downward as a whole, and when the inner door 115 is lowered along the opening and closing direction E, the storage space is opened (open state, refer to FIG. Figure 2 ). The opening and closing direction E is the direction in which the inner door 115 approaches or moves away from the inner shell 111. The substrate W can be loaded into or unloaded from the accommodation space in the open state. When the inner door 115 rises along the opening and closing direction E, the inner door 115 contacts the inner shell 111. In this case, the accommodation space can be closed (closed state).

[0043] The outer chamber 120 includes an outer shell 121 and an outer door 125. The outer shell 121 may be formed to accommodate the entire inner chamber 110. Thus, the outer shell 121 may be formed to surround not only the inner shell 111 but also the inner door 115. The outer door 125 may also open and close the outer shell 121 as it moves. The outer door 125 is connected to the inner door 115 by a supporting member 127 and is capable of supporting the inner door 115. In this case, the inner door 115 opens and closes the inner shell 111 while moving in conjunction with the lifting movement of the outer door 125. The description of the open state and the closed state may also be applied to the relationship between the outer shell 121 and the outer door 125.

[0044] The high-voltage substrate processing apparatus 100 may further include a fastening module 150 for fastening the outer housing 121 and the outer door 125 in the closed state. Since the inner door 115 is supported on the outer door 125 by the support member 127, the fastening module 150 also fastens the inner door 115 to the inner housing 111. The fastening module 150 maintains the protective gas at the second pressure in the outer chamber 120. The fastening module 150 applies a fastening force so that the processing gas is maintained at the first pressure in the inner chamber 110.

[0045] Specifically, the fastening module 150 may include a rotating ring 151 , a supporting protrusion 153 , and a locking protrusion 157 .

[0046] The rotating ring 151 is mounted on the housing 121 and rotates around the central axis of the housing 121. Specifically, an annular guide groove 123 may be formed on the outer surface of the housing 121. The rotating ring 151 may be inserted into the guide groove 123 and rotate along the periphery of the housing 121. The force for rotating the rotating ring 151 may be provided by a driving wheel (not shown) in contact with the rotating ring 151. The rotating ring 151 may be formed as a second plane parallel to a first plane formed by a support protrusion 153 or a locking protrusion 157 described later. The first plane and the second plane may be planes substantially perpendicular to the opening and closing direction E.

[0047] The support protrusion 153 may be a protrusion mounted on the housing 121. The support protrusion 153 may be mounted on the housing 121 via the rotating ring 151. Specifically, the support protrusion 153 protrudes from the inner circumferential surface of the rotating ring 151, and a plurality of support protrusions 153 may be arranged along the circumferential direction of the rotating ring 151.

[0048] The supporting protrusion 153 may include a protrusion body 154 and a friction reducing member 155. The protrusion body 154 may be formed as a whole with the rotating ring 151. The friction reducing member 155 may be installed on the upper side of the protrusion body 154 as a member independent of the rotating ring 151. If the friction reducing member 155 can contact the locking protrusion 157, the protrusion body 154 supports the friction reducing member 155.

[0049] The friction reducing member 155 may have a lower friction coefficient than the retaining protrusion 157 and the protrusion body 154. For example, if the retaining protrusion 157 or the protrusion body 154 is made of a first metal, the friction reducing member 155 may be made of a second metal that is softer than the first metal. The friction reducing member 155 may also be formed of reinforced plastic.

[0050] The locking protrusion 157 may be a protrusion provided on the outer door 125. The locking protrusion 157 has a size that passes between a pair of adjacent support protrusions 153 when the outer door 125 rises along the opening and closing direction E. In the closed state, the locking protrusion 157 is located at a higher level than the support protrusion 153 (see Figure 3 ). When the support protrusion 153 rotates along the rotation direction R, the locking protrusion 157 is located on the support protrusion 153 and supported by the support protrusion 153 (fastened state, see Figure 4 ). In the fastened state, the horizontal plane of the outer door 125 may be substantially the same as the horizontal plane in the closed state. The fastened state may be understood as a state of one of the closed states.

[0051] According to this structure, the locking protrusion 157 is in a state where the positioning is offset relative to the supporting protrusion 153 (first relationship, see Figure 3 ), the outer door 125 rises along the opening and closing direction E and becomes closed. When the rotating ring 151 rotates along the rotation direction R in the closed state, the support protrusion 153 rotates relative to the locking protrusion 157. The upper surface of the support protrusion 153 contacts the lower surface of the locking protrusion 157 and rotates. By this rotation, the support protrusion 153 is positioned corresponding to the locking protrusion 157 (second relationship, see Figure 2 ).

[0052] Since the upper surface of the support protrusion 153 is the friction reducing member 155, the friction reducing member 155 minimizes the friction with the stop protrusion 157 due to the low friction coefficient. As a result, during the transition from the first relationship to the second relationship, the wear of the support protrusion 153 and the stop protrusion 157 and the generation of particles caused thereby can be suppressed.

[0053] In the above, it is explained that the friction reducing member 155 is a part of the support protrusion 153, but the friction reducing member 155 may also be a part of the stop protrusion 157. In this case, the friction reducing member 155 occupies the lower part of the stop protrusion 157 and may contact the upper surface of the support protrusion 153 during the rotation.

[0054] In the above, an example in which the support protrusion 153 rotates when the locking protrusion 157 is stopped is shown, however, in an alternative embodiment, the locking protrusion 157 can be rotated when the support protrusion 153 is stopped. In the latter case, a rotating member (not shown) is rotatably mounted on the outer door 125, and the locking protrusion 157 can protrude from the rotating member. The rotating member can also be formed to form the second plane. The rotating member is located in the space defined by the housing 121 and can rotate around an axis passing through the center of the peripheral surface of the outer door 125. The rotating member can have an annular rotating ring that accommodates the outer door 125.

[0055] In another alternative embodiment, the locking protrusion 157 can have rotation and other modes relative to the supporting protrusion 153, such as translation. In this case, the friction between the locking protrusion 157 and the supporting protrusion 153 occurring during the transition from the first relationship to the second relationship can be reduced by the friction reducing member 155.

[0056] Will refer to Figure 5 The specific shape of the support protrusion 153 will be described. Figure 5 Tie Figure 2 An enlarged cross-sectional view of the support protrusion 153.

[0057] Reference Figure 5 The protrusion body 154 may include a receiving portion 154a and a peripheral portion 154b.

[0058] The accommodation portion 154a is a portion formed concavely compared to the peripheral portion 154b. The accommodation portion 154a may be located at a central portion along the width direction of the protrusion body 154. The accommodation portion 154a may extend along an extension direction intersecting the rotation direction R (a direction through the image).

[0059] The peripheral portion 154b is located at one side of the receiving portion 154a. As in the present embodiment, the peripheral portion 154b may be formed at both sides of the receiving portion 154a. The peripheral portion 154b has a shape that is more protruding than the receiving portion 154a.

[0060] The friction reducing member 155 may include an inserting portion 155 a and a contact portion 155 b .

[0061] The insertion portion 155a is a portion inserted into the receiving portion 154a. The insertion portion 155a has a size corresponding to the receiving portion 154a and can be inserted into the receiving portion 154a without a gap. The insertion portion 155a can be inserted into the receiving portion 154a by sliding along the extending direction.

[0062] The contact portion 155b may be a portion located above the insertion portion 155a. The contact portion 155b may be supported by the peripheral portion 154b. The contact portion 155b is in contact with the locking protrusion 157 (see Figure 2 ) part in contact.

[0063] In order to fix the friction reducing member 155 to the protrusion body 154, a fixing piece 159 may be further provided. The fixing piece 159 is inserted into the friction reducing member 155 and the protrusion body 154 in a direction from the friction reducing member 155 to the protrusion body 154. The upper surface of the fixing piece 159 may be formed in a concave shape so as to minimize contact with the locking protrusion 157.

[0064] According to this configuration, the insertion portion 155 a is inserted into the accommodation portion 154 a but cannot move in the rotation direction R. Due to the fixing piece 159 , the insertion portion 155 a cannot be disengaged from the accommodation portion 154 a in the height direction.

[0065] Will refer to Figure 6 Other shapes of the support protrusion 153 will be described. Figure 6 The system shows that Figure 5 FIG. 1 is a cross-sectional view of a support protrusion 153 ′ according to a modified example of the support protrusion 153 .

[0066] Reference Figure 6 , the first receiving portion 154a' of the protrusion body 154' may have a shape in which the width becomes narrower in a direction away from the protrusion body 154'. The first insertion portion 155a' may have a shape corresponding to the shape of the receiving portion 154a'.

[0067] A second receiving portion 154a' may be formed on both sides of the receiving portion 154a'. The receiving portion 154a' may have the same structure as the previous receiving portion 154a (see Figure 5 ) The second insertion portion 155a" may also have a shape corresponding to the accommodating portion 154a".

[0068] According to this configuration, the insertion portion 155a' is inserted into the accommodation portion 154a' but cannot move in the rotation direction R. The insertion portion 155a' does not come off from the accommodation portion 154a' in the height direction due to the fixing piece 159' and the engagement structure between the insertion portion 155a' and the accommodation portion 154a'.

[0069] Due to the engagement between the insertion portion 155a" and the accommodation portion 154a", both ends of the contact portion 155b' are not lifted by the shear force along the rotation direction R. The shear force is a force applied to the contact portion 155b' by the locking protrusion 157 along the rotation direction R during the rotation.

[0070] In this specification, a processing device having dual chambers 110 and 120 is exemplified as a high-voltage substrate processing device 100, but the present invention is not limited thereto. A processing device having a single chamber also falls within the scope of the present invention. The single chamber is composed of a shell and a door. A substrate is arranged in the chamber, and a process gas for processing the substrate is specifically supplied with a process gas. The fastening module 150 is also applied to this single chamber. Even if there is pressure of the process gas in the module, the door is firmly fastened to the shell by the fastening module 150.

[0071] In this specification, a batch type processing apparatus is described as an example, but the present invention is not limited thereto and can also be applied to a single wafer type processing apparatus.

[0072] Possibility of industrial application

[0073] The present invention has industrial applicability in the field of high-voltage substrate processing device manufacturing.

Claims

1. A high voltage substrate processing device, wherein: include: an inner chamber formed to accommodate a substrate to be processed; The outer chamber comprises: a housing formed to accommodate the inner chamber; an outer door formed to move between a closed state for closing the housing and an open state for opening the housing; as well as a fastening module formed to connect the housing and the outer door in the closed state to maintain the processing gas for processing the substrate in the inner chamber at a first pressure higher than the atmospheric pressure, and to maintain the protective gas in the outer chamber at a second pressure set relative to the first pressure, The fastening module comprises: a supporting protrusion mounted on the housing; and a latching protrusion mounted on the outer door and supported by the support protrusion when the latching protrusion is switched from a first relationship offset relative to the support protrusion to a second relationship corresponding to the support protrusion, One of the supporting protrusion and the locking protrusion comprises: a protrusion body; and A friction reducing member is mounted on the protrusion body to contact the other of the support protrusion and the locking protrusion during the transition from the first relationship to the second relationship and has a lower friction coefficient than the protrusion body and the other.

2. The high voltage substrate processing apparatus according to claim 1, wherein: The protrusion body and the other are formed of a first metal, and the friction reducing member is formed of one of a reinforced plastic and a second metal softer than the first metal.

3. The high voltage substrate processing apparatus according to claim 1, wherein: The protrusion body includes: a receiving portion; and a peripheral portion formed on at least one of two sides of the receiving portion and protruding more than the receiving portion. The friction reducing member includes: an insertion portion inserted into the accommodation portion; and a contact portion supported on the peripheral portion and in contact with the other portion in the closed state.

4. The high voltage substrate processing apparatus according to claim 3, wherein: The accommodation portion extends along a direction intersecting the moving direction.

5. The high voltage substrate processing apparatus according to claim 3, wherein: The receiving portion has a shape whose width gradually narrows in a direction away from the protrusion body, and the insertion portion has a shape corresponding to the shape of the receiving portion.

6. The high voltage substrate processing apparatus according to claim 1, wherein: One of the support protrusion and the locking protrusion further includes a fixing piece that fixes the friction reducing member to the protrusion body.

7. The high voltage substrate processing apparatus according to claim 1, wherein: The fastening module further includes a rotating member forming a second plane parallel to a first plane formed by one of the supporting protrusion and the locking protrusion, The supporting protrusion is formed to protrude from the rotating member and is in a position to support the locking protrusion as the rotating member rotates.

8. The high voltage substrate processing apparatus according to claim 7, wherein: The rotating member includes a rotating ring rotatably mounted on the housing.

9. The high voltage substrate processing apparatus according to claim 1, wherein: The support protrusion includes the friction reducing member, which is arranged on an upper side of the protrusion body.

10. The high voltage substrate processing apparatus according to claim 1, wherein: The inner chamber comprises an inner shell and an inner door, wherein the inner door is connected to the outer door and moves in conjunction with the outer door to close or open the inner shell.

11. The high voltage substrate processing apparatus according to claim 1, wherein: The second pressure is a pressure higher than atmospheric pressure.

12. A high voltage substrate processing device, wherein: include: A chamber having a shell and a door for opening and closing the shell; as well as a fastening module formed to fasten the housing and the door to maintain the process gas injected into the chamber at a pressure higher than atmospheric pressure, The fastening module comprises: a supporting protrusion mounted on the housing; and a latching protrusion mounted on the door and supported by the support protrusion when switching from a first relationship offset relative to the support protrusion to a second relationship corresponding to the support protrusion, One of the supporting protrusion and the locking protrusion comprises: a protrusion body; and A friction reducing member is mounted on the protrusion body to contact the other of the support protrusion and the locking protrusion during the transition from the first relationship to the second relationship and has a lower friction coefficient than the protrusion body and the other.

13. The high voltage substrate processing apparatus according to claim 12, wherein: The fastening module further comprises a rotating ring rotatably mounted in the housing. The supporting protrusion is formed to protrude from the rotating ring and is in a position to support the locking protrusion as the rotating ring rotates.

14. The high voltage substrate processing apparatus according to claim 12, wherein: The protrusion body and the other are formed of a first metal, and the friction reducing member is formed of one of a reinforced plastic and a second metal softer than the first metal.

15. The high voltage substrate processing apparatus according to claim 12, wherein: The protrusion body includes: a receiving portion; and a peripheral portion formed on at least one of two sides of the receiving portion and protruding more than the receiving portion. The friction reducing member includes: an insertion portion inserted into the accommodation portion; and a contact portion supported on the peripheral portion and in contact with the other portion.

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