A replaceable angle film tearing and transferring mechanism

Abstract

The application relates to the technical field of wafer debonding, and particularly discloses a film tearing and transferring mechanism with replaceable angles, which comprises a fixed end and a linear motion assembly, an iron frame adsorption table is located at the outer ring of a wafer loading disc, a plurality of vacuum adsorption discs are fixedly arranged on the iron frame adsorption table, the plurality of vacuum adsorption discs are uniformly distributed, the wafer is connected to the wafer loading disc through the plurality of vacuum adsorption discs, a plurality of telescopic cylinders are fixedly arranged on the iron frame adsorption table, the plurality of telescopic cylinders are uniformly distributed, the wafer is located on the top of the output end of the plurality of telescopic cylinders, residual glue is adhered to the wafer, the residual glue, the wafer, the iron frame and the adhered film form an integral whole, and the iron frame is located on the iron frame adsorption table. The film tearing and transferring operation of the wafer can be automatically performed, the angle of the wafer can be automatically rotated, and the wafer is convenient for film tearing.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer debonding, and particularly relates to a film tearing and transferring mechanism with replaceable angle. BACKGROUND

[0002] A bonder is a key device for bonding chips or devices with residual glue, and plays an important role in modern microelectronics technology. Wafer bonding technology realizes three-dimensional short-distance interconnection of integrated circuits by stacking wafers, thereby improving information transmission speed and reducing device size. Wafer bonding technology includes temporary bonding and permanent bonding, wherein temporary bonding has higher flexibility, and permanent bonding tightly combines wafers through chemical and physical methods.

[0003] The debonding process is a process after the completion of related processes after temporary bonding, which needs to peel off the residual glue on the wafer and remove the adhesive residual glue.

[0004] A bonder can complete a high-precision and high-efficiency bonding process to connect devices of different materials together, and provides important support for electrical interconnection, functional integration and device packaging of microelectronic materials, optoelectronic materials and nanometer-level microelectromechanical components. Such devices usually support multiple bonding processes, such as anodic bonding, glass powder bonding, solder bonding, eutectic bonding, etc.

[0005] The existing technology still has the following to be improved: The wafer surface is usually coated with a layer of residual glue, which needs to be removed in subsequent processing steps for further processing and processing. The residual glue may have high adhesion, making it difficult to completely peel off from the wafer surface. SUMMARY

[0006] To solve the above problems in the prior art, the present application provides a film tearing and transferring mechanism with replaceable angle, which can automatically perform the film tearing and transferring operation of the wafer, automatically rotate the angle of the wafer, and facilitate the film tearing of the wafer.

[0007] The object of the present application can be achieved by the following technical solutions:

[0008] A film tearing and transferring mechanism with replaceable angle, comprising a fixed end and a linear motion assembly, an iron frame adsorption table is located at the outer circle of a wafer carrier disc, a plurality of vacuum suction cups are fixedly arranged on the iron frame adsorption table, the plurality of vacuum suction cups are uniformly distributed, a wafer is connected to the wafer carrier disc through the plurality of vacuum suction cups, a plurality of telescopic cylinders are fixedly arranged on the iron frame adsorption table, the plurality of telescopic cylinders are uniformly distributed, the wafer is located on the top of the output end of the plurality of telescopic cylinders, residual glue is adhered to the wafer, the residual glue, the wafer, the iron frame and the film are an integral whole, and the iron frame is located on the iron frame adsorption table.

[0009] Further, the lower end of the wafer carrier disc is fixedly provided with a guide bushing, the lower end of the guide bushing is provided with a lifting cylinder, and the output end of the lifting cylinder is connected with the guide bushing.

[0010] Further, the guide bushing is provided with a cylinder adapter plate, the lower end of the cylinder adapter plate is provided with a rotary cylinder, and a strip-shaped hole is formed in the cylinder adapter plate.

[0011] Further, the rotary cylinder is provided with a cam, and the cam is tangent to the strip-shaped hole of the cylinder adapter plate.

[0012] Further, the guide bushing is slidably connected to two guide rails, and the lower ends of the two guide rails are fixedly connected to the upper end of the fixed end.

[0013] Further, the lower end of the fixed end is connected with the linear motion assembly, and the guide bushing is slidably connected to the linear motion assembly.

[0014] Further, the plurality of vacuum suction cups and the plurality of telescopic cylinders are staggered.

[0015] Further, the wafer carrier disc is fixedly provided with a vacuum interface.

[0016] Further, the iron frame adsorption table is in a ring structure.

[0017] Further, the wafer carrier disc is provided with a film tearing adhesive tape above.

[0018] The beneficial effects of the present application are:

[0019] (1) By setting the wafer carrier disc, the iron frame adsorption table and the film tearing adhesive tape, the technical effects achieved are that the iron frame adsorption table is located at the outer circle of the wafer carrier disc, a plurality of vacuum suction cups are fixedly arranged on the iron frame adsorption table, the plurality of vacuum suction cups are evenly distributed, the wafer is connected to the wafer carrier disc through the plurality of vacuum suction cups, a plurality of telescopic cylinders are fixedly arranged on the iron frame adsorption table, the plurality of telescopic cylinders are evenly distributed, the wafer is located on the top of the output end of the plurality of telescopic cylinders, the wafer has residual glue, the residual glue, the wafer, the iron frame and the adhesive film form an integral whole, and the iron frame is located on the iron frame adsorption table.

[0020] The wafer, the iron frame and the adhesive film with the frame wafer are placed on the wafer carrier disc, the wafer has residual glue, the vacuum suction cup is vacuumized through the vacuum interface, and the film tearing adhesive tape is used to tear the residual glue on the wafer.

[0021] (2) The technical effects achieved by setting the cylinder adapter plate and the rotary cylinder are that the lower end of the wafer carrier disc is fixedly provided with a guide bushing, the guide bushing is provided with the cylinder adapter plate, the lower end of the cylinder adapter plate is provided with the rotary cylinder, a strip-shaped hole is formed in the cylinder adapter plate, and a cam is arranged on the rotary cylinder and is in tangential cooperation with the strip-shaped hole of the cylinder adapter plate;

[0022] When the wafer cannot be started, the rotary cylinder is started, the cam drives the cylinder adapter plate to rotate, and the wafer is rotated by a certain angle, and then the upper end surface of the wafer is again attached to the film tearing tape, the starting of the wafer and the film tearing are completed, the rotary cylinder can control the angle of the rotating wafer through the cylinder adapter plate, the starting of the wafer and the film tearing are facilitated, and the phenomenon that the film cannot be torn smoothly due to the failure to start is avoided.

[0023] (3) The technical effects achieved by setting the linear motion assembly and the guide rail are that the lower end of the wafer carrier disc is fixedly provided with a guide bushing, the lower end of the guide bushing is provided with a lifting cylinder, the output end of the lifting cylinder is fixedly connected with the guide bushing, the guide bushing is slidably connected on the two guide rails, the lower ends of the two guide rails are fixedly connected with the upper end of the fixed end, the lower end of the fixed end is provided with a linear motion assembly, and the guide bushing is slidably connected on the linear motion assembly.

[0024] The guide rail and the linear motion assembly drive the wafer carrier disc to move linearly, the lifting cylinder is started, the wafer carrier disc and the wafer are lifted, the upper end surface of the wafer is attached to the film tearing tape, the wafer is continuously moved, the film tearing process is completed, the linear motion assembly and the guide rail can automatically perform the transfer operation on the wafer carrier disc, the film tearing tape can directly adhere to the film on the wafer, and the wafer carrier disc is torn by the translation of the wafer carrier disc. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to facilitate the understanding of those skilled in the art, the present application will be further described below with reference to the drawings.

[0026] Figure 1 is a top view of the present application;

[0027] Figure 2 is Figure 1 is a partial enlarged view of A in the middle;

[0028] Figure 3 is a front view of the present application;

[0029] Figure 4 is Figure 3 is a partial enlarged view of B in the middle;

[0030] Figure 5 is a left view of the present application;

[0031] Figure 6A cross-sectional view of a wafer with frame including an iron frame, a wafer, an adhesive film, and residual glue in a state before tearing the film in the present application;

[0032] Main element symbol explanation:

[0033] In the figure: 1, vacuum chuck; 2, adhesive film; 3, wafer; 4, guide rail; 5, fixed end; 6, linear motion assembly; 7, lifting cylinder; 8, guide bushing; 9, telescopic cylinder; 10, vacuum interface; 11, iron frame adsorption table; 12, cylinder adapter plate; 13, rotary cylinder; 14, cam; 15, wafer carrier plate; 16, residual glue; 17, film tearing tape; 18, iron frame. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application; obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present application.

[0035] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom end" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0036] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "sleeved / connected", "connected" and the like should be broadly understood, for example, "connected" can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0037] Reference Figures 1 to 6The application discloses a replaceable-angle film tearing and transferring mechanism, which comprises a fixed end 5 and a linear motion assembly 6, an iron frame adsorption table 11 is arranged at the outer ring of a wafer carrier disc 15, a plurality of vacuum adsorption discs 1 are fixedly arranged on the iron frame adsorption table 11 and uniformly distributed, a wafer 3 is connected to the wafer carrier disc 15 through the plurality of vacuum adsorption discs 1, a plurality of telescopic cylinders 9 are fixedly arranged on the iron frame adsorption table 11 and uniformly distributed, the wafer 3 is located at the top of the output end of the plurality of telescopic cylinders 9, residual glue 16 is adhered to the wafer 3, the residual glue 16, the wafer 3, an iron frame 18 and a film 2 form an integral whole, and the iron frame 18 is located on the iron frame adsorption table 11.

[0038] The plurality of telescopic cylinders 9 are fixedly arranged on the wafer carrier disc 15 and uniformly distributed, the upper end output ends of the plurality of vacuum adsorption discs 1 and the plurality of telescopic cylinders 9 are in contact with the iron frame adsorption table 11, and the wafer 3 is located at the upper end center of the film 2.

[0039] The wafer carrier disc 15 is fixedly provided with a guide bushing 8 at the lower end, the guide bushing 8 is provided with a lifting cylinder 7 at the lower end, and the output end of the lifting cylinder 7 is connected with the guide bushing 8 in a matched mode.

[0040] The guide bushing 8 is provided with a cylinder adapter plate 12, the cylinder adapter plate 12 is provided with a rotary cylinder 13 at the lower end, and the cylinder adapter plate 12 is provided with an adapter plate strip-shaped hole.

[0041] The rotary cylinder 13 is provided with a cam 14, and the cam 14 is in tangential cooperation with the adapter plate strip-shaped hole.

[0042] The rotary cylinder 13 can control the angle of the rotating wafer 3 through the cylinder adapter plate 12, so that the wafer 3 can be conveniently started and the film can be torn, and the phenomenon that the film cannot be torn smoothly due to the failure of starting can be avoided.

[0043] The guide bushing 8 is slidably connected to two guide rails 4, and the lower ends of the two guide rails 4 are fixedly connected to the upper end of the fixed end 5.

[0044] The lower end of the fixed end 5 is connected with the linear motion assembly 6, and the guide bushing 8 is slidably connected to the linear motion assembly 6.

[0045] The linear motion assembly 6 and the guide rail 4 can automatically perform the transferring operation on the wafer carrier disc 15, the film adhesive tape 17 can directly adhere to the residual glue on the wafer 3, and the wafer carrier disc 15 can be torn through the translation of the wafer carrier disc 15.

[0046] The plurality of vacuum adsorption discs 1 and the plurality of telescopic cylinders 9 are staggered and distributed.

[0047] The iron frame adsorption table 11 is in a ring structure. The wafer carrier plate 15 is provided with a film tearing adhesive tape 17 above, which is used to tear off the residual glue on the wafer.

[0048] The working principle and use process of the present application are as follows: the residual glue 16, the wafer 3, the iron frame adsorption table 11 and the film 2 are placed on the wafer carrier plate 15, the wafer 3 is adhered with the residual glue 16, the vacuum chuck 1 is vacuumized through the vacuum interface 10;

[0049] The guide rail 4 and the linear motion assembly 6 drive the wafer carrier plate 15 to move linearly, the lifting cylinder 7 is started, the wafer carrier plate 15 and the wafer 3 are lifted, the upper end surface of the wafer 3 is attached to the film tearing adhesive tape 17, the wafer 3 is continuously moved, and the film tearing process is completed;

[0050] When the wafer 3 cannot start, the rotary cylinder 13 is started, the cam 14 drives the cylinder adapter plate 12 to rotate, the wafer 3 is rotated by a certain angle, the residual glue 16 on the upper end surface of the wafer 3 is attached to the film tearing adhesive tape again, and the starting and film tearing of the wafer 3 are completed.

[0051] The telescopic cylinder 9 is started, the wafer 3 is lifted upward, and then the wafer 3 is transported to the next link.

[0052] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Although the present application has been disclosed as above, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the above disclosed technical content to obtain equivalent embodiments with equivalent changes, without departing from the technical solution of the present application. Any modification, change, equivalent change and modification of the above embodiments, which does not depart from the technical solution of the present application, are still within the scope of the present application.

Claims

1. A replaceable angle film tearing transfer mechanism, characterized in that: Including fixed end (5) and linear motion assembly (6), iron frame adsorption platform (11) is located at the outer ring of wafer carrier tray (15), a plurality of vacuum suction cups (1) are fixedly arranged on the iron frame adsorption platform (11), a plurality of vacuum suction cups (1) are uniformly distributed, wafer (3) is connected on the wafer carrier tray (15) through a plurality of vacuum suction cups (1), a plurality of telescopic cylinders (9) are fixedly arranged on the iron frame adsorption platform (11), a plurality of telescopic cylinders (9) are uniformly distributed, the wafer (3) is located on the top of the output end of a plurality of telescopic cylinders (9), the wafer (3) has residual glue (16), the residual glue (16), the wafer (3), the iron frame (18) and the mucosa (2) are an integral whole, the iron frame (18) is located on the iron frame adsorption platform (11); The lower end of the wafer carrier tray (15) is fixedly provided with a guide bushing (8), the lower end of the guide bushing (8) is provided with a lifting cylinder (7), the output end of the lifting cylinder (7) is connected with the guide bushing (8); The guide bushing (8) is provided with a cylinder adapter plate (12), the lower end of the cylinder adapter plate (12) is provided with a rotary cylinder (13), the cylinder adapter plate (12) is provided with an adapter plate strip hole; The rotary cylinder (13) is provided with a cam (14), the cam (14) is tangent to the adapter plate strip hole.

2. The changeable angle film tear transfer mechanism according to claim 1, characterized in that: The guide bushing (8) is slidably connected on two guide rails (4), the lower ends of the two guide rails (4) are fixedly connected on the upper end of the fixed end (5).

3. The changeable angle film tear transfer mechanism according to claim 2, characterized in that: The lower end of the fixed end (5) is connected with the linear motion assembly (6), and the guide bushing (8) is slidably connected on the linear motion assembly (6).

4. The changeable angle film tear transfer mechanism of claim 1, wherein: A plurality of vacuum suction cups (1) and a plurality of telescopic cylinders (9) are staggered.

5. The changeable angle film tear transfer mechanism of claim 1, wherein: The wafer carrier tray (15) is fixedly provided with a vacuum interface (10).

6. The changeable angle film tear transfer mechanism of claim 1, wherein: The iron frame adsorption platform (11) is in ring structure.

7. The changeable angle film tear transfer mechanism of claim 1, wherein: The wafer carrier tray (15) is provided with a film tearing adhesive tape (17) above.

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