Satellite thermal vacuum experiment temperature control method, electronic device and storage medium

Abstract

The invention provides a satellite thermal vacuum experiment temperature control method, an electronic device and a storage medium, and the method comprises the steps: collecting the current temperature of an assembly or position of a target temperature control region in a satellite in real time, and carrying out the statistics of the temperature arrival number of the assembly or position of the target temperature control region; based on the temperature arrival number of each assembly or position, the overall temperature change trend of the target temperature control area is calculated; and adjusting external heat flow output in real time according to the overall temperature change trend of the target temperature control area. According to the invention, the target temperature can be reached at the temperature change rate required by the test, and the temperature overshoot and temperature control precision meeting the test requirements can be ensured at the same time. According to the technical scheme, the temperature can be automatically adjusted without human intervention, and the efficiency and safety of temperature adjustment are ensured.

Description

Technical Field

[0001] The present application relates to the field of satellite testing technology, and in particular to a satellite thermal vacuum experiment temperature control method, an electronic device and a storage medium. Background Art

[0002] Thermal vacuum testing is a key test to ensure that spacecraft can operate normally in the extreme environment of space. By placing the spacecraft in a test container that can simulate a vacuum environment, the thermal vacuum test can simulate the extreme temperature conditions that the spacecraft may encounter in orbit, thereby verifying the effectiveness of its design and the reliability of its quality. During the test, technicians will adjust the heat flow outside the spacecraft and the heat power consumption inside to ensure that each component can reach the predetermined temperature. This helps to identify potential design defects or manufacturing problems so that necessary corrections can be made before launch. For the simulation of external heat flow, the commonly used technical means include infrared cages, infrared lamp arrays, and contact heaters. These devices can accurately control the power output of the heater by adjusting the parameters of the PID controller (i.e., proportional-integral-differential controller), thereby achieving precise control of the temperature change rate of each area and the final target temperature, while also ensuring that the temperature fluctuation and control accuracy during the entire test process can meet the experimental requirements.

[0003] During the research process of conceiving and forming this application, the applicant discovered at least the following problems: the thermal vacuum test of the satellite needs to simulate the extreme temperature state of the entire satellite in the cosmic vacuum environment, including extremely low and high temperatures, and at the same time assess the satellite performance during the entire environmental simulation process. It is necessary to ensure the severity of the test environment to ensure that the test assessment is sufficient, and it is also necessary to ensure that there will be no product damage caused by overheating or the introduction of risks that affect reliability during the entire process. During the entire test process, someone needs to monitor the external heat flux output, the temperature of the external heat flux heating area, and the temperature of each product on the satellite to make a judgment on the working condition conversion. Therefore, a certain number of professional and technical personnel are required to take turns on duty, and the thermal vacuum test generally has complex working conditions and a long duration. When commercial satellite products are mass-produced, the cost of conducting thermal vacuum tests is extremely high, resulting in a poor user experience. Summary of the invention

[0004] In order to alleviate the above problems, the present application provides a satellite thermal vacuum experiment temperature control method, comprising: Collect the current temperature of the components or positions in the target temperature control area inside the satellite in real time, and count the temperature of the components or positions in the target temperature control area; Based on the temperature reaching number of each component or position, calculate the overall temperature change trend of the target temperature control area; According to the overall temperature change trend of the target temperature control area, the external heat flow output is adjusted in real time.

[0005] Optionally, the step of collecting the current temperature of the components or positions of the target temperature control area inside the satellite in real time and counting the temperature of the components or positions in the target temperature control area includes: Reading a current operating condition code, and reading a target temperature of a target temperature control area under the current operating condition according to the current operating condition code, wherein the target temperature of the target temperature control area is determined by thermal simulation and thermal balance test results; The direction of temperature change of the current operating condition relative to the previous operating condition is determined according to the target temperature.

[0006] Optionally, the overall temperature change trend includes a temperature change direction; and the process of calculating the overall temperature change trend of the target temperature control area based on the temperature reaching number of each component or position includes: Compare the current temperature of each component or position with the target temperature of the target temperature control area, determine the temperature reaching state of each component or position, and obtain the temperature reaching number of the component or position in the target temperature control area; The start time of the current working condition is determined according to the temperature reaching number of the component or position in the target temperature control area.

[0007] Optionally, in the process of comparing the difference between the current temperature of each component or position and the target temperature of the target temperature control area, judging the temperature-reaching status of each component or position, and obtaining the temperature-reaching number of the component or position in the target temperature control area, if the current operating condition is a heating up relative to the previous operating condition, the current temperature of the component or position is higher than the target temperature, it can be determined that the temperature has been reached and the temperature has been counted; if the current operating condition is a cooling down relative to the previous operating condition, the current temperature of the component or position is lower than the target temperature, it can be determined that the component has been heated and the temperature has been counted.

[0008] Optionally, the overall temperature change trend includes a temperature change rate; in the process of calculating the overall temperature change trend of the target temperature control area based on the temperature of each component or position, Calculate the weighted average temperature of the target temperature control area based on the current temperature of each component or position in the target temperature control area; Fitting a temperature curve according to the weighted average temperature of the target temperature control area obtained at preset time intervals; The temperature curve is derived to obtain the current temperature change rate.

[0009] Optionally, according to the overall temperature change trend of the target temperature control area, the process of adjusting the external heat flow output in real time includes: When the weighted average temperature differs from the target temperature by more than a first temperature difference, adjusting the corresponding external heat flow output to increase the temperature change rate; and / or, When the difference between the weighted average temperature and the target temperature is less than a second temperature difference, the corresponding external heat flow output is adjusted to reduce the temperature change rate.

[0010] Optionally, the process of determining the temperature change direction of the component or position in the target temperature control area according to the temperature reached by the component or position in the target temperature control area includes: If the temperature of the component or position is less than the preset threshold, the temperature change direction remains unchanged; If the temperature reached by the component or position is greater than or equal to a preset threshold, the corresponding external heat flux output is adjusted to adjust the temperature change rate to zero until the current test condition ends.

[0011] Optionally, the process of adjusting the external heat flow output in real time according to the overall temperature change trend of the target temperature control area includes: The safety temperature threshold of each component or position is read, and when the current temperature of the component or position reaches the safety temperature threshold, the external heat flow output is adjusted.

[0012] The present application also provides an electronic device, the electronic device comprising a processor and a memory; The memory stores a computer program, and when the computer program is executed by the processor, the steps of the above-mentioned satellite thermal vacuum experiment temperature control method are implemented.

[0013] The present application also provides a storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the satellite thermal vacuum experiment temperature control method as described above are implemented.

[0014] The satellite thermal vacuum experiment temperature control method, electronic device and storage medium provided by the present application collect the current temperature of the components or positions of the target temperature control area inside the satellite in real time, count the temperature reaching number of the components or positions of the target temperature control area; calculate the overall temperature change trend of the target temperature control area based on the temperature reaching number of each component or position; adjust the external heat flow output in real time according to the overall temperature change trend of the target temperature control area; it can ensure that the target temperature is reached at the temperature change rate required by the test, and at the same time ensure the temperature overshoot and temperature control accuracy that meet the test requirements. The technical solution of the present application can autonomously adjust the temperature without human intervention, and ensure the efficiency and safety of temperature adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor.

[0016] Figure 1This is a flow chart of a temperature control method for a satellite thermal vacuum experiment according to an embodiment of the present application.

[0017] Figure 2 This is a satellite thermal vacuum experiment operation control flow chart of an embodiment of the present application.

[0018] Figure 3 FIG. 1 is a schematic diagram of the basic components of an electronic device according to an embodiment of the present application.

[0019] The realization of the purpose, functional features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. The above-mentioned drawings have shown clear embodiments of this application, which will be described in more detail later. These drawings and textual descriptions are not intended to limit the scope of the concept of this application in any way, but to illustrate the concept of this application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0020] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0021] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0022] It should be understood that, although the terms first, second, third, etc. may be used to describe various information in this article, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this article, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein can be interpreted as "at the time of" or "when" or "in response to determination". Furthermore, as used in this article, the singular forms "one", "one" and "the" are intended to also include plural forms, unless there is an opposite indication in the context. It should be further understood that the terms "comprising" and "including" indicate that there are the described features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or", "and / or", "including at least one of the following" etc. used in this application can be interpreted as inclusive, or mean any one or any combination. For example, “comprising at least one of the following: A, B, C” means “any of the following: A; B; C; A and B; A and C; B and C; A and B and C”, and for another example, “A, B or C” or “A, B and / or C” means “any of the following: A; B; C; A and B; A and C; B and C; A and B and C”. An exception to this definition will only occur when a combination of elements, functions, steps or operations are inherently mutually exclusive in some manner.

[0023] It should be understood that, although the various steps in the flowchart in the embodiment of the present application are displayed in sequence according to the indication of the arrows, these steps are not necessarily performed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and it can be performed in other orders. Moreover, at least a portion of the steps in the figure may include a plurality of sub-steps or a plurality of stages, and these sub-steps or stages are not necessarily performed at the same time, but can be performed at different times, and their execution order is not necessarily performed in sequence, but can be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0024] As used herein, the words "if" and "if" may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to determining" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)", depending on the context.

[0025] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0026] The thermal vacuum test of the satellite needs to simulate the extreme temperature state of the entire satellite in the cosmic vacuum environment, including extreme low and high temperatures, and at the same time assess the satellite performance during the entire environmental simulation process. It is necessary to ensure the severity of the test environment to ensure that the test assessment is sufficient, and it is also necessary to ensure that there will be no product damage caused by overheating or the introduction of risks that affect reliability during the entire process. This application is intended to build an automatically operable thermal vacuum test condition conversion and temperature control system, simulate the logic of manual temperature control, and realize automatic conversion of conditions and automatic temperature adjustment during the test according to the test constraints, thereby reducing personnel costs in the test and meeting the mass production needs of the commercial satellite industry.

[0027] First embodiment This application first provides a satellite thermal vacuum experiment temperature control method. Figure 1 This is a flow chart of a temperature control method for a satellite thermal vacuum experiment according to an embodiment of the present application.

[0028] like Figure 1 As shown, in one embodiment, the satellite thermal vacuum experiment temperature control method includes: S10: collecting the current temperature of the components or positions in the target temperature control area inside the satellite in real time, and counting the temperature of the components or positions in the target temperature control area.

[0029] Exemplarily, the external heat flow control system receives the target temperature requirements of each heating or cooling area, adjusts the output power of the external heat flow heater or refrigerator in real time through PID closed-loop control, and accurately controls the corresponding area according to the target temperature requirements. For each different working condition during the experiment, the number of components or positions in the corresponding heating or cooling area must reach the test target temperature. The following embodiments are described using heating as an example.

[0030] S20: Based on the temperature reaching number of each component or position, calculate the overall temperature change trend of the target temperature control area.

[0031] Considering the test cost and implementation difficulty, each area of ​​the test system contains multiple components or locations that need to be temperature controlled. Since the test does not require all components or locations to reach the target temperature, in actual operation, the heat flow outside the area can be adjusted to ensure that the temperature of each component or location is within its safety threshold, so that a certain number of components and locations can reach the temperature. For example, when setting the target temperature, it is necessary to clarify whether the current operating condition is heating up or cooling down relative to the previous operating condition, so that the module can make logical judgments on the temperature change trend.

[0032] S30: According to the overall temperature change trend of the target temperature control area, the external heat flow output is adjusted in real time.

[0033] For example, based on the difference between the current temperature data and the target temperature, an instruction can be issued to adjust the corresponding external heat flow output to increase the temperature change rate, so as to speed up or accurately control the temperature change and improve the experimental efficiency.

[0034] This embodiment collects the current temperature of the components or positions in the target temperature control area inside the satellite in real time, and counts the temperature reaching number of the components or positions in the target temperature control area; calculates the overall temperature change trend of the target temperature control area based on the temperature reaching number of each component or position; adjusts the external heat flux output in real time according to the overall temperature change trend of the target temperature control area; can ensure that the target temperature is reached at the temperature change rate required by the test, and at the same time ensure that the temperature overshoot and temperature control accuracy required by the test are met, can autonomously adjust the temperature without human intervention, and ensure the efficiency and safety of temperature adjustment.

[0035] Optionally, the step of collecting the current temperature of the components or positions of the target temperature control area inside the satellite in real time and counting the temperature of the components or positions in the target temperature control area includes: Reading a current operating condition code, and reading a target temperature of a target temperature control area under the current operating condition according to the current operating condition code, wherein the target temperature of the target temperature control area is determined by thermal simulation and thermal balance test results; The direction of temperature change of the current operating condition relative to the previous operating condition is determined according to the target temperature.

[0036] Figure 2 This is a satellite thermal vacuum experiment operation control flow chart of an embodiment of the present application.

[0037] like Figure 2 As shown, for example, assuming that the total number of working conditions in the current experiment is N0, that is, the total working condition sequence number N0, the target temperature T of each component or position under the Nth working condition αN , T βN , where the subscripts α and β represent each component or position, and more can be distinguished by other Greek letters, and so on. The N after the Greek letter represents the current operating condition number. When setting the target temperature, it is necessary to clarify whether the current operating condition is heating up or cooling down relative to the previous operating condition, so that the module can make logical judgments. The target temperature of each component or position under the Nth operating condition is determined by the results of thermal simulation and thermal balance tests.

[0038] Optionally, the overall temperature change trend includes a temperature change direction; and the process of calculating the overall temperature change trend of the target temperature control area based on the temperature reaching number of each component or position includes: Compare the current temperature of each component or position with the target temperature of the target temperature control area, determine the temperature reaching state of each component or position, and obtain the temperature reaching number of the component or position in the target temperature control area; The start time of the current working condition is determined according to the temperature reaching number of the component or position in the target temperature control area.

[0039] Please continue to refer to Figure 2 , for example, in the Nth operating condition, the component or position can reach the test target temperature by the number n 0N After that, the experiment of this working condition is officially started and the timing of this working condition begins.

[0040] Optionally, in the process of comparing the difference between the current temperature of each component or position and the target temperature of the target temperature control area, judging the temperature-reaching status of each component or position, and obtaining the temperature-reaching number of the component or position in the target temperature control area, if the current operating condition is a heating up relative to the previous operating condition, the current temperature of the component or position is higher than the target temperature, it can be determined that the temperature has been reached and the temperature has been counted; if the current operating condition is a cooling down relative to the previous operating condition, the current temperature of the component or position is lower than the target temperature, it can be determined that the component has been heated and the temperature has been counted.

[0041] For example, if the current operating condition is a heating up condition relative to the previous operating condition, the component or position can be judged to have reached temperature when the real-time temperature of the component or position under the Nth operating condition is higher than the target temperature, and the temperature can be included in the temperature number; if the current operating condition is a cooling down condition relative to the previous operating condition, the component or position can be judged to have reached temperature when the real-time temperature of the component or position under the Nth operating condition is lower than the target temperature, and the temperature can be included in the temperature number.

[0042] Optionally, the overall temperature change trend includes a temperature change rate; in the process of calculating the overall temperature change trend of the target temperature control area based on the temperature of each component or position, Calculate the weighted average temperature of the target temperature control area based on the current temperature of each component or position in the target temperature control area; Fitting a temperature curve according to the weighted average temperature of the target temperature control area obtained at preset time intervals; The temperature curve is derived to obtain the current temperature change rate.

[0043] Weighted average means that when calculating the average, each data item is weighted according to its importance or weight, and then the average is obtained. Specifically, the weighted average is the average of a set of data after weighting according to their respective importance or weight. The calculation formula is: Weighted average = (w1x1 + w2x2 + ... + w n x n ) / (w1 + w2 + ... + w n ), where w1, w2, ..., w n are weights, x1, x2, ..., x nis a data item. ‌For example, the area that can be heated by the external heat flow output is the target temperature control area, and there may be multiple components or locations in the target temperature control area that can collect the current temperature. Therefore, the real-time temperature collection of multiple components or locations in the target temperature control area can be performed, and the weighted average temperature of the target temperature control area can be calculated by weighted average.

[0044] Exemplarily, during the experiment, real-time temperature data of the component or location is obtained from the temperature acquisition module at preset time intervals, and the calculated weighted average temperature is fit along the time axis data to obtain a fitting temperature curve, which is derived to obtain the current slope, that is, the current temperature change rate, that is, the temperature change rate.

[0045] Optionally, according to the overall temperature change trend of the target temperature control area, the process of adjusting the external heat flow output in real time includes: When the weighted average temperature differs from the target temperature by more than a first temperature difference, adjusting the corresponding external heat flow output to increase the temperature change rate; Optionally, when the weighted average temperature differs from the target temperature by less than a second temperature difference, the corresponding external heat flux output is adjusted to reduce the temperature change rate.

[0046] For example, when the difference between the weighted average temperature data (i.e., the weighted average temperature) and the target temperature is greater than the first temperature difference, an instruction is issued to adjust the corresponding external heat flow output to increase the temperature change rate; when the difference between the temperature data and the target temperature is less than the second temperature difference, an instruction is issued to adjust the corresponding external heat flow output to reduce the temperature change rate. When the group temperature data reaches the target temperature, its temperature change rate is 0, at which time the efficiency is the highest and the waste is the smallest.

[0047] Optionally, the process of determining the temperature change direction of the component or position in the target temperature control area according to the temperature reached by the component or position in the target temperature control area includes: If the temperature of the component or position is less than the preset threshold, the temperature change direction remains unchanged; If the temperature reached by the component or position is greater than or equal to a preset threshold, the corresponding external heat flux output is adjusted to adjust the temperature change rate to zero until the current test condition ends.

[0048] For example, the temperature change direction can be determined according to the temperature of the key component or position, and then the external heat flow output can be controlled according to the temperature change direction. Ideally, when the temperature does not reach the threshold, the external heat flow output is controlled to continue to maintain the temperature change capability; when the temperature reaches the threshold, the external heat flow output is adjusted to reduce its temperature change rate to 0 to improve the experimental efficiency.

[0049] Optionally, the process of adjusting the external heat flow output in real time according to the overall temperature change trend of the target temperature control area includes: The safety temperature threshold of each component or position is read, and when the current temperature of the component or position reaches the safety temperature threshold, the external heat flow output is adjusted.

[0050] For example, the external heat flow output can be controlled according to the safety temperature threshold of the key components or locations to prevent the temperature from exceeding the safety temperature threshold and causing damage to the key components or locations. The system can set the safety temperature threshold of each component or location. When the module determines that the change trend of the current temperature data has the risk of exceeding the threshold, it will also issue an instruction to adjust the external heat flow output to suppress this trend.

[0051] Second embodiment The present application also provides an electronic device, the electronic device comprising a processor and a memory; The memory stores a computer program, and when the computer program is executed by the processor, the steps of the above-mentioned satellite thermal vacuum experiment temperature control method are implemented.

[0052] Figure 3 FIG. 1 is a schematic diagram of the basic components of an electronic device according to an embodiment of the present application.

[0053] like Figure 3 As shown, in one embodiment, the entire system of the electronic device consists of three parts, including a product temperature monitoring system, a test condition automatic control system, and an external heat flow control system.

[0054] The product temperature monitoring system is directly connected to the satellite, and can directly call the temperature telemetry of each component of the satellite product to obtain the real-time temperature data of the components.

[0055] The test condition automatic control system performs certain data analysis and logical judgment according to the current working condition requirements, and outputs the target temperature requirements for each heating area.

[0056] The external heat flux control system receives the target temperature requirements of each heating area, and adjusts the output power of the external heat flux heater in real time through PID closed-loop control, and accurately controls the corresponding area according to the target temperature requirements.

[0057] Among them, the product temperature monitoring system and the external heat flow control system are existing and technologically mature systems, so they are not elaborated in detail.

[0058] The test condition automatic control system includes a condition timing conversion module and an AI temperature data processing module.

[0059] The system needs to preset parameters for operation. The parameter package required for the working condition timing conversion module includes: 1) Total operating condition number N0; 2) Target temperature T of each component or location under the Nth operating condition αN , T βN, where the subscripts α and β represent each component or position, and more can be distinguished by other Greek letters, and so on. The N after the Greek letter represents the current operating condition number. When setting the target temperature, it is necessary to clarify whether the current operating condition is heating up or cooling down relative to the previous operating condition, so that the module can make logical judgments. The target temperature of each component or position under the Nth operating condition is determined by the results of thermal simulation and thermal balance tests.

[0060] 3) The number n of components or locations that must reach the test target temperature under the Nth working condition 0N If the current operating condition is a heating up condition relative to the previous operating condition, the component or position can be judged to have reached the temperature when the real-time temperature of the component or position under the Nth operating condition is higher than the target temperature, and the temperature can be included in the temperature number; if the current operating condition is a cooling down condition relative to the previous operating condition, the component or position can be judged to have reached the temperature when the real-time temperature of the component or position under the Nth operating condition is lower than the target temperature, and the temperature can be included in the temperature number.

[0061] 4) Temperature holding time t at the Nth working condition 0N .

[0062] Please also refer to Figure 2 and Figure 3 , in the operation process of the working condition timing conversion module, the specific steps are as follows: A. Before the system is running, set the target temperature of each component or position under each working condition, set the total working condition sequence number N0, and set the number n of components or positions that must reach the test target temperature under each working condition. 0N , set the hold time t0; B. Start of the test; C. Working condition sequence number count N=1; D. Send instructions to the AI ​​temperature data processing module to start temperature control operations according to working condition N requirements E. Obtain the real-time temperature of the components from the product temperature monitoring system, and refer to the current working condition N judgment logic to count the number of components that have reached temperature n; F. Compare n and n 0N , if n<n 0N Then go back to the previous step and continue counting to the temperature n; if n ≥ n 0N Then proceed to the next step; G. Start timing t; H. Comparison of t and t 0N , if t<t 0N , then continue timing; if t ≥ t 0N (Indicates that the holding time has met the requirement), then proceed to the next step; I. Stop timing, and reset t to zero; J. Working condition number N=N+1 K. Compare N and N0. If N<N0 (indicating that the next operating condition sequence number still does not exceed the total operating condition sequence number required by the test), return to step D) and start to repeat a new cycle; if N≥N0 (indicating that the execution of the next cycle will exceed the number of cycles required by the test), proceed to the next step; L. Prompt that all test conditions are completed and generate a test end signal; M. The test is over and the system stops.

[0063] Exemplarily, the condition parameters that the AI ​​temperature data processing module needs to set during the temperature control operation may include: 1) Total operating condition number N0; 2) Target temperature T of each component or location under the Nth operating condition αN , T βN , where the subscripts α and β represent each component or position, and more can be distinguished by other Greek letters, and so on. The N after the Greek letter represents the current operating condition number. When setting the target temperature, it is necessary to clarify whether the current operating condition is heating up or cooling down relative to the previous operating condition, so that the module can make logical judgments. The target temperature of each component or position under the Nth operating condition is determined by the results of thermal simulation and thermal balance tests; 3) The number of components that must reach the test target temperature under the Nth working condition n 0N If the current operating condition is a temperature increase relative to the previous operating condition, the component or position can be judged to have reached the temperature when the real-time temperature of the component or position under the Nth operating condition is higher than the target temperature, and the temperature is calculated; if the current operating condition is a temperature decrease relative to the previous operating condition, the component or position can be judged to have reached the temperature when the real-time temperature of the component or position under the Nth operating condition is lower than the target temperature, and the temperature is calculated; 4) The safety temperature thresholds of each component or location [TαL, TαH], [TβL, TβH], where the subscripts α and β represent each component or location, and more can be distinguished by other Greek letters, and so on.

[0064] Optionally, because artificial intelligence (AI) technology has more powerful information processing, analysis, decision-making and learning capabilities, artificial intelligence technology is introduced in the system control logic process of the electronic device, and with the help of the existing AI automatic learning and induction capabilities, AI is used as a tool to perform more intelligent logic control logic. Exemplarily, the AI ​​temperature data processing module obtains the real-time temperature data of the component or position from the temperature acquisition module at preset time intervals, and then fits the calculated weighted average temperature along the time axis data to obtain the fitting temperature curve, and derives it to obtain the current slope, that is, the current temperature change rate (temperature change rate). When the temperature data (i.e., the weighted average temperature) differs from the target temperature by more than the first temperature difference, the AI ​​temperature data processing module will issue an instruction to adjust the corresponding external heat flow output to increase the temperature change rate; when the temperature data differs from the target temperature by less than the second temperature difference, the AI ​​temperature data processing module will issue an instruction to adjust the corresponding external heat flow output to reduce the temperature change rate. In an ideal state, when the temperature of a component or position reaches the target temperature, its temperature change rate is 0.

[0065] In addition, the system sets a safety temperature threshold for each component or location. When the module determines that the change trend of the current temperature data is at risk of exceeding the threshold, it will also issue an instruction to adjust the external heat flow output to suppress this trend.

[0066] Exemplarily, when a target temperature control area is converted from a low temperature to a high temperature condition, the temperature of the area is affected by an external heat flow heating control. The area includes components α, β, and γ. The temperature control system presets the high temperature condition target temperature and safety temperature threshold of components α, β, and γ. At the beginning, the data processing module judges that the temperature of α, β, and γ is far from the target temperature. In order to increase the temperature change rate, that is, the slope of the temperature curve, the data processing module issues instructions through calculation to give a higher external heat flow output to ensure that α, β, and γ approach the target temperature as quickly as possible. When α, β, and γ approach the target temperature, the data processing module can simultaneously ensure that the temperature of any component will not exceed its upper limit of the safety temperature threshold (the lower limit when the temperature is reduced). Assuming that the temperature of α may exceed its upper limit of the safety temperature threshold after calculation and analysis under the current external heat flow output, the data processing module will continuously adjust the external heat flow output according to the change of the slope of its temperature curve to ensure that its slope approaches 0 when the temperature of α approaches the upper limit of the safety temperature. As α, β, and γ gradually approach and reach the target temperature, the data processing module also gradually adjusts the external heat flow output to stabilize the temperature of α, β, and γ at the current state (the slope of the temperature curve is 0 or fluctuates around the current temperature).

[0067] Due to test costs and implementation difficulties, the test system cannot control the temperature of a single component or position by an independent external heat flow. Generally, the external heat flow is controlled by region, and each region contains multiple components or positions that need to be temperature controlled. Since the test does not require all components or positions to reach the target temperature, the AI ​​temperature data processing module is actually running to ensure that the temperature of each component or position is within the limited conditions of its safety threshold, and adjust the heat flow outside the region to make a certain number of components and positions reach the temperature. At the same time, in order to ensure the safety of the test temperature control, it is necessary to impose certain restrictions on the output power of the external heat flow.

[0068] The above temperature control logic can rely on artificial intelligence technology to reinforce learning and import AI temperature data processing modules. The reinforcement learning algorithm allows the intelligent agent to determine the best control strategy by interacting with the environment. After the introduction of artificial intelligence technology, an intelligent control system can be established. By integrating sensors, actuators and intelligent devices, intelligent monitoring and control of electrical equipment can be realized, reducing human operation and management, and improving the intelligence level of the system. Artificial intelligence technology is good at processing diverse and complex data. In the system control of electronic devices, artificial intelligence technology can collect, process and analyze system data in real time, make accurate decisions quickly, optimize control strategies, and achieve optimal operation of the system. Artificial intelligence technology has stronger logic and processing capabilities for fuzzy data. It can simulate human thinking patterns and conduct comprehensive analysis of information to make smarter and more reasonable control decisions. Artificial intelligence technology has the ability of adaptive control and can automatically adjust control strategies according to changes in system performance. At the same time, through technologies such as machine learning and deep learning, artificial intelligence technology can continuously learn and optimize control logic to make system control more accurate and efficient. After the introduction of artificial intelligence technology, the system control of electronic devices can better cope with interference factors such as environmental and equipment abnormalities, and improve the stability and reliability of the system. At the same time, artificial intelligence technology can also monitor the system status in real time, detect and handle potential faults in a timely manner, and ensure the safe operation of the system.

[0069] Third embodiment The present application also provides a storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the satellite thermal vacuum experiment temperature control method as described above are implemented.

[0070] The satellite thermal vacuum experiment temperature control method, electronic device and storage medium provided by the present application collect the current temperature of the components or positions of the target temperature control area inside the satellite in real time, count the temperature reaching number of the components or positions of the target temperature control area; calculate the overall temperature change trend of the target temperature control area based on the temperature reaching number of each component or position; adjust the external heat flow output in real time according to the overall temperature change trend of the target temperature control area; it can ensure that the target temperature is reached at the temperature change rate required by the test, and at the same time ensure the temperature overshoot and temperature control accuracy that meet the test requirements. The technical solution of the present application can autonomously adjust the temperature without human intervention, and ensure the efficiency and safety of temperature adjustment.

[0071] It should be noted that in the present application, step codes such as S10, S20, etc. are used for the purpose of expressing the corresponding content more clearly and concisely, and do not constitute a substantial limitation on the sequence. When implementing the step, those skilled in the art may execute S20 first and then S10, etc., but these should all be within the scope of protection of the present application.

[0072] In the embodiments of the device and storage medium provided in the present application, all technical features of any of the above-mentioned method embodiments may be included, and the expanded and explained contents of the specification are basically the same as those of the above-mentioned method embodiments, and will not be repeated here.

[0073] The embodiment of the present application further provides a computer program product, which includes a computer program code. When the computer program code runs on a computer, the computer executes the methods in the above various possible implementation modes.

[0074] An embodiment of the present application also provides a chip, including a memory and a processor, the memory is used to store a computer program, and the processor is used to call and run the computer program from the memory, so that a device equipped with the chip executes the methods in various possible implementation modes as described above.

[0075] It is understood that the above scenarios are only examples and do not constitute a limitation on the application scenarios of the technical solutions provided in the embodiments of the present application. The technical solutions of the present application can also be applied to other scenarios. For example, it is known to those skilled in the art that with the evolution of device architecture and the emergence of new business scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0076] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0077] The steps in the method of the embodiment of the present application can be adjusted in order, combined and deleted according to actual needs.

[0078] The units in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.

[0079] In the present application, the same or similar terminology concepts, technical solutions and / or application scenario descriptions are generally described in detail only the first time they appear. When they appear again later, they are generally not repeated for the sake of brevity. When understanding the technical solutions and other contents of the present application, for the same or similar terminology concepts, technical solutions and / or application scenario descriptions that are not described in detail later, reference can be made to the previous related detailed descriptions.

[0080] In the present application, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0081] The various technical features of the technical solution of the present application can be arbitrarily combined. In order to make the description concise, not all possible combinations of the various technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present application.

[0082] The above are only preferred embodiments of the present application, and the application scope of the present application is not limited thereto. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the application protection scope of the present application.

Claims

1. A satellite thermal vacuum experiment temperature control method, characterized in that: include: Collect the current temperature of the components or positions in the target temperature control area inside the satellite in real time, and count the temperature of the components or positions in the target temperature control area; Based on the temperature reaching number of each component or position, calculate the overall temperature change trend of the target temperature control area; According to the overall temperature change trend of the target temperature control area, the external heat flow output is adjusted in real time.

2. A satellite thermal vacuum experiment temperature control method according to claim 1, characterized in that: The step of collecting the current temperature of the components or positions of the target temperature control area inside the satellite in real time and counting the temperature of the components or positions in the target temperature control area includes: Reading a current operating condition code, and reading a target temperature of a target temperature control area under the current operating condition according to the current operating condition code, wherein the target temperature of the target temperature control area is determined by thermal simulation and thermal balance test results; The direction of temperature change of the current operating condition relative to the previous operating condition is determined according to the target temperature.

3. A satellite thermal vacuum experiment temperature control method according to claim 2, characterized in that: The overall temperature change trend includes the temperature change direction; the process of calculating the overall temperature change trend of the target temperature control area based on the temperature of each component or position and the process before the process include: Compare the current temperature of each component or position with the target temperature of the target temperature control area, determine the temperature reaching state of each component or position, and obtain the temperature reaching number of the component or position in the target temperature control area; The start time of the current working condition is determined according to the temperature reaching number of the component or position in the target temperature control area.

4. A satellite thermal vacuum experiment temperature control method according to claim 3, characterized in that: In the process of comparing the difference between the current temperature of each component or position and the target temperature of the target temperature control area, judging the temperature reaching status of each component or position, and obtaining the temperature reaching number of the component or position in the target temperature control area, if the current operating condition is a heating up condition relative to the previous operating condition, the component or position can be judged to have reached the temperature when the current temperature is higher than the target temperature, and the temperature reaching number is calculated; if the current operating condition is a cooling condition relative to the previous operating condition, the component or position can be judged to have reached the temperature when the current temperature is lower than the target temperature, and the temperature reaching number is calculated.

5. A satellite thermal vacuum experiment temperature control method according to claim 4, characterized in that: The overall temperature change trend includes the temperature change rate; based on the temperature of each component or position, in the process of calculating the overall temperature change trend of the target temperature control area, Calculate the weighted average temperature of the target temperature control area based on the current temperature of each component or position in the target temperature control area; Fitting a temperature curve according to the weighted average temperature of the target temperature control area obtained at preset time intervals; The temperature curve is derived to obtain the current temperature change rate.

6. A satellite thermal vacuum experiment temperature control method according to claim 5, characterized in that: According to the overall temperature change trend of the target temperature control area, the process of adjusting the external heat flow output in real time includes: When the weighted average temperature differs from the target temperature by more than a first temperature difference, adjusting the corresponding external heat flow output to increase the temperature change rate; and / or, When the difference between the weighted average temperature and the target temperature is less than a second temperature difference, the corresponding external heat flow output is adjusted to reduce the temperature change rate.

7. A satellite thermal vacuum experiment temperature control method according to claim 6, characterized in that: The process of determining the temperature change direction of the component or position in the target temperature control area according to the temperature reached by the component or position in the target temperature control area includes: If the temperature of the component or position is less than the preset threshold, the temperature change direction remains unchanged; If the temperature reached by the component or position is greater than or equal to a preset threshold, the corresponding external heat flux output is adjusted to adjust the temperature change rate to zero until the current test condition ends.

8. A satellite thermal vacuum experiment temperature control method according to any one of claims 1 to 7, characterized in that: According to the overall temperature change trend of the target temperature control area, the process of adjusting the external heat flow output in real time includes: The safety temperature threshold of each component or position is read, and when the current temperature of the component or position reaches the safety temperature threshold, the external heat flow output is adjusted.

9. An electronic device, characterized in that: The electronic device includes a processor and a memory; The memory stores a computer program, and when the computer program is executed by the processor, the steps of the satellite thermal vacuum experiment temperature control method according to any one of claims 1 to 8 are implemented.

10. A storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by the processor, the steps of the satellite thermal vacuum experiment temperature control method according to any one of claims 1 to 8 are implemented.

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