Processing method of circuit board for new energy automobile

Abstract

The invention discloses a processing method of a circuit board for a new energy automobile, and relates to the technical field of circuit board processing, and the processing method of the circuit board for the new energy automobile comprises the following steps: S1, designing a circuit board pattern; s2, manufacturing a photomask; s3, cleaning the circuit board base material; s4, coating a photoresist; s5, exposure is carried out; s6, developing: putting the exposed circuit board substrate into a developing solution for developing; s7, etching: putting the developed circuit board substrate into an etching solution for etching; s8, photoresist removal: putting the etched circuit board base material into a photoresist removal solution for photoresist removal; s9, cleaning: cleaning the circuit board substrate after the photoresist is removed; s10, detection is carried out; according to the processing method of the circuit board for the new energy automobile, the processing precision and quality are improved; the performance of each part of the circuit board is more stable, and the product quality is improved; and the processing period of the circuit board is shortened, and the requirement of the new energy automobile industry on rapid production of high-quality circuit boards is met.

Description

Technical Field

[0001] The present invention relates to the field of circuit board processing technology, and in particular to a processing method for a circuit board for a new energy vehicle. Background Art

[0002] With the rapid rise of new energy vehicles, the performance requirements for circuit boards are increasing; traditional circuit board processing technology has gradually revealed its limitations when facing the complex electrical systems and high integration requirements of new energy vehicles; the processing methods in the existing technology have technical problems such as low processing accuracy and processing quality, and the reliability and stability need to be improved; therefore, in view of this situation, it is urgent to develop a processing method for circuit boards for new energy vehicles to meet the needs of actual use. Summary of the invention

[0003] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide a method for processing circuit boards for new energy vehicles, which improves processing accuracy and quality; makes the performance of each part of the circuit board more stable, improves product quality; enhances reliability and stability; enhances the long-term reliability and stability of the circuit board; shortens the processing cycle of the circuit board, and meets the needs of the new energy vehicle industry for the rapid production of high-quality circuit boards.

[0004] To achieve the above purpose, the present invention adopts the following technical solutions:

[0005] A method for processing a circuit board for a new energy vehicle comprises the following steps:

[0006] S1. Design circuit board patterns: Use artificial intelligence algorithms to design circuit board patterns for new energy vehicles;

[0007] S2. Making a photomask: Making the designed circuit board pattern into a photomask through nano-scale photolithography technology;

[0008] S3. Cleaning the circuit board substrate: Cleaning the circuit board substrate to remove oil and dust impurities on the surface;

[0009] S4, coating photoresist: coating the photoresist evenly on the cleaned circuit board substrate;

[0010] S5, exposure: exposing the photomask and the circuit board substrate coated with photoresist;

[0011] S6, development: placing the exposed circuit board substrate into a developer for development;

[0012] S7, etching: placing the developed circuit board substrate into an etching solution for etching;

[0013] S8, degumming: putting the etched circuit board substrate into the degumming liquid to degumming;

[0014] S9, cleaning: cleaning the circuit board substrate after degumming;

[0015] S10. Testing: Test the processed circuit boards, including appearance testing and electrical performance testing. The test results must meet the requirements for use in new energy vehicles.

[0016] As a preferred solution: the circuit board pattern in step S1 includes a circuit layout and a component layout; the artificial intelligence algorithm adopts a genetic algorithm, which searches for the optimal parameter combination from a large number of parameter combinations through encoding and genetic operations on the process parameters of photoresist coating thickness, exposure time, etching solution concentration and etching time.

[0017] As a preferred solution: the genetic algorithm specifically sets a set of initial process parameter combinations as a population, calculates the processing efficiency and product quality indicators corresponding to each combination, performs selection, crossover and mutation operations according to the fitness function, generates a new generation of parameter combinations, and continuously iterates until the best parameter combination that meets the requirements is found.

[0018] As a preferred solution: the precision of the photomask in step S2 is 1-5 μm; and a mixture of acetone and alcohol is used to clean the circuit board substrate in step S3.

[0019] As a preferred solution: in step S4, electrostatic coating is adopted, and the thickness of the photoresist is 20-30 μm.

[0020] As a preferred solution: the exposure in step S5 adopts ultraviolet light or deep ultraviolet light exposure, and the exposure time is 30-38s.

[0021] As a preferred solution: in step S6, the developer is sodium hydroxide or potassium hydroxide solution, the concentration of the ferric chloride solution is 30%-40%, and the concentration of the copper sulfate solution is 15%-25%; the developing time is 60-90s.

[0022] As a preferred solution: in step S7, the etching solution is ferric chloride solution or copper sulfate solution, and the etching time is 140-150s.

[0023] As a preferred solution: in step S8, the degumming liquid is acetone or ethanol, and the degumming time is 30-45s.

[0024] As a preferred solution: in step S9, deionized water is used for cleaning to remove impurities of the etching solution and the degumming solution on the surface.

[0025] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0026] First, improve processing accuracy and quality: The photomask is made through nano-level photolithography technology with an accuracy of 1-5μm, which can ensure the fineness of the circuit board pattern, more accurate circuit layout and component layout, and reduce circuit failures and unstable performance caused by line errors, thereby greatly improving the processing accuracy and quality of the circuit board and ensuring the normal operation of the electrical system of new energy vehicles.

[0027] Second, electrostatic coating of photoresist is adopted, and the thickness is controlled at 20-30μm. The coating uniformity is good, which avoids the uneven development and etching problems caused by uneven thickness of photoresist, makes the performance of each part of the circuit board more stable, and improves the product quality.

[0028] Third, enhance reliability and stability: Using a mixture of acetone and alcohol when cleaning the circuit board substrate can effectively remove oil and dust impurities on the surface, improve the surface roughness of the substrate to below 0.1μm, enhance the adhesion between the photoresist and the substrate, and make it less likely for the photoresist to fall off during subsequent processing, thereby improving the reliability and stability of the circuit board.

[0029] Fourth, the precise control and selection of etching solution and degumming solution ensure the thoroughness and accuracy of the etching and degumming process, avoid the influence of residual substances on the performance of the circuit board, and enhance the long-term reliability and stability of the circuit board.

[0030] Fifth, improve processing efficiency: use genetic algorithms to encode and genetically operate process parameters such as photoresist coating thickness, exposure time, etching solution concentration and etching time, and search for the optimal parameter combination from a large number of parameter combinations; shorten the processing cycle of circuit boards and meet the needs of the new energy vehicle industry for rapid production of high-quality circuit boards.

[0031] Sixth, adapt to the special needs of new energy vehicles: New energy vehicles have higher requirements for the reliability of circuit boards. Through the above-mentioned technical measures, this processing method enables the circuit board to have good high temperature resistance, high humidity, vibration resistance and other properties, and can operate stably in the complex working environment of new energy vehicles, meeting the new energy vehicle industry's demand for high-quality circuit boards.

[0032] Seventh, the trend of miniaturization and lightweight of new energy vehicles requires circuit boards to have higher integration and smaller size; this processing method can achieve fine circuit layout and higher integration. Through reasonable component layout and compact circuit design, the circuit board can be smaller in size and lighter in weight to meet the special design requirements of new energy vehicles.

[0033] In order to more clearly illustrate the structural features and effects of the present invention, it is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 The figure is a flow chart of the processing method of the circuit board for new energy vehicles of the present invention. DETAILED DESCRIPTION

[0035] The present invention Figure 1 As shown, a method for processing a circuit board for a new energy vehicle comprises the following steps:

[0036] S1. Design circuit board patterns: Use artificial intelligence algorithms to design circuit board patterns for new energy vehicles;

[0037] S2. Making a photomask: Making the designed circuit board pattern into a photomask through nano-scale photolithography technology;

[0038] S3. Cleaning the circuit board substrate: Cleaning the circuit board substrate to remove oil and dust impurities on the surface;

[0039] S4, coating photoresist: coating the photoresist evenly on the cleaned circuit board substrate;

[0040] S5, exposure: exposing the photomask and the circuit board substrate coated with photoresist;

[0041] S6, development: placing the exposed circuit board substrate into a developer for development;

[0042] S7, etching: placing the developed circuit board substrate into an etching solution for etching;

[0043] S8, degumming: putting the etched circuit board substrate into the degumming liquid to degumming;

[0044] S9, cleaning: cleaning the circuit board substrate after degumming;

[0045] S10. Testing: Test the processed circuit boards, including appearance testing and electrical performance testing. The test results must meet the requirements for use in new energy vehicles.

[0046] The circuit board pattern in step S1 includes circuit layout and component layout; the artificial intelligence algorithm adopts a genetic algorithm, which searches for the optimal parameter combination from a large number of parameter combinations through encoding and genetic operations on the process parameters of photoresist coating thickness, exposure time, etching solution concentration and etching time.

[0047] The genetic algorithm is as follows: a set of initial process parameter combinations is set as the population, and the processing efficiency and product quality indicators corresponding to each combination are calculated. Selection, crossover and mutation operations are performed according to the fitness function to generate a new generation of parameter combinations, and iterates continuously until the best parameter combination that meets the requirements is found.

[0048] The precision of the photomask in step S2 is 1-5 μm; and a mixture of acetone and alcohol is used to clean the circuit board substrate in step S3.

[0049] In step S4, electrostatic coating is used, and the thickness of the photoresist is 20-30 μm.

[0050] In step S5, ultraviolet light or deep ultraviolet light is used for exposure, and the exposure time is 30-38 seconds.

[0051] In step S6, the developer is sodium hydroxide or potassium hydroxide solution, the concentration of the ferric chloride solution is 30%-40%, and the concentration of the copper sulfate solution is 15%-25%; the developing time is 60-90s.

[0052] In step S7, the etching solution is ferric chloride solution or copper sulfate solution, and the etching time is 140-150s.

[0053] In step S8, the degumming liquid is acetone or ethanol, and the degumming time is 30-45 seconds.

[0054] In step S9, deionized water is used for cleaning to remove impurities of etching solution and degumming solution on the surface.

[0055] Embodiment 1: A method for processing a circuit board for a new energy vehicle comprises the following steps:

[0056] Design circuit board pattern (S1): Using genetic algorithm, set the population size to 100. In the initial population, the process parameter combination includes random values ​​of photoresist coating thickness in the range of 18-32μm, random values ​​of exposure time in the range of 28-40s, random selection of etching solution concentration in the range of 25%-45%, and etching time in the range of 130-160s. After multiple generations of genetic operations, such as the selection operation using roulette method, crossover probability of 0.7, mutation probability of 0.05, etc., a set of optimized circuit layout and component layout is finally determined. For example, in the connection line layout of the battery management chip, a shorter path and a more reasonable crossover method are used to reduce the loss and delay of signal transmission; in terms of component layout, the high-power devices are dispersed to facilitate heat dissipation, while ensuring the compactness of the connection between them.

[0057] Making photomasks (S2): Using advanced nano-level photolithography technology, the designed circuit board pattern is transferred to the photomask through a precise mask making process. The accuracy of the photomask is strictly controlled at around 3μm to ensure the high accuracy of the subsequent photolithography process. For example, through high-resolution photolithography machines and fine photoresist coating technology, the line width and spacing errors on the photomask are less than 1μm, ensuring the clarity and accuracy of the pattern.

[0058] Cleaning the circuit board substrate (S3): Use a mixture of acetone and alcohol in a volume ratio of 3:2 for cleaning. Soak the circuit board substrate in the mixture for 15 minutes, and then use an ultrasonic cleaner to clean it at a frequency of 40kHz for 10 minutes. After cleaning, rinse the circuit board substrate with deionized water until the rinse water is clear and free of impurities. This cleaning method can effectively remove oil, dust and other impurities on the surface of the circuit board substrate, reduce the roughness of the substrate surface to less than 0.1μm, and provide good surface quality for subsequent photoresist coating.

[0059] Photoresist coating (S4): Electrostatic coating technology is used to apply a high-voltage electrostatic field to the photoresist solution so that the photoresist particles are uniformly adsorbed on the surface of the circuit board substrate. The thickness of the photoresist is controlled to be about 28 μm, and the coating uniformity deviation is less than 3%. For example, during the coating process, the intensity of the electrostatic field and the coating speed are adjusted so that the photoresist forms a flat and dense coating on the circuit board substrate without defects such as bubbles and pinholes.

[0060] Exposure (S5): UV light is used for exposure, and the exposure time is set to 36 seconds. The wavelength and intensity of the UV light are precisely adjusted to ensure that the photoresist can fully undergo photochemical reactions. During the exposure process, the photomask is closely attached to the circuit board substrate coated with photoresist to ensure the transfer accuracy of the pattern. For example, through a high-precision alignment system, the alignment error between the photomask and the circuit board substrate is controlled within 2μm to ensure that the photolithography pattern after exposure is consistent with the design requirements.

[0061] Development (S6): Sodium hydroxide solution is used as a developer with a concentration of 32%. The development time is controlled at about 78 seconds. During the development process, the temperature and stirring speed of the developer are controlled to make the development process uniform and stable. After the development is completed, the circuit board substrate is rinsed with deionized water to remove the residual developer. After development, the part of the photoresist exposed to ultraviolet light is dissolved, and the unexposed part is retained, forming a photolithography pattern corresponding to the photomask pattern.

[0062] Etching (S7): Ferric chloride solution is selected as the etching solution, and the etching time is set to 148s. During the etching process, the etching is uniform, fast and without over-etching by controlling the temperature, flow rate and stirring method of the etching solution. For example, the temperature of the etching solution is controlled at about 35°C, the flow rate is 15cm / s, and a stirrer is used for stirring to ensure that the etching solution can fully contact the surface of the circuit board substrate to achieve an efficient etching effect.

[0063] Degumming (S8): Acetone was used as the degumming liquid, and the degumming time was 38 seconds. During the degumming process, ultrasonic cleaning was used to accelerate the degumming process and improve the degumming effect. After degumming, the circuit board substrate was rinsed with deionized water to ensure that all photoresist residues were removed.

[0064] Cleaning (S9): Use deionized water to clean the debonded circuit board substrate for multiple times, each cleaning time is 5 minutes, and a total of 3 cleanings. During the cleaning process, an ultrasonic cleaning machine is used for auxiliary cleaning to ensure that the etching liquid and debonding liquid impurities on the surface of the circuit board substrate are removed, so that the cleanliness of the circuit board substrate surface meets the national standard.

[0065] Inspection (S10): In terms of appearance inspection, optical microscopes and electron microscopes were used to check the surface quality and circuit integrity of the circuit board. No defects such as circuit breakage, short circuit, and open circuit were found. The surface was flat and smooth, without obvious scratches and stains. In terms of electrical performance inspection, professional electrical testing equipment was used to test the resistance, capacitance, inductance and other parameters of the circuit board. All parameters were within the design requirements, and the conductivity and insulation of the circuit were good. After rigorous testing, the circuit board fully meets the use requirements of new energy vehicles and has good performance and reliability.

[0066] Embodiment 2: A method for processing a circuit board for a new energy vehicle comprises the following steps:

[0067] S1. Design circuit board patterns: Use artificial intelligence algorithms to design circuit board patterns for new energy vehicles;

[0068] S2. Making a photomask: Making the designed circuit board pattern into a photomask through nano-scale photolithography technology;

[0069] S3. Cleaning the circuit board substrate: Cleaning the circuit board substrate to remove oil and dust impurities on the surface;

[0070] S4, coating photoresist: coating the photoresist evenly on the cleaned circuit board substrate;

[0071] S5, exposure: exposing the photomask and the circuit board substrate coated with photoresist;

[0072] S6, development: placing the exposed circuit board substrate into a developer for development;

[0073] S7, etching: placing the developed circuit board substrate into an etching solution for etching;

[0074] S8, degumming: putting the etched circuit board substrate into the degumming liquid to degumming;

[0075] S9, cleaning: cleaning the circuit board substrate after degumming;

[0076] S10. Testing: Test the processed circuit boards, including appearance testing and electrical performance testing. The test results must meet the requirements for use in new energy vehicles.

[0077] The circuit board pattern in step S1 includes circuit layout and component layout; the artificial intelligence algorithm adopts a genetic algorithm, which searches for the optimal parameter combination from a large number of parameter combinations through encoding and genetic operations on the process parameters of photoresist coating thickness, exposure time, etching solution concentration and etching time.

[0078] The genetic algorithm is as follows: a set of initial process parameter combinations is set as the population, and the processing efficiency and product quality indicators corresponding to each combination are calculated. Selection, crossover and mutation operations are performed according to the fitness function to generate a new generation of parameter combinations, and iterates continuously until the best parameter combination that meets the requirements is found.

[0079] The precision of the photomask in step S2 is 1 μm; and a mixture of acetone and alcohol is used to clean the circuit board substrate in step S3.

[0080] In step S4, electrostatic coating is used, and the thickness of the photoresist is 20 μm.

[0081] In step S5, ultraviolet light or deep ultraviolet light exposure is used for exposure, and the exposure time is 30 seconds.

[0082] In step S6, the developer is sodium hydroxide or potassium hydroxide solution, the concentration of the ferric chloride solution is 30%, and the concentration of the copper sulfate solution is 15%; the developing time is 60 seconds.

[0083] In step S7, the etching solution is ferric chloride solution or copper sulfate solution, and the etching time is 140s.

[0084] In step S8, the degumming liquid is acetone or ethanol, and the degumming time is 30 seconds.

[0085] In step S9, deionized water is used for cleaning to remove impurities of etching solution and degumming solution on the surface.

[0086] Embodiment 3: A method for processing a circuit board for a new energy vehicle comprises the following steps:

[0087] S1. Design circuit board patterns: Use artificial intelligence algorithms to design circuit board patterns for new energy vehicles;

[0088] S2. Making a photomask: Making the designed circuit board pattern into a photomask through nano-scale photolithography technology;

[0089] S3. Cleaning the circuit board substrate: Cleaning the circuit board substrate to remove oil and dust impurities on the surface;

[0090] S4, coating photoresist: coating the photoresist evenly on the cleaned circuit board substrate;

[0091] S5, exposure: exposing the photomask and the circuit board substrate coated with photoresist;

[0092] S6, development: placing the exposed circuit board substrate into a developer for development;

[0093] S7, etching: placing the developed circuit board substrate into an etching solution for etching;

[0094] S8, degumming: putting the etched circuit board substrate into the degumming liquid to degumming;

[0095] S9, cleaning: cleaning the circuit board substrate after degumming;

[0096] S10. Testing: Test the processed circuit boards, including appearance testing and electrical performance testing. The test results must meet the requirements for use in new energy vehicles.

[0097] The circuit board pattern in step S1 includes circuit layout and component layout; the artificial intelligence algorithm adopts a genetic algorithm, which searches for the optimal parameter combination from a large number of parameter combinations through encoding and genetic operations on the process parameters of photoresist coating thickness, exposure time, etching solution concentration and etching time.

[0098] The genetic algorithm is as follows: a set of initial process parameter combinations is set as the population, and the processing efficiency and product quality indicators corresponding to each combination are calculated. Selection, crossover and mutation operations are performed according to the fitness function to generate a new generation of parameter combinations, and iterates continuously until the best parameter combination that meets the requirements is found.

[0099] The precision of the photomask in step S2 is 5 μm; and a mixture of acetone and alcohol is used to clean the circuit board substrate in step S3.

[0100] In step S4, electrostatic coating is used, and the thickness of the photoresist is 30 μm.

[0101] In step S5, ultraviolet light or deep ultraviolet light exposure is used for exposure, and the exposure time is 38 seconds.

[0102] In step S6, the developer is sodium hydroxide or potassium hydroxide solution, the concentration of the ferric chloride solution is 40%, and the concentration of the copper sulfate solution is 25%; the developing time is 90 seconds.

[0103] In step S7, the etching solution is ferric chloride solution or copper sulfate solution, and the etching time is 150s.

[0104] In step S8, the degumming liquid is acetone or ethanol, and the degumming time is 45 seconds.

[0105] In step S9, deionized water is used for cleaning to remove impurities of etching solution and degumming solution on the surface.

[0106] Embodiment 4: A method for processing a circuit board for a new energy vehicle comprises the following steps:

[0107] S1. Design circuit board patterns: Use artificial intelligence algorithms to design circuit board patterns for new energy vehicles;

[0108] S2. Making a photomask: Making the designed circuit board pattern into a photomask through nano-scale photolithography technology;

[0109] S3. Cleaning the circuit board substrate: Cleaning the circuit board substrate to remove oil and dust impurities on the surface;

[0110] S4, coating photoresist: coating the photoresist evenly on the cleaned circuit board substrate;

[0111] S5, exposure: exposing the photomask and the circuit board substrate coated with photoresist;

[0112] S6, development: placing the exposed circuit board substrate into a developer for development;

[0113] S7, etching: placing the developed circuit board substrate into an etching solution for etching;

[0114] S8, degumming: putting the etched circuit board substrate into the degumming liquid to degumming;

[0115] S9, cleaning: cleaning the circuit board substrate after degumming;

[0116] S10. Testing: Test the processed circuit boards, including appearance testing and electrical performance testing. The test results must meet the requirements for use in new energy vehicles.

[0117] The circuit board pattern in step S1 includes circuit layout and component layout; the artificial intelligence algorithm adopts a genetic algorithm, which searches for the optimal parameter combination from a large number of parameter combinations through encoding and genetic operations on the process parameters of photoresist coating thickness, exposure time, etching solution concentration and etching time.

[0118] The genetic algorithm is as follows: a set of initial process parameter combinations is set as the population, and the processing efficiency and product quality indicators corresponding to each combination are calculated. Selection, crossover and mutation operations are performed according to the fitness function to generate a new generation of parameter combinations, and iterates continuously until the best parameter combination that meets the requirements is found.

[0119] The precision of the photomask in step S2 is 2 μm; and a mixture of acetone and alcohol is used to clean the circuit board substrate in step S3.

[0120] In step S4, electrostatic coating is used, and the thickness of the photoresist is 25 μm.

[0121] In step S5, ultraviolet light or deep ultraviolet light is used for exposure, and the exposure time is 35 seconds.

[0122] In step S6, the developer is sodium hydroxide or potassium hydroxide solution, the concentration of the ferric chloride solution is 35%, and the concentration of the copper sulfate solution is 20%; the developing time is 80 seconds.

[0123] In step S7, the etching solution is ferric chloride solution or copper sulfate solution, and the etching time is 145 seconds.

[0124] In step S8, the degumming liquid is acetone or ethanol, and the degumming time is 40 seconds.

[0125] In step S9, deionized water is used for cleaning to remove impurities of etching solution and degumming solution on the surface.

[0126] The design emphasis of the present invention is:

[0127] First, improve processing accuracy and quality: The photomask is made through nano-level photolithography technology with an accuracy of 1-5μm, which can ensure the fineness of the circuit board pattern, more accurate circuit layout and component layout, and reduce circuit failures and unstable performance caused by line errors, thereby greatly improving the processing accuracy and quality of the circuit board and ensuring the normal operation of the electrical system of new energy vehicles.

[0128] Second, electrostatic coating of photoresist is adopted, and the thickness is controlled at 20-30μm. The coating uniformity is good, which avoids the uneven development and etching problems caused by uneven thickness of photoresist, makes the performance of each part of the circuit board more stable, and improves the product quality.

[0129] Third, enhance reliability and stability: Using a mixture of acetone and alcohol when cleaning the circuit board substrate can effectively remove oil and dust impurities on the surface, improve the surface roughness of the substrate to below 0.1μm, enhance the adhesion between the photoresist and the substrate, and make it less likely for the photoresist to fall off during subsequent processing, thereby improving the reliability and stability of the circuit board.

[0130] Fourth, the precise control and selection of etching solution and degumming solution ensure the thoroughness and accuracy of the etching and degumming process, avoid the influence of residual substances on the performance of the circuit board, and enhance the long-term reliability and stability of the circuit board.

[0131] Fifth, improve processing efficiency: use genetic algorithms to encode and genetically operate process parameters such as photoresist coating thickness, exposure time, etching solution concentration and etching time, and search for the optimal parameter combination from a large number of parameter combinations; shorten the processing cycle of circuit boards and meet the needs of the new energy vehicle industry for rapid production of high-quality circuit boards.

[0132] Sixth, adapt to the special needs of new energy vehicles: New energy vehicles have higher requirements for the reliability of circuit boards. Through the above-mentioned technical measures, this processing method enables the circuit board to have good high temperature resistance, high humidity, vibration resistance and other properties, and can operate stably in the complex working environment of new energy vehicles, meeting the new energy vehicle industry's demand for high-quality circuit boards.

[0133] Seventh, the trend of miniaturization and lightweight of new energy vehicles requires circuit boards to have higher integration and smaller size; this processing method can achieve fine circuit layout and higher integration. Through reasonable component layout and compact circuit design, the circuit board can be smaller in size and lighter in weight to meet the special design requirements of new energy vehicles.

[0134] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A method for processing a circuit board for a new energy vehicle, characterized in that: The steps include: S1. Design circuit board patterns: Use artificial intelligence algorithms to design circuit board patterns for new energy vehicles; S2. Making a photomask: Making the designed circuit board pattern into a photomask through nano-scale photolithography technology; S3. Cleaning the circuit board substrate: Cleaning the circuit board substrate to remove oil and dust impurities on the surface; S4, coating photoresist: coating the photoresist evenly on the cleaned circuit board substrate; S5, exposure: exposing the photomask and the circuit board substrate coated with photoresist; S6, development: placing the exposed circuit board substrate into a developer for development; S7, etching: placing the developed circuit board substrate into an etching solution for etching; S8, degumming: putting the etched circuit board substrate into the degumming liquid to degumming; S9, cleaning: cleaning the circuit board substrate after degumming; S10. Testing: Test the processed circuit boards, including appearance testing and electrical performance testing. The test results must meet the requirements for use in new energy vehicles.

2. The method for processing a circuit board for a new energy vehicle according to claim 1, characterized in that: The circuit board pattern in step S1 includes a circuit layout and a component layout; the artificial intelligence algorithm adopts a genetic algorithm, which searches for the optimal parameter combination from a large number of parameter combinations through encoding and genetic operations on the process parameters of photoresist coating thickness, exposure time, etching solution concentration and etching time.

3. The method for processing a circuit board for a new energy vehicle according to claim 2, characterized in that: The genetic algorithm specifically sets a set of initial process parameter combinations as a population, calculates the processing efficiency and product quality indicators corresponding to each combination, performs selection, crossover and mutation operations according to the fitness function, generates a new generation of parameter combinations, and continuously iterates until the best parameter combination that meets the requirements is found.

4. The method for processing a circuit board for a new energy vehicle according to claim 1, characterized in that: The precision of the photomask in step S2 is 1-5 μm; and a mixture of acetone and alcohol is used to clean the circuit board substrate in step S3.

5. The method for processing a circuit board for a new energy vehicle according to claim 1, characterized in that: In the step S4, electrostatic coating is adopted, and the thickness of the photoresist is 20-30 μm.

6. The method for processing a circuit board for a new energy vehicle according to claim 1, characterized in that: The exposure in step S5 is performed by ultraviolet light or deep ultraviolet light exposure, and the exposure time is 30-38 seconds.

7. The method for processing a circuit board for a new energy vehicle according to claim 1, characterized in that: In step S6, the developer is sodium hydroxide or potassium hydroxide solution, the concentration of the ferric chloride solution is 30%-40%, and the concentration of the copper sulfate solution is 15%-25%; the developing time is 60-90s.

8. The method for processing a circuit board for a new energy vehicle according to claim 1, characterized in that: In step S7, the etching solution is ferric chloride solution or copper sulfate solution, and the etching time is 140-150s.

9. The method for processing a circuit board for a new energy vehicle according to claim 1, characterized in that: In step S8, the degumming liquid is acetone or ethanol, and the degumming time is 30-45 seconds.

10. The method for processing a circuit board for a new energy vehicle according to claim 1, characterized in that: In step S9, deionized water is used for cleaning to remove impurities of etching solution and degumming solution on the surface.

Images