Film thickness data measurement method and device of virtual measurement machine, medium and product

Abstract

The embodiment of the invention relates to the technical field of semiconductors, and discloses a film thickness data measurement method and device of a virtual measurement machine, a medium and a product. The method comprises the following steps: when a virtual wafer passes through a virtual thin film process machine, storing film thickness data generated by the virtual thin film process machine in the virtual wafer; when the virtual wafer passes through a virtual measuring machine for measuring the film thickness, acquiring the film thickness data through the virtual measuring machine; and assembling the film thickness data according to a data format required by a real measurement machine to obtain virtual measurement result data. By adopting the scheme, thin film process manufacturing can be carried out on the virtual wafer through the virtual thin film process machine table, virtual measurement of the film thickness data is realized, and the virtual measurement requirement is met.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a film thickness data measurement method, equipment, medium and product of a virtual measuring machine. Background Art

[0002] In recent years, with the rapid development of science and technology, the production of semiconductor chips has become an important factor affecting the development of equipment hardware and software.

[0003] Producing a chip requires hundreds or even thousands of steps, among which thin film technology plays a vital role. Thin films are extremely thin layers of material formed on the surface of the chip, and their thickness is usually at the nanometer level. These films can be composed of a variety of materials, including metals, oxides, and nitrides, which have different physical and chemical properties to meet the needs of different functional parts of the chip. Thin film technology mainly includes the following common methods: physical vapor deposition (PVD), chemical vapor deposition (CVD), and atomic layer deposition (ALD).

[0004] In order to ensure the quality and performance of thin films during chip manufacturing, accurate measurement methods are required. Thickness measurement is one of the main evaluation criteria. Virtual measurement of film thickness plays an important role in the production process, providing a data basis for the formulation of corresponding data simulation and measurement requirements. However, for virtual measurement machines, on the one hand, there is a lack of physical wafers, and on the other hand, how to obtain film thickness data generated by process machines. These two difficulties need to be solved urgently. Summary of the invention

[0005] One purpose of the present application is to provide a film thickness data measurement method, equipment, medium and product for a virtual measuring machine, at least to solve the problem that the physical wafer cannot be connected and the film thickness data cannot be obtained during the virtual measurement process. The present application stores the film thickness data generated by the virtual thin film process machine in the virtual wafer when the virtual wafer passes through the virtual thin film process machine; obtains the film thickness data through the virtual measuring machine when the virtual wafer passes through the virtual measuring machine for measuring the film thickness; assembles the film thickness data according to the data format required by the real measuring machine to obtain virtual measurement result data. By adopting this solution, the virtual wafer can be subjected to thin film process production through the virtual thin film process machine, and the virtual measurement of the film thickness data can be realized to meet the virtual measurement requirements.

[0006] To achieve the above objectives, some embodiments of the present application provide the following aspects:

[0007] In a first aspect, some embodiments of the present application provide a film thickness data measurement method of a virtual measuring machine, the method comprising:

[0008] When the virtual wafer passes through the virtual thin film process machine, the film thickness data generated by the virtual thin film process machine is stored in the virtual wafer;

[0009] When the virtual wafer passes through a virtual measuring machine for measuring film thickness, the film thickness data is obtained through the virtual measuring machine;

[0010] The film thickness data is assembled according to the data format required by the real measuring machine to obtain virtual measurement result data.

[0011] In a second aspect, some embodiments of the present application further provide an electronic device, comprising: one or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, cause the processor to perform the steps of the method described above.

[0012] In a third aspect, some embodiments of the present application further provide a computer-readable medium having computer program instructions stored thereon, wherein the computer program instructions can be executed by a processor to implement the method as described above.

[0013] In a fourth aspect, some embodiments of the present application further provide a computer program product, comprising a computer program / instruction, which implements the steps of the method described above when executed by a processor.

[0014] Compared with the related art, in the solution provided by the embodiment of the present application, when the virtual wafer passes through the virtual thin film process machine, the film thickness data generated by the virtual thin film process machine is stored in the virtual wafer; when the virtual wafer passes through the virtual measuring machine for measuring the film thickness, the film thickness data is obtained by the virtual measuring machine; the film thickness data is assembled according to the data format required by the real measuring machine to obtain virtual measurement result data. This technical solution can perform thin film process production on the virtual wafer through the virtual thin film process machine, and realize virtual measurement of film thickness data, meeting the virtual measurement requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0016] Figure 1 An exemplary flow chart of a film thickness data measurement method of a virtual measuring machine provided according to some embodiments of the present application;

[0017] Figure 2 A schematic diagram of data interaction for film thickness data measurement according to some embodiments of the present application;

[0018] Figure 3 An exemplary structural diagram of the electronic device is disclosed. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] First embodiment

[0021] The first embodiment of the present application relates to a film thickness data measurement method of a virtual measuring machine. Figure 1 As shown, the method may include the following steps:

[0022] Step S101, when a virtual wafer passes through a virtual thin film process machine, the film thickness data generated by the virtual thin film process machine is stored in the virtual wafer;

[0023] In the simulation or virtual environment of semiconductor manufacturing and other related fields, a virtual wafer is a digital simulation of the wafer used in actual production. It has some key properties and feature settings of the actual wafer, and is used to simulate the situation of the real wafer in each manufacturing process link, just like creating a virtual "stand-in" with the basic characteristics of the wafer in the computer system, so as to analyze, test and optimize the entire manufacturing process without actual physical operation.

[0024] A virtual thin film process machine is also a thin film process machine that simulates a real production scenario in a virtual environment. In the semiconductor manufacturing process, a thin film process machine is a device used to deposit, grow or form various thin film materials on the surface of a wafer, such as through chemical vapor deposition (CVD), physical vapor deposition (PVD) and other technologies. A virtual thin film process machine simulates the functions and operation of these actual machines through software algorithms and models, and can "generate" corresponding results based on the set process parameters. One of the results here is film thickness data.

[0025] The film thickness data is stored in the virtual wafer. When this virtual thin film process machine that simulates the actual operation completes its virtual thin film generation operation, it will obtain the thickness data of the thin film formed on the surface of the virtual wafer. Then, this film thickness data will be stored in the virtual wafer object representing the wafer. This step is very important because subsequent further analysis, quality assessment, process optimization and other operations of the entire virtual wafer manufacturing process may be based on the film thickness data stored in the virtual wafer. For example, when judging whether the thin film process meets the expected thickness requirements and combining it with other subsequent process links to analyze the overall process compatibility, it is necessary to call this stored film thickness data as the basic basis.

[0026] In a virtual manufacturing environment, the process of simulating data generation and storage in the thin film process is aimed at conducting virtual-level research and optimization of the semiconductor manufacturing process more conveniently and efficiently.

[0027] Step S102, when the virtual wafer passes through a virtual measuring machine for measuring film thickness, the film thickness data is obtained through the virtual measuring machine;

[0028] A virtual measuring machine for measuring film thickness can be a measuring machine specifically used to measure film thickness in a virtual environment that simulates a real production scenario. In the actual semiconductor manufacturing process, the measuring machine is a very critical device that can accurately measure the thickness of the film deposited on the surface of the wafer using various physical principles and measurement techniques (such as optical interference principles, etc.). The virtual measuring machine simulates the functions and measurement processes of these real measuring machines through software programming, algorithm models, etc., and can perform similar film thickness measurement operations on virtual wafers passing through it in a virtual environment.

[0029] The process of obtaining film thickness data can be when the virtual wafer "moves" to the virtual measuring machine for measuring film thickness in this simulated production process, just like a real wafer is sent to an actual measuring machine for measurement. At this time, the virtual measuring machine will detect and analyze the film thickness on the surface of the virtual wafer according to the measurement principles and methods it simulates, and then obtain specific data about the film thickness. This data reflects the thickness of the film on the virtual wafer at the current simulation process stage. The production process of the virtual wafer can be evaluated and optimized based on these data in the future, such as judging whether the film thickness meets the expected requirements and whether the previous film deposition process needs to be adjusted.

[0030] In a virtual manufacturing environment, the film thickness on the surface of a virtual wafer is measured and the corresponding data is obtained by simulating a real measuring machine, so as to simulate, analyze and optimize the semiconductor manufacturing process without performing actual physical operations.

[0031] Step S103 , assembling the film thickness data according to the data format required by the real measurement machine to obtain virtual measurement result data.

[0032] In the previous process, whether it is the film thickness data generated by the virtual thin film process machine and stored in the virtual wafer, or the film thickness data obtained by the virtual measurement machine, it may initially exist in a relatively simple format that is easy to calculate and process within the virtual environment. For example, it may be just an array of simple thickness values, or a data format with some basic tags but not in line with the output specifications of the measurement machine in the actual production scenario.

[0033] In actual semiconductor manufacturing and other related industries, after the actual measurement equipment completes the measurement of wafer film thickness, it will output the measurement results in a specific, industry-wide and standardized data format. This data format is usually set to meet the needs of data analysis, quality control, process adjustment and other aspects in the subsequent production process.

[0034] For example, it may include the following information:

[0035] In addition to the specific value of the film thickness, the basic measurement information also includes the measurement timestamp, indicating when the measurement was completed; the measurement location information, such as in which area of ​​the wafer (center, edge, etc.) the measurement was performed. Because the film thickness at different locations on the wafer may be different, it is important to clearly understand the measurement location for a comprehensive understanding of the wafer film thickness.

[0036] The device-related information will indicate which measuring machine was used to complete the measurement. This helps to trace the source of the measurement and to check whether the abnormality is caused by the device itself when a problem occurs.

[0037] The process batch information will be linked to the specific process batch to which the wafer belongs, so as to grasp the film thickness of the same batch of products from a macro perspective and analyze whether there are batch quality problems.

[0038] To assemble the previously acquired virtual film thickness data according to the data format required by the real measuring machine is to expand and standardize the original simple form of film thickness data. Specifically, it is necessary to add the various necessary information mentioned above to these data. For example, according to the virtual time set in the virtual environment, add the corresponding measurement timestamp to the film thickness data; according to the position setting of the virtual wafer in the virtual environment, determine the location information of the film thickness measurement and add it; clarify which virtual measuring machine simulated the measurement in the virtual environment, and add it as equipment-related information; at the same time, it is also necessary to link to the virtual process batch information to which the virtual wafer belongs.

[0039] After being assembled in this way according to the data format required by the actual measuring machine, the originally scattered and simple film thickness data becomes virtual measurement result data that conforms to the actual production scenario specifications and contains rich information.

[0040] These virtual measurement result data can be further used in the virtual environment to simulate various operations in actual production. For example, similar to the quality control process in real production, in the virtual environment, these data can be used to determine whether the film thickness of the virtual wafer meets the quality standards and whether the virtual process needs to be adjusted, thereby achieving effective simulation and optimization of semiconductor manufacturing and other related processes at the virtual level.

[0041] In one embodiment, after obtaining the virtual measurement result data, the method further includes:

[0042] The virtual measurement result data is reported to an upstream system according to a preset reporting rule.

[0043] In this solution, after the virtual measuring machine obtains the film thickness data, the data is assembled according to the data format required by the real machine to obtain the virtual measurement result data, and the virtual measurement result data is reported to the upstream system in a prescribed manner.

[0044] Through such a setting, the patented technical solution enables the virtual measuring machine to have measurement capabilities, so that the processing results of the previous process can be verified.

[0045] The film thickness data generated by the virtual measuring machine is generated according to the actual manufacturer's specifications. It is imperceptible to its upstream system and also makes the entire production chain complete for the entire virtual factory.

[0046] In one embodiment, obtaining the film thickness data by a virtual measuring machine includes:

[0047] The film thickness data is obtained by interacting with the virtual measuring machine and the virtual wafer.

[0048] Among them, the specific method of obtaining film thickness data can be obtained through the interaction between the virtual measuring machine and the virtual wafer. Since the virtual wafer has stored the film thickness data, this solution can obtain the film thickness data as long as it interacts and parses according to the corresponding data parsing rules.

[0049] This solution can improve the efficiency of obtaining film thickness data through such a setting, and avoid affecting the acquisition time of film thickness data or introducing other errors due to complex communication processing.

[0050] In one embodiment, the method further comprises:

[0051] Define the data structure of the virtual wafer to store film thickness data.

[0052] Specifically, the measurement points of each product can be defined. For example, 13 measurement points are defined for product A, and (x, y) is used to represent the coordinate points on the virtual wafer. The thickness of the film is represented by z, and the number of layers T is marked, such as T1, T2, etc.

[0053] Through such a setting, the present solution can store the film thickness data according to a predefined data structure, which is beneficial for subsequent reading and processing and improves processing efficiency and accuracy.

[0054] In one embodiment, the method further comprises:

[0055] Obtain thickness data distribution information obtained by real thin film process machines in thin film processes;

[0056] Determining data distribution characteristics of film thickness data generated by the virtual thin film process machine according to the thickness data distribution information;

[0057] The virtual thin film process machine is controlled to generate film thickness data according to the data distribution characteristics.

[0058] In the actual thin film process, assuming that the target thickness of a certain thin film is 10 angstroms (angstroms are 0.1nm, a unit commonly used in chip manufacturing), the obtained thickness data distribution information may include other values ​​other than 10 angstroms, such as 10 angstroms, 9.8 angstroms, 10.2 angstroms, 9.2 angstroms, 10.8 angstroms, etc. If the accuracy we need is 10 angstroms ± 0.5 angstroms for qualified data, then we can determine that 10 angstroms, 9.8 angstroms, and 10.2 angstroms are qualified data, and 9.2 angstroms and 10.8 angstroms are unqualified data.

[0059] This solution can determine the distribution information of film thickness based on the statistics of historical data, and determine the data distribution characteristics based on the distribution information, and then when the virtual thin film process machine generates film thickness data, the data distribution characteristics can be combined to generate the film thickness data.

[0060] Through such a setting, the present scheme can improve the authenticity of the virtual film thickness data, and can identify whether the virtual measuring machine can identify unqualified data, and provide a basis for judging whether the virtual measuring machine can operate stably.

[0061] In one embodiment, controlling the virtual thin film process machine to generate film thickness data according to the data distribution characteristics includes:

[0062] determining at least two measurement points on the simulated wafer surface;

[0063] The virtual thin film process machine is controlled to generate film thickness data of each measuring point according to the data distribution characteristics.

[0064] In this solution, there can be multiple measurement points, such as 13 in the above example, or even more. By setting multiple measurement points, the precision of data simulation of the virtual thin film process machine can be improved, providing more data recognition basis for the recognition capability of the virtual measurement machine.

[0065] In one embodiment, the film thickness data is generated according to the recipe requirements of the current film material.

[0066] In this solution, the film thickness data is generated based on the recipe requirements of the current film material, for example, based on the process formula and operation requirements in actual production.

[0067] The technical solution provided in this embodiment is that when the virtual wafer passes through the virtual thin film process machine, the film thickness data generated by the virtual thin film process machine is stored in the virtual wafer; when the virtual wafer passes through the virtual measuring machine for measuring the film thickness, the film thickness data is obtained by the virtual measuring machine; the film thickness data is assembled according to the data format required by the real measuring machine to obtain virtual measurement result data. This technical solution can perform thin film process production on the virtual wafer through the virtual thin film process machine, and realize virtual measurement of film thickness data to meet virtual measurement requirements.

[0068] Second embodiment

[0069] A second embodiment of the present application relates to a film thickness data measurement method of a virtual measurement machine. Figure 2 Schematic diagram of data interaction for film thickness data measurement according to some embodiments of the present application; Figure 2 As shown:

[0070] S1: Define the data structure of the virtual wafer for storing film thickness data.

[0071] S2: When the virtual wafer passes through a virtual thin film process machine capable of generating thin films, the generated film thickness data is stored in the virtual wafer according to the requirements of the recipe.

[0072] S3: When the virtual wafer passes through the virtual measuring machine for measuring film thickness, the virtual measuring machine interacts with the virtual wafer to obtain corresponding film thickness data.

[0073] S4: When the virtual measuring machine obtains the film thickness data, the data is assembled according to the data format required by the real machine and reported to the upstream system in the prescribed manner.

[0074] In step 1, the data structure of the film thickness data is as follows:

[0075] Define the measurement points for each product. For example, product A has 13 measurement points defined. (x, y) is used to represent the coordinate points on the virtual wafer. z is used to represent the thickness of the film, and the number of layers T1 is marked.

[0076] In step 2, the specific process details are as follows:

[0077] S21: The virtual wafer passes through the virtual thin film process machine to generate a thin film of material A according to the recipe requirements, and its thickness requirement is (angstrom).

[0078] S22: Generate 13 point thicknesses of material A according to the data structure defined in S1.

[0079] In step 4, the specific structure of the measurement data is as follows:

[0080]

[0081]

[0082]

[0083] This patented technical solution enables the virtual measuring machine to have measurement capabilities, so that the processing results of the pre-process can be verified. The film thickness data generated by the virtual measuring machine is generated according to the real manufacturer's specifications, which is imperceptible to its upstream system. For the entire virtual factory, it also makes the entire production chain complete.

[0084] In addition, some embodiments of the present application also provide an electronic device. The electronic device may be a digital computer in various forms, such as a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, etc. The electronic device may also be a mobile device in various forms, such as a personal digital processing, a cellular phone, a smart phone, a wearable device, and other similar computing devices.

[0085] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor executes the steps of the method provided in any one or more of the above embodiments. Figure 3 An exemplary structural diagram of the electronic device is disclosed. Figure 3As shown, the electronic device includes: one or more processors 301, a memory 302, and an interface for connecting each component, including a high-speed interface and a low-speed interface. The various components are connected to each other using different buses and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only used as examples, and are not intended to limit the implementation of the present application described and / or required herein.

[0086] The electronic device may further include: an input device 303 and an output device 304. The processor 301, the memory 302, the input device 303 and the output device 304 may be connected via a bus or other means. Figure 3 The example of connecting through bus is taken in the following.

[0087] The input device 303 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 304 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.

[0088] To provide interaction with a user, the electronic device may be a computer. The computer has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0089] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the method provided by any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0090] The memory 302 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 301 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 302, so as to implement the program instructions / modules corresponding to the method provided by any one or more of the above embodiments in the embodiments of the present application.

[0091] The memory 302 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 302 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory 302 may optionally include a memory remotely arranged relative to the processor 301, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0092] It should be noted that the computer-readable medium described in the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM, Random AccElasticsearchs Memory), a read-only memory (ROM, Read-Only Memory), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable medium may be any tangible medium containing or storing a program, which may be used by or in combination with an instruction execution system, device or device.

[0093] Computer readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, modules of programs or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission medium that can be used to store information that can be accessed by a computing device.

[0094] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0095] In the above-described embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. For example, it can be implemented by using an application specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device. In certain embodiments, the software program of the present application can be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including relevant data structures) can be stored in a computer-readable recording medium, for example, a RAM memory, a magnetic or optical drive or a floppy disk and similar devices. In addition, some steps or functions of the present application can be implemented by hardware, for example, as a circuit that cooperates with a processor to perform each step or function.

[0096] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from a computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid state disk (SSD)), etc.

[0097] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0098] The scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the device claim may also be implemented by one unit or device through software or hardware. The words "first", "second", etc. are only used to distinguish the description, and do not indicate any particular order, nor can they be understood as indicating or implying relative importance.

[0099] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily mention changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.

Claims

1. A film thickness data measurement method using a virtual measuring machine, characterized in that: When the virtual wafer passes through the virtual thin film process machine, the film thickness data generated by the virtual thin film process machine is stored in the virtual wafer; When the virtual wafer passes through a virtual measuring machine for measuring film thickness, the film thickness data is obtained through the virtual measuring machine; The film thickness data is assembled according to the data format required by the real measuring machine to obtain virtual measurement result data.

2. The method according to claim 1, characterized in that After obtaining the virtual measurement result data, the method further includes: The virtual measurement result data is reported to an upstream system according to a preset reporting rule.

3. The method according to claim 1, characterized in that The film thickness data is obtained by a virtual measuring machine, including: The film thickness data is obtained by interacting with the virtual measuring machine and the virtual wafer.

4. The method according to claim 1, characterized in that: The method further comprises: Define the data structure of the virtual wafer to store film thickness data.

5. The method according to claim 1, characterized in that The method further comprises: Obtain thickness data distribution information obtained by real thin film process machines in thin film processes; Determining data distribution characteristics of film thickness data generated by the virtual thin film process machine according to the thickness data distribution information; The virtual thin film process machine is controlled to generate film thickness data according to the data distribution characteristics.

6. The method according to claim 5, characterized in that Controlling the virtual thin film process machine to generate film thickness data according to the data distribution characteristics, including: determining at least two measurement points on the simulated wafer surface; The virtual thin film process machine is controlled to generate film thickness data of each measuring point according to the data distribution characteristics.

7. The method according to claim 1, characterized in that The film thickness data is generated based on the reci pe requirements of the current film material.

8. An electronic device, characterized in that: The electronic device comprises: one or more processors; and A memory storing computer program instructions, which, when executed, cause the processor to perform the steps of the method as claimed in any one of claims 1 to 7.

9. A computer readable medium having a computer program / instructions stored thereon, characterized in that: When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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