Method for preventing cutting fracture of glass support plate

Abstract

The invention discloses a method for preventing cutting fracture of a glass support plate, which comprises the following steps of: coating copper on the surface of the glass support plate: covering first copper layers on the upper surface and the lower surface of the glass support plate, and symmetrically arranging the two first copper layers and adjacent to a slotting area; s2, base material pressing, wherein multiple layers of base materials are symmetrically pressed on the upper side and the lower side of the glass carrier plate respectively; coating copper on the surface of the base material: coating copper on the outer surface of each laminated layer of base material to form a surface copper layer; a sample plate is formed after base material pressing and copper coating are completed; coating: respectively covering the upper and lower surfaces of the sample plate with oil films to form substrates; and finally, laser grooving is carried out, a first through groove and a second through groove with opposite openings are formed in a grooving area through laser grooving, the first through groove and the second through groove are the same in structure and are symmetrical, at least one layer of base material is arranged between the groove bottom of the first through groove and the glass carrier plate, and subsequent cutting can be carried out after grooving is completed. The first through groove and the second through groove can block the influence of the shrinkage trend of the base material on the edge of the glass support plate, and prevent the glass support plate from cracking in the cutting process.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board cutting, and in particular relates to a method for preventing a glass carrier from being broken during cutting. Background Art

[0002] At present, for circuit boards, glass core substrates have obvious advantages over traditional resin substrates. The main advantages are that the glass has high strength and is not easy to warp. The hole density is high and the flatness is high, which is suitable for processing fine circuits. Especially in the field of high computing power and AI, glass substrates are the key path. However, glass core substrates are somewhat brittle, and cracks are easily generated in the glass during the cutting process, which affects the reliability of the glass core substrate.

[0003] Therefore, a new technology is needed to solve the problem in the prior art that the glass carrier is prone to cracks during the cutting process. Summary of the invention

[0004] In order to solve the above problems in the prior art, the present invention provides a method for preventing a glass carrier from being cut and broken, so that the glass carrier is not prone to cracks in the subsequent cutting process.

[0005] The present invention adopts the following technical solutions:

[0006] A method for preventing a glass carrier from being cut and broken comprises the following steps:

[0007] S1. Copper coating on the surface of the glass carrier: The glass carrier can be used to cut to form a substrate, each substrate is provided with a grooved area near the outer edge thereof, each of the grooved areas is annular, and copper is coated on the upper and lower surfaces of the glass carrier in each of the grooved areas to form two symmetrically arranged first copper layers;

[0008] S2. Lamination of substrates: After the copper coating is completed, the substrates are respectively laminated on the upper and lower sides, and the size of each substrate is equal to the size of the glass carrier;

[0009] S3. Copper coating on the surface of the substrate: the outer surfaces of the substrate on the upper and lower sides are covered with surface copper layers corresponding to each of the first copper layers;

[0010] S4. Repeat steps S2-S3 until the preset layers of the substrates are sequentially pressed together and the surfaces of the substrates are copper-coated, and a sample is formed after completion;

[0011] S5. Coating: The upper and lower surfaces of the sample are respectively covered with an oil film to form a substrate;

[0012] S6. Laser grooving: Laser grooving is used in each of the grooving areas to form symmetrical first through grooves and second through grooves on the upper and lower sides of the substrate; at least one layer of the substrate is provided between the bottom of the first through groove and the glass carrier, and subsequent cutting can be performed after the grooving is completed.

[0013] As a further improvement of the technical solution of the present invention, in step S3 or step S4, the surface of one of the layers of the substrate located above the glass carrier is also covered with a second copper layer, and the bottom of the glass carrier is covered with a third copper layer symmetrical to the second copper layer; the second copper layer is located between the first copper layer and the outermost surface copper layer above the glass carrier in the vertical direction, and the second copper layer is located within the grooved area in the horizontal direction and is spaced apart from the surface copper layer of the same layer.

[0014] As a further improvement of the technical solution of the present invention, the second copper layer and the third copper layer respectively form the bottoms of the first through groove and the second through groove.

[0015] As a further improvement of the technical solution of the present invention, a gold layer is plated on a side surface of the second copper layer and the third copper layer away from the glass carrier.

[0016] As a further improvement of the technical solution of the present invention, the sizes of the bottoms of the first through groove and the second through groove are both smaller than the sizes of the third copper layer and the second copper layer.

[0017] As a further improvement of the technical solution of the present invention, two opposite side walls in the first through groove are both provided with inclined surfaces, and the size of the groove bottom of the first through groove is smaller than the size of the groove opening.

[0018] As a further improvement of the technical solution of the present invention, the two side walls in the first through groove are respectively a first side wall and a second side wall, the first side wall is away from the edge of the glass carrier and is provided with a step structure; the first side wall includes a first section, a second section and a third section connected in sequence, the second section is parallel to the bottom of the first through groove and forms a step surface of the step structure, and one end of the first section away from the second section is tightly connected to the second copper layer.

[0019] As a further improvement of the technical solution of the present invention, the two side walls in the first through groove are respectively a first side wall and a second side wall, the first side wall is away from the edge of the glass carrier and is provided with a step structure; the first side wall is provided with a fourth section and a fifth section connected in sequence from the inside to the outside, the bottom of the fourth section is connected to the bottom of the first through groove and is perpendicular to the bottom surface of the groove, and the fifth section is inclined and one end away from the fourth section forms a part of the notch of the first through groove.

[0020] As a further improvement of the technical solution of the present invention, the first side wall and the second side wall are symmetrically arranged.

[0021] As a further improvement of the technical solution of the present invention, in the groove area, the distance between the edge side of the substrate corresponding to the first through groove and the second through groove is not less than 500um; the groove width of the first through groove and the second through groove can be preferably 450um-550um; the distance between the bottom of the first through groove and the second through groove and the glass carrier plate can be preferably 80um-120um.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] In this solution, a first through groove and a second through groove are opened on the substrate on both sides of the glass carrier by laser, and a groove structure is provided on each substrate near the cutting line. The setting of the first through groove and the second through groove can block the influence of the shrinkage trend of the ABF material on the edge of the glass, reduce the influence of the cutting stress on the glass carrier, and prevent the glass carrier from cracking during the subsequent cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The technology of the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments:

[0025] Figure 1 It is a partial structural cross-sectional view of the substrate structure of the present invention before slotting;

[0026] Figure 2 It is a cross-sectional view of a through groove structure of the present invention;

[0027] Figure 3 is a cross-sectional view of the through groove structure when a step is provided on the first side wall of the present invention;

[0028] Figure 4 It is a cross-sectional view of the through groove structure when the first side wall and the second side wall of the present invention are symmetrically arranged and both are provided with steps;

[0029] Figure 5 is a cross-sectional view of the through groove structure when a slope is provided on the first side wall of the present invention;

[0030] Figure 6 This is a top view of the substrate after the grooves are cut.

[0031] Reference numerals:

[0032] 1-substrate; 11-glass carrier; 111-first copper layer; 12-base material; 121-surface copper layer; 122-second copper layer; 123-third copper layer; 13-oil film; 14-first through groove; 141-first side wall; 142-second side wall; 15-second through groove; 16-step structure; 17-cutting line; 18-substrate. DETAILED DESCRIPTION

[0033] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention, so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other without conflict. The same reference numerals used throughout the drawings indicate the same or similar parts.

[0034] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature, or it may be indirectly fixed or connected to the other feature. In addition, the descriptions of up, down, left, right, etc. used in the present invention are only relative to the relative positional relationship of the components of the present invention in the drawings.

[0035] Reference Figures 1 to 6 A method for preventing a glass carrier plate 11 from being cut and broken comprises the following steps:

[0036] S1. Copper coating on the surface of glass carrier 11: glass carrier 11 can be used to make and cut to form substrate 1. Glass carrier 11 can be used to be cut to form single or several substrates 18. The specific number can be set according to actual conditions. Each preset substrate is provided with a slotted area. Each slotted area is annular and located on each substrate 18 near its outer edge. Inside each slotted area, the upper and lower surfaces of the glass carrier 11 are covered with a first copper layer 111, that is, the upper and lower surfaces of the glass carrier 11 in each slotted area are copper-coated to form two symmetrically arranged first copper layers 1. Due to thermal expansion and contraction, after high-temperature pressing, the temperature drops to room temperature, ABF shrinks significantly, and the edge of the glass carrier 11 will be cracked by stress. When a larger glass carrier 11 is cut in the middle, the cutting line 17 will also have the same cracking problem, because there is also stress of thermal expansion and contraction at this position. Therefore, a through groove is provided near the cutting line on each substrate 1. The groove area is provided to form a through groove structure for subsequent cutting in the groove area, and the through groove structure will not affect the glass carrier 11.

[0037] S2. Lamination of substrate 12: After the copper coating is completed, the substrate 12 is laminated on the upper and lower sides of the glass carrier 11, and the plane size of the two substrates 12 is equal to the size of the glass carrier 11. The substrate 12 can be ABF, which is a polymer packaging material. The substrate 12 can also be made of other materials according to the actual manufacturing process.

[0038] S3. Copper coating on the surface of the substrate 12: The outer surfaces of the substrate 12 on the upper and lower sides are covered with copper layer structures corresponding to each of the first copper layers 111, and each copper layer structure is recorded as a surface copper layer 121, that is, the surface of the substrate 12 on each of the substrates 1 away from the glass carrier 11 is covered with the surface copper layer 121. Among them, on each slotted area, the surface of one layer of the substrate 12 located above the glass carrier 11 is also covered with a second copper layer 122, and the bottom of the glass carrier 11 is covered with a third copper layer 123 symmetrical to each of the second copper layers 122. That is, on each substrate 18, the second copper layer 122 is ring-shaped or U-shaped around the outside of a corresponding surface copper layer 121, and there is a gap between it and the surface copper layer 121 in the horizontal direction, and each second copper layer 122 and the corresponding surface copper layer 121 are located on the same horizontal plane. Symmetrically, the third copper layer 123 and the surface copper layer 121 are located on the same horizontal plane. The third copper layer 123 is ring-shaped or U-shaped. The second copper layer 122 and the third copper layer 123 are located between two adjacent substrates 12 in the vertical direction.

[0039] In addition, the second copper layer 122 is located between the first copper layer 111 and the outermost surface copper layer 121 above the glass carrier 11 in the vertical direction, and the second copper layer 122 is located within the groove area in the horizontal direction and is spaced apart from the surface copper layer 121 of the same layer. Since the surface of one of the substrates 12 located above the glass carrier 11 is covered with the second copper layer 122, when the upper surface of the first substrate 12 located above the glass carrier 11 is covered with the second copper layer 122, and the lower surface of the first substrate 12 below the glass carrier 11 is covered with the third copper layer 123 symmetrical to the second copper layer 122, at this time, the second copper layer 122 and the third copper layer 123 can be synchronously covered on the corresponding substrate 12 surface with the corresponding surface copper layer 121, or sequentially covered on the corresponding substrate 12 surface according to the actual manufacturing process. The arrangement of the second copper layer 122 and the third copper layer 123 is conducive to the positioning of the first through groove 14 and the second through groove 15 during the subsequent laser groove opening.

[0040] The second copper layer 122 and the third copper layer 123 respectively form the bottom of the first through groove 14 and the second through groove 15, and the second copper layer 122 and the third copper layer 123 are plated with a gold layer on the side surface away from the glass carrier 11, that is, the second copper layer 122 and the third copper layer 123 can be plated with gold to facilitate peeling off the cut ABF substrate 12 during laser grooving, and to facilitate peeling off the substrate 12 away from the side of the glass carrier 11 to smoothly complete the grooving process. The bottom of the groove can be copper plated with gold, or it can be etched off according to the situation. Since there is at least one layer of substrate between the first through groove 14, the second through groove 15 and the glass carrier 11, the glass carrier 11 will not be affected when the first through groove 14 and the second through groove 15 are cut to form.

[0041] S4. Repeat steps S2-S3 until the preset layers of the substrate 12 are pressed in sequence, and copper is coated on the outer surface of each substrate 12 after each pressing is completed, and a sample is formed after completion. Among them, since the surface of one layer of the substrate 12 located above the glass carrier 11 is covered with a second copper layer 122, and the bottom of the glass carrier 11 is covered with a third copper layer 123 symmetrical to the second copper layer 122, when the second copper layer 122 is not provided on the surface of the first layer of the substrate 12, the second copper layer 122 and the third copper layer 123 can be synchronously covered on the surface of the corresponding substrate 12 with the corresponding surface copper layer 121, or can be covered on the surface of the corresponding substrate 12 in sequence according to the actual manufacturing process.

[0042] S5. Coating: The upper and lower surfaces of the sample are respectively coated with an oil film 13 to form a substrate 1.

[0043] S6. Laser grooving: Laser grooving is used to form a first through groove 14 and a second through groove 15 with opposite openings on each of the grooving areas, and the first through groove 14 and the second through groove 15 are symmetrical in structure. Among them, at least one layer of the substrate 12 is provided between the bottom of the first through groove 14 and the glass carrier 11, and after the grooving is completed, subsequent cutting can be performed along the cutting line 17 to form each matrix 18. The distance between the corresponding first through groove 14 and the second through groove 15 and the edge of its matrix 18 is not less than 500um, and this distance can be preferably 500um. The groove width of the first through groove 14 and the second through groove 15 can be preferably 450-550um, that is, about 500um, and the distance between the bottom of the first through groove 14 and the second through groove 15 and the glass carrier 11 is 80um-120um, and can be preferably 100um. The setting of the first through groove 14 and the second through groove 15 can block the influence of the shrinkage trend of the ABF material on the edge of the glass.

[0044] The bottom dimensions of the first through groove 14 and the second through groove 15 are both smaller than the dimensions of the third copper layer 123 and the second copper layer 122. The substrate 12 partially covers the second copper layer 122, and a step structure 16 is formed at the connection nodes between the two ends of the second copper layer 122 and the substrate 12. The step structure 16 can further reduce the stress at the connection node. The two opposite side walls in the first through groove 14 are both provided with inclined surfaces. Figure 2 As shown, the bottom size of the first through groove 14 is smaller than the size of the notch. Due to thermal expansion and contraction, after the high-temperature pressing of each layer of substrate 12, the temperature drops to room temperature, the ABF substrate 12 layer shrinks significantly, and the upper and lower sides of the edge of the glass carrier 11 will be subjected to stress, causing the glass carrier 11 to crack. When a glass carrier 11 of a larger size is cut in the middle, the same cracking problem will occur at the cutting point, because there is also stress caused by thermal expansion and contraction at this position. The provision of the first through groove 14 and the second through groove 15 can reduce the shrinkage stress generated during cutting. By providing a through groove structure that is symmetrical up and down, that is, the first through groove 14 and the second through groove 15, isolation is formed between single chip carriers. The isolation structure formed by this symmetrical through groove can protect the edge of the glass carrier at the cutting line, and the outer edge of each substrate can be made thinner. The narrower and thinner the edge, the smaller the stress. That is, in the actual manufacturing process, the distance between the first through groove 14 on each substrate and its outer side surface or outer edge can be set to a smaller value, and the thickness of the second copper layer 122 can be set to a smaller value, which can reduce edge stress and save materials.

[0045] In this solution, for each preset substrate structure, the glass carrier 11 is provided with a first through groove 14 and a second through groove 15 which are symmetrical up and down respectively by laser in the substrate position on the upper and lower sides. The setting of the first through groove 14 and the second through groove 15 can block the influence of the shrinkage tendency of the ABF material on the edge of the glass carrier in each substrate, reduce the influence of the cutting stress on the glass carrier 11 in each substrate, and prevent the glass carrier 11 from cracking during the subsequent cutting process. When the thicker polymer layer is cut, it can be completed in multiple times to avoid fracture caused by internal stress. When the glass carrier 11 is cut to form a plurality of substrate units for making chips, the cutting line 17 can refer to the attached Figure 6 As shown, each base 18 is symmetrically provided with U-shaped slots on the four sides of the upper and lower sides, that is, the first through slot 14 and the second through slot 15 are both in the shape of U-shaped or ring-shaped.

[0046] In addition, refer to the attached Figure 3-5 The two side walls of the first through groove 14 are respectively a first side wall 141 and a second side wall 142. The first side wall 141 is away from the edge of the glass carrier 11. To prevent excessive stress at the foot of the first through groove 14 and the second through groove 15, the first side wall 141 can adopt a step, a slope or an arc structure. Figure 3 As shown, the second side wall 142 is inclined, and a step structure 16 is also provided on the first side wall 141. The first side wall 141 includes a first section, a second section and a third section connected in sequence. The first section and the third section are both inclined, and the second section is parallel to the bottom of the first through groove 14 and forms a step surface of the step structure 16. The end of the first section away from the second section is tightly connected to the second copper layer 122. The first side wall 141 is away from the edge of the glass carrier 11 or the substrate 1, and is close to the area to be cut of the glass carrier 11 or the substrate 1. When cutting in the area to be cut, a step structure 16 can be set on the first side wall 141 near the second copper layer 122 to further reduce the stress there. Among them, the first side wall 141 can be selected to be symmetrical with the second side wall 142 according to the actual production process requirements, refer to Figure 4 shown.

[0047] In another embodiment, referring to Figure 5 As shown, the second side wall 142 is tilted as a whole, and the first side wall 141 is also provided with a slope structure. The first side wall 141 is provided with a fourth section and a fifth section which are connected in sequence from the inside to the outside in a slope shape. The bottom of the fourth section is connected to the bottom of the first through groove 14 and is perpendicular to the bottom surface of the groove or the glass carrier 11. The fifth section is tilted and one end away from the fourth section forms a part of the notch of the first through groove 14. The angle between the fifth section and the glass carrier 11 is smaller than the angle between the second side wall 142 and the glass carrier 11. The fourth section and the fifth section are connected to form a bent structure, forming a turning node on the first side wall 141, which can further reduce the stress there. Among them, the first side wall 141 can be selected to be symmetrical with the second side wall 142 according to the actual production process requirements.

[0048] The other contents of the method for preventing the glass carrier from being cut and broken described in the present invention can be found in the prior art and will not be described in detail here.

[0049] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A method for preventing a glass carrier from being cut and broken, characterized in that: The following steps are involved: S1. Copper coating on the surface of the glass carrier: The glass carrier can be used to cut to form a substrate, each substrate is provided with a grooved area near the outer edge thereof, each of the grooved areas is annular, and copper is coated on the upper and lower surfaces of the glass carrier in each of the grooved areas to form two symmetrically arranged first copper layers; S2. Substrate lamination: After the copper coating is completed, the substrate is pressed on the upper and lower sides respectively, and the plane size of the two substrates is equal to the size of the glass carrier; S3. Copper coating on the surface of the substrate: the outer surfaces of the substrate on the upper and lower sides are covered with surface copper layers corresponding to each of the first copper layers; S4. Repeat steps S2-S3 until the preset several layers of the substrate are pressed together in sequence and the surface of each substrate is copper-coated, and a sample is formed after completion; S5. Coating: The upper and lower surfaces of the sample are respectively covered with an oil film to form a substrate; S6. Laser grooving: Laser grooving is used in each of the grooving areas to form symmetrical first through grooves and second through grooves on the upper and lower sides of the substrate; at least one layer of the substrate is provided between the bottom of the first through groove and the glass carrier, and subsequent cutting can be performed after the grooving is completed.

2. The method for preventing a glass carrier from being cut and broken according to claim 1, characterized in that: In step S3 or step S4, the surface of one of the layers of the substrate located above the glass carrier is also covered with a second copper layer, and the bottom of the glass carrier is covered with a third copper layer symmetrical to the second copper layer; the second copper layer is located between the first copper layer and the outermost surface copper layer above the glass carrier in the vertical direction, and the second copper layer is located within the grooved area in the horizontal direction and is spaced apart from the surface copper layer of the same layer.

3. The method for preventing a glass carrier from being cut and broken according to claim 2, characterized in that: The second copper layer and the third copper layer sequentially form the bottoms of the first through groove and the second through groove respectively.

4. The method for preventing a glass carrier from being cut and broken according to claim 2, characterized in that: A gold layer is plated on a side surface of the second copper layer and the third copper layer away from the glass carrier.

5. The method for preventing a glass carrier from being cut and broken according to claim 3, characterized in that: The sizes of the bottoms of the first through groove and the second through groove are both smaller than the sizes of the third copper layer and the second copper layer.

6. The method for preventing a glass carrier from being cut and broken according to claim 1, characterized in that: Two opposite side walls in the first through groove are both provided with inclined surfaces, and the size of the groove bottom of the first through groove is smaller than the size of the groove opening.

7. The method for preventing a glass carrier from being cut and broken according to claim 4, characterized in that: The two side walls in the first through groove are respectively a first side wall and a second side wall, the first side wall is away from the edge of the glass carrier and is provided with a step structure; the first side wall includes a first section, a second section and a third section connected in sequence, the second section is parallel to the bottom of the first through groove and forms a step surface of the step structure, and one end of the first section away from the second section is tightly connected to the second copper layer.

8. The method for preventing a glass carrier from being cut and broken according to claim 4, characterized in that: The two side walls in the first through groove are respectively the first side wall and the second side wall, the first side wall is away from the edge of the glass carrier and is provided with a step structure; the first side wall is provided with a fourth section and a fifth section connected in sequence from the inside to the outside, the bottom of the fourth section is connected to the bottom of the first through groove and is perpendicular to the bottom surface of the groove, and the fifth section is inclined and one end away from the fourth section forms a part of the notch of the first through groove.

9. The method for preventing a glass carrier from being cut and broken according to claim 7 or 8, characterized in that: The first side wall and the second side wall are symmetrically arranged.

10. The method for preventing a glass carrier from being cut and broken according to claim 1, characterized in that: In the grooved area, the distance between the edge side of the substrate corresponding to the first through groove and the second through groove is not less than 500um; the groove width of the first through groove and the second through groove can be preferably 450um-550um; the distance between the bottom of the first through groove and the second through groove and the glass carrier can be preferably 80um-120um.

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