Substrate, power module, electrical apparatus, and method of manufacturing power module

Abstract

The invention relates to a substrate (1) for a power module, the substrate (1) being substantially rectangular in plan view and having two opposite long sides (2A, 2B) and two opposite short sides (3A, 3B), and the substrate (1) having a plurality of semiconductors (4) for converting a three-phase alternating voltage (AC) into a positive, medium and negative direct voltage (DC), or the positive, medium and negative DC voltages (DC) are converted into a three-phase AC voltage (AC). In particular, in order to provide an improved substrate, it is proposed that the substrate also has: three AC connections (AC1, AC2, AC3) arranged on the long sides (2A, 2B); a positive direct current connection (DCP) arranged on the first short side (3A); a first intermediate direct current connection (DCM1) arranged on the first short side (3A); a second intermediate DC connection (DCM2) arranged on the second short side (3B); and a negative direct current connection (DCN) arranged on the second short side (3B), in which the positive direct current connection (DCP) is arranged closer to the first long side (2A) than the first intermediate direct current connection (DCM1) and the negative direct current connection (DCN) is arranged closer to the second long side (2B) than the second intermediate direct current connection (DCM2).

Description

Technical Field

[0001] The present invention relates to a substrate for a power module, wherein the substrate is designed to be essentially rectangular in plan view, having two opposite long sides and two opposite short sides, and wherein the substrate has a plurality of semiconductors for converting a three-phase alternating current (AC) voltage into positive, neutral and negative direct current (DC) voltages, or converting positive, neutral and negative direct current (DC) voltages into a three-phase alternating current (AC) voltage.

[0002] Furthermore, the invention relates to a power module having at least one such base plate.

[0003] Furthermore, the invention relates to an electrical device, in particular a converter, having at least one such power module.

[0004] Finally, the invention relates to a method of manufacturing such a power module. Background Art

[0005] Such devices or methods are used in a variety of power electronics applications. For example, in multiphase semiconductor modules with a half-bridge topology, the intermediate circuit connections are symmetrically routed to both sides to achieve the most balanced inductance possible for each phase. This is also desirable in three-level topologies, leading to further space requirements. However, this can be difficult to achieve in small packages due to the limited space available for the connections and the need to maintain air gaps and leakage paths. Alternatively, other housing types can be chosen to provide more space, for example.

[0006] US Pat. No. 8,847,328 B1 discloses a power semiconductor module having four power connections. An insulated gate bipolar transistor (IGBT) has a collector connected to a first power connection and an emitter coupled to a third power connection. An antiparallel diode is coupled in parallel to the IGBT. A DC voltage connection is connected between the second and fourth power connections. The DC link can include two diodes and two IGBTs, wherein the IGBTs are connected to a common collector in one configuration. The first and second power connections are arranged in a first row along one side of the module, and the third and fourth power connections are arranged in a second row along the opposite side of the module. Two identical instances of the module can be interconnected to form a three-layer NPC phase leg with low leakage inductance, wherein the phase leg has two parallel DC connections. Summary of the Invention

[0007] The object of the present invention is to provide an improved substrate, a corresponding power module, a corresponding electrical device and a corresponding method for producing a power module.

[0008] One solution to this object is provided by a baseplate of the type described above, which also has three AC connections arranged on the long sides, a positive DC connection arranged on the first short side, a first intermediate DC connection arranged on the first short side, a second intermediate DC connection arranged on the second short side, and a negative DC connection arranged on the second short side, wherein the positive DC connection is arranged closer to the first long side than the first intermediate DC connection, and the negative DC connection is arranged closer to the second long side than the second intermediate DC connection.

[0009] Another solution to this object is provided by a power module of the aforementioned type, which comprises the proposed base plate and a module housing which at least partially surrounds the base plate.

[0010] A further solution to this object is provided by an electrical device having at least one first intermediate circuit capacitor, which is connected between a module DC connection electrically connected to the positive DC connection on the one hand and a module DC connection electrically connected to the intermediate DC connection on the other hand, and having at least one second intermediate circuit capacitor, which is connected between a module DC connection electrically connected to the negative DC connection on the one hand and a module DC connection electrically connected to the intermediate DC connection on the other hand.

[0011] Finally, the object is achieved by a method for producing a power module, comprising the following method steps:

[0012] - Provides output power modules with:

[0013] at least two output power module voltage connections provided on the first short side,

[0014] at least two output power module voltage connections provided on the second short side,

[0015] - an output module housing for receiving and at least partially encapsulating the substrate, and

[0016] - Introducing the substrate into the output power module,

[0017] -Electrically connect the four DC connectors of the base plate to the four output power module voltage connectors respectively.

[0018] The proposed substrate can be, for example, a DCB (direct copper bonding) substrate or an AMB (active metal brazing) substrate. In some examples, a printed circuit board (PCB) can also be used as the substrate. In addition, the substrate can also be designed as a two-part or multi-part substrate.

[0019] In plan view, the substrate is designed to be essentially rectangular, wherein the substrate can be designed as a plate or a parallelepiped. If the substrate is designed as two-part or multi-part, the substrate formed by the two or more substrate parts has an essentially rectangular outline in plan view.

[0020] To convert a three-phase AC voltage into three different DC voltages, or vice versa, the substrate comprises a plurality of semiconductors, such as transistors, which can be designed as power MOSFETs, IGBTs, etc., or diodes. These semiconductors are preferably power semiconductors and are further suitable for interconnection and electrical connection to the DC and AC connections, for example, according to a three-stage design.

[0021] It is proposed that three AC connections for the three phases of the AC voltage be arranged on the long sides of a substantially rectangular baseplate. Of note, four DC connections are provided for three different DC voltages: a positive DC connection for a positive DC voltage, two intermediate DC connections for a neutral or intermediate DC voltage, and a negative DC connection for a negative DC voltage. These four DC connections are arranged on the short sides of the substantially rectangular baseplate. The positive DC connection and a first intermediate DC connection are arranged on a first short side of the substantially rectangular baseplate, with the positive DC connection being arranged closer to the first long side of the substantially rectangular baseplate than the first intermediate DC connection. The second intermediate DC connection and the negative DC connection are arranged on a second short side of the substantially rectangular baseplate, with the negative DC connection being arranged closer to the second long side of the substantially rectangular baseplate than the second intermediate DC connection.

[0022] For ease of explanation, let's assume the baseplate is viewed from a plan view, with the long sides at the top and bottom, and the short sides at the right and left. The AC connectors are then arranged at the top and / or bottom, with the positive DC connector at the top left, the first intermediate DC connector at the bottom left, the second intermediate DC connector at the top right, and the negative DC connector at the bottom right.

[0023] The baseplate design, particularly the specific arrangement of the AC and DC connectors, results in a relatively uniform distribution of impedance or inductance, particularly across the three AC voltage phases within the baseplate. This relatively uniform impedance distribution is further enhanced by the relatively symmetrical impedance of the individual AC voltage phases due to the arrangement of the DC connectors. Consequently, during operation of the baseplate or corresponding power module, the loading of the individual AC voltage phases is relatively uniform, which offers significant advantages. Unevenly loaded AC voltage phases can cause particularly strong heating of a particular AC voltage phase during operation of the baseplate or the proposed power module, thereby impacting the lifespan of the components of that AC voltage phase and, consequently, the baseplate and power module. Furthermore, additional cooling measures may be required to address the more intense heating of a particular AC voltage phase. For example, structural measures such as larger heat sinks can result in higher costs and sometimes require more space, leading to a larger power module size without necessarily improving electrical performance.

[0024] Furthermore, the baseplate design allows the use of established housing types as module housings. Furthermore, the arrangement of the DC terminals, in particular, allows capacitors to be placed close to their respective potentials, typically closer than 20% or 10% of the baseplate diagonal when viewed from above. For example, new module or housing types, which would be either larger or require new manufacturing technologies, are not required. This also makes it easier to implement platforms within a device family.

[0025] In an advantageous embodiment of the invention, three AC connections are arranged on one of the two sides, preferably on the first long side.

[0026] This means that all three AC connections are arranged on the same long side, which in particular facilitates the design of a symmetrical arrangement. These three AC connections can be arranged, for example, on the first long side (the top in the above example) or the second long side (the bottom), while the DC connections can be arranged for symmetry reasons as described above, or in a point-symmetrical mirrored arrangement relative to the center of the baseplate (in the above example: positive DC connection at the top left, first middle DC connection at the bottom left, second middle DC connection at the top right, negative DC connection at the bottom right; or in a point-symmetrical arrangement: negative DC connection at the top left, second middle DC connection at the bottom left, first middle DC connection at the top right, positive DC connection at the bottom right).

[0027] In another advantageous embodiment of the invention, the substrate is designed such that the impedances between the DC connections of each phase of the three-phase AC voltage are equal within a tolerable deviation of 25%, in particular 15% or 10%.

[0028] For example, the impedance between the positive DC connection and the negative DC connection, i.e. the AC voltage resistance, is equal within a tolerable deviation range within each phase of the three-phase AC voltage. This means in particular that the impedance between the positive DC connection and the negative DC connection along the first phase of the three-phase AC voltage is equal to the impedance between the positive DC connection and the negative DC connection along the second phase of the three-phase AC voltage within a tolerable deviation range, which in turn is equal to the impedance between the positive DC connection and the negative DC connection along the third phase of the three-phase AC voltage within a tolerable deviation range. The same applies to the impedance between the positive DC connection and the two DC connections of the intermediate DC voltage, as well as the impedance between the negative DC connection and the two DC connections of the intermediate DC voltage. These impedances are in particular the same within a tolerable deviation range at the operating frequency of the substrate or semiconductor. If the semiconductor is designed as a transistor, the impedance is in particular the same within a tolerable deviation range within the switching frequency or clock frequency of the transistor. In some examples, the corresponding inductances between the DC connections of the two DC voltages for the three phases of the AC voltage are the same within a tolerable deviation range. More details on this aspect will be described below. Figure 2 Further explanation in.

[0029] The tolerable deviation range is at most 25%, preferably at most 15% or at most 10%.

[0030] To ensure that the impedances are uniform within a tolerable range, the substrate can, for example, be designed symmetrically or approximately symmetrically. A symmetrical substrate design can, for example, include three AC terminals arranged approximately equidistantly and approximately midway between the two short sides. Preferably, the three AC terminals are arranged very close together in a plan view of the substrate, in particular, closer than 20% or 10% of the substrate's diagonal. Furthermore, the conductors or conductor paths connecting the AC terminals to the semiconductors, or connecting the semiconductors to the DC terminals, can be designed approximately symmetrically, or have approximately the same cross-section and approximately the same inductance. In particular, the impedances of the conductors or conductor paths can be precalculated or simulated and adjusted or matched to achieve the desired impedance. This adjustment or matching can be achieved, for example, by making the conductors or conductor paths' cross-sections larger or smaller than originally planned, or by arranging them on the substrate in a manner different from the shortest possible connection, in order to achieve the best possible matching of the inductances or impedances between the conductors or conductor paths.

[0031] In another advantageous embodiment of the invention, the base plate is designed such that the impedance between the positive DC connection and the two intermediate DC connections for the three phases of the AC voltage is equal within a tolerable deviation range and furthermore equal within a tolerable deviation range to the impedance between the negative DC connection and the two intermediate DC connections for the three phases of the AC voltage.

[0032] As described above, the impedances between the positive DC connection and the two DC connections of the intermediate DC voltage are equal to one another within a tolerable range, while the impedances between the negative DC connection and the two connections of the intermediate DC voltage are equal to one another within an acceptable range. For reasons of symmetry, in particular to achieve the most uniform possible loading of the AC voltage phases during operation of the baseplate or power module, the impedances between the positive DC connection and the two connections of the intermediate DC voltage continue to be equal to the impedances between the negative DC connection and the two connections of the intermediate DC voltage within an acceptable range, taking into account the three phases of the AC voltage. More details on this aspect will be provided below. Figure 2 Further explanation in.

[0033] As described above, the proposed power module includes a module housing, which, for example, is partially designed in the shape of a frame and houses and secures a substrate in its center. In addition to the frame-shaped housing portion, the module housing may also include a cover that protects the substrate from environmental influences and prevents hazards caused by voltages present during power module operation. In some examples, the module housing includes multiple recesses for accommodating connection pins. The three AC connectors and four DC connectors of the substrate can then be electrically connected to at least one connection pin, each of which is mounted in a recess of the module housing.

[0034] In another advantageous embodiment of the present invention, the power module has three module AC connections arranged on the long sides, which are electrically connected to the three AC connections of the baseplate, and four module DC connections arranged on the short sides, which are electrically connected to the four DC connections of the baseplate. The individual electrical connections can be made via the aforementioned connecting pins, if the module housing has such pins.

[0035] To enable the power module to be powered by, or to draw from, three-phase AC voltage or the three aforementioned DC voltages, the power module has three module AC connectors and four module DC connectors. The three AC connectors on the baseboard are electrically connected to the three module AC connectors, and the four DC connectors on the baseboard are electrically connected to the four module DC connectors. Like the three AC connectors on the baseboard, the three module AC connectors are arranged on the long sides, while the four module DC connectors—like the DC connectors on the baseboard—are arranged on the short sides. This power module design allows for short, direct electrical connections between the module AC connectors and the module DC connectors and the corresponding AC and DC connectors on the baseboard. In some examples, these connections are made via suitable connecting pins.

[0036] In another advantageous embodiment of the present invention, the module DC connector electrically connected to the positive DC connector and the module DC connector electrically connected to the first intermediate DC connector are arranged on the first short side, wherein the module DC connector electrically connected to the positive DC connector is arranged closer to the first long side than the module DC connector electrically connected to the first intermediate DC connector, and the module DC connector electrically connected to the negative DC connector and the module DC connector electrically connected to the second intermediate DC connector are arranged on the second short side, wherein the module DC connector electrically connected to the negative DC connector is arranged closer to the second long side than the module DC connector electrically connected to the second intermediate DC connector.

[0037] The described design, and in particular the arrangement of the module AC connections and module DC connectors, enables a particularly short and direct electrical connection to the corresponding AC or DC connectors on the baseplate. This further reduces electrical losses and unnecessary inductances during operation, while also supporting uniform loading of the individual AC voltage phases.

[0038] The specific design of this aspect will be described in the following Figures 4 to 7 Further explanation in.

[0039] In another advantageous embodiment of the invention, the power module further comprises a first backup capacitor, which is connected between the positive DC voltage at the positive DC connection and the intermediate DC voltage at the first intermediate DC connection, and a second backup capacitor, which is connected between the negative DC voltage at the negative DC connection and the intermediate DC voltage at the second intermediate DC connection.

[0040] Backup capacitors, or decoupling capacitors, are used in high-frequency and complex digital circuits to stabilize the power supply voltage. Functionally, backup capacitors are similar to filter capacitors. Each circuit or circuit section has one or more capacitors connected in parallel to the power supply voltage. These capacitors act as voltage or energy sources during periods of high current or power demand. Due to their low impedance at high frequencies, they reduce the impedance of the parent power supply or its leads, preventing the energy supplies of subcircuits from interfering with each other. On output signal lines, they reduce overshoot and undershoot of signal levels, thereby reducing the potential for interference in signal processing. Conversely, capacitors absorb interfering, brief overvoltages in electronic circuits, reducing their propagation and harmful effects.

[0041] The aforementioned, particularly symmetrical, arrangement of the DC connectors or module DC connectors is particularly advantageous for providing a convenient arrangement of backup capacitors for the relevant commutation branches outside the module. In particular, the individual backup capacitors can be spatially close together, particularly within 20% or 10% of the substrate diagonal when viewed from above, thereby further reducing electrical losses and undesirable inductances during operation. Preferably, the electrical connection length of each backup capacitor to each DC connector does not exceed 20% or 10% of the substrate diagonal when viewed from above.

[0042] In another advantageous embodiment of the present invention, the power module further comprises a printed circuit board, wherein the first backup capacitor and the second backup capacitor are each arranged on the printed circuit board.

[0043] The circuit board can be, for example, a printed circuit board (PCB), another DCB substrate, another AMB substrate, or the like. Preferably, the circuit board is arranged near the substrate to ensure a short electrical connection between each backup capacitor and each DC connector.

[0044] In another advantageous embodiment of the present invention, the first backup capacitor and the second backup capacitor are each arranged on a substrate.

[0045] The electrical connection of particularly short backup capacitors to the respective DC connections can be achieved by arranging the respective backup capacitors on the substrate and appropriately electrically connecting them to the respective DC connections. Preferably, a first backup capacitor is arranged in the region of a first short side and a second backup capacitor is arranged in the region of a second short side, wherein the distance between the respective backup capacitors and the respective short side does not exceed 20% or 10% of the substrate diagonal when viewed from above.

[0046] In another advantageous embodiment of the present invention, the power module can be operated with an electrical power of at least several tens of kilowatts, preferably 40 kilowatts to 500 kilowatts, with an AC voltage of at least several hundred volts, preferably 280 volts to 800 volts, with a DC voltage of at least several hundred volts, preferably 800 volts to 1500 volts, and / or with a current of several tens of amperes, preferably 70 amperes to 1000 amperes.

[0047] As described above, the proposed electrical device comprises at least one power module, at least one first intermediate circuit capacitor and at least one second intermediate circuit capacitor.

[0048] In some variations, the electrical device may be designed as a rectifier for rectifying a three-phase AC voltage into three DC voltages. To this end, the electrical device may, for example, have only one appropriately electrically connected power module. In other variations, the electrical device may be designed as an inverter for inverting three DC voltages into a three-phase AC voltage. To this end, the electrical device may, for example, have only one appropriately electrically connected power module. If the electrical device includes both a rectifier and an inverter, the electrical device may be designed as a converter for converting a three-phase AC voltage into another three-phase AC voltage.

[0049] A particular advantage of the proposed method is that commercially available output power modules, or at least their output module housings, can be used. These modules are inexpensive and readily available in large quantities. For example, the IGBT modules "EconoDual3" from Infineon Technologies AG (Munich), "SEMiX" from SEMIKRON Elektronik GmbH & Co. KG (Nuremberg), or "SD3" from Siemens AG (Munich) or their module housings can be used as output power modules or output module housings. These IGBT modules are specifically designed for use in Level 2 technology, for example, to implement a single half-bridge using multiple individual IGBT semiconductors.

[0050] The proposed method eliminates the need for expensive special adjustments, which are difficult to obtain on the market due to the low expected quantities. In particular, conventional circuit boards or conventional substrates can be omitted in output power modules or output module housings, as the output power modules or output module housings are enhanced by being equipped with the proposed substrate.

[0051] For this purpose, the above-mentioned output power module or output module housing is equipped with the proposed base plate. Subsequently, the four DC terminals of the base plate are electrically connected to the four output power module voltage terminals.

[0052] In another advantageous embodiment of the present invention, the positive DC connection and the first intermediate DC connection are electrically connected to two output power module voltage connections located on the first short side, wherein the output power module voltage connection electrically connected to the positive DC connection is arranged closer to the first long side than the output power module voltage connection electrically connected to the first intermediate DC connection, and the negative DC connection and the second intermediate DC connection are electrically connected to the two output power module voltage connections located on the second short side, wherein the output power module voltage connection electrically connected to the negative DC connection is arranged closer to the second long side than the output power module voltage connection electrically connected to the second intermediate DC connection.

[0053] Preferably, each of the four output power module voltage connections and each of the four DC connections of the baseplate are arranged on the same short side, so that a short electrical connection can be achieved between the connections, wherein the electrical connection is preferably shorter than 20% or 10% of the baseplate diagonal in plan view.

[0054] In another preferred embodiment of the present invention, three module AC connectors are provided on the long sides of the output power module, and electrical connections are established from the three AC connectors of the baseplate to the three module AC connectors. Preferably, the three module AC connectors and the three AC connectors of the baseplate are arranged on the same long side, thereby enabling short electrical connections between the mating connectors. Each electrical connection is preferably shorter than 20% or 10% of the baseplate diagonal as viewed in plan. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Next, the present invention will be described and explained in detail based on the embodiments shown in the drawings.

[0056] Figure 1 shows a first embodiment of the proposed substrate,

[0057] Figure 2 A circuit diagram showing a second embodiment of the proposed substrate,

[0058] Figure 3-Figure 8 shows the first to sixth embodiments of the proposed power module,

[0059] Figure 9 shows an embodiment of the proposed electrical device,

[0060] Figure 10 A flow chart showing an embodiment of the proposed method for manufacturing an embodiment of a power module is shown. DETAILED DESCRIPTION

[0061] Figure 1 A first embodiment of the proposed substrate 1 is shown, wherein a plan view is schematically illustrated.

[0062] In the plan view shown, the substrate 1 is substantially rectangular and thus has two opposite long sides 2A and 2B and two opposite short sides 3A and 3B. In addition, the substrate 1 has a plurality of semiconductors 4, which are shown in FIG. Figure 1 Only two semiconductors 4 are shown. The semiconductors 4 are used to convert three-phase alternating current (AC) voltage into positive, neutral and negative direct current (DC) voltages, or convert positive, neutral and negative direct current (DC) voltages into three-phase alternating current (AC) voltages.

[0063] On the long sides 2A, 2B, the base plate 1 has three AC connectors AC1, AC2, AC3 for applying a three-phase AC voltage (AC) to the base plate 1 or obtaining a three-phase AC voltage (AC) from the base plate 1. The three AC connectors AC1, AC2, AC3 are preferably arranged on one of the two long sides 2A, 2B, for example. Figure 1 As shown, on the first long side 2A and the first short side 3A, the baseboard 1 has a positive DC connector DCP for applying a positive DC voltage to or extracting a positive DC voltage from the baseboard 1. Furthermore, the baseboard 1 has a first intermediate DC connector DCM1 on the first short side 3A for applying an intermediate DC voltage to or extracting a positive DC voltage from the baseboard 1. The positive DC connector DCP is arranged closer to the first long side 2A than the first intermediate DC connector DCM1.

[0064] On the second short side 3B, the substrate 1 has a negative DC connection DCN for applying a negative DC voltage to or extracting a negative DC voltage from the substrate 1. Furthermore, on the second short side 3B, the substrate 1 has a second intermediate DC connection DCM2 for applying an intermediate DC voltage to or extracting a negative DC voltage from the substrate 1. The negative DC connection DCN is arranged closer to the second long side 2B than the second intermediate DC connection DCM2.

[0065] In order to realize the voltage conversion, the semiconductors 4 are appropriately connected to each other and electrically connected to the AC terminals AC1, AC2, AC3 and the DC terminals DCP, DCM1, DCM2, DCP. Figure 1 For clarity, this is not shown in detail, but Figure 2 It is shown as an example in FIG.

[0066] Figure 2 A circuit diagram of a second embodiment of the proposed substrate 1 is shown, wherein Figure 1 The same reference numerals in the drawings denote the same objects.

[0067] Unlike the first embodiment, according to the second embodiment, the substrate 1 includes a first backup capacitor 9A and a second backup capacitor 9B. The first backup capacitor 9A is connected between the positive DC voltage at the positive DC terminal DCP and the intermediate DC voltage at the first intermediate DC terminal DCM1. The second backup capacitor 9B is connected between the negative DC voltage at the negative DC terminal DCN and the intermediate DC voltage at the second intermediate DC terminal DCM2. Alternatively, the first backup capacitor 9A and the second backup capacitor 9B may be arranged outside the substrate 1 of the power module 5, for example, on a circuit board 10 included in the power module.

[0068] The substrate 1 has a total of nine semiconductors 4, numbered T1, T2, ..., T9. Between each AC connection AC1, AC2 or AC3, there is one semiconductor 4 connected to the positive DC connection DCP, the two intermediate DC connections DCM1 and DCM2, and the negative DC connection DCN. This arrangement allows the voltage conversion described above.

[0069] In addition, the substrate 1 has a total of ten impedances Z, of which Figure 2 The symbol Z_DCXY is used, where X represents the DC voltage bit (ie, positive, center / neutral, or negative DC voltage DCP, DCM, DCN), and Y is the number of each DC voltage bit.

[0070] The advantage of the substrate 1 is that it is designed so that the impedance Z between the two DC voltages DCP, DCM1, DCM2, DCN of the three-phase AC voltage is equal within a tolerable deviation range, wherein the tolerable deviation is 25%, in particular 15% or 10%.

[0071] In this example, the impedances between the positive DC connection DCP and the negative DC connection DCN for the three phases of the AC voltage are equal within a tolerable deviation, i.e. due to the series connection of the individual impedances:

[0072] For the first AC voltage phase (connected to AC connector AC1):

[0073] Z(DCP->DCN,AC1)=Z_DCP1+Z_DCN3+Z_DCN2+Z_DCN1

[0074] For the second AC voltage phase (connected to AC connector AC2):

[0075] Z(DCP->DCN,AC2)=Z_DCP1+Z_DCP2+Z_DCN2+Z_DCN1

[0076] For the third AC voltage phase (connected to AC connector AC3):

[0077] Z(DCP->DCN,AC3)=Z_DCP1+Z_DCP2+Z_DCP3+Z_DCN1,

[0078] Among them, Z(DCP->DCN, AC1), Z(DCP->DCN, AC2) and Z(DCP->DCN, AC3) should be equal within a tolerable deviation range.

[0079] Furthermore, in this example, the impedances between the positive DC connection DCP and the negative DC connection DCN for the three phases of the AC voltage and the two intermediate DC connections DCM1 and DCM2 should be equal within a tolerable deviation, i.e. due to the individual impedances that are partially connected in series and partially in parallel (denoted by "||", where the reciprocal of the total impedance is equal to the sum of the reciprocals of the individual impedances when the individual impedances are connected in parallel):

[0080] For the first AC voltage phase (connected to AC connector AC1):

[0081] Z(DCP->DCM1 / DCM2,AC1)=Z_DCP1+(Z_DCM1||(Z_DCM2+Z_DCM3+Z_DCM4))

[0082] Z(DCN->DCM1 / DCM2,AC1)=Z_DCN1+Z_DCN2+Z_DCN3+(Z_DCM1||(Z_DCM2+Z_DCM3+Z_DCM4))

[0083] For the second AC voltage phase (connected to AC connector AC2):

[0084] Z(DCP->DCM1 / DCM2,AC2)=Z_DCP1+Z_DCP2+((Z_DCM2+Z_DCM1)||(Z_DCM3+Z_DCM4))

[0085] Z(DCN->DCM1 / DCM2,AC2)=Z_DCN1+Z_DCN2+((Z_DCM2+Z_DCM1)||(Z_DCM3+Z_DCM4))

[0086] For the third AC voltage phase (connected to AC connector AC3):

[0087] Z(DCP->DCM1 / DCM2,AC3)=Z_DCP1+Z_DCP2+Z_DCP3+((ZDCM3+ZDCM2+ZDCM1)||ZDCM4)

[0088] Z(DCN->DCM1 / DCM2,AC3)=Z_DCN1+((Z_DCN3+Z_DCN2+Z_DCN1)||Z_DCM4)

[0089] Among them, Z(DCP->DCM1 / DCM2, AC1), Z(DCP->DCM1 / DCM2, AC2) and Z(DCP->DCM1 / DCM2, AC3) should be equal within the tolerable deviation range, among which Z(DCN->DCM1 / DCM2, AC1), Z(DCN->DCM1 / DCM2, AC2) and Z(DCN->DCM1 / DCM2, AC3) should also be within the tolerable deviation range. Finally, for symmetry reasons, Z(DCP->DCM1 / DCM2, AC1), Z(DCP->DCM1 / DCM2, AC2) and Z(DCP->DCM1 / DCM2, AC3) as well as Z(DCN->DCM1 / DCM2, AC1), Z(DCN->DCM1 / DCM2, AC2) and Z(DCN->DCM1 / DCM2, AC3) should also be equal within a tolerable deviation range.

[0090] If the semiconductors 4 are designed as transistors T1, T2, T9, the impedance Z is equal within a tolerable deviation range, in particular at the switching or clock frequency of the transistors T1, T2, ..., T9. In some examples, the respective inductances between the two DC connections can be equal within a tolerable deviation range of the DC voltage of the three-phase AC voltage.

[0091] Figure 3 A first embodiment of the proposed power module 5 is shown, wherein a schematic plan view is presented.

[0092] The power module 5 has a base plate 1 that is similar to the base plate 1 according to the first embodiment. In addition, the power module 5 has a module housing 6 that partially surrounds the base plate 1. In addition, the power module 5 is provided with three module AC connectors MAC1, MAC2, MAC3 on the long sides 2A, 2B, which are electrically connected to the three AC connectors AC1, AC2, AC3 of the base plate 1. The three module AC connectors MAC1, MAC2, MAC3 are preferably arranged on one of the two long sides 2A, 2B, for example, as shown in FIG. Figure 1 In addition, the power module is provided with four module DC connectors MDCP, MDCM1, MDCM2, MDCN on the short sides 3A, 3B, which are electrically connected to the four DC connectors DCP, DCM1, DCM2, DCN of the base plate 1.

[0093] Figure 4 A second embodiment of the proposed power module 5 is shown, in which a schematic plan view is presented.

[0094] The power module 5 has a baseplate 1, which is similar to the baseplate 1 according to the first embodiment. Furthermore, the power module 5 has a module housing 6 that partially surrounds the baseplate 1. The module housing 6 has multiple recesses 7, some of which have a connecting pin 8 embedded in each recess. Preferably, corresponding connecting pins 8 are embedded in recesses 7 near the DC connectors DCP, DCM1, DCM2, and DCN or the AC connectors AC1, AC2, and A3 of the baseplate 1. Three of the connecting pins 8 are electrically connected to the three AC connectors AC1, AC2, and AC3 of the baseplate 1, and four of the connecting pins 8 are electrically connected to the four DC connectors DCP, DCM1, DCM2, and DCN of the baseplate 1.

[0095] Figure 5 A third exemplary embodiment of the proposed power module 5 is shown, again in a schematic plan view.

[0096] The power module 5 is similar to the power module 5 according to the second embodiment. In addition, the power module 5 has three module AC connectors MAC1, MAC2, MAC3 arranged on the long sides 2A, 2B, which are electrically connected to the three AC connectors AC1, AC2, AC3 of the base plate 1 via the three connecting pins 8 mentioned above. The three module AC connectors MAC1, MAC2, MAC3 are preferably arranged on one of the two long sides 2A, 2B, for example, Figure 1 In addition, the power module is provided with four module DC connectors MDCP, MDCM1, MDCM2, and MDCN on the short sides 3A and 3B, which are electrically connected to the four DC connectors DCP, DCM1, DCM2, and DCN of the base plate 1 via the four connecting pins 8.

[0097] like Figure 5 As shown, the module DC connector MDCP electrically connected to the positive DC connector DCP and the module DC connector MDCM1 electrically connected to the first intermediate DC connector DCM1 are located on the first short side 3A, wherein the module DC connector MDCP electrically connected to the positive DC connector DCP is arranged closer to the first long side 2A than the module DC connector MDCM1 electrically connected to the first intermediate DC connector DCM1. Furthermore, the module DC connector MDCN electrically connected to the negative DC connector DCN and the module DC connector MDCM2 electrically connected to the second intermediate DC connector DCM2 are located on the second short side 3B, wherein the module DC connector MDCN electrically connected to the negative DC connector DCN is arranged closer to the second long side 2B than the module DC connector MDCM2 electrically connected to the second intermediate DC connector DCM2.

[0098] Figure 6 A fourth exemplary embodiment of the proposed power module 5 is shown, wherein a schematic plan view is again shown.

[0099] The power module 5 is similar to the power module 5 according to the first embodiment. Furthermore, the power module 5 includes a first backup capacitor 9A and a second backup capacitor 9B, both of which are arranged on the substrate 1. The first backup capacitor 9A is connected between the positive DC voltage at the positive DC connection DCP and the intermediate DC voltage at the first intermediate DC connection DCM1. The second backup capacitor 9B is connected between the negative DC voltage at the negative DC connection DCN and the intermediate DC voltage at the second intermediate DC connection DCM2.

[0100] Figure 7 A fifth exemplary embodiment of the proposed power module 5 is shown, wherein a plan view is again schematically illustrated.

[0101] The power module 5 is similar to the power module 5 according to the fourth embodiment, wherein the arrangement of the first backup capacitor 9A and the second backup capacitor 9B differs from that of the fourth embodiment. The power module 5 now has a circuit board 10 on which the first backup capacitor 9A and the second backup capacitor 9B are arranged, wherein the first backup capacitor 9A and the second backup capacitor 9B are electrically connected to the DC connections DCP, DCM1, and DCM2 in a matching manner as described above.

[0102] Figure 8 A sixth embodiment of the proposed power module 5 is shown, wherein a more realistic representation is presented in plan view.

[0103] The power module 5 has great similarities to the power module 5 according to the third embodiment.

[0104] Figure 9 An embodiment of the proposed electrical device 11 is shown, wherein a schematic plan view is presented.

[0105] The illustrated electrical device 11 is a converter that converts a three-phase AC voltage input via the device AC connectors GAC1, GAC2, and GAC3 into another three-phase AC voltage output via the device AC connectors GAC1', GAC2', and GAC3'. To this end, the electrical device 11 includes two power modules 5 and 5', each of which can be designed according to the second embodiment of the power module described above. For the sake of clarity, Figure 9 Only some details of the two power modules 5 and 5 ′ are schematically shown, without being illustrated in detail.

[0106] The device AC connectors GAC1, GAC2, GAC3 are electrically connected to the module AC connectors MAC1, MAC2, MAC3 of the first power module 5 respectively. The device AC connectors GAC1', GAC2', GAC3' are electrically connected to the module AC connectors MAC1', MAC2', MAC3' of the second power module 5' respectively.

[0107] The electrical device 11 further comprises a first intermediate circuit capacitor 12A, which is connected to the module DC terminals MDCP, MDCP' for the positive DC voltage of the two power modules 5 and 5'. On the other hand, the first intermediate circuit capacitor 12A is connected to the module DC terminals MDCM1, MDCM2, MDCM1', MDCM2' for the neutral / intermediate DC voltage of the two power modules 5 and 5'.

[0108] Furthermore, the electrical device 11 has a second intermediate circuit capacitor 12B, which is connected, on the one hand, to the module DC connections MDCN, MDCN' for the negative DC voltage of the two power modules 5 and 5'. On the other hand, the second intermediate circuit capacitor 12B is connected to the module DC connections MDCM1, MDCM2, MDCM1', MDCM2' for the neutral / intermediate DC voltage of the two power modules 5 and 5'.

[0109] In some variant examples, the electrical device 11 may also be designed as a rectifier for rectifying a three-phase AC voltage into three DC voltages, thereby omitting the second ( Figure 9 In other variant examples, the electrical device 11 can also be designed as an inverter for converting three DC voltages into three-phase AC voltages, thereby omitting the first ( Figure 9 Center (left side) Power module 5' and device AC connectors GAC1, GAC2, and GAC3.

[0110] Figure 10 An exemplary embodiment of a proposed method 1000 is shown for producing an exemplary embodiment of a power module 5. The method comprises the following method steps.

[0111] In method step 1002, an output power module 5A is provided, which has two output power module voltage connections XC-3A-2A and XC-3A-2B arranged on a first short side 3A. Furthermore, two output power module voltage connections XC-3B-2A and XC-3B-2B are arranged on a second short side 3B of the output power module 5A. Furthermore, the output power module 5A has an output module housing 6A for accommodating and at least partially encapsulating a substrate 1.

[0112] In step 1004 , the substrate 1 is introduced into the output power module 5A.

[0113] In step 1006 , the four DC connectors DCP, DCM1 , DCM2 , and DCN of the substrate 1 are electrically connected to the four output power module voltage connectors XC-3A-2A, XC-3A-2B, XC-3B-2A, and XC-3B-2B, respectively.

[0114] The positive DC connection DCP and the first intermediate DC connection DCM1 are electrically connected to two output power module voltage connections XC-3A-2A and XC-3A-2B located on the first short side 3A, wherein the output power module voltage connection XC-3A-2A electrically connected to the positive DC connection DCP is arranged closer to the first long side 2A than the output power module voltage connection XC-3A-2B electrically connected to the first intermediate DC connection DCM1. Furthermore, the negative DC connection DCN and the second intermediate DC connection DCM2 are electrically connected to two output power module voltage connections XC-3B-2A and XC-3B-2B located on the second short side 3B, wherein the output power module voltage connection XC-3B-2B electrically connected to the negative DC connection DCN is arranged closer to the second long side 2B than the output power module voltage connection XC-3B-2A electrically connected to the second intermediate DC connection DCM2.

[0115] In an optional method step 1008 (indicated by dotted arrows), three module AC connectors MAC1, MAC2, and MAC3 are provided, which are located on the long sides 2A and 2B of the output power module 5A, and the three AC connectors AC1, AC2, and AC3 of the substrate 1 are electrically connected to the three module AC connectors MAC1, MAC2, and MAC3 respectively.

Claims

1. A substrate (1) for a power module, in, The substrate (1) is substantially rectangular in plan view and has two opposite long sides (2A, 2B) and two opposite short sides (3A, 3B), and wherein the substrate (1) has a plurality of semiconductors (4) for converting a three-phase alternating voltage (AC) into positive, neutral and negative direct voltages (DC) or for converting positive, neutral and negative direct voltages (DC) into a three-phase alternating voltage (AC), It is characterized in that - three AC connections (AC1, AC2, AC3) are provided on the long sides (2A, 2B), - a positive direct current connection (DCP) is provided on the first short side (3A), - a first intermediate DC connection (DCM1) is provided on said first short side (3A), - a second intermediate DC connection (DCM2) is provided on the second short side (3B), and - a negative direct current connection (DCN) is provided on said second short side (3B), wherein the positive DC connection (DCP) is arranged closer to the first long side (2A) than the first intermediate DC connection (DCM1), and Wherein, the negative DC connection (DCN) is arranged closer to the second long side (2B) than the second intermediate DC connection (DCM2).

2. The substrate (1) according to claim 1, wherein: The three AC connections (AC1, AC2, AC3) are arranged on one of the two long sides (2A, 2B), preferably on the first long side (2A).

3. The substrate (1) according to any one of the preceding claims, wherein The substrate (1) is designed so that the impedance (Z) between the DC connections (DCP, DCM1, DCM2, DCN) of two of the DC voltages of the three phases of the AC voltage is equal within a tolerable deviation, wherein the tolerable deviation is 25%, in particular 15% or 10%.

4. The substrate (1) according to claim 3, wherein: The substrate (1) is designed so that the impedance (Z) between the two intermediate DC connectors (DCM1, DCM2) for the three phases of the AC voltage and the positive DC connector (DCP) is equal within the tolerable deviation, and the impedance is also equal to the impedance (Z) between the two intermediate DC connectors (DCM1, DCM2) for the three phases of the AC voltage and the negative DC connector (DCN) within the tolerable deviation.

5. A power module (5), comprising: - a substrate (1) according to any one of the preceding claims, - a module housing (6) at least partially surrounding the substrate (1).

6. The power module (5) according to claim 5, further comprising: - three module AC connectors (MAC1, MAC2, MAC3) arranged on the long sides (2A, 2B), the module AC connectors being electrically connected to the three AC connectors (AC1, AC2, AC3) of the base plate (1), and - Four module DC connectors (MDCP, MDCM1, MDCM2, MDCN) arranged on the short sides (3A, 3B), the module DC connectors being electrically connected to the four DC connectors (DCP, DCM1, DCM2, DCN) of the base plate (1).

7. The power module (5) according to claim 6, wherein: A module DC connector (MDCP) electrically connected to the positive DC connector (DCP) and a module DC connector (MDCM1) electrically connected to the first intermediate DC connector (DCM1) are arranged on the first short side (3A), wherein a module DC connector (MDCP) electrically connected to the positive DC connector (DCP) is arranged closer to the first long side (2A) than a module DC connector (MDCM1) electrically connected to the first intermediate DC connector (DCM1), wherein a module DC connector (MDCN) electrically connected to the negative DC connector (DCN) and a module DC connector (MDCM2) electrically connected to the second intermediate DC connector (DCM2) are arranged on the second short side (3B), and Wherein, a module DC connector (MDCN) electrically connected to the negative DC connector (DCN) is arranged closer to the second long side (2B) than a module DC connector (MDCM2) electrically connected to the second intermediate DC connector (DCM2).

8. The power module (5) according to any one of claims 5 to 7, further comprising: - a first backup capacitor (9A) connected between the positive DC voltage at the positive DC connection (DCP) and the intermediate DC voltage at the first intermediate DC connection (DCM1), and - a second backup capacitor (9B) connected between the negative DC voltage at the negative DC connection (DCN) and the intermediate DC voltage at the second intermediate DC connection (DCM2).

9. The power module (5) according to claim 8, further comprising a circuit board (10), wherein: The first backup capacitor (9A) and the second backup capacitor (9B) are respectively arranged on the circuit board (10).

10. The power module (5) according to claim 8, wherein: The first backup capacitor (9A) and the second backup capacitor (9B) are respectively arranged on the substrate (1).

11. The power module (5) according to any one of claims 5 to 10, wherein: The power module (10) can be operated with an electrical power of at least tens of kilowatts, preferably 40 kilowatts to 500 kilowatts, an AC voltage of at least hundreds of volts, preferably 280 volts to 800 volts, a DC voltage of at least hundreds of volts, preferably 800 volts to 1500 volts, and / or a current of tens of amperes, preferably 70 amperes to 1000 amperes.

12. An electrical device (11), in particular a converter, comprising: at least one power module (5) according to any one of claims 5 to 11, preferably at least two of said power modules (5), at least one first intermediate circuit capacitor (12A) connected between a module DC connection (MDCP) electrically connected to the positive DC connection (DCP) on the one hand and a module DC connection (MDCM1, MDCM2) electrically connected to the intermediate DC connection (DCM1, DCM2) on the other hand, and - at least one second intermediate circuit capacitor (12B), which is connected between a module DC connection (MDCN) which is electrically connected to the negative DC connection (DCN) on the one hand and a module DC connection (MDCM1, MDCM2) which is electrically connected to the intermediate DC connection (DCM1, DCM2) on the other hand.

13. A method for producing a power module (5) according to any one of claims 5 to 11, comprising the following method steps: - providing an output power module (5A), the output power module having: ° at least two output power module voltage connections (XC-3A-2A, XC-3A-2B) arranged on said first short side (3A), ° at least two output power module voltage connections (XC-3B-2A, XC-3B-2B) arranged on the second short side (3B), ° An output module housing (6A) for accommodating and at least partially surrounding the substrate (1), and - inserting the substrate (1) into the output power module (5A), - Establishing the connection from the four DC connectors (DCP, DCM1, DCM2, DCN) of the base plate (1) to the four output power module voltage connectors (XC-3A-2A, XC-3A-2B, XC-3B-2A, XC-3B-2B) corresponding electrical connections.

14. The method according to claim 13, wherein: The positive DC connector (DCP) and the first intermediate DC connector (DCM1) are electrically connected to two output power module voltage connectors (XC-3A-2A, XC-3A-2B) arranged on the first short side (3A), wherein an output power module voltage connector (XC-3A-2A) electrically connected to the positive DC connector (DCP) is arranged closer to the first long side (2A) than an output power module voltage connector (XC-3A-2B) electrically connected to the first intermediate DC connector (DCM1), wherein the negative DC connector (DCN) and the second intermediate DC connector (DCM2) are electrically connected to two output power module voltage connectors (XC-3B-2A, XC-3B-2B) arranged on the second short side (3B), and Wherein, the output power module voltage connector (XC-3B-2B) electrically connected to the negative DC connector (DCN) is arranged closer to the second long side (2B) than the output power module voltage connector (XC-3B-2A) electrically connected to the second intermediate DC connector (DCM2).

15. The method according to claim 13 or 14, further comprising the following method steps: - providing three module AC connectors (MAC1, MAC2, MAC3) arranged on the long sides (2A, 2B) of the output power module (5A), and - Establishing corresponding electrical connections from the three AC connectors (AC1, AC2, AC3) of the base plate (1) to the three module AC connectors (MAC1, MAC2, MAC3).

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