PCB circuit board facilitating heat dissipation

Abstract

This invention discloses a PCB circuit board with convenient heat dissipation, relating to the field of application-specific integrated circuit (ASIC) technology. The heat-dissipating PCB circuit board includes a PCB circuit board with a fixed outer shell. The PCB circuit board is fixedly connected inside the fixed outer shell. A moving mechanism is fixedly connected to the outer wall of the fixed outer shell, and a pneumatic heat dissipation mechanism is fixedly connected to the top of the fixed outer shell. The moving mechanism includes an inner shell, which is fixedly connected to the right side of the fixed outer shell. This heat-dissipating PCB circuit board utilizes a telescopic rod to continuously extend and retract, causing the fixed outer shell to move back and forth between two outer shells. This causes the space between the inner shell and the corresponding outer shell to continuously increase and decrease, drawing away the heat generated by the PCB circuit board through the air, and then returning the thermally cooled air, thus effectively cooling the PCB circuit board.

Description

Technical Field

[0001] This invention relates to the field of application-specific integrated circuit (ASIC) technology, specifically to a PCB circuit board that facilitates heat dissipation. Background Technology

[0002] PCB, short for Printed Circuit Board, is an indispensable key component in electronic devices. As an important electronic component, it provides electrical connections for electronic components, achieving electrical connections through printed circuits. The manufacturing process of PCB is complex, involving multiple processes such as drilling, copper plating, and etching to ensure its stable and reliable performance. It is widely used in many fields such as computers, communications, and consumer electronics, and is the cornerstone of the modern electronics industry.

[0003] Patent application number CN202320124782.4 discloses a PCB circuit board that facilitates heat dissipation. The main body of the circuit board has eight layers, and a middle support plate is set in the middle of the eight-layer circuit board. An upper clamping plate and a bottom clamping plate are respectively set on the outer side of the main body of the circuit board. The upper clamping plate is set above the bottom clamping plate. The ends of the middle support plate, the upper clamping plate and the bottom clamping plate are welded and fixed to an exhaust pipe. A bracket is welded to the inner surface of the exhaust pipe, and an exhaust fan is installed on the bracket.

[0004] In desert regions, some detection equipment is often buried underground along with PCB circuit boards to conduct geological surveys of the desert. Generally, the PCB circuit boards are allowed to passively dissipate heat through contact with the sand. Since sand has a low thermal conductivity, this heat dissipation efficiency is low, and the PCB is prone to overheating and damage. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the present invention provides a PCB circuit board that facilitates heat dissipation, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution: a PCB circuit board that facilitates heat dissipation, comprising a PCB circuit board, a fixed outer shell provided on the outside of the PCB circuit board, the PCB circuit board being fixedly connected inside the fixed outer shell, a moving mechanism being fixedly connected to the outer wall of the fixed outer shell, and a pneumatic heat dissipation mechanism being fixedly connected to the top of the fixed outer shell.

[0007] Mobile institutions include:

[0008] Inner shell, which is fixedly connected to the right side of the fixed outer shell;

[0009] The outer shell is movably connected to the outer wall of the inner shell. The telescopic rod continuously extends and retracts, causing the fixed outer shell to move back and forth between the two outer shells, thereby causing the space between the inner shell and the corresponding outer shell to continuously increase and decrease.

[0010] The telescopic rod is fixedly connected to the bottom of the fixed outer shell, and the other end of the telescopic rod is fixedly connected to the outer shell.

[0011] Preferably, an inner shell is fixedly connected to the left side of the fixed outer shell, and an outer shell is movably connected to the outer wall of the inner shell. Both outer shells are fixedly connected to an outer end resistance plate. When the telescopic rod extends or retracts, the outer end resistance plate increases the resistance of the outer shell in the sand, thereby keeping the two outer shells in a fixed position in the sand.

[0012] Preferably, heat-conducting plates are fixedly connected to the top and bottom of the fixed housing. The heat-conducting plates expand the contact surface. When the PCB circuit board is working, it will transfer heat to the sand through the heat-conducting plates on the outer wall of the fixed housing. As the fixed housing is moved left and right by the telescopic rod, the heat-conducting plates will also move left and right.

[0013] Preferably, an outer fixing tube is fixedly connected to the outer wall of the outer shell, an outer movable rod is movably connected inside the outer fixing tube, an inner limiting rod is movably connected inside the outer movable rod, and the inner limiting rod is fixedly connected to the inner wall of the outer shell, and the inner limiting rod can limit the range of movement of the outer movable rod.

[0014] Preferably, the pneumatic heat dissipation mechanism includes an air intake pipe, which is fixedly connected to the top of the fixed housing. An exhaust pipe is fixedly connected to the top of the fixed housing. The bottom of the air intake pipe is located at the top of the PCB circuit board, and the exhaust pipe is located at the bottom of the PCB circuit board. Solenoid valves are fixedly connected inside both the air intake pipe and the exhaust pipe. When the solenoid valves are opened, outside air can enter the inside of the fixed housing through the air intake pipe, and at the same time, the air inside the fixed housing can be discharged to the outside through the exhaust pipe.

[0015] Preferably, both the intake pipe and the exhaust pipe are movably connected to a sandproof shell at their tops, and each sandproof shell is fixedly connected to a guide plate at its top. The airflow in the air pushes the guide plate, causing the sandproof shell to rotate, thereby aligning the corresponding sandproof mesh with the direction of the airflow, allowing the airflow to pass through the two corresponding sandproof meshes. Sandproof meshes are fixedly connected to both the back and front of the sandproof shell. As the airflow passes through the sandproof meshes, the sandproof meshes block the fine sand contained in the airflow, preventing the fine sand from contacting the PCB circuit board along the flow channel.

[0016] Preferably, the top of the air intake pipe is movably connected to a first arc-shaped fan blade inside the corresponding sandproof shell, and the top of the exhaust pipe is movably connected to a second arc-shaped fan blade inside the corresponding sandproof shell. Both the bottom of the first arc-shaped fan blade and the second arc-shaped fan blade are fixedly connected to a spiral plate.

[0017] Preferably, when the first and second arc-shaped fan blades are blown by the airflow, the corresponding spiral plates will rotate in opposite directions. When the same airflow pushes the first and second arc-shaped fan blades to rotate, the first arc-shaped fan blade rotates with the spiral plate, which pushes the cold air from the outside into the fixed housing through the air intake pipe to cool the PCB circuit board. The second arc-shaped fan blade rotates with the spiral plate, which exhausts the hot air inside the fixed housing through the exhaust pipe.

[0018] This invention provides a PCB circuit board that facilitates heat dissipation. It has the following beneficial effects:

[0019] 1. This heat-dissipating PCB circuit board uses a telescopic rod to continuously extend and retract, allowing the fixed outer shell to move back and forth between the two outer shells. This causes the space between the inner shell and the corresponding outer shell to continuously increase and decrease, drawing away the heat generated by the PCB circuit board through the air, and then returning the heat-conducting and cooled air, thus cooling the PCB circuit board and preventing it from overheating.

[0020] 2. This heat-dissipating PCB circuit board allows airflow to pass through the corresponding sandproof shell, causing the first and second arc-shaped fan blades to rotate, which in turn rotates the corresponding spiral plates. One spiral plate pushes cool air from the outside into the fixed shell through the air intake pipe, while the other spiral plate exhausts hot air from inside the fixed shell through the exhaust pipe. The inflow of cool air from the outside dissipates heat from the PCB circuit board, thus preventing the PCB circuit board from overheating.

[0021] 3. This heat-dissipating PCB circuit board, through the continuous extension and retraction of the telescopic rod, allows the fixed outer shell to move back and forth between the two outer shells. This causes the fixed outer shell, along with the air intake and exhaust pipes, to sway back and forth, which in turn causes the corresponding sandproof mesh to sway back and forth as well. This allows the sandproof mesh to shake off the fine sand adhering to the surface, thereby increasing the airflow and improving the heat dissipation effect, further preventing the PCB circuit board from overheating. Attached Figure Description

[0022] Figure 1 This is a front-view stereoscopic structural diagram of the present invention;

[0023] Figure 2 for Figure 1 Schematic diagram of cross-section structure;

[0024] Figure 3 This is a schematic diagram of the three-dimensional structure of the present invention viewed from below;

[0025] Figure 4 This is a top-view three-dimensional structural diagram of the present invention;

[0026] Figure 5 for Figure 4 Schematic diagram of cross-section structure;

[0027] Figure 6 This is a schematic diagram of the intake pipe structure of the present invention;

[0028] Figure 7 for Figure 1 Enlarged structural diagram of section A in the middle;

[0029] Figure 8 This is a schematic diagram of the spiral plate structure of the present invention.

[0030] In the diagram: 1. PCB circuit board; 2. Fixed outer shell; 3. Moving mechanism; 301. Inner shell; 302. Outer shell; 303. Outer end resistance plate; 304. Heat conduction plate; 305. Telescopic rod; 306. Outer fixed tube; 307. Outer movable rod; 308. Inner limiting rod; 4. Pneumatic heat dissipation mechanism; 401. Air inlet pipe; 402. Exhaust pipe; 403. Solenoid valve; 404. Sandproof shell; 405. Guide plate; 406. Sandproof net; 407. First arc-shaped fan blade; 408. Second arc-shaped fan blade; 409. Spiral plate. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0032] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention.

[0033] Example 1: Please refer to Figure 1-5 The present invention provides a technical solution: a PCB circuit board that facilitates heat dissipation, including a PCB circuit board 1, a fixed outer shell 2 is provided on the outside of the PCB circuit board 1, the PCB circuit board 1 is fixedly connected inside the fixed outer shell 2, a moving mechanism 3 is fixedly connected to the outer wall of the fixed outer shell 2, and a pneumatic heat dissipation mechanism 4 is fixedly connected to the top of the fixed outer shell 2.

[0034] Mobile mechanism 3 includes:

[0035] Inner shell 301 is fixedly connected to the right side of fixed outer shell 2;

[0036] Outer shell 302, which is movably connected to the outer wall of inner shell 301;

[0037] Telescopic rod 305 is fixedly connected to the bottom of fixed housing 2, and the other end of telescopic rod 305 is fixedly connected to outer housing 302.

[0038] The PCB circuit board 1 is connected to the corresponding circuit through the opening provided on the outer wall of the fixed housing 2. When the PCB circuit board 1 starts to work, the telescopic rod 305 also starts to work at the same time, so that the telescopic rod 305 continuously extends and retracts.

[0039] An inner shell 301 is fixedly connected to the left side of the fixed outer shell 2. An outer shell 302 is movably connected to the outer wall of the inner shell 301. An outer end resistance plate 303 is fixedly connected to the outer side of both outer shells 302.

[0040] When the telescopic rod 305 extends or retracts, the outer end resistance plate 303 increases the resistance of the outer shell 302 in the sand, which in turn keeps the two outer shells 302 in a fixed position in the sand. As the telescopic rod 305 extends or retracts continuously, the fixed outer shell 2 will move back and forth between the two outer shells 302.

[0041] This causes the space between the inner shell 301 and the corresponding outer shell 302 to continuously increase and decrease. When the space increases, the air inside the fixed outer shell 2 is drawn into the outer shell 302, which helps to remove the heat generated by the PCB circuit board 1 during operation. The heat is then transferred to the sand nearby through the outer walls of the inner shell 301, the outer shell 302, and the outer end resistance plate 303. When the space decreases, the drawn-in air is returned to the fixed outer shell 2. The returned air is thermally cooled, which helps to cool the PCB circuit board 1.

[0042] The top and bottom of the fixed outer casing 2 are both fixedly connected to heat-conducting plates 304, which serve to expand the contact surface.

[0043] When the PCB circuit board 1 is working, it transfers heat to the sand through the heat-conducting plate 304 on the outer wall of the fixed housing 2. As the fixed housing 2 is moved left and right by the telescopic rod 305, the heat-conducting plate 304 also moves left and right, thus transferring heat to one part of the sand. Then it immediately moves to another place, allowing the sand that just absorbed heat to dissipate heat independently. Then the heat-conducting plate 304 moves back, allowing it to continue conducting heat, which further expands the heat dissipation contact area.

[0044] An outer fixing tube 306 is fixedly connected to the outer wall of the outer casing 302. An outer movable rod 307 is movably connected inside the outer fixing tube 306. An inner limiting rod 308 is movably connected inside the outer movable rod 307. The inner limiting rod 308 is fixedly connected to the inner wall of the outer casing 302 and can limit the range of movement of the outer movable rod 307.

[0045] When the PCB circuit board 1 inside the fixed housing 2 overheats, the air inside the fixed housing 2 expands. The expanded air pushes the outer movable rod 307 inside the outer fixed tube 306 outward, thereby preventing the air pressure inside the fixed housing 2 from becoming too high due to overheating. At the same time, the outward movement of the outer movable rod 307 increases the heat conduction area between the internal air and the sand, thus promoting heat dissipation.

[0046] Example 2: Please refer to Figure 1-8 Based on Embodiment 1, the present invention provides a technical solution:

[0047] The pneumatic cooling mechanism 4 includes an air inlet pipe 401, which is fixedly connected to the top of the fixed housing 2. An exhaust pipe 402 is fixedly connected to the top of the fixed housing 2. The bottom of the air inlet pipe 401 is located at the top of the PCB circuit board 1, and the exhaust pipe 402 is located at the bottom of the PCB circuit board 1. Solenoid valves 403 are fixedly connected inside both the air inlet pipe 401 and the exhaust pipe 402. When the solenoid valve 403 is open, it allows outside air to enter the fixed housing 2 through the air inlet pipe 401, and at the same time, the air inside the fixed housing 2 can be discharged to the outside through the exhaust pipe 402. The solenoid valve 403 is closed during the day to prevent hot air from the desert from entering the fixed housing 2 and interfering with the cooling.

[0048] As night falls in the desert, the temperature on the sand surface drops sharply. The solenoid valve 403 opens, allowing the intake pipe 401 to push the cold air from the outside into the fixed housing 2. At the same time, the exhaust pipe 402 will exhaust the air inside the fixed housing 2 to the outside. Meanwhile, the air pushed in by the intake pipe 401 will pass over the top of the PCB circuit board 1 and move to the bottom of the PCB circuit board 1 through the flow, and then be discharged through the exhaust pipe 402, which can better contact the PCB circuit board 1 for heat dissipation.

[0049] Both the top of the intake pipe 401 and the exhaust pipe 402 are movably connected to a sandproof shell 404, and the top of the sandproof shell 404 is fixedly connected to a guide plate 405. Both the back and front of the sandproof shell 404 are fixedly connected to a sandproof net 406.

[0050] On a desert night, the airflow pushes the guide plate 405, causing the sand-proof shell 404 to rotate. This aligns the corresponding sand-proof net 406 with the airflow direction, allowing the airflow to pass through the two sand-proof nets 406. The sand-proof nets 406 block the fine sand contained in the airflow, preventing it from contacting the PCB circuit board 1 along with the flow channel. Simultaneously, the continuous extension and retraction of the telescopic rod 305 causes the fixed shell 2 to move back and forth between the two outer shells 302. This causes the fixed shell 2, along with the air intake pipe 401 and exhaust pipe 402, to sway back and forth, causing the corresponding sand-proof nets 406 to sway back and forth as well. This shakes off the fine sand adhering to the surface of the sand-proof nets 406, thereby increasing the airflow and improving heat dissipation.

[0051] The top of the intake pipe 401 is movably connected to the corresponding sandproof shell 404 and the top of the exhaust pipe 402 is movably connected to the corresponding sandproof shell 404 and the bottom of the first arc-shaped fan blade 407 and the second arc-shaped fan blade 408 are both fixedly connected to the spiral plate 409.

[0052] When the first arc-shaped fan blade 407 and the second arc-shaped fan blade 408 are blown by the airflow, the corresponding spiral plate 409 will rotate in opposite directions.

[0053] As the airflow passes through the corresponding sandproof shell 404, it causes the first arc-shaped fan blade 407 and the second arc-shaped fan blade 408 to rotate. This, in turn, causes the first arc-shaped fan blade 407 and the second arc-shaped fan blade 408 to rotate the corresponding spiral plate 409. When the first arc-shaped fan blade 407 rotates with the spiral plate 409, the spiral plate 409 pushes the outside cold air into the fixed shell 2 through the air intake pipe 401 to cool the PCB circuit board 1. At the same time, when the second arc-shaped fan blade 408 rotates with the spiral plate 409, it exhausts the hot air inside the fixed shell 2 through the exhaust pipe 402. This allows the fixed shell 2 to continuously receive outside cold air through the air intake pipe 401 to dissipate heat from the PCB circuit board 1.

[0054] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A PCB circuit board that facilitates heat dissipation, comprising a PCB circuit board (1), characterized in that: The PCB circuit board (1) is provided with a fixed shell (2) on the outside. The PCB circuit board (1) is fixedly connected inside the fixed shell (2). A moving mechanism (3) is fixedly connected to the outer wall of the fixed shell (2). A pneumatic heat dissipation mechanism (4) is fixedly connected to the top of the fixed shell (2). The mobile mechanism (3) includes: Inner shell (301), which is fixedly connected to the right side of the fixed outer shell (2); Outer shell (302), which is movably connected to the outer wall of inner shell (301); Telescopic rod (305), the telescopic rod (305) is fixedly connected to the bottom of the fixed outer shell (2), and the other end of the telescopic rod (305) is fixedly connected to the outer shell (302); The fixed outer shell (2) is fixedly connected to the left side of the inner shell (301), and the outer shell (302) is movably connected to the outer wall of the inner shell (301). Both outer shells (302) are fixedly connected to the outer side of the outer end resistance plate (303).

2. The PCB circuit board with heat dissipation as described in claim 1, characterized in that: The fixed outer shell (2) is fixedly connected to a heat-conducting plate (304) at both the top and bottom, and the heat-conducting plate (304) serves to expand the contact surface.

3. The PCB circuit board with heat dissipation as described in claim 1, characterized in that: The outer shell (302) is fixedly connected to an outer fixing tube (306), and an outer movable rod (307) is movably connected inside the outer fixing tube (306). An inner limiting rod (308) is movably connected inside the outer movable rod (307). The inner limiting rod (308) is fixedly connected to the inner wall of the outer shell (302), and the inner limiting rod (308) can limit the range of movement of the outer movable rod (307).

4. A PCB circuit board for easy heat dissipation according to claim 1, characterized in that: The pneumatic heat dissipation mechanism (4) includes an air inlet pipe (401), which is fixedly connected to the top of the fixed housing (2). An exhaust pipe (402) is fixedly connected to the top of the fixed housing (2). The bottom of the air inlet pipe (401) is located on the top of the PCB circuit board (1), and the exhaust pipe (402) is located on the bottom of the PCB circuit board (1). Solenoid valves (403) are fixedly connected inside both the air inlet pipe (401) and the exhaust pipe (402).

5. A PCB circuit board for easy heat dissipation according to claim 4, characterized in that: The top of the air intake pipe (401) and the exhaust pipe (402) are movably connected to a sandproof shell (404), the top of the sandproof shell (404) is fixedly connected to a guide plate (405), and the back and front of the sandproof shell (404) are fixedly connected to a sandproof net (406).

6. A PCB circuit board for easy heat dissipation according to claim 5, characterized in that: The top of the air intake pipe (401) is movably connected to the corresponding sandproof shell (404) with a first arc-shaped fan blade (407), and the top of the exhaust pipe (402) is movably connected to the corresponding sandproof shell (404) with a second arc-shaped fan blade (408). The bottom of the first arc-shaped fan blade (407) and the second arc-shaped fan blade (408) are both fixedly connected with a spiral plate (409).

7. A PCB circuit board for easy heat dissipation according to claim 6, characterized in that: When the first arc-shaped fan blade (407) and the second arc-shaped fan blade (408) are blown by the airflow, the corresponding spiral plate (409) will rotate in opposite directions.

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