Lead bonding equipment of semiconductor product

Abstract

The invention provides a lead bonding device of a semiconductor product. The lead bonding equipment of the semiconductor product is used for conducting lead welding on an intermediate assembly with a lead frame provided with a chip, so that the chip arranged on the lead frame is electrically connected with a pin of the lead frame, and a semiconductor assembly comprising the lead frame, the chip and a lead is formed. The lead bonding equipment of the semiconductor product comprises an equipment operation table and a dust removal device. The equipment operation table is provided with a feeding end and a discharging end which are opposite to each other, and is provided with a bonding wire working area positioned between the feeding end and the discharging end; the dust removal device comprises a first dust removal device arranged above the area between the wire welding working area and the discharging end, and the first dust removal device can remove dust of the formed semiconductor assembly after the lead is welded. According to the structure, the first dust removal device is arranged above the area between the wire welding working area and the discharging end, dust removal is carried out on the semiconductor assembly after the lead wire is welded, and the problems of chip short circuit, chip surface pollution and the like are avoided.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a wire bonding device for semiconductor products. Background Art

[0002] In the semiconductor packaging industry, wire bonding equipment (such as aluminum wire bonding equipment) is used to weld wires to the lead frame and the chip (bare die or wafer with multiple chips integrated) located on the lead frame to achieve electrical connection between the two. In the related art, in the welding area of ​​the wire bonding equipment, a pressure plate is often used to press the lead frame to fix the lead frame. Metal debris generated in the welding area due to the pressing of the pressure plate and other reasons will be adsorbed on the chip surface, which can easily cause short circuit problems on the chip surface. Summary of the invention

[0003] The embodiment of the present application provides a wire bonding device for a semiconductor product, which is used for wire bonding an intermediate component having a chip on a lead frame, so as to electrically connect the chip on the lead frame with the pins of the lead frame to form a semiconductor component including the lead frame, the chip and the leads. The wire bonding device for the semiconductor product includes:

[0004] An equipment operating table having a feed end and a discharge end opposite to each other, wherein the equipment operating table has a welding wire working area located between the feed end and the discharge end;

[0005] The dust removal device comprises a first dust removal device arranged above the area between the welding wire working area and the discharge end, and the first dust removal device can remove dust from the formed semiconductor component after the lead welding.

[0006] In some embodiments, the equipment operation platform includes a conveyor belt track located at least between the feed end and the discharge end, and the wire bonding equipment for semiconductor products further includes a conveyor belt, which is used to carry an intermediate component having a chip on a lead frame and a semiconductor component including a lead frame, a chip and a lead;

[0007] The conveyor belt can move from the feed end toward the discharge end; when the conveyor belt moves from the feed end toward the discharge end, an intermediate component having a chip on a lead frame enters the equipment operating table from the feed end along the conveyor belt, and after lead welding is performed in the welding wire working area, the formed semiconductor component including the lead frame, chip and lead is moved out of the conveyor belt track from the discharge end along the conveyor belt.

[0008] In some embodiments, the first dust removal device includes a first blowing pipe and an air suction pipe disposed above the area between the welding wire working area and the discharge end, the first blowing pipe is used to blow air toward the semiconductor component to blow away foreign matter on the semiconductor component, and the air suction pipe is used to extract the airflow with foreign matter above the semiconductor component.

[0009] In some embodiments, there is a non-zero angle between the extension direction of the first blowing pipe and the suction pipe and the extension direction of the conveyor belt track; and / or,

[0010] The first air blowing pipe and the air suction pipe are in the shape of straight rods, and the first air blowing pipe and the air suction pipe are parallel.

[0011] In some embodiments, the first dust removal device has a first mounting seat, the first mounting seat includes a first mounting vertical wall and a first mounting bottom wall extending from the bottom edge of the first mounting vertical wall toward one side; the first mounting bottom wall is assembled on the side of the conveyor belt track and is located on the side of the first mounting vertical wall away from the conveyor belt track; the first blowing pipe and the suction pipe are arranged on the first mounting vertical wall and extend to above the conveyor belt track.

[0012] In some embodiments, the first air blowing pipe is provided with a first opening located at the bottom and facing one side of the suction pipe, and the axial direction of the first opening has a first angle with the direction perpendicular to the surface of the equipment operating table; the suction pipe is provided with a second opening located at the bottom and facing one side of the first air blowing pipe, and the axial direction of the second opening has a second angle with the direction perpendicular to the surface of the equipment operating table; wherein, the first angle is 15°-65°, the second angle is 15°-65°, and / or at least one of the first angle and the second angle is adjustable.

[0013] In some embodiments, the air suction pipe is located on a side of the first air blowing pipe close to the wire bonding work area.

[0014] In some embodiments, the first air blowing pipe and the air suction pipe are height-adjustable.

[0015] In some embodiments, the wire bonding apparatus for semiconductor products further comprises a gas supply device connected to the first gas blowing pipe, and a gas withdrawal device connected to the gas suction pipe;

[0016] The gas supply device provides nitrogen, and the gas extraction device is a vacuum extraction device.

[0017] In some embodiments, the dust removal device also includes a second dust removal device disposed above the feed end, and the second dust removal device can remove dust from the intermediate component with a chip on the lead frame before the intermediate component with a chip on the lead frame enters the wire bonding work area.

[0018] The main technical effects achieved by the embodiments of the present application are:

[0019] The wire bonding equipment for semiconductor products provided in the embodiment of the present application, by setting a first dust removal device above the area between the welding wire working area and the discharge end, removes dust from the formed semiconductor component after wire welding, realizes wire bonding in the wire bonding process, and removes foreign matter such as metal debris generated by the wire bonding process, thereby avoiding the occurrence of problems such as chip short circuit and chip surface contamination due to the presence of foreign matter such as metal debris. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural side view of a wire bonding device for a semiconductor product provided by an exemplary embodiment of the present application;

[0021] Figure 2 is a top view of the structure of a wire bonding device for a semiconductor product provided by an exemplary embodiment of the present application;

[0022] Figures 3 to 5 is a structural diagram of a first dust removal device provided by an exemplary embodiment of the present application; wherein, Figure 3 is a three-dimensional structural diagram of the first dust removal device, Figure 4 is a side view of the first dust removal device from one perspective, Figure 5 is a side view of the first dust removal device from another perspective;

[0023] Figures 6 to 8 is a structural diagram of a second dust removal device provided by an exemplary embodiment of the present application; wherein, Figure 6 is a three-dimensional structural diagram of the second dust removal device, Figure 7 is a side view of the second dust removal device from one perspective, Figure 8 is a side view of the second dust removal device from another perspective;

[0024] Fig. 9 and Fig.10 is a structural diagram of another first dust removal device provided by an exemplary embodiment of the present application; wherein, Fig. 9 is a three-dimensional structural diagram of the first dust removal device, Fig.10 is a side view of the first dust removal device from one perspective;

[0025] Fig.11 and Fig.12is a structural diagram of another second dust removal device provided by an exemplary embodiment of the present application; wherein, Fig.11 is a three-dimensional structural diagram of the second dust removal device, Fig.12 It is a side view of the second dust removal device from one perspective. DETAILED DESCRIPTION

[0026] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0027] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0028] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0029] The wire bonding equipment of the semiconductor product is used to perform wire bonding on an intermediate component having a chip on a lead frame, so as to electrically connect the chip on the lead frame with the pins of the lead frame to form a semiconductor component including the lead frame, the chip and the leads. The wire bonding equipment of the semiconductor product includes an equipment operating table and a dust removal device. The equipment operating table has a relative feed end and a discharge end, and the equipment operating table has a wire bonding work area located between the feed end and the discharge end; the dust removal device includes a first dust removal device arranged above the area between the wire bonding work area and the discharge end, and the first dust removal device can remove dust from the formed semiconductor component after wire bonding. The wire bonding equipment of the above-mentioned semiconductor product is provided with a first dust removal device above the area between the wire welding working area and the discharge end. After the wire welding, the formed semiconductor component is dusted, the wire bonding is realized in the wire bonding process, and foreign matters such as metal debris generated by the wire bonding process are removed, so as to avoid the occurrence of problems such as chip short circuit and chip surface contamination due to the presence of foreign matters such as metal debris.

[0030] The following is combined with Figures 1 to 12 , some embodiments of the wire bonding equipment of the semiconductor product described in this application are described in detail.

[0031] Please refer to Figure 1 as shown, and if necessary, combined Figures 2 to 12 As shown, the wire bonding equipment 100 for semiconductor products is used to perform wire bonding on an intermediate component 200 having a chip 80 on a lead frame 70, so as to electrically connect the chip 80 on the lead frame 70 with the pins of the lead frame 70, thereby forming a semiconductor component 300 including the lead frame 70, the chip 80 and the leads 90. The wire bonding equipment 100 for semiconductor products includes an equipment operating table 10 and a dust removal device 20.

[0032] The equipment operating platform 10 has a feed end 1001 and a discharge end 1002 opposite to each other, and the equipment operating platform 10 has a wire welding working area S1 located between the feed end 1001 and the discharge end 1002 .

[0033] The dust removal device 20 includes a first dust removal device 21 disposed above the area between the wire bonding work area S1 and the discharge end 1002 . The first dust removal device 21 can remove dust from the formed semiconductor component 300 after wire bonding.

[0034] for example Figure 1 As shown, in some embodiments, the equipment operation station 10 has a feed end 1001 and a discharge end 1002 opposite to each other in a first direction X. Figure 1The second direction Z points upward. The first direction X and the second direction Z are perpendicular to each other. Of course, in some other embodiments, the two directions may also have other non-zero angles.

[0035] In some embodiments, the equipment operating station 10 includes a conveyor belt track 13 located at least between the feed end 1001 and the discharge end 1002, and the wire bonding equipment 100 for the semiconductor product also includes a conveyor belt 12, and the conveyor belt 12 is used to carry an intermediate component 200 having a chip 80 on a lead frame 70 and a semiconductor component 300 including a lead frame 70, a chip 80 and leads.

[0036] The conveyor belt 12 can move from the feed end 1001 toward the discharge end 1002. When the conveyor belt 12 moves from the feed end 1001 toward the discharge end 1002, the intermediate component 200 having a chip 80 on a lead frame 70 enters the equipment operation table 10 from the feed end 1001 along with the conveyor belt 12, and after the lead is welded in the welding wire working area S1, the formed semiconductor component 300 including the lead frame 70, the chip 80 and the lead is moved out of the conveyor belt track 13 from the discharge end 1002 along with the conveyor belt 12.

[0037] In some embodiments, the dust removal device 20 is detachably mounted on the equipment operating table 10, which is convenient for replacement and maintenance of the dust removal device 20, and also convenient for leveling the product when the product on the conveyor belt 12 becomes stuck and warped.

[0038] In some embodiments, the first dust removal device 21 includes a first blowing pipe 211 and an air suction pipe 212 disposed above the area between the wire bonding work area S1 and the discharge end 1002, wherein the first blowing pipe 211 is used to blow air toward the semiconductor component 300 to blow away foreign matter on the semiconductor component 300, and the air suction pipe 212 is used to extract the airflow having foreign matter above the semiconductor component 300.

[0039] In some embodiments, an extending direction of the first air blowing pipe 211 and an extending direction of the conveyor track 13 have a non-zero angle.

[0040] Preferably, the extension direction of the first air blowing pipe 211 and the extension direction of the conveyor belt track 13 are perpendicular to each other, or have an angle close to a right angle, so as to control the length of the suction pipe 212, control the size of the entire dust removal device, and have a good dust removal effect.

[0041] In some embodiments, an extending direction of the suction pipe 212 and an extending direction of the conveyor track 13 have a non-zero angle.

[0042] Preferably, the extension direction of the suction pipe 212 and the extension direction of the conveyor belt track 13 are perpendicular to each other, or have an angle close to a right angle, so as to control the length of the suction pipe 212, control the size of the entire dust removal device, and have a good dust removal effect.

[0043] In some embodiments, the first air blowing pipe 211 and the air suction pipe 212 are in the shape of straight rods. The first air blowing pipe 211 and the air suction pipe 212 may be parallel to each other.

[0044] In some embodiments, the first dust removal device 21 has a first mounting seat 213, and the first mounting seat 213 includes a first mounting vertical wall 2131 and a first mounting bottom wall 2132 extending toward one side from the bottom edge of the first mounting vertical wall 2131. The first mounting bottom wall 2132 is assembled on the side of the conveyor belt track 13 and is located on the side of the first mounting vertical wall 2131 away from the conveyor belt track 13. The first blowing pipe 211 and the suction pipe 212 are arranged on the first mounting vertical wall 2131 and extend to be located above the conveyor belt track 13.

[0045] like Figure 2 As shown, the conveyor belt track 13 extends along the first direction X, and the first mounting seat 213 is assembled on the side of the conveyor belt track 13 facing the third direction Y. Specifically, the first mounting bottom wall 2132 is assembled on the side of the conveyor belt track 13 facing the third direction Y.

[0046] The first direction X and the third direction Y are perpendicular to each other. Of course, in some other embodiments, the two may also have other non-zero angles. The second direction Z and the third direction Y are also perpendicular to each other. Of course, in some other embodiments, the two may also have other non-zero angles.

[0047] In some embodiments, the first blowing pipe 211 and the suction pipe 212 are detachably mounted on the first mounting wall 2131. Figures 3 to 5 As shown, the first mounting wall 2131 is provided with mounting holes 2312, 2311 corresponding to the first air blowing pipe 211 and the air suction pipe 212 respectively, and the first air blowing pipe 211 and the air suction pipe 212 may be provided with matching mounting holes corresponding to the mounting holes 2312, 2311 respectively, so as to penetrate fixing parts (such as mounting screws, etc.) so as to detachably mount the first air blowing pipe 211 and the air suction pipe 212 on the first mounting wall 2131.

[0048] In some embodiments, the first air blowing pipe 211 is provided with a first opening 2110 located at the bottom and facing one side of the suction pipe 212, and a first angle A is formed between the axial direction of the first opening 2110 and a direction perpendicular to the surface of the equipment operating table 10; the suction pipe 212 is provided with a second opening 2120 located at the bottom and facing one side of the first air blowing pipe 211, and a second angle B is formed between the axial direction of the second opening 2120 and a direction perpendicular to the surface of the equipment operating table 10; wherein, the first angle A is 15°-65°, and the second angle B is 15°-65°.

[0049] Preferably, the first angle A is 45 degrees, and the second angle B is 45 degrees, which has a better dust removal effect.

[0050] The first openings 2110 may be a plurality of circular holes or small holes of other shapes that are spaced apart along the length direction of the first blowing tube 211 .

[0051] The second openings 2120 may be a plurality of circular holes or small holes of other shapes that are spaced apart along the length direction of the air intake pipe 212 .

[0052] In some embodiments, at least one of the first angle A and the second angle B is adjustable.

[0053] For example, both the first angle A and the second angle B are adjustable. The first blowing pipe 211 and the suction pipe 212 are provided with matching mounting holes spaced apart along the circumferential direction, so that the first angle A and the second angle B can be adjusted by aligning the different matching mounting holes with the corresponding mounting holes.

[0054] One of the first angle A and the second angle B may also be adjustable, and the pipe corresponding to the adjustable angle is provided with matching mounting holes spaced circumferentially to facilitate alignment and installation with corresponding mounting holes through different matching mounting holes to achieve adjustment of the corresponding angle.

[0055] In some embodiments, the air intake pipe 212 is located on one side of the first air blowing pipe 211 close to the welding wire working area S1, so that the airflow provided by the first air blowing pipe 211 flows outward as little as possible (especially toward the downward process working area), which will not affect the next process flow and has a better dust removal effect.

[0056] In some embodiments, the first blowing pipe 211 and the suction pipe 212 are height-adjustable.

[0057] for example Fig. 9 and Fig.10As shown, the mounting holes 2130 and 2133 for mounting the first blowing pipe 211 and the suction pipe 212 opened in the mounting wall 2131 of the first dust removal device 21' extend in the vertical direction of the mounting wall 2131 and can be Fig.10 The multiple connected hole structures shown may also be spaced hole structures. The heights of the first blowing pipe 211 and the suction pipe 212 are adjusted by different hole positions of the mounting holes 2130 and 2133, respectively, to better meet different needs. For example, the heights of the first blowing pipe 211 and the suction pipe 212 can be adjusted according to different product heights.

[0058] Here, the first blowing pipe 211 and the suction pipe 212 can be both adjustable in height, or only one of them can be adjusted. If the first blowing pipe 211 and the suction pipe 212 are both adjustable in height, the height of one of them can be adjusted separately, or the heights of both can be adjusted simultaneously.

[0059] The heights of the first air blowing pipe 211 and the air suction pipe 212 can be adjusted according to specific needs.

[0060] In some embodiments, the wire bonding device 100 for semiconductor products further includes a gas supply device 40 connected to the first gas blowing pipe 211. The gas supply device 40 is connected to the first gas blowing pipe 211 through a pipeline.

[0061] One end of the first blowing pipe 211 assembled on the first mounting seat 213 may be provided with an internal thread, and the end of the pipe connecting the gas providing device 40 and the first blowing pipe 211 is provided with a matching thread that matches the internal thread, and the two are fixedly connected by thread sealing.

[0062] Of course, in some other embodiments, the pipeline may be sealed and fixedly connected to the first blowing pipe 211 in other ways.

[0063] In some embodiments, the gas providing device 40 can provide nitrogen. Of course, in other embodiments, the gas providing device 40 can also provide other gases.

[0064] The wire bonding equipment 100 for semiconductor products further includes a gas extraction device 30 connected to the gas suction pipe 212 .

[0065] An inner thread may be provided in one end of the air intake pipe 212 assembled on the first mounting seat 213, and a matching thread matching with the inner thread is provided at the end of the pipe connecting the gas withdrawal device 30 and the air intake pipe 212, and the two are fixedly connected by thread sealing.

[0066] Of course, in some other embodiments, the pipeline may be sealed and fixedly connected to the air intake pipe 212 in other ways.

[0067] In some embodiments, the gas withdrawal device 30 may be a vacuum device, such as a vacuum pump or other suction pumps.

[0068] In some embodiments, the dust removal device 20 also includes a second dust removal device 22 disposed above the feed end 1001, and the second dust removal device 22 can remove dust from the intermediate component 200 having a chip 80 on the lead frame 70 before the intermediate component 200 having a chip 80 on the lead frame 70 enters the wire bonding work area S1.

[0069] In some embodiments, the second dust removal device 22 includes a second air blowing pipe 222 disposed above the feed end 1001 , and the second air blowing pipe 222 is used to blow air toward the intermediate component 200 to blow foreign matter on the intermediate component 200 outward from the feed end 1001 .

[0070] In some embodiments, when the equipment operating table 10 includes a conveyor belt track 13 located at least between the feed end 1001 and the discharge end 1002, an extension direction of the second blowing pipe 222 and an extension direction of the conveyor belt track 13 have a non-zero angle.

[0071] Preferably, the extension direction of the second air blowing pipe 222 is perpendicular to the extension direction of the conveyor belt track 13, or the two have an angle close to a right angle, so as to control the length of the second air blowing pipe 222, control the size of the entire second dust removal device, and have a good dust removal effect.

[0072] In some embodiments, the second blowing tube 222 is in the shape of a straight rod.

[0073] In some embodiments, the second dust removal device 22 has a second mounting seat 221, and the second mounting seat 221 includes a second mounting vertical wall 2211 and a second mounting bottom wall 2212 extending from the bottom edge of the second mounting vertical wall 2211 toward one side; the second mounting bottom wall 2212 is assembled on the side of the conveyor belt track 13, and is located on the side of the second mounting vertical wall 2211 away from the conveyor belt track 13; the second air blowing pipe 222 is arranged on the second mounting vertical wall 2211, and extends to the top of the conveyor belt track 13.

[0074] In some embodiments, the second air blowing pipe 222 is detachably mounted on the second mounting wall 2211. Figures 3 to 5As shown, the second mounting wall 2211 is provided with mounting holes corresponding to the second air blowing pipe 222 respectively, and the second air blowing pipe 222 may be provided with matching mounting holes corresponding to the mounting holes for passing fixing parts (such as mounting screws, etc.) so that the second air blowing pipe 222 can be detachably mounted on the second mounting wall 2211.

[0075] In some embodiments, the second air blowing pipe 222 is provided with a third opening 2220 located at the lower part and facing away from the welding wire working area S1, and a third angle C is formed between the axial direction of the third opening 2220 and the direction perpendicular to the surface of the equipment operating table 10; wherein the third angle C is 15°-65°.

[0076] The third openings 2220 may be a plurality of circular holes or small holes of other shapes arranged at intervals along the length direction of the second blowing tube 222 .

[0077] In some embodiments, the third angle C is adjustable.

[0078] For example, the second air blowing pipe 222 is provided with matching mounting holes spaced apart along the circumferential direction, so as to adjust the first angle A and the second angle B by aligning and mounting different matching mounting holes with the mounting holes.

[0079] In other embodiments, the third angle C is not adjustable.

[0080] In some embodiments, the height of the second air blowing tube 222 is adjustable.

[0081] For example, Fig.11 and Fig.12 As shown, the mounting hole 22110 for mounting the second air blowing pipe 222 opened in the second mounting vertical wall 2211 of the second dust removal device 22' extends in the vertical direction of the second mounting vertical wall 2211 and can be as follows: Fig.12 The multiple interconnected hole structures shown may also be spaced hole structures. The height of the second blowing pipe 222 can be adjusted by being arranged at different hole positions to better meet different needs. For example, the height of the second blowing pipe 222 can be adjusted according to different product heights.

[0082] The height of the second air blowing pipe 222 can be adjusted according to specific needs.

[0083] In some embodiments, the second air blowing pipe 222 is connected to a gas providing device 40. The gas providing device 40 is connected to the second air blowing pipe 222 through a pipeline.

[0084] The second blowing pipe 222 is assembled on one end of the second mounting seat 221 and may be provided with an internal thread. The end of the pipe connecting the gas providing device 40 and the second blowing pipe 222 is provided with a matching thread that matches the internal thread. The two are fixedly connected by thread sealing.

[0085] Of course, in some other embodiments, the pipeline may be sealed and fixedly connected to the second blowing pipe 222 in other ways.

[0086] Of course, the wire bonding equipment of the semiconductor product can also be supplied with gas through other independent gas supply devices.

[0087] In some embodiments, the equipment operating platform 10 may further include a support base 11 located at least below the conveyor belt track 13 .

[0088] In addition, the front end of the equipment operating table 10 of the wire bonding equipment 100 for semiconductor products may also include a feed portion 50 located at the front end of the feed end 1001, such as a support structure or a barrier structure with an opening between the wire bonding equipment and the previous process flow area. The rear end of the equipment operating table 10 of the wire bonding equipment 100 for semiconductor products may also include a discharge portion 60 located at the rear end of the discharge end 1002, such as a support structure or a barrier structure with an opening between the wire bonding equipment and the next process flow area. The feed portion 50, the discharge portion 60 and the equipment operating table 10 may all have a certain gap. For those with a second dust removal device 22, the airflow provided by the second dust removal device 22 can blow foreign matter such as dust into the gap between the feed portion 50 and the equipment operating table 10.

[0089] It should be noted that the dust removal device 20 of the wire bonding equipment 100 for the semiconductor product mentioned above includes both a first dust removal device 21 and a second dust removal device 22, which can greatly improve the dust removal effect.

[0090] Of course, in some other embodiments, the dust removal device of the wire bonding equipment for semiconductor products may also only have the first dust removal device but not the second dust removal device.

[0091] In the absence of conflict, the above-mentioned embodiments and features thereof may be combined with each other.

[0092] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0093] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0094] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A wire bonding device for semiconductor products, used for wire bonding an intermediate component having a chip on a lead frame, so as to electrically connect the chip on the lead frame with the pins of the lead frame to form a semiconductor component including a lead frame, a chip and a lead, characterized in that: The wire bonding equipment of the semiconductor product comprises: An equipment operating table having a feed end and a discharge end opposite to each other, wherein the equipment operating table has a welding wire working area located between the feed end and the discharge end; The dust removal device comprises a first dust removal device arranged above the area between the welding wire working area and the discharge end, and the first dust removal device can remove dust from the formed semiconductor component after the lead welding.

2. The wire bonding device for semiconductor products according to claim 1, characterized in that: The equipment operation platform includes a conveyor belt track located at least between the feed end and the discharge end, and the wire bonding equipment for semiconductor products also includes a conveyor belt, which is used to carry an intermediate component with a chip on a lead frame and a semiconductor component including a lead frame, a chip and a lead; The conveyor belt can move from the feed end toward the discharge end; when the conveyor belt moves from the feed end toward the discharge end, an intermediate component having a chip on a lead frame enters the equipment operating table from the feed end along the conveyor belt, and after lead welding is performed in the welding wire working area, the formed semiconductor component including the lead frame, chip and lead is moved out of the conveyor belt track from the discharge end along the conveyor belt.

3. The wire bonding device for semiconductor products according to claim 2, characterized in that: The first dust removal device includes a first blowing pipe and an air suction pipe arranged above the area between the welding wire working area and the discharge end. The first blowing pipe is used to blow air toward the semiconductor component to blow away foreign matter on the semiconductor component, and the air suction pipe is used to extract the airflow with foreign matter above the semiconductor component.

4. The wire bonding device for semiconductor products according to claim 3, characterized in that: An angle between the extension direction of the first blowing pipe and the suction pipe and the extension direction of the conveyor belt track is not zero; and / or, The first air blowing pipe and the air suction pipe are in the shape of straight rods, and the first air blowing pipe and the air suction pipe are parallel.

5. The wire bonding device for semiconductor products according to claim 3, characterized in that: The first dust removal device has a first mounting seat, which includes a first mounting vertical wall and a first mounting bottom wall extending from the bottom edge of the first mounting vertical wall toward one side; the first mounting bottom wall is assembled on the side of the conveyor belt track and is located on the side of the first mounting vertical wall away from the conveyor belt track; the first blowing pipe and the suction pipe are arranged on the first mounting vertical wall and extend to above the conveyor belt track.

6. The wire bonding device for semiconductor products according to any one of claims 3 to 5, characterized in that: The first air blowing pipe is provided with a first opening located at the lower part and facing one side of the air suction pipe, and a first angle is formed between the axial direction of the first opening and a direction perpendicular to the surface of the equipment operating table; the air suction pipe is provided with a second opening located at the lower part and facing one side of the first air blowing pipe, and a second angle is formed between the axial direction of the second opening and a direction perpendicular to the surface of the equipment operating table; wherein, the first angle is 15°-65°, the second angle is 15°-65°, and / or at least one of the first angle and the second angle is adjustable.

7. The wire bonding device for semiconductor products according to any one of claims 3 to 5, characterized in that: The air suction pipe is located at a side of the first air blowing pipe close to the welding line working area.

8. The wire bonding device for semiconductor products according to any one of claims 3 to 5, characterized in that: The first air blowing pipe and the air suction pipe are height-adjustable.

9. The wire bonding device for semiconductor products according to any one of claims 3 to 5, characterized in that: The wire bonding equipment for semiconductor products further comprises a gas supply device connected to the first gas blowing pipe, and a gas withdrawal device connected to the gas suction pipe; The gas supply device provides nitrogen, and the gas extraction device is a vacuum extraction device.

10. The wire bonding device for semiconductor products according to any one of claims 1 to 5, characterized in that: The dust removal device also includes a second dust removal device arranged above the feed end, and the second dust removal device can remove dust from the intermediate component with a chip on the lead frame before the intermediate component with a chip on the lead frame enters the wire bonding work area.

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