Semiconductor metal brush monitoring device

Abstract

The present invention provides a semiconductor metal brush monitoring device, which includes a main body frame, a guide rail, a substrate fixing bracket, a driving component, a metal brush fixing bracket and a special-shaped sliding component. Among them, the driving component can convert rotational motion into linear motion to realize the pushing and pulling operation of the substrate fixing bracket. Through the setting of the guide rail and the special-shaped sliding component, the forward, backward, upward and downward movement of the substrate fixing bracket can be realized. The semiconductor metal brush monitoring device of the present invention can simulate the application scenario of the metal brush to effectively monitor the metal brush.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor devices and relates to a semiconductor metal brush monitoring device. Background Art

[0002] In the manufacturing process of semiconductor devices, a complex and delicate process is often involved, which includes multiple steps and processes, such as wafer preparation - front - end chip processing - back - end package monitoring, etc. Among them, in the manufacturing process of semiconductor devices, metal brushes are often used. For example, in the surface treatment process of wafers, before the metallization process, it is usually necessary to chemically modify the surface of the wafer to change the composition and structure of the wafer surface, and the use of metal brushes can physically remove impurities or oxide layers on the wafer surface; in the process of depositing metal thin films, during physical sputtering or chemical vapor deposition, metal brushes can be used to assist in removing excess metal particles generated during the deposition process; in the process of electrochemically preparing metal layers, metal brushes can be used as electrodes; in the packaging process, metal brushes can be used to clean impurities on the surface of packaging materials to ensure good contact between the metal layer and the packaging materials.

[0003] Since the application of metal brushes has an important impact on product quality and performance, and they are consumables, when the brushes show abnormalities, they need to be replaced in a timely manner. However, currently, due to the lack of effective monitoring equipment for metal brushes, most of the monitoring is currently carried out by manual observation.

[0004] Therefore, it is necessary to provide a semiconductor metal brush monitoring device. Summary of the Invention

[0005] In view of the above - mentioned disadvantages of the prior art, the purpose of the present invention is to provide a semiconductor metal brush monitoring device to solve the problem that it is difficult to effectively monitor metal brushes in the prior art.

[0006] To achieve the above - mentioned purpose and other related purposes, the present invention provides a semiconductor metal brush monitoring device, which includes:

[0007] A main body frame;

[0008] A guide rail, which is fixed on the upper surface of the main body frame, includes a first guide rail and a second guide rail, and the end of the second guide rail has an inclined surface;

[0009] A substrate fixing frame, which is provided with a through - hole and a sliding groove on the side far from the through - hole, and the substrate is arranged above the through - hole through the substrate fixing frame;

[0010] A driving component, which includes a driving member and a crank. One end of the crank is connected to the driving member, and the other end of the crank fits into the sliding groove. The driving component converts rotational motion into linear motion.

[0011] A metal brush fixing bracket, which is fixed to the main body frame, and the metal brush is arranged in the through groove through the metal brush fixing bracket.

[0012] A special-shaped sliding component, which is fixed to the substrate fixing bracket and includes a special-shaped slider and a limiting member corresponding to the special-shaped slider.

[0013] When the substrate fixing bracket moves forward, the driving component provides a driving force. The substrate fixing bracket contacts the first guide rail and moves along the first guide rail, and the metal brush contacts the bottom surface of the substrate.

[0014] When the substrate fixing bracket moves backward, the driving component provides a pulling force. The special-shaped slider moves along the inclined surface to the second guide rail under the restriction of the limiting member and runs on the second guide rail, and the substrate fixing bracket is placed on the second guide rail, and the metal brush is away from the bottom surface of the substrate.

[0015] Optionally, the first guide rail and the second guide rail are of an integrally formed structure.

[0016] Optionally, the first guide rail and the second guide rail are of a detachable structure.

[0017] Optionally, a first sliding rail is arranged on the surface of the first guide rail, and / or a second sliding rail is arranged on the surface of the second guide rail.

[0018] Optionally, rollers are arranged at the bottom end of the special-shaped slider.

[0019] Optionally, the metal brush fixing bracket includes a first pressing plate, a second pressing plate and a displacement adjusting plate, and the first pressing plate and the second pressing plate are fixed to the displacement adjusting plate.

[0020] Optionally, the guide rail is arranged axially symmetrically.

[0021] Optionally, a counter is further included, and the number of times the metal brush contacts the substrate is obtained through the counter.

[0022] Optionally, an image acquisition device is further included, and the morphology of the metal brush is obtained through the image acquisition device.

[0023] Optionally, the metal brush includes a cleaning metal brush or a conductive metal brush.

[0024] As described above, the semiconductor metal brush monitoring device of the present invention includes a main body frame, a guide rail, a substrate fixing frame, a driving component, a metal brush fixing frame and a special-shaped sliding component. Among them, the driving component can convert the rotational motion into a linear motion to realize the pushing and pulling operation of the substrate fixing frame. Through the setting of the guide rail and the special-shaped sliding component, the forward, backward, upward and downward movement of the substrate fixing frame can be realized. The semiconductor metal brush monitoring device of the present invention can simulate the application scenario of the metal brush to effectively monitor the metal brush. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It shows a three-dimensional structural schematic diagram of the semiconductor metal brush monitoring device in an embodiment of the present invention.

[0026] Figure 2 It shows Figure 1 an enlarged structural schematic diagram of area B in

[0027] Figure 3 It shows Figure 1 an enlarged structural schematic diagram of area C in

[0028] Figure 4 It shows Figure 1 a cross-sectional structural schematic diagram along A-A' in

[0029] DESCRIPTION OF THE REFERENCE NUMERALS

[0030] 100 - Main body frame; 200 - Guide rail; 201 - First guide rail; 202 - Second guide rail; 212 - Inclined surface; 300 - Substrate fixing frame; 301 - Through groove; 302 - Sliding groove; 400 - Driving component; 401 - Driving member; 402 - Crank; 500 - Metal brush fixing frame; 501 - First pressing plate; 502 - Second pressing plate; 503 - Displacement adjusting plate; 600 - Special-shaped sliding component; 601 - Special-shaped slider; 602 - Limiting member; 700 - Substrate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] The following uses specific specific examples to illustrate the embodiments of the present invention. Those skilled in the art can easily understand the other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0032] It should be noted that the illustrations provided in this embodiment only schematically illustrate the basic concept of the present invention. Therefore, only the components related to the present invention are shown in the drawings, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and proportion of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0033] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.

[0034] As Figure 1 , this embodiment provides a semiconductor metal brush monitoring device, and the semiconductor metal brush monitoring device includes:

[0035] A main body frame 100;

[0036] A guide rail 200, the guide rail 200 is fixed on the upper surface of the main body frame 100, includes a first guide rail 201 and a second guide rail 202, and the end of the second guide rail 202 has an inclined surface 212;

[0037] A substrate fixing frame 300, the substrate fixing frame 300 is provided with a through groove 301 and a sliding groove 302 on one side far from the through groove 301, and the substrate 700 is arranged above the through groove 301 through the substrate fixing frame 300;

[0038] A driving assembly 400, the driving assembly 400 includes a driving member 401 and a crank 402, one end of the crank 402 is connected to the driving member 401, the other end of the crank 402 fits into the sliding groove 302, and the rotational movement is converted into a linear movement through the driving assembly 400;

[0039] A metal brush fixing frame 500, the metal brush fixing frame 500 is fixed on the main body frame 100, and a metal brush (not shown) is arranged in the through groove 301 through the metal brush fixing frame 500;

[0040] A special-shaped sliding assembly 600, the special-shaped sliding assembly 600 is fixed on the substrate fixing frame 300, includes a special-shaped slider 601 and a limiting member 602 arranged corresponding to the special-shaped slider 601;

[0041] When the substrate fixing frame 300 moves forward, the driving assembly 400 provides a driving force. The substrate fixing frame 300 contacts the first guide rail 201 and moves along the first guide rail 201, and the metal brush contacts the bottom surface of the substrate 700.

[0042] When the substrate fixing frame 300 moves backward, the driving assembly 400 provides a pulling force. The special-shaped slider 601 moves along the inclined surface 212 to the second guide rail 202 under the restriction of the limiting member 602 and moves on the second guide rail 202, and the substrate fixing frame 300 is erected on the second guide rail 202, and the metal brush is away from the bottom surface of the substrate 700.

[0043] In the semiconductor metal brush monitoring device of this embodiment, the driving assembly 400 can convert rotational motion into linear motion to realize the pushing and pulling operation of the substrate fixing frame 300. Through the arrangement of the guide rail 200 and the special-shaped sliding assembly 600, the forward, backward, upward and downward movement of the substrate fixing frame 300 can be realized. The semiconductor metal brush monitoring device of this embodiment can simulate the application scenario of the metal brush to effectively monitor the metal brush.

[0044] Specifically, as Figure 1 , when the substrate fixing frame 300 needs to move forward, the driving member 401 in the driving assembly 400, such as a motor, rotates, and converts the rotational motion into linear motion through the crank 402, so that the crank 402 can move along the sliding groove 302 and provide a driving force for the substrate fixing frame 300 at the same time. At this time, the substrate fixing frame 300 contacts the first guide rail 201 and moves horizontally along the first guide rail 201. The bottom of the special-shaped slider 601 moves on the surface of the second guide rail 202. At this time, since the special-shaped slider 601 is not restricted by the limiting member 602, it will not change the vertical displacement of the substrate fixing frame 300. When the substrate 700 carried by the substrate fixing frame 300 moves above the through groove 301, the substrate 700 contacts the metal brush to simulate the wiping process of the metal brush.

[0045] After the substrate 700 completes a wiping process with the metal brush, to simulate the running mode of the fixed direction of the substrate 700 in actual production, such as Figure 1For the left-to-right movement in it, the substrate 700 needs to be moved away from the metal brush and run to the initial position to facilitate the wiping process of the next metal brush. Therefore, the substrate fixing frame 300 needs to be retracted. At this time, still through the rotation of the driving component 400, and through the crank 402, the rotational movement is converted into a linear movement to provide a pulling force, so that the special-shaped slider 601 runs along the inclined surface 212 to the second guide rail 202 under the restriction of the limiting member 602, as Figure 3 , at this time, the special-shaped slider 601 is blocked by the limiting member 602, so that the bottom of the special-shaped slider 601 slides on the second guide rail 202, and the substrate fixing frame 300 is erected on the second guide rail 202 through the special-shaped slider 601, thereby realizing the rising operation of the substrate 700, so that the bottom surface of the substrate 700 is far away from the metal brush to run to the initial position, and when returning to the initial position, the special-shaped slider 601 automatically returns to the original position due to the action of gravity, preparing for the next test cycle.

[0046] Among them, the types of the substrate 700 may include, for example, silicon substrates, glass substrates, III-V substrates, etc., and the morphologies of the substrate 700 may include, for example, square, circular, etc.

[0047] The types of the metal brush may include, for example, a cleaning metal brush used in a cleaning process or a conductive metal brush used in an electrochemical process, such as an electroplating metal brush, etc.

[0048] As an example, the first guide rail 201 and the second guide rail 202 may be of a detachable structure.

[0049] Specifically, such as Figure 1 and Figure 2 , in this embodiment, the guide rail 200 adopts a detachable structure, that is, it includes the first guide rail 201 fixed to the upper surface of the main body frame 100 and the second guide rail 202 fixed to the upper surface of the first guide rail 201. Of course, according to needs, the first guide rail 201 and the second guide rail 202 can also be respectively fixed to the upper surface of the substrate fixing frame 300, which is not limited here.

[0050] In this embodiment, the first guide rail 201 and the second guide rail 202 form an L-shaped guide rail 200 to facilitate the limiting of the substrate fixing frame 300 through the first guide rail 201 and the second guide rail 202, and ensure that the substrate fixing frame 300 can be in stable contact with the metal brush when carrying the substrate 700 for forward and backward movement.

[0051] Further, a first slide rail (not shown) may be provided on the surface of the first guide rail 201, and / or a second slide rail (not shown) may be provided on the surface of the second guide rail 202. Meanwhile, pulleys corresponding to the first slide rail and the second slide rail are provided on the substrate fixing bracket 300, so that the operation of the substrate fixing bracket 300 and the guide rail 200 can be more stable and smooth, and wear can be reduced.

[0052] Of course, according to needs, the first guide rail 201 and the second guide rail 202 may also be an integrally formed structure. For example, the first guide rail 201 and the second guide rail 202 are directly manufactured into the guide rail 200 with an L-shaped morphology.

[0053] Of course, according to needs, only the second guide rail 202 may be provided. A first slide rail is provided on the inner side surface of the second guide rail 202, and a second slide rail is provided on the upper surface of the second guide rail 202. Meanwhile, pulleys corresponding to the first slide rail are provided on the side wall of the substrate fixing bracket 300. Thus, when the substrate fixing bracket 300 moves forward and backward, it can move along the first slide rail, and when it moves up and down, it can move along the second slide rail.

[0054] Further, as Figure 3 , rollers (not shown) may be provided at the bottom end of the special-shaped slider 601. By providing the rollers, the operation of the special-shaped slider 601 on the second guide rail 202 is facilitated, wear is reduced, and operation is facilitated. Among them, preferably, the rollers are detachable rollers for easy replacement.

[0055] As an example, the metal brush fixing bracket 500 includes a first pressing plate 501, a second pressing plate 502, and a displacement adjusting plate 503, and the first pressing plate 501 and the second pressing plate 502 are fixed on the displacement adjusting plate 503.

[0056] Specifically, referring to Figure 4 , in this embodiment, the metal brush fixing bracket 500 is provided inside the main frame 100. The metal brush fixing bracket 500 includes the first pressing plate 501 and the second pressing plate 502 for clamping and fixing the metal brush. Meanwhile, the displacement adjusting plate 503 capable of performing displacement adjustment is also provided, and the first pressing plate 501 and the second pressing plate 502 are fixed on the displacement adjusting plate 503. Thus, displacement adjustment of the metal brush can be realized through the displacement adjusting plate 503, such as one or a combination of lifting displacement adjustment and horizontal displacement adjustment.

[0057] The fixing method of the metal brush is not limited to this. It can also be fixed on the displacement adjusting plate 503 by means such as nuts and buckles, and no excessive limitation is made here.

[0058] As an example, it is preferred that the guide rail 200 is axially symmetrically arranged.

[0059] Specifically, in this embodiment, it is preferred that the guide rail 200 is axially symmetrically arranged to improve the running stability. For example, Figure 1 , in this embodiment, there are 2 groups of symmetrically arranged guide rails 200, that is, a total of 2 symmetrically arranged first guide rails 201 and 4 symmetrically arranged second guide rails 202 are included. At the same time, 4 special-shaped sliding components 600 are correspondingly arranged, thereby improving the running stability of the substrate fixing frame 300.

[0060] Regarding the quantity, distribution, etc. of the guide rail 200 are not limited thereto. It may also only include 1 first guide rail 201, 1 second guide rail 202 and 1 special-shaped sliding component 600, and no excessive limitation is made here.

[0061] As an example, it is preferred that the semiconductor metal brush monitoring device may further include a counter (not shown) to obtain the number of times the metal brush contacts the substrate 700 through the counter, so as to automatically obtain the usage times of the metal brush, so as to perform accurate counting during fatigue tests of the metal brush and avoid deviation in manual counting.

[0062] Among them, no excessive limitation is made on the type of the counter here. The counter can count by monitoring the operation of the crank 402, the operation of the substrate fixing frame 300 or the operation of the special-shaped sliding component 600, and the specific monitoring and counting methods are not limited here.

[0063] As an example, it is preferred that the semiconductor metal brush monitoring device further includes an image acquisition device (not shown) to obtain the morphology of the metal brush through the image acquisition device, so as to accurately obtain the morphology of the metal brush during fatigue tests of the metal brush and accurately judge the usage condition of the metal brush.

[0064] Among them, the types of the image acquisition device may include, for example, a CCD camera, a video camera, etc. No limitation is made on the quantity, distribution, types, etc. of the image acquisition device here.

[0065] Furthermore, it is preferred that the image acquisition device has an automatic comparison function to automatically compare the obtained morphology of the metal brush with the standard morphology of the metal brush stored therein, so as to automatically judge the appearance of the obtained metal brush and avoid manual judgment errors.

[0066] Further, the semiconductor metal brush monitoring device may further include a controller. Preferably, the controller communicates with the driving member 401, and / or the counter, and / or the image acquisition device, so as to achieve automatic control of the semiconductor metal brush monitoring device through the controller. Regarding the communication method, one or a combination of wired communication or wireless communication may be adopted, and the specific communication method is not limited herein.

[0067] In summary, the semiconductor metal brush monitoring device of the present invention includes a main body frame, a guide rail, a substrate fixing frame, a driving assembly, a metal brush fixing frame and a special-shaped sliding assembly. Among them, the driving assembly can convert rotational motion into linear motion to realize the pushing and pulling operation of the substrate fixing frame. Through the setting of the guide rail and the special-shaped sliding assembly, the front, back, up and down movement of the substrate fixing frame can be realized. The semiconductor metal brush monitoring device of the present invention can simulate the application scenario of the metal brush to effectively monitor the metal brush.

[0068] The above embodiments are only illustrative of the principles and effects of the present invention, and are not used to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A semiconductor metal brush monitoring device, characterized in that, The semiconductor metal brush monitoring device includes: A main body frame; Guide rails, which are fixed on the upper surface of the main body frame, including a first guide rail and a second guide rail, and the end of the second guide rail has an inclined surface; A substrate fixing bracket, which is provided with a through groove and a sliding groove on one side far from the through groove, and the substrate is arranged above the through groove through the substrate fixing bracket; A driving component, which includes a driving member and a crank. One end of the crank is connected to the driving member, and the other end of the crank fits into the sliding groove. The rotational movement is converted into a linear movement through the driving component; A metal brush fixing bracket, which is fixed on the main body frame, and the metal brush is arranged in the through groove through the metal brush fixing bracket; A special-shaped sliding component, which is fixed on the substrate fixing bracket and includes a special-shaped slider and a limiting member corresponding to the special-shaped slider; When the substrate fixing bracket moves forward, the driving component provides a driving force. The substrate fixing bracket contacts the first guide rail and moves along the first guide rail, and the metal brush contacts the bottom surface of the substrate; When the substrate fixing bracket moves backward, the driving component provides a pulling force. The special-shaped slider moves along the inclined surface to the second guide rail under the restriction of the limiting member, and the substrate fixing bracket is arranged on the second guide rail to move, and the metal brush is away from the bottom surface of the substrate; Through the arrangement of the guide rail and the special-shaped sliding component, the forward, backward, upward and downward movement of the substrate fixing bracket can be realized to simulate the running mode of the fixing direction of the substrate in actual production, so as to simulate the application scenario of the metal brush and effectively monitor the metal brush.

2. The semiconductor metal brush monitoring device according to claim 1, wherein: The first guide rail and the second guide rail are of an integrally formed structure.

3. The semiconductor metal brush monitoring device according to claim 1, wherein: The first guide rail and the second guide rail are of a detachable structure.

4. The semiconductor metal brush monitoring device according to claim 1, characterized in that: The surface of the first guide rail is provided with a first slide rail, and / or the surface of the second guide rail is provided with a second slide rail.

5. The semiconductor metal brush monitoring device according to claim 1, characterized in that: The bottom end of the special-shaped slider is provided with a roller.

6. The semiconductor metal brush monitoring device according to claim 1, wherein: The metal brush fixing bracket includes a first pressing plate, a second pressing plate and a displacement adjusting plate, and the first pressing plate and the second pressing plate are fixed on the displacement adjusting plate.

7. The semiconductor metal brush monitoring device according to claim 1, characterized in that: The guide rail is symmetrically arranged.

8. The semiconductor metal brush monitoring device according to claim 1, wherein: It further includes a counter, and the number of times the metal brush contacts the substrate is obtained through the counter.

9. The semiconductor metal brush monitoring device according to claim 1, characterized in that: It further includes an image acquisition device, and the morphology of the metal brush is obtained through the image acquisition device.

10. The semiconductor metal brush monitoring device according to claim 1, wherein: The metal brush includes a cleaning metal brush or a conductive metal brush.

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