PCB convenient for heat dissipation

Abstract

The invention discloses a PCB convenient for heat dissipation, and relates to the technical field of application-specific integrated circuits. The PCB convenient for heat dissipation comprises a PCB body, a fixed shell is arranged outside the PCB body, the PCB body is fixedly connected to the interior of the fixed shell, a moving mechanism is fixedly connected to the outer wall of the fixed shell, a pneumatic heat dissipation mechanism is fixedly connected to the top of the fixed shell, the moving mechanism comprises an inner sleeve shell, and the inner sleeve shell is fixedly connected to the outer wall of the fixed shell. And the inner sleeve shell is fixedly connected to the right side of the fixed shell. According to the PCB convenient to dissipate heat, the fixed outer shell continuously moves back and forth between the two outer sleeve shells through continuous stretching and retracting of the telescopic rods, so that the space between the inner sleeve shell and the corresponding outer sleeve shell continuously becomes larger and smaller, heat generated during work of the PCB is extracted through air, and the heat dissipation efficiency of the PCB is improved. And then the air subjected to heat conduction and cooling is sent back, so that the cooling effect on the PCB can be achieved.

Description

Technical Field

[0001] The invention relates to the technical field of application specific integrated circuits, in particular to a PCB circuit board that is convenient for heat dissipation. Background Art

[0002] PCB, full name Printed Circuit Board, is an indispensable key component in electronic devices. As an important electronic component, it is the provider of electrical connections for electronic components, and realizes electrical connections through printed circuits. The manufacturing process of PCB is complex, covering multiple processes such as drilling, copper plating, and etching to ensure its stable and reliable performance. It is widely used in many fields such as computers, communications, and consumer electronics, and is the cornerstone of the modern electronics industry. Patent application number CN202320124782.4 discloses a PCB circuit board that is easy to dissipate heat. The circuit board body is provided with eight layers, and an intermediate support plate is provided in the middle position of the eight-layer circuit board body. An upper clamping plate and a bottom clamping plate are respectively provided on the outer side of the circuit board body. The upper clamping plate is provided above the bottom clamping plate. The ends of the intermediate support plate, the upper clamping plate and the bottom clamping plate are all welded and fixed to the exhaust pipe. A bracket is welded on the inner surface of the exhaust pipe, and an exhaust fan is installed on the bracket. In desert areas, some detection equipment is often buried underground together with PCB circuit boards for geological surveys of the desert. Generally, the PCB circuit boards are allowed to passively dissipate heat through the contact parts with the sand. The thermal conductivity of sand is low, so the heat dissipation efficiency is low, and the PCB is easily overheated and damaged. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a PCB circuit board that is easy to dissipate heat to solve the problems raised in the above background technology.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a PCB circuit board that is easy to dissipate heat, comprising a PCB circuit board, a fixed shell is arranged outside the PCB circuit board, the PCB circuit board is fixedly connected inside the fixed shell, a moving mechanism is fixedly connected to the outer wall of the fixed shell, and a pneumatic heat dissipation mechanism is fixedly connected to the top of the fixed shell; The mobile mechanism includes: An inner casing, the inner casing being fixedly connected to the right side of the fixed outer casing; The outer shell is movably connected to the outer wall of the inner shell. The telescopic rod is continuously extended and retracted, so that the fixed outer shell continuously moves back and forth between the two outer shells, thereby making the space between the inner shell and the corresponding outer shell continuously expand and shrink; A telescopic rod is fixedly connected to the bottom of the fixed shell, and the other end of the telescopic rod is fixedly connected to the outer shell.

[0005] Preferably, the left side of the fixed outer shell is fixedly connected to an inner shell, the outer wall of the inner shell is movably connected to an outer shell, and the outer sides of the two outer shells are fixedly connected to outer end resistance plates. When the telescopic rod is extended or retracted, the outer end resistance plates will increase the resistance of the outer shells in the sand, thereby allowing the two outer shells to maintain a fixed position in the sand.

[0006] Preferably, the top and bottom of the fixed shell are fixedly connected with heat conducting plates, which play the role of expanding the contact surface. When the PCB circuit board is working, it will transfer the heat to the sand through the heat conducting plates on the outer wall of the fixed shell. As the fixed shell is driven by the telescopic rod to move left and right, the heat conducting plates will also move left and right.

[0007] Preferably, the outer wall of the outer shell is fixedly connected to an external fixed tube, the outer fixed tube is movably connected to an external movable rod, the outer movable rod is movably connected to an inner limiting rod, the inner limiting rod is fixedly connected to the inner wall of the outer shell, and the inner limiting rod can limit the range of movement of the outer movable rod.

[0008] Preferably, the pneumatic heat dissipation mechanism includes an air inlet pipe, which is fixedly connected to the top of the fixed shell, to which the exhaust pipe is fixedly connected, the bottom of the air inlet pipe is arranged on the top of the PCB circuit board, and the exhaust pipe is arranged on the bottom of the PCB circuit board. The air inlet pipe and the exhaust pipe are both fixedly connected with a solenoid valve, and when the solenoid valve is opened, external air can enter the fixed shell through the air inlet pipe, and at the same time, the air inside the fixed shell can be discharged to the outside through the exhaust pipe.

[0009] Preferably, the tops of the air inlet pipe and the exhaust pipe are both movably connected with sand-proof shells, and the tops of the sand-proof shells are both fixedly connected with guide plates. The airflow flowing in the air will push the guide plates to rotate the sand-proof shells, thereby allowing the corresponding sand-proof nets to face the direction of the airflow, and then allowing the airflow to pass through the corresponding two sand-proof nets. The back and front of the sand-proof shells are both fixedly connected with sand-proof nets. When the airflow passes through the sand-proof nets, the sand-proof nets will block the fine sand contained in the airflow to prevent the fine sand from contacting the PCB circuit board along the flow channel.

[0010] Preferably, the top of the air inlet pipe is located inside the corresponding sand-proof shell and is movably connected to a first arc-shaped fan blade, the top of the exhaust pipe is located inside the corresponding sand-proof shell and is movably connected to a second arc-shaped fan blade, and the bottoms of the first arc-shaped fan blade and the second arc-shaped fan blade are fixedly connected to a spiral plate.

[0011] Preferably, when the first arc fan blade and the second arc fan blade are blown toward the airflow, the corresponding spiral plates will rotate in opposite directions. When the same airflow pushes the first arc fan blade and the second arc fan blade to rotate, the first arc fan blade rotates with the spiral plate, causing the spiral plate to push the outside cold air into the fixed shell through the air inlet pipe to cool the PCB circuit board. The second arc fan blade rotates with the spiral plate, causing the hot air inside the fixed shell to be discharged out of the fixed shell through the exhaust pipe.

[0012] The present invention provides a PCB circuit board that is easy to dissipate heat and has the following beneficial effects: 1. The PCB circuit board which is convenient for heat dissipation is continuously extended and retracted by the telescopic rod, so that the fixed outer shell is continuously moved back and forth between the two outer shells, thereby making the space between the inner shell and the corresponding outer shell continuously expand and shrink, and the heat generated by the operation of the PCB circuit board is extracted together with the air, and then the air cooled by heat conduction is sent back, so that the PCB circuit board can be cooled, thereby preventing the PCB circuit board from overheating.

[0013] 2. The PCB circuit board that is easy to dissipate heat, by allowing the airflow to pass through the corresponding sand-proof shell, the airflow will make the first arc fan blade and the second arc fan blade rotate, and then make them rotate with the corresponding spiral plate, one of the spiral plates pushes the external cold air into the fixed shell through the air inlet pipe, and the other spiral plate discharges the hot air inside the fixed shell through the exhaust pipe. The cold air flowing into the outside is used to dissipate the heat of the PCB circuit board, thereby preventing the PCB circuit board from overheating.

[0014] 3. The PCB circuit board which is easy to dissipate heat can make the fixed shell move back and forth between the two outer shells through the continuous extension and retraction of the telescopic rod, so that the fixed shell swings back and forth with the intake pipe and the exhaust pipe, and then the corresponding sand-proof net swings back and forth together, so that the sand-proof net can shake off the fine sand attached to the surface, thereby increasing the gas flow, improving the heat dissipation effect, and further preventing the PCB circuit board from overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the main stereoscopic structure of the present invention; Figure 2 for Figure 1 Schematic diagram of the cross-section structure; Figure 3 It is a bottom-up three-dimensional structural schematic diagram of the present invention; Figure 4 It is a top view of the three-dimensional structure of the present invention; Figure 5 for Figure 4 Schematic diagram of the cross-section structure; Figure 6 This is a schematic diagram of the air intake pipe structure of the present invention; Figure 7 for Figure 1 A schematic diagram of the enlarged structure of the middle part A; Figure 8 It is a schematic diagram of the spiral plate structure of the present invention.

[0016] In the figure: 1. PCB circuit board; 2. fixed shell; 3. moving mechanism; 301. inner shell; 302. outer shell; 303. outer end resistance plate; 304. heat conducting plate; 305. telescopic rod; 306. outer fixed tube; 307. outer movable rod; 308. inner limiting rod; 4. pneumatic heat dissipation mechanism; 401. air inlet pipe; 402. exhaust pipe; 403. solenoid valve; 404. anti-sand shell; 405. guide plate; 406. anti-sand net; 407. first arc fan blade; 408. second arc fan blade; 409. spiral plate. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0018] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0019] Example 1: Please refer to Figure 1-5 The present invention provides a technical solution: a PCB circuit board that is easy to dissipate heat, comprising a PCB circuit board 1, a fixed shell 2 is arranged outside the PCB circuit board 1, the PCB circuit board 1 is fixedly connected inside the fixed shell 2, a moving mechanism 3 is fixedly connected to the outer wall of the fixed shell 2, and a pneumatic heat dissipation mechanism 4 is fixedly connected to the top of the fixed shell 2; The moving mechanism 3 comprises: The inner casing 301 is fixedly connected to the right side of the fixed outer casing 2; An outer shell 302, the outer shell 302 is movably connected to the outer wall of the inner shell 301; The telescopic rod 305 is fixedly connected to the bottom of the fixed shell 2, and the other end of the telescopic rod 305 is fixedly connected to the outer shell 302.

[0020] The PCB circuit board 1 is connected to the corresponding circuit through the openings provided on the outer wall of the fixed housing 2. When the PCB circuit board 1 starts to work, the telescopic rod 305 also starts to work at the same time, allowing the telescopic rod 305 to continuously extend and retract.

[0021] The left side of the fixed outer shell 2 is fixedly connected with an inner shell 301 , the outer wall of the inner shell 301 is movably connected with an outer shell 302 , and the outer sides of the two outer shells 302 are fixedly connected with outer end resistance plates 303 .

[0022] When the telescopic rod 305 is extended or retracted, the outer end resistance plate 303 will increase the resistance of the outer shell 302 in the sand, thereby allowing the two outer shells 302 to maintain a fixed position in the sand. The telescopic rod 305 is continuously extended or retracted, causing the fixed outer shell 2 to continuously move back and forth between the two outer shells 302.

[0023] This will cause the space between the inner shell 301 and the corresponding outer shell 302 to continue to expand and shrink. When the space becomes larger, the air inside the fixed shell 2 will be drawn into the outer shell 302, so that the heat generated by the operation of the PCB circuit board 1 can be drawn out through the air, and the heat can be transferred to the nearby sand through the outer walls of the inner shell 301, the outer shell 302 and the outer end resistance plate 303. When the space becomes smaller, the drawn air will be sent back to the fixed shell 2, and the returned air will be air that has been cooled by heat conduction, so that this air can cool the PCB circuit board 1.

[0024] The top and bottom of the fixed housing 2 are both fixedly connected with a heat conducting plate 304, and the heat conducting plate 304 serves to expand the contact surface.

[0025] When the PCB circuit board 1 is working, it will transfer the heat to the sand through the heat conducting plate 304 on the outer wall of the fixed shell 2. As the fixed shell 2 is driven by the telescopic rod 305 to move left and right, the heat conducting plate 304 will also move left and right, and then the heat conducting plate 304 will transfer the heat to one part of the sand, and then immediately move to another place, allowing the sand that has just absorbed heat to dissipate the heat alone, and then the heat conducting plate 304 moves back, allowing the heat conducting plate 304 to continue to conduct heat, thereby further expanding the heat dissipation contact area.

[0026] The outer wall of the outer shell 302 is fixedly connected to an outer fixed tube 306, the outer fixed tube 306 is movably connected to an outer movable rod 307, the outer movable rod 307 is movably connected to an inner limiting rod 308, the inner limiting rod 308 is fixedly connected to the inner wall of the outer shell 302, and the inner limiting rod 308 can limit the range of movement of the outer movable rod 307.

[0027] When the PCB circuit board 1 inside the fixed shell 2 is overheated, the air inside the fixed shell 2 will expand. The expanded air will push the outer movable rod 307 in the outer fixed tube 306 outward, thereby avoiding overheating and causing excessive pressure of the air inside the fixed shell 2. At the same time, the movement of the outer movable rod 307 outward will increase the heat conduction area between the internal air and the sand, thereby promoting heat dissipation.

[0028] Example 2: Please refer to Figure 1-8 Based on the first embodiment, the present invention provides a technical solution: The pneumatic heat dissipation mechanism 4 includes an air intake pipe 401, which is fixedly connected to the top of the fixed shell 2, to which an exhaust pipe 402 is fixedly connected, the bottom of the air intake pipe 401 is arranged on the top of the PCB circuit board 1, and the exhaust pipe 402 is arranged at the bottom of the PCB circuit board 1. The air intake pipe 401 and the exhaust pipe 402 are both fixedly connected with an electromagnetic valve 403. When the electromagnetic valve 403 is opened, the outside air can enter the fixed shell 2 through the air intake pipe 401, and the air inside the fixed shell 2 can be discharged to the outside through the exhaust pipe 402. The electromagnetic valve 403 is closed during the day to prevent the hot air flow in the desert from entering the fixed shell 2 during the day and interfering with the heat dissipation.

[0029] When night falls in the desert, the temperature on the sand surface drops sharply, and the solenoid valve 403 opens, allowing the air intake pipe 401 to push the cold air from the outside into the fixed shell 2, while the exhaust pipe 402 discharges the air inside the fixed shell 2 to the outside. At the same time, the air pushed in by the air intake pipe 401 passes through the top of the PCB circuit board 1, and the air flows and moves to the bottom of the PCB circuit board 1 and is discharged through the exhaust pipe 402, so that it can better contact the PCB circuit board 1 to dissipate heat.

[0030] The tops of the air inlet pipe 401 and the exhaust pipe 402 are both movably connected with a sand-proof shell 404 , the tops of the sand-proof shell 404 are both fixedly connected with a guide plate 405 , and the back and front of the sand-proof shell 404 are both fixedly connected with a sand-proof net 406 .

[0031] At night in the desert, the airflow in the air will push the guide plate 405 to rotate the sand-proof shell 404, and then the corresponding sand-proof net 406 will face the direction of the airflow, and then the airflow will pass through the corresponding two sand-proof nets 406. The sand-proof nets 406 will block the fine sand contained in the airflow to prevent the fine sand from contacting the PCB circuit board 1 along the flow channel. At the same time, the continuous extension and retraction of the telescopic rod 305 will allow the fixed shell 2 to move back and forth between the two outer shells 302, so that the fixed shell 2 will swing back and forth with the air inlet pipe 401 and the exhaust pipe 402, and then the corresponding sand-proof nets 406 will swing back and forth together, which will make the sand-proof nets 406 shake off the fine sand attached to the surface, thereby increasing the gas throughput and improving the heat dissipation effect.

[0032] The top of the air inlet pipe 401 is located inside the corresponding sand-proof shell 404 and is movably connected to the first arc-shaped fan blade 407. The top of the exhaust pipe 402 is located inside the corresponding sand-proof shell 404 and is movably connected to the second arc-shaped fan blade 408. The bottoms of the first arc-shaped fan blade 407 and the second arc-shaped fan blade 408 are fixedly connected to spiral plates 409.

[0033] When the first arc-shaped blade 407 and the second arc-shaped blade 408 are blown toward the airflow, the corresponding spiral plate 409 will rotate in the opposite direction.

[0034] When the airflow passes through the corresponding sand-proof shell 404, the airflow will cause the first arc-shaped fan blade 407 and the second arc-shaped fan blade 408 to rotate, and then the first arc-shaped fan blade 407 and the second arc-shaped fan blade 408 will cause the corresponding spiral plate 409 to rotate. When the first arc-shaped fan blade 407 rotates with the spiral plate 409, the spiral plate 409 will push the cold air from the outside into the fixed shell 2 through the air inlet pipe 401 to cool the PCB circuit board 1. At the same time, when the second arc-shaped fan blade 408 rotates with the spiral plate 409, the hot air inside the fixed shell 2 will be discharged from the fixed shell 2 through the exhaust pipe 402, so that the fixed shell 2 continuously flows in the cold air from the outside through the air inlet pipe 401 to dissipate the heat of the PCB circuit board 1.

[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A PCB circuit board that is convenient for heat dissipation, comprising a PCB circuit board (1), characterized in that: A fixed housing (2) is arranged outside the PCB circuit board (1), the PCB circuit board (1) is fixedly connected inside the fixed housing (2), a moving mechanism (3) is fixedly connected to the outer wall of the fixed housing (2), and a pneumatic heat dissipation mechanism (4) is fixedly connected to the top of the fixed housing (2); The moving mechanism (3) comprises: An inner casing (301), wherein the inner casing (301) is fixedly connected to the right side of the fixed outer casing (2); An outer shell (302), wherein the outer shell (302) is movably connected to the outer wall of the inner shell (301); A telescopic rod (305), wherein the telescopic rod (305) is fixedly connected to the bottom of the fixed outer shell (2), and the other end of the telescopic rod (305) is fixedly connected to the outer shell (302).

2. A PCB circuit board for heat dissipation according to claim 1, characterized in that: The left side of the fixed outer shell (2) is fixedly connected to an inner shell (301), the outer wall of the inner shell (301) is movably connected to an outer shell (302), and the outer sides of the two outer shells (302) are fixedly connected to outer end resistance plates (303).

3. A PCB circuit board for heat dissipation according to claim 1, characterized in that: The top and bottom of the fixed housing (2) are both fixedly connected with a heat conducting plate (304), and the heat conducting plate (304) serves to expand the contact surface.

4. A PCB circuit board for heat dissipation according to claim 1, characterized in that: The outer wall of the outer shell (302) is fixedly connected to an outer fixed tube (306), the outer fixed tube (306) is movably connected to an outer movable rod (307), the outer movable rod (307) is movably connected to an inner limiting rod (308), the inner limiting rod (308) is fixedly connected to the inner wall of the outer shell (302), and the inner limiting rod (308) can limit the range of movement of the outer movable rod (307).

5. A PCB circuit board for heat dissipation according to claim 1, characterized in that: The pneumatic heat dissipation mechanism (4) comprises an air intake pipe (401), the air intake pipe (401) is fixedly connected to the top of the fixed housing (2), the top of the fixed housing (2) is fixedly connected to an exhaust pipe (402), the bottom of the air intake pipe (401) is arranged on the top of the PCB circuit board (1), the exhaust pipe (402) is arranged on the bottom of the PCB circuit board (1), and the interiors of the air intake pipe (401) and the exhaust pipe (402) are both fixedly connected to an electromagnetic valve (403).

6. A PCB circuit board for facilitating heat dissipation according to claim 5, characterized in that: The tops of the air inlet pipe (401) and the exhaust pipe (402) are both movably connected with a sand-proof shell (404), the tops of the sand-proof shell (404) are both fixedly connected with a guide plate (405), and the back and front of the sand-proof shell (404) are both fixedly connected with a sand-proof net (406).

7. A PCB circuit board for facilitating heat dissipation according to claim 6, characterized in that: The top of the air inlet pipe (401) is located inside the corresponding sand-proof shell (404) and is movably connected to a first arc-shaped fan blade (407); the top of the exhaust pipe (402) is located inside the corresponding sand-proof shell (404) and is movably connected to a second arc-shaped fan blade (408); and the bottoms of the first arc-shaped fan blade (407) and the second arc-shaped fan blade (408) are fixedly connected to a spiral plate (409).

8. A PCB circuit board for facilitating heat dissipation according to claim 7, characterized in that: When the first arc-shaped fan blade (407) and the second arc-shaped fan blade (408) are blown toward the airflow, the corresponding spiral plates (409) are caused to rotate in opposite directions.

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