Angle-replaceable film tearing and transferring mechanism

Abstract

The invention relates to the technical field of wafer de-bonding, and particularly discloses an angle-replaceable film tearing and transferring mechanism which comprises a fixed end and a linear motion assembly, an iron frame adsorption table is located at the outer ring of a wafer carrying disc, a plurality of vacuum suction cups are fixedly arranged on the iron frame adsorption table and are uniformly distributed, and the linear motion assembly is located at the lower end of the iron frame adsorption table; a wafer is connected to the wafer carrying disc through a plurality of vacuum suction cups, a plurality of telescopic air cylinders are fixedly arranged on the iron frame adsorption table and evenly distributed, the wafer is located at the tops of the output ends of the telescopic air cylinders, residual glue adheres to the wafer, the residual glue, the wafer, the iron frame and the adhesive film are integrated, and the iron frame is located on the iron frame adsorption table. According to the invention, the film tearing and transferring operation of the wafer can be automatically carried out, the angle of the wafer can be automatically rotated, and the film tearing of the wafer is facilitated.

Description

Technical Field

[0001] The invention relates to the technical field of wafer debonding, and in particular to a film tearing and transferring mechanism with changeable angles. Background Art

[0002] The bonding machine is a key device used to bond chips or devices with residual adhesive, and it plays an important role in modern microelectronics technology. Wafer bonding technology achieves three-dimensional short-distance interconnection of integrated circuits by stacking wafers, thereby increasing the speed of information transmission and reducing the size of devices. Wafer bonding technology includes temporary bonding and permanent bonding. Temporary bonding has higher flexibility, while permanent bonding uses chemical and physical methods to tightly bond the wafers.

[0003] The debonding process is a process that is carried out after temporary bonding and the completion of related processes. It is necessary to peel off the residual glue on the wafer and remove the residual adhesive.

[0004] Bonding machines can complete high-precision and high-efficiency bonding processes, connecting devices of different materials together, and provide important support for the electrical interconnection, functional integration and device packaging of microelectronic materials, optoelectronic materials and their nano-scale micro-electromechanical components. Such equipment usually supports a variety of bonding processes, such as anodic bonding, glass powder bonding, solder bonding, eutectic bonding, etc.

[0005] The existing technology still has the following areas for improvement: the wafer surface is usually coated with a layer of residual glue, which needs to be removed in subsequent processing steps for further handling and processing. The residual glue may have high adhesion, making it difficult to be completely peeled off from the wafer surface. Summary of the invention

[0006] In order to solve the above problems existing in the prior art, the present invention provides a film tearing and transferring mechanism with a changeable angle, which can automatically perform the film tearing and transferring operation of the wafer and can automatically rotate the angle of the wafer to facilitate the film tearing of the wafer.

[0007] The purpose of the present invention can be achieved through the following technical solutions: A film tearing and transferring mechanism with interchangeable angles comprises a fixed end and a linear motion component, an iron frame adsorption platform is located at the outer circle of a wafer carrier, a plurality of vacuum suction cups are fixedly arranged on the iron frame adsorption platform, the plurality of vacuum suction cups are evenly distributed, a wafer is connected to the wafer carrier through the plurality of vacuum suction cups, a plurality of telescopic cylinders are fixedly arranged on the iron frame adsorption platform, the plurality of telescopic cylinders are evenly distributed, the wafer is located at the top of the output ends of the plurality of telescopic cylinders, residual glue is adhered to the wafer, the residual glue, the wafer, the iron frame and the sticky film are a whole, and the iron frame is located on the iron frame adsorption platform.

[0008] Furthermore, a guide bushing is fixedly provided at the lower end of the wafer carrier, a lifting cylinder is provided at the lower end of the guide bushing, and an output end of the lifting cylinder is cooperatively connected with the guide bushing.

[0009] Furthermore, a cylinder adapter plate is provided on the guide bushing, a rotating cylinder is provided at the lower end of the cylinder adapter plate, and an adapter plate strip hole is opened on the cylinder adapter plate.

[0010] Furthermore, a cam is provided on the rotary cylinder, and the cam is tangentially matched with the strip-shaped hole of the adapter plate.

[0011] Furthermore, the guide bushing is slidably connected to the two guide rails, and the lower ends of the two guide rails are fixedly connected to the upper ends of the fixed ends.

[0012] Furthermore, the lower end of the fixed end is connected to the linear motion component, and the guide bushing is slidably connected to the linear motion component.

[0013] Furthermore, the plurality of vacuum suction cups and the plurality of telescopic cylinders are staggeredly distributed.

[0014] Furthermore, a vacuum interface is fixedly arranged on the wafer carrier.

[0015] Furthermore, the iron frame adsorption platform is in a ring structure.

[0016] Furthermore, a film tearing tape is arranged above the wafer carrier.

[0017] The beneficial effects of the present invention are: (1) By setting up a wafer carrier, an iron frame adsorption platform and a film peeling tape, the technical effect that can be achieved is that it includes a fixed end and a linear motion component, the iron frame adsorption platform is located at the outer ring of the wafer carrier, a plurality of vacuum suction cups are fixedly arranged on the iron frame adsorption platform, the plurality of vacuum suction cups are evenly distributed, the wafer is connected to the wafer carrier through the plurality of vacuum suction cups, a plurality of telescopic cylinders are fixedly arranged on the iron frame adsorption platform, the plurality of telescopic cylinders are evenly distributed, the wafer is located at the top of the output end of the plurality of telescopic cylinders, there is residual glue on the wafer, the residual glue, the wafer, the iron frame and the adhesive film are a whole, and the iron frame is located on the iron frame adsorption platform; The wafer, iron frame and framed wafer with adhesive film are placed on the wafer carrier as a whole. There is residual adhesive on the wafer. The vacuum suction cup is used to evacuate the vacuum through the vacuum interface, and the tearing tape is used to tear off the residual adhesive on the wafer.

[0018] (2) By providing a cylinder adapter plate and a rotating cylinder, the technical effect that can be achieved is that a guide bushing is fixedly provided at the lower end of the wafer carrier, a cylinder adapter plate is provided on the guide bushing, a rotating cylinder is provided at the lower end of the cylinder adapter plate, an adapter plate strip hole is provided on the cylinder adapter plate, a cam is provided on the rotating cylinder, and the cam is tangent to the adapter plate strip hole; When the wafer cannot be started, start the rotating cylinder, and the cam drives the cylinder adapter plate to rotate. After driving the wafer to rotate a certain angle, the upper end surface of the wafer is again fitted with the film tearing tape to complete the wafer starting and film tearing. The rotating cylinder can control the angle of the rotating wafer through the cylinder adapter plate, which is convenient for the wafer starting and film tearing, and avoids the phenomenon of not being able to tear the film smoothly due to the inability to start.

[0019] (3) By providing a linear motion assembly and a guide rail, the technical effect that can be achieved is that a guide bushing is fixedly provided at the lower end of the wafer carrier, a lifting cylinder is provided at the lower end of the guide bushing, the output end of the lifting cylinder is fixedly connected to the guide bushing, the guide bushing is slidably connected to the two guide rails, the lower ends of the two guide rails are fixedly connected to the upper end of the fixed end, a linear motion assembly is provided at the lower end of the fixed end, and the guide bushing is slidably connected to the linear motion assembly; The guide rail and linear motion assembly drive the wafer carrier to make linear motion, start the lifting cylinder, drive the wafer carrier and the wafer to rise, make the upper end surface of the wafer fit with the film tearing tape, continue to move the wafer, and complete the film tearing process. The linear motion assembly and guide rail can automatically transfer the wafer carrier, and the film tearing tape can directly adhere to the thin film on the wafer. The wafer carrier can be peeled off by translating the wafer carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0021] Figure 1 A top view of the present invention; Figure 2 for Figure 1 A partial enlarged view of middle A; Figure 3 It is a front view of the present invention; Figure 4 for Figure 3 A partial enlarged view of B in the middle; Figure 5 It is a left side view of the present invention; Figure 6 It is a cross-sectional view of the wafer with frame in the present invention including the iron frame, the wafer, the adhesive film and the residual adhesive before the film is torn off; Description of main component symbols: In the figure: 1. Vacuum suction cup; 2. Mucous film; 3. Wafer; 4. Guide rail; 5. Fixed end; 6. Linear motion assembly; 7. Lifting cylinder; 8. Guide bushing; 9. Telescopic cylinder; 10. Vacuum interface; 11. Iron frame adsorption table; 12. Cylinder adapter plate; 13. Rotating cylinder; 14. Cam; 15. Wafer carrier; 16. Residual glue; 17. Film tearing tape; 18. Iron frame. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application; obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application without making creative work are within the scope of protection of the present application.

[0023] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0024] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] Reference Figures 1 to 6 , which is a film tearing and transferring mechanism with replaceable angle disclosed by the present invention, including a fixed end 5 and a linear motion component 6, an iron frame adsorption platform 11 is located at the outer circle of a wafer carrier 15, a plurality of vacuum suction cups 1 are fixedly arranged on the iron frame adsorption platform 11, and the plurality of vacuum suction cups 1 are evenly distributed, a wafer 3 is connected to the wafer carrier 15 through the plurality of vacuum suction cups 1, a plurality of telescopic cylinders 9 are fixedly arranged on the iron frame adsorption platform 11, and the plurality of telescopic cylinders 9 are evenly distributed, the wafer 3 is located at the top of the output end of the plurality of telescopic cylinders 9, residual glue 16 is adhered to the wafer 3, the residual glue 16, the wafer 3, the iron frame 18 and the mucous film 2 are a whole, and the iron frame 18 is located on the iron frame adsorption platform 11.

[0026] A plurality of telescopic cylinders 9 are fixedly arranged on the wafer carrier 15 , and the plurality of telescopic cylinders 9 are evenly distributed. The upper output ends of the plurality of vacuum suction cups 1 and the plurality of telescopic cylinders 9 are in contact with the iron frame adsorption platform 11 , and the wafer 3 is located at the upper center of the mucosa 2 .

[0027] A guide bushing 8 is fixedly provided at the lower end of the wafer carrier 15 , and a lifting cylinder 7 is provided at the lower end of the guide bushing 8 . The output end of the lifting cylinder 7 is cooperatively connected with the guide bushing 8 .

[0028] A cylinder adapter plate 12 is arranged on the guide bushing 8 , a rotary cylinder 13 is arranged at the lower end of the cylinder adapter plate 12 , and an adapter plate strip hole is opened on the cylinder adapter plate 12 .

[0029] The rotary cylinder 13 is provided with a cam 14, which is tangentially matched with the strip-shaped hole of the adapter plate.

[0030] The rotating cylinder 13 can control the angle of the rotating wafer 3 through the cylinder adapter plate 12, which is convenient for starting and tearing the film of the wafer 3, and avoids the phenomenon that the film cannot be smoothly torn due to the inability to start.

[0031] The guide bushing 8 is slidably connected to the two guide rails 4 , and the lower ends of the two guide rails 4 are fixedly connected to the upper ends of the fixed ends 5 .

[0032] The lower end of the fixed end 5 is connected to a linear motion component 6 , and a guide bushing 8 is slidably connected to the linear motion component 6 .

[0033] The linear motion assembly 6 and the guide rail 4 can automatically transfer the wafer carrier 15 , and the film-tearing tape 17 can directly adhere to the residual adhesive on the wafer 3 . The film-tearing operation is performed on the wafer carrier 15 by translating the wafer carrier 15 .

[0034] The plurality of vacuum suction cups 1 and the plurality of telescopic cylinders 9 are staggeredly arranged. A vacuum interface 10 is fixedly arranged on the wafer carrier 15 .

[0035] The iron frame adsorption platform 11 is annular in structure. A film tearing tape 17 is arranged above the wafer carrier 15, and the film tearing tape 17 is used to tear off the residual adhesive on the wafer.

[0036] The working principle and use process of the present invention are as follows: the residual adhesive 16, the wafer 3, the iron frame adsorption platform 11 and the adhesive film 2 are placed on the wafer carrier 15, the residual adhesive 16 is adhered to the wafer 3, and the vacuum suction cup 1 is evacuated through the vacuum interface 10; The guide rail 4 and the linear motion assembly 6 drive the wafer carrier 15 to perform linear motion, and the lifting cylinder 7 is started to drive the wafer carrier 15 and the wafer 3 to rise, so that the upper end surface of the wafer 3 is in contact with the film tearing tape 17, and the wafer 3 is continued to be moved to complete the film tearing process; When the wafer 3 cannot be started, the rotating cylinder 13 is started, and the cam 14 drives the cylinder adapter plate 12 to rotate, and after driving the wafer 3 to rotate a certain angle, the residual glue 16 on the upper end surface of the wafer 3 is again attached to the film tearing tape, and the starting and film tearing of the wafer 3 are completed; The telescopic cylinder 9 is started to lift the wafer 3 upward, and then the wafer 3 is transported to the next step.

[0037] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A film tearing and transferring mechanism with changeable angle, characterized in that: The invention comprises a fixed end (5) and a linear motion component (6); an iron frame adsorption platform (11) is located at the outer ring of a wafer carrier (15); a plurality of vacuum suction cups (1) are fixedly arranged on the iron frame adsorption platform (11); the plurality of vacuum suction cups (1) are evenly distributed; a wafer (3) is connected to the wafer carrier (15) via the plurality of vacuum suction cups (1); a plurality of telescopic cylinders (9) are fixedly arranged on the iron frame adsorption platform (11); the plurality of telescopic cylinders (9) are evenly distributed; the wafer (3) is located at the top of the output end of the plurality of telescopic cylinders (9); residual glue (16) is adhered to the wafer (3); the residual glue (16), the wafer (3), the iron frame (18) and the mucosa (2) are an integral whole; the iron frame (18) is located on the iron frame adsorption platform (11).

2. The film tearing and transferring mechanism with changeable angle according to claim 1, characterized in that: A guide bushing (8) is fixedly provided at the lower end of the wafer carrier (15), a lifting cylinder (7) is provided at the lower end of the guide bushing (8), and an output end of the lifting cylinder (7) is cooperatively connected to the guide bushing (8).

3. The film tearing and transferring mechanism with changeable angle according to claim 2, characterized in that: A cylinder adapter plate (12) is arranged on the guide bushing (8), a rotary cylinder (13) is arranged at the lower end of the cylinder adapter plate (12), and an adapter plate strip hole is opened on the cylinder adapter plate (12).

4. The film tearing and transferring mechanism with changeable angle according to claim 3, characterized in that: The rotary cylinder (13) is provided with a cam (14), and the cam (14) is tangentially matched with the strip-shaped hole of the adapter plate.

5. The film tearing and transferring mechanism with changeable angle according to claim 4, characterized in that: The guide bushing (8) is slidably connected to the two guide rails (4), and the lower ends of the two guide rails (4) are fixedly connected to the upper ends of the fixed ends (5).

6. The film tearing and transferring mechanism with changeable angle according to claim 5, characterized in that: The lower end of the fixed end (5) is connected to the linear motion component (6), and the guide bushing (8) is slidably connected to the linear motion component (6).

7. The film tearing and transferring mechanism with changeable angle according to claim 1, characterized in that: The plurality of vacuum suction cups (1) and the plurality of telescopic cylinders (9) are distributed in a staggered manner.

8. The film tearing and transferring mechanism with changeable angle according to claim 1, characterized in that: A vacuum interface (10) is fixedly arranged on the wafer carrier (15).

9. The film tearing and transferring mechanism with changeable angle according to claim 1, characterized in that: The iron frame adsorption platform (11) is in an annular structure.

10. The film tearing and transferring mechanism with changeable angle according to claim 1, characterized in that: A film-tearing tape (17) is arranged above the wafer carrier (15).

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