Side grounding module and substrate processing apparatus including same

Abstract

The present invention relates to a side grounding module for processing a substrate using plasma and a substrate processing apparatus including the same. The present invention discloses a side grounding module comprising: a base part (100) in which a through hole (101) is formed; a contact shaft part (200) including a contact plate (210) forming a contact surface (211), and a shaft (220) extending from the contact plate (210) and passing through the through hole (101); an elastic part (300) which surrounds the shaft (220) and which is compressed and extended in accordance with the relative movement of the contact shaft part (200) with respect to the base part (100); and a bellows section (400), one end of which is connected to the base section (100) and the other end of which is coupled to the contact shaft section (200), forming a ground path between the contact shaft section (200) and the base section (100).

Description

Technical Field

[0001] The present invention relates to a side grounding module and a substrate processing device including the side grounding module, and more particularly, to a side grounding module for processing a substrate using plasma and a substrate processing device including the side grounding module. Background Art

[0002] A substrate processing device is a device that performs substrate processing such as deposition and etching on the surface of a substrate, and generally includes: a process chamber that forms a sealed processing space; a substrate support portion that is arranged in the process chamber to support the substrate; and a gas injection portion that is arranged on the upper part of the substrate support portion to inject gas used to perform the process.

[0003] On the other hand, in the substrate processing apparatus, power can be applied during the use of plasma or the like depending on the type of substrate processing, and for this purpose, the substrate support portion is grounded together with the process chamber to generate a potential difference.

[0004] To this end, the existing substrate processing device electrically connects the substrate support part to the bottom and inner side of the process chamber to keep the substrate support part grounded. However, the side grounding part of the substrate support part driven by the lifting and lowering movement has the problem of particles generated by friction, which affects the process.

[0005] In particular, the existing substrate processing device achieves grounding by making contact as the substrate supporting part rises. During the grounding process, a part of the structure of the side grounding part moves relatively, thereby causing friction between the through-hole guiding the movement and the moving axis to generate particles. Because the particles generated at this time reduce the process uniformity, there is a problem of reducing the process stability.

[0006] In addition, the existing substrate processing device has a strip for conducting electricity on the side grounding portion to cope with the length change caused by the relative movement of a part of the structure of the side grounding portion and to perform electrical connection between the process chamber and the substrate supporting portion. However, since the strip is configured to extend toward the side of the side grounding portion, there is a problem that the number of side grounding portions set at the edge of the substrate supporting portion is limited. Summary of the invention

[0007] Problem to be solved

[0008] In order to solve the above-mentioned problems, an object of the present invention is to provide a substrate processing apparatus that can minimize the generation of particles when driven for grounding.

[0009] Means of solving the problem

[0010] The present invention is proposed to achieve the purpose of the present invention as described above. The present invention discloses a side grounding module as a side grounding module of a substrate processing device. The substrate processing device includes: a process chamber 10, which forms a sealed processing space S inside; a substrate support part 20, which can be raised and lowered in the process chamber 10 and supports the substrate 1; and a side grounding module 50, which grounds and connects the substrate support part 20 and the process chamber 10. The side grounding module includes: a base portion 100, which is formed with a through hole 101; a contact shaft portion 200, which includes a contact plate 210 and a shaft 220, wherein the contact plate 210 forms a contact surface 211, and the shaft 220 extends from the contact plate 210 to pass through the through hole 101; an elastic portion 300, which surrounds the shaft 220 and is compressed and elongated as the contact shaft portion 200 moves relative to the base portion 100; and a bellows portion 400, one end of which is connected to the base portion 100 and the other end of which is combined with the contact shaft portion 200 to form a grounding path between the contact shaft portion 200 and the base portion 100.

[0011] One end of the elastic portion 300 is supported by the contact plate 210 , and the other end thereof may be supported by the base portion 100 .

[0012] The side grounding module may further include a guide cover portion 500 , which is combined with the base portion 100 and allows the shaft 220 to pass through and guide the upward and downward movement of the contact shaft portion 200 .

[0013] The guide cover 500 has an opening 501 corresponding to the through hole 101 formed at one end and a guide opening 502 corresponding to the shaft 220 formed at the other end, and can be disposed opposite to the contact plate 210 in the base 100 .

[0014] The elastic portion 300 may have one end supported by the contact plate 210 and the other end supported by the guide cover 500 .

[0015] The bellows portion 400 may include a first bellows 410 , one end of the first bellows 410 being coupled to the contact plate 210 and the other end of the first bellows 410 being coupled to the base portion 100 .

[0016] The bellows portion 400 may include a second bellows 420 , one end of the second bellows 420 being coupled to the base portion 100 and the other end of the second bellows 420 being coupled to the shaft 220 .

[0017] The side grounding module may include a fastening component 600 , which passes through the other end of the second bellows 420 and is coupled to the end of the shaft 220 to energize the second bellows 420 and the shaft 220 .

[0018] The bellows portion 400 may include a second bellows 420 , one end of the second bellows 420 being coupled to the guide cover portion 500 and the other end of the second bellows 420 being coupled to the shaft 220 .

[0019] In addition, the present invention discloses a substrate processing device, including: a process chamber 10, which forms a sealed processing space S inside; a substrate support part 20, which is arranged in the process chamber 10 and can be raised and lowered, and supports the substrate 1; a side grounding module 50, which is arranged on the inner surface of the process chamber 10 or at least one of the substrate support parts 20, and grounds the substrate support part 20 and the process chamber 10 as the substrate support part 20 rises.

[0020] The base portion 100 is combined with and disposed at an edge of the substrate supporting portion 20 , and may further include a supporting frame 40 . The supporting frame 40 is protrudingly disposed on an inner surface of the process chamber 10 and contacts the contact plate 210 as the substrate supporting portion 20 rises.

[0021] The substrate processing device may further include a shadow frame 30 , which is mounted on the support frame 40 and is located at the outer periphery of the upper edge of the substrate 1 as the substrate support portion 20 rises during substrate processing.

[0022] The base portion 100 is combined with the inner surface of the process chamber 10 . As the substrate supporting portion 20 rises, the contact plate 210 may contact the substrate supporting portion 20 .

[0023] A plurality of side grounding modules 50 may be symmetrically arranged on a plane with the center of the substrate supporting portion 20 as the reference.

[0024] Effects of the Invention

[0025] The substrate processing device according to the present invention forms a grounding path between the process chamber and the substrate supporting part through a bellows part with a large contact area and a relatively short path, thereby improving the grounding performance. Therefore, it has the advantage of improving the stability of substrate processing using plasma.

[0026] In addition, the substrate processing device according to the present invention omits friction factors when driving the relative movement of the contact shaft portion with the base portion and the compression and extension of the elastic portion, thereby minimizing the generation of particles and isolating the influence on the process, thereby having the advantage of improving the uniformity of substrate processing.

[0027] In particular, the substrate processing apparatus according to the present invention uses a bellows portion to suppress diffusion of particles generated inside, thereby having an advantage of isolating the influence of the particle diffusion on the process.

[0028] In addition, the substrate processing device according to the present invention omits the strip portion extending in the side direction, reduces the plane area of ​​the side grounding module, and further increases the number of side grounding modules that can be set per unit area, thereby having the advantage of enhancing the grounding performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A diagram schematically shows a substrate processing apparatus according to the present invention.

[0030] Figure 2 It is shown in Figure 1 A three-dimensional view of a portion of a side grounding module set in a substrate processing device.

[0031] Figure 3 It is shown Figure 1 A front view of a side grounding module in a substrate processing device.

[0032] Figure 4a and Figure 4b It is shown separately Figure 3 A cross-sectional view of the substrate support portion of the side grounding module in the raised and lowered states.

[0033] Figure 5 is a diagram showing another embodiment of a side grounding module according to the present invention.

[0034] Figure 6 FIG. 1 is a diagram showing another embodiment in which a side grounding module is provided for a substrate processing apparatus according to the present invention.

[0035] (Explanation of Reference Numerals)

[0036] 100: Base portion 200: Contact shaft portion

[0037] 300: Elastic part 400: Bellows part DETAILED DESCRIPTION

[0038] Hereinafter, the side grounding module of the present invention and a substrate processing device including the side grounding module will be described with reference to the accompanying drawings.

[0039] like Figure 1 As shown, the substrate processing device according to the present invention includes: a process chamber 10, which forms a sealed processing space S inside; a substrate support part 20, which is arranged in the process chamber 10 and can be raised and lowered, and supports the substrate 1; at least one of the inner surface of the process chamber 10 or the substrate support part 20 is arranged, and the substrate support part 20 is grounded and connected to the process chamber 10 as the substrate support part 20 rises.

[0040] In addition, the substrate processing apparatus according to the present invention may further include a support frame 40 , which is configured to protrude from the inner surface of the process chamber 10 and contact the contact plate 210 as the substrate supporting portion 20 rises.

[0041] In addition, the substrate processing apparatus according to the present invention may further include a shadow frame 30 , which is mounted on the support frame 40 and is located at the outer periphery of the upper edge of the substrate 1 as the substrate support portion 20 rises during substrate processing.

[0042] In addition, the substrate processing device according to the present invention may also include: a gas injection portion 60, which is arranged on the upper side of the substrate support portion 20 to inject process gas used for substrate processing; one or more bottom grounding portions 70, which are connected to the bottom surface of the substrate support portion 20 and the bottom surface of the process chamber 100, and are connected by strips or the like.

[0043] Here, the substrate 1 serving as a substrate processing object is a substrate for performing substrate processing such as etching and deposition, and can be any substrate as long as its planar shape is a rectangular quadrilateral, such as a substrate for manufacturing LCDs, a substrate for manufacturing OLEDs, a substrate for manufacturing solar cells, etc.

[0044] Then, the substrate processing performed by the substrate processing device according to the present invention is a process of applying power in a sealed processing space S to perform deposition, etching, etc., and any process can also be applied, for example, including a PECVD process using plasma.

[0045] On the other hand, the substrate processing can be performed with a mask 80 placed on the substrate 1. At this time, the mask 80 can constitute various structures. In order to perform deposition, etching, etc. in a predetermined pattern, the mask can form one or more openings in a predetermined pattern, etc.

[0046] For example, the mask 80 may also be a structure including a mask spacer forming one or more openings for the process gas to pass through and a mask frame supporting the edge of the mask spacer, or may be a structure in which a separate mask spacer is omitted.

[0047] The process chamber 10 has a structure in which a sealed processing space S is formed, and may have various structures.

[0048] For example, the process chamber 10 may include: a chamber body 11 , the upper side of which is open and has one or more gates 13 formed thereon; and an upper cover 12 , which covers the upper opening of the chamber body 11 to form a sealed processing space S.

[0049] At this time, the chamber body 11 is structured to be open at the upper side and to be formed with one or more gates 13 , and the planar shape can be formed into various shapes according to the connection structure with other modules such as a transfer module.

[0050] In addition, the chamber body 11 may have a structure for forming a process condition for the processing space S, for example, an exhaust system for controlling pressure.

[0051] The upper cover 12 is a structure that covers the opening of the chamber body 11 to form a sealed processing space S isolated from the outside, and can have various structures.

[0052] The substrate supporting part 20 is a structure that is escalably disposed in the process chamber 100 and supports the substrate 1 , and may have various structures.

[0053] For example, the substrate support part 20 may include: a support plate, forming a substrate placement surface for placing the substrate 1; a support shaft, connected to the support plate at the lower part of the support plate; wherein the support shaft is connected to an external driving part to drive the support plate to rise and fall.

[0054] On the other hand, the substrate supporting portion 20 is provided with a side grounding module 50 described later for lifting and moving, and the side grounding module 50 can be moved up and down as a whole. Therefore, when it is raised for substrate processing, the side grounding module 50 is raised and connected to the cover portion 400 described later, and then can be grounded to the process chamber 10.

[0055] In addition, as another example, Figure 6 As shown, when the side grounding module 50 is arranged on the inner surface of the chamber body 11 in the process chamber 10, the substrate support part 20 can be grounded after contacting the side grounding module 50 through the extension part 23 extending from the edge of the support plate toward the side of the side grounding module 50.

[0056] The shadow frame 30 is a structure located at the periphery of the upper edge of the substrate 1 as the substrate supporting part 20 rises during substrate processing, and can have various structures.

[0057] That is, the shadow frame 30 may be a structure that is supported while being located at the outer periphery of the upper edge of the substrate 1 and interfering with the substrate supporting part 20 when the shadow frame 30 is placed in the processing space S in the process chamber 10 .

[0058] At this time, the shadow frame 30 covers a portion of the edge of the substrate 1 to prevent the edge of the substrate 1 from being exposed to the gas.

[0059] On the other hand, the shadow frame 30 may be directly supported on the edge of the substrate 1 . For another example, the shadow frame 30 may also be supported on the mask 80 corresponding to the periphery of the edge of the substrate 1 .

[0060] In addition, when the shadow frame 30 is placed in the process chamber 10 as the substrate supporting part 20 is lowered, it can be supported on a supporting frame 40 provided on the inner surface of the process chamber 10 to be described later.

[0061] The gas injection unit 60 is provided on the upper side of the substrate support unit 20 to inject a process gas for processing the substrate, and may have various structures.

[0062] For example, the gas injection unit 60 may be in the form of a shower head, wherein the upper cover 12 is combined with a back plate, and a spray plate having a plurality of spray holes is combined with the lower side of the back plate.

[0063] The support frame 40 may be a structure that is protruded from the inner surface of the process chamber 10 so as to contact the contact plate 210 as the substrate support portion 20 rises.

[0064] That is, Figure 4a As shown, the support frame 40 may be disposed on the inner surface of the chamber body 11 , and contact the side grounding module 50 as the substrate support portion 20 rises, so as to ground the structure between the substrate support portion 20 and the process chamber 10 .

[0065] To this end, the support frame 40 can be set on the inner surface of the chamber body 11 as an "L"-shaped bracket, and support the shadow frame 30 on it. Through the rise of the substrate support part 20, the bottom surface is pressurized and contacts the side grounding module 50, thereby forming a grounding path.

[0066] On the other hand, a plurality of the support frames 40 may be configured corresponding to the plurality of side grounding modules 50 . As another example, the support frame 40 may also be arranged on the inner surface of the process chamber 10 along the edge of the shadow frame 30 to form a horizontal length.

[0067] The bottom grounding portion 70 is a structure connected to the bottom surface of the substrate supporting portion 20 and the bottom surface of the process chamber 100 and connected by a strip or the like, and can be configured into various structures.

[0068] That is, the bottom grounding portion 70 is composed of a strip, and its length can change corresponding to the lifting and lowering movement of the substrate support portion 20, and one end is combined with the bottom surface of the substrate support portion 20, and the other end is combined with the bottom surface of the chamber body 11 in the process chamber 10, which can perform a grounding connection between the substrate support portion 20 and the process chamber 10.

[0069] On the other hand, at this time, a plurality of bottom grounding portions 70 may be symmetrically arranged on a plane based on the center of the substrate supporting portion 20 , so as to achieve uniform grounding connection for the substrate supporting portion 20 .

[0070] The side grounding module 50 may be disposed on at least one of the inner surface of the process chamber 10 or the substrate supporting part 20 , and may be grounded to connect the substrate supporting part 20 and the process chamber 10 as the substrate supporting part 20 rises.

[0071] At this time, the side grounding module 50 is set on the substrate support part 20, and can contact the support frame 40 as the substrate support part 20 rises; as another example, it is set on the inner surface of the process chamber 10, that is, it is set on the support frame 40, and can contact the substrate support part 20 as the substrate support part 20 rises.

[0072] On the other hand, in order to enhance the grounding performance of the substrate support portion 20 and form a uniform grounding path, a plurality of side grounding modules 50 may be symmetrically arranged on a plane with the center of the substrate support portion 20 as the reference. More specifically, Figure 2 As shown, a plurality of the side grounding modules 50 may be arranged along the edge of the substrate supporting portion 20 .

[0073] Hereinafter, the side grounding module of the present invention will be described in detail with reference to the accompanying drawings.

[0074] like Figure 3 As shown, the side grounding module according to the present invention includes: a base portion 100, which is formed with a through hole 101; a contact shaft portion 200, including a contact plate 210 and a shaft 220, the contact plate 210 forms a contact surface 211, and the shaft 220 extends from the contact plate 210 and passes through the through hole 101; an elastic portion 300, which is arranged to surround the shaft 220 and is compressed and extended as the contact shaft portion 200 moves relative to the base portion 100; a bellows portion 400, one end of which is connected to the base portion 100 and the other end is combined with the contact shaft portion 200 to form a grounding path between the contact shaft portion 200 and the base portion 100.

[0075] In addition, the side grounding module according to the present invention may further include a guide cover portion 500 , which is combined with the base portion 100 and through which the shaft 220 passes to guide the upward and downward movement of the contact shaft portion 200 .

[0076] The base portion 100 is a structure in which a through hole 101 is formed through which a shaft 220 described later passes, and can have various structures.

[0077] For example, Figure 3 As shown, the base portion 100 may include: a fastening portion 110, formed with a fastening opening; a support base 120, horizontally extending from the fastening portion 110 and formed with a through opening 101; and a fastening bolt 130, penetrating the fastening portion 110 to be set on the inner surface of the substrate support portion 20 or the chamber body 11.

[0078] At this time, the base portion 100 is made of a conductive material such as metal, and directly or indirectly supports the contact shaft portion 200 and the elastic portion 300 described later, and is also disposed on the substrate support portion 20 or the inner surface of the chamber body 11 to form a grounding path.

[0079] For example, Figure 3 As shown, the base portion 100 may be disposed on a side of the substrate supporting portion 20 by fastening bolts 130 .

[0080] The contact shaft portion 200 may be provided through the through hole 101 of the base portion 100 , and may compress or extend the elastic portion 300 to be described later by relative movement with respect to the base portion 100 to contact the support frame 40 or the substrate support portion 20 under pressure.

[0081] That is, when the side grounding module 50 is disposed on the substrate supporting part 20 , the contact shaft part 200 integrally rises with the rise of the substrate supporting part 20 to contact the bottom surface of the supporting frame 40 , thereby guiding the grounding connection between the substrate supporting part 20 and the process chamber 10 .

[0082] To this end, the contact shaft portion 200 may include: a contact plate 210 forming a contact surface 211 ; and a shaft 220 extending from the contact plate 210 to pass through the through hole 101 .

[0083] The contact plate 210 has a contact surface 211 formed on one surface and a shaft 220 disposed on the other surface, and may be made of a conductive material to form a ground path.

[0084] The shaft 220 may be a structure extending from the contact plate 210 and passing through the through-hole 101 .

[0085] At this time, the shaft 220 is provided with an elastic part 300 described later on the outer peripheral surface, and can guide the elastic part 300 to be compressed and extended by relative movement with respect to the base part 100, and can be connected to the bellows part 400 through the fastening component 600 described later and can be energized with the bellows part 400.

[0086] On the other hand, at this time, the shaft 220 is arranged so that the outer peripheral surface is spaced from the inner surface of the through-hole 101. When the elastic part 300 described later is arranged outside the shaft 220, the elastic part 300 and the inner surface of the through-hole 101 are spaced apart, thereby preventing friction with the through-hole 101 when the shaft 220 and the elastic part 300 move relative to each other.

[0087] The elastic portion 300 is a structure that surrounds the shaft 220 and is compressed and extended as the contact shaft portion 200 corresponds to the base portion 100 , and can have various structures.

[0088] That is, the elastic portion 300 may be configured to apply pressure through elastic force to strengthen the contact force and maintain a stable contact state when the contact shaft portion 200 contacts the support frame 40 or the substrate support portion 20 .

[0089] On the other hand, the elastic part 300 is supported by the contact plate 210 at one end and supported by the guide cover part 500 described later at the other end. Figure 5 As shown, one end may be supported by the contact plate 210 , while the other end may be supported by the base 100 .

[0090] According to this, if Figure 4a As shown, as the substrate support part 20 rises, the contact plate 210 contacts the support frame 40 and moves downward relative to the base part 100, thereby compressing the elastic part 300, and then the elastic part 300 provides a pressing force for the contact plate 210 to the support frame 40 side through elastic force.

[0091] In addition, if Figure 4b As shown, the elastic portion 300 can provide a restoring force to release the contact plate 210 from the support frame 40 as the substrate support portion 20 descends, so that the contact plate 210 moves upward relative to the base portion 100 .

[0092] The bellows portion 400 is a structure for forming a ground path between the contact shaft portion 200 and the base portion 100 , and may have various structures.

[0093] That is, Figure 3 As shown, the bellows portion 400 may have one end connected to the base portion 100 and the other end coupled to the contact shaft portion 200 to form a grounding path between the contact shaft portion 200 and the base portion 100 .

[0094] At this time, the bellows portion 400 is made of conductive material, and a grounding path can be formed between the electrically connected contact plate 210 and the base portion 100. Compared with the previous method of using strips, the contact area is increased, the grounding path is shortened, and the grounding performance can be enhanced.

[0095] For example, the bellows portion 400 may include a first bellows 410 having one end coupled to the contact plate 210 and the other end coupled to the base portion 100 ; and a second bellows 420 having one end coupled to the guide cover portion 500 and the other end coupled to the shaft 220 .

[0096] The first bellows 410 has one end coupled to one side of the coupling shaft 220 in the contact plate 210, and the other end coupled to the side opposite to the contact plate 210 in the base portion 100, so as to electrically connect the contact plate 210 and the base portion 100. Furthermore, the substrate support portion 20 or the process chamber 10 coupled and arranged on the base portion 100 and the process chamber 10 or the substrate support portion 20 in contact with the contact plate 210 can be electrically connected to each other.

[0097] The second bellows 420 may have various structures as a structure in which one end is coupled to a guide cover 500 described later and the other end is coupled to the shaft 220 .

[0098] That is, Figure 3 As shown, the second bellows 420 may be a structure in which one end is coupled to the guide cover 500 and the other end is coupled to the end of the shaft 220 via a fastening member 600 described later.

[0099] Thus, the first bellows 410 and the second bellows 420 cover the shaft 220 and the elastic part 300 , thereby physically preventing particles generated during the relative movement of the shaft 220 and the elastic part 300 from diffusing toward the processing space S and the substrate support part 20 .

[0100] In addition, similar to the first bellows 410 , the second bellows 420 is directly or indirectly electrically connected to the contact shaft portion 200 and the base portion 100 , and can also form a grounding path.

[0101] On the other hand, the second bellows 420 does not form a ground path when the guide cover 500 described later is made of an insulating material, but can also be used as a cover structure for preventing particle diffusion.

[0102] The guide cover 500 is a structure that is coupled to the base 100 and through which the shaft 220 passes to guide the vertical movement of the contact shaft 200 , and may have various structures.

[0103] That is, the guide cover portion 500 may be a structure that surrounds at least a portion of the shaft 220 and the elastic portion 300 , supports the distal end of the elastic portion 300 , and guides the movement of the shaft 220 .

[0104] For example, the guide cover 500 has an opening 501 corresponding to the through hole 101 at one end and a guide hole 502 corresponding to the shaft 220 at the other end, and can be disposed opposite to the contact plate 210 side in the base 100 .

[0105] That is, the guide cover 50 is formed with a flange having an opening 501 corresponding to the through-hole 101 at one end, and is connected to the base 100 and disposed on one surface of the second bellows 420 so that the opening 501 extends and is located at the through-hole 101 .

[0106] At this time, the guide cover part 500 forms a guide opening 502 at the other end, and the guide opening 502 has an inner diameter corresponding to the outer diameter of the shaft 220, which can guide the relative movement of the shaft 220, and support the elastic part 300 at the end of the inner surface. The supported elastic part 300 can guide the compression and extension of the elastic part 300 as the shaft 220 moves relative to each other.

[0107] Accordingly, at this time, one end of the elastic portion 300 is supported by the contact plate 210 , and the other end may be supported by the guide cover portion 500 .

[0108] On the other hand, unlike the above, Figure 5 As shown, according to the side grounding module of the present invention, the guide cover portion 500 structure can be omitted. In this case, the second bellows 420 can be directly combined and arranged on the bottom surface of the base portion 100, and the elastic portion 300 is supported by the contact plate 210 at one end and can be supported on the base portion 100 at the other end.

[0109] To this end, the inner diameter of the through hole 101 formed in the base portion 100 is smaller than the inner diameter of the first bellows 410 to form a step, thereby supporting the other end of the elastic portion 300 .

[0110] Furthermore, since the inner diameter of the through-hole 101 is formed to correspond to the outer diameter of the shaft 220 , it is of course possible to guide the vertical movement of the shaft 220 .

[0111] On the other hand, the above-mentioned embodiment is mainly described with the structure that the side grounding module 50 is connected to the substrate support part 20 to contact the support frame 40 to form a grounding path. However, in the following example, Figure 6 The structure shown in the figure is that the side grounding module 50 is set on the inner surface of the chamber body 11.

[0112] At this time, the side grounding module 50 according to the present invention is that the base part 100 is supported and arranged on the inner surface of the chamber body 11 by the fastening bolts 130, and can be arranged so that the chamber body 11 and the base part 100 are electrically connected to each other.

[0113] In this case, the contact shaft portion 200 is arranged such that the contact plate 210 is located at the lower side and the shaft 220 has a length and is extendable at the upper side, so that the extension portion 23 of the substrate support portion 20 can contact the contact plate 210 as it rises.

[0114] On the other hand, in this case, the above-mentioned bellows portion 400 can also be configured so that the first bellows 410 is located on the lower side relative to the base portion 100, and the second bellows 420 is located on the upper side relative to the base portion 100, and the guide cover portion 500 can also be set on the upper side relative to the base portion 100 on the side of the second bellows 420.

[0115] The above is only a part of the relevant description of the preferred embodiment that can be implemented by the present invention. It is well known that the scope of the present invention is not limited to the above-mentioned embodiment explanation. The technical ideas of the present invention described above and its fundamental technical ideas should be regarded as all included in the scope of this part.

Claims

1. A side grounding module, as a side grounding module of a substrate processing device, the substrate processing device comprising: A process chamber (10) forming a sealed processing space (S) inside; A substrate support part (20) is movably disposed in the process chamber (10) and supports the substrate (1); a side grounding module (50) is grounded to connect the substrate support part (20) and the process chamber (10), characterized in that: The side grounding module comprises: The base portion (100) is formed with a through opening (101); The contact shaft portion (200) comprises a contact plate (210) and a shaft (220), wherein the contact plate (210) forms a contact surface (211), and the shaft (220) extends from the contact plate (210) and passes through the through opening (101); An elastic portion (300) surrounds the shaft (220) and is compressed and extended as the contact shaft portion (200) moves relative to the base portion (100); The bellows portion (400) has one end connected to the base portion (100) and the other end coupled to the contact shaft portion (200) to form a grounding path between the contact shaft portion (200) and the base portion (100).

2. The side grounding module according to claim 1, characterized in that: The elastic part (300) has one end supported by the contact plate (210) and the other end supported by the base part (100).

3. The side grounding module according to claim 1, characterized in that: Also includes: The guide cover part (500) is combined with the base part (100) and allows the shaft (220) to pass through to guide the upward and downward movement of the contact shaft part (200).

4. The side grounding module according to claim 3, characterized in that: The guide cover part (500) is formed with an opening (501) corresponding to the through-hole (101) at one end and a guide opening (502) corresponding to the shaft (220) at the other end, and is arranged on the side opposite to the contact plate (210) in the base part (100).

5. The side grounding module according to claim 3, characterized in that: The elastic part (300) has one end supported by the contact plate (210) and the other end supported by the guide cover part (500).

6. The side grounding module according to claim 1, characterized in that: The bellows portion (400) comprises a first bellows (410), One end of the first bellows (410) is coupled to the contact plate (210), and the other end is coupled to the base portion (100).

7. The side grounding module according to claim 1, characterized in that: The bellows portion (400) includes a second bellows (420), One end of the second bellows (420) is coupled to the base portion (100), and the other end is coupled to the shaft (220).

8. The side grounding module according to claim 7, characterized in that: include: A fastening component (600) passes through the other end of the second bellows (420) and is coupled to the end of the shaft (220) to electrically connect the second bellows (420) and the shaft (220).

9. The side grounding module according to claim 3, characterized in that: The bellows portion (400) includes a second bellows (420), One end of the second bellows (420) is coupled to the guide cover (500), and the other end is coupled to the shaft (220).

10. A substrate processing device, comprising: A process chamber (10) forming a sealed processing space (S) inside; A substrate support part (20) is arranged in the process chamber (10) in a liftable manner and supports the substrate (1); The side grounding module (50) of any one of claims 1 to 9 is arranged on at least one of the inner surface of the process chamber (10) or the substrate supporting part (20), and grounds the substrate supporting part (20) and the process chamber (10) as the substrate supporting part (20) rises.

11. The substrate processing apparatus according to claim 10, wherein: The base portion (100) is combined with and arranged at the edge of the substrate support portion (20), and further comprises a support frame (40). The support frame (40) is protrudingly arranged on the inner surface of the process chamber (10), and contacts the contact plate (210) as the substrate support portion (20) rises.

12. The substrate processing apparatus according to claim 11, characterized in that: Also includes: A shadow frame (30) is mounted on the support frame (40) and is located at the periphery of the upper edge of the substrate (1) as the substrate support portion (20) rises during substrate processing.

13. The substrate processing apparatus according to claim 10, wherein: The base portion (100) is combined with the inner surface of the process chamber (10), and as the substrate supporting portion (20) rises, the contact plate (210) contacts the substrate supporting portion (20).

14. The substrate processing apparatus according to claim 10, characterized in that: A plurality of side grounding modules (50) are arranged symmetrically on a plane with the center of the substrate supporting portion (20) as the center.

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