Method for manufacturing metal-based circuit board and metal-based circuit board

Abstract

The present invention discloses a method for manufacturing a metal-based circuit board and a metal-based circuit board. The metal-based circuit board includes a main board and an outer board. The main board includes a signal transmission layer located at the top and a routing portion located at the inner layer. The outer board is disposed on the signal transmission layer and includes a first pad portion and a second pad portion. The first pad portion is used for soldering a chip. The signal transmission layer is provided with a chip guide post and an output portion. The chip guide post is electrically connected to the first pad portion, and the output portion is electrically connected to the second pad portion. The output portion includes a connected ring block and an output block. The ring block is spaced apart and sleeved outside the chip guide post. The output block is electrically connected to the second pad portion. The chip guide post is electrically connected to the ring block via the routing portion. On the one hand, when the chip is operating, heat from the bottom of the chip can be transferred to the ring block, and then transferred to the second pad portion via the output portion for heat dissipation, thereby improving the overall heat dissipation capacity. On the other hand, the ring block acts as an external shielding layer for the chip guide post, reducing external electromagnetic interference and improving the stability of signal transmission.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board structures, and in particular to a method for manufacturing a metal-based circuit board and the metal-based circuit board. Background Art

[0002] A metal-based circuit board (MCPCB) is a type of circuit board that incorporates a metal substrate to enhance thermal conductivity, compared to conventional printed circuit boards (PCBs) with non-metallic substrates. Compared to traditional non-metallic substrates, MPCBs typically utilize aluminum, copper, or other highly thermally conductive metals as their substrates to improve heat dissipation. They are widely used in high-power LEDs, power electronics modules, and radio frequency communication equipment. Conventional MPCB designs typically utilize metal as the underlying substrate, with an insulating layer and signal transmission layer layered above. This allows circuits to be laid on the metal substrate, while the signal transmission layer relies on an insulating medium to protect it, ensuring signal integrity and reducing electromagnetic interference.

[0003] During the actual operation of high-power LEDs, power electronic modules, and radio frequency communication equipment, their high-power devices generate a large amount of heat. This is especially true at the contact surface between the circuit board and the high-power device, where heat is easily accumulated and the heat dissipation efficiency is still limited. At the same time, in existing metal-based circuit board designs, a shielding layer is usually added to reduce electromagnetic interference. However, the introduction of a shielding layer often makes it difficult to take into account the heat dissipation requirements, and the simultaneous use of both is not conducive to the miniaturization of the above-mentioned structures.

[0004] Therefore, existing metal-based circuit boards face the technical problem of finding a balance between heat dissipation and signal stability in practical applications. Summary of the Invention

[0005] The object of the present invention is to provide a method for manufacturing a metal-based circuit board and a metal-based circuit board, so as to solve the problem faced by existing metal-based circuit boards in practical applications that it is difficult to balance heat dissipation and signal stability.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A metal-based circuit board, comprising:

[0008] A mainboard, comprising a signal transmission layer located on the top layer and a wiring portion located on the inner layer;

[0009] an outer plate, the outer plate being arranged on the signal transmission layer and comprising a first pad portion and a second pad portion, the first pad portion being used for soldering a chip, and the second pad portion being used for outputting a signal;

[0010] A chip guide column and an output portion are provided on the signal transmission layer, wherein the chip guide column is electrically connected to the first pad portion, and the output portion is electrically connected to the second pad portion;

[0011] The output portion includes a connected ring block and an output block. The ring block is sleeved outside the chip guide column at intervals. The output block is electrically connected to the second pad portion. The chip guide column is electrically connected to the ring block through the routing portion.

[0012] Optionally, the outer plate includes an insulating layer and a metal layer sequentially arranged in a direction away from the signal transmission layer, and the first pad portion and the second pad portion are arranged on the metal layer;

[0013] The insulating layer is provided with a first metal connection portion at a position corresponding to the first pad portion and the chip guide column, and the insulating layer is provided with a second metal connection portion at a position corresponding to the output block and the second pad portion; the first metal connection portion is electrically connected to the first pad portion and the chip guide column respectively; the second metal connection portion is electrically connected to the output block and the second pad portion respectively.

[0014] Optionally, the lower surface area of ​​the first metal connection portion is smaller than the upper surface area of ​​the chip guide pillar, and the lower surface area of ​​the second metal connection portion is smaller than the upper surface area of ​​the output block.

[0015] Optionally, the end of the first metal connection portion close to the first pad portion is the first end portion, and the end of the first metal connection portion close to the chip guide column is the second end portion; the area of ​​the second end portion is smaller than the area of ​​the first end portion.

[0016] Optionally, the first metal connection portion includes a first metal block and a second metal block, the thermal expansion coefficient of the first metal block is greater than the thermal expansion coefficient of the second metal block, and the first pad portion and the first metal block are integrally formed and have the same thermal expansion coefficient;

[0017] Along a direction close to the chip guide pillar, the first pad portion, the first metal block and the second metal block are arranged in sequence.

[0018] Optionally, the end of the second metal connection portion close to the output block is the third end, and the end of the second metal connection portion close to the second pad portion is the fourth end; the area of ​​the fourth end is smaller than the area of ​​the third end.

[0019] Optionally, the second metal connection portion includes a third metal block and a fourth metal block, the thermal expansion coefficient of the fourth metal block is greater than the thermal expansion coefficient of the third metal block, and the fourth metal block and the second pad portion are integrally formed and have the same thermal expansion coefficient;

[0020] The third metal block is electrically connected to the output block and to the fourth metal block.

[0021] Optionally, a first pad filling groove is formed in the metal layer at a position corresponding to the first pad portion, the first pad filling groove is filled with a first insulating ring, and the first pad portion is provided in the first insulating ring;

[0022] A second pad filling groove is formed on the metal layer at a position corresponding to the second pad portion. The second pad filling groove is filled with a second insulating ring, and the second pad portion is provided in the second insulating ring.

[0023] A method for manufacturing a metal-based circuit board, for preparing the metal-based circuit board as described above, comprising:

[0024] A motherboard is provided, comprising a signal transmission layer located on the top layer and a wiring portion located on the inner layer; a chip guide post and an output portion are provided on the signal transmission layer, the output portion comprising a ring block and an output block connected to each other, the ring block being spaced apart and sleeved outside the chip guide post;

[0025] Providing an outer board, the outer board comprising a first pad portion and a second pad portion, the first pad portion being used for soldering a chip, and the second pad portion being used for outputting a signal;

[0026] The outer plate is arranged on the signal transmission layer, the chip guide pillar is electrically connected to the first pad portion, and the output block is electrically connected to the second pad portion.

[0027] Optionally, providing a mainboard includes:

[0028] A first groove is formed on the signal transmission layer corresponding to the chip guide pillar, and a second groove is formed on the output portion;

[0029] The first groove is filled with conductive material to form a chip guide column; the second groove is filled with conductive material to form an output portion.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] The manufacturing method of the metal-based circuit board and the metal-based circuit board provided by the present invention are achieved by arranging an outer plate above the main board and arranging a chip guide post and an output part on the signal transmission layer. The output part includes a connected ring block and an output block, and the ring block is arranged at intervals outside the chip guide post. On the one hand, when the chip is working, the heat at its bottom can be transferred to the ring block and transferred to the second pad part through the output part for heat dissipation, thereby improving the overall heat dissipation capacity. On the other hand, the ring block is arranged outside the chip guide post. The ring block is equivalent to the external shielding layer of the chip guide post, which can reduce external electromagnetic interference and isolate the chip guide post from the surrounding circuits to reduce crosstalk and improve the stability of signal transmission. In summary, the manufacturing method of the metal-based circuit board and the metal-based circuit board provided by the present invention have the advantages of strong heat dissipation and high signal stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not intended to limit the conditions under which the present invention can be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and objectives that can be achieved by the present invention.

[0034] Figure 1 Schematic diagram of a first processing structure of an outer plate in an embodiment of the present invention;

[0035] Figure 2 Schematic diagram of the second processing structure of the outer plate in an embodiment of the present invention;

[0036] Figure 3 Schematic diagram of a third processing structure of an outer plate in an embodiment of the present invention;

[0037] Figure 4 Schematic diagram of a fourth processing structure of an outer plate in an embodiment of the present invention;

[0038] Figure 5 Schematic diagram of a fifth processing structure of an outer plate in an embodiment of the present invention;

[0039] Figure 6 Schematic diagram of the sixth processing structure of the outer plate in an embodiment of the present invention;

[0040] Figure 7 Schematic diagram of the overall structure of the outer plate in an embodiment of the present invention;

[0041] Figure 8 A schematic diagram of the overall structure of a metal-based circuit board provided in an embodiment of the present invention;

[0042] Figure 9 for Figure 8 Schematic diagram of the cross-section structure along AA;

[0043] Illustration: 100, main board; 110, signal transmission layer; 120, chip guide pillar; 130, output unit; 131, ring block; 132, output block;

[0044] 200, outer plate; 201, insulation layer; 202, metal layer; 203, first pad filling groove; 204, second pad filling groove; 205, laser hole; 206, etched hole; 207, through hole; 210, first pad portion; 220, second pad portion;

[0045] 230. First metal connection portion; 231. First end portion; 232. Second end portion; 233. First metal block; 234. Second metal block; 240. Second metal connection portion; 241. Third end portion; 242. Fourth end portion; 243. Third metal block; 244. Fourth metal block; 300. Chip. DETAILED DESCRIPTION

[0046] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0047] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0048] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0049] Example 1:

[0050] This invention provides a metal-based circuit board that aims to address the existing technical issues of metal-based circuit boards, which struggle to balance heat dissipation and signal stability. Through the improved technical solution of the present invention, the metal-based circuit board not only significantly improves heat dissipation efficiency, but also effectively reduces electromagnetic interference and enhances signal transmission stability.

[0051] like Figure 8 and Figure 9As shown, the metal-based circuit board provided in this embodiment includes a main board 100 and an outer board 200; the main board 100 includes a signal transmission layer 110 located at the top layer and a routing portion located at the inner layer; wherein the routing portion may include routing layers and substrate layers arranged alternately, and the material of the substrate layer is not limited, including but not limited to resin, metal, etc., the routing layer may be selected from metals such as copper wire and silver wire, and the lines between different routing layers may be electrically connected through a via structure when they need to be connected. The signal transmission layer 110 is the top layer of the main board 100, which is arranged on the substrate layer, and is specifically provided with a chip guide column 120 and an output portion 130, and the output portion 130 includes a ring block 131 and an output block 132 connected to each other, and the ring block 131 is spaced apart and sleeved on the chip guide column 120. In addition, there is no restriction on the forming method of the chip guide pillar 120 and the output part 130, and they can be formed by opening a groove on the signal transmission layer 110 and then filling it with conductive material; it should be noted that the chip guide pillar 120 is used as the signal input of the chip 300, the wiring layer is used to process the signal of the chip 300, and the output part 130 can output the processed signal, and the output object is determined according to the design. For example: in power circuit board applications, the output part 130 can be used to drive power switching devices such as MOSFET or IGBT to ensure efficient control of current; the output part 130 can also be used in high-frequency signal transmission systems, and the output part 130 is connected to a high-speed signal channel to reduce signal loss and increase the transmission rate.

[0052] The outer plate 200 is arranged on the signal transmission layer 110, and includes a first pad portion 210 and a second pad portion 220. The first pad portion 210 is used to weld the chip 300, and the second pad portion 220 is used to output the signal; correspondingly, the chip guide column 120 is electrically connected to the first pad portion 210, the chip guide column 120 is electrically connected to the ring block 131 through the routing portion, and the output block 132 is electrically connected to the second pad portion 220, that is, the output portion 130 is electrically connected to the second pad portion 220.

[0053] Specifically, an outer plate 200 is provided above the main board 100, and a chip guide pillar 120 and an output portion 130 are provided on the signal transmission layer 110, and the output portion 130 includes a connected ring block 131 and an output block 132, and the ring block 131 is arranged at intervals outside the chip guide pillar 120. On the one hand, when the chip is working, the heat at its bottom can be transferred to the ring block 131, and then transferred to the second pad portion 220 through the output portion 130 for heat dissipation, so as to improve the overall heat dissipation capacity. On the other hand, the ring block 131 is arranged outside the chip guide pillar 120, and the ring block 131 is equivalent to the external shielding layer of the chip guide pillar 120, which can reduce external electromagnetic interference and isolate the chip guide pillar 120 from the surrounding circuits to reduce crosstalk and improve the stability of signal transmission. In summary, the metal-based circuit board provided in the embodiment of the present invention has the advantages of strong heat dissipation and high signal stability.

[0054] Further, if Figures 1 to 8 As shown, the outer plate 200 includes an insulating layer 201 and a metal layer 202 arranged in sequence along a direction away from the signal transmission layer 110, and the first pad portion 210 and the second pad portion 220 are arranged on the metal layer 202; the insulating layer 201 is provided with a first metal connection portion 230 corresponding to the position between the first pad portion 210 and the chip guide column 120, and the insulating layer 201 is provided with a second metal connection portion 240 corresponding to the position between the output block 132 and the second pad portion 220; the first metal connection portion 230 is electrically connected to the first pad portion 210 and the chip guide column 120 respectively; the second metal connection portion 240 is electrically connected to the output block 132 and the second pad portion 220 respectively.

[0055] It can be understood that the metal layer 202, as an important component of the heat dissipation path, enhances the overall heat dissipation capacity. The high thermal conductivity of the metal material itself ensures that the heat generated by the chip 300 or other high-power components can be quickly conducted to the outside; at the same time, in conjunction with the arrangement of the first metal connection part 230, the chip guide column 120, the output part 130 and the second metal connection part 240 and other structures, heat can be effectively transferred from the inside of the circuit board to the outside, especially the heat accumulated at the bonding surface of the chip 300 and the outer plate 200, thereby improving the overall heat dissipation performance of the circuit board and ensuring the stability of the chip 300 when working at high power.

[0056] Furthermore, the lower surface area of ​​the first metal connection portion 230 is smaller than the upper surface area of ​​the chip guide pillar 120, and the lower surface area of ​​the second metal connection portion 240 is smaller than the upper surface area of ​​the output block 132. It is understood that during the process of attaching the outer board 200 to the main board 100, the smaller metal connection portion helps reduce electromagnetic radiation by reducing the area of ​​the current path. At the same time, under the action of the ring block 131, external electromagnetic interference is further shielded, effectively improving electromagnetic compatibility, reducing the impact of external interference on circuit board signal transmission, and ensuring high stability and high-quality signal transmission.

[0057] As an optional implementation, Figure 7 As shown, the end of the first metal connection portion 230 close to the first pad portion 210 is a first end portion 231, and the end of the first metal connection portion 230 close to the chip guide pillar 120 is a second end portion 232. The area of ​​the second end portion 232 is smaller than the area of ​​the first end portion 231. When the temperature rises, the smaller area of ​​the second end portion 232 can reduce stress concentration caused by expansion, prevent damage or deformation between the first metal connection portion 230 and the chip guide pillar 120, and thus improve the reliability of the metal-based circuit board.

[0058] More specifically, the first metal connection portion 230 includes a first metal block 233 and a second metal block 234. The first metal block 233 has a greater thermal expansion coefficient than the second metal block 234. The first pad portion 210 and the first metal block 233 are integrally formed and have the same thermal expansion coefficient. The first pad portion 210, the first metal block 233, and the second metal block 234 are sequentially arranged in a direction approaching the chip guide pillar 120. Here, the first metal block 233 corresponds to the first end portion 231, and the second metal block 234 corresponds to the second end portion 232. It is understood that because the thermal expansion coefficient of the first metal block 233 is greater than that of the second metal block 234, the first metal block 233 experiences a greater volumetric expansion when the temperature rises. This allows the first metal block 233 to exert a compressive stress toward the second metal block 234 in high-temperature operating environments, helping to maintain close contact between the metal connections and preventing loosening or poor contact due to temperature fluctuations. Furthermore, the first pad portion 210 and the first metal block 233 are integrally formed and have the same thermal expansion coefficient, thereby reducing stress differences caused by thermal expansion and preventing interface fracture between the pad and the metal block.

[0059] As an optional implementation, Figure 7 As shown, the end of the second metal connection portion 240 close to the output block 132 is the third end 241, and the end of the second metal connection portion 240 close to the second pad portion 220 is the fourth end 242. The area of ​​the fourth end 242 is smaller than the area of ​​the third end 241. The smaller fourth end 242 can form a finer current density at the contact point, helping to reduce contact resistance and improve contact stability, especially reducing signal loss during high-frequency signal transmission.

[0060] In addition, based on the above-mentioned special-shaped structures of the first metal connection part 230 and the second metal connection part 240, in this embodiment, the heat is transferred along the direction of the first pad part 210, the first metal connection part 230, the chip guide column 120, the output part 130, the second metal connection part 240, and the second pad part 220. With the arrangement of the first metal connection part 230 being "wide at the top and narrow at the bottom" and the second metal connection part 240 being "narrow at the top and wide at the bottom", the first metal connection part 230 can provide a larger contact area, thereby enhancing the heat conduction capability to the chip 300, especially near the chip guide column 120 and the first pad part 2 The portion 10 can better guide the heat generated by the chip to be transferred outward; the second metal connection portion 240 optimizes the heat dissipation. For the heat accumulated on the bottom of the chip 300, the first portion can be directly dissipated through the metal layer 202, and the second portion is transferred in the direction of the first pad portion 210, the first metal connection portion 230, the chip guide column 120, the output portion 130, the second metal connection portion 240, and the second pad portion 220. The heat of the second portion is lower than that of the first portion. The setting of the second metal connection portion 240 helps to concentrate the distribution of heat, thereby balancing the overall heat distribution and improving the stability of the metal-based circuit board.

[0061] More specifically, the second metal connection portion 240 includes a third metal block 243 and a fourth metal block 244. The fourth metal block 244 has a greater thermal expansion coefficient than the third metal block 243, and the fourth metal block 244 is integrally formed with the second pad portion 220 and has the same thermal expansion coefficient. The third metal block 243 is electrically connected to the output block 132 and to the fourth metal block 244. Exemplarily, there are two third metal blocks 243, spaced apart, and having a right trapezoidal cross-section. The fourth metal block 244 is disposed between the two third metal blocks 243 and has an inverted trapezoidal cross-section. In this case, the wide portion of the third metal block 243 corresponds to the third end 241, and the wide portion of the fourth metal block 244 and the narrow portion of the third metal block 243 correspond to the fourth end 242. Specific analysis: The fourth metal block 244 will expand more when the temperature rises. In addition, the contact surface between the fourth metal block 244 and the third metal block 243 is a slope, so that the third metal block 243 is squeezed by the fourth metal block 244 in both the horizontal and vertical directions. Cooperating with the second pad portion 220 to squeeze the third metal block 243 in the vertical direction, the pressure is avoided from being concentrated on a single contact point, and is evenly distributed on the contact surface, thereby alleviating the problem of excessive local stress caused by thermal stress. At the same time, through the pressure caused by the difference in thermal expansion, the third metal block 243 and the fourth metal block 244 are kept in close contact to further reduce electromagnetic radiation, and the stable connection between the metal blocks effectively shields external electromagnetic interference, thereby improving the electromagnetic compatibility of the circuit and ensuring the stability of signal transmission.

[0062] Furthermore, the narrow portion of the fourth metal block 244 is embedded between the narrow portions of the two third metal blocks 243 to form a through hole 207. The through hole 207 prevents the fourth metal block 244 from directly contacting the output block 132.

[0063] Based on the above embodiment, a first pad filling groove 203 is defined in the metal layer 202 at a position corresponding to the first pad portion 210. The first pad filling groove 203 is filled with a first insulating ring (not shown), and the first pad portion 210 is disposed in the first insulating ring. A second pad filling groove 204 is defined in the metal layer 202 at a position corresponding to the second pad portion 220. The second pad filling groove 204 is filled with a second insulating ring (not shown), and the second pad portion 220 is disposed in the second insulating ring. The insulating ring can be formed as a plating layer on the wall of the filling groove, or can be preformed and then embedded in the filling groove, which is not a limitation in this embodiment.

[0064] Example 2:

[0065] The method for manufacturing a metal-based circuit board provided in this embodiment is used to prepare the metal-based circuit board in Example 1, comprising:

[0066] Step S100: Provide a motherboard 100. The motherboard 100 includes a signal transmission layer 110 at the top and a wiring portion at an inner layer. The signal transmission layer 110 is provided with a chip guide pillar 120 and an output portion 130. The output portion 130 includes a ring block 131 and an output block 132 connected to each other. The ring block 131 is spaced apart and sleeved outside the chip guide pillar 120.

[0067] Step S200: providing an outer plate 200, wherein the outer plate 200 includes a first pad portion 210 and a second pad portion 220, wherein the first pad portion 210 is used for soldering a chip, and the second pad portion 220 is used for outputting a signal;

[0068] Step S300 , placing the outer plate 200 on the signal transmission layer 110 , electrically connecting the chip guide pillars 120 to the first pad portion 210 , and electrically connecting the output block 132 to the second pad portion 220 .

[0069] Furthermore, providing the mainboard 100 includes:

[0070] Step S101: A first groove is formed in the signal transmission layer 110 corresponding to the chip guide pillar 120, and a second groove is formed in the output portion 130. The signal transmission layer 110 may be made of an insulating material, thereby leaving an insulating material between the first groove (a circular groove) and the second groove (including a ring groove partially surrounding the circular groove). This allows a subsequent ring block 131 to be formed around the chip guide pillar 120 through the insulating material, thereby improving the stability of the chip 300 when inputting signals into the chip guide pillar 120.

[0071] S102 , filling the first groove with a conductive material to form a chip guide pillar 120 ; and filling the second groove with a conductive material to form an output portion 130 .

[0072] Further, providing the outer plate 200 includes:

[0073] Step S201: Figure 1 As shown, a stacked insulating layer 201 and a metal layer 202 are provided, and laser holes 205 are opened on the metal layer 202 at positions corresponding to the two third metal blocks 243 of the second metal connecting portion 240. The cross-section of the laser hole 205 is arranged in a trapezoidal shape, and the two laser holes 205 corresponding to the second metal connecting portion 240 are connected by a channel on the surface of the insulating layer 201. The channel is arranged corresponding to the through hole 207, and the depth of the channel is less than the depth of the laser hole 205.

[0074] Step S202: Figure 2 As shown, the first metal material is filled at the position of the laser hole 205 and the channel to form two connected third metal blocks 243;

[0075] Step S203: Figure 3 As shown, the insulating layer 201 and the metal layer 202 are turned over so that the metal layer 202 faces upward; a first pad filling groove 203 and a second pad filling groove 204 are opened on the metal layer 202, and the opening methods include but are not limited to laser processing, mechanical processing, etc.;

[0076] Next, an etching hole 206 is formed between the two third metal blocks 243 on the bottom wall of the second pad filling groove 204 by etching;

[0077] Next, another laser hole 205 corresponding to the first metal connection portion 230 is opened on the bottom wall of the first pad filling groove 203 by laser processing;

[0078] Step S204: Figure 4 As shown, a second metal block 234 is deposited or set in the laser hole 205 set corresponding to the first metal connection part 230; it should be supplemented that before depositing or setting the second metal block 234, a pad needs to be set at the insulating layer 201 to temporarily support the second metal block 234; the etched hole 206 and the second pad filling groove 204 are filled with a second metal material to form an integrally formed fourth metal block 244 and the second pad part 220; wherein, the second metal block 234 is selected from the first metal material, and the thermal expansion coefficient of the first metal material is smaller than the thermal expansion coefficient of the second metal material. Optionally, the first metal material is gold and the second metal material is copper; or the first metal material is copper and the second metal material is silver;

[0079] Step S205: Figure 5 As shown, the second metal material is filled in the laser hole 205 and the first pad filling groove 203 corresponding to the first metal connection portion 230 to form a first metal block 233 and a first pad portion 210;

[0080] Step S206: Figure 6 As shown, the spacers are removed, and a through hole 207 is opened on one side of the insulating layer 201 at a position corresponding to the channel to obtain the outer plate 200.

[0081] It should be noted that the fourth metal block 244 and the second pad portion 220 are filled and formed based on the etched hole 206, and the etched hole 206 is located between the two third metal blocks 243, which can improve the connection stability between the three; similarly, the first metal block 233 and the first pad portion 210 are filled and formed based on the laser hole 205 provided in the second metal block 234, which can improve the connection stability between the three.

[0082] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A metal-based circuit board, characterized in that: include: A mainboard, comprising a signal transmission layer located on the top layer and a wiring portion located on the inner layer; an outer plate, the outer plate being arranged on the signal transmission layer and comprising a first pad portion and a second pad portion, the first pad portion being used for soldering a chip, and the second pad portion being used for outputting a signal; A chip guide column and an output portion are provided on the signal transmission layer, wherein the chip guide column is electrically connected to the first pad portion, and the output portion is electrically connected to the second pad portion; The output portion includes a ring block and an output block connected to each other, the ring block is sleeved outside the chip guide column at intervals, the output block is electrically connected to the second pad portion, and the chip guide column is electrically connected to the ring block through the routing portion; The outer plate includes an insulating layer and a metal layer sequentially arranged in a direction away from the signal transmission layer, and the first pad portion and the second pad portion are arranged on the metal layer; The insulating layer is provided with a first metal connection portion at a position corresponding to the position between the first pad portion and the chip guide column, and a second metal connection portion is provided at a position corresponding to the position between the output block and the second pad portion; the first metal connection portion is electrically connected to the first pad portion and the chip guide column respectively; the second metal connection portion is electrically connected to the output block and the second pad portion respectively; The first metal connection portion includes a first metal block and a second metal block, the thermal expansion coefficient of the first metal block is greater than the thermal expansion coefficient of the second metal block, and the first pad portion and the first metal block are integrally formed and have the same thermal expansion coefficient; Along a direction close to the chip guide pillar, the first pad portion, the first metal block and the second metal block are arranged in sequence.

2. The metal-based circuit board according to claim 1, wherein: The lower surface area of ​​the first metal connection portion is smaller than the upper surface area of ​​the chip guide pillar, and the lower surface area of ​​the second metal connection portion is smaller than the upper surface area of ​​the output block.

3. The metal-based circuit board according to claim 1, wherein: The end of the first metal connection portion close to the first pad portion is the first end portion, and the end of the first metal connection portion close to the chip guide column is the second end portion; the area of ​​the second end portion is smaller than the area of ​​the first end portion.

4. The metal-based circuit board according to claim 1, wherein: The end of the second metal connection portion close to the output block is the third end, and the end of the second metal connection portion close to the second pad portion is the fourth end; the area of ​​the fourth end is smaller than that of the third end.

5. The metal-based circuit board according to claim 4, characterized in that: The second metal connection portion includes a third metal block and a fourth metal block, the thermal expansion coefficient of the fourth metal block is greater than the thermal expansion coefficient of the third metal block, and the fourth metal block and the second pad portion are integrally formed and have the same thermal expansion coefficient; The third metal block is electrically connected to the output block and to the fourth metal block.

6. A metal-based circuit board according to any one of claims 1 to 5, characterized in that: A first pad filling groove is formed in the metal layer at a position corresponding to the first pad portion, the first pad filling groove is filled with a first insulating ring, and the first pad portion is arranged in the first insulating ring; A second pad filling groove is formed on the metal layer at a position corresponding to the second pad portion. The second pad filling groove is filled with a second insulating ring, and the second pad portion is provided in the second insulating ring.

7. A method for manufacturing a metal-based circuit board, characterized in that: For preparing a metal-based circuit board according to any one of claims 1 to 6, comprising: A motherboard is provided, comprising a signal transmission layer located on the top layer and a wiring portion located on the inner layer; a chip guide post and an output portion are provided on the signal transmission layer, the output portion comprising a ring block and an output block connected to each other, the ring block being spaced apart and sleeved outside the chip guide post; Providing an outer board, the outer board comprising a first pad portion and a second pad portion, the first pad portion being used for soldering a chip, and the second pad portion being used for outputting a signal; The outer plate is arranged on the signal transmission layer, the chip guide pillar is electrically connected to the first pad portion, and the output block is electrically connected to the second pad portion.

8. The method for manufacturing a metal-based circuit board according to claim 7, wherein: The mainboard provided includes: A first groove is formed on the signal transmission layer corresponding to the chip guide pillar, and a second groove is formed on the output portion; The first groove is filled with conductive material to form a chip guide column; the second groove is filled with conductive material to form an output portion.

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