Printed circuit board (PCB) with laminated design, power module circuit and PCB design method

Abstract

The invention discloses a PCB (Printed Circuit Board) with a laminated design, a power module circuit and a PCB design method, the PCB comprises at least two conductive layers which are laminated, and each conductive layer is provided with a plurality of half-bridge arms, a main circuit positive electrode wiring area and a main circuit negative electrode wiring area; the half-bridge arm comprises an upper bridge arm and a lower bridge arm which is arranged on a different layer from the upper bridge arm; the upper bridge arm input end of the upper bridge arm is connected with the main circuit anode wiring area, and the upper bridge arm input end of the upper bridge arm is connected with the upper bridge arm output end through an upper bridge arm driving circuit; the lower bridge arm input end of the lower bridge arm is connected with the upper bridge arm output end on the same half bridge arm, the lower bridge arm input end of the lower bridge arm is connected with the lower bridge arm output end through a lower bridge arm driving circuit, the lower bridge arm output end is connected with the main circuit negative electrode wiring area, and the current of the main circuit positive electrode wiring area and the current of the main circuit negative electrode wiring area are opposite in direction. According to the technical scheme, due to the fact that the directions of generated parasitic inductances are opposite, the parasitic inductances can be counteracted mutually, and then the parasitic inductances in a current loop are reduced.

Description

Technical Field

[0001] The present invention relates to the field of electronic devices, and in particular to a PCB board with a stacked design, a power module circuit and a PCB board design method. Background Art

[0002] In industrial applications, the power module circuit is a widely used electronic module. For example, it is used in the motor controller of a water pump. During the application process, the motor controller of the water pump is low voltage and high current.

[0003] At present, in the relevant technology, when designing the power module circuit, MOSFET (metal oxide semiconductor field effect transistor) module is adopted, and the double-sided layout is adopted. The structure cannot be freely changed, and the PCB board cannot be designed with the stacking technology. Therefore, no current in the opposite direction is generated on the PCB board, and the parasitic inductance in the current loop is large. There is a problem of damaging the microcontroller and the power device due to the large parasitic inductance. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a PCB board, a power module circuit and a PCB board design method with a stacking design, so as to solve the problem that the PCB board used in the power module circuit in the prior art cannot be designed using the stacking technology, so no current in the opposite direction is generated on the PCB board, the parasitic inductance in the current loop is large, and there is a problem that the microcontroller and the power device are damaged due to the large parasitic inductance.

[0005] The technical solution adopted by the present invention to solve the technical problem is: to provide a PCB board with a stacked design, comprising: at least two layers of conductive layers arranged in a stacked manner, wherein the conductive layers are provided with a plurality of half-bridge arms, a main positive electrode wiring area connected to the positive electrode of a power supply, and a main negative electrode wiring area connected to the negative electrode of the power supply;

[0006] The main positive wiring area is used to connect current, and the main negative wiring area is used to output current, wherein the main positive wiring area has the current in opposite directions to the main negative wiring area; the half bridge arm includes an upper bridge arm for installing an upper bridge arm drive circuit and a lower bridge arm for installing a lower bridge arm drive circuit, and the upper bridge arm and the upper bridge arm are arranged on different conductive layers;

[0007] The upper bridge arm is provided with an upper bridge arm input end and an upper bridge arm output end, the upper bridge arm input end is connected to the main circuit positive electrode wiring area, and the upper bridge arm input end is connected to the upper bridge arm output end via the upper bridge arm driving circuit;

[0008] The lower bridge arm is provided with a lower bridge arm input end and a lower bridge arm output end, the lower bridge arm input end is connected to the upper bridge arm output end on the same half bridge arm, the lower bridge arm input end is connected to the lower bridge arm output end via the lower bridge arm drive circuit, and the lower bridge arm output end is connected to the main circuit negative pole wiring area.

[0009] The present invention further provides that the conductive layer is also provided with a filter circuit negative electrode connection area connected to the positive electrode of the power supply and a filter circuit positive electrode connection area connected to the negative electrode of the power supply;

[0010] The main circuit positive electrode connection area is connected to the filter circuit positive electrode connection area via the filter circuit;

[0011] The main circuit negative electrode connection area is connected to the filter circuit negative electrode connection area via the filter circuit;

[0012] Among them, the current flows through the positive wiring area of ​​the filter circuit and the filter circuit to the positive wiring area of ​​the main circuit, and the current flows out from the negative wiring area of ​​the main circuit to the negative wiring area of ​​the filter circuit. The positive wiring area of ​​the filter circuit and the negative wiring area of ​​the main circuit have currents in opposite directions.

[0013] The present invention further provides that the positive electrode wiring areas of the filter circuit on different conductive layers are connected, and the negative electrode wiring areas of the filter circuit on different conductive layers are connected.

[0014] The present invention further provides that a current sampling area is also provided on the conductive layer and is provided on the same conductive layer as the upper bridge arm, the current sampling area is connected to the output end of the lower bridge arm, and the current sampling area is also connected to the main circuit negative pole wiring area via a current sampling circuit.

[0015] The present invention further arranges that the current sampling areas on different conductive layers are connected, the main positive electrode wiring areas on different conductive layers are connected, and the main negative electrode wiring areas on different conductive layers are connected.

[0016] The present invention is further provided that the upper surface of the conductive layer of the top layer is covered with a first green oil layer, and the upper surface of the conductive layer of the top layer is provided with a plurality of heat dissipation windows penetrating the first green oil layer, and / or the lower surface of the conductive layer of the bottom layer is covered with a second green oil layer, and the lower surface of the conductive layer of the bottom layer is provided with a plurality of heat dissipation windows penetrating the second green oil layer.

[0017] The present invention is further arranged that the PCB board with a laminated design is also provided with a plurality of groups of heat dissipation holes penetrating the PCB board with a laminated design in a thickness direction, and electronic components are arranged on the upper surface of each group of the heat dissipation holes, and each group of the heat dissipation holes includes a plurality of outer holes and a plurality of inner holes, and the plurality of the outer holes are arranged around the periphery of the electronic components, and the plurality of the inner holes are arranged at the bottom of the electronic components.

[0018] The present invention also provides a power module circuit, comprising: a half-bridge driving circuit corresponding to the half-bridge arm and a PCB board with any of the stacked designs;

[0019] The half-bridge driving circuit comprises an upper bridge arm driving circuit arranged on the upper bridge arm and a lower bridge arm driving circuit arranged on the lower bridge arm;

[0020] The input end of the upper bridge arm driving circuit is connected to the input end of the upper bridge arm, and the output end of the upper bridge arm driving circuit is connected to the corresponding output end of the upper bridge arm;

[0021] The input end of the lower bridge arm driving circuit is connected to the lower bridge arm input end, and the output end of the lower bridge arm driving circuit is connected to the corresponding lower bridge arm output end.

[0022] The present invention is further configured to include: a filter circuit;

[0023] The filter circuit includes a first capacitor, a first inductor and a second capacitor;

[0024] One end of the first capacitor is connected to the positive electrode of the power supply, the one end of the first capacitor is also connected to one end of the second capacitor via the first inductor, and the one end of the first capacitor is also connected to the positive electrode wiring area of ​​the filter circuit;

[0025] The other end of the first capacitor and the other end of the second capacitor are connected to the negative electrode connection area of ​​the filter circuit, and the other end of the first capacitor and the other end of the second capacitor are also connected to the negative electrode of the power supply.

[0026] The present invention also provides a PCB board design method for manufacturing a PCB board of any stacked design, comprising:

[0027] The upper bridge arm and the lower bridge arm are arranged on the plurality of the conductive layers, wherein the upper bridge arm and the lower bridge arm are arranged on different conductive layers;

[0028] The main positive electrode wiring area and the main negative electrode wiring area are arranged on the conductive layer;

[0029] A plurality of the conductive layers are stacked.

[0030] Beneficial effects of the present invention:

[0031] In the technical solution of the present invention, the PCB board with a laminated design is provided with at least two conductive layers arranged in a laminated manner, and an upper bridge arm for installing an upper bridge arm driving circuit and a lower bridge arm for installing a lower bridge arm driving circuit are arranged on the conductive layer. The upper bridge arm and the lower bridge arm are located in different conductive layers. By separately arranging the upper bridge arm and the lower bridge arm, the upper bridge arm driving circuit and the lower bridge arm driving circuit replace the MOSFET module, so that the PCB board with a laminated design adopts a laminated design. Since the main positive pole wiring area and the main negative pole wiring area have currents in opposite directions, when the upper bridge arm driving circuit on one half of the bridge arm and the lower bridge arm driving circuit on the other half of the bridge arm are turned on, the parasitic inductances generated by the currents in opposite directions are in opposite directions and can offset each other, thereby reducing the parasitic inductance in the current loop, and protecting the single-chip microcomputer and the power device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0033] Figure 1 It is a structural diagram of a PCB board with a laminated design according to the present invention;

[0034] Figure 2 It is a schematic diagram of the structure of the power module circuit of the present invention;

[0035] Figure 3 is a circuit structure diagram of a power module circuit of the present invention;

[0036] Figure 4 It is a circuit structure diagram of the three-phase load module of the present invention;

[0037] Figure 5 It is a flow chart of the PCB board design method of the stacking design of the present invention.

[0038] Figure numerals: 1, main positive wiring area; 2, main negative wiring area; 3, upper bridge arm; 4, lower bridge arm; 5, filter circuit positive wiring area; 6, filter circuit negative wiring area; 7, current sampling area; 8, U phase output terminal; 9, V phase output terminal; 10, W phase output terminal; 11, conductive layer; 20, half-bridge drive circuit; 201, upper bridge arm drive circuit; 202, lower bridge arm drive circuit; 30, filter circuit; 40, MOS tube drive circuit; 50, MOS tube protection circuit; 60, buffer circuit; 70, parasitic circuit; 80, electric Flow sampling circuit; 90, three-phase load module; 901, U phase; 902, W phase; 903, V phase; R1, first resistor; R2, second resistor; R3, third resistor; R4, fourth resistor; R5, fifth resistor; R6, sixth resistor; R7, seventh resistor; R8, eighth resistor; C1, first capacitor; C2, second capacitor; C3, third capacitor; L1, first inductor; L2, second inductor; L3, third inductor; L4, fourth inductor; L5, fifth inductor; Q1, first MOS tube; Q2, second MOS tube. DETAILED DESCRIPTION

[0039] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings, are constructed and operated in a specific direction, and are only for the convenience of describing the present technical solution, rather than indicating that the device or element referred to must have a specific direction, and therefore cannot be understood as a limitation to the present invention.

[0040] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present invention. However, it should be clear to those skilled in the art that the present invention may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present invention.

[0041] like Figure 1As shown, a PCB board with a laminated design provided by the present invention can be used for a power module circuit in a motor controller. The PCB board with a laminated design may include a conductive layer 11, wherein the conductive layer 11 is provided with at least two layers and is laminated, and a half-bridge arm, a main positive wiring area 1, and a main negative wiring area 2 may be provided on the conductive layer 11; the main positive wiring area 1 is connected to the positive electrode of the power supply, and the main positive wiring area 1 is used to connect the current, the main negative wiring area 2 is connected to the negative electrode of the power supply, and the main negative wiring area 2 is used to output the current, wherein the current on the main positive wiring area 1 has a current in the opposite direction to the current on the main negative wiring area 2; the half-bridge arm may include an upper bridge arm 3 and a lower bridge arm 4, and the upper bridge arm 3 is used to install an upper bridge arm driver The upper bridge arm 3 is provided with an upper bridge arm input terminal and an upper bridge arm output terminal, the upper bridge arm input terminal is connected to the main positive electrode wiring area 1, and the upper bridge arm input terminal is connected to the upper bridge arm output terminal via the upper bridge arm driving circuit; the lower bridge arm 4 is used to install the lower bridge arm driving circuit, the lower bridge arm 4 includes a lower bridge arm input terminal and a lower bridge arm output terminal, the lower bridge arm input terminal is connected to the lower bridge arm output terminal via the lower bridge arm driving circuit, the lower bridge arm input terminal is connected to the upper bridge arm output terminal on the same half bridge arm, and the upper bridge arm 3 and the lower bridge arm 4 are arranged on different conductive layers 11; wherein, the main positive electrode wiring area 1 and the main negative electrode wiring area 2 have currents in opposite directions.

[0042] Here, it should be noted that after the power supply starts to supply power, when the main positive wiring area 1 is connected to the current, the current can flow from the main positive wiring area 1 to the input end of the upper bridge arm; when the main negative wiring area 2 outputs the current, the current can flow from the output end of the lower bridge arm to the main negative wiring area 2. In addition, in order to illustrate the specific arrangement of the upper bridge arm 3 and the lower bridge arm 4 on different conductive layers 11, further examples are given here. For example, when the conductive layer 11 is provided with two layers, the upper bridge arm 3 is provided on one conductive layer 11, and the lower bridge arm 4 is provided on the other conductive layer 11. When other numbers of conductive layers 11 are provided, the arrangement of the upper bridge arm 3 and the lower bridge arm 4 is the same as the arrangement of the upper bridge arm 3 and the lower bridge arm 4 on two conductive layers 11, which will not be repeated here.

[0043] In this embodiment, by separately setting the upper bridge arm 3 and the lower bridge arm 4, the upper bridge arm drive circuit and the lower bridge arm drive circuit replace the MOSFET module, so that the PCB board adopts a stacked design. When the upper bridge arm drive circuit on one half of the bridge arm and the lower bridge arm drive circuit on the other half of the bridge arm are turned on, the current is output to the load through the main positive electrode wiring area 1 and the turned-on upper bridge arm drive circuit, and then after returning through the load, the current flows to the main negative electrode wiring area 2 through the turned-on lower bridge arm drive circuit. Since the main positive electrode wiring area 1 and the main negative electrode wiring area 2 have currents in opposite directions, the parasitic inductances generated by the currents in opposite directions are in opposite directions and can offset each other, thereby reducing the parasitic inductance in the current loop, and protecting the single-chip microcomputer and power devices.

[0044] When the conductive layer 11 is set, the upper bridge arms 3 on different conductive layers 11 can be connected, the lower bridge arms 4 on different conductive layers 11 can be connected, the main positive wiring areas 1 between different conductive layers 11 can be connected, and the main negative wiring areas 2 between different conductive layers 11 can be connected.

[0045] In this embodiment, connecting the upper bridge arms 3 on different conductive layers 11 can increase the current capacity of the upper bridge arms 3. Similarly, connecting the lower bridge arms 4 on different conductive layers 11 can increase the current capacity of the lower bridge arms 4. Connecting the main positive wiring area 1 on different conductive layers 11 can increase the current capacity of the main positive wiring area 1. Connecting the main negative wiring area 2 on different conductive layers 11 can increase the current capacity of the main negative wiring area 2.

[0046] In some embodiments, Figure 1 As shown, the conductive layer 11 may also be provided with a filter circuit negative electrode wiring area 6 and a filter circuit positive electrode wiring area 5, the filter circuit negative electrode wiring area 6 is connected to the negative electrode of the power supply, and the filter circuit positive electrode wiring area 5 is connected to the positive electrode of the power supply; the main circuit positive electrode wiring area 1 is connected to the filter circuit positive electrode wiring area 5 via the filter circuit, that is, the current can flow from the filter circuit positive electrode wiring area 5 to the main circuit positive electrode wiring area 1 via the filter circuit; the main circuit negative electrode wiring area 2 is connected to the filter circuit negative electrode wiring area 6 via the filter circuit, that is, the current can flow from the main circuit negative electrode wiring area 2 to the filter circuit negative electrode wiring area 6 via the filter circuit; wherein, the filter circuit positive electrode wiring area 5 and the filter circuit negative electrode wiring area 6 have currents in opposite directions.

[0047] In this embodiment, when the upper bridge arm driving circuit on one half of the bridge arm is turned on with the lower bridge arm driving circuit on the other half of the bridge arm, the current starts from the positive electrode of the power supply, flows to the load after passing through the positive electrode wiring area 5 of the filter circuit, the positive electrode wiring area 1 of the main circuit and the upper bridge arm driving circuit, and then flows back from the load to the turned-on lower bridge arm driving circuit, and finally flows to the negative electrode of the power supply through the negative electrode wiring area 2 of the main circuit and the negative electrode wiring area 6 of the filter circuit. Among them, since the currents from the positive electrode wiring area 5 of the filter circuit and the negative electrode wiring area 6 of the filter circuit have opposite directions, the parasitic inductances generated are in opposite directions and can offset each other, thereby further reducing the parasitic inductance in the current loop and protecting the single-chip microcomputer and power devices.

[0048] When the positive electrode connection area 5 of the filter circuit is set, the positive electrode connection areas 5 of the filter circuit between different conductive layers 11 can be connected. Similarly, when the negative electrode connection area 6 of the filter circuit is set, the negative electrode connection areas 6 of the filter circuit between different conductive layers 11 can be connected.

[0049] In this embodiment, connecting the positive electrode connection areas 5 of the filter circuit between different conductive layers 11 can increase the current capacity of the positive electrode connection areas 5 of the filter circuit. Similarly, connecting the negative electrode connection areas 6 of the filter circuit between different conductive layers 11 can increase the current capacity of the negative electrode connection areas 6 of the filter circuit.

[0050] In some embodiments, Figure 1 As shown, a current sampling area 7 can also be set on the conductive layer 11. The current sampling area 7 and the upper bridge arm 3 are located in the same layer. The current sampling area 7 is connected to the output end of the lower bridge arm. The current sampling area 7 is also connected to the main circuit negative electrode wiring area 2 through a current sampling circuit.

[0051] Here, it should be noted that, during the current flow, the current is output from the output end of the lower bridge arm, flows to the current sampling area 7, and then flows to the main circuit negative electrode wiring area 2 through the current sampling circuit.

[0052] In this embodiment, when the upper bridge arm driving circuit on one half of the bridge arm is turned on with the lower bridge arm driving circuit on the other half of the bridge arm, the current starts from the positive electrode of the power supply, flows to the load after passing through the positive electrode wiring area 5 of the filter circuit, the positive electrode wiring area 1 of the main circuit and the upper bridge arm driving circuit, and then flows back from the load to the turned-on lower bridge arm driving circuit, and finally flows to the negative electrode of the power supply through the current sampling area 7, the negative electrode wiring area 2 of the main circuit, and the negative electrode wiring area 6 of the filter circuit. Among them, since the upper bridge arm 3 and the lower bridge arm 4 are located in different conductive layers 11, when the current flows back, it first flows back from the load to the upper bridge arm 3, and then flows from the upper bridge arm 4 to the lower bridge arm 4. Therefore, in the process of current flow, the direction of the current flowing back from the load to the lower bridge arm 4 is opposite to the direction of the current flowing from the lower bridge arm 4 to the current sampling area 7. Therefore, the parasitic inductances generated are in opposite directions and can offset each other, further reducing the parasitic inductance in the current loop, and protecting the single-chip microcomputer and power devices.

[0053] When the current sampling area 7 is provided, the current sampling areas 7 between different conductive layers 11 can be connected. In this embodiment, the current sampling areas 7 between different conductive layers 11 can be connected to increase the current passing capacity of the current sampling areas 7.

[0054] In some embodiments, the upper surface of the top conductive layer 11 of the PCB board is covered with a first green oil layer, and a plurality of heat dissipation windows penetrating the first green oil layer may be provided on the upper surface of the top conductive layer 11. Of course, the lower surface of the bottom conductive layer 11 of the PCB board may also be covered with a second green oil layer, and a plurality of heat dissipation windows penetrating the second green oil layer may be provided on the lower surface of the bottom conductive layer 11. Alternatively, while a plurality of heat dissipation windows penetrating the first green oil layer are provided on the upper surface of the top conductive layer 11 of the PCB board, a plurality of heat dissipation windows penetrating the second green oil layer may be provided on the lower surface of the bottom conductive layer 11 of the PCB board.

[0055] Here, it should be noted that when the heat dissipation window is set on the top conductive layer 11, the heat dissipation window is a square hole that penetrates the first green oil layer. Of course, it can also be a hole of other shapes, such as a circular hole; when the heat dissipation window is set on the bottom conductive layer 11, it is a square hole that penetrates the second green oil layer. Of course, it can also be a hole of other shapes, such as a circular hole. When the heat dissipation window is set, the number and location of the heat dissipation window are not specifically limited if it does not affect the use of the PCB board. Those skilled in the art can determine it by themselves according to the actual application situation when setting.

[0056] In this embodiment, the setting of the heat dissipation window allows heat to be dissipated through the heat dissipation window, thereby reducing thermal resistance. At the same time, when the thermal conductive gel is filled on the conductive layer 11, a small protrusion is formed when the thermal conductive gel is filled into the heat dissipation window, thereby increasing the friction between the thermal conductive gel and the green oil layer, reducing the fluidity of the thermal conductive gel, and thus reducing the risk of short circuit. At the same time, compared with the PCB board in the prior art in which only the MOSFET module dissipates heat, the heat dissipation path is increased, and the heat dissipation effect is improved.

[0057] Specifically, when the heat dissipation windows are arranged, multiple groups can be arranged in n×m (for example, 2×3) manner, wherein n≥1, m≥1, and the arrangement manner of n×m multiple groups makes the surface of the conductive layer 11 beautiful and neat. It should be noted that when the heat dissipation windows are arranged in n×m manner, the specific values ​​of n and m can be determined by those skilled in the art according to actual conditions, and different n×m can also be used on the same conductive layer 11. For example, on the same conductive layer 11, several groups of heat dissipation windows arranged in 2×3 and several groups of heat dissipation windows arranged in 4×5 can be arranged at the same time. In order to further explain n and m, a specific example is now given. For example, when a MOS (metal oxide semiconductor) pad is arranged on the PCB board, the heat dissipation window located at the MOS pad position is arranged in a fully open manner, that is, a heat dissipation window with an area adapted to the MOS pad is arranged. When a heat dissipation window is arranged at the power circuit position on the PCB board, multiple heat dissipation windows with small areas can be used, and the multiple heat dissipation windows are arranged in n×m manner.

[0058] In some embodiments, a plurality of groups of heat dissipation holes penetrating the conductive layer 11 may be further provided on the PCB board, and electronic components are provided on the upper surface of each group of heat dissipation holes. Each group of heat dissipation holes includes a plurality of outer holes and a plurality of inner holes, and the plurality of outer holes are arranged around the periphery of the electronic components, wherein the inner walls of the outer holes and the inner holes are coated with a metal layer, and the inner holes and the outer holes are connected in parallel.

[0059] Specifically, a number of outer holes form a square structure, and the inner holes are arranged in the square structure. The inner walls of the outer holes and the inner holes are coated with a metal layer, and the outer holes and the inner holes are connected in parallel through the metal layer coated on the inner walls. Thirty-two outer holes can be arranged, and the thirty-two outer holes surround the square structure; twenty-one inner holes can be arranged, and seven inner holes are connected to form a straight line, wherein one straight line passes through the center point of the square structure, and the other two straight lines are symmetrically arranged on both sides of the center point and are perpendicular to the straight line passing through the center point. It should be noted that the number of outer holes and inner holes is not limited to the above number, and those skilled in the art can decide according to actual conditions.

[0060] In this embodiment, the heat generated by the electronic components can also be dissipated through the heat dissipation holes. The provision of the heat dissipation holes reduces the thermal resistance of the PCB board along the thickness direction, further improving the heat dissipation effect. In addition, since the inner hole and the outer hole are connected in parallel, the parasitic inductance generated in the outer hole and the inner hole are connected in parallel, further reducing the parasitic inductance.

[0061] In order to more clearly explain the direction of the current between the conductive layers 11 on the PCB board, the following is an example in which a PCB board is provided with four conductive layers 11 and the PCB board is applied to three-phase load control.

[0062] In this embodiment, if Figure 1As shown, the PCB board can be provided with four layers of conductive layers 11, and three half-bridge arms corresponding to the three-phase load are provided on the conductive layer 11. At the same time, the conductive layer 11 is provided with the above-mentioned filter circuit negative electrode connection area 6, filter circuit positive electrode connection area 5, current sampling area 7, heat dissipation window and heat dissipation hole. The half-bridge arm, filter circuit negative electrode connection area 6, filter circuit positive electrode connection area 5, current sampling area 7, heat dissipation window and heat dissipation hole on the conductive layer 11 are arranged in the same manner as above, and are not repeated here. In order to facilitate the connection of the PCB board with the three-phase load, the PCB board is provided with a U-phase output terminal 8, a V-phase output terminal 9 and a W-phase output terminal 10, wherein the U-phase output terminal 8 is connected to the upper bridge arm output terminal of the corresponding half-bridge arm and the lower bridge arm input terminal on the same half-bridge arm, and the connection between the V-phase output terminal 9 and the W-phase output terminal 10 on the PCB board is the same as that of the U-phase output terminal 8, and is not repeated here. When the PCB board is connected to a three-phase load, the U phase in the three-phase load can be directly connected to the U phase output terminal 8, the W phase can be connected to the W phase output terminal 10, and the V phase can be connected to the V phase output terminal 9. The following is an example of the upper bridge arm drive circuit corresponding to U and the lower bridge arm drive circuit corresponding to W being turned on.

[0063] In application, when the power supply starts to power on, the current starts from the positive pole of the power supply, flows through the positive pole wiring area 5 of the filter circuit, the positive pole wiring area 1 of the main road, and the upper bridge arm driving circuit corresponding to U to the load, and then flows back from the load to the lower bridge arm driving circuit corresponding to the turned-on W, and finally flows through the current sampling area 7, the negative pole wiring area 2 of the main road, and the negative pole wiring area 6 of the filter circuit to the negative pole of the power supply, wherein the positive pole wiring area 1 of the main road and the negative pole wiring area 2 of the main road have currents in opposite directions, and the direction of the current flowing from the positive pole wiring area 5 of the filter circuit to the positive pole wiring area 1 of the main road The direction of the parasitic inductance generated between the currents in opposite directions is opposite to the direction of the current flowing from the negative electrode wiring area 2 of the main circuit to the negative electrode wiring area 6 of the filter circuit, and the direction of the current between the conductive layer 11 provided with the upper bridge arm 3 and the conductive layer 11 provided with the lower bridge arm 4. The directions of the parasitic inductances generated between the currents in opposite directions are opposite and can offset each other, thereby reducing the parasitic inductance in the current loop; in addition, the setting of the heat dissipation window and the heat dissipation hole further reduces the parasitic inductance while dissipating heat. The design of the PCB board reduces the parasitic inductance in the current loop and protects the single-chip microcomputer and power devices.

[0064] In this embodiment, the PCB board adopts a single-sided layout method. Compared with the double-sided layout method in the prior art, the single-sided layout reduces materials. At the same time, the single-sided layout adopts the patch process, so all electronic components only need to go through one reflow soldering, which further reduces the production process and thus reduces the production cost.

[0065] In some embodiments, Figure 2 , Figure 3As shown, the present invention further provides a power module circuit, which may include a half-bridge drive circuit 20 and the above-mentioned PCB board, the half-bridge drive circuit 20 corresponds to the half-bridge arm, and the correspondence here refers to the correspondence in quantity, that is, one half-bridge drive circuit 20 corresponds to one half-bridge arm; wherein the half-bridge drive circuit 20 includes an upper bridge arm drive circuit 201 and a lower bridge arm drive circuit 202, the upper bridge arm drive circuit 201 is arranged on the upper bridge arm 3, the lower bridge arm drive circuit 202 is arranged on the lower bridge arm 4, and the upper bridge arm drive circuit 201 is arranged on the upper bridge arm 3, and the lower bridge arm drive circuit 202 is arranged on the lower bridge arm 4. The input end of the driving circuit 201 is connected to the input end of the upper bridge arm, the output end of the upper bridge arm driving circuit 201 is connected to the corresponding upper bridge arm output end, the corresponding upper bridge arm output end refers to the upper bridge arm output end of the upper bridge arm 3 installed by the upper bridge arm driving circuit 201, the input end of the lower bridge arm driving circuit 202 is connected to the input end of the lower bridge arm, the output end of the lower bridge arm driving circuit 202 is connected to the corresponding lower bridge arm output end, and the corresponding lower bridge arm output end refers to the lower bridge arm output end of the lower bridge arm 4 installed by the lower bridge arm driving circuit 202.

[0066] In this embodiment, when the upper bridge arm driving circuit 201 on one half of the bridge arm and the lower bridge arm driving circuit 202 on the other half of the bridge arm are turned on, the current is output to the load through the main positive wiring area 1 and the turned-on upper bridge arm driving circuit 201, and then after returning through the load, the current flows to the main negative wiring area 2 through the turned-on lower bridge arm driving circuit 202. Since the main positive wiring area 1 and the main negative wiring area 2 have currents in opposite directions, the parasitic inductances generated by the currents in opposite directions are in opposite directions and can offset each other, thereby reducing the parasitic inductance in the current loop, thereby protecting the single-chip microcomputer and power devices.

[0067] In some embodiments, the power module circuit may further include a filter circuit 30 , one end of the filter circuit 30 is connected to the filter circuit positive electrode connection area 5 , and the other end of the filter circuit 30 is connected to the filter circuit negative electrode connection area 6 .

[0068] Specifically, Figure 3 As shown, the filter circuit 30 may include a first capacitor C1, a first inductor L1 and a second capacitor C2; the positive electrode of the power supply is connected to one end of the first capacitor C1 and one end of the first inductor L1, the other end of the first inductor L1 is connected to one end of the second capacitor C2 and the input end of the upper bridge arm, and one end of the first capacitor C1 is also connected to the positive electrode wiring area 5 of the filter circuit; the other end of the second capacitor C2 and the other end of the first capacitor C1 are connected to the main negative electrode wiring area 2, and the other end of the second capacitor C2 is also connected to the output end of the lower bridge arm.

[0069] In this embodiment, the current flows to the upper bridge arm driving circuit 201 after being filtered by the first capacitor C1, the first inductor L1 and the second capacitor C2. After the current is filtered, the differential mode ripple current and voltage become smaller, so the radiation and conduction are reduced accordingly, thereby reducing the difficulty of EMC (electromagnetic compatibility test). Of course, the circuit structure of the filter circuit 30 is not limited to the above circuit structure, and the circuit structure of the filter circuit 30 can be any circuit structure that can achieve the above function.

[0070] In some embodiments, the power module circuit may further include a current sampling circuit 80, one end of the current sampling circuit 80 is connected to the current sampling area 7, and the other end of the current sampling circuit 80 is connected to the main negative wiring area 2. During the operation of the power module circuit, current sampling can be performed through the end of the current sampling circuit 80 connected to the current sampling area 7.

[0071] In some embodiments, the power module circuit may further include a MOS tube driving circuit 40, a MOS tube protection circuit 50, a buffer circuit 60 and a parasitic circuit 70; the upper bridge arm driving circuit 201 includes a first end, a second end and a third end, the first end is used for the corresponding control signal input, the second end is the voltage input end of the upper bridge arm driving circuit 201, and the third end is the voltage output end of the upper bridge arm driving circuit 201; the lower bridge arm driving circuit 202 includes a fourth end, a fifth end and a sixth end, the fourth end is used for the corresponding control signal input, the fifth end is the lower bridge arm driving circuit 202. The first end and the fourth end are respectively connected in series with a MOS tube driving circuit 40; a MOS tube protection circuit 50 is respectively connected in series between the first end and the second end of the same upper bridge arm driving circuit 201 and between the fourth end and the fifth end of the same lower bridge arm driving circuit 202; a parasitic circuit 70 is respectively connected in series with the second end, the third end, the fifth end and the sixth end; the parasitic circuit 70 connected in series on the fifth end is connected to the other end of the second capacitor C2 via a current sampling circuit 80.

[0072] In this embodiment, if Figure 3As shown, three half-bridge drive circuits 20 are arranged in parallel, and the three half-bridge drive circuits 20 arranged in parallel are respectively connected to the corresponding phase circuits, that is, the three half-bridge drive circuits 20 arranged in parallel are respectively connected to the U phase, the W phase and the V phase. The upper bridge arm drive circuit 201 may include a first MOS transistor Q1, the first MOS transistor Q1 is an N-MOS transistor (N-type metal oxide semiconductor transistor), the gate of the first MOS transistor Q1 is the first end, the drain of the first MOS transistor Q1 is the second end, and the source of the first MOS transistor Q1 is the third end. The lower bridge arm driving circuit 202 may include a second MOS tube Q2, the second MOS tube Q2 is an N-MOS tube, the gate of the second MOS tube Q2 is the fourth terminal, the source of the second MOS tube Q2 is the fifth terminal, and the drain of the second MOS tube Q2 is the sixth terminal. When connected, the drain of the first MOS tube Q1 is connected to the upper bridge arm input terminal, and the source of the same first MOS tube Q1 is connected to the corresponding upper bridge arm output terminal; the drain of the second MOS tube Q2 is connected to the lower bridge arm input terminal, and the source of the same second MOS tube Q2 is connected to the corresponding lower bridge arm output terminal.

[0073] The MOS transistor driving circuit 40 may include a first resistor R1. When the MOS transistor driving circuit 40 is set, a MOS transistor driving circuit 40 is set for each gate of the first MOS transistor Q1 and the gate of the second MOS transistor Q2; wherein, when the MOS transistor driving circuit 40 is set for the first MOS transistor Q1, one end of the corresponding first resistor R1 is connected to the gate of the first MOS transistor Q1, and the corresponding control signal is input to the first MOS transistor Q1 through the other end of the first resistor R1; when the MOS transistor driving circuit 40 is set for the second MOS transistor Q2, one end of the corresponding first resistor R1 is connected to the gate of the second MOS transistor Q2, and the corresponding control signal is input to the second MOS transistor Q2 through the other end of the first resistor R1. In this embodiment, the setting of the MOS transistor driving circuit 40 prevents the current from breaking through the first MOS transistor Q1 and the second MOS transistor Q2, and plays a protective role for the first MOS transistor Q1 and the second MOS transistor Q2. It should be noted that the MOS transistor driving circuit 40 is not limited to the above-mentioned circuit structure, and can also be any other circuit structure that can achieve the above-mentioned function.

[0074] The MOS transistor protection circuit 50 may include a second resistor R2. When the MOS transistor protection circuit 50 is set, each first MOS transistor Q1 and the second MOS transistor Q2 are respectively provided with a MOS transistor protection circuit 50, wherein when the first MOS transistor Q1 is set, one end of the second resistor R2 is connected to the gate of the first MOS transistor Q1, and the other end of the second resistor R2 is connected to the source of the same first MOS transistor Q1; when the second MOS transistor Q2 is set, one end of the second resistor R2 is connected to the gate of the second MOS transistor Q2, and the other end of the second resistor R2 is connected to the source of the same second MOS transistor Q2. In this embodiment, the MOS tube protection circuit 50 is set to provide a fixed bias voltage between the gate of the first MOS tube Q1 and the source of the first MOS tube Q1, ensuring the normal closing and conduction of the first MOS tube Q1. At the same time, it also has an anti-static effect, providing a discharge circuit for the capacitance between the gate of the first MOS tube Q1 and the source of the first MOS tube Q1 and the capacitance between the gate of the first MOS tube Q1 and the drain of the first MOS tube Q1; the effect of the MOS tube protection circuit 50 on the second MOS tube Q2 is the same as that on the first MOS tube Q1, which will not be repeated here. It should be noted that the MOS tube protection circuit 50 is not limited to the above circuit structure, and can also be any other circuit structure that can achieve the above function.

[0075] The buffer circuit 60 may include a third capacitor C3 and a third resistor R3. When the buffer circuit 60 is set, each first MOS tube Q1 and the second MOS tube Q2 are respectively provided with a buffer circuit 60, wherein when the first MOS tube Q1 is set, one end of the third capacitor C3 is connected to the drain of the first MOS tube Q1, the other end of the third capacitor C3 is connected to one end of the third resistor R3, and the other end of the third resistor R3 is connected to the source of the same first MOS tube Q1; when the second MOS tube Q2 is set, one end of the third capacitor C3 is connected to the drain of the second MOS tube Q2, the other end of the third capacitor C3 is connected to one end of the third resistor R3, and the other end of the third resistor R3 is connected to the source of the same second MOS tube Q2. In this embodiment, the buffer circuit 60 plays a protective role for the first MOS tube Q1 during the opening and closing process. It should be noted that the buffer circuit 60 is not limited to the above-mentioned circuit structure, and can also be any other circuit structure that can achieve the above-mentioned function.

[0076] The parasitic circuit 70 may include a second inductor L2 and a fourth resistor R4, and the second inductor L2 and the fourth resistor R4 are connected in series. When the parasitic circuit 70 is set, each first MOS tube Q1 and each second MOS tube Q2 are respectively provided with a parasitic circuit 70. Specifically, the drain of each first MOS tube Q1 and the source of the first MOS tube Q1 are respectively connected in series with a parasitic circuit 70, that is: the drain of the first MOS tube Q1 is connected to one end of the second capacitor C7 via the parasitic circuit 70, and the source of the first MOS tube Q1 is connected to the corresponding phase path via the parasitic circuit 70; the drain of each second MOS tube Q2 and the source of the second MOS tube Q2 are respectively connected in series with a parasitic circuit 70, that is: the drain of the second MOS tube Q2 is connected to the corresponding phase path via the parasitic circuit 70, and the source of the second MOS tube Q2 is connected to one end of the current sampling circuit 80 via the parasitic circuit 70. Further, a parasitic circuit 70 is also connected in series between the parasitic circuits 70 on the sources of any two adjacent second MOS tubes Q2. In this embodiment, the parasitic circuit 70 is provided to further filter out the interference signal. It should be noted that the parasitic circuit 70 is not limited to the above circuit structure, but can also be any other circuit structure that can achieve the above function.

[0077] The current sampling circuit 80 may include a fifth resistor R5. When the current sampling circuit 80 is set, one end of the fifth resistor R5 is connected to the current sampling area 7 (i.e., the parasitic circuit 70 on the source of the second MOS tube Q2 is connected to one end of the fifth resistor R5), and the other end of the fifth resistor R5 is connected to the negative electrode connection area 6 of the filter circuit (i.e., the other end of the fifth resistor R5 is connected to the common terminal of the first capacitor C1 and the second capacitor C2). In the application process, the current can be collected through the end of the fifth resistor R5 connected to the current sampling area 7. Of course, the current sampling circuit 80 is not limited to the above circuit structure. For example, the current sampling circuit 80 can also be a circuit structure of two resistors in parallel, that is, one end of the two resistors is connected in common, the parasitic circuit 70 on the source of the second MOS tube Q2 is connected to the common terminal of the two resistors, and the other end of the two resistors is connected to the common terminal of the first capacitor C1 and the second capacitor C2.

[0078] In order to illustrate the application of the power module circuit, the power module circuit is now specifically described in combination with a three-phase load module 90, wherein the three-phase load module 90 is equivalent to a three-phase load in actual application. Figure 4As shown, the three-phase load module 90 may include a U phase 901, a V phase 902 and a W phase 903, wherein the U phase 901 may include a third inductor L3 and a sixth resistor R6, one end of the sixth resistor R6 is connected to one end of the third inductor L3, and the other end of the sixth resistor R6 is connected to the half-bridge drive circuit 20 corresponding to the U phase 901; the V phase 902 may include a fourth inductor L4 and a seventh resistor R7, one end of the seventh resistor R7 is connected to one end of the fourth inductor L4, and the other end of the seventh resistor R7 is connected to the half-bridge drive circuit 20 corresponding to the V phase 902; the W phase 903 may include a fifth inductor and an eighth resistor R8, one end of the eighth resistor R8 is connected to one end of the fifth inductor, and the other end of the eighth resistor R8 is connected to the half-bridge drive circuit 20 corresponding to the W phase 903; the other end of the third inductor L3, the other end of the fourth inductor L4 and the other end of the fifth inductor are connected in common. When the upper bridge arm driving circuit 201 corresponding to the U phase 901 and the lower bridge arm driving circuit 202 corresponding to the W phase 903 are turned on, the current is filtered by the filter circuit 30, flows to the U phase 901 through the upper bridge arm driving circuit 201 corresponding to the U phase 901, and then flows out from the W phase 903 to the lower bridge arm driving circuit 202 corresponding to the W phase 903 after returning, and then flows to the negative pole of the power supply through the current sampling circuit 80.

[0079] In some embodiments, Figure 5 As shown, the present invention also provides a PCB board design method, which is used to manufacture the PCB board with the above-mentioned stacking design, and the PCB board design method includes the following steps:

[0080] S100: Arrange an upper bridge arm and a lower bridge arm on a plurality of conductive layers, wherein the upper bridge arm and the lower bridge arm are arranged on different conductive layers.

[0081] In this step, when the upper bridge arm and the lower bridge arm are arranged on the conductive layer, the number of the upper bridge arm and the lower bridge arm is related to the load applied by the power module circuit. For example, when the load applied by the power module circuit is a three-phase load, three upper bridge arms and three lower bridge arms can be arranged respectively. In this embodiment, the load is a three-phase load, and three upper bridge arms and three lower bridge arms are arranged respectively.

[0082] S200: a main positive electrode wiring area and a main negative electrode wiring area are arranged on the conductive layer.

[0083] In this step, when setting the main positive electrode wiring area and the main negative electrode wiring area, the direction of current flow needs to be considered, that is, the main positive electrode wiring area and the main negative electrode wiring area have currents in opposite directions. When setting the main positive electrode wiring area and the main negative electrode wiring area, those skilled in the art can decide the location of the main positive electrode wiring area and the main negative electrode wiring area on their own, provided that the above requirements are met.

[0084] In some embodiments, after the main positive wiring area and the main negative wiring area are set on the conductive layer, the positive wiring area of ​​the filter circuit and the negative wiring area of ​​the filter circuit may also be set on the conductive layer, wherein the positive wiring area of ​​the filter circuit and the negative wiring area of ​​the filter circuit need to consider the direction of current flow when setting the positive wiring area of ​​the filter circuit and the negative wiring area of ​​the filter circuit, that is, the positive wiring area of ​​the filter circuit and the negative wiring area of ​​the filter circuit have currents in opposite directions. When setting the positive wiring area of ​​the filter circuit and the negative wiring area of ​​the filter circuit, those skilled in the art may decide the setting positions of the positive wiring area of ​​the filter circuit and the negative wiring area of ​​the filter circuit on their own, provided that the above requirements are met.

[0085] In some embodiments, after the main positive wiring area and the main negative wiring area are set on the conductive layer, a current sampling area can also be set on the conductive layer, wherein the current sampling area and the conductive layer with the upper bridge arm are located on the same conductive layer.

[0086] In some embodiments, after the main positive wiring area and the main negative wiring area are set on the conductive layer, a heat dissipation window can also be set on the conductive layer. When setting the heat dissipation window, the use of the PCB board with a laminated design needs to be considered, that is, the number and location of the heat dissipation windows do not affect the use of the PCB board with a laminated design. On the premise of meeting the above requirements, technical personnel in this field can determine it according to actual application conditions.

[0087] In some embodiments, after the main positive wiring area and the main negative wiring area are set on the conductive layer, several groups of heat dissipation holes can also be set on the conductive layer. Specifically, each group of heat dissipation holes includes several outer holes and several inner holes, and the several outer holes are arranged around the periphery of the electronic components, wherein the inner walls of the outer holes and the inner holes are coated with a metal layer, and the inner holes and the outer holes are connected in parallel. Therefore, when setting the heat dissipation holes, it is necessary to determine the setting positions of the heat dissipation holes in combination with the setting positions of the electronic components, that is, the outer holes of the heat dissipation holes are arranged around the periphery of the electronic components, wherein the several outer holes form a square structure, and the inner holes are arranged within the square structure.

[0088] S300: stacking a plurality of conductive layers.

[0089] In this step, when the conductive layers are stacked, the conductive layer provided with the upper bridge arm may be arranged adjacent to the conductive layer provided with the lower bridge arm. For example, when the conductive layer has four layers, two of the conductive layers are provided with the upper bridge arm, and the other two conductive layers are provided with the lower bridge arm, when the conductive layers are stacked, one conductive layer provided with the upper bridge arm is arranged between two conductive layers provided with the lower bridge arm, and the other conductive layer provided with the upper bridge arm is arranged at the top layer.

[0090] Here, it should be noted that the description of the above power module circuit and PCB board design method embodiment is similar to the description of the above-mentioned laminated PCB board embodiment, and has similar beneficial effects as the above-mentioned laminated PCB board embodiment. For technical details not disclosed in the power module circuit and PCB board design method embodiment in this application, please refer to the description of the laminated PCB board embodiment in this application for understanding.

[0091] It can be understood that the above embodiments only express the preferred implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the patent scope of the present invention. It should be pointed out that, for ordinary technicians in this field, the above technical features can be freely combined without departing from the concept of the present invention, and several deformations and improvements can be made, which all belong to the protection scope of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should belong to the coverage of the claims of the present invention.

Claims

1. A PCB board with a laminated design, characterized in that: include: At least two layers of conductive layers are stacked, and a plurality of half-bridge arms, a main positive electrode wiring area connected to the positive electrode of the power supply, and a main negative electrode wiring area connected to the negative electrode of the power supply are arranged on the conductive layers; The main positive wiring area is used to connect current, and the main negative wiring area is used to output current, wherein the main positive wiring area and the main negative wiring area have currents in opposite directions; The half bridge arm comprises an upper bridge arm for installing an upper bridge arm driving circuit and a lower bridge arm for installing a lower bridge arm driving circuit, and the upper bridge arm and the lower bridge arm are arranged on different conductive layers; The upper bridge arm is provided with an upper bridge arm input end and an upper bridge arm output end, the upper bridge arm input end is connected to the main circuit positive electrode wiring area, and the upper bridge arm input end is connected to the upper bridge arm output end via the upper bridge arm driving circuit; The lower bridge arm is provided with a lower bridge arm input end and a lower bridge arm output end, the lower bridge arm input end is connected to the upper bridge arm output end on the same half bridge arm, the lower bridge arm input end is connected to the lower bridge arm output end via the lower bridge arm drive circuit, and the lower bridge arm output end is connected to the main circuit negative pole wiring area.

2. The PCB board with a laminated design according to claim 1, characterized in that: The conductive layer is also provided with a filter circuit negative electrode connection area connected to the positive electrode of the power supply and a filter circuit positive electrode connection area connected to the negative electrode of the power supply; The main circuit positive electrode connection area is connected to the filter circuit positive electrode connection area via the filter circuit; The main circuit negative electrode connection area is connected to the negative electrode connection area of ​​the filter circuit via the filter circuit; Among them, the current flows through the positive wiring area of ​​the filter circuit and the filter circuit to the positive wiring area of ​​the main circuit, and the current flows out from the negative wiring area of ​​the main circuit to the negative wiring area of ​​the filter circuit. The positive wiring area of ​​the filter circuit and the negative wiring area of ​​the main circuit have currents in opposite directions.

3. The PCB board with a stacked design according to claim 2, characterized in that: The positive electrode wiring areas of the filter circuit on different conductive layers are connected, and the negative electrode wiring areas of the filter circuit on different conductive layers are connected.

4. The PCB board with a laminated design according to any one of claims 1 to 3, characterized in that: The conductive layer is also provided with a current sampling area which is provided on the same conductive layer as the upper bridge arm. The current sampling area is connected to the output end of the lower bridge arm and is also connected to the main circuit negative electrode connection area via a current sampling circuit.

5. The PCB board with a stacked design according to claim 4, characterized in that: The current sampling areas on different conductive layers are connected, the main positive electrode wiring areas on different conductive layers are connected, and the main negative electrode wiring areas on different conductive layers are connected.

6. The PCB board with a stacked design according to claim 1, characterized in that: The upper surface of the conductive layer of the top layer is covered with a first green oil layer, and the upper surface of the conductive layer of the top layer is provided with a plurality of heat dissipation windows penetrating the first green oil layer, and / or the lower surface of the conductive layer of the bottom layer is covered with a second green oil layer, and the lower surface of the conductive layer of the bottom layer is provided with a plurality of heat dissipation windows penetrating the second green oil layer.

7. The PCB board with a laminated design according to claim 1 or 6, characterized in that: The PCB board with the stacked design is also provided with a plurality of groups of heat dissipation holes penetrating the PCB board with the stacked design in the thickness direction, and the upper surface of each group of the heat dissipation holes is provided with electronic components, and each group of the heat dissipation holes includes a plurality of outer holes and a plurality of inner holes, wherein the plurality of the outer holes surround the outer periphery of the electronic components, and the plurality of the inner holes are provided at the bottom of the electronic components.

8. A power module circuit, characterized in that: include: A half-bridge driving circuit corresponding to the half-bridge arm and a PCB board with a laminated design as claimed in any one of claims 1 to 7; The half-bridge driving circuit comprises an upper bridge arm driving circuit arranged on the upper bridge arm and a lower bridge arm driving circuit arranged on the lower bridge arm; The input end of the upper bridge arm driving circuit is connected to the input end of the upper bridge arm, and the output end of the upper bridge arm driving circuit is connected to the corresponding output end of the upper bridge arm; The input end of the lower bridge arm driving circuit is connected to the lower bridge arm input end, and the output end of the lower bridge arm driving circuit is connected to the corresponding lower bridge arm output end.

9. The power module circuit according to claim 8, characterized in that: Also includes: Filter circuit; The filter circuit includes a first capacitor, a first inductor and a second capacitor; One end of the first capacitor is connected to the positive electrode of the power supply, the one end of the first capacitor is also connected to one end of the second capacitor via the first inductor, and the one end of the first capacitor is also connected to the positive electrode wiring area of ​​the filter circuit; The other end of the first capacitor and the other end of the second capacitor are connected to the negative electrode connection area of ​​the filter circuit, and the other end of the first capacitor and the other end of the second capacitor are also connected to the negative electrode of the power supply.

10. A PCB board design method for manufacturing a PCB board with a stacked design as claimed in any one of claims 1 to 7, characterized in that: include: The upper bridge arm and the lower bridge arm are arranged on the plurality of the conductive layers, wherein the upper bridge arm and the lower bridge arm are arranged on different conductive layers; The main positive electrode wiring area and the main negative electrode wiring area are arranged on the conductive layer; A plurality of the conductive layers are stacked.

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