Chip with heat dissipation structure and manufacturing process

Abstract

The application relates to the technical field of semiconductors, and particularly discloses a chip with a heat dissipation structure and a preparation process, which comprises components, a circuit board and a heat dissipation device, the components and the circuit board are connected with the heat dissipation device respectively, the circuit board is provided with a containing hole, the components are arranged at the containing hole in correspondence, and at least a part of the components is connected with the heat dissipation device. The heat conductivity coefficient of the circuit board is larger than that of a traditional PCB circuit board, and the components and the circuit board are connected with the heat dissipation device respectively, so that the components do not need to conduct heat through the circuit board during heat dissipation, the heat dissipation effect of the components can be greatly improved, the heat on the circuit board can be reduced, and the heat dissipation capacity of the whole chip is further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, more particularly, the present application relates to a chip with a heat dissipation structure and a preparation process. BACKGROUND

[0002] With the rapid development of science and technology, various electronic devices have higher and higher power, especially power modules, which have smaller and smaller size. Because electronic components are arranged too closely, heat is concentrated in the device. If the heat cannot be effectively dissipated to the outside, the electronic device will work for a long time at high temperature, which will cause various forms of failure, thereby greatly limiting the use range, service life and performance stability of the electronic device.

[0003] The most effective conduction mode of chip device heat is to exchange heat with the outside through the bottom of the solder pad, the PCB circuit board, the interface material and the heat sink in turn. The thermal conductivity coefficient of the traditional PCB circuit board is 0.2-5 W / m·K, and the heat of the chip device is transmitted to the heat sink through the PCB circuit board and the thermal conductive interface material.

[0004] The surface of the heat sink can be clearly seen to have obvious unevenness under magnification. When the PCB circuit board contacts the heat sink, there is a gap between the contact surfaces of the two. Because air has very poor heat transfer performance, contact thermal resistance is generated. When a large amount of heat passes through the contact surface, a large temperature difference will be generated. At present, the thermal conductive interface material fills the contact surface and expels air from the contact surface, thereby reducing the contact thermal resistance. However, the thermal conductive interface material, such as thermal conductive silicone grease (thermal conductivity coefficient 1-8 W / m·K), has a limited thermal conductivity coefficient. Due to the influence of vibration between the power device and the shell, the gap between the contact surfaces changes slightly, and the thermal conductive silicone grease will change the thermal resistance with the change of the gap.

[0005] For high-power device heat dissipation applications such as IGBT (Insulated Gate Bipolar Transistor), the heat flux tends to be high-power and high-integration, and the module also continuously generates a large amount of heat due to its high-frequency conduction and opening and closing. The weakness of the IGBT power semiconductor module is overheating, and the thermal management problem is critical. The material thermal conductivity coefficient of the PCB circuit board and the thermal conductive interface material become the bottleneck of the thermal management of the power device.

[0006] Therefore, it is necessary to provide a chip with a heat dissipation structure and a preparation process to at least partially solve the problems in the prior art. SUMMARY

[0007] A series of simplified concepts are introduced in the part of the summary of the invention, which will be further described in detail in the part of the specific embodiments. The part of the summary of the invention does not mean to try to define the key features and essential technical features of the claimed technical solutions, and does not mean to try to determine the protection scope of the claimed technical solutions.

[0008] To at least partially solve the above problems, the present application provides a chip with a heat dissipation structure, comprising: components, a circuit board and a heat sink, the components and the circuit board are connected with the heat sink respectively; the circuit board is provided with a receiving hole, the components are arranged at the receiving hole correspondingly, and the components are connected with at least a part of the heat sink.

[0009] Preferably, the circuit board comprises an insulation layer and a circuit layer connected with each other, the components are electrically connected with the circuit layer, and the heat sink is connected with the insulation layer.

[0010] Preferably, the heat sink is provided with a heat dissipation flow channel, and a heat dissipation medium passing through the heat dissipation flow channel is gas or liquid.

[0011] Preferably, the heat sink is provided with a boss extending therefrom, the boss is arranged in the receiving hole, and the boss is connected with the components.

[0012] Preferably, the components are arranged in the receiving hole and connected with the heat sink.

[0013] The present application further provides a preparation process of the chip with the heat dissipation structure, comprising:

[0014] Covering a dry film on a target region of a surface of the heat sink where a boss is to be made;

[0015] Etching the surface of the heat sink according to the thickness of the circuit board and the size of the components to make the boss;

[0016] Making a receiving hole on the circuit board according to the size of the boss;

[0017] Positioning the boss of the heat sink in the receiving hole of the circuit board and pressing the heat sink and the circuit board;

[0018] Attaching the components to the boss and electrically connecting the components with the circuit layer of the circuit board.

[0019] Preferably, the positioning of the boss of the heat sink in the receiving hole of the circuit board and the pressing of the heat sink and the circuit board comprise:

[0020] Inserting a positioning plate on a positioning clamp mechanism into the receiving hole to clamp the circuit board;

[0021] The moving mechanism connected with the positioning and clamping mechanism is used to position and move the circuit board to the upper side of the convex post;

[0022] The circuit board is moved downward by the moving mechanism, so that the convex post is inserted into the accommodating hole, and the positioning plate is inserted into the gap between the convex post and the accommodating hole;

[0023] The moving mechanism is disconnected with the positioning and clamping mechanism, and the circuit board and the heat sink are pressed and connected;

[0024] After the pressing and connecting is finished, the moving mechanism is connected with the positioning and clamping mechanism, and the positioning and clamping mechanism is controlled to be disconnected with the circuit board and the heat sink.

[0025] Preferably, before the component is attached to the convex post, the method further comprises:

[0026] After the circuit board and the heat sink are pressed and connected, a gap is formed between the convex post and the accommodating hole, and the gap is filled with insulating material to form an insulating isolation layer.

[0027] The application also provides another preparation process of a chip with a heat dissipation structure, comprising:

[0028] An accommodating hole is made on the circuit board according to the size of the component;

[0029] The circuit board is connected with the heat sink;

[0030] The component is positioned and placed in the accommodating hole, and the component is attached to the heat sink through the heat-conducting solder.

[0031] Preferably, the component is positioned and placed in the accommodating hole, and the component is attached to the heat sink through the heat-conducting solder, comprising:

[0032] The component is clamped by the positioning plate on the positioning and clamping mechanism;

[0033] The moving mechanism connected with the positioning and clamping mechanism is used to position and move the component to the upper side of the circuit board;

[0034] The component is moved downward by the moving mechanism, so that the component is placed in the accommodating hole, and the positioning plate is inserted into the gap between the component and the accommodating hole; and the heat-conducting solder is arranged in the accommodating hole in advance;

[0035] The heat-conducting solder is heated, so that the component is connected with the heat sink;

[0036] After the component is connected with the heat sink, the positioning and clamping mechanism is disconnected with the circuit board and the component, and a gap is formed between the component and the accommodating hole;

[0037] The gap is filled with insulating material to form an insulating isolation layer.

[0038] Compared with the prior art, the present application at least includes the following beneficial effects:

[0039] The chip with the heat dissipation structure and the preparation process have the following advantages: the heat conductivity coefficient of the circuit board is larger than that of the traditional PCB circuit board, the circuit board and the components are connected with the heat sink respectively, the components do not need to conduct heat through the circuit board during heat dissipation, the heat dissipation effect of the components is greatly improved, the heat accumulation on the circuit board is reduced, and the heat dissipation capacity of the whole chip is further improved.

[0040] The chip with the heat dissipation structure and the preparation process, other advantages, objects and characteristics of the present application will be embodied in part through the following description, and will be understood by those skilled in the art through research and practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0041] The accompanying drawings are used to provide a further understanding of the present application, and constitute a part of the specification, together with the embodiments of the present application, to explain the present application, and do not constitute a limitation on the present application. In the drawings:

[0042] Figure 1 It is a schematic view of the connection structure of the heat dissipation structure and the chip in the prior art;

[0043] Figure 2 It is a schematic view of the structure of the chip with the heat dissipation structure adopting the boss and the air-cooled heat dissipation in the present application;

[0044] Figure 3 It is a schematic view of the structure of the chip with the heat dissipation structure adopting the boss and the liquid-cooled heat dissipation in the present application;

[0045] Figure 4 It is a schematic view of the structure of the chip with the heat dissipation structure adopting the components placed in the accommodating hole and the air-cooled heat dissipation in the present application;

[0046] Figure 5 It is a schematic view of the structure of the chip with the heat dissipation structure adopting the components placed in the accommodating hole and the liquid-cooled heat dissipation in the present application;

[0047] Figure 6 It is a schematic view of the structure of the chip with the heat dissipation structure in the first preparation process of the present application, in which the circuit board is clamped and located above the boss;

[0048] Figure 7 It is a schematic view of the structure of the chip with the heat dissipation structure in the first preparation process of the present application, in which the positioning and clamping mechanism limits the boss and the accommodating hole;

[0049] Figure 8The schematic view of the gap between the boss and the accommodating hole in the first preparation process of the chip with the heat dissipation structure;

[0050] Figure 9 The structure schematic view of the insulating isolation layer between the boss and the accommodating hole in the first preparation process of the chip with the heat dissipation structure;

[0051] Figure 10 The structure schematic view of the circuit board without the accommodating hole and the heat sink in the second preparation process of the chip with the heat dissipation structure;

[0052] Figure 11 The structure schematic view of the circuit board and the heat sink after being pressed together in the second preparation process of the chip with the heat dissipation structure;

[0053] Figure 12 The structure schematic view of the circuit board with the accommodating hole being clamped above the heat sink in the second preparation process of the chip with the heat dissipation structure;

[0054] Figure 13 The structure schematic view of the circuit board with the accommodating hole and the heat sink being pressed together in the second preparation process of the chip with the heat dissipation structure;

[0055] Figure 14 The structure schematic view of the component being clamped in the second preparation process of the chip with the heat dissipation structure;

[0056] Figure 15 The structure schematic view of the component and the accommodating hole being limited by the positioning and clamping mechanism in the second preparation process of the chip with the heat dissipation structure;

[0057] Figure 16 The schematic view of the gap between the component and the accommodating hole in the second preparation process of the chip with the heat dissipation structure;

[0058] Figure 17 The schematic view of the insulating isolation layer between the component and the accommodating hole in the second preparation process of the chip with the heat dissipation structure;

[0059] Figure 18 The internal structure schematic view of the positioning and clamping mechanism in the preparation process of the chip with the heat dissipation structure;

[0060] Figure 19 The bottom surface structure schematic view of the positioning and clamping mechanism in the preparation process of the chip with the heat dissipation structure;

[0061] Figure 20This is a schematic diagram of the internal structure of the positioning and clamping mechanism and the moving mechanism in the fabrication process of the chip with heat dissipation structure described in this invention. Detailed Implementation

[0062] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments, so that those skilled in the art can implement it based on the description.

[0063] It should be understood that terms such as “having,” “comprising,” and “including” as used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0064] like Figure 1 As shown, in the prior art, the PCB circuit board includes a circuit layer 22, a PCB thermally conductive insulating layer 10, and a PCB metal base 11. The component 1 is connected to the PCB circuit board through a solder paste layer 12, and the PCB circuit board is connected to the heat sink 3 through an interface material 13. The interface material 13 is generally thermally conductive silicone grease. The disadvantage of this connection method is that gaps are easily generated at the contact surface between the heat sink 3 and the PCB circuit board, which increases the thermal resistance and affects the heat dissipation effect of the component 1.

[0065] like Figures 2-5 As shown, the present invention provides a chip with a heat dissipation structure, including: a component 1, a circuit board 2 and a heat sink 3, wherein the component 1 and the circuit board 2 are respectively connected to the heat sink 3; the circuit board 2 is provided with a receiving hole 4, and the component 1 is correspondingly disposed at the receiving hole 4, and the component 1 is connected to at least a part of the heat sink 3.

[0066] The circuit board 2 includes single-layer, double-layer or multi-layer circuits. The material of the circuit board 2 includes one or more of the following: flame-retardant material FR4 (flame-retardant material grade code), IMS (insulating metal substrate), ceramic plate and glass substrate; the thermal conductivity of the circuit board 2 is 0.2-200 W / m·K.

[0067] In this invention, the receiving hole 4 on the circuit board 2 is used to connect the component 1 and the heat sink 3, so that the heat generated by the component 1 can be directly dissipated by the heat sink 3, and the heat generated by the circuit board 2 during operation is also dissipated through the heat sink 3.

[0068] The heat sink 3 can be made of copper, aluminum, or a composite material of copper and aluminum. Among them, the heat sink 3 made of copper has a thermal conductivity of 400 W / m·K, which can improve the heat dissipation effect of component 1 and circuit board 2.

[0069] Circuit board 2 and heat sink 3 are connected as one unit by pressing, such as hot pressing or cold pressing, which can improve the bonding ability between the two and reduce the gap between them, thereby reducing thermal resistance.

[0070] In the technical solution, the thermal conductivity of the circuit board 2 is greater than that of a traditional PCB, and the circuit board 2 and the component 1 are connected to the heat sink 3, so that the component 1 can dissipate heat without the need of the circuit board 2, thereby greatly improving the heat dissipation effect of the component 1 and reducing the heat accumulation on the circuit board 2, and further improving the heat dissipation capacity of the entire chip.

[0071] In one embodiment, the circuit board 2 comprises an insulating layer 21 and a circuit layer 22 connected to each other, the component 1 is electrically connected to the circuit layer 22, and the heat sink 3 is connected to the insulating layer 21.

[0072] The insulating layer 21 is preferably an IMS (insulated metal substrate) with high thermal conductivity, and the circuit layer 22 is a PCB copper foil layer, which is a single-layer, double-layer or multi-layer circuit. The component 1 is electrically connected to the circuit layer 22, for example, by wire bonding.

[0073] In one embodiment, the heat sink 3 is provided with a heat dissipation flow channel 31, and the heat dissipation medium passing through the heat dissipation flow channel 31 is gas or liquid.

[0074] The heat sink 3 can be air-cooled or liquid-cooled, as shown in Figure 2 and Figure 4 The heat dissipation flow channel 31 is provided with an opening on the side away from the circuit board 2; as shown in Figure 3 and Figure 5 The heat dissipation flow channel 31 is provided with a closed side on the side away from the circuit board 2, and the heat dissipation flow channel 31 is formed in the interior of the heat sink 3, facilitating the flow of liquid to achieve heat dissipation.

[0075] Two connection structures of the component 1 and the heat sink 3 are provided as follows:

[0076] As shown in Figure 2 and Figure 3 The first connection structure is that the heat sink 3 is provided with a boss 5 extending therefrom, the boss 5 is arranged in a receiving hole 4, and the boss 5 is connected to the component 1.

[0077] The boss 5 is made on the heat sink 3 (for example, by etching), the receiving hole 4 is made on the component 1 (for example, by laser cutting), then the boss 5 is inserted into the receiving hole 4, the top surface of the boss 5 is flush with the top surface of the circuit board 2, the circuit board 2 and the heat sink 3 are connected by pressing, after the connection, the component 1 is attached to the heat sink 3, and then the component 1 is electrically connected to the circuit board 2 by wire bonding.

[0078] Through the technical scheme, the boss 5 is arranged in the accommodating hole 4 of the circuit board 2, and the boss 5 is attached to the component 1, when the chip works, the heat generated by the circuit board 2 can be radiated through the radiator 3, and the circuit board 2 can also transmit the heat to the boss 5 to radiate, the heat dissipation capacity of the circuit board 2 is improved, and the part, where the component 1 is attached to the boss 5, can be effectively radiated, so that the component 1 can directly radiate through the radiator 3 without the circuit board 2, and the heat dissipation effect is improved.

[0079] As shown in Figure 4 and Figure 5 The second connecting structure is shown, the component 1 is arranged in the accommodating hole 4, and is connected with the radiator 3.

[0080] The circuit board 2 is connected with the radiator 3 in a press-fit manner, then the insulating layer 21 of the circuit board 2 is burned or knocked off through laser or machining depth control, the accommodating hole 4 is formed, and then the radiator 3 is exposed; or, the accommodating hole 4 is first made on the circuit board 2, and then the circuit board 2 and the radiator 3 are connected in a press-fit manner; it should be noted that the accommodating hole 4 is made on the insulating layer 21 of the circuit board 2 which is not covered by the circuit layer 22.

[0081] The component 1 is positioned and placed in the accommodating hole 4, and the component 1 is attached to the radiator 3 through the heat-conducting solder, so that the interface thermal resistance is reduced, and the heat conduction process of the insulating layer 21 is cancelled.

[0082] For the two connecting structures of the component 1 and the radiator 3, the application provides two corresponding preparation processes as follows:

[0083] As shown in Figures 6-9 The first preparation process provided by the application is shown:

[0084] A preparation process of a chip with a heat dissipation structure comprises the following steps:

[0085] The surface of the radiator 3 is covered with a dry film at a target region where the boss 5 is to be made;

[0086] According to the thickness of the circuit board 2 and the size of the component 1, the surface of the radiator 3 is etched to make the boss 5;

[0087] According to the size of the boss 5, the accommodating hole 4 is made on the circuit board 2;

[0088] The boss 5 of the radiator 3 is positioned and sleeved in the accommodating hole 4 of the circuit board 2, and the radiator 3 and the circuit board 2 are press-fit;

[0089] The component 1 is attached to the boss 5, and the component 1 is electrically connected with the circuit layer 22 of the circuit board 2.

[0090] The heat sink 3 is preferably made of copper material; the size of the accommodating hole 4 is capable of inserting the boss 5.

[0091] The target area covered by the dry film is not etched, and the rest is etched to a certain depth, thereby obtaining the boss 5; the height of the boss 5 and the thickness of the circuit board 2 need to meet: the component 1 can be connected with the boss 5, and the component 1 can be electrically connected with the circuit board 2; the length and width of the boss 5 are smaller than the length and width of the component 1, so as not to affect the wire bonding of the component 1 and the circuit board 2.

[0092] The circuit board 2 is cut by laser cutting to obtain the accommodating hole 4, and the size of the accommodating hole 4 is capable of inserting the boss 5.

[0093] The prepared heat sink 3 and the circuit board 2 are sleeved together and connected by pressing, which can improve the combination of the two and reduce the thermal resistance between the two; after the two are connected, the component 1 is connected with the boss 5, and the component 1 is cooled by the heat sink 3, thereby improving the cooling effect.

[0094] Further, the boss 5 of the heat sink 3 is positioned and sleeved in the accommodating hole 4 of the circuit board 2, and the heat sink 3 and the circuit board 2 are pressed, comprising:

[0095] The positioning plate 61 on the positioning and clamping mechanism 6 is inserted into the accommodating hole 4 to clamp the circuit board 2;

[0096] The circuit board 2 is positioned and moved to the upper side of the boss 5 by the moving mechanism 7 connected with the positioning and clamping mechanism 6;

[0097] The circuit board 2 is lowered by the moving mechanism 7, so that the boss 5 is inserted into the accommodating hole 4, and the positioning plate 61 is inserted into the gap 8 between the boss 5 and the accommodating hole 4;

[0098] The moving mechanism 7 is disconnected with the positioning and clamping mechanism 6, and the heat sink 3 and the circuit board 2 are pressed;

[0099] After the pressing is finished, the moving mechanism 7 is connected with the positioning and clamping mechanism 6, and the positioning and clamping mechanism 6 is controlled to be disconnected with the circuit board 2 and the heat sink 3.

[0100] Further, before the component 1 is connected with the boss 5, it further comprises:

[0101] After the circuit board 2 and the heat sink 3 are connected by pressing, the gap 8 is formed between the boss 5 and the accommodating hole 4, the gap 8 is filled with insulating material to form an insulating isolation layer 9.

[0102] As Figure 6As shown, the plurality of positioning plates 61 on the positioning and clamping mechanism 6 first approach each other, enabling them to be inserted into the accommodating hole 4, and then the plurality of positioning plates 61 are in close contact with the side wall of the accommodating hole 4, thereby achieving clamping of the circuit board 2, and then the positioning and clamping mechanism 6 is controlled to move by the moving mechanism 7, while the circuit board 2 is moved to be located above the boss 5, and the circuit board 2 is moved downward, so that the boss 5 can be inserted into the accommodating hole 4;

[0103] As shown in Figure 7 The size of the boss 5 is smaller than that of the accommodating hole 4, and the plurality of positioning plates 61 can ensure that a gap 8 is formed in each direction between the boss 5 and the accommodating hole 4 when the boss 5 is inserted into the accommodating hole 4, preventing the boss 5 from directly contacting the side wall of the accommodating hole 4. Since the boss 5 is made of copper, aluminum or copper-aluminum composite material and has certain electrical conductivity, it is easy to cause the distance between the circuit layer 22 of the circuit board 2 and the heat sink 3 to exceed the safe distance when the boss 5 contacts the inner wall of the accommodating hole 4, affecting the normal use of the chip. Of course, when the accommodating hole 4 is made, the circuit layer 22 will not be exposed in the accommodating hole 4, but the side wall of the accommodating hole 4 needs to be kept at a safe distance from the circuit layer 22 in the horizontal direction to ensure the stability of the circuit board 2 in operation. However, it is inevitable that there will be processing errors when the accommodating hole 4 is made. Therefore, in order to improve the stability of the circuit board 2 in operation, a gap 8 is reserved between the boss 5 and the accommodating hole 4 for filling with insulating material to completely isolate the boss 5 from the circuit layer 22 and prevent electrical conduction between the boss 5 and the circuit layer 22;

[0104] As shown in Figure 7 When the heat sink 3 and the circuit board 2 are pressed together, the moving mechanism 7 is completely separated from the positioning and clamping mechanism 6, and the position of the positioning and clamping mechanism 6 remains unchanged. During pressing, pressure is applied to the top of the positioning and clamping mechanism 6 for pressing. In this process, the positioning plates 61 are always located at the gap 8, ensuring that the positions of the boss 5 and the accommodating hole 4 do not shift;

[0105] As shown in Figure 8 After the heat sink 3 and the circuit board 2 are pressed together, they are tightly combined, and then the positioning and clamping mechanism 6 is removed by connecting the moving mechanism 7 and the positioning and clamping mechanism 6, forming a gap 8 between the boss 5 and the accommodating hole 4, ensuring the accuracy of the relative position of the boss 5 and the accommodating hole 4 during pressing, and preventing the boss 5 from contacting the accommodating hole 4;

[0106] As shown in Figure 9 The gap 8 is filled with insulating material, which can be thermally conductive insulating material, to form an insulating isolation layer 9, effectively isolating the boss 5 from the circuit board 2, and then the component 1 is attached to the boss 5, and the component 1 is electrically connected to the circuit board 2.

[0107] As shown in Figures 10-17As shown, the second preparation process provided by the present application is as follows:

[0108] A preparation process of a chip with a heat dissipation structure, comprising:

[0109] According to the size of the component 1, a containing hole 4 is made on the circuit board 2;

[0110] The circuit board 2 is connected with the heat sink 3;

[0111] The component 1 is positioned and placed in the containing hole 4, and the component 1 is attached with the heat sink 3 through the heat-conducting solder.

[0112] In this preparation process, the circuit board 2 can be connected with the heat sink 3 first, and then the containing hole 4 is made, or the containing hole 4 is made first, and then the circuit board 2 is connected with the heat sink 3;

[0113] As shown in Figure 10 and Figure 11 , the circuit board 2 and the heat sink 3 are connected by pressing first, and then the containing hole 4 is made on the circuit board 2, which can be made by laser or machine processing depth control bell, that is, the insulating layer 21 of the circuit board 2 is burned or knocked off to form the containing hole 4, so that the heat sink 3 is exposed;

[0114] As shown in Figure 12 and Figure 13 , the containing hole 4 is made on the circuit board 2 first, and then the circuit board 2 is moved and placed above the heat sink 3 by the positioning and clamping mechanism 6 driven by the moving mechanism 7, and then the circuit board 2 and the heat sink 3 are connected by pressing, and when the connection by pressing is performed, the positioning and clamping mechanism 6 does not need to be removed, and the pressure can be directly applied to the positioning and clamping mechanism 6;

[0115] Then, the component 1 is positioned and moved into the containing hole 4, so that the component 1 and the heat sink 3 are connected through the heat-conducting solder.

[0116] Further, the component 1 is positioned and placed in the containing hole 4, and the component 1 is attached with the heat sink 3 through the heat-conducting solder, comprising:

[0117] The component 1 is clamped by the positioning plate 61 on the positioning and clamping mechanism 6;

[0118] The component 1 is positioned and moved above the circuit board 2 by the moving mechanism 7 connected with the positioning and clamping mechanism 6;

[0119] The component 1 is moved downward by the moving mechanism 7, so that the component 1 is placed in the containing hole 4, and the positioning plate 61 is inserted into the gap 8 between the component 1 and the containing hole 4; wherein the heat-conducting solder is arranged in the containing hole 4 in advance;

[0120] The heat-conducting solder is heated to connect the component 1 and the heat sink 3;

[0121] After the component 1 is connected with the heat sink 3, the positioning and clamping mechanism 6 is separated from the circuit board 2 and the component 1, and a gap 8 is formed between the component 1 and the accommodating hole 4;

[0122] The gap 8 is filled with insulating material to form an insulating isolation layer 9.

[0123] As shown in Figure 14 , the plurality of positioning plates 61 of the positioning and clamping mechanism 6 are controlled to move away from each other, so that the plurality of positioning plates 61 can be sleeved on the outside of the component 1, and then the plurality of positioning plates 61 are controlled to move close to each other to clamp the component 1;

[0124] As shown in Figure 15 , the component 1 is moved and placed in the accommodating hole 4 by the moving mechanism 7, the heat-conducting solder is pre-arranged in the accommodating hole 4, the positioning plate 61 is located at the gap 8 between the component 1 and the accommodating hole 4 after the component 1 is placed in position, the installation and positioning of the component 1 are realized, and then the heat-conducting solder is heated, so that the component 1 is welded with the heat sink 3. During the welding process, the position of the component 1 remains unchanged through the limiting of the positioning plate 61, and the formation of the gap 8 is ensured.

[0125] As shown in Figure 16 , after the heat-conducting solder is solidified, the positioning and clamping mechanism 6 is removed, and the gap 8 is formed.

[0126] As shown in Figure 17 , the gap 8 is filled with insulating material, which can be heat-conducting insulating material, to form an insulating isolation layer 9. Then, the component 1 and the circuit board 2 are electrically connected by wire bonding (or other electrical connection methods). Through the formed insulating isolation layer 9, it can prevent the solder used in the electrical connection process of the component 1 and the circuit board 2 from entering between the component 1 and the accommodating hole 4, so as to prevent the circuit board 2 and the heat sink 3 from forming a conductive condition, and ensure the stability of the chip working.

[0127] As shown in Figures 18-20 , in the two preparation processes of the present application, the positioning and clamping mechanism 6 comprises: a positioning block 62, one side of which is provided with a plurality of sliding grooves 63, the positioning plate 61 is slidably connected in the sliding groove 63, the positioning plate 61 is connected with one side of the sliding groove 63 through the elastic element 64, the opposite side of the sliding groove 63 is provided with a first electromagnet 65, and the surface of the positioning plate 61 is provided with a first permanent magnet which acts with the first electromagnet 65;

[0128] The thickness of the positioning plate 61 corresponds to the gap 8 formed by inserting the component into the accommodating hole 4, and the bottom end of the positioning plate 61 is provided with a guide surface; wherein the component is the boss 5 or the component 1;

[0129] The positioning block 62 is provided with a groove 66 on the side connected with the moving mechanism 7, the groove 66 is provided with a second permanent magnet 67, the moving mechanism 7 is provided with a connecting block 71 corresponding to the groove 66, the connecting block 71 is provided with a second electromagnet 72 corresponding to the second permanent magnet 67, the connection and disconnection between the positioning and clamping mechanism 6 and the moving mechanism 7 are realized by controlling the second electromagnet 72.

[0130] For example, the second electromagnet 72 is electrified to be attracted to the second permanent magnet 67, realizing the connection between the positioning and clamping mechanism 6 and the moving mechanism 7, the second electromagnet 72 is electrified to be repelled from the second permanent magnet 67 (or the second electromagnet 72 is de-energized and does not act on the second permanent magnet 67), realizing the disconnection between the positioning and clamping mechanism 6 and the moving mechanism 7.

[0131] The positioning block 62 is further provided with a plurality of first magnetic attraction pieces 68 on the side connected with the moving mechanism 7, the moving mechanism 7 is provided with a second magnetic attraction piece 73 attracted to the first magnetic attraction piece 68, the first magnetic attraction piece 68 is electrically connected with the first electromagnet 65; after the first magnetic attraction piece 68 and the second magnetic attraction piece 73 are contacted, the first electromagnet 65 can be controlled to work by the control module built in the moving mechanism 7.

[0132] The first electromagnet 65 is controlled by the control module built in the moving mechanism 7, and the electrical connection is realized by the contact between the first magnetic attraction piece 68 and the second magnetic attraction piece 73.

[0133] The positioning block 62 is further provided with a plurality of pressure sensors 69 on the side away from the moving mechanism 7, for detecting the contact pressure between the circuit board 2 or the component 1 and the positioning block 62; the pressure sensors 69 can detect whether the clamping or placement is in place when the positioning and clamping mechanism 6 clamps or places the circuit board 2 or the component 1;

[0134] For example, when clamping, if the pressure values detected by the plurality of pressure sensors 69 are all greater than a first set value, it indicates that the clamping is effective, otherwise, the position is adjusted for re-clamping.

[0135] When placing, if the pressure values detected by the plurality of pressure sensors 69 are all greater than a second set value, it indicates that the placement is in place, otherwise, the position is adjusted for re-placing; the second set value is greater than the first set value.

[0136] In the first preparation process, the elastic member 64 is a tension spring, the first electromagnet 65 is electrified to produce an attractive effect on the positioning plate 61, so that the plurality of positioning plates 61 are close to each other, and then inserted into the accommodating hole 4 of the circuit board 2; when the first electromagnet 65 is de-energized, no attractive effect is produced on the positioning plate 61, and under the action of the tension spring, the plurality of positioning plates 61 are in close contact with the inner wall of the accommodating hole 4 to realize clamping of the circuit board 2.

[0137] In the second preparation process, only the component 1 is clamped (the circuit board 2 is pressed with the heat sink 3 first, and then the accommodating hole 4 is made), the elastic member 64 is a compression spring, the first electromagnet 65 generates repulsion on the positioning plate 61 after being electrified, so that the plurality of positioning plates 61 are away from each other, and then the component 1 is placed between the plurality of positioning plates 61; when the first electromagnet 65 is de-energized, no action is generated on the positioning plate 61, and under the action of the compression spring, the plurality of positioning plates 61 are in close contact with the side surface of the component 1 to clamp the component 1;

[0138] In the second preparation process, both the circuit board 2 and the component 1 need to be clamped (the accommodating hole 4 is made first, and then the circuit board 2 is pressed with the heat sink 3), when the elastic member 64 is a tensile spring, the principle of clamping the circuit board 2 is the same as above; when clamping the component 1, the plurality of positioning plates 61 are placed outside the component 1 first, and then the first electromagnet 65 generates adsorption on the positioning plate 61 after being electrified, so that the plurality of positioning plates 61 are close to each other to clamp the component 1.

[0139] In the second preparation process, both the circuit board 2 and the component 1 need to be clamped (the accommodating hole 4 is made first, and then the circuit board 2 is pressed with the heat sink 3), when the elastic member 64 is a compression spring, the principle of clamping the component 1 is the same as above; when clamping the circuit board 2, the plurality of positioning plates 61 are placed in the accommodating hole 4 first, and then the first electromagnet 65 generates repulsion on the positioning plate 61 after being electrified, so that the plurality of positioning plates 61 are away from each other to clamp the circuit board 2.

[0140] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0141] In this application, unless otherwise clearly indicated and limited, the terms "mounting", "connection", "connecting", "fixed", and the like should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection or communication with each other; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0142] Although the embodiments of the present application have been disclosed as above, it is not limited to the application listed in the specification and the embodiments, and can be fully applied to various fields suitable for the present application, and additional modifications can be easily realized by those skilled in the art, and therefore the present application is not limited to specific details and the figures shown and described herein without departing from the general concept defined by the present application.

Claims

1. A fabrication process for a chip with a heat dissipation structure, characterized in that, include: Cover the target area of ​​the radiator (3) where the boss (5) is to be made with a dry film. Based on the thickness of the circuit board (2) and the size of the components (1), the surface of the heat sink (3) is etched to create a boss (5). Based on the dimensions of the boss (5), a receiving hole (4) is made on the circuit board (2); Positioning the boss (5) of the heat sink (3) within the receiving hole (4) of the circuit board (2), and pressing the heat sink (3) and the circuit board (2) together, including: Insert the positioning plate (61) on the positioning clamping mechanism (6) into the receiving hole (4) to clamp the circuit board (2); The circuit board (2) is positioned and moved above the boss (5) by the moving mechanism (7) connected to the positioning clamping mechanism (6); wherein, after the second electromagnet (72) on the moving mechanism (7) is energized, it attracts each other with the second permanent magnet (67) on the positioning clamping mechanism (6), thereby realizing the connection between the positioning clamping mechanism (6) and the moving mechanism (7). The circuit board (2) is moved down by the moving mechanism (7) so that the boss (5) is inserted into the receiving hole (4) and the positioning plate (61) is inserted into the gap (8) between the boss (5) and the receiving hole (4); Disconnect the moving mechanism (7) from the positioning clamping mechanism (6) and press the circuit board (2) and the heat sink (3) together; wherein, after the second electromagnet (72) on the moving mechanism (7) is energized, it repels or does not interact with the second permanent magnet (67) on the positioning clamping mechanism (6), thereby realizing the separation of the positioning clamping mechanism (6) from the moving mechanism (7); After pressing is completed, the moving mechanism (7) is connected to the positioning and clamping mechanism (6), and the positioning and clamping mechanism (6) is controlled to disengage from the circuit board (2) and the heat sink (3); The component (1) is attached to the boss (5), and the component (1) is electrically connected to the circuit layer (22) of the circuit board (2); The positioning and clamping mechanism (6) includes: a positioning block (62) with a plurality of grooves (63) on one side, a positioning plate (61) slidably connected in the groove (63), the positioning plate (61) being connected to one side of the groove (63) via an elastic element (64), a first electromagnet (65) being provided on the opposite side of the groove (63), and a first permanent magnet being provided on the surface of the positioning plate (61) to interact with the first electromagnet (65).

2. The fabrication process of the chip with a heat dissipation structure according to claim 1, characterized in that, Before attaching the component (1) to the boss (5), the following steps are also included: After the circuit board (2) and the heat sink (3) are pressed together, a gap (8) is formed between the boss (5) and the receiving hole (4). Insulating material is filled into the gap (8) to form an insulating layer (9).

3. The fabrication process of the chip with a heat dissipation structure according to claim 1, characterized in that, The circuit board (2) includes an insulating layer (21) and a circuit layer (22) that are connected to each other. The component (1) is electrically connected to the circuit layer (22), and the heat sink (3) is connected to the insulating layer (21).

4. The fabrication process of the chip with a heat dissipation structure according to claim 1, characterized in that, The radiator (3) is provided with a heat dissipation channel (31), and the heat dissipation medium passing through the heat dissipation channel (31) is gas or liquid.

5. A fabrication process for a chip with a heat dissipation structure, characterized in that, include: Based on the dimensions of component (1), a receiving hole (4) is made on the circuit board (2); Connect the circuit board (2) to the heat sink (3); The component (1) is positioned and placed in the receiving hole (4), and the component (1) is bonded to the heat sink (3) by thermally conductive solder, including: The component (1) is gripped by the positioning plate (61) on the positioning clamping mechanism (6); The component (1) is positioned and moved above the circuit board (2) by the moving mechanism (7) connected to the positioning clamping mechanism (6); wherein, after the second electromagnet (72) on the moving mechanism (7) is energized, it attracts each other with the second permanent magnet (67) on the positioning clamping mechanism (6), thereby realizing the connection between the positioning clamping mechanism (6) and the moving mechanism (7). The component (1) is moved down by the moving mechanism (7) so that the component (1) is placed in the receiving hole (4) and the positioning plate (61) is inserted into the gap (8) between the component (1) and the receiving hole (4); wherein, thermally conductive solder is pre-arranged in the receiving hole (4); Heat the thermally conductive solder to connect the component (1) to the heat sink (3); After the component (1) is connected to the heat sink (3), the positioning clamping mechanism (6) is separated from the circuit board (2) and the component (1), and a gap (8) is formed between the component (1) and the receiving hole (4). Fill the gap (8) with insulating material to form an insulating layer (9); The positioning and clamping mechanism (6) includes: a positioning block (62) with a plurality of grooves (63) on one side, a positioning plate (61) slidably connected in the groove (63), the positioning plate (61) being connected to one side of the groove (63) via an elastic element (64), a first electromagnet (65) being provided on the opposite side of the groove (63), and a first permanent magnet being provided on the surface of the positioning plate (61) to interact with the first electromagnet (65).

6. The fabrication process of the chip with a heat dissipation structure according to claim 5, characterized in that, The circuit board (2) includes an insulating layer (21) and a circuit layer (22) that are connected to each other. The component (1) is electrically connected to the circuit layer (22), and the heat sink (3) is connected to the insulating layer (21).

7. The fabrication process of the chip with a heat dissipation structure according to claim 5, characterized in that, The radiator (3) is provided with a heat dissipation channel (31), and the heat dissipation medium passing through the heat dissipation channel (31) is gas or liquid.

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