Laser detecting and processing system

Abstract

A laser detecting and processing system is used for detecting and processing an electronic component. The laser detecting and processing system comprises a laser light source generating module, a spectroscope, a camera and a light equalizing module. The laser light source generating module is used for generating a laser beam, the spectroscope is located in a laser path of the laser beam to reflect the laser beam to the electronic component, and the camera is located behind the spectroscope to receive the laser beam reflected by the electronic component so as to generate a laser image of the electronic component. Wherein the laser beam can further process a circuit in an electronic component. The light uniformizing module is located between the laser light source generating module and the spectroscope to uniformize the intensity of the laser beam, and the light uniformizing module comprises a speckle eliminator used for eliminating speckles generated by the laser beam.

Description

Technical Field

[0001] The present invention relates to a laser detection and processing system, and in particular to a deep ultraviolet laser detection and processing system. Background Art

[0002] With the advancement of technology, electronic products are becoming more and more popular and gradually changing the lifestyles of many people. As electronic products become more and more sophisticated, more and more integrated circuits are used, and the required process line width is becoming finer and finer.

[0003] Inevitably, some defects will occur in the production process of precision semiconductors, which may render some semiconductor components and circuits unusable or require repair in order to increase product output and yield, thereby reducing production costs.

[0004] In conventional semiconductor processes, in order to repair defects generated in semiconductor processes, a laser repair machine is often required, and a general laser repair machine uses white light for observation and then uses laser for repair. Therefore, the observation optical path and the repair optical path of a general laser repair machine require two light sources, a white light source and a laser light source, so that the laser repair machine is not only bulky, but also because the white light image resolution is poor, and the wavelength difference between the white light and the laser light source is large, it will cause axial chromatic aberration, resulting in different focusing planes, resulting in axial deviation, and thus causing inconvenience in repair. Summary of the invention

[0005] The invention summary is intended to provide a simplified summary of the present disclosure so that readers can have a basic understanding of the present disclosure. This invention summary is not a complete overview of the present disclosure, and it is not intended to point out the important / critical elements of the embodiments of the present invention or to define the scope of the present invention.

[0006] An object of the present invention is to provide a laser inspection and processing system that can use a single laser light source to inspect, process and repair defects of electronic components, thereby effectively improving the efficiency and quality of inspection, processing and repair.

[0007] To achieve the above-mentioned purpose, according to one embodiment of the present disclosure, a laser detection and processing system is provided for detecting and processing an electronic component. This laser detection and processing system includes a laser light source generating module, a spectroscope, a camera and a light averaging module. The laser light source generating module is used to generate a laser beam, the spectroscope is located in a laser path of the laser beam to reflect the laser beam to the electronic component, and the camera is located behind the spectroscope to receive the laser beam reflected from the electronic component to generate a laser image of the electronic component. The laser beam further processes the circuit in the electronic component. In addition, the light averaging module is located between the laser light source generating module and the spectroscope to uniform the intensity of the laser beam, and the light averaging module includes a speckle eliminator to eliminate the speckle generated by the laser beam.

[0008] In some embodiments, the laser light source generation module includes a laser beam generator and a laser beam intensity controller. The laser beam generator generates a laser beam, and the laser beam intensity controller is connected to the laser beam generator to control the laser beam generator to adjust the intensity of the laser beam.

[0009] In some embodiments, a speckle remover, such as a rotating diffuser, is used to remove speckles generated by the laser beam.

[0010] In some embodiments, the light homogenizing module further includes a relay lens located between the speckle eliminator and the beam splitter to make the laser beam more uniform.

[0011] In some embodiments, the light homogenizing module further includes a switching device connected to the speckle eliminator and the relay lens so as to place the speckle eliminator and the relay lens in the laser path of the laser beam when the laser beam is used for illumination, and to move the speckle eliminator and the relay lens out of the laser path of the laser beam when the laser beam is used for processing electronic components.

[0012] In some embodiments, the laser detection and processing system further includes an optical path switching device disposed between the laser light source generating module and the beam splitter so that when the laser beam is used for illumination, the laser beam passes through the light-homogenizing module, and when the laser beam is used for processing electronic components, the laser path of the laser beam avoids the light-homogenizing module.

[0013] In some embodiments, the optical path switching device includes a first reflector, a second reflector, a third reflector, and a fourth reflector. The first reflector is used to switch the laser path of the laser beam. When the laser beam is used to process the electronic component, the laser beam is reflected so that the laser path avoids the light averaging module. The second reflector is located on one side of the first reflector and is used to reflect the laser beam from the first reflector. The third reflector is located on one side of the second reflector and is used to reflect the laser beam from the second reflector. The fourth reflector is located on one side of the third reflector and is used to reflect the laser beam from the third reflector, so that the laser beam is reflected to the beam splitter and then reflected to the electronic component by the beam splitter.

[0014] In some embodiments, the laser detection and processing system further includes a polarized light path switching device, which is disposed between the laser light source generating module and the beam splitter, so as to utilize the P polarized light of the laser beam, pass through the light averaging module, illuminate the electronic components and generate laser images of the electronic components, and utilize the S polarized light of the laser beam to process the electronic components.

[0015] In some embodiments, the polarized light path switching device includes a first polarized beam splitter, a first reflector, a second reflector, and a second polarized beam splitter. The first polarized beam splitter is used to change the paths of the P polarized light and the S polarized light of the laser beam, and allows the P polarized light to pass through the homogenizing module and reflect the S polarized light. The first reflector is located on one side of the first polarized beam splitter to reflect the S polarized light from the first polarized beam splitter, the second reflector is located on one side of the first reflector to reflect the S polarized light from the first reflector, and the second polarized beam splitter is located on one side of the second reflector to reflect the S polarized light from the second reflector, and allows the P polarized light passing through the homogenizing module to pass through and then irradiate the beam splitter, and then use the beam splitter to reflect to the electronic component, so as to use the P polarized light to illuminate the electronic component and generate a laser image of the electronic component, and use the S polarized light of the laser beam to process the electronic component.

[0016] In some embodiments, the polarized light path switching device further includes a third polarized beam splitter located between the beam splitter and the camera to reflect the S polarized light of the laser beam reflected by the electronic component and allow the P polarized light of the laser beam reflected by the electronic component to pass through and enter the camera.

[0017] In some embodiments, the polarized light path switching device further includes a laser intensity adjuster disposed between the laser light source generating module and the beam splitter to adjust the intensity of the laser beam.

[0018] In some embodiments, the polarized light path switching device further includes a scanning module disposed between the laser light source generating module and the beam splitter to adjust the angle of the laser beam.

[0019] In some embodiments, the laser detection and processing system further includes a beam collector located on one side of the third polarization beam splitter to absorb the S-polarized light of the laser beam reflected by the third polarization beam splitter.

[0020] In some embodiments, the laser light source generation module further includes a λ / 2 wave plate located between the laser beam generator and the polarized light path switching device to adjust the ratio of the P polarized light and the S polarized light of the laser beam.

[0021] In some embodiments, the laser detection and processing system further includes an objective lens located between the beam splitter and the electronic component to focus the laser beam on the surface of the electronic component.

[0022] In some embodiments, the laser detection and processing system further includes a tube lens located between the beam splitter and the camera to image the laser beam in the camera.

[0023] In some embodiments, the laser inspection and processing system further includes a beam collector located at the back of the beam splitter and at about 90 degrees to the camera to absorb part of the laser beam.

[0024] In some embodiments, the laser beam is a deep ultraviolet laser beam.

[0025] Therefore, the laser detection and processing system can use a single laser light source, such as a deep ultraviolet laser beam, to detect, process and repair defects of electronic components to be processed, thereby effectively improving the efficiency and quality of detection and processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows:

[0027] Figure 1 is a schematic diagram of a laser detection and processing system according to a first embodiment of the present invention;

[0028] Figure 2 is a schematic diagram of a laser detection and processing system according to a second embodiment of the present invention;

[0029] Figure 3 It is a schematic diagram of a laser detection and processing system according to a third embodiment of the present invention.

[0030]

Explanation of symbols

[0031] 100:Laser detection and processing system

[0032] 110: Laser light source generation module

[0033] 112:Laser beam generator

[0034] 114: Laser beam intensity controller

[0035] 120: optical module

[0036] 122: Speckle Eliminator

[0037] 124: Relay lens

[0038] 126: Switching device

[0039] 130: Beam Spectroscope

[0040] 140:Objective lens

[0041] 150: Tube mirror

[0042] 160: Camera

[0043] 170: Beam Dump

[0044] 200:Laser detection and processing system

[0045] 210: Laser light source generation module

[0046] 212:Laser beam generator

[0047] 214: Laser beam intensity controller

[0048] 220: optical module

[0049] 222: Speckle Eliminator

[0050] 224: Relay lens

[0051] 230: Beam Spectroscope

[0052] 240:Objective lens

[0053] 250: Tube mirror

[0054] 260: Camera

[0055] 270: Beam Dump

[0056] 280: Optical path switching device

[0057] 281: Laser intensity adjuster

[0058] 282: First reflector

[0059] 283: Scanning module

[0060] 284: Second reflector

[0061] 286: The third reflector

[0062] 288: The fourth reflector

[0063] 300:Laser detection and processing system

[0064] 310: Laser light source generation module

[0065] 312:Laser beam generator

[0066] 314: Laser beam intensity controller

[0067] 316:λ / 2 wave plate

[0068] 320: optical module

[0069] 322: Speckle Eliminator

[0070] 324: Relay lens

[0071] 330: Beam Spectroscope

[0072] 340: Objective lens

[0073] 350: Tube mirror

[0074] 360: Camera

[0075] 370: Beam Dump

[0076] 375: Beam Dump

[0077] 380: Polarized light path switching device

[0078] 381: Laser intensity adjuster

[0079] 382: First polarization beam splitter

[0080] 383: Scanning module

[0081] 384: First Reflector

[0082] 386: Second reflector

[0083] 388: Second polarization beam splitter

[0084] 389: The third polarization beam splitter

[0085] 900: Electronic components

[0086] BS: Beamsplitter

[0087] M1: First reflector

[0088] M2: Second reflector

[0089] M3: The third reflector

[0090] M4: The fourth reflector

[0091] PBS1: First polarization beam splitter

[0092] PBS2: Second polarization beam splitter

[0093] P-polarization: P polarized light

[0094] RL1: First relay lens

[0095] RL2: Second relay lens

[0096] S-polarization: S polarized light

[0097] S+P: S polarized light + P polarized light DETAILED DESCRIPTION

[0098] The following is a detailed description of the embodiments with the accompanying drawings, but the embodiments provided are not intended to limit the scope of the present disclosure, and the description of the structural operation is not intended to limit the order of its execution. Any device with equal functions produced by the re-combination of components is within the scope of the present disclosure. In addition, the drawings are for illustration purposes only and are not drawn according to the original size. For ease of understanding, the same or similar components in the following description will be described with the same symbols.

[0099] In addition, the terms used throughout the specification and claims generally have the ordinary meaning of each term used in the field, in the context of this disclosure, and in the specific context, unless otherwise specified. Certain terms used to describe the present disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art on the description of the present disclosure.

[0100] In the embodiments and claims, unless otherwise specified in the context, "a", "an" and "the" may refer to a single or multiple number. The numbers used in the steps are only used to mark the steps for ease of description, and are not used to limit the order and implementation methods.

[0101] Secondly, the words "include", "including", "have", "contain" and the like used in this article are all open terms, which mean including but not limited to.

[0102] Figures 1 to 3 Schematic diagrams of laser detection and processing systems disclosed according to embodiments of the present invention are respectively shown.

[0103] First, see Figure 1As shown in the figure, the laser inspection and processing system 100 is used to inspect and process an electronic component 900, for example, an electronic component to be inspected and / or to be repaired, such as a semiconductor wafer or chip to be inspected and / or to be repaired. In some embodiments, the laser inspection and processing system 100 includes a laser light source generation module 110, a beam splitter (BS) 130 and a camera 160. The laser light source generation module 110 is used to generate a laser beam, and the beam splitter 130 is located in a laser path of the laser beam to reflect the laser beam to the electronic component 900. In some embodiments, the beam splitter 130 is a beam splitter that semi-transmits and semi-reflects the laser beam, but the present invention is not limited to this. In addition, the camera 160 is located behind the beam splitter 130 to receive the laser beam reflected from the electronic component 900, thereby generating a laser image of the electronic component 900. The laser beam can also be used to further process defects in the electronic component 900 or to perform processing.

[0104] In some embodiments, the camera 160 is preferably a deep ultraviolet camera that can receive light beams with a wavelength of more than 200 nanometers, such as deep ultraviolet light beams of 213 nanometers, 224.3 nanometers, 248.6 nanometers, or 266 nanometers.

[0105] In some embodiments, the laser light source generating module 110 includes a laser beam generator 112 and a laser beam intensity controller 114. The laser beam generator 112 generates a laser beam, and the laser beam intensity controller 114 is connected to the laser beam generator 112 to control the laser beam generator 112 to adjust the intensity of the laser beam according to demand.

[0106] In some embodiments, the laser detection and processing system 100 further includes a light homogenizing module 120 located between the laser light source generating module 110 and the beam splitter 130 for homogenizing the intensity of the laser beam, thereby making the laser beam more uniform and effectively eliminating the speckle generated by the laser beam, thereby improving the resolution of the image.

[0107] In some embodiments, the light homogenizing module 120 includes a speckle eliminator 122, such as a rotating diffuser, which uses a rotation method to homogenize the intensity of the laser beam to eliminate the speckle generated by the laser beam.

[0108] In addition, in some embodiments, the light homogenizing module 120 further includes a relay lens 124, which is located between the speckle eliminator 122 and the beam splitter 130, so that the laser beam can be more uniform. For example, the relay lens 124 can include more than one lens, such as a group of relay lenses including a first relay lens (RL1) and a second relay lens (RL2), so as to more uniformly illuminate the electronic component 900 and capture the image, but the present invention is not limited thereto.

[0109] It is worth noting that the light homogenizing module 120 further includes a switching device 126 connected to the speckle eliminator 122 and the relay lens 124. The speckle eliminator 122 and the relay lens 124 can be moved into the laser path of the laser beam or moved out of the laser path of the laser beam by switching (such as rotating, flipping or moving, etc.), so that the laser beam does not pass through the speckle eliminator 122 and the relay lens 124, but directly irradiates the beam splitter 130 and is reflected to irradiate the electronic component 900. Therefore, when the laser beam is used for illumination, the speckle eliminator 122 and the relay lens 124 are disposed in the laser path of the laser beam, and when the laser beam is used to process the electronic component 900, the speckle eliminator 122 and the relay lens 124 are moved out of the laser path of the laser beam.

[0110] In some embodiments, the laser inspection and processing system 100 further includes an objective lens 140 located between the beam splitter 130 and the electronic component 900 to focus the laser beam on the surface of the electronic component 900 .

[0111] In some embodiments, the laser inspection and processing system 100 further includes a tube lens 150 located between the beam splitter 130 and the camera 160 to form an image of the laser beam in the camera 160 .

[0112] In some embodiments, the laser inspection and processing system 100 further includes a beam collector 170 located at the back of the beam splitter 130 and at an angle of approximately 90 degrees to the camera 160 to absorb a portion of the laser beam that passes through the beam splitter 130 .

[0113] In some embodiments, the laser beam is a deep ultraviolet laser beam, such as a 266nm ultraviolet laser, but the present invention is not limited thereto, and a laser beam with a wavelength close to or less than 266nm may also be used without departing from the spirit and protection scope of the present invention.

[0114] See also Figure 2As shown in the figure, the laser inspection and processing system 200 is also used to inspect and process an electronic component 900, such as a semiconductor wafer or chip to be inspected and / or repaired. In some embodiments, the laser inspection and processing system 200 includes a laser light source generating module 210, a beam splitter (BS) 230, and a camera 260. The laser light source generating module 210 is used to generate a laser beam, and the beam splitter 230 is located in a laser path of the laser beam to reflect the laser beam to the electronic component 900. In addition, the camera 260 is located behind the beam splitter 230 to receive the laser beam reflected from the electronic component 900, and then generate a laser image of the electronic component 900. The laser beam can also be used to further process or repair defects in the electronic component 900. In some embodiments, the beam splitter 230 is a beam splitter that semi-transmits and semi-reflects the laser beam, but the present invention is not limited to this.

[0115] In some embodiments, the camera 260 is preferably a deep ultraviolet camera that can receive light beams with a wavelength of more than 200 nanometers, such as deep ultraviolet light beams of 213 nanometers, 224.3 nanometers, 248.6 nanometers, or 266 nanometers.

[0116] In some embodiments, the laser light source generating module 210 includes a laser beam generator 212 and a laser beam intensity controller 214. The laser beam generator 212 generates a laser beam, and the laser beam intensity controller 214 is connected to the laser beam generator 212 to control the laser beam generator 212 to adjust the intensity of the laser beam according to demand.

[0117] In some embodiments, the laser detection and processing system 200 further includes a light homogenizing module 220 located between the laser light source generating module 210 and the beam splitter 230 for homogenizing the intensity of the laser beam, thereby making the laser beam more uniform and effectively eliminating the speckle generated by the laser beam, thereby improving the resolution of the image.

[0118] In some embodiments, the light homogenizing module 220 includes a speckle eliminator 222, such as a rotating diffuser, which uses rotation to homogenize the intensity of the laser beam to eliminate the speckle generated by the laser beam.

[0119] In addition, in some embodiments, the light homogenizing module 220 further includes a relay lens 224 located between the speckle remover 222 and the beam splitter 230 to make the laser beam more uniform. For example, the relay lens 224 may include more than one lens, such as a set of relay lenses including a first relay lens (RL1) and a second relay lens (RL2), so as to more uniformly illuminate the electronic component 900 and capture an image, but the present invention is not limited thereto.

[0120] It is worth noting that the laser detection and processing system 200 also includes an optical path switching device 280, which is arranged between the laser light source generating module 210 and the spectrometer 230, so that when the laser beam is used for illumination, the laser beam can pass through the light-homogenizing module 220, and when the laser beam is used for processing the electronic component 900, the laser path of the laser beam avoids the light-homogenizing module 220.

[0121] In some embodiments, the optical path switching device 280 includes a first reflector (M1) 282, a second reflector (M2) 284, a third reflector (M3) 286, and a fourth reflector (M4) 288. The first reflector 282 is used to switch the laser path of the laser beam. When the laser beam is used to process the electronic component 900, the first reflector 282 rotates to reflect the laser beam so that the laser path avoids the light averaging module 220 and is directed to the second reflector 284 located on one side of the first reflector 282. The second reflector 284 further reflects the laser beam to the third reflector 286 located on one side of the second reflector 284. The third reflector 286 further reflects the laser beam to the fourth reflector 288. The fourth reflector 288 is located on one side of the third reflector 286 and further reflects the laser beam so that the laser beam is further reflected to the beam splitter 230 and then reflected by the beam splitter 230 to the surface of the electronic component 900. Through the first reflector 282 , the second reflector 284 , the third reflector 286 and the fourth reflector 288 , the laser beam effectively avoids the light-homogenizing module 220 to be used for processing the electronic component 900 .

[0122] When a laser beam is used to illuminate and capture the surface image of the electronic component 900, the first reflector 282 and the fourth reflector 288 are switched (for example, rotated, flipped or moved) to an angle that does not reflect the laser light, so that the laser beam passes through the light-homogenizing module 220 and is then reflected to the surface of the electronic component 900 via the beam splitter 230.

[0123] Similarly, in some embodiments, the laser inspection and processing system 200 further includes an objective lens 240 located between the beam splitter 230 and the electronic component 900 to focus the laser beam on the surface of the electronic component 900 .

[0124] In some embodiments, the laser inspection and processing system 200 further includes a tube lens 250 located between the beam splitter 230 and the camera 260 to form an image of the laser beam in the camera 260 .

[0125] In some embodiments, the laser inspection and processing system 200 further includes a beam collector 270 located at the back of the beam splitter 230 and at an angle of approximately 90 degrees to the camera 260 to absorb a portion of the laser beam that passes through the beam splitter 230 .

[0126] In some embodiments, the laser beam is a deep ultraviolet laser beam, such as a 266nm ultraviolet laser, but the present invention is not limited thereto, and a laser beam with a wavelength close to or less than 266nm may also be used without departing from the spirit and protection scope of the present invention.

[0127] In some embodiments, the optical path switching device 280 may further include a laser intensity adjuster 281, located between the second reflector 284 and the third reflector 286, for adjusting the intensity of the laser beam. For example, the laser intensity adjuster 281 may be a shutter or a laser energy adjustment element, such as an acousto-optic modulator (AOM) and / or an electro-optic modulator (EOM), all of which do not depart from the spirit and scope of the present invention.

[0128] In some embodiments, the optical path switching device 280 further includes a scanning module 283, located between the laser intensity adjuster 281 and the third reflector 286, to adjust the angle of the laser beam, thereby scanning the electronic component 900 to perform processing and defect repair in an area. For example, the scanning module 283 can be a high-speed scanning galvo scanning system or a micro-electromechanical scanning mirror (MEMS scanning mirror), which does not deviate from the spirit and protection scope of the present invention.

[0129] In some embodiments, the laser intensity adjuster 281 and the scanning module 283 may be disposed at any position between the laser light source generating module 210 and the beam splitter 230 without departing from the spirit and protection scope of the present invention.

[0130] See also Figure 3 As shown in the figure, the laser inspection and processing system 300 is used to inspect and process an electronic component 900, such as a semiconductor wafer or chip to be inspected and / or repaired. Figure 1 as well as Figure 2 The difference between the laser detection and processing system 100 and the laser detection and processing system 200 is that the laser detection and processing system 300 can use the laser beam to detect and process the electronic component 900 at the same time.

[0131] In some embodiments, the laser inspection and processing system 300 includes a laser light source generating module 310, a beam splitter (BS) 330, and a camera 360. The laser light source generating module 310 is used to generate a laser beam, and the beam splitter 330 is located in a laser path of the laser beam to reflect the laser beam to the electronic component 900. In some embodiments, the beam splitter 330 is a beam splitter that semi-transmits and semi-reflects the laser beam, but the present invention is not limited thereto. In addition, the camera 360 is located behind the beam splitter 330 to receive the laser beam reflected from the electronic component 900, and then generate a laser image of the electronic component 900. Among them, the laser beam can also be used to further process defects in the electronic component 900 or perform processing.

[0132] In some embodiments, the camera 360 is preferably a deep ultraviolet camera that can receive light beams with a wavelength of more than 200 nanometers, such as deep ultraviolet light beams of 213 nanometers, 224.3 nanometers, 248.6 nanometers, or 266 nanometers.

[0133] In some embodiments, the laser light source generation module 310 includes a laser beam generator 312 and a laser beam intensity controller 314. The laser beam generator 312 generates a laser beam, and the laser beam intensity controller 314 is connected to the laser beam generator 312 to control the laser beam generator 312 to adjust the intensity of the laser beam according to demand.

[0134] In some embodiments, the laser detection and processing system 300 further includes a light homogenizing module 320 located between the laser light source generating module 310 and the beam splitter 330 for homogenizing the intensity of the laser beam, thereby making the laser beam more uniform and effectively eliminating the speckle generated by the laser beam, thereby improving the resolution of the image.

[0135] In some embodiments, the light homogenizing module 320 includes a speckle eliminator 322, such as a rotating diffuser, which uses rotation to homogenize the intensity of the laser beam to eliminate the speckle generated by the laser beam.

[0136] In addition, in some embodiments, the light homogenizing module 320 further includes a relay lens 324 located between the speckle remover 322 and the beam splitter 330 to make the laser beam more uniform. For example, the relay lens 324 may include more than one lens, such as a set of relay lenses including a first relay lens (RL1) and a second relay lens (RL2), so as to more uniformly illuminate the electronic component 900 and capture an image, but the present invention is not limited thereto.

[0137] It is worth noting that the laser detection and processing system 300 also includes a polarized light path switching device 380, which is arranged between the laser light source generating module 310 and the beam splitter 330, so as to utilize the P-polarized light (P-polarization) of the laser beam, pass through the light-homogenizing module 320, and illuminate the electronic component 900 and generate a laser image of the electronic component 900, and utilize the S-polarized light (S-polarization) of the laser beam to process the electronic component 900.

[0138] In some embodiments, the polarization light path switching device 380 includes a first polarization beam splitter (PBS1) 382, ​​a first reflector 384, a second reflector 386, and a second polarization beam splitter (PBS2) 388. The first polarization beam splitter 382 is used to change the paths of the P polarization light and the S polarization light of the laser beam, so that the P polarization light passes through the light homogenizing module 320 and reflects the S polarization light to the first reflector 384. The first reflector 384 is located on one side of the first polarization beam splitter 382, ​​and is used to further reflect the S polarization light to the second reflector 386. The second reflector 386 is located on one side of the first reflector 384, and is used to reflect the S polarization light to the second polarization beam splitter 388. In addition, the second polarized beam splitter 388 is located on one side of the second reflector 386 to further reflect the S-polarized light from the second reflector 386 to the beam splitter 330, and the P-polarized light passing through the light-homogenizing module 320 can penetrate the second polarized beam splitter 388 and illuminate the beam splitter 330, and then be reflected to the electronic component 900, and then the P-polarized light is used to illuminate the electronic component 900 and generate a laser image of the electronic component 900, and at the same time, the S-polarized light of the laser beam is used to process the electronic component 900.

[0139] In some embodiments, the polarized light path switching device 380 further includes a third polarized beam splitter 389, which is located between the beam splitter 330 and the camera 360 to reflect the S-polarized light of the laser beam reflected by the electronic component 900 and allow the P-polarized light of the laser beam reflected by the electronic component 900 to pass through and enter the camera 360.

[0140] In some embodiments, the laser inspection and processing system 300 further includes an objective lens 340 located between the beam splitter 330 and the electronic component 900 to focus the laser beam on the surface of the electronic component 900 .

[0141] In some embodiments, the laser detection and processing system 300 further includes a tube lens 350 located between the beam splitter 330 and the camera 360 to form an image of the laser beam in the camera 360 .

[0142] In some embodiments, the laser inspection and processing system 300 further includes a beam collector 370 located at the back of the beam splitter 330 and at an angle of approximately 90 degrees to the camera 360 to absorb a portion of the laser beam that passes through the beam splitter 330 .

[0143] In some embodiments, the laser beam is a deep ultraviolet laser beam, such as a 266nm ultraviolet laser beam, but the present invention is not limited thereto. Laser beams with wavelengths close to or less than 266nm may also be used without departing from the spirit and scope of protection of the present invention.

[0144] In some embodiments, the laser detection and processing system 300 further includes a beam collector 375 located on one side of the third polarization beam splitter 389 to absorb the S-polarized light of the laser beam reflected by the third polarization beam splitter 389 .

[0145] In some embodiments, the laser light source generating module 310 further includes a λ / 2 wave plate 316, which is located between the laser beam generator 312 and the polarized light path switching device 380, and can be rotated to adjust the ratio of the P polarized light and the S polarized light of the laser beam, wherein the λ / 2 wave plate 316 is, for example, a phase delay plate, which can be made of a birefringent material, and it does not deviate from the spirit and protection scope of the present invention.

[0146] In some embodiments, the polarized light path switching device 380 may further include a laser intensity adjuster 381, located between the first reflector 384 and the second reflector 386, to adjust the intensity of the S-polarized light of the laser beam. For example, the laser intensity adjuster 381 may be a shutter or a laser energy adjustment element, such as an acousto-optic modulator and / or an electro-optic modulator, all of which do not depart from the spirit and protection scope of the present invention.

[0147] In some embodiments, the polarized light path switching device 380 further includes a scanning module 383, located between the laser intensity adjuster 381 and the second reflector 386, to adjust the angle of the S polarized light of the laser beam, and then scan the electronic component 900 to perform processing and defect repair in an area. For example, the scanning module 383 can be a high-speed scanning galvanometer or a micro-electromechanical scanning mirror, which does not deviate from the spirit and protection scope of the present invention.

[0148] In some embodiments, the laser intensity adjuster 381 and the scanning module 383 may be disposed at any position between the laser light source generating module 310 and the beam splitter 330 without departing from the spirit and protection scope of the present invention.

[0149] In summary, the laser inspection and processing system disclosed in the present invention can use a single laser light source, such as a deep ultraviolet laser beam, to inspect, process, and repair defects of electronic components to be processed, thereby effectively improving the efficiency and quality of inspection and processing.

[0150] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the definition of the attached claims.

Claims

1. A laser detection and processing system, characterized in that: Used to detect and process an electronic component, including: A laser light source generating module, used to generate a laser beam; a beam splitter, located in a laser path of the laser beam, to reflect the laser beam to the electronic component; a camera, located behind the beam splitter, to receive the laser beam reflected from the electronic component to generate a laser image of the electronic component, wherein the laser beam further processes a circuit in the electronic component; and A light-homogenizing module is located between the laser light source generating module and the beam splitter to uniformize the intensity of the laser beam, wherein the light-homogenizing module includes a speckle eliminator to eliminate speckles generated by the laser beam.

2. The laser detection and processing system according to claim 1, characterized in that: The laser light source generation module comprises: a laser beam generator, for generating the laser beam; and A laser beam intensity controller is connected to the laser beam generator and is used to control the laser beam generator to adjust the intensity of the laser beam.

3. The laser detection and processing system according to claim 1, characterized in that: The speckle remover comprises: A rotating diffuser is used to eliminate speckle generated by the laser beam.

4. The laser detection and processing system according to claim 3, characterized in that: The light averaging module further comprises: A relay lens is located between the speckle eliminator and the beam splitter to make the laser beam more uniform.

5. The laser detection and processing system according to claim 4, characterized in that: The light averaging module further comprises: A switching device is connected to the speckle eliminator and the relay lens to place the speckle eliminator and the relay lens in the laser path of the laser beam when the laser beam is used for illumination, and to move the speckle eliminator and the relay lens out of the laser path of the laser beam when the laser beam is used for processing the electronic component.

6. The laser detection and processing system according to claim 1, characterized in that: Also includes: An optical path switching device is arranged between the laser light source generating module and the beam splitter to make the laser beam pass through the light-evening module when the laser beam is used for illumination, and to make the laser path of the laser beam avoid the light-evening module when the laser beam is used for processing the electronic component.

7. The laser detection and processing system according to claim 6, characterized in that: The optical path switching device comprises: a first reflector, used for switching the laser path of the laser beam, and reflecting the laser beam when the laser beam is used to process the electronic component, so that the laser path avoids the light averaging module; a second reflecting mirror, located at one side of the first reflecting mirror, for reflecting the laser beam from the first reflecting mirror; a third reflecting mirror, located at one side of the second reflecting mirror, for reflecting the laser beam from the second reflecting mirror; and A fourth reflector is located at one side of the third reflector and is used to reflect the laser beam from the third reflector so that the laser beam is reflected to the beam splitter and then reflected to the electronic component by the beam splitter.

8. The laser detection and processing system according to claim 2, characterized in that: Also includes: A polarized light path switching device is disposed between the laser light source generating module and the beam splitter to utilize the P polarized light of the laser beam to pass through the light averaging module to illuminate the electronic component and generate the laser image of the electronic component, and utilize the S polarized light of the laser beam to process the electronic component.

9. The laser detection and processing system according to claim 8, characterized in that: The polarized light path switching device comprises: a first polarization beam splitter, used for changing the paths of the P polarized light and the S polarized light of the laser beam, so that the P polarized light passes through the light homogenizing module and reflects the S polarized light; a first reflector, located at one side of the first polarization beam splitter, to reflect the S polarized light from the first polarization beam splitter; a second reflector, located at one side of the first reflector, to reflect the S-polarized light from the first reflector; as well as A second polarized beam splitter is located on one side of the second reflector to reflect the S polarized light from the second reflector and allow the P polarized light passing through the light averaging module to pass through and then irradiate the beam splitter, and then reflect to the electronic component by the beam splitter, so as to utilize the P polarized light to illuminate the electronic component and generate the laser image of the electronic component, and utilize the S polarized light of the laser beam to process the electronic component.

10. The laser detection and processing system according to claim 9, characterized in that: The polarized light path switching device further comprises: A third polarized beam splitter is located between the beam splitter and the camera to reflect the S polarized light of the laser beam reflected by the electronic component and allow the P polarized light of the laser beam reflected by the electronic component to pass through and enter the camera.

11. The laser detection and processing system according to claim 10, characterized in that: The polarized light path switching device further comprises: A laser intensity adjuster is disposed between the laser light source generating module and the beam splitter to adjust the intensity of the laser beam.

12. The laser detection and processing system according to claim 11, characterized in that: The polarized light path switching device further comprises: A scanning module is disposed between the laser light source generating module and the beam splitter to adjust the angle of the laser beam.

13. The laser detection and processing system according to claim 10, characterized in that: Also includes: A beam collector is located at one side of the third polarization beam splitter to absorb the S polarization light of the laser beam reflected by the third polarization beam splitter.

14. The laser detection and processing system according to claim 8, characterized in that: The laser light source generation module further comprises: A λ / 2 wave plate is located between the laser beam generator and the polarized light path switching device to adjust the ratio of the P polarized light and the S polarized light of the laser beam.

15. The laser detection and processing system according to claim 1, characterized in that: A beam collector is also included, which is located at the back of the beam splitter and is about 90 degrees to the camera to absorb part of the laser beam.

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