Wafer storage device with higher adaptability

Abstract

The wafer storage equipment comprises a bottom plate, side plates, mounting plates and a top plate which form an equipment frame, the side plates are arranged on the two sides of the upper surface of the bottom plate, the mounting plates are arranged on the outer sides of the side plates and located above the bottom plate, a plurality of sets of modules are arranged on the inner sides of the side plates, and the modules are arranged on the top plate. The module comprises a wafer bearing table used for placing a wafer, the surface of the wafer bearing table is coated with a film, the wafer bearing table is provided with a fixing piece made of carbon fibers and a gasket coated with carbon, and static electricity is prevented from being generated in the equipment operation process. The first optical fiber sensors on the two sides of the device detect whether wafers exist or not, the second optical fiber sensors at the upper end and the lower end of the device detect whether the wafers are located on the same vertical plane or not in the vertical direction, and precision is improved. And the DO, the amplifier and the AI arranged at the two ends of the equipment main frame enable the data output to be more stable. The number of the modules can be adjusted according to actual application, wafer storage is not limited to 8 layers or 16 layers, and the adaptation degree is higher.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer storage in semiconductor processing equipment, and in particular relates to a wafer storage device with higher adaptability. Background Art

[0002] During semiconductor processing, wafers need to be stored and transported. Different wafer storage methods are used for different processing processes and storage times. In the prior art, wafer boxes are generally used for storage, which are not distributed properly and take up a lot of space. The number of wafers placed is fixed, which affects the storage capacity and handling efficiency of the wafers, and also affects the operating efficiency of the entire equipment. Summary of the invention

[0003] The purpose of the present invention is to solve the above-mentioned problems. The present application proposes a wafer storage device with higher adaptability. A PVC film is coated on the wafer carrier, carbon is coated on the gasket, and the fixing parts are made of carbon fiber. This avoids the generation of static electricity and improves the stability of the wafer. The number of modules can be adjusted according to demand, and the adaptability is higher.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wafer storage device with higher adaptability, comprising a bottom plate, a side plate, a mounting plate and a top plate constituting a device frame, side plates are arranged on both sides of the upper surface of the bottom plate, a mounting plate is arranged on the outer side of the side plate above the bottom plate, a plurality of modules are arranged on the inner side of the side plate, the modules include a wafer carrier for placing wafers, a fixing part and a gasket are arranged on the wafer carrier, the wafer carrier is fixed to the side plate by a positioning pin, and columns are arranged on the front and rear end surfaces of the side plate; The front surfaces of the two mounting plates are each provided with a fiber optic sensor mounting seat, on which a plurality of fiber optic sensors are disposed, the sides of the two mounting plates are each provided with through holes for mounting guide rails, the guide rail of the mounting plate on the left is provided with a plurality of infrared sensors and DO digital output interfaces, and the DO digital output interface is located below the infrared sensor, and the guide rail of the mounting plate on the right is provided with an amplifier and an AI, and the AI ​​is located below the amplifier.

[0005] Furthermore: the fixing part is made of carbon fiber material, the gasket is coated with carbon to prevent static electricity, and the surface of the wafer carrier is coated with PVC film.

[0006] Furthermore: photoelectric sensors are provided at the front and rear ends of the upper surface of the top plate, and mounting blocks for installing optical fiber sensor 2 are provided on one side of the photoelectric sensor on the top plate and in the middle position of the front and rear ends of the bottom plate. The photoelectric sensor is connected to the optical fiber sensor 2 by a wire, and the optical fiber sensor 2 emits downward infrared rays to detect whether the wafers are in the same plumb plane in the vertical direction.

[0007] Further: the infrared rays emitted by the optical fiber sensors on both sides are used to detect the horizontality of the wafer when it is placed.

[0008] Further: the number of the infrared sensors and the optical fiber sensors 1 is consistent, and they are connected to each other one by one. The optical fiber sensor is connected to AI through a line, and the AI ​​is connected to DO through a line. The number of the optical fiber sensors 1 is consistent with the number of wafer carriers.

[0009] Further: a group of the modules includes four wafer carriers, and the configuration of the modules can be increased or decreased according to demand.

[0010] Compared with the prior art, the present invention has the following beneficial effects: The present invention is provided with multiple groups of modules on the inner side of the side plate, each group of modules includes four wafer carriers, the wafer carrier is fixed to the side plate by positioning pins, the positioning pins can adjust the position of the wafer carrier, the wafer carrier surface is coated, and the fixing parts made of carbon fiber and the gaskets coated with carbon are arranged above it, which avoid static electricity generation during the operation of the equipment; the optical fiber sensors on both sides of the equipment detect whether the infrared light emitted by the red fruit is blocked to detect whether the wafer exists, and the optical fiber sensors on the upper and lower ends of the equipment are used to detect whether the wafer is in the same plumb plane in the vertical direction. The wafer is placed irregularly, and the supporting robot will be clamped and re-placed, which improves the accuracy; the DO digital output interface, amplifier, and AI provided at both ends of the main frame of the equipment make the output of data more stable. The number of modules can be adjusted according to the actual application, and the wafer storage is not limited to 8 or 16 layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only for more clearly illustrating the embodiments of the present invention or the technical solutions in the prior art. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0012] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a front view of the overall structural schematic diagram of the present invention; Figure 3 A side view of a schematic diagram of the overall structure of the present invention; Figure 4 It is a partially enlarged schematic diagram of the installation of the wafer carrier of the present invention; Figure 5 It is a partial enlarged schematic diagram of the connection between the wafer carrier and the positioning pins of the present invention; Figure 6 It is a model diagram of the present invention; In the figure: 1-bottom plate, 2-side plate, 3-mounting plate, 4-top plate, 5-photoelectric sensor, 6-infrared sensor, 7-DO digital output interface, 8-amplifier, 9-AI, 10-column, 11-optical fiber sensor 1, 12-wafer carrier, 13-fixing part, 14-gasket, 15-locating pin, 16-optical fiber sensor mounting seat, 17-wafer, 18-infrared, 19-guide rail, 20-mounting block. DETAILED DESCRIPTION

[0013] In order to enable those skilled in the art to better understand and implement the technical solution of the present invention, the present invention is further described below in conjunction with specific embodiments. However, the embodiments are only intended to illustrate the present invention and not to limit the present invention.

[0014] like Figures 1 to 6 A wafer storage device with higher adaptability is shown, including a bottom plate 1, a side plate 2, a mounting plate 3 and a top plate 4 constituting a device frame, side plates 2 are provided on both sides of the upper surface of the bottom plate 1, and a mounting plate 3 is provided on the outer side of the side plate 2 located above the bottom plate 1, the mounting plate 3 is in a "Z" shape, and the upper and lower ends are respectively fixed on the top plate and the bottom plate, a plurality of groups of modules are provided on the inner side of the side plate 2, each group of modules includes four wafer carriers 12, the modules include a wafer carrier 12 for placing a wafer 17, a fixing part 13 and a gasket 14 are provided on the wafer carrier 12, the fixing part 13 is made of carbon fiber material, the gasket 14 is coated with antistatic carbon, the surface of the wafer carrier 12 is coated with PVC film, and the wafer 17 is placed on the gasket when placed, which can eliminate static electricity generated during the operation of the equipment.

[0015] The wafer carrier 12 is fixed to the side plate 2 by positioning pins 15. The position of the wafer carrier 12 can be adjusted by adjusting the positioning pins. The front and rear end surfaces of the side plate 2 are both provided with columns 10. The front surfaces of the two mounting plates 3 are each provided with a fiber optic sensor mounting seat 16, and a plurality of fiber optic sensors 11 are disposed on the fiber optic sensor mounting seat 16. The sides of the two mounting plates 3 are each provided with a through hole for mounting a guide rail 19. The guide rail 19 of the mounting plate 3 on the left is provided with a plurality of infrared sensors 6 and a DO digital output interface 7, and the DO digital output interface 7 is located below the infrared sensor 6. The guide rail 19 of the mounting plate 3 on the right is provided with an amplifier 8 and an AI9, and the AI9 is ​​located below the amplifier 8.

[0016] Photoelectric sensors 5 are provided at both the front and rear ends of the upper surface of the top plate 4. Mounting blocks 20 for mounting optical fiber sensor 2 are provided on one side of the photoelectric sensor 5 on the top plate 4 and in the middle of the front and rear ends of the bottom plate 1. The photoelectric sensor 5 is connected to the optical fiber sensor 2. The photoelectric sensor 5 receives the signal of the optical fiber sensor 2. The optical fiber sensor 2 emits downward infrared rays 18 to detect whether the wafer 17 is in the same plumb plane in the vertical direction. If the wafer 17 is not placed properly, the matching robot will clamp it and re-place it.

[0017] The number of the optical fiber sensors 11 is consistent with the number of the wafer carriers 12.

[0018] The number of modules can be adjusted according to actual applications. The number of wafer carriers is not limited to 8 or 16 layers, and the number of wafer carriers can be increased or decreased in multiples of 4.

[0019] The optical fiber sensor 11 can amplify the signal in conjunction with a pre-stage small signal amplifier.

[0020] The number of infrared sensors 6 and optical fiber sensors 11 is consistent, and they are connected to each other one by one. The infrared light emitted by optical fiber sensor 11 is detected by whether the wafer 17 exists. Optical fiber sensor 2 is used to detect the verticality in the vertical direction. If the wafer is not placed properly, the matching robot will clamp and re-place it. The infrared sensor 6 receives the signal amplified by the optical fiber sensor 11 and transmits it to AI. The AI ​​is an analog input signal. Its input end is connected to the infrared sensor to receive the digital signal of the infrared sensor, and its output end is connected to DO to convert the digital signal of the infrared sensor into an analog signal, so that it can be recognized by the PLC; The DO is a digital output interface, the input end of which is connected to the AI, receives the analog signal of the AI, and finally transmits the signal to the central control PLC so that it can display the number and location of temporarily stored wafers.

[0021] The optical fiber sensor 1 is connected to the infrared sensor 1. The infrared light emitted by the optical fiber sensor 1 is used to detect whether the wafer exists. The optical fiber sensor 1 amplifies the signal and transmits it to the infrared sensor, and transmits the processed signal to the AI, and then converts the digital signal of the optical fiber sensor into an analog signal, and finally transmits the signal to the DO, which transmits the signal to the central control PLC to display the number and location of the temporarily stored wafers. The optical fiber sensor 2 located on the mounting block is used to detect whether multiple wafers are in the same plumb plane in the vertical direction. The optical fiber sensor 2 is connected to the photoelectric sensor and receives the signal of the optical fiber sensor 2 to determine whether the wafers are in the same plumb plane in the vertical direction. If they are different planes, the matching robot will clamp and re-place them.

[0022] The wafer storage device of the present invention stores wafers by inserting them from the front of the device and picking them up from the back, and is applied in cleaning machine equipment.

[0023] The present invention arranges multiple groups of modules on the inner side of the side panel, each group of modules includes four wafer carriers, the wafer carriers are fixed to the side panel by positioning pins, the positioning pins can adjust the position of the wafer carriers, the surface of the wafer carriers is coated, and the fixing parts made of carbon fiber and the gaskets coated with carbon arranged above them avoid the generation of static electricity during the operation of the equipment; the optical fiber sensor 1 on both sides of the equipment detects whether the wafer exists, and the optical fiber sensor 2 at the upper and lower ends of the equipment detects whether the wafer is in the same plumb plane in the vertical direction, and the detection accuracy is improved by infrared rays; the infrared sensors at both ends of the main frame of the equipment are connected with AI and DO to make the data output more stable and accurate.

[0024] The contents not described in detail in the present invention are all prior art.

[0025] The above description is only a preferred embodiment of the present invention, and is not limited to the description in the specification and implementation. Therefore, any equivalent changes or modifications made according to the structure, features and principles described in the scope of the present invention should be included in the scope of the present invention.

Claims

1. A wafer storage device with a higher adaptability, comprising a bottom plate (1), a side plate (2), a mounting plate (3) and a top plate (4) constituting a device frame, characterized in that: Side panels (2) are provided on both sides of the upper surface of the bottom plate (1); a mounting plate (3) is provided on the outer side of the side panel (2) above the bottom plate (1); a plurality of modules are provided on the inner side of the side panel (2); the modules include a wafer carrier (12) for placing a wafer (17); a fixing member (13) and a gasket (14) are provided on the wafer carrier (12); the wafer carrier (12) is fixed to the side panel (2) by a positioning pin (15); and columns (10) are provided on the front and rear end surfaces of the side panel (2); The front surfaces of the two mounting plates (3) are each provided with an optical fiber sensor mounting seat (16), and a plurality of optical fiber sensors (11) are provided on the optical fiber sensor mounting seat (16). The sides of the two mounting plates (3) are each provided with a through hole for mounting a guide rail (19). The guide rail (19) of the mounting plate (3) on the left is provided with a plurality of infrared sensors (6) and DO digital output interfaces (7), and the DO digital output interface (7) is located below the infrared sensor (6). The guide rail (19) of the mounting plate (3) on the right is provided with an amplifier (8) and an AI (9), and the AI ​​(9) is located below the amplifier (8).

2. A wafer storage device with higher adaptability according to claim 1, characterized in that: The fixing member (13) is made of carbon fiber material, the gasket (14) is coated with carbon to prevent static electricity, and the surface of the wafer support platform (12) is coated with a PVC film.

3. A wafer storage device with higher adaptability according to claim 1, characterized in that: Photoelectric sensors (5) are provided at both the front and rear ends of the upper surface of the top plate (4); mounting blocks (20) for mounting optical fiber sensor 2 are provided on one side of the photoelectric sensor (5) on the top plate (4) and at the middle position between the front and rear ends of the bottom plate (1); the photoelectric sensor (5) is connected to the optical fiber sensor 2 via a wire; the optical fiber sensor 2 emits infrared rays (18) downwards for detecting whether the wafers (17) are in the same plumb plane in the vertical direction.

4. The wafer storage device with higher adaptability according to claim 1, characterized in that: The mounting plate (3) is in a "Z" shape, with the upper and lower ends being fixed on the top plate (4) and the bottom plate (1) respectively.

5. The wafer storage device with higher adaptability according to claim 1, characterized in that: The infrared rays (18) emitted by the optical fiber sensors (11) on both sides are used to detect the levelness of the wafer (17).

6. The wafer storage device with higher adaptability according to claim 1, characterized in that: The number of the infrared sensors (6) and the optical fiber sensors (11) is the same, and they are connected to each other in a one-to-one correspondence. The optical fiber sensors (6) are connected to the AI ​​(9) via a wire, and the AI ​​(9) is connected to the DO (7) via a wire. The number of the optical fiber sensors (11) is the same as the number of the wafer carriers (12).

7. The wafer storage device with higher adaptability according to claim 1, characterized in that: Each group of the modules comprises four wafer carriers (12), and the arrangement of the modules can be adjusted according to demand.

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