Triode with waterproof function

Abstract

The invention relates to the technical field of triodes, in particular to a triode with a waterproof function, which comprises a triode main body, triode pins, a heat conduction inner shell, a rubber shell, a heat dissipation assembly, a fixing assembly, a protective outer shell and a protective shell cover, the heat conduction inner shell, the rubber shell and the protection outer shell are sequentially and fixedly installed on the outer side of the triode body, the fixing assembly is fixedly installed at the lower ends of triode pins, the protection shell cover is fixedly installed at the upper end of the protection outer shell, and heat conduction columns wrapping the triode pins are installed at the bottom end of the heat conduction inner shell. The length of the portion, extending out of the lower end of the protective outer shell, of the heat dissipation assembly is in direct proportion to the temperature around the triode body. When the temperature reaches the limiting temperature of the triode, gas in the heat conduction inner shell downwards pushes the fixing assembly through the heat conduction column to disconnect pins and ports of the triode.

Description

Technical Field

[0001] The invention relates to the technical field of triodes, in particular to a triode with a waterproof function. Background Art

[0002] The full name of the transistor should be semiconductor transistor, also known as bipolar transistor, crystal transistor, is a semiconductor device that controls current. Its function is to amplify weak signals into electrical signals with larger amplitude values. It is also used as a contactless switch. The transistor is one of the basic semiconductor components, has the function of current amplification, and is the core component of electronic circuits. The transistor is made of two PN junctions very close to each other on a semiconductor substrate. The two PN junctions divide the entire semiconductor into three parts. The middle part is the base area, and the two sides are the emitter area and the collector area. There are two arrangements: PNP and NPN.

[0003] Existing transistors are all simply packaged by fixing two plastic shells with bolts and then welded on a circuit board for use. However, in coastal areas with large temperature differences between day and night and humid air, this simple packaging structure will easily penetrate moisture, causing the transistor to leak and damage the transistor. At the same time, when the transistor is used to transmit signals, the current in the transistor needs to be very stable, and the change in the temperature around the transistor will affect the current size in the transistor, resulting in unstable working state of the transistor and affecting the accuracy of the signal transmission of the transistor. The simple packaging structure of the existing transistor cannot meet the requirement of maintaining the stability of the temperature around the transistor under the condition of large temperature differences between day and night. And the existing installation method is to directly weld the pins and ports together. When the transistor needs to be replaced and repaired, the connection method of welding the pins and ports will make the disassembly and assembly of the transistor very inconvenient.

[0004] In view of the above situation, in order to overcome the above technical problems, the present invention designs a triode with waterproof function. Summary of the invention

[0005] The purpose of the invention is to provide a transistor with waterproof function, which is used to solve the problem that the existing transistor packaging is simple and cannot prevent moisture from entering the transistor. At the same time, when the transistor is working, the ambient temperature is controlled to ensure the working temperature of the transistor, and the welding installation method of the transistor is changed to a fixing installation method, which is convenient for installation and protects the pins.

[0006] In order to achieve the above technical objectives, the present invention provides the following technical solutions:

[0007] A triode with waterproof function comprises a triode body, a triode pin, a heat-conducting inner shell, a rubber shell, a heat dissipation component, a fixing component, a protective outer shell, and a protective shell cover. One end of the triode pin is fixedly mounted on the lower end of the triode body. The heat-conducting inner shell, the rubber shell, and the protective outer shell are fixedly mounted on the outer side of the triode body in sequence. The heat dissipation component comprises a heat-conducting copper column, a heat-conducting copper sheet, and a heat dissipation sheet. The heat-conducting copper column is arranged in a circle and is slidably connected to the inside of the heat-conducting inner shell and passes through the rubber shell. The heat-conducting copper sheet is fixedly mounted on the lower end of the heat-conducting copper column. Multiple heat sinks are fixedly mounted on the lower side of the thermally conductive copper sheet and penetrate the protective shell, the fixed assembly is fixedly mounted on the lower end of the transistor pin, the protective shell cover is fixedly mounted on the upper end of the protective shell, a thermally conductive column wrapping the transistor pin is mounted on the bottom end of the thermally conductive inner shell, the transistor pin is connected to the port through the fixed assembly, the length of the heat sink extending from the lower end of the protective shell is proportional to the ambient temperature of the transistor body, and when the temperature reaches the transistor limit temperature, the gas in the thermally conductive inner shell pushes the fixed assembly downward through the thermally conductive column to disconnect the transistor pin and the port.

[0008] Preferably, the fixing assembly comprises a connecting ring, a heating wall, a fixing ring, a conductive rod, an insulating sheet, a conductive block, a spring 1, and a spring sheet, the connecting ring being fixedly connected to the lower end of the heat-conducting column, the heating wall being fixedly connected to the outside of the connecting ring, the fixing ring being fixedly installed at the lower end of the connecting ring, a plurality of conductive rod mounting grooves penetrating the fixing ring are provided at both ends of the fixing ring, a plurality of conductive rods are slidably installed in the conductive rod mounting grooves, the insulating sheet is fixedly installed on the inner side of the fixing ring, conductive block mounting holes are provided at both ends of the conductive rod, one end of the spring 1 is fixedly installed at the inner end of the conductive block mounting hole, the conductive block is fixedly installed at the other end of the spring 1, the spring sheet is fixedly installed on the inner side of the fixing ring, a cavity is provided in the heat-conducting inner shell, and the cavity is divided into, from top to bottom, an upper end of the cavity, a lower end of the cavity, and a cavity interlayer, a ventilation duct is provided in the heat-conducting column, the upper end of the ventilation duct is connected to the cavity interlayer, and the lower end passes through the connecting ring and is connected to the conductive rod mounting groove.

[0009] In the above scheme, when the transistor needs to be installed, the port is clamped in the fixing ring, and a reed is installed in the fixing ring to clamp the port. When the transistor is working, the pin and the port are electrically connected through the conductive rod and the conductive block, and the gas in the cavity interlayer is connected to the conductive rod installation groove through the ventilation pipe and the air pressure increases with the working temperature of the transistor body. When the temperature reaches the limit temperature of the transistor, the air pressure in the cavity interlayer and the ventilation pipe increases to push the conductive rod, pressing the conductive rod downward. At this time, the conductive block is squeezed into the conductive block installation hole, disconnecting the connection between the pin and the port.

[0010] Preferably, a heating cavity is provided in the heating wall and connected to the ventilation duct, the heating cavity is wrapped around the outside of the fixing ring, an air outlet is provided on the inside of the fixing ring, one end of the air outlet is connected to the inside of the fixing ring, and the other end passes through the outside of the connecting ring.

[0011] In the above scheme, the hot air in the ventilation duct can flow into the heating chamber. Since the heating chamber is wrapped outside the fixed ring, the inside of the fixed ring can be heated to increase the gas temperature inside the fixed ring. The high-temperature gas can be used to evaporate the water vapor inside the fixed ring. Since the hot air will rise, the high-temperature gas will take away the water vapor from the air outlet, and at the same time accelerate the air circulation in the fixed ring, further accelerating the evaporation of water vapor.

[0012] Preferably, a one-way valve is provided in the air outlet.

[0013] In the above scheme, when the transistor stops working, the transistor body no longer generates heat, and the gas in the fixed ring no longer moves upward. At this time, in order to prevent water vapor from flowing in from the air outlet, a one-way valve is provided in the air outlet to prevent water vapor from entering from the air outlet.

[0014] Preferably, a heat dissipation groove is provided on the outer ring of the protective shell and penetrates the protective shell, and the heat dissipation groove is provided on the outer side above the heat sink.

[0015] In the above scheme, when the heat sink dissipates heat, it will heat the surrounding air and form an upward airflow. Because the heat sink is opened on the outside above the heat sink, the upward airflow will pass through the heat sink, further taking away some heat while accelerating the air flow rate in the heat sink and improving the heat dissipation efficiency.

[0016] Preferably, the inner layer of the connecting ring is provided with a rubber inner ring and the outer layer is made of heat-absorbing material and expands by absorbing heat.

[0017] In the above scheme, because the ventilation duct runs through the connecting ring, when hot air passes through the connecting ring, the connecting ring will absorb the heat of the gas in the ventilation duct, compress the inner rubber inner ring, prevent water vapor from entering the main part of the transistor through the pin, and at the same time strengthen the connection with the thermal conductive column.

[0018] Preferably, the conductive rod is provided with an insulating groove on the same side as the conductive block mounting hole, and the fixing ring is provided with a matching hole at the bottom end of the spring leaf.

[0019] In the above scheme, when the pin and the port are connected, the reed clamps the port while the reed is connected to the conductive rod to enhance the conductivity between the pin and the port. When the temperature reaches the transistor limit temperature, the conductive rod is pushed downward, the transistor pin and the port are disconnected, and the lower end of the reed is clamped into the insulating groove to prevent the conductive rod from continuing to slide downward, while releasing the port to facilitate removal of the transistor.

[0020] Preferably, the heat sinks are arranged in a circle around the heat conducting column.

[0021] In the above scheme, the heat sinks are arranged in a circle around the heat-conducting column, so that while the heat sinks are dissipating heat, the heat of the gas in the ventilation duct in the heat-conducting column can be transferred to the fixed component, and at the same time, the water vapor discharged from the air outlet can be prevented from condensing and refluxing in the air outlet and on the outer wall of the heat-conducting column.

[0022] Preferably, an exhaust pipe is provided in the heat-conducting copper column, the upper end of the exhaust pipe is connected to the lower end of the cavity, and the lower end passes through the heat-conducting copper sheet.

[0023] In the above scheme, an exhaust pipe is opened in the heat-conducting copper column. When the gas at the upper end of the cavity absorbs heat and expands to push the heat-conducting copper column and the heat sink down, the gas at the lower end of the cavity can be discharged from the lower end of the cavity through the exhaust pipe, which will not produce resistance to the downward movement of the heat-conducting copper column, and at the same time can prevent the gas at the lower end of the cavity from being squeezed into the rubber layer to produce gaps.

[0024] Preferably, an alarm sensor is fixedly mounted on the upper end of the thermally conductive copper column, a pressing block is fixedly mounted on the lower end of the alarm sensor, and the pressing block is located outside the thermally conductive copper column.

[0025] In the above scheme, an alarm sensor is fixedly installed on the upper end of the thermally conductive copper column. When the heat sink drops to the bottom, the heat dissipation capacity of the protruding part of the heat sink is still insufficient to dissipate the temperature generated by the transistor. At this time, the thermally conductive copper column drops to the lowest end, and the pressing block will contact the lower wall of the cavity and squeeze the alarm sensor at the same time. At this time, the alarm sensor sounds an alarm to prevent damage to the transistor.

[0026] The beneficial effects of the present invention are as follows:

[0027] The existing transistor packaging structure is simple, and it is easy for water to penetrate during use. There are certain safety risks and poor heat dissipation. It is difficult to completely conduct the excess heat inside the transistor to the outside world. High temperature overheating problems are prone to occur during use, and the static working point is unstable, which affects the conductivity of the transistor; and the pin welding fixing method is adopted, which is difficult to repair and replace, and it is easy to cause certain damage to the pins and circuits during the disassembly process, which inevitably shortens the service life of the transistor. The present invention optimizes the packaging structure by using a rubber shell and a protective shell, enhances the sealing, and ensures its waterproof performance. At the same time, in order to avoid affecting its heat dissipation performance due to the optimization of the packaging structure, a heat dissipation component is set to maintain a constant temperature around the transistor body, and a fixing component is set to prevent water vapor from corroding the pins. At the same time, the fixing method is optimized, the disassembly and assembly of the transistor is convenient, and the transistor is protected, and the service life of the transistor is extended.

[0028] The present invention sets a heat dissipation component, sets a cavity in a heat-conducting inner shell, utilizes the thermal expansion and contraction of air, adjusts the heat dissipation area of ​​the heat sink as the temperature around the transistor changes, ensures the constant temperature around the transistor body, increases the working stability of the transistor, and simultaneously connects the fixing component. When the temperature around the transistor reaches the limit temperature of the transistor, the connection between the transistor pin and the port is disconnected, thereby protecting the transistor from damage.

[0029] The present invention replaces the original welding fixing method by arranging a fixing component, which not only makes it convenient to disassemble and assemble the transistor, but also utilizes the indirect electrical conduction method of the conductive rod to ensure that the transistor pins will not be corroded by water vapor. At the same time, the temperature generated by the operation of the transistor is used to heat the inside of the fixing ring through the heating wall, and the water vapor inside the fixing ring is taken away by the principle of hot air drying, thereby extending the service life of the transistor. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects of the present invention will now be described, by way of example only, with reference to the accompanying drawings, in which:

[0031] Figure 1 It is a sectional isometric view of the present invention;

[0032] Figure 2 It is a cross-sectional view of the present invention;

[0033] Figure 3 It is an isometric view of a cross-sectional view of the heat-conducting inner shell and the heat-dissipating assembly of the present invention;

[0034] Figure 4 It is an isometric view of a cross-sectional view of the fixing assembly of the present invention.

[0035] In the figure, 1, transistor body; 2, transistor pin; 3, heat-conducting inner shell; 31, cavity; 311, upper end of cavity; 312, lower end of cavity; 313, cavity interlayer; 32, heat-conducting column; 321, ventilation duct; 33, spring 2; 4, rubber shell; 5, heat dissipation component; 51, heat-conducting copper column; 511, alarm sensor; 512, pressing block; 513, exhaust pipe; 52, heat-conducting copper sheet; 53, heat sink; 6, fixing component ; 61. Connecting ring; 611. Rubber inner ring; 62. Heating wall; 621. Heating chamber; 63. Fixing ring; 631. Conductive rod mounting groove; 632. Air outlet; 633. One-way valve; 634. Matching hole; 64. Conductive rod; 641. Conductive block mounting hole; 642. Insulating groove; 65. Insulating sheet; 66. Conductive block; 67. Spring 1; 68. Reed; 7. Protective shell; 71. Heat dissipation slot; 8. Protective shell cover. DETAILED DESCRIPTION

[0036] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0037] As an embodiment of the present invention, reference Figure 1 and Figure 2 A triode with waterproof function, comprising a triode body 1, a triode pin 2, a heat-conducting inner shell 3, a rubber shell 4, a heat dissipation component 5, a fixing component 6, a protective outer shell 7, and a protective shell cover 8, wherein one end of the triode pin 2 is fixedly mounted on the lower end of the triode body 1, the heat-conducting inner shell 3, the rubber shell 4, and the protective outer shell 7 are sequentially fixedly mounted on the outer side of the triode body 1, the heat dissipation component 5 comprises a heat-conducting copper column 51, a heat-conducting copper sheet 52, and a heat dissipation sheet 53, and the heat-conducting copper column 51 is arranged in a circle and slidably connected to the inside of the heat-conducting inner shell 3 and penetrates the rubber shell 4, the heat-conducting copper sheet 52 is fixedly mounted on the lower end of the heat-conducting copper column 51, a plurality of the heat sinks 53 are fixedly mounted on the lower side of the heat-conducting copper sheet 52 and penetrate the protective shell 7, the fixing assembly 6 is fixedly mounted on the lower end of the transistor pin 2, the protective shell cover 8 is fixedly mounted on the upper end of the protective shell 7, the bottom end of the heat-conducting inner shell 3 is mounted with a heat-conducting column 32 wrapping the transistor pin 2, the transistor pin 2 is connected to the port through the fixing assembly 6, and at the same time, a spring 2 33 is fixedly mounted in the cavity 31 to overcome the self-gravity of the heat sink assembly 5. When the transistor body 1 is working, the temperature around it rises, the gas temperature in the cavity 31 rises, and the gas pressure gradually increases, pushing the heat-conducting copper column 51 to move downward, increasing the length of the heat sink 53 extending from the lower end of the protective shell 7, and when the temperature around the transistor body 1 reaches the limit temperature, the gas in the cavity 31 pushes the fixing assembly 6 through the heat-conducting column 32 to disconnect the connection between the transistor pin 2 and the port.

[0038] As an embodiment of the present invention, reference Figure 4The fixing assembly 6 includes a connecting ring 61, a heating wall 62, a fixing ring 63, a conductive rod 64, an insulating sheet 65, a conductive block 66, a spring 67, and a spring leaf 68. The connecting ring 61 is fixedly connected to the lower end of the heat-conducting column 32, the heating wall 62 is fixedly connected to the outside of the connecting ring 61, the fixing ring 63 is fixedly installed at the lower end of the connecting ring 61, and a plurality of conductive rod mounting grooves 631 penetrating the fixing ring 63 are provided at both ends of the fixing ring 63. The plurality of conductive rods 64 are slidably installed in the conductive rod mounting grooves 631, the insulating sheet 65 is fixedly installed on the inside of the fixing ring 63, and the conductive rods 6 Conductive block mounting holes 641 are provided at both ends of the heat conducting column 32, one end of the spring 67 is fixedly installed at the inner end of the conductive block mounting hole 641, the conductive block 66 is fixedly installed at the other end of the spring 67, the leaf spring 68 is fixedly installed at the inner side of the fixing ring 63, a cavity 31 is provided in the heat conducting inner shell 3, and the cavity 31 is divided into a cavity upper end 311, a cavity lower end 312, and a cavity interlayer 313 from top to bottom, a ventilation duct 321 is provided in the heat conducting column 32, the upper end of the ventilation duct 321 is connected to the cavity interlayer 313, and the lower end passes through the connecting ring 61 and is connected to the conductive rod mounting groove 631. When the transistor needs to be installed, the port is clamped between the fixing rings 63. A spring 68 is installed in the fixing ring 63 to clamp the port. When the transistor body 1 is working, the transistor pin 2 and the port are electrically connected through the conductive rod 64 and the conductive block 66. The gas in the cavity interlayer 313 is connected to the conductive rod mounting groove 631 through the ventilation pipe 321, and the air pressure increases with the working temperature of the transistor body 1. When the temperature reaches the limit temperature of the transistor body 1, the air pressure in the cavity interlayer 313 and the ventilation pipe 321 increases to push the conductive rod 64, press the conductive rod 64 downward, squeeze the conductive block 66 into the conductive block mounting hole 641, and disconnect the transistor pin 2 and the port.

[0039] As an embodiment of the present invention, reference Figure 4The heating wall 62 has a heating chamber 621 in it and is connected to the ventilation pipe 321. The heating chamber 621 is wrapped around the outside of the fixing ring 63. The fixing ring 63 has an air outlet 632 in it. One end of the air outlet 632 is connected to the inside of the fixing ring 63, and the other end passes through the outside of the connecting ring 61. A one-way valve 633 is arranged in the air outlet 632. The hot air in the ventilation pipe 321 can flow into the heating chamber 621. Since the heating chamber 621 is wrapped around the outside of the fixing ring 63, the inside of the fixing ring 63 can be heated to increase the gas temperature inside the fixing ring 63. The water vapor inside the fixing ring 63 can be evaporated by the high-temperature gas. Since the hot air rises, the high-temperature gas will take away the water vapor from the air outlet 632, and at the same time, the air circulation in the fixing ring 63 is accelerated, further accelerating the evaporation of water vapor. When the transistor body 1 stops working, the transistor body 1 no longer generates heat, and the gas in the fixing ring 63 no longer moves upward. At this time, in order to prevent water vapor from flowing in from the air outlet 632, a one-way valve 633 is provided in the air outlet 632 to prevent water vapor from entering from the air outlet 632.

[0040] As an embodiment of the present invention, reference Figure 2 The outer ring of the protective shell 7 is provided with a heat dissipation groove 71 which penetrates the protective shell 7. The heat dissipation groove 71 is provided on the upper and outer sides of the heat sink 53. When the heat sink 53 dissipates heat, it heats the surrounding air and forms an upward airflow. Since the heat dissipation groove 71 is provided on the upper and outer sides of the heat sink 53, the upward airflow passes through the heat dissipation groove 71. While the upward airflow further takes away part of the heat, it speeds up the air flow in the heat dissipation groove 71 and improves the heat dissipation efficiency.

[0041] As an embodiment of the present invention, reference Figure 4 The inner layer of the connecting ring 61 is provided with a rubber inner ring 611 and the outer layer is made of heat absorbing material and expands by absorbing heat. Because the ventilation pipe 321 passes through the connecting ring 61, when hot air passes through the connecting ring 61, the connecting ring 61 will absorb the heat of the gas in the ventilation pipe 321, compress the inner rubber inner ring 611, prevent water vapor from entering the transistor body 1 through the transistor pin 2, and strengthen the connection with the heat conducting column 32.

[0042] As an embodiment of the present invention, reference Figure 4 The conductive rod 64 is provided with an insulating groove 642 on the same side of the conductive block mounting hole 641, and the fixing ring 63 is provided with a matching hole 634 at the bottom end of the spring 68. When the transistor pin 2 is connected to the port, the spring 68 clamps the port while the spring 68 is connected to the conductive rod 64, thereby enhancing the conductivity between the transistor pin 2 and the port. When the temperature reaches the limiting temperature of the transistor body 1, the conductive rod 64 is pushed downward, the transistor pin 2 is disconnected from the port, and the lower end of the spring 68 is clamped into the insulating groove 642, thereby preventing the conductive rod 64 from sliding downward further while releasing the port, thereby facilitating the removal of the transistor.

[0043] As an embodiment of the present invention, reference Figure 3 The heat sink 53 is arranged in a circle around the heat-conducting column 32. The heat sink 53 is arranged in a circle around the heat-conducting column 32, so that the heat of the gas in the ventilation duct 321 in the heat-conducting column 32 can be transferred to the fixing component 6 while the heat sink 53 dissipates heat, and the water vapor discharged from the air outlet 632 can be prevented from condensing and refluxing in the air outlet 632 and on the outer wall of the heat-conducting column 32.

[0044] As an embodiment of the present invention, reference Figure 3 The heat-conducting copper column 51 is provided with an exhaust pipe 513, the upper end of which is connected to the lower end 312 of the cavity, and the lower end of which penetrates the heat-conducting copper sheet 52. The exhaust pipe 513 is provided in the heat-conducting copper column 51. When the gas at the upper end 311 of the cavity absorbs heat and expands, pushing the heat-conducting copper column 51 and the heat sink 53 downward, the gas at the lower end 312 of the cavity can be discharged from the lower end 312 of the cavity through the exhaust pipe 513, which will not generate resistance to the downward movement of the heat-conducting copper column 51, and at the same time, it can prevent the gas at the lower end 312 of the cavity from being squeezed into the connection between the rubber shell 4 and the heat-conducting inner shell 3 to generate a gap.

[0045] As an embodiment of the present invention, reference Figure 2 The upper end of the heat-conducting copper column 51 is fixedly mounted with an alarm sensor 511, and the lower end of the alarm sensor 511 is fixedly mounted with a pressing block 512, and the pressing block 512 is located outside the heat-conducting copper column 51. The alarm sensor 511 is fixedly mounted on the upper end of the heat-conducting copper column 51. When the heat sink 53 drops to the bottom, the heat dissipation capacity of the extended portion of the heat sink 53 is still insufficient to dissipate the temperature generated by the transistor body 1. At this time, the heat-conducting copper column 51 drops to the bottom, and the pressing block 512 will contact the lower wall of the cavity 31 and squeeze the alarm sensor 511 at the same time. At this time, the alarm sensor 511 alarms to prevent the transistor from being damaged.

[0046] Working principle: Existing transistors are all simply packaged by fixing two plastic shells with bolts and then welded on a circuit board for use. This simple packaging structure can easily penetrate moisture, causing the transistor to leak and damage the transistor. At the same time, the heat dissipation is poor, affecting the accuracy of the transistor signal transmission. The present invention optimizes the packaging structure of the transistor, enhances the sealing, and at the same time, by setting a heat dissipation component 5, when the transistor body 1 is working, the ambient temperature is controlled by changing the contact area between the heat sink 53 and the outside world, ensuring that the temperature around the transistor body 1 is constant, and using the fixing component 6, the installation method of the transistor is optimized while preventing water vapor from corroding the transistor pin 2.

[0047] Specifically, refer to Figure 2In order to ensure that the temperature around the transistor body 1 is constant, when the transistor body 1 is working, the ambient temperature rises, the gas temperature in the cavity 31 rises, and the gas pressure gradually increases, pushing the heat-conducting copper column 51 to move downward, increasing the length of the heat sink 53 extending from the lower end of the protective shell 7, and simultaneously enhancing the heat dissipation capacity.

[0048] refer to Figure 4 A heating chamber 621 is provided in the heating wall 62 and is connected to the ventilation pipe 321. The upper end of the ventilation pipe 321 is connected to the cavity interlayer 313. The hot air in the cavity interlayer 313 can flow into the heating chamber 621. Because the heating chamber 621 is wrapped around the outside of the fixing ring 63, it can heat the inside of the fixing ring 63, increase the gas temperature inside the fixing ring 63, and use the high-temperature gas to evaporate the water vapor inside the fixing ring 63. Because the hot air will rise, the high-temperature gas will take away the water vapor from the air outlet 632, and at the same time accelerate the air circulation in the fixing ring 63, further accelerating the evaporation of water vapor. A one-way valve 633 is provided in the air outlet 632 to prevent water vapor from entering the fixing ring 63 when the triode is not working or the temperature is not enough. Reference Figure 2 and Figure 4 The outer ring of the protective shell 7 is provided with a heat dissipation groove 71 which penetrates the protective shell 7. The rising airflow generated by the heat dissipation of the heat sink 53 and the gas discharged from the air outlet 632 will pass through the heat dissipation groove 71, further taking away part of the heat while accelerating the air flow rate in the heat dissipation groove 71 to improve the heat dissipation efficiency. At the same time, the heat sink 53 is arranged in a circle on the outside of the heat-conducting column 32 to prevent the water vapor coming out of the air outlet 632 from condensing and refluxing on the heat-conducting column 32.

[0049] When the ambient temperature of the transistor body 1 reaches the transistor limit temperature, refer to Figure 2 and Figure 4 , the heat-conducting copper column 51 drops to the lowest end, and the pressing block 512 contacts the lower wall of the cavity 31 and squeezes the alarm sensor 511 at the same time. At this time, the alarm sensor 511 alarms to prevent the transistor from being damaged. Figure 3 and Figure 4 , the air pressure in the cavity interlayer 313 and the ventilation duct 321 increases to the point where it can push the conductive rod 64, press the conductive rod 64 downward, squeeze the conductive block 66 into the conductive block mounting hole 641, and disconnect the transistor pin 2 from the port. At this time, the lower end of the reed 68 is stuck in the insulating groove 642 to prevent the conductive rod 64 from continuing to slide downward, while loosening the port to facilitate the removal of the transistor.

[0050] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected, and the scope of the present invention to be protected is defined by the attached claims and their equivalents.

Claims

1. A triode with waterproof function, characterized in that: The invention comprises a transistor body (1), a transistor pin (2), a heat-conducting inner shell (3), a rubber shell (4), a heat-dissipating assembly (5), a fixing assembly (6), a protective outer shell (7), and a protective shell cover (8); one end of the transistor pin (2) is fixedly mounted on the lower end of the transistor body (1); the heat-conducting inner shell (3), the rubber shell (4), and the protective outer shell (7) are fixedly mounted on the outer side of the transistor body (1) in sequence; the heat-dissipating assembly (5) comprises a heat-conducting copper column (51), a heat-conducting copper sheet (52), and a heat-dissipating sheet (53); the heat-conducting copper column (51) is arranged in a circular shape and is slidably connected to the inside of the heat-conducting inner shell (3) and passes through the rubber shell (4); the heat-conducting copper sheet (52) is fixedly mounted on the lower end of the heat-conducting copper column (51); A plurality of heat sinks (53) are fixedly mounted on the lower side of the heat-conducting copper sheet (52) and penetrate the protective shell (7); the fixing assembly (6) is fixedly mounted on the lower end of the transistor pin (2); the protective shell cover (8) is fixedly mounted on the upper end of the protective shell (7); a heat-conducting column (32) wrapping the transistor pin (2) is mounted on the bottom end of the heat-conducting inner shell (3); the transistor pin (2) is connected to the port through the fixing assembly (6); the length of the portion of the heat sink (53) extending from the lower end of the protective shell (7) is proportional to the ambient temperature of the transistor body (1); when the temperature reaches the transistor limit temperature, the gas in the heat-conducting inner shell (3) pushes the fixing assembly (6) downward through the heat-conducting column (32) to disconnect the connection between the transistor pin (2) and the port.

2. The triode with waterproof function according to claim 1, characterized in that: The fixing assembly (6) comprises a connecting ring (61), a heating wall (62), a fixing ring (63), a conductive rod (64), an insulating sheet (65), a conductive block (66), a spring (67), and a spring sheet (68); the connecting ring (61) is fixedly connected to the lower end of the heat-conducting column (32); the heating wall (62) is fixedly connected to the outside of the connecting ring (61); the fixing ring (63) is fixedly installed at the lower end of the connecting ring (61); a plurality of conductive rod installation grooves (631) penetrating the fixing ring (63) are provided at both ends of the fixing ring (63); a plurality of conductive rods (64) are slidably installed in the conductive rod installation grooves (631); the insulating sheet (65) is fixedly installed on the inside of the fixing ring (63); the conductive rods (64) are fixedly installed in the conductive rod installation grooves (631); Conductive block mounting holes (641) are provided at both ends of the rod (64); one end of the spring (67) is fixedly mounted on the inner end of the conductive block mounting hole (641); the conductive block (66) is fixedly mounted on the other end of the spring (67); the leaf spring (68) is fixedly mounted on the inner side of the fixing ring (63); a cavity (31) is provided in the heat-conducting inner shell (3); the cavity (31) is divided into a cavity upper end (311), a cavity lower end (312), and a cavity interlayer (313) from top to bottom; a ventilation duct (321) is provided in the heat-conducting column (32); the upper end of the ventilation duct (321) is connected to the cavity interlayer (313); and the lower end passes through the connecting ring (61) and is connected to the conductive rod mounting groove (631).

3. The triode with waterproof function according to claim 2, characterized in that: A heating chamber (621) is provided in the heating wall (62) and is connected to the ventilation duct (321); the heating chamber (621) is wrapped around the outside of the fixing ring (63); an air outlet (632) is provided on the inside of the fixing ring (63); one end of the air outlet (632) is connected to the inside of the fixing ring (63), and the other end passes through the outside of the connecting ring (61).

4. The triode with waterproof function according to claim 3, characterized in that: A one-way valve (633) is arranged in the air outlet hole (632).

5. The triode with waterproof function according to claim 1, characterized in that: The outer ring of the protective shell (7) is provided with a heat dissipation groove (71) which penetrates the protective shell (7), and the heat dissipation groove (71) is arranged on the upper and outer sides of the heat sink (53).

6. The triode with waterproof function according to claim 2, characterized in that: The inner layer of the connecting ring (61) is provided with a rubber inner ring (611) and the outer layer is made of heat-absorbing material and expands by absorbing heat.

7. The triode with waterproof function according to claim 2, characterized in that: The conductive rod (64) is provided with an insulating groove (642) on the same side as the conductive block mounting hole (641), and the fixing ring (63) is provided with a matching hole (634) at the bottom end of the spring leaf (68).

8. The triode with waterproof function according to claim 1, characterized in that: The heat sinks (53) are arranged in a circular pattern around the heat-conducting column (32).

9. The triode with waterproof function according to claim 2, characterized in that: An exhaust pipe (513) is provided in the heat-conducting copper column (51), the upper end of the exhaust pipe (513) is connected to the lower end (312) of the cavity, and the lower end passes through the heat-conducting copper sheet (52).

10. The triode with waterproof function according to claim 1, characterized in that: An alarm sensor (511) is fixedly mounted on the upper end of the heat-conducting copper column (51), and a pressing block (512) is fixedly mounted on the lower end of the alarm sensor (511), and the pressing block (512) is located outside the heat-conducting copper column (51).

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